Display device

By arranging a metal heat dissipation board on the back surface or side surface of the display panel and forming a grounding path with the printed circuit board, the damage problem of electrostatic or electromagnetic waves to the printed circuit board is solved, and a more stable and reliable display device is achieved, while improving the heat dissipation performance.

CN119644627APending Publication Date: 2025-03-18LG DISPLAY CO LTD
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Patent Information

Application Number
CN202411869810.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2019-12-26
Filing Date
2020-12-18
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

Existing display devices are difficult to prevent damage to the printed circuit board on the back surface of the display panel.

Method used

A heat dissipation plate formed of metal is arranged on the rear surface or side surface of the display panel, and a printed circuit board is arranged on the rear surface thereof. The rear surface of the heat dissipation plate is conductively connected to the ground terminal of the printed circuit board through a conductive tape to form a grounding path.

Benefits of technology

Effectively prevent static electricity or electromagnetic waves from causing damage to the printed circuit board, improve the stability and reliability of the display device, and improve the heat dissipation performance.

✦ Generated by Eureka AI based on patent content.

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Abstract

Disclosed is a display device including: a display panel; a heat dissipation plate formed of a metal and disposed on a rear surface or a side surface of the display panel; a printed circuit board disposed on a rear surface of the heat dissipation plate and connected to the display panel; and the conductive band covers the heat dissipation plate and the printed circuit board, and the conductive band is used for conductively connecting the rear surface of the heat dissipation plate with a grounding terminal of the printed circuit board.
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Description

[0001] This application is a divisional application of the invention patent application with application date of December 18, 2020, application number 202011505138.9, and invention name “Display Device”.

[0002] This application claims the benefit of Korean Patent Application No. 10-2019-0175414, filed on December 26, 2019, which is hereby incorporated by reference into this application as if fully described in this application. Technical Field

[0003] The present invention relates to a display device, and more particularly, to a display device that can prevent a printed circuit board disposed on a rear surface of a display panel from being damaged due to static electricity or electromagnetic waves. Background Art

[0004] Image displays for displaying various information through a screen are core technologies in the information and communication age, and are being developed toward thinness, light weight, and high performance. Accordingly, as flat panel displays with reduced weight and volume, thus overcoming the shortcomings of cathode ray tubes (CRTs), liquid crystal displays that realize images by receiving light from a light source, electroluminescent displays that emit light internally without any light source unit, and the like have become highlights.

[0005] In these displays, a plurality of pixels are arranged in a matrix, thereby displaying an image. Here, each pixel includes a light emitting diode and a pixel driving circuit including a plurality of transistors for independently driving the light emitting diode.

[0006] Recently, light and thin display panels are being actively studied, and display devices whose display panels can be bent into a curved surface or can be folded and unfolded are being provided.

[0007] However, as display devices are developed to meet miniaturization and thin thickness, it is difficult to prevent static electricity or electromagnetic waves from being generated from a display panel or a circuit board, or to ground the display panel or the circuit board. Summary of the invention

[0008] Accordingly, the present invention is directed to a display device that substantially obviates one or more problems due to limitations and disadvantages of the related art.

[0009] An object of the present invention is to provide a display device which can use a heat radiation plate formed of metal and arranged on a rear surface or a side surface of a display panel as a ground path of a printed circuit board.

[0010] Some of the additional advantages, purposes and features of the present invention will be described in the following description, and some will become obvious to those skilled in the art after reviewing the following or can be learned from the practice of the present invention. The purposes and other advantages of the present invention can be realized and obtained through the structures specifically pointed out in the written description and claims and the drawings.

[0011] To achieve these objects and other advantages and in accordance with the intent of the present invention, as embodied and broadly described herein, a display device includes: a display panel; a heat sink formed of metal and arranged on a rear surface or a side surface of the display panel; a printed circuit board arranged on a rear surface of the heat sink and connected to the display panel; and a conductive tape covering the heat sink and the printed circuit board, wherein the conductive tape conductively connects the rear surface of the heat sink to a ground terminal of the printed circuit board.

[0012] The heat sink plate may include a black coating covering at least a rear surface thereof, and the conductive tape may be attached to at least one first opening formed through the black coating to expose at least a portion of the heat sink plate.

[0013] The display device may further include a guide panel interposed between the heat dissipation plate and the conductive tape.

[0014] The guide panel may include a substrate recess formed to expose a printed circuit board inserted into the substrate recess, and a cutout region formed adjacent to the substrate recess to expose the at least one first opening.

[0015] The display device may further include a middle frame disposed on a rear surface of the guide panel.

[0016] The guide panel may include at least one second opening formed through the black coating layer to expose the heat dissipation plate.

[0017] The middle frame may include a ground member to pass through the second opening and then protrude and contact the second opening.

[0018] In another aspect of the present invention, a display device includes: a display panel; a heat sink formed of metal and arranged on a rear surface or a side surface of the display panel; a printed circuit board arranged on the rear surface of the heat sink and connected to the display panel; a first opening formed by removing a predetermined area of ​​a black coating formed on the rear surface of the heat sink; and a connector conductively connected to a ground terminal of the printed circuit board formed through the first opening and the rear surface of the heat sink.

[0019] It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are included to provide a further understanding of the present invention, and are incorporated in and constitute a part of this application; the accompanying drawings illustrate embodiments of the present invention and together with the description are used to explain the principles of the present invention. In the drawings:

[0021] Figure 1 is a rear view of a display device according to an embodiment of the present invention;

[0022] Figure 2 yes Figure 1 An exploded perspective view of the display device shown;

[0023] Figure 3 It is along Figure 1 A cross-sectional view of the display device taken along line AA' shown;

[0024] Figure 4 is a cross-sectional view of a display device according to another embodiment of the present invention. DETAILED DESCRIPTION

[0025] In the accompanying drawings, the same or similar elements are referred to by the same reference numerals even if they are depicted in different drawings. In the following description of the present invention, if a detailed description of a known function or configuration involved herein may make the subject matter of the present invention unclear, the detailed description will be omitted. In addition, those skilled in the art will recognize that for ease of description, some features shown in the accompanying drawings may be enlarged, reduced or simplified, and the accompanying drawings and the elements shown in the accompanying drawings are not necessarily shown in actual proportion.

[0026] In the present invention, a "display device" in a narrow sense may include display devices each having a display panel and a driving unit for driving the display panel, such as a liquid crystal module (LCM) and an organic light emitting diode (OLED) display module. In addition, a "display device" may include a complete product (i.e., a finished product) having an LCM, an OLED display module, etc., such as a notebook computer, a TV, a computer monitor and a car monitor, other instrument display devices for a vehicle, and a set of electronic devices or set devices (i.e., set equipment) such as a mobile electronic device (i.e., a smart phone) or an electronic tablet.

[0027] Figure 1 FIG. 1 is a rear view of a display device according to an embodiment of the present invention. Figure 2 yes Figure 1 An exploded perspective view of the display device shown

[0028] Reference Figure 1 and 2 , the display device 100 according to this embodiment of the present invention may include: a display panel 110 ; a heat dissipation plate 120 ; a printed circuit board 130 ; a conductive tape 140 and a guide panel 150 .

[0029] First, as the display panel 110, all types of display panels may be used, such as a liquid crystal display panel, an electroluminescent display panel, etc. For example, as the electroluminescent display panel, an organic light emitting diode (OLED) display panel, a quantum dot light emitting diode (QLED) display panel, or an inorganic light emitting diode display panel may be used.

[0030] For example, when a liquid crystal display panel is used as the display panel 110, the display panel 110 includes a plurality of gate lines, a plurality of data lines, and a plurality of pixels formed at intersections between the gate lines and the data lines. In addition, the display panel 110 may include: an array substrate having thin film transistors as switching elements for adjusting light transmittance in pixels respectively; an upper substrate having a color filter and / or a black matrix; and a liquid crystal layer formed between the array substrate and the upper substrate.

[0031] Alternatively, when an OLED display panel is used as the display panel 110, the display panel 110 includes: a plurality of gate lines; a plurality of data lines; and a plurality of pixels formed at intersections between the gate lines and the data lines. In addition, the display panel 110 may include: an array substrate having a thin film transistor as an element for selectively applying a voltage to each pixel; an organic light emitting diode (OLED) layer formed on the array substrate; and an encapsulation substrate arranged on the array substrate to cover the OLED layer. The encapsulation substrate may protect the thin film transistor and the OLED layer from external impact and prevent moisture or oxygen from penetrating the OLED layer.

[0032] The layer formed on the array substrate may include an inorganic light emitting layer, such as a nano-scale material layer or quantum dots.

[0033] In addition, a pad portion (not shown) may be provided at one side of the edge of the array substrate, the pad portion being connected to each signal line located in the pixel array, and the pad portion being connected to a circuit board for driving the display panel 110. Although not shown in the drawings, a separate back plate may be attached to the rear surface of the array substrate.

[0034] The display panel 110 may include a touch panel disposed on an array substrate. Here, the touch panel and a polarizing film may be further disposed on an upper surface of the array substrate. The polarizing film may prevent reflection of light incident from the outside, thereby providing a function of improving the visibility of the display panel 110. The touch panel may sense a user touch signal.

[0035] A light control film (LCF) may be provided on the touch panel. The LCF may adjust the angle of light emitted from the display panel 110, thereby preventing the viewing angle from increasing in an unnecessary direction. A cover window (not shown) may be provided at the outermost portion of the display panel 110. A cover glass formed of glass or a cover plastic formed of plastic may be used as the cover window.

[0036] Transparent adhesive layers may be disposed between the polarizing film and the touch panel, between the touch panel and the LCF, and between the LCF and the cover window. Pressure sensitive adhesives (PSAs) including optically clear adhesives (OCAs) or optically clear resins (OCRs) for UV curing may be applied to these adhesive layers.

[0037] Hereinafter, an electroluminescent display panel used as the display panel 110 will be exemplarily described. However, the present invention is not limited thereto. For example, among the electroluminescent display panels, a quantum dot light emitting diode (QLED) display panel, an organic light emitting diode (LED) display panel, or an inorganic light emitting diode display panel may be used as the display panel 110.

[0038] The heat dissipation plate 120 is bonded to the rear surface or the side surface of the display panel 110. Figure 2 As shown, the heat dissipation plate 120 is attached to cover almost the entire rear surface of the display panel 110. An adhesive layer is provided between the display panel 110 and the heat dissipation plate 120, and the display panel 110 and the heat dissipation plate 120 can be bonded by applying pressure using the adhesive layer while the display panel 110 and the heat dissipation plate 120 are fed between rotating rolls.

[0039] The heat sink 120 may have a shape corresponding to the shape of the display panel 110, and may be formed of aluminum or copper having excellent thermal conductivity. Naturally, the shape of the heat sink 120 and the material used for the heat sink 120 are not limited thereto. For example, the heat sink 120 may have a shape corresponding to the position or structure of the printed circuit board 130 (which is coupled to the display panel 110 or the rear surface of the heat sink 120). In addition, the heat sink 120 may be formed of at least one of other materials having excellent thermal conductivity, that is, at least one of gold, silver, magnesium, aluminum, carbon fiber, graphite, and graphene. Alternatively, the heat sink 120 may be formed of an alloy of these materials.

[0040] Black coating 121 (see Figure 3 ) is disposed on the surface of the heat dissipation plate 120. The black coating 121 may be provided to prevent the inherent metallic color of the heat dissipation plate 120 from affecting the appearance of the display device 100, and because the black coating 121 includes a material that assists heat dissipation, the black coating 121 may also be used to improve the heat dissipation effect.

[0041] The printed circuit board 130 may transmit a data signal and a driving control signal input from the outside to the display panel 110. A flexible printed circuit board (FPCB) 132 connecting the printed circuit board 130 to the display panel 110 may be disposed between the display panel 110 and the printed circuit board 130. The FPCB 132 may include a flexible printed circuit (FPC) or a film having wiring thereon, and may be bendable or foldable.

[0042] In this embodiment of the present invention, the printed circuit board 130 is arranged on the rear surface of the heat dissipation plate 120. Figure 1 As shown. Here, the FPCB 132 is bent into a roughly U-shape between the display panel 110 and the printed circuit board 130. The ground terminal 131 is provided at one side end or both side ends of the printed circuit board 130. The display panel 110 or the printed circuit board 130 may be damaged due to electromagnetic interference (EMI) or electrostatic discharge (ESD), thereby generating defects. Such defects may be generated by static electricity due to charges accumulated between the display panel 110 and the printed circuit board (including the driving element) 130 or between the display panel 110 and the system for holding the display panel 110, or by static electricity due to charges caused by a human body carrying unsafe static electricity, and the ground terminal 131 may provide a path for discharging such static electricity to the outside to ground the display panel 110.

[0043] The ground terminal 131 may be connected to the heat dissipation plate 120 formed of metal, thereby being able to form a ground path.

[0044] If the black coating layer 121 is not provided on the heat dissipation plate 120 , the ground terminal 131 may be directly conductively connected to the heat dissipation plate 120 to achieve grounding.

[0045] However, if the black coating layer 121 is provided on the heat dissipation plate 120, the first opening 122 may be formed by removing at least a portion of the black coating layer 121 located on the rear surface of the heat dissipation plate 120, thereby forming a ground path using the ground terminal 131, because the black coating layer 121 is formed of an insulating material. That is, the first opening 122 corresponds to a region where a portion of the black coating layer 121 is removed using a laser to expose at least a portion of the heat dissipation plate 120.

[0046] Here, the black coating layer 121 may be formed by applying a coating to the heat dissipation plate 120, then drying the coating, laminating a film on the heat dissipation plate 120, or coating the heat dissipation plate 120 with a resin. For example, during lamination or coating, vinyl chloride monomer (VCM) having excellent barrier properties, mechanical strength, thermal adhesion, gloss, etc. may be used. Naturally, polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), polyester (PET), polyamide (PA), polycarbonate (PC), etc. may be used.

[0047] Figure 3 It is along Figure 1 A cross-sectional view of the display device taken along line AA' is shown.

[0048] The heat dissipation plate 120 is disposed on the rear surface of the display panel 110 , the black coating layer 121 is provided on the rear surface of the heat dissipation plate 120 , and the printed circuit board 130 is disposed on the rear surface of the black coating layer 121 .

[0049] The conductive tape 140 is attached to the first opening 122, which is formed by removing the black coating 121 adjacent to the ground terminal 131 formed on the printed circuit board 130, and the conductive tape 140 conductively connects the ground terminal 131 formed through the first opening 122 and the rear surface of the heat sink 120, thereby forming a ground path. Naturally, the ground path can be implemented in multiple areas. Although not shown in the figure, the conductive tape 140 contacts or is attached to multiple parts of the remaining area other than the ground terminal 131 and the first opening 122. It can be formed by an insulating material. The conductive tape 140 can also be one of the connectors that conductively connect the ground terminal 131 to the heat sink 120. Thus, the conductive tape 140 can be an example of one of various connectors.

[0050] In addition, a guide panel 150 is provided on the rear surface of the heat dissipation plate 120. The guide panel 150 may be a component that mechanically couples the display panel 110 to a system for holding the display panel 110 (eg, a display, a navigation system, a vehicle dashboard, etc.). Figure 2 and 3, the guide panel 150 includes a substrate recess 151 in which the printed circuit board 130 is inserted, and a notch region 152 formed adjacent to the substrate recess 151 to expose the first opening 122 .

[0051] The substrate recess 151 may have a structure for supporting the printed circuit board 130 on the guide panel 150 or a structure for passing the printed circuit board 130 therethrough to be attached to the rear surface of the heat dissipation plate 120. Figure 2 As shown, the substrate recess 151 may have an opening structure through which the printed circuit board 130 passes. Although not shown in the figure, a diaphragm or a partition may be provided inside the substrate recess 151 so that the printed circuit board 130 is arranged on the heat dissipation plate 120 while being separated from the heat dissipation plate 120.

[0052] Figure 4 Components in this embodiment that are substantially the same as those in the previous embodiment are denoted by the same reference numerals even though they are depicted in different drawings.

[0053] Reference Figure 4 , the display device 100 according to this embodiment of the present invention includes a display panel 110 , a heat dissipation plate 120 , a printed circuit board 130 , a conductive tape 140 , a guide panel 150 , and a middle frame 160 .

[0054] A black coating 121 is disposed on the outer surface of the heat sink 120 , and a conductive tape (or adhesive tape) 140 may be attached to the ground terminal 131 of the printed circuit board 130 and the first opening 122 in the heat sink 120 to form a ground path.

[0055] The grounding member 161 is separately provided on the middle frame 160, and the grounding member 161 passes through the second opening 123 formed in the guide panel 150 and then protrudes, and the grounding member 161 contacts the second opening 123, thereby forming another grounding path. At least one second opening 123 may be formed through the black coating 121 to expose the heat dissipation plate 120. Here, the grounding member 161 may be formed of metal and may be connected to another element formed of metal, or the middle frame 160 may be formed of metal. An opening 123 corresponding to the second opening 123 in the guide panel 150 is formed in the heat dissipation plate 120.

[0056] These ground paths may include: a first ground path formed by conductively connecting the first opening 122 and the ground terminal 131 using the conductive tape 140; and a second ground path formed by contact between the second opening 123 and the ground member 161, and these ground paths may be selectively adopted according to the purpose or coupling structure of the display panel 110. Naturally, as Figure 4 As shown, both a first ground path and a second ground path may be employed.

[0057] exist Figure 4 In the embodiment, the middle frame 160 may be a mechanical element for holding one of the equipment display device, electronic device and unit device of the display panel 110, as described above. Therefore, the middle frame 160 may be replaced with a bottom cover or a bottom case.

[0058] In the display device 100 according to the present invention, the heat dissipation plate 120 can improve the heat dissipation performance of the display device 100, and a portion of the black coating 121 of the heat dissipation plate 120 can be removed to serve as a grounding path of the printed circuit board 130, and the heat dissipation plate 120 can be formed wider to be arranged throughout the entire rear surface of the display panel 110, thereby selectively providing various grounding paths.

[0059] It can be clearly seen from the above description that the display device according to the present invention has the following effects:

[0060] First, the heat dissipation plate can improve the heat dissipation performance of the display device, and at the same time, a portion of the black coating of the heat dissipation plate can be removed to be used as a ground path of the printed circuit board.

[0061] Second, the heat dissipation plate may be formed wider to be arranged over the entire rear surface of the display panel, thereby being able to selectively provide various ground paths.

[0062] It will be clear to those skilled in the art that various modifications and changes can be made in the present invention without departing from the spirit or scope of the present invention. Therefore, the present invention is intended to cover all modifications and changes to the present invention within the scope of the appended claims and their equivalents.

Claims

1. A display device, comprising: Display panel; a heat dissipation plate, the heat dissipation plate being arranged on a rear surface of the display panel; A black coating, wherein the black coating is located on the heat dissipation plate; a printed circuit board arranged on a rear surface of the heat sink and connected to the display panel; as well as a guide panel arranged on the rear surface of the heat dissipation plate, wherein the heat dissipation plate is arranged on the entire rear surface of the display panel, wherein the heat sink is conductively connected to a ground terminal of the printed circuit board, and The black coating is made of insulating material.

2. The display device according to claim 1, further comprising: A conductive tape conductively connects the heat sink to the ground terminal of the printed circuit board.

3. The display device according to claim 2, wherein the black coating layer comprises at least one first opening, the at least one first opening exposing the heat dissipation plate, and The conductive tape connects the heat sink to the ground terminal of the printed circuit board through the at least one first opening. 4 . The display device according to claim 1 , wherein the ground terminal is conductively and directly connected to the heat dissipation plate to form a ground path.

5. The display device according to claim 3, wherein the guide panel comprises: a substrate recess that exposes the printed circuit board inserted into the substrate recess; as well as A cutout region is disposed adjacent to the substrate recess and exposes the at least one first opening. The display device according to claim 1 , wherein the heat dissipation plate is formed of a metal having thermal conductivity.

7. The display device according to claim 1, further comprising: The middle frame includes a grounding member conductively connected to the heat dissipation plate.

8. A display device, comprising: Display panel; a heat sink disposed on a rear surface of the display panel, and a printed circuit board mounted on a guide panel; A black coating, wherein the black coating is located on the heat dissipation plate; a printed circuit board arranged on a rear surface of the heat sink and connected to the display panel; a guide panel arranged on the rear surface of the heat dissipation plate; as well as a middle frame, the middle frame comprising a grounding member, the grounding member being conductively connected to the heat dissipation plate through at least one second opening, The black coating is made of insulating material. 9 . The display device of claim 8 , wherein the guide panel comprises the at least one second opening, the at least one second opening exposing the heat dissipation plate.

10. The display device according to claim 9, further comprising: A black coating, the black coating being located on the heat sink, The at least one second opening is formed through the black coating layer to expose the heat dissipation plate. 11 . The display device according to claim 8 , wherein the heat dissipation plate is conductively connected to a ground terminal of the printed circuit board.

12. The display device according to claim 11, further comprising: A conductive tape conductively connects the heat sink to the ground terminal of the printed circuit board.