Ultrasonic detection device and method for using the same

Abstract

The present invention relates to an ultrasonic detection device, comprising: a detection module which includes a plurality of probes and performs ultrasonic scanning with a subject as a target; the processing module is used for sending an ultrasonic generation signal to enable the plurality of probes to generate an ultrasonic signal and generating a picture of the detection surface of the detected body based on an ultrasonic reflection signal detected by the probes; the control module is used for controlling the ultrasonic scanning action of the detection module and controlling the signal processing of the processing module; the control module is used for controlling the focusing positions of the probes by adjusting the distances between the plurality of probes and the detected body.

Description

Technical Field

[0001] The present invention relates to an ultrasonic testing device and a method using the same. Background Art

[0002] The technology uses signals with frequencies in the ultrasonic wave region to obtain images of the inside of the object being tested. It is widely used in the medical field where the objects are internal organs or fetuses during pregnancy, or in non-destructive testing (NDT) to detect internal defects without changing the shape of the manufactured product.

[0003] For example, ultrasonic testing can now be used to detect defects in semiconductor components with complex circuit patterns. In the past, ultrasonic testing was only possible for purposes such as selecting a portion of finished semiconductor components to calculate the defect rate.

[0004] However, with regard to the recent development of autonomous driving technology, in order to prevent vehicle accidents caused by defective components, the defect detection standards for semiconductors used in autonomous vehicles are gradually being strengthened.

[0005] Therefore, in areas such as autonomous driving that require extremely high levels of manufacturing quality, in order to be able to detect potential defects in semiconductor components in advance, it is necessary to develop improved ultrasonic testing equipment that has high detection accuracy and can reduce the time required for detection, so that all semiconductor components can be tested rather than screening tests.

[0006] In this regard, Korean Patent Registration No. 10-2125751 (hereinafter referred to as “prior art document”) discloses an ultrasonic imaging device and an image generation method of the ultrasonic imaging device capable of simultaneously imaging a plurality of joint surfaces of a workpiece.

[0007] The prior art document only discloses a method of ultrasonically testing a plurality of joint surfaces using a single probe, but only discloses a method of ultrasonically testing substantially flat joint surfaces, and does not disclose a method of ultrasonically testing uneven curved joint surfaces.

[0008] During the manufacturing process, various samples may bend, become uneven or unbalanced due to various reasons such as differences in thermal expansion coefficients between materials. If these samples are tested by ultrasonic wave, accurate ultrasonic testing cannot be performed due to the presence of curved test surfaces.

[0009] Further, if Figure 1As shown, after the focus of the probe 11 is focused by A-scanning at the reference position, when the detection surface 3 of the curved sample 1 is ultrasonically scanned, the height of the probe 11 is fixed, and since the detection surface 3 of the curved sample 1 is curved, detection positions with inconsistent focus depths will appear during the scanning process, resulting in the disadvantage of being unable to accurately perform ultrasonic detection.

[0010] According to prior art literature, one probe is used to perform ultrasonic testing on multiple joint surfaces, and the ultrasonic testing is performed on multiple joint surfaces while focusing on the middle points of multiple adjacent joint surfaces. Therefore, the precision of ultrasonic testing on each joint surface cannot be guaranteed. Moreover, since only one probe is used, there are still limitations in the speed of ultrasonic testing.

[0011] [Prior technical literature]

[0012] [Patent Literature]

[0013] Korean registered patent No. 10-2125751 (Announcement date: June 23, 2020, invention title: Ultrasonic imaging device and image generation method of ultrasonic imaging device) Summary of the invention

[0014] The present invention is created to solve the problems existing in the prior art as described above. The technical problems to be solved according to one embodiment of the present invention are as follows.

[0015] First, an object of the present invention is to provide an ultrasonic testing device that can perform rapid and highly precise ultrasonic testing even on samples having uneven or unbalanced testing surfaces such as curved samples.

[0016] Second, an object of the present invention is to provide an ultrasonic inspection device for curved samples that can rapidly perform ultrasonic inspection on samples with uneven curvature using an optimal scanning pattern while ensuring precision.

[0017] Thirdly, an object of the present invention is to provide an ultrasonic testing device that can improve the speed and precision of ultrasonic testing of a test object having a plurality of joint surfaces.

[0018] Fourth, the purpose of the present invention is to provide an ultrasonic testing device that can simultaneously perform ultrasonic testing on multiple test objects placed on a testing table, thereby greatly saving the time, effort and cost required for ultrasonic testing on multiple test objects, thereby improving the efficiency of ultrasonic testing. Another purpose is to provide an ultrasonic testing device that can improve the speed and precision of ultrasonic testing on a test object with multiple joint surfaces and can perform large-scale testing.

[0019] The present invention is an ultrasonic detection device proposed to solve the problems mentioned above, comprising: a detection module, which includes multiple probes and performs ultrasonic scanning on a detected object; a processing module, which sends an ultrasonic generating signal to make the multiple probes generate ultrasonic signals, and generates an image of the detection surface of the detected object based on the ultrasonic reflection signals detected by the probes; a control module, which controls the ultrasonic scanning action of the detection module and controls the signal processing of the processing module; the control module controls the focusing position of the probe by adjusting the distance between each of the multiple probes and the detected object.

[0020] Preferably, the multiple probes are divided into: a first probe, which performs ultrasonic scanning to calculate the displacement information of the detection surface of the detected object; a second probe, which performs ultrasonic scanning to ultrasonically detect the detection surface; the processing module includes: a displacement information calculation unit, which performs gate processing on the ultrasonic reflection signal detected by the second probe, and then outputs the displacement of the ultrasonic reflection signal of the detection surface, generates a picture of the detection surface based on the displacement, and calculates displacement information of the reference position of the detection surface corresponding to the displacement value in the height direction using the ultrasonic reflection signal detected by the first probe; based on the displacement information calculated by the displacement information calculation unit, controls the height of the second probe to change while performing ultrasonic scanning.

[0021] Preferably, the first and second probes are each combined to an assembly fixture and are combined to the assembly fixture in a first direction arrangement form in which they are arranged in a row along a predetermined scanning line; or in a second direction arrangement form in which they are arranged one by one along the arrangement direction of at least two or more scanning lines and ultrasonic scanning is performed on different scanning lines at the same time.

[0022] Preferably, when the first and second probes are arranged in the first direction, the processing module controls, for the kth scanning line, displacement information calculated based on the ultrasonic reflection signal detected by the first probe, and performs ultrasonic scanning on the k+1th scanning line as the height of the second probe changes.

[0023] Preferably, the processing module controls the first probe to perform ultrasonic scanning on the k+1th scanning line to calculate displacement information when ultrasonic scanning is performed on the k+1th scanning line as the height of the second probe changes; and the displacement information calculation unit calculates the displacement information of the k+1th scanning line using the ultrasonic reflection signal detected on the k+1th scanning line.

[0024] Preferably, when the first and second probes are arranged in the second direction, the processing module controls the displacement information calculated based on the ultrasonic reflection signal detected by the first probe for the kth scanning line, and performs ultrasonic scanning on the kth scanning line as the height of the second probe changes.

[0025] Preferably, the processing module is, when ultrasonic scanning is performed on the kth scanning line as the height of the second probe changes, controlling the first probe to perform ultrasonic scanning on the k+1th scanning line to calculate displacement information, and using the displacement information calculation unit to calculate the displacement information of the ultrasonic reflection signal detected on the k+1th scanning line.

[0026] Preferably, the assembly fixture is movable in the first direction or the second direction; the processing module includes: a curvature information calculation unit, which calculates curvature information based on the displacement information obtained by the first probe when the assembly fixture moves; the curvature information calculation unit calculates unit curvature information in each unit interval pre-set on the detection surface, and compares the cumulative curvature information of the first to nth intervals with the unit curvature information of the n+1th interval. When the unit curvature information of the n+1th interval exceeds a pre-set range compared with the cumulative curvature information, the n+1th interval is judged to be an abnormal interval.

[0027] Preferably, the curvature information calculation unit controls the first probe to return to the starting point of the n+1th interval through the assembly fixture for the second time when the n+1th interval is judged to be an abnormal interval for the first time, thereby recalculating the unit curvature information of the n+1th interval.

[0028] Preferably, the curvature information calculation unit calculates the cumulative curvature information using the average value of the curvature information of each unit in the first to nth intervals; the predetermined range is calculated based on the standard deviation of the curvature information of each unit in the first to nth intervals, and thus becomes a variable range as the ultrasonic scanning proceeds.

[0029] Preferably, the processing module also includes: a scanning pattern setting unit, which manages the scanning pattern corresponding to the spacing information between the multiple scanning points of each scanning line of the first and second probes; the scanning pattern setting unit is to arrange the multiple scanning points of each scanning line at the same interval or at different intervals.

[0030] Preferably, when the first and second probes are arranged in the first direction, the scanning points of the kth scanning line and the k+1th scanning line are separated from each other by the same interval, and the kth scanning line and the k+1th scanning line are formed in the same scanning pattern.

[0031] Preferably, when the first and second probes are arranged in the second direction, the scanning points of the kth scanning line and the k+1th scanning line are separated from each other by the same interval, or separated by different intervals, and the kth scanning line and the k+1th scanning line are formed in the same scanning pattern.

[0032] Preferably, the processing module also includes a height adjustment unit, which calculates the height adjustment value of each probe and provides it to the control module to focus on the joint surfaces corresponding to each probe; the height adjustment unit can use the corresponding height information of each probe with the largest displacement of the ultrasonic reflection signal of each joint surface corresponding to each probe as the height adjustment value.

[0033] The height adjustment unit calculates the thickness of each layer of the detected object by the time difference of the ultrasonic reflection signal of each joint surface, and then calculates the spacing distance between the specific joint surface and each other multiple joint surfaces, and then provides the calculated spacing distances as height adjustment values ​​for each other probe to the control module.

[0034] Preferably, the height adjustment unit calculates the height adjustment values ​​of each other probe corresponding to each other joint surface in sequence, from other joint surfaces that are close to the specific joint surface to other joint surfaces that are farther away, and provides them to the control module; the height adjustment value of the specific other probe is determined by calculating the spacing distance between the corresponding other specific joint surface and the previous joint surface corresponding to the previous probe for which the height adjustment value calculation was completed.

[0035] Preferably, the spacing distance is determined by calculating the layer thickness of the object to be detected between the other specific joint surface and the previous joint surface through the ultrasonic reflection signal of the previous probe after the height adjustment value is calculated.

[0036] Preferably, the multiple probes are divided into a first probe for performing ultrasonic scanning for calculating displacement information of the detection surface of the object to be detected and a second probe for performing ultrasonic scanning for ultrasonic detection of the detection surface; the processing module also includes a region segmentation unit, which calculates the layer thickness of the object to be detected through the height adjustment unit based on the displacement information calculated using the ultrasonic reflection signal detected by the first probe, and then calculates the layer morphology information, and calculates the area with the same layer morphology information for the plane of the object to be detected, thereby dividing the area of ​​the object to be detected into first to mth areas.

[0037] Preferably, the processing module further comprises an area determination unit for determining in a predetermined manner whether to perform ultrasonic detection by the second probe on the first to m-th areas divided by the area division unit, thereby setting an ultrasonic detection area and an ultrasonic omission area.

[0038] Preferably, the kth region (here, k is a natural number less than m) divided by the region division unit is a continuous region based on a plane; the region judgment unit is that when the kth region is set as an ultrasonic omission region, for the region in the first to mth regions having the same layer layout as the kth region, the ultrasonic detection by the second probe is omitted.

[0039] Preferably, it also includes: a detection table, which has a plurality of placement parts for respectively placing each object to be detected; the detection table includes a plurality of placement areas arranged separately from each other, and at least two or more placement parts in each placement area are arranged in a row; the plurality of probes are classified into at least two or more probe groups, and each probe group is composed of at least one probe; the each probe group is arranged one by one corresponding to the placement area and combined with the assembly fixture to perform ultrasonic scanning on the plurality of objects to be detected placed in the corresponding placement area, and the individual probes constituting the probe group are connected to the assembly fixture by adjusting the connecting part, so as to adjust the horizontal position of the probe.

[0040] According to the ultrasonic detection device of the present invention having the above-mentioned problems and solutions, the beneficial effects are as follows:

[0041] First, the present invention comprises a first probe for ultrasonically scanning the detection surface of a sample to calculate displacement information and a second probe for ultrasonically scanning the detection surface of the sample to perform ultrasonic detection. Based on the displacement information calculated using the ultrasonic reflection signal detected by the first probe, ultrasonic scanning is performed as the height of the second probe changes. Therefore, fast and high-precision ultrasonic detection can be performed on samples with uneven or unbalanced detection surfaces such as curved samples.

[0042] Second, since the present invention is configured to set scanning patterns corresponding to the spacing information between the scanning points of each scanning line of the first probe and the second probe in the same or different manner, it has the effect of quickly performing ultrasonic detection on samples with uneven curvature with the optimal scanning pattern while ensuring precision.

[0043] Third, the present invention has multiple probes corresponding to the multiple joint surfaces of the object to be detected that need to be ultrasonically detected. After focusing on the joint surfaces corresponding to each probe by adjusting the height of each probe, ultrasonic detection can be performed on each joint surface at the same time, thereby improving the speed and precision of ultrasonic detection of the object to be detected with multiple joint surfaces.

[0044] Fourth, the present invention configures the detection table into a placement area formed by at least two or more placement parts arranged in a row and arranged separately from each other, and multiple probes are configured to be divided into multiple probe groups composed of at least one probe, and each probe group is arranged corresponding to the placement area one by one, so that ultrasonic scanning can be performed on multiple objects to be detected placed in the corresponding placement area. Therefore, ultrasonic inspection can be performed on multiple objects to be detected placed on the detection table at the same time, thereby greatly saving time, energy and cost for ultrasonic inspection of multiple objects to be detected, and further producing the advantage of improving the efficiency of ultrasonic inspection.

[0045] Furthermore, according to the present invention, ultrasonic detection is performed on a plurality of probes constituting the probe group and a plurality of joint surfaces of the object to be detected formed by a plurality of layers, respectively. After the height of each probe constituting the probe group is adjusted and each joint surface corresponding to each probe is focused, ultrasonic detection can be performed on each joint surface at the same time, thereby improving the speed and precision of ultrasonic detection of the object to be detected having a plurality of joint surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 It is a simplified diagram used to illustrate the problems existing in the previous detection method;

[0047] Figure 2 is a configuration diagram of an ultrasonic detection device according to an embodiment of the present invention;

[0048] Figure 3 is a simplified plan view for explaining the arrangement of a first probe and a second probe of an ultrasonic detection device applicable to an embodiment of the present invention;

[0049] Figure 4 It is a simplified diagram for explaining the operation of the ultrasonic detection device according to the embodiment of the present invention;

[0050] Figure 5 is a simplified diagram for explaining the operation of the first probe constituting the ultrasonic detection device of the embodiment of the present invention;

[0051] Figure 6 is a simplified diagram for explaining the operation of the second probe constituting the ultrasonic detection device of the embodiment of the present invention;

[0052] Figure 7 It is a simplified diagram for explaining another form of operation of the ultrasonic detection device according to the embodiment of the present invention;

[0053] Figure 8 is an example diagram showing various scanning patterns applicable to an ultrasonic detection device according to an embodiment of the present invention;

[0054] Fig. 9This is a configuration diagram of an ultrasonic detection device for detecting a target object formed of multiple layers as an ultrasonic detection device according to an embodiment of the present invention;

[0055] Fig.10 is an exemplary diagram of a subject to be detected by an ultrasonic detection device according to an embodiment of the present invention;

[0056] Fig.11 is a simplified diagram for explaining the operation of a detection module for performing ultrasonic scanning on a first form of a subject by an ultrasonic detection device according to an embodiment of the present invention;

[0057] Fig.12 is a simplified diagram for explaining the operation of the detection module for performing ultrasonic scanning on a second form of a subject to be detected by the ultrasonic detection device according to the embodiment of the present invention;

[0058] Fig.13 is a simplified diagram for explaining the processing of ultrasonic signals and ultrasonic reflection signals in an ultrasonic detection device applicable to an embodiment of the present invention;

[0059] Fig.14 is a flow chart for explaining an ultrasonic detection method by an ultrasonic detection device according to an embodiment of the present invention;

[0060] Fig.15 is a configuration diagram of a test bench constituting an ultrasonic testing device according to an embodiment of the present invention;

[0061] Fig.16 is a diagram showing an example of the arrangement of an ultrasonic detection device according to an embodiment of the present invention;

[0062] Fig.17 is a simplified diagram for explaining a detection method using an ultrasonic detection device according to an embodiment of the present invention;

[0063] Fig.18 It is a schematic diagram for explaining the process of the region division unit and the region determination unit of the ultrasonic detection device according to the embodiment of the present invention;

[0064] Fig.19 This is a schematic diagram for explaining the use process of the curvature information calculation unit of the ultrasonic detection device according to the embodiment of the present invention.

[0065] Explanation of symbols

[0066] 1: sample; 3: detection surface; 10: detection module; 11: probe;

[0067] 11a: first probe; 11b: second probe; 11c: third probe;

[0068] 11d: fourth probe; 11e: fifth probe; 11f: sixth probe;

[0069] 12: adjustment connection portion; 12a: first adjustment connection portion;

[0070] 12b: second adjustment connection portion; 12c: third adjustment connection portion;

[0071] 12d: fourth adjustment connection portion; 12e: fifth adjustment connection portion;

[0072] 12f: sixth adjustment connection portion; 13: assembly fixture; 15: moving assembly;

[0073] 0 17a: first probe group; 17b: second probe group; 17c: third probe group;

[0074] 20: displacement information calculation unit; 21: height adjustment unit;

[0075] 25: scanning pattern setting unit; 30: processing module; 31: oscillator;

[0076] 32: timing unit; 33: signal input unit; 35: signal processing unit;

[0077] 36: image generation unit; 37: display unit; 38: scanning control unit;

[0078] 50: control module; 70: testing table; 71: placement unit;

[0079] 71a: first placement portion; 71b: second placement portion; 71c: third placement portion;

[0080] 71d: fourth placement portion; 72: adsorption hole; 73: placement area;

[0081] 73a: first placement area; 73b: second placement area;

[0082] 73c: third placement area; 73d: fourth placement area;

[0083] 100: ultrasonic detection device; 341: curvature information calculation unit;

[0084] 342: region segmentation unit; 343: region determination unit. DETAILED DESCRIPTION

[0085] The preferred embodiments of the ultrasonic device of the present invention having the above-mentioned problems, solutions and beneficial effects are described in detail below with reference to the accompanying drawings.

[0086] The present invention can be transformed in many ways and can have many embodiments, so a number of specific embodiments are shown in the figures and described in detail in the detailed content. The beneficial effects and features of the present invention, as well as the related implementation methods, will become clear with reference to the drawings and the multiple embodiments described in detail below. However, the present invention can be implemented in many forms and is not limited to the multiple embodiments disclosed below.

[0087] Hereinafter, multiple embodiments of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are given the same drawing symbols, and repeated descriptions thereof are omitted.

[0088] The terms “including” or “having” used in the following embodiments are used to specify the features or constituent elements described in the specification, and do not preclude the possibility that one or more other features or constituent elements are added.

[0089] In the drawings, the sizes of various components may be exaggerated or reduced for the convenience of explanation. For example, the size and thickness of each structure appearing in the drawings are arbitrarily indicated for the convenience of explanation, and therefore the present invention is not necessarily limited to the contents shown in the drawings.

[0090] When certain embodiments can be implemented differently, a specific order of actions can also be performed differently from the order described. For example, two actions described consecutively can actually be performed simultaneously, or in an order opposite to the order described.

[0091] like Figures 2 to 6 As shown in the figure, the ultrasonic detection device 100 of the embodiment of the present invention is composed of: a first probe 11a, which performs ultrasonic scanning on the detection surface 3 of the sample 1 to calculate displacement information; a detection module 10, which is equipped with a second probe 11b, which performs ultrasonic scanning on the detection surface 3 of the sample 1 for ultrasonic detection; a processing module 30, which sends an ultrasonic generating signal so that the first probe 11a and the second probe 11b respectively generate ultrasonic signals, performs gate processing on the ultrasonic reflection signal detected by the second probe 11b, outputs the displacement of the ultrasonic reflection signal of the detection surface 3, and generates a picture of the detection surface 3 based on the displacement of the ultrasonic reflection signal; a displacement information calculation unit 20, which calculates the displacement information corresponding to the displacement value in the height direction relative to the reference position of the detection surface 3 using the ultrasonic reflection signal detected by the first probe 11a; and a control module 50, which controls the ultrasonic scanning action of the detection module 1, controls the signal processing of the processing module 30, and controls the ultrasonic scanning based on the calculated displacement information as the height of the second probe 11b changes.

[0092] The detection module 10 is provided with a plurality of probes, namely a first probe 11a and a second probe 11b, for respectively performing ultrasonic scanning on the detection surface 3 of the sample 1. The first probe 11a applicable to the present invention performs ultrasonic scanning under the control of the control module 50 to calculate the displacement information of the detection surface 3 of the sample 1, and the second probe 11b performs ultrasonic scanning on the detection surface 3 of the sample 1 under the control of the control module 50 to perform ultrasonic detection.

[0093] The sample 1 applicable to the present invention refers to a sample with a buckled shape, a curved shape, an uneven shape or an unbalanced shape (hereinafter referred to as a "bent sample"). The curved sample 1 applicable to the present invention includes a buckled, curved, uneven or unbalanced detection surface 3. However, it is clearly pointed out that the present invention is not a technology that can only be applied to such a curved sample, and it can be applied to samples of all shapes.

[0094] The detection module 10 of the present invention further comprises an assembly fixture 13. The assembly fixture 13 has the function of fixing the first probe 11a and the second probe 11b to the upper side of the scanning position for ultrasonic scanning of the sample 1. Further, the first probe 11a and the second probe 11b are assembled and connected at the lower part of the assembly fixture 13.

[0095] However, the first probe 11a and the second probe 11b of the present invention are respectively assembled to be height-adjustable. To this end, the detection module 10 of the present invention also has a first adjustment connection portion 12a and a second adjustment connection portion 12b. The first adjustment connection portion 12a is to assemble and connect the first probe 11a on the assembly fixture 13, and to be height-adjustable, and the second adjustment connection portion 12b is to assemble and connect the second probe 11b on the assembly fixture 13, and to be height-adjustable. Therefore, each probe 11a, 11b can adjust the height through the corresponding adjustment connection portion 12a, 12b.

[0096] The first adjustment connection part 12a and the second adjustment connection part 12b can adjust the heights of the corresponding probes 11a and 11b respectively according to the control of the control module 50. Further, in the present invention, the control module 50 controls the second adjustment connection part 12b so that the height of the second probe 11b changes while ultrasonically scanning the detection surface 3 of the curved sample 1.

[0097] The detection module 10 of the present invention further comprises a moving assembly 15, which is used to move the assembly fixture 13 so that the first probe 11a and the second probe 11b move simultaneously. The moving assembly 15 can move the assembly fixture 13 in the ±X direction, the ±Y direction, and the ±Z direction according to the control of the control module 50. As a result, the first probe 11a and the second probe 11b, which are mounted and connected to the assembly fixture 13 with adjustable height, can still move in the ±X direction, the ±Y direction, and the ±Z direction simultaneously.

[0098] The detection module 10 composed as described above generates ultrasonic signals with the support of the processing module 30 and performs ultrasonic scanning. The ultrasonic reflection signals of the detection surface 3 are processed to calculate displacement information, which is then analyzed for ultrasonic detection.

[0099] The processing module 30 sends an ultrasonic generating signal, so that the first probe 11a and the second probe 11b generate ultrasonic signals respectively, performs gate processing on the ultrasonic reflection signal detected by the second probe 11b, and then outputs the displacement of the ultrasonic reflection signal of the detection surface 3, and based on the displacement of the ultrasonic reflection signal, generates an action of generating a picture of the detection surface 3.

[0100] The processing module 30 can receive and transmit the ultrasonic reflection signal detected by the first probe 11a to the displacement information calculation unit 20, thereby calculating the displacement information. Of course, the ultrasonic reflection signal detected by the first probe 11a is transmitted to the displacement information calculation unit 20 under the control of the control module 50, thereby calculating the displacement information of the detection surface 3.

[0101] In order to implement the actions described above, the processing module 30 includes a scanning control unit 38 for controlling the scanning positions of the first probe 11a and the second probe 11b, a timing unit 32 and an oscillator 31 for sending an ultrasonic generation signal, a signal input unit 33, a signal processing unit 35, and an image generation unit 36 ​​for generating an ultrasonic image from the ultrasonic transmission signal transmitted by the second probe 11b, and a display unit 37 for displaying the ultrasonic image.

[0102] The signal input unit 33 includes an amplifier for amplifying the ultrasonic reflection signal received by the second probe 11b and an A / D converter for converting the ultrasonic reflection signal from analog to digital. The signal processing unit 35 performs gate processing on the ultrasonic reflection signal to detect displacement.

[0103] The scanning control unit 38 controls the ultrasonic scanning through the control of the control module 50. The control module 50 controls the moving assembly 15, controls the horizontal scanning positions of the first probe 11a and the second probe 11b through the X-axis drive and the Y-axis drive, and sends the current scanning pattern information of the first probe 11a and the second probe 11b to the scanning control unit 38. Then, the timing unit 32 can refer to the scanning pattern information received by the scanning control unit 38. The information about the scanning pattern is described later.

[0104] The timing unit 32 sends an ultrasonic wave transmission and reception timing signal (information) to the oscillator 31 based on the scanning pattern information of the first probe 11a and the second probe 11b obtained from the scanning control unit 38. The oscillator 31 outputs an ultrasonic wave generation signal to the piezoelectric elements of the first probe 11a and the second probe 11b based on the timing signal output by the timing unit 32.

[0105] The piezoelectric element provided on the first probe 11a and the second probe 11b has electrodes on both sides of a piezoelectric film. The piezoelectric element transmits an ultrasonic signal from the piezoelectric film when a voltage is input between the two electrodes. The piezoelectric element converts the echo (reflected wave) received by the piezoelectric film into a voltage generated between the two electrodes, i.e., an ultrasonic reflection signal.

[0106] The signal input unit 33 amplifies the ultrasonic reflection signal of the second probe 11b and converts it into a digital signal. The signal processing unit 35 performs signal processing on the digital ultrasonic reflection signal. The signal processing unit 35 obtains displacement information by intercepting only a predetermined period of the ultrasonic reflection signal of the second probe 11b through the gate pulse output by the timing unit 32, and outputs the displacement information to the image generation unit 36. The image generation unit 36 ​​generates an ultrasonic image based on the displacement signal output by the signal processing unit 35. In addition, the display unit 37 displays the ultrasonic image and allows analysis.

[0107] The processing module 30 as described above is also the detection module 10 as described above, and operates as a whole under the control of the control module 50. Further, the control module 50 controls the ultrasonic scanning action of the detection module 10 and implements the signal processing action of the processing module 30.

[0108] Furthermore, the control module 50 controls the moving component 15 so that the assembly fixture 13 assembled with the first probe 11a and the second probe 11b moves along the X-axis, the Y-axis, and the Z-axis. Furthermore, the control module 50 controls the moving component 15 so that the assembly fixture 13 moves along the X-axis and the Y-axis, and the ultrasonic detection area of ​​the sample 1 can be ultrasonically scanned along multiple scanning lines (the first scanning line to the Nth scanning line), and controls the moving component 15 so that the assembly fixture 13 moves along the Z-axis, so that the height of the first probe 11a and the second probe 11b assembled on the assembly fixture 13 is adjusted as a whole.

[0109] On the one hand, the control module 50 controls the probes 11a and 11b to be connected to the adjustment connection parts 12a and 12b on the assembly fixture 13 in an adjustable height, so that the height of the corresponding first probe 11a and second probe 11b can be adjusted. Further, the second probe 11b performs ultrasonic scanning as the height changes based on the displacement information of the scanning line of the detection surface 3 calculated by the ultrasonic reflection signal of the first probe 11 as the control module 50 controls the second adjustment connection part 12b. This will be described later.

[0110] The second probe 11b used in the present invention performs ultrasonic scanning along the scanning line of the detection surface 3, and performs ultrasonic scanning while changing its height in accordance with the curved shape of the detection surface 3. The height change of the second probe 11b is controlled based on the displacement information calculated by the ultrasonic reflection signal of the first probe 11a.

[0111] To this end, the ultrasonic detection device 100 of the present invention includes a displacement information calculation unit 20 that calculates displacement information corresponding to the displacement value in the height direction for the reference position of the detection surface 3 using the ultrasonic reflection signal detected by the first probe 11a. The control module 50 performs ultrasonic scanning based on the calculated displacement information as the height of the second probe 11b changes.

[0112] The control module 50 that receives the displacement information from the displacement information calculation unit 20 controls the second adjustment connection unit 12 b based on the displacement information to change the height of the second probe 11 b during ultrasonic scanning.

[0113] The displacement information calculation unit 20 may be arranged as other components, or may be set as a component of the processing module 30, or may be set in the signal input unit 33 of the processing module 30, or may be set as a component of the control module 50. Further, the displacement information calculation unit 20 of the present invention is included as a component of the ultrasonic detection device 100, and performs a calculation operation of displacement information corresponding to a displacement value in a height direction relative to a reference position of the detection surface 3 using the ultrasonic reflection signal detected by the first probe 11a.

[0114] The displacement information calculation unit 20 calculates the displacement information corresponding to the displacement value in the height direction relative to the reference position of the detection surface 3 using the ultrasonic reflection signal detected by the first probe 11a under the control of the control module 50, and provides the calculated displacement information to the control module 50. Then, the control module 50 controls the second adjustment connection unit 12b to change the height of the second probe 11b during the ultrasonic scanning process.

[0115] The displacement information calculation unit 20 calculates displacement information corresponding to a displacement value in a height direction relative to a reference position of the detection surface 3 using the ultrasonic reflection signal detected by the first probe 11 a .

[0116] Specifically, Figure 5 As shown in the figure, the first probe 11a is in a state of being fixed in height, and moves along the scanning direction while performing ultrasonic scanning on a specific scanning line of the detection surface 3 of the sample 1. The first probe 11a performs ultrasonic scanning along the scanning line of the detection surface 3, and receives the ultrasonic reflection signal reflected from the detection surface 3 of the scanning line and transmits it to the displacement information calculation unit 20.

[0117] As the first probe 11a continuously performs ultrasonic scanning at multiple scanning points on the scanning line, ultrasonic reflection signals reflected from the detection surface 3 are also received corresponding to multiple scanning points. However, since the detection surface 3 is curved, the arrival time of the ultrasonic reflection signals from each scanning point is different.

[0118] The displacement information calculation unit 20 can calculate the distance L between the first probe 11a and the detection surface 3 at each scanning point by [L=(Δt*V) / 2]. Here, Δt is the time required from ultrasonic oscillation to reception, and V is the ultrasonic speed (about 1480 m / s in water).

[0119] The reference position of the detection surface 3 refers to the detection surface 3 at the scanning starting point (for example, Figure 5The displacement information calculation unit 20 can calculate the spacing distance L2 between the first probe 11a and the detection surface 3 at the next scanning point of the scanning start point. The displacement information at the scanning point can be the displacement value in the height direction relative to the reference position, that is, the value of L2-L1 (equivalent to the height difference of the detection surface at the two scanning points) as the displacement information.

[0120] Through the above process, the displacement information calculation unit 20 can calculate the displacement information along the scanning line of the detection surface 3, and provide the calculated displacement information to the control module 50. Then, the control module 50 controls the ultrasonic scanning as the height of the second probe 11b changes based on the displacement information.

[0121] Specifically, the control module 50 corresponds to the displacement information and controls the second adjustment connection part 12b so that the height of the second probe 11b is corrected during the ultrasonic scanning process of the second probe 11b. Figure 6 As shown in the figure, during the ultrasonic scanning process, the height of the second probe 11 b changes in accordance with the curved shape of the detection surface of the scanning line matched with the displacement information calculated by the displacement information calculation unit 20, thereby performing ultrasonic scanning.

[0122] During the ultrasonic scanning process, the spacing distance L1 between the second probe 11b and the detection surface 3 is consistent at all scanning points. As a result, at the reference position, the second probe 11b is focused and then ultrasonic scanning is performed, so that ultrasonic scanning can be performed in a focused state at all scanning points, thereby performing highly precise ultrasonic testing.

[0123] On the one hand, if Figure 3 As shown in the figure, the first probe 11a and the second probe 11b applicable to the present invention are assembled to the assembly fixture 13 and connected, and are arranged in a longitudinal arrangement form along the same scanning line in a row ( Figure 3 a) or a lateral arrangement along adjacent scan lines one by one ( Figure 3 b) are assembled and connected.

[0124] Figure 3 a shows an example in which the first probe 11a and the second probe 11b are arranged in a row along a specific scanning line, for example, along the kth scanning line when ultrasonic scanning is performed, that is, they are assembled and connected to the assembly fixture 13 in a longitudinal arrangement. Figure 3b shows an example in which the first probe 11a and the second probe 11b respectively pass through different adjacent scanning lines, for example, one by one on the kth scanning line and the k+1th scanning line, that is, an example in which they are assembled and connected to the assembly fixture 13 in a horizontal arrangement that crosses the scanning lines.

[0125] like Figure 3 As shown in a, when the first probe 11a and the second probe 11b are assembled in a longitudinal arrangement and connected to the assembly fixture 13, the control module 50 is based on the displacement information calculated by using the ultrasonic reflection signal detected by the first probe 11a for a specific scan line, such as the kth scan line, and as the height of the second probe 11b changes, an ultrasonic scan of the k+1th scan line corresponding to the next scan line of the specific scan line is performed.

[0126] Furthermore, the control module 50 controls the ultrasonic scanning of a specific scanning line through the first probe 11a, so that the ultrasonic reflection signal reflected from the detection surface 3 is analyzed in the displacement information calculation unit 20, and then the displacement information relative to the specific scanning line is calculated. Then, according to the calculated displacement information, the height of the second probe 11b can be changed when performing ultrasonic scanning on other scanning lines of the specific scanning line.

[0127] As a result, when the second probe 11b scans a predetermined scanning line for ultrasonic detection, the ultrasonic scanning is performed while the height changes in accordance with the curved shape of the detection surface 3 of the previous scanning line. Figure 3 The arrangement of a has the limitation that the accuracy of ultrasonic detection can be ensured only when the intervals between adjacent scanning lines are close or the shapes of the detection surfaces 3 of adjacent scanning lines are almost the same.

[0128] On the one hand, in this situation, the control module 50 controls the second probe 11b to change its height while performing ultrasonic scanning on the k+1th scanning line, controls the first probe 11a to perform ultrasonic scanning on the k+1th scanning line to calculate displacement information, and controls the displacement information calculation unit 20 to calculate the displacement information using the ultrasonic reflection signal detected on the k+1th scanning line.

[0129] As a result, the control module 50 can control the second adjustment connection part 12b to perform ultrasonic scanning while the height changes in response to the displacement information of the k+1th scanning line calculated by the displacement information calculation part 20 when the second probe 11b performs ultrasonic scanning on the k+2th scanning line. If this process is repeated, for all scanning lines of the detection surface 3, the second probe 11b performs ultrasonic detection while the height changes in response to the shape of the detection surface 3 of the previous scanning line, and finally implements ultrasonic detection with guaranteed accuracy.

[0130] like Figure 3 As shown in figure b, when the first probe 11a and the second probe 11b are assembled in a horizontal arrangement in a state connected to the assembly fixture 3, the control module 50 controls the height of the second probe 11b based on the displacement information calculated by the ultrasonic reflection signal detected by the first probe 11a for a specific scanning line, such as the k-th scanning line, and performs ultrasonic scanning on the k-th scanning line corresponding to the scanning line of the object of displacement information calculation.

[0131] Furthermore, the control module 50 controls the first probe 11a to perform ultrasonic scanning on a specific scanning line, and then the ultrasonic reflection signal reflected from the detection surface 3 is analyzed in the displacement information calculation unit 20, and then the displacement information of the specific scanning line is calculated. Then, according to the calculated displacement information, the height of the second probe 11b is controlled to change when performing ultrasonic scanning on the same specific scanning line.

[0132] As a result, when the second probe 11b performs the scanning required for ultrasonic detection on the specific scanning line, the ultrasonic scanning can be performed while the height is changed according to the curved shape of the specific scanning line detection surface 3. Figure 3 Compared with the layout of a, Figure 3 The b arrangement can further improve the accuracy of ultrasonic detection.

[0133] On the one hand, when the control module 50 controls the second probe 11b to be variable in height and performs ultrasonic scanning on the kth scanning line, the first probe 11a performs the ultrasonic scanning required for calculating the displacement information on the k+1th scanning line, and the displacement information calculation unit 20 calculates the displacement information using the ultrasonic reflection signal detected on the k+1th scanning line.

[0134] As a result, the control module 50 controls the second adjustment connection part 12b so that the ultrasonic scanning is performed while the height changes in accordance with the displacement information of the k+1 scanning line calculated by the displacement information calculation part 20 and the k+1 scanning line corresponding to the same scanning line is ultrasonically scanned by the second probe 11b. When these processes are repeated, the second probe 11b performs ultrasonic detection on all scanning lines of the detection surface 3 while the height changes in accordance with the shape of the detection surface 3 of the corresponding scanning line, and as a result, the accuracy is further improved, and the ultrasonic detection is performed in a guaranteed state.

[0135] On the one hand, if Figure 7 As shown in the figure, the control module 50 according to the present invention controls the first probe 11a to continuously perform ultrasonic scanning on multiple scanning lines for calculating displacement information, and as the height of the second probe 11b changes, ultrasonic scanning can be continuously performed on the detection surface of the sample for multiple scanning lines to perform ultrasonic detection.

[0136] For example, the control module 50 defines the first scanning line and the second scanning line as a first group of scanning lines, defines the third scanning line and the fourth scanning line as a second group of scanning lines, defines the fifth scanning line and the sixth scanning line as a third group of scanning lines, etc., and controls each group of scanning lines to perform an ultrasonic scanning action through the first probe 11a and an ultrasonic scanning action through the second probe 11b. As described above, it is preferably suitable to perform the operation when each plurality of scanning lines are formed very close to each other, or have a small degree of curvature and are basically in a horizontal state.

[0137] According to the ultrasonic detection device of one embodiment of the present invention described above, there are a first probe for performing ultrasonic scanning on the detection surface of the sample for calculating displacement information and a second probe for performing ultrasonic scanning on the detection surface of the sample for ultrasonic detection. The second probe performs ultrasonic scanning while the height changes based on the displacement information calculated using the ultrasonic reflection signal detected by the first probe. Therefore, it has the advantage of being able to perform rapid and high-precision ultrasonic detection on samples with uneven or unbalanced detection surfaces, such as curved samples.

[0138] Figure 8 2 is an example diagram showing various scanning patterns of an ultrasonic detection device according to an embodiment of the present invention. Figure 8 and Fig. 9 The ultrasonic detection device 100 of the present invention includes a scanning pattern setting unit 25 for storing and managing scanning patterns corresponding to the interval information between a plurality of scanning points of each scanning line of the first probe 11a and the second probe 11b.

[0139] The scanning pattern can be changed by the administrator and can be variably applied to samples with different bending degrees. Therefore, the scanning pattern setting unit 25 can be changed into different scanning patterns according to the needs of the administrator and stored and managed.

[0140] The first probe 11a and the second probe 11b perform ultrasonic scanning while moving along multiple scanning lines (first scanning line to Nth scanning line) during the ultrasonic scanning of the sample, and perform ultrasonic scanning on each scanning point corresponding to the scanning pattern stored and managed by the scanning pattern setting unit 25 according to the control of the control module 50.

[0141] The scanning pattern can be changed and set by the administrator according to the bending shape of the sample 1, the bending degree of each part, etc. Specifically, Figure 8 As shown in the figure, the plurality of scanning points (shown as points) in each scanning line forming the scanning pattern may be spaced at the same interval ( Figure 8 ), or they can be spaced at different intervals ( Figure 8 In addition, each scanning line is as follows Figure 8 A and Figure 8 As shown in b, it can have different scanning patterns, or as Figure 8 As shown in c, different scanning patterns may also be provided.

[0142] Further, the scanning pattern suitable for the present invention is, for example Figure 8 As shown in a of FIG. 1 , the scanning patterns of the plurality of scanning lines are the same, and the intervals between the plurality of scanning points in each scanning line are the same, or as Figure 8 As shown in b, the scanning patterns of the plurality of scanning lines are the same, but the intervals between the plurality of scanning points in each scanning line are different, or as shown in Figure 8 As shown in c, while the scanning patterns of the plurality of scanning lines are different, the intervals between the plurality of scanning points in each scanning line can be formed differently.

[0143] The scanning pattern as described above is stored and managed in the scanning pattern setting unit 25, and the scanning pattern setting unit 25 sends the scanning pattern information of the first probe 11a and the second probe 11b to the scanning control unit 38 according to the control of the control module 50. Then, the timing unit 32 can refer to the scanning pattern information received by the scanning control unit 38.

[0144] Next, combine Figures 9 to 14 The ultrasonic scanning of a test object formed of a plurality of layers using the ultrasonic testing apparatus according to the embodiment of the present invention will be described. Fig. 9FIG. 1 is an ultrasonic detection device according to another embodiment of the present invention, which is a configuration diagram of an ultrasonic detection device for detecting a detected object formed of multiple layers. Fig. 9 For explanation purposes only.

[0145] like Figures 9 to 14 As shown in the figure, the ultrasonic detection device 100 of the embodiment of the present invention is composed of: a detection module 10, which has a plurality of probes 11, and performs ultrasonic scanning corresponding to the plurality of joint surfaces 5 of the object to be detected 1 formed by a plurality of layers 3; a processing module 30, which sends an ultrasonic generating signal to make the plurality of probes 11 generate ultrasonic signals respectively, performs gate processing on the ultrasonic reflection signals respectively detected by the plurality of probes 11, and then outputs the displacement of each ultrasonic reflection signal of the plurality of joint surfaces 5, and generates a picture of each joint surface 5 based on the displacement of each ultrasonic reflection signal; a control module 50, which controls the ultrasonic scanning action of the detection module 10 and controls the signal processing of the processing module 30.

[0146] The detection module 10 includes a plurality of probes 11, which respectively perform ultrasonic scanning corresponding to a plurality of joint surfaces 5 of the object 1 formed by a plurality of layers 3. Fig. 9 As shown in the figure, there are first to k-th probes 11, which correspond to the first to k-th joint surfaces 5 of the respective subjects 1 in sequence, so as to perform ultrasonic scanning (see Fig.10 ).

[0147] The subject 1 applicable to the present invention is as follows Fig.10 As shown in a, the first layer 3a, the second layer 3b and the third layer 3c are laminated and bonded in sequence, and a first bonding surface 5a is formed on the boundary surface between the first layer 3a and the second layer 3b, and a second bonding surface 5b is formed on the boundary surface between the second layer 3b and the third layer 3c. In addition, the detected body 1 has an upper surface 7 corresponding to the upper surface of the uppermost layer, i.e., the first layer 3a, and a lower surface 9 corresponding to the lower surface of the lowermost layer, i.e., the third layer 3c. 5]

[0149] The object to be detected 1 as described above may be a DCB (Direct Copper Bonding) substrate equivalent to a power semiconductor module substrate. In this state, the second layer 3b may be a ceramic substrate (e.g., Al2O3, AlN, Si3N4, ZDA (zirconia-doped alumina)), and the first layer 3a and the third layer 3c may be an upper metal layer (e.g., Cu or Al) and a lower metal layer (e.g., Cu or Al) of the ceramic substrate, respectively.

[0150] In order to be equivalent to Fig.10 The object to be detected 1 of the DCB (Direct Copper Bonding) substrate shown in a is subjected to ultrasonic detection, and the detection module 10 is as shown in FIG. Fig.11 As shown, a first probe 11a for ultrasonic scanning corresponding to the first joint surface 5a and a second probe 11b for ultrasonic scanning corresponding to the second joint surface 5b may be provided. Further, in this state, the detection module 10 may have two probes 11a and 11b for ultrasonic scanning of the corresponding joint surfaces 5a and 5b.

[0151] The subject 1 used in the present invention is as follows Fig.10 As shown in b, the first layer 3a, the second layer 3b, the third layer 3c, the fourth layer 3d, and the fifth layer 3e can be stacked and bonded in sequence, and a first bonding surface 5a is formed on the boundary surface between the first layer 3a and the second layer 3b, a second bonding surface 5b is formed on the boundary surface between the second layer 3b and the third layer, a third bonding surface 5c is formed on the boundary surface between the third layer 3c and the fourth layer 3d, and a fourth bonding surface 5d is formed on the boundary surface between the fourth layer 3d and the fifth layer 3e. In addition, the detected body 1 includes an upper surface 7 which is the uppermost layer, i.e., equivalent to the upper surface of the first layer 3a, and a lower surface 9 which is the lowermost layer, i.e., equivalent to the lower surface of the fifth layer 3e.

[0152] The object 1 to be detected may be a high voltage (High

[0153] In this state, the third layer 3c may be a ceramic substrate (e.g., Al2O3, AlN, Si3N4, ZDA (zirconia-doped alumina)), the first layer 3a and the fifth layer 3e may be an upper metal layer (e.g., Cu or Al) and a lower metal layer (e.g., Cu or Al) of the ceramic substrate, respectively, and the second layer 3b and the fourth layer 3d may be metal brazing layers.

[0154] In order to be equivalent to Fig.10 The ultrasonic detection is performed on the AMB (Active Metal Brazing) substrate of the object to be detected 1, and the detection module 10 is as shown in FIG. Fig.12As shown in the figure, the detection module 10 may include a first probe 11a for ultrasonic scanning corresponding to the first joint surface 5a; a second probe 11b for ultrasonic scanning corresponding to the second joint surface 5b; a third probe 11c for ultrasonic scanning corresponding to the third joint surface 5c; and a fourth probe 11d for ultrasonic scanning corresponding to the fourth joint surface 5d. Further, in this state, the detection module 10 may include four probes 11a to 11d to perform ultrasonic scanning on the corresponding joint surfaces 5a to 5d.

[0155] The detection module 10 of the present invention also includes an assembly fixture 13. The assembly fixture 13 performs the function of fixing the plurality of probes 11 on the upper side of the fixed detection position to perform ultrasonic detection on the object 1. Fig.11 and Fig.12 As shown, a plurality of probes 11 are assembled on the lower portion of an assembling fixture 13 .

[0156] However, each of the plurality of probes 11 of the present invention is assembled to be able to adjust the height so as to focus on the corresponding joint surface 5. To this end, the detection module 10 of the present invention is also provided with a plurality of adjustment connecting parts 12. Each adjustment connecting part 12 assembles the corresponding probe 11 to the assembly fixture 13 and connects them to an adjustable height. Therefore, each probe 11 can be adjusted in height through the corresponding adjustment connecting part 12.

[0157] The adjustment connection part can correspond to the first probe to the kth probe 11 respectively, and is composed of the first adjustment connection part to the kth adjustment connection part 12. Each adjustment connection part can adjust the height of the corresponding probe 11 under the control of the control module 50.

[0158] Further, the control module 50 controls the moving assembly 15 so that the assembly fixture 13 equipped with the multiple probes 11 can move along the X-axis, Y-axis and Z-axis. Further, the control module 50 controls the moving assembly 15 so that the assembly fixture 13 moves along the X-axis and Y-axis, so that the ultrasonic detection area of ​​the object 1 can be ultrasonically scanned, and controls the moving assembly 15 so that the assembly fixture 13 moves along the Z-axis, so that the height of the multiple probes 11 assembled on the assembly fixture 13 can be adjusted as a whole.

[0159] On the one hand, the control module 50 controls the adjustment connection parts 12 that adjust the height of each probe 11 to the assembly fixture 13, so that the height of each corresponding probe 11 can be adjusted. Then, each probe 11 can be focused on the joint surface 5. This will be described later.

[0160] The ultrasonic detection device 100 of the present invention includes a plurality of probes 11 to perform ultrasonic scanning on a plurality of joint surfaces 5 of the object 1 formed by a plurality of layers 3. Therefore, each probe 11 needs to be focused on the corresponding joint surface 5 before performing ultrasonic scanning.

[0161] The multiple probes 11 used in the present invention scan the ultrasonic signals of the same frequency to the corresponding joint surface 5. Each ultrasonic reflection signal equivalent to the echo signal of the ultrasonic signal of each probe 11 is gate-processed in the processing module 30, so that the displacement output of the ultrasonic reflection signal of the joint surface 5 is achieved.

[0162] In order to improve the accuracy and precision of ultrasonic testing of each joint surface 5, the present invention enables each probe 5 to focus on the corresponding joint surface 5. To this end, the height of the probe 11 can be adjusted so that it can focus on the corresponding joint surface 5.

[0163] To this end, the ultrasonic detection device 100 of the present invention further includes a height adjustment unit 21 that calculates a height adjustment value for each probe 11 and provides the height adjustment value to the control module 50 , so that each probe 11 can focus on the corresponding joint surface 5 .

[0164] The control module 50 receiving the height adjustment value from the height adjustment part 21 controls the moving assembly 15 to adjust the height of the probe 11 assembled on the assembly fixture 13 , or controls each adjustment connection part 12 to adjust the height of each probe 11 .

[0165] The height adjustment unit 21 may be arranged by other components, or may be set as a component of the processing module 30, or may be set in the signal input unit 33 of the processing module 30, or may be set as a component of the control module 50. Further, the height adjustment unit 21 of the present invention is included as a component of the ultrasonic detection device 100, and performs the action of calculating the height adjustment value for each probe 11, so that each probe 11 can be focused on the corresponding joint surface.

[0166] The height adjustment unit 21, under the control of the control module 50, calculates the height adjustment value of each probe 11 so that each probe 11 can be focused on the corresponding joint surface 5, and provides the calculated height adjustment value to the control module 50. Then, the control module 50 controls the moving assembly 15, and further controls the adjustment connection unit 12, so that the height of the corresponding probe 11 can be adjusted.

[0167] The height adjustment unit 21 calculates the height adjustment value of each probe 11 through various height adjustment value calculation methods under the control of the control module 50 and provides the height adjustment value to the control module 50. The various height adjustment value calculation methods of the height adjustment unit 21 are described in detail below.

[0168] The height adjustment unit 21 may calculate the height adjustment value by the first height adjustment value calculation method and provide it to the control module 50. Further, the height adjustment unit 21 may perform the operation of providing the height corresponding information of each probe 11 having the largest displacement of the ultrasonic reflection signal of each joint surface 5 corresponding to each probe 11 as the height adjustment value to the control module 50.

[0169] Here, the height corresponding information is equivalent to the height value of the focusing object probe 11 provided by the control module 50 or the height value identification information corresponding to the height value or the identification information of the focusing object probe 11 .

[0170] When the first height adjustment value calculation method is applied, the control module 50 enables each probe 11 corresponding to each joint surface 5 to perform A-scan in sequence, so that the height adjustment unit 21 can determine the height corresponding information that maximizes the displacement of the ultrasonic reflection signal of each joint surface 5 corresponding to each probe 11.

[0171] The A-scan is to express the size (amplitude) of the ultrasonic reflection signal received at a certain point in the vertical direction of the object 1 relative to time, so as to determine the defects of the object. Fig.13 As shown in the figure, each probe 11 can be used to display the waveform of the echo signal, i.e., the ultrasonic reflection signal, on the time side, and the vertical side of the graph can display the signal strength (amplitude), and the horizontal side can display the time. Furthermore, it is a method of confirming the amplitude change over time at a specific reference point. Here, ultrasonic focusing can be achieved by ensuring the maximum amplitude for the corresponding joint surface 5 while finely moving the Z-axis height of each probe 11.

[0172] The A-scan irradiates the ultrasonic signal in the vertical direction to the object 1 to be detected through each probe 11. Here, it is configured to adjust the focusing distance with the maximum amplitude on the corresponding joint surface 5 of the object 1 to be detected. After that, a gate is set before and after the ultrasonic reflection signal of the corresponding joint surface 5. The gate is used to limit the detection area to a certain interval. Here, the control module 50 can control the adjustment connection part 12 corresponding to the probe 11 performing the A-scan, and then adjust the focusing distance by moving the Z axis.

[0173] Combine the following Fig.11 The calculation method of the first height adjustment value is further described in detail.

[0174] The control module 50 controls the first probe 11a corresponding to the first joint surface 5a to perform A-scan while changing the height. Further, the control module 50 controls the first adjustment connection portion 12a corresponding to the first probe 11a to control the height of the first probe 11a to be variable, and controls the first probe 11a to scan ultrasonic signals at each changed height.

[0175] Each echo signal of the ultrasonic signal at each variable height, that is, each ultrasonic reflection signal, is received by the first probe 11a and then sequentially transmitted to the height adjustment unit 21. The height adjustment unit 21 is formed as follows. Fig.13 By analyzing the A-scan waveform shown in the figure, the corresponding ultrasonic reflection signal with the maximum amplitude (displacement) in the corresponding first joint surface 5a can be determined, so that the variable height of the first probe 11a that receives the ultrasonic reflection signal can be determined.

[0176] When the control module 50 controls the first probe 11a to scan the ultrasonic signal at a specific variable height, the specific variable height is transmitted to the height adjustment unit 21. Then, the height adjustment unit 21 can match and store the A-scan waveform analysis result and the variable heights of the first probe 11a accordingly. Thus, the height adjustment unit 21 can determine the variable height of the first probe 11a that receives the corresponding ultrasonic reflection signal with the maximum amplitude (displacement) in the first joint surface 5a according to the A-scan waveform analysis result.

[0177] The height adjustment unit 21 transmits the variable height of the first probe 11a as a height adjustment value to the control module 50. Then, the control module 50 controls the first adjustment connection unit 12a so that the first probe 11a is adjusted to the variable height. Then, the first adjustment connection unit 12a adjusts the first probe 11a to the variable height. As a result, the first probe 11a completes focusing on the corresponding first joint surface 5a, and then improves the precision of ultrasonic detection through ultrasonic scanning.

[0178] With the control of the control module 50 and the action of the height adjustment unit 21, after the first probe 11a completes focusing on the first joint surface 5a, the second probe 11b is focused on the second joint surface 5b through the same control and action as described above.

[0179] If the subject 1 is Fig.12As shown in the figure, there are four corresponding probes 11 for the four joint surfaces 5a~5d, and the control of the control module 50 and the action of the height adjustment unit 21 can be applied in the same way, so that the third probe 11c focuses on the third joint surface 5c and the fourth probe 11d focuses on the fourth joint surface 5d.

[0180] On the one hand, the height adjustment unit 21 calculates the height adjustment value by a second height adjustment value calculation method, which is different from the first height adjustment value calculation method, and provides the height adjustment value to the control module 50. Further, the height adjustment unit 21 provides the height corresponding information of the specific probe 11 with the largest displacement of the ultrasonic reflection signal of the specific joint surface 5 corresponding to the specific probe 11 as the height adjustment value for the specific probe 11 to the control module 50 (hereinafter referred to as "focusing action based on A-scan"), and then calculates the thickness of each layer 3 of the object 1 by the time difference of the ultrasonic reflection signal of each joint surface 5, and calculates the spacing distance between the specific joint surface 5 and each different joint surface 5, and then performs the action of providing the calculated spacing distance as the height adjustment value for each different probe 11 to the control module 50 (hereinafter referred to as "focusing action based on spacing distance").

[0181] Combine the following Fig.11 The calculation method of the second height adjustment value is described in detail.

[0182] First, the "focusing action based on A-scan" is performed on the first probe 11a corresponding to the specific probe. Further, the height corresponding information of the specific probe, i.e., the first probe 11a, which has the largest displacement of the ultrasonic reflection signal of the specific joint surface, i.e., the first joint surface 5a, corresponding to the first probe 11a corresponding to the specific probe, is provided to the control module 50 as the height adjustment value of the specific probe, i.e., the first probe 11a. The "focusing action based on A-scan" as described above follows the action of calculating the height adjustment value by A-scan according to the control and action of the control module 50 and the height adjustment unit 21 described in the first height adjustment value calculation method.

[0183] After the height of the first probe 11 a is adjusted according to the “focusing action based on A-scan”, the height adjustment unit 21 calculates the height adjustment value of the second probe 11 b corresponding to the other probe according to the “focusing action based on spacing distance” and provides it to the control module 50 .

[0184] Specifically, the height adjustment unit 21 calculates the thickness of each layer of the object 1, especially the second layer 3b, by using the ultrasonic reflection signal used when determining the height adjustment value of the first probe 11a by the "focusing action based on A-scan", and further calculates the spacing distance between the second joint surface 5b corresponding to the second probe 11b and the first joint surface 5a, which is the specific joint surface. Here, the spacing distance between the second joint surface 5b corresponding to the second probe 11b and the first joint surface 5a, which is the specific joint surface, is ultimately equivalent to the thickness of the second layer 3b.

[0185] The height adjustment unit 21 can calculate the thickness d1 of the second layer 3b by the time difference between the ultrasonic reflection signal of the specific joint surface, that is, the first joint surface 5a and the second joint surface 5b corresponding to the second probe 11b. Figure 5 The time difference t1 of the ultrasonic reflection signal to the first bonding surface 5a and the second bonding surface 5b is calculated from the ultrasonic reflection signal waveform shown in FIG.

[0186] The height adjustment unit 21 can calculate the thickness of the second layer 3b, that is, the distance between the first joint surface 5a and the second joint surface 5b, by using the calculated time difference t1 of the ultrasonic reflection signal of the first joint surface 5a and the second joint surface 5b in a variety of distance calculation methods. For example, since the height adjustment unit 21 pre-stores and manages the media constituting each layer of the object 1 and the ultrasonic velocity for each medium, the thickness of the second layer 3b, that is, the distance between the first joint surface 5a and the second joint surface 5b can be calculated by (ultrasonic velocity for the medium of the second layer 3b)*(t1 / 2).

[0187] The height adjustment unit 21 provides the calculated thickness of the second layer 3b, i.e., the spacing distance between the first joint surface 5a and the second joint surface 5b, as the height adjustment value of the other probe, i.e., the second probe 11b, to the control module 50. Then, the control module 50 determines the received height adjustment value as the height displacement value h1 of the second probe 11b relative to the first probe 11a, and controls the second adjustment connection unit 12b to move the second probe 11b relative to the first probe 11a with a height difference of the height displacement value h1. With this "focusing action based on the spacing distance", the second probe 11b focuses on the corresponding second joint surface 5b, thereby improving the accuracy of ultrasonic detection.

[0188] The height adjustment unit 21 uses and analyzes the ultrasonic reflection signal in order to determine the time difference required for calculating the thickness of each layer 3 during the execution of the "focusing action based on the spacing distance". The ultrasonic reflection signal used and analyzed at this time is preferably the echo signal of the ultrasonic signal of the probe that has completed focusing with the "focusing action based on the A-scan", that is, the first probe 11a, that is, the ultrasonic reflection signal. Since the focusing of the first probe is completed, the amplitude of the ultrasonic reflection signal to the first joint surface 5a is the largest, and as a result, the amplitude of the ultrasonic reflection signal to the other adjacent joint surfaces, that is, the second joint surface 5b is also large enough, so that the phenomenon that the time difference cannot be determined due to the absence or extremely small reflection signal can be prevented in advance.

[0189] Apply the above second height adjustment value calculation method to Fig.12 When the detected object is shown in the figure, the height adjustment unit 21 determines the time difference of the ultrasonic reflection signal between the second joint surface 5b and the third joint surface 5c and between the third joint surface 5c and the fourth joint surface 5d during the "focusing action based on the spacing distance", and calculates the thickness d2 of the third layer 3c and the thickness of the fourth layer 3d of the detected object 1 (not shown). The height adjustment unit 21 can calculate the spacing distance between the first joint surface 5a and the third joint surface 5c and the spacing distance between the first joint surface 5a and the fourth joint surface 5d according to the thickness of each layer, and provide the calculated spacing distances to the control module 50 as the height adjustment value h2 of the third probe 11c and the height adjustment value of the fourth probe 11d, that is, as the height displacement value of the first probe 11a.

[0190] Then, the control module 50 controls the corresponding third adjustment connection part and the fourth adjustment connection part so that the third probe and the fourth probe are respectively separated from the first probe by the determined height displacement values. As a result, the third probe 11c focuses on the corresponding third joint part 5c, and the fourth probe 11d focuses on the corresponding fourth joint part 5d, thereby improving the accuracy of ultrasonic detection.

[0191] On the one hand, the height adjustment unit 21 can calculate the height adjustment value according to a third height adjustment value calculation method different from the first height adjustment value calculation method and the second height adjustment value calculation method, and provide it to the control module 50. Further, the height adjustment unit 21 uses the height corresponding information of the specific probe 11 with the largest displacement of the ultrasonic reflection signal of the specific joint surface 5 corresponding to the specific probe 11 as the height adjustment value of the specific probe 11, and provides it to the control module 50 ("focusing action based on A-scan"). Then, from other joint surfaces 5 close to the specific joint surface 5 to other joint surfaces 5 far away, the height adjustment values ​​of each other probe 11 corresponding to each other joint surface 5 are calculated in sequence, and provided to the control module 50. The height adjustment value of the specific other probe 11 is determined by calculating the distance between the corresponding other specific joint surface 5 and the previous joint surface 5 corresponding to the previous probe 11 for which the height adjustment value calculation was completed previously (hereinafter referred to as "focusing action based on sequential adjustment").

[0192] Recombined below Fig.12 A method for calculating the third height adjustment value is described in detail.

[0193] First, the "focusing action based on A-scan" is performed on the first probe 11a corresponding to the specific probe. Further, the height corresponding information of the specific probe, i.e., the first probe 11a, which has the largest displacement of the ultrasonic reflection signal of the specific joint surface, i.e., the first joint surface 5a, corresponding to the first probe 11a corresponding to the specific probe, is provided to the control module 50 as the height adjustment value of the specific probe, i.e., the first probe 11a. The "focusing action based on A-scan" as described above follows the action of calculating the height adjustment value by A-scan according to the control and action of the control module 50 and the height adjustment unit 21 as described in the first height adjustment value calculation method and the second height adjustment value calculation method.

[0194] After the height of the first probe 11a is adjusted according to the “focusing action based on A-scan”, the height adjustment unit 21 calculates the height adjustment values ​​of the second probe 11b to the fourth probe 4d corresponding to other probes according to the “focusing action based on sequential adjustment” and provides them to the control module 50.

[0195] Specifically, the height adjustment unit 21 sequentially calculates the height adjustment values ​​of the other probes 11b, 11c, and 11d corresponding to the other joint surfaces 5b, 5c, and 5d from the second joint surface 5b corresponding to the other joint surface close to the first joint surface 5a corresponding to the specific joint surface to the fourth joint surface 5d corresponding to the other joint surface away from the first joint surface 5a, and provides the calculated height adjustment values ​​to the control module 50.

[0196] The height adjustment unit 21 first calculates the height adjustment value of the specific other probe, namely the second probe 11b, corresponding to the second joint surface 5b which is equivalent to the other joint surface and is closest to the first joint surface 5a. The height adjustment value of the second probe 11b corresponding to the specific other probe is determined by calculating the spacing distance between the corresponding other specific joint surface, namely the second joint surface 5b, and the previous probe whose height adjustment value has been calculated before, namely the previous joint surface, namely the first joint surface 5a, corresponding to the first probe 11a.

[0197] After completing the height adjustment value of the second probe 11b, the height adjustment unit 21 calculates the height adjustment value of the specific other probe, namely the third probe 11c, corresponding to the third joint surface 5c equivalent to the other joint surface approached after the first joint surface 5a to the second joint surface 5b. Here, the height adjustment value of the third probe 11c equivalent to the specific other probe is determined by calculating the spacing distance between the corresponding other specific joint surface, namely the third joint surface 5c, and the previous probe for which the height adjustment value calculation was completed previously, namely the previous joint surface corresponding to the second probe 11b, namely the second joint surface 5b.

[0198] After the height adjustment value of the third probe 11c is completed, the height adjustment unit 21 calculates the height adjustment value of the fourth probe 11d, which is a specific other probe corresponding to the fourth joint surface 4d corresponding to the other joint surface farthest from the first joint surface 5a. Here, the height adjustment value of the fourth probe 11d corresponding to the specific other probe is determined by calculating the spacing distance between the corresponding other specific joint surface, i.e., the fourth joint surface 5d, and the previous probe, i.e., the previous joint surface 5c corresponding to the third probe 11c, for which the height adjustment value calculation was completed previously.

[0199] The method for calculating the height adjustment value of each probe according to the third height adjustment value calculation method as described above is that, under the control of the control module 50, the first probe 11a is focused first, and then other probes are focused.

[0200] According to the situation, the control module 50 can control to focus on the second probe 11b first, and then focus on the other multiple probes. In this state, the height adjustment unit 21 focuses on the second probe 11b according to the "focusing action based on A-scan", and then after the height of the second probe 11b is adjusted, the height adjustment unit 21 calculates the height adjustment values ​​of the first probe 11a, the third probe 11c and the fourth probe 4d corresponding to other probes according to the "focusing action based on sequential adjustment" and provides them to the control module 50. More specifically, the height adjustment unit 21 simultaneously calculates the height adjustment values ​​of the first probe 11a and the third probe 11c corresponding to the first joint surface 5a and the third joint surface 5c corresponding to another joint surface closer to the second joint surface 5b according to the "focusing action based on sequential adjustment", and then calculates the height adjustment value of the fourth probe 11d corresponding to the fourth joint surface 5d.

[0201] Here, the height adjustment values ​​of the first probe 11a and the third probe 11c are determined by calculating the spacing distances between the first joint surface 5a and the third joint surface 5c corresponding to other specific joint surfaces, respectively, and the second joint surface 5b corresponding to the previous joint surface, which corresponds to the second probe 11b corresponding to the previous probe and whose height adjustment value has been calculated before; the height adjustment value of the fourth probe 11d is determined by calculating the distance between the corresponding fourth joint surface 5d corresponding to other specific joint surfaces and the third joint surface 5c corresponding to the previous joint surface, which corresponds to the third probe 11c corresponding to the previous probe and whose height adjustment value has been calculated before.

[0202] The spacing distance between the other specific joint surface 5 corresponding to the specific other probe 11 and the previous joint surface 5 corresponding to the previous probe 11 that completed the height adjustment value calculation is determined by calculating the thickness of the layer 3 of the object 1 located between the other specific joint surface 5 and the previous joint surface 5 through the ultrasonic reflection signal of the previous probe 11 that completed the height adjustment value calculation.

[0203] For example, the spacing distance between the other specific joint surface corresponding to the second probe 11b equivalent to the specific other probe, i.e., the second joint surface 5b, and the previous joint surface corresponding to the first probe 11a equivalent to the previous probe for which the height adjustment value calculation was completed, i.e., the first joint surface 5a, is determined by calculating the thickness of the second layer 3b of the layer equivalent to the test object 1 located between the other specific joint surface, i.e., the second joint surface 5b, and the previous joint surface, i.e., the first joint surface 5a, by the ultrasonic reflection signal of the first probe 11a equivalent to the previous probe for which the height adjustment value calculation is completed.

[0204] Furthermore, the spacing distance between the other specific joint surface, i.e., the third joint surface 5c, corresponding to the third probe 11c, which is equivalent to the specific other probe, and the previous joint surface, i.e., the second joint surface 5b, corresponding to the second probe 11b, which is equivalent to the previous probe, for which the height adjustment value calculation was completed before, is determined by calculating the thickness of the third layer 3c, which is equivalent to the layer of the test object 1 located between the other specific joint surface, i.e., the third joint surface 5c, and the previous joint surface, i.e., the second joint surface 5b, by the ultrasonic reflection signal of the second probe 11b, which is equivalent to the previous probe for which the height adjustment value calculation is completed.

[0205] On the one hand, after calculating all the height adjustment values ​​of the probes, the height adjustment unit 21 provides them to the control module 50 at one time, or transmits them to the control module 50 every time the height adjustment value of each probe is calculated.

[0206] However, as described above, the spacing distance between the other specific joint surface corresponding to the other specific probe and the previous joint surface corresponding to the previous probe that previously completed the height adjustment value calculation is determined by calculating the thickness of the layer of the object to be detected between the other specific joint surface and the previous joint surface through the ultrasonic reflection signal of the previous probe that completed the height adjustment value calculation, so the ultrasonic reflection signal of the previous probe that completed the height adjustment value is used and analyzed. Accordingly, preferably, the height adjustment unit 21 transmits the height adjustment value of each probe to the control module 50 each time the height adjustment value is calculated, and the echo signal of the ultrasonic signal of the probe that completed the height adjustment, i.e., the ultrasonic reflection signal, is used and analyzed for calculating the height adjustment value of the next probe.

[0207] Combine the following Fig.14 A method of performing ultrasonic testing on each joint surface 5 of the test object 1 using the ultrasonic testing device 100 described above will be briefly described.

[0208] First, the step s10 is performed to focus each probe corresponding to each joint surface of the object 1. The focusing method for each probe can be performed by a variety of height adjustment value calculation methods and the control of the control module 50.

[0209] After the focusing execution step s10 is completed, a step s30 is performed to set a gate for the ultrasonic reflection signal of each joint surface and set a scanning area of ​​the object 1. Specifically, the gate for the ultrasonic reflection signal of each probe is set by using the scanning information obtained by A-scanning the ultrasonic signal of each probe after the height adjustment is completed, and the X-axis and Y-axis scanning areas of the object 1 are set. This is a step of preparing a C-scan mode by setting the same set frequency and probe with the highest amplitude for the reflection signal of each joint surface or inner surface and setting a gate for the ultrasonic reflection signal of each probe.

[0210] After the step s30 is completed, the step s50 is executed to simultaneously move all the probes corresponding to the joint surfaces to perform ultrasonic scanning. The step s50 is a step of performing C-scanning on the scanning area set in the previous step s30, and driving the assembly fixture 13 in the ±X and ±Y directions to move the multiple probes simultaneously, and then performing ultrasonic testing, thereby obtaining scanning information of each of the multiple probes.

[0211] Further, the entire area to be detected (or the entire area of ​​the detected body arranged in a row in the arrangement area, see Fig.16 and Fig.17 ) Perform ultrasonic testing, and each scanning information can be obtained through each probe. The object scanning area of ​​each probe may be different. If there are overlapping areas, one method can be ignored by pre-setting.

[0212] After the step s50 is completed, the step s70 of detecting the displacement of the ultrasonic reflection signal of each corresponding joint surface in each gate is implemented. Specifically, the ultrasonic reflection signal of the probe is processed in the gate to detect the displacement of the ultrasonic reflection signal of each joint surface.

[0213] After the step s70 is completed, as the ultrasonic scanning of the set scanning area is completed, the pictures of each joint surface are generated and analyzed. In this step, the pictures of each joint surface can be combined into a scanned image.

[0214] According to the present invention described above, i.e. the ultrasonic detection device, as an ultrasonic detection device, a plurality of probes are provided corresponding to the plurality of joint surfaces of the object to be detected which need to be ultrasonically detected. After the height of each probe is adjusted and the focusing of each joint surface corresponding to each probe is completed, ultrasonic detection can be performed on each joint surface at the same time. Therefore, its advantage is that the speed and precision of ultrasonic detection of the object to be detected having multiple joint surfaces can be improved.

[0215] like Figures 15 to 17As shown in the figure, the ultrasonic detection device 100 of the embodiment of the present invention is an ultrasonic detection device, which is composed of: a detection table 70, which has a plurality of placement parts 71 for respectively placing the object to be detected 1; a detection module 10, which has a plurality of probes 11, and performs ultrasonic detection on the joint surface of the object to be detected 1 placed on the detection table 70; a processing module 30, which sends an ultrasonic generating signal so that the plurality of probes 11 each generate an ultrasonic signal, performs gate processing on the ultrasonic reflection signals detected by the plurality of probes 11, outputs the displacement of the ultrasonic reflection signal of the joint surface 5, and generates a picture of the joint surface based on the displacement of the ultrasonic reflection signal; a control module 50, which controls the ultrasonic scanning action of the detection module 10 and controls the signal processing of the processing module 30.

[0216] The testing station 70 is as follows Fig.15 As shown in the figure, there are multiple placement parts 71 so that the detected objects 1 can be placed separately, and include multiple placement areas 73 (73a, 73b, 73c, 73d) arranged and separated from each other, and in each of the placement areas 73 (73a, 73b, 73c, 73d) there are at least two placement parts 71 (71a, 71b, 71c, 71d) arranged in a row.

[0217] Fig.16 The example in which the placement area 73 is composed of four placement areas, namely, a first placement area 73a, a second placement area 73b, a third placement area 73c and a fourth placement area 73d, which are arranged in a continuous and spaced relationship from each other, is shown, but the present invention is not limited thereto and the placement area 73 may be composed of more or fewer placement areas.

[0218] exist Fig.16 2 shows an example in which the plurality of placement portions 71 formed in the placement areas 73 are composed of a first placement portion 71a, a second placement portion 71b, a third placement portion 71c and a fourth placement portion 71d arranged in a row, but the example is not limited thereto and may also be composed of more or fewer placement portions.

[0219] Preferably, adsorption holes 72 are formed on each of the placement parts 71 (71a, 71b, 71c, 71d) for vacuum adsorption of the placed object 1. Preferably, alignment positions or alignment lines are formed on each of the placement parts 71 (71a, 71b, 71c, 71d) so that the object 1 to be placed can be placed in an aligned state.

[0220] Furthermore, each placement portion 71 (71a, 71b, 71c, 71d) arranged and formed in each placement area 73 (73a, 73b, 73c, 73d) is for corresponding to the detected body 1 of various sizes, and preferably, the placement area can be variably composed. Further, each placement area 73 (73a, 73b, 73c, 73d) formed by the plurality of placement portions 71 (71a, 71b, 71c, 71d) is preferably composed so that the area can be varied in the width direction (the direction in which each placement area is separately arranged) and / or the length direction (the direction in which the plurality of placement portions are arranged in a row).

[0221] The plurality of objects 1 placed on the detection table 70 are detected by ultrasonic scanning through the operation of the detection module 10 having a plurality of probes 11. Further, the detection module 10 has ultrasonic detection parts for the plurality of objects placed on the detection table 70, specifically, a plurality of probes 11 for performing ultrasonic scanning on the joint surface.

[0222] like Fig.17 As shown in the figure, the plurality of probes 11 ( 11 a , 11 b , 11 c , 11 d , 11 e , 11 f ) are classified into a plurality of probe groups 17 a , 17 b , 17 c , and each of the probe groups 17 a , 17 b , 17 c is composed of at least one probe 11 .

[0223] Fig.17 The example in which the multiple probes 11 (11a, 11b, 11c, 11d, 11e, 11f) are composed of three probe groups including a first probe group 17a, a second probe group 17b and a third probe group 17c is shown, but it is not limited to this and can also be composed of more or fewer probe groups.

[0224] And in Fig.17 1 shows an example in which the first probe group 17a is composed of the adjacent first probe 11a and the second probe 11b, the second probe group 17b is composed of the adjacent third probe 11c and the fourth probe 11d, and the third probe group 17c is composed of the adjacent fifth probe 11e and the sixth probe 11f, but it is not limited thereto and may also be composed of more or fewer probe groups. Furthermore, the number of probes constituting each probe group may vary, and the number of probes between each probe group may also be the same or different.

[0225] The probe groups 17a, 17b, 17c are arranged one by one in the placement areas 73 (73a, 73b, 73c) according to the control of the control module 50, and perform ultrasonic scanning on multiple subjects 1 placed in the corresponding placement areas 73 (73a, 73b, 73c).

[0226] Combination Fig.17To further explain in detail, the first probe group 17a performs ultrasonic scanning on multiple objects 1 placed on multiple placement portions 71 formed by adjacently arranged first probes 11a and second probes 11b and arranged in a row on the first placement area 73a under the control of the control module 50. The second probe group 17b performs ultrasonic scanning on multiple objects 1 placed on multiple placement portions 71 formed by adjacently arranged third probes 11c and fourth probes 11d and arranged in a row on the second placement area 73b under the control of the control module 50. The third probe group 17c performs ultrasonic scanning on multiple objects 1 placed on multiple placement portions 71 formed by adjacently arranged fifth probes 11e and sixth probes 11f and arranged in a row on the third placement area 73c under the control of the control module 50.

[0227] like Fig.16 As shown in the figure, the multiple probe groups move along a moving path passing through the xy axis, and simultaneously perform ultrasonic scanning on multiple test objects 1 placed on multiple placement portions 71 arranged in a row on their respective corresponding placement areas 73. Therefore, the advantage of being able to perform ultrasonic testing on a large number of test objects with one ultrasonic scanning action is achieved.

[0228] The plurality of probe groups may also be configured to perform ultrasonic scanning while simultaneously moving along a moving path on the upper sides of mutually separated and individually corresponding placement areas 73, or may be configured to perform ultrasonic scanning while being connected to an assembly fixture 13 and moving together.

[0229] However, in order to simplify the structure and control operation required for the movement of the plurality of probe groups, it is more preferable to adopt a structure in which the plurality of probe groups are simultaneously moved in a state of being mounted and connected to one mounting jig 13 .

[0230] Therefore, the multiple probe groups of the present invention are as follows Fig.16 As shown in the figure, it is mounted on the assembly fixture 13 constituting the detection module 10, and moves simultaneously under the control of the control module 50 to perform ultrasonic scanning on multiple objects 1 placed in the corresponding placement areas 73.

[0231] The number of probes 11 constituting the probe groups 17a, 17b, 17c may vary. Further, ultrasonic scanning may be performed by changing the number of probes 11 constituting the probe groups 17a, 17b, 17c corresponding to the specific placement area 73. To this end, preferably, the positions of the plurality of probes 11 constituting each probe group are variable in the horizontal direction. For example, Fig.16In the state where the third probe 11c is included in the second probe group 17b, if the third probe 11c is to be included in the first probe group 17a, the third probe 11c needs to be moved horizontally to be arranged on the upper side of the first placement area 73a. During this process, the second probe 11b may also need to be moved horizontally to be closer to the first probe group 11a.

[0232] As described above, each probe 11 constituting each probe group is not directly fixedly connected to the assembly fixture 13, but is installed on the assembly fixture 13 through the adjustment connection part 12 constituting the detection module 10 so as to be moved in the horizontal direction. Further, each probe 11 constituting the probe group is assembled on the assembly fixture 13 through the adjustment connection part 12, and is connected so that the horizontal position can be adjusted through the adjustment connection part 12. Each adjustment connection part 12 is used to assemble the corresponding probe 11 to the assembly fixture 13, and as long as the corresponding probe 11 can be moved in the horizontal direction, it can be composed of multiple structures.

[0233] exist Fig.16 1 shows an example in which the first probe 11a is connected to the assembly fixture 13 through the first adjustment connection part 12a, the second probe 11b is connected to the second adjustment connection part 12b, the third probe 11c is connected to the third adjustment connection part 12c, the fourth probe 11d is connected to the fourth adjustment connection part 12d, the fifth probe 11e is connected to the fifth adjustment connection part 12e, and the sixth probe 11f is connected to the sixth adjustment connection part 12f so that the position can be adjusted in the horizontal direction. However, although it will be described later, each adjustment connection part 12 allows the corresponding probe 11 to move in the height direction.

[0234] As described above, each probe 11 can be moved in the horizontal direction by the corresponding adjustment connection part 12 on the assembly fixture 13, so it can be changed according to the needs based on the number of probes 11 constituting each probe group corresponding to each placement area 73.

[0235] In order to perform ultrasonic scanning on the plurality of probes 11 constituting the detection module 10 and obtain ultrasonic detection results of the ultrasonic detection part, ie, the joint surface, of the detected object 1 along with the ultrasonic scanning, a processing module 30 is used.

[0236] Although described later, the processing module 30 sends an ultrasonic generating signal to make the multiple probes 11 each generate an ultrasonic signal, gate processing is performed on the ultrasonic reflection signals detected by each of the multiple probes 11, and then the displacement of the ultrasonic reflection signal of the joint surface 5 is output, and based on the displacement of the ultrasonic reflection signal, the action of generating a joint surface image is implemented.

[0237] Although described later, the ultrasonic scanning operation of the detection module 10 and the signal processing of the processing module 30 are performed under the control of the control module 50, and the object 1 to be detected may have multiple joint surfaces. Therefore, the control module 50 controls the detection module 10 and the processing module 30 to perform ultrasonic scanning on the multiple joint surfaces 5 and generate ultrasonic detection results.

[0238] For example, the control module 50 is to make each probe group corresponding to each placement area 73 move the horizontal position of the probe 11, and control all the multiple joint surfaces 5 of the object 1 placed in each placement area 73 to perform ultrasonic scanning at one time. Fig.17 The inverted movement of the subject 1 shown in the figure is controlled to perform ultrasonic scanning twice.

[0239] The latter state is equivalent to a method of ultrasonically scanning the joint surface 5 close to the upper surface of the detected object 1 and the joint surface 5 close to the lower surface separately. To this end, the ultrasonic detection device 100 of the present invention preferably also includes an inversion module (not shown) so that the multiple detected objects 1 placed in each placement area 73 can be inverted.

[0240] Fig.17 a is an example in which each object 1 to be detected is placed in the first mounting area 73a and the second mounting area 73b so that the upper surface can be seen, and then the joint surface 5 close to the upper surface is ultrasonically scanned by the corresponding first probe group 17a and the second probe group 17b, and then the inversion module is used to place the object 1 in the first mounting area 73a and the second mounting area 73b so that the lower surface can be seen, and then the joint surface 5 close to the lower surface is ultrasonically scanned by the corresponding first probe group 17a and the second probe group 17b.

[0241] Fig.17 b is an example of performing ultrasonic scanning on the joint surfaces 5 close to the upper surface and the lower surface through the corresponding first probe groups 17a and the second probe groups 17b, while the object 1 to be detected is placed in the first placement area 73a so that the upper surface can be seen, and in the second placement area 73b so that the lower surface can be seen, and then performing ultrasonic scanning on the joint surfaces 5 close to the lower surface and the upper surface through the corresponding first probes 17a and the second probes 17b, while the object 1 to be detected is placed in the first placement area 73 so that the lower surface can be seen, and in the second placement area 73b so that the upper surface can be seen.

[0242] However, the ultrasonic scanning action through such an inverted module may cause various problems, such as the complexity of the structure and the complexity of the control action due to the use of the inverted module and the increase in the ultrasonic detection time.

[0243] To this end, the method adopted in the present invention is a method of performing ultrasonic scanning on the object 1 having multiple joint surfaces 5 at one time by using a probe group composed of multiple probes 11. Further, in the present invention, when the object 1 to be detected placed on multiple placement parts 71 of a specific placement area 73 has multiple joint surfaces, the corresponding probe group is composed of the same number of probes 11 as the multiple joint surfaces, and a method of simultaneously performing ultrasonic testing on all joint surfaces through a rapid focusing process.

[0244] Specifically, the plurality of probes 11 constituting the probe group of the present invention are: Fig.10 The ultrasonic detection is performed on the multiple joint surfaces of the object 1 to be detected formed by multiple layers 3 shown in the figure respectively. In order to focus on the joint surfaces corresponding to the probes 11 constituting the probe group, the ultrasonic detection device 100 of the present invention also includes a height adjustment unit 21 which calculates the height adjustment value of each probe 11 and provides it to the control module 50.

[0245] The focusing implementation process described below by the height adjustment unit 21 and the control module 50 is performed on all the probes 11 constituting each probe group corresponding to each placement area 73; further, each probe group consisting of a plurality of probes corresponding to the number of joint surfaces of the object to be detected 1 is performed separately. Therefore, the description of focusing is equivalent to the description of the probes 11 constituting a specific probe group, but the same applies to the focusing of other probe groups. While describing the focusing process of the probe below, the composition and operation of the detection module 10, the processing module 30 and the control module 50 constituting the present invention are also described.

[0246] The detection module 10 includes a plurality of probes 11 , which can be classified into a plurality of probe groups. The plurality of probes 11 constituting each probe group respectively correspond to a plurality of joint surfaces 5 of the object 1 formed by a plurality of layers 3 to perform ultrasonic scanning.

[0247] Further, the detection module 10 of the present invention is as follows Fig.17 As shown in the figure, there are first to Kth probes 11, which can be classified into multiple probe groups consisting of at least one probe, and the multiple probes 11 constituting each probe group correspond to the first to nth joint surfaces 5 of each object 1 in sequence to perform ultrasonic scanning.

[0248] In order to Fig.10The object to be detected 1 shown in a is equivalent to a DCB (Direct Copper Bonding) substrate and ultrasonic testing is performed. A specific probe group, such as the first probe group 17a, is used. Fig.11 As shown in the figure, there may be a first probe 11a for ultrasonic scanning corresponding to the first joint surface 5a and a second probe 11b for ultrasonic scanning corresponding to the second joint surface 5b. Further, in this state, the first probe group 17a is composed of two probes 11a and 11b, so that ultrasonic scanning can be performed on each joint surface 5a and 5b of the object 1 placed on each placement portion 71 arranged in a row and formed on the corresponding first placement area 73a.

[0249] In order to Fig.10 The ultrasonic detection is performed on the object 1 of the test which is equivalent to the AMB (Active Metal Brazing) substrate shown in b, and a specific probe group, such as the first probe group 17a, is used. Fig.12 As shown in the figure, there may be a first probe 11a for ultrasonic scanning corresponding to the first joint surface 5a, a second probe 11b for ultrasonic scanning corresponding to the second joint surface 5b, a third probe 11c for ultrasonic scanning corresponding to the third joint surface 5c, and a fourth probe 11d for ultrasonic scanning corresponding to the fourth joint surface 5d. Further, in this state, the first probe group 17a is composed of four probes 11a to 11d, so that ultrasonic scanning can be performed on each joint surface 5a to 5d of the object 1 placed on each placement portion 71 arranged in a row and formed on the corresponding first placement area 73a.

[0250] On the one hand, the ultrasonic detection device according to an embodiment of the present invention is that, preferably, the assembly fixture 13, the adjustment connection part 12, the moving assembly 15, the scanning control part 38, the control module 50, the height adjustment part 21, etc. can adjust or control each probe 11 constituting the probe group, and can adjust or control the probe group unit. Fig.11 and Fig.12 As shown, the same is applicable when the first to third height adjustment value calculation methods are executed. Matters that are repeated with the above contents will not be described again.

[0251] According to the ultrasonic detection device of the present invention described above, the detection table is composed of placement areas in which at least two or more placement parts are arranged in a row and are spaced apart from each other, and multiple probes are classified into multiple probe groups consisting of at least one probe, and each probe group is arranged in the placement area one by one accordingly, so that ultrasonic scanning can be performed on multiple objects to be detected placed in the corresponding placement area. Therefore, its advantage is that ultrasonic detection can be performed on multiple objects to be detected placed on the detection table at the same time, thereby greatly saving the time, energy and cost required for ultrasonic detection of multiple objects to be detected, and further improving the efficiency of ultrasonic detection.

[0252] According to the present invention, a plurality of probes constituting a probe group respectively perform ultrasonic scanning corresponding to a plurality of joint surfaces of a test object formed by a plurality of layers. After the height of each probe constituting the probe group is adjusted and each joint surface corresponding to each probe is focused, ultrasonic detection can be performed on each joint surface at the same time. Therefore, the speed and precision of ultrasonic detection of a test object having a plurality of joint surfaces can be improved.

[0253] Fig.18 Schematic diagram for explaining the process of the region division unit and the region determination unit of the ultrasonic detection device according to the embodiment of the present invention. Fig.18 The ultrasonic detection device according to the embodiment of the present invention includes a region segmentation unit 342 and a region determination unit 343 .

[0254] In order to distinguish the plane of the object to be detected, the probe can be divided into a first and a second probe 11b. As described above, the probe can be divided into a first probe 11a for calculating displacement information and a second probe 11b for ultrasonic detection of the detection surface, and based on the plane of the object to be detected, the area can be first divided by the action of the first probe 11a.

[0255] The first probe 11a uses the displacement information calculated by detecting the ultrasonic reflection signal. The displacement information is transmitted to the height adjustment unit 21 and can be processed by a method preset in the height adjustment unit 21 to calculate the thickness of the layer of the object.

[0256] The thickness information of the object is transmitted to the region segmentation unit 342, which is configured to model the layer morphology information of the object. The region segmentation unit 342 divides the entire plane area of ​​the object into first to mth regions by determining regions with the same layer morphology information. Fig.18The plane of the object to be detected is shown in the figure and divided into four regions, but by comparing and judging the layer morphology information, it can be confirmed that the first region is repeated. Further, the region division unit 342 calculates the thickness of the layer of the object to be detected by the height adjustment unit 21 based on the displacement information calculated using the ultrasonic reflection signal detected by the first probe 11a, thereby calculating the layer morphology information, and calculates the region with the same layer morphology information on the plane of the object to be detected, thereby dividing the region of the object to be detected into the first to mth regions.

[0257] The region judgment unit 343 judges whether to perform ultrasonic detection on the first to third regions divided by the region division unit 342 through the second probe. The region judgment unit 343 is divided into an "ultrasonic detection area" where ultrasonic detection is performed and an "ultrasonic omission area" where ultrasonic detection is omitted. The region judgment unit 343 can perform detection more quickly by setting the ultrasonic omission area and thereby omitting the ultrasonic scanning action of the second probe 11b. Further, the region judgment unit 343 judges in a predetermined manner whether to perform ultrasonic detection on the first to m-th regions divided by the region division unit 342 through the second probe 11b, thereby setting the ultrasonic detection area and the ultrasonic omission area.

[0258] As an example, after the ultrasonic detection of the first area by the second probe 11b is performed, when the detection information is transmitted to the area judgment unit 343 and is set as an ultrasonic omission area, the ultrasonic detection of the first area can be omitted. The area set as the ultrasonic omission area is preferably set as an area where the probability of failure is relatively low according to a pre-set condition, and the condition for setting it as the ultrasonic omission area can be set by a pre-learned machine learning model (not shown). In the case of rapid detection, the ultrasonic detection omission using this area judgment unit 343 may be very effective.

[0259] Furthermore, the kth region (where k is a natural number less than m) divided by the region dividing unit 342 may be a continuous region based on a plane. Furthermore, the region judging unit 343 determines that when the kth region is set as an ultrasonic wave omitting region, the ultrasonic wave detection by the second probe 11b may be omitted for a region having the same layer arrangement form as the kth region among the first to mth regions.

[0260] Fig.19 FIG. 1 is a schematic diagram for explaining the process of using the curvature information calculation unit of the ultrasonic inspection apparatus according to the embodiment of the present invention. Fig.19 The present invention includes a curvature information calculation unit 341, which calculates the curvature information of the corresponding interval using the displacement information obtained by the first probe 11a. The process of obtaining the displacement information by the first probe 11a is as described above, so it is omitted.

[0261] The curvature information calculation unit 341 calculates unit curvature information for a unit section preset on the detection surface. The area or length of the unit section may vary according to the designer's choice. Fig.19 The diagram shows the state divided into the first section S1 to the Nth section Sn, and the unit curvature information (R1 to Rn) of each section is calculated. This method is very useful for a relatively curved or bent subject compared to a flat subject.

[0262] The curvature information calculation unit 341 is configured to determine that the interval in which the unit curvature information changes sharply is a detection error or defect, and the first probe 11a can be reused for detection. The unit curvature information is configured to be compared with the cumulative curvature information. The cumulative curvature information includes the average value and standard deviation of the unit curvature information, based on which the curvature allowable range can be set.

[0263] Furthermore, the cumulative curvature information of the first to nth intervals is compared with the unit curvature information of the n+1th interval. When the unit curvature information of the n+1th interval exceeds a preset range (allowable curvature range) compared with the cumulative curvature information, the n+1th interval can be judged as an "abnormal interval".

[0264] In addition to the average value of the unit curvature information, the standard deviation is also used as a parameter. Then, the curvature allowable range is not a fixed range, but can be continuously changed during the ultrasonic testing process. Therefore, a more accurate and flexible range can be calculated.

[0265] Here, when the curvature information calculation unit 341 determines that the n+1th interval is an abnormal interval for the first time, it controls the first probe 11a to return to the starting point of the n+1th interval through the assembly fixture 13 for the second time, thereby recalculating the unit curvature information of the n+1th interval. With this series of processes, before performing ultrasonic testing through the second probe 11b, the abnormal interval can be determined in advance, so that ultrasonic testing can be performed more accurately.

[0266] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, a person skilled in the art can still modify or make equivalent substitutions for the technical solutions described in the aforementioned embodiments, and these modifications or substitutions do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions described in the embodiments of the present invention.

Claims

1. An ultrasonic detection device, characterized in that: As an ultrasonic detection device, it includes: a detection module, which includes multiple probes and performs ultrasonic scanning on a detected object; a processing module, which sends an ultrasonic generating signal to make the multiple probes generate ultrasonic signals, and generates a picture of the detection surface of the detected object based on the ultrasonic reflection signals detected by the probes; a control module, which controls the ultrasonic scanning action of the detection module and controls the signal processing of the processing module; the control module controls the focusing position of the probe by adjusting the distance between each of the multiple probes and the detected object.

2. The ultrasonic detection device according to claim 1, characterized in that: The multiple probes are divided into: a first probe, which performs ultrasonic scanning to calculate the displacement information of the detection surface of the detected object; a second probe, which performs ultrasonic scanning to ultrasonically detect the detection surface; the processing module includes: a displacement information calculation unit, which performs gate processing on the ultrasonic reflection signal detected by the second probe, and then outputs the displacement of the ultrasonic reflection signal of the detection surface, generates a picture of the detection surface based on the displacement, and calculates displacement information equivalent to the displacement value in the height direction for the reference position of the detection surface using the ultrasonic reflection signal detected by the first probe; based on the displacement information calculated by the displacement information calculation unit, controls the height of the second probe to change while performing ultrasonic scanning.

3. The ultrasonic detection device according to claim 2, characterized in that: The first and second probes are each combined to an assembly fixture, and are combined to the assembly fixture in a first direction arrangement form in which they are arranged in a row along a predetermined scanning line, or in a second direction arrangement form in which they are arranged separately along the arrangement directions of at least two or more scanning lines and ultrasonic scanning is performed on different scanning lines at the same time.

4. The ultrasonic detection device according to claim 3, characterized in that: When the first and second probes are arranged in the first direction, the processing module performs ultrasonic scanning on the k+1th scanning line based on the displacement information calculated using the ultrasonic reflection signal detected by the first probe for the kth scanning line as the height of the second probe changes.

5. The ultrasonic detection device according to claim 4, characterized in that: When the processing module performs ultrasonic scanning on the k+1th scanning line as the height of the second probe changes, the processing module controls the first probe to perform ultrasonic scanning on the k+1th scanning line to calculate displacement information; the displacement information calculation unit calculates the displacement information of the k+1th scanning line using the ultrasonic reflection signal detected on the k+1th scanning line.

6. The ultrasonic detection device according to claim 3, characterized in that: When the first and second probes are arranged in the second direction, the processing module controls the kth scanning line based on the displacement information calculated based on the ultrasonic reflection signal detected by the first probe, and performs ultrasonic scanning on the kth scanning line as the height of the second probe changes.

7. The ultrasonic detection device according to claim 3, characterized in that: The assembly fixture is composed of moving in the first direction or the second direction; the processing module includes: a curvature information calculation unit, which calculates curvature information based on the displacement information obtained by the first probe when the assembly fixture moves; the curvature information calculation unit calculates unit curvature information in each unit interval pre-set on the detection surface, and compares the cumulative curvature information of the first to nth intervals with the unit curvature information of the n+1th interval. When the unit curvature information of the n+1th interval exceeds a pre-set range compared with the cumulative curvature information, the n+1th interval is judged to be an abnormal interval.

8. The ultrasonic detection device according to claim 7, characterized in that: When the curvature information calculation unit determines that the n+1th interval is an abnormal interval for the first time, the first probe is returned to the starting point of the n+1th interval by the assembly fixture for the second time, thereby recalculating the unit curvature information of the n+1th interval.

9. The ultrasonic detection device according to claim 7, characterized in that: The curvature information calculation unit calculates the cumulative curvature information using the average value of each unit curvature information in the first to nth intervals; the preset range is calculated based on the standard deviation of each unit curvature information in the first to nth intervals, and therefore becomes a variable range as the ultrasonic scanning proceeds.

10. The ultrasonic detection device according to claim 3, characterized in that: The processing module also includes: a scanning pattern setting unit, which manages the scanning pattern corresponding to the spacing information between multiple scanning points of each scanning line of the first and second probes; the scanning pattern setting unit arranges the multiple scanning points of each scanning line at the same interval or at different intervals.

11. The ultrasonic detection device according to claim 10, characterized in that: When the first and second probes are arranged in the first direction, the scanning points of the kth scanning line and the k+1th scanning line are separated from each other by the same interval, and the kth scanning line and the k+1th scanning line are formed in the same scanning pattern.

12. The ultrasonic detection device according to claim 10, characterized in that: When the first and second probes are arranged in the second direction, the scanning points of the kth scanning line and the k+1th scanning line are separated from each other by the same interval or by different intervals, and the kth scanning line and the k+1th scanning line are formed in the same scanning pattern.

13. The ultrasonic detection device according to claim 1, characterized in that: The processing module also includes a height adjustment unit, which calculates the height adjustment value for each probe and provides it to the control module to focus on the joint surfaces corresponding to each probe; the height adjustment unit uses the corresponding height information of each probe with the largest displacement of the ultrasonic reflection signal of each joint surface corresponding to each probe as the height adjustment value.

14. The ultrasonic detection device according to claim 13, characterized in that: The height adjustment unit calculates the thickness of each layer of the object to be detected by the time difference of the ultrasonic reflection signal of each joint surface, and then calculates the spacing distance between the specific joint surface and each other multiple joint surfaces, and then provides each calculated spacing distance as a height adjustment value for each other probe to the control module.

15. The ultrasonic detection device according to claim 13, characterized in that: The height adjustment unit calculates the height adjustment values ​​of each other probe corresponding to each other joint surface in sequence, from other joint surfaces that are close to the specific joint surface to other joint surfaces that are farther away, and provides them to the control module; the height adjustment value of the specific other probe is determined by calculating the spacing distance between the corresponding other specific joint surface and the previous joint surface corresponding to the previous probe for which the height adjustment value calculation was completed.

16. The ultrasonic detection device according to claim 15, characterized in that: The spacing distance is determined by calculating the layer thickness of the object to be detected between the other specific joint surface and the previous joint surface using the ultrasonic reflection signal of the previous probe after the height adjustment value calculation is completed.

17. The ultrasonic detection device according to claim 14, characterized in that: The multiple probes are divided into a first probe for performing ultrasonic scanning for calculating displacement information of the detection surface of the object to be detected and a second probe for performing ultrasonic scanning for ultrasonic detection of the detection surface; the processing module also includes a region segmentation unit, which calculates the layer thickness of the object to be detected through the height adjustment unit based on the displacement information calculated using the ultrasonic reflection signal detected by the first probe, and then calculates the layer morphology information, and calculates the area with the same layer morphology information for the plane of the object to be detected, thereby dividing the area of ​​the object to be detected into first to mth areas.

18. The ultrasonic detection device according to claim 17, characterized in that: The processing module further includes an area determination unit for determining whether to perform ultrasonic detection by the second probe in a predetermined manner for the first to m-th areas divided by the area division unit, thereby setting an ultrasonic detection area and an ultrasonic omission area.

19. The ultrasonic detection device according to claim 18, characterized in that: The kth region (here, k is a natural number less than m) divided by the region division unit is a continuous region based on a plane; when the kth region is set as an ultrasonic omission region, the region judgment unit omits ultrasonic detection by the second probe for the region in the first to mth regions having the same layer layout as the kth region.

20. The ultrasonic detection device according to claim 1, characterized in that: Also includes: A testing platform, which has multiple placement parts for placing each test object respectively; the testing platform includes multiple placement areas arranged separately from each other, and at least two placement parts in each placement area are arranged in a row; the multiple probes are classified into at least two probe groups, and each probe group is composed of at least one probe; each of the probe groups is arranged corresponding to the placement area and combined with an assembly fixture to perform ultrasonic scanning on multiple test objects placed in the corresponding placement area, and the individual probes constituting the probe group are connected to the assembly fixture by adjusting the connection part, so as to adjust the horizontal position of the probe.

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