Heat dissipation control method, device, equipment and medium

Abstract

The embodiment of the invention provides a heat dissipation control method, and the method comprises the steps: collecting the internal temperature data and environment temperature data of target equipment, and obtaining the air inlet temperature change rate and / or predicted air inlet temperature of the target equipment according to the collected internal temperature data and environment temperature data; a target hysteresis temperature is calculated according to the air inlet temperature change rate and / or the predicted air inlet temperature, and the hysteresis temperature of the target equipment is adjusted to be the target hysteresis temperature; and determining a heat dissipation mode according to the target hysteresis temperature, and adjusting the fan speed of the target equipment according to the heat dissipation mode when the air inlet temperature of the target equipment changes. According to the embodiment of the invention, the reciprocating oscillation and fluctuation of the rotating speed of the target equipment system fan and the power supply body fan caused by the temperature change of the air inlet are reduced, and the heat dissipation efficiency is improved while the heat dissipation energy consumption is reduced.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation control method, device, equipment and medium. Background Art

[0002] With the increasing progress and development of computer network technology, electronic devices such as switches, servers, and personal computers (Personal Computers) are the core devices of data center communication networks. Their overall performance and reliability directly affect the stability of the entire network system. These electronic devices continuously forward data and exchange traffic during actual operation, which will inevitably generate a large amount of heat. If the heat cannot be dissipated in a timely and effective manner, it will inevitably cause the equipment to overheat, thereby affecting its functional stability and even causing overheating damage. At present, commonly used heat dissipation methods include natural air cooling, forced air cooling, and liquid cooling. Among them, among the air-cooled heat dissipation methods, heat dissipation based on the switch air inlet temperature is a relatively mature, effective and widely used method. However, this method still has problems such as low heat dissipation efficiency, high energy consumption or high cost in actual engineering applications. Therefore, there is an urgent need for an efficient and economical heat dissipation method to solve this problem. Summary of the invention

[0003] In view of the above problems, the present invention proposes a heat dissipation control method, device, equipment and medium.

[0004] In a first aspect of the present invention, a heat dissipation control method is first provided, characterized in that the method comprises:

[0005] Collect internal temperature data and ambient temperature data of the target device;

[0006] Determine the air inlet temperature change rate and / or predict the air inlet temperature of the target device according to the internal temperature data and the ambient temperature data;

[0007] Calculating a target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature, and adjusting the hysteresis temperature of the target device to the target hysteresis temperature;

[0008] A heat dissipation mode is determined according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, a fan speed of the target device is adjusted according to the heat dissipation mode.

[0009] Optionally, determining the air inlet temperature change rate and / or predicting the air inlet temperature of the target device according to the internal temperature data and the ambient temperature data includes:

[0010] Obtaining air inlet temperature data of the target device according to an average value of the internal temperature and the ambient temperature;

[0011] According to the air inlet temperature data, the air inlet temperature of the target device is predicted by an autoregressive integral moving average model to obtain a predicted air inlet temperature.

[0012] Optionally, the determining the temperature change rate of the air inlet of the target device and / or predicting the air inlet temperature according to the internal temperature data and the ambient temperature data further includes:

[0013] The air inlet temperature change rate is obtained according to the predicted air inlet temperature and the current air inlet temperature of the target device.

[0014] Optionally, calculating the target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature includes:

[0015] If the absolute value of the air inlet temperature change rate is greater than the absolute value of the preset temperature change rate standard value, calculating the first target hysteresis temperature according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value;

[0016] Wherein, the calculation formula of the first target hysteresis temperature is:

[0017] h new =h*(1+|r|-|r d |)

[0018] Among them, h new represents the adjusted hysteresis temperature, h represents the current hysteresis temperature, r represents the temperature change rate, r d Indicates the standard value of temperature change rate;

[0019] If the absolute value of the air inlet temperature change rate is less than the product of the absolute value of the temperature change rate standard value and the preset change rate percentage, the second target hysteresis temperature is calculated according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value;

[0020] Wherein, the calculation formula of the second target hysteresis temperature is:

[0021] h new =h*(1-|r|+|r d |).

[0022] Optionally, the calculating the target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature further includes:

[0023] If the predicted air inlet temperature is greater than the standard value of the air inlet temperature, calculating a third target hysteresis temperature according to the predicted air inlet temperature and the standard value of the air inlet temperature; the standard value of the air inlet temperature is set according to the model of the target device;

[0024] Wherein, the calculation formula of the third target hysteresis temperature is:

[0025]

[0026] Among them, T f represents the predicted air inlet temperature, T d Indicates the standard value of air inlet temperature;

[0027] If the predicted air inlet temperature is less than the product of the air inlet temperature standard value and the preset air inlet temperature percentage, calculating a fourth target hysteresis temperature according to the predicted air inlet temperature and the air inlet temperature standard value;

[0028] Wherein, the calculation formula of the fourth target hysteresis temperature is:

[0029]

[0030] Optionally, the method further comprises:

[0031] If the output power of the target device is greater than the target device output power standard value, calculating the value of the fifth target hysteresis temperature according to the output power of the target device and the target device output power standard value; the target device output power standard value is set according to the model of the target device;

[0032] Wherein, the calculation formula of the fifth target hysteresis temperature is:

[0033]

[0034] Where P represents the output power of the target device, P d Indicates the standard value of the target device output power;

[0035] If the output power of the target device is less than the product of the target device output power standard value and the preset target device output power percentage, calculating a sixth target hysteresis temperature according to the output power of the target device and the target device output power standard value;

[0036] Wherein, the calculation formula of the sixth target hysteresis temperature is:

[0037]

[0038] Optionally, determining a heat dissipation mode according to the target hysteresis temperature, and adjusting a fan speed of the target device according to the heat dissipation mode when an air inlet temperature of the target device changes, includes:

[0039] Get the difference between the predicted air inlet temperature and the current air inlet temperature;

[0040] If the difference is greater than the target hysteresis temperature, obtaining a fan speed duty cycle of the target device based on the predicted air inlet temperature;

[0041] If the difference is less than or equal to the target hysteresis temperature, maintaining the fan speed duty cycle of the target device;

[0042] The fan speed duty cycle is set to the fan of the target device to adjust the fan speed of the target device.

[0043] In a second aspect of the present invention, a heat dissipation control device is provided, wherein the device comprises:

[0044] A data acquisition module, used to collect internal temperature data and ambient temperature data of the target device;

[0045] A data processing module, used to determine the air inlet temperature change rate and / or predict the air inlet temperature of the target device according to the internal temperature data and the ambient temperature data;

[0046] a hysteresis temperature adjustment module, configured to calculate a target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature, and adjust the hysteresis temperature of the target device to the target hysteresis temperature;

[0047] The heat dissipation mode generating module is used to determine the heat dissipation mode according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, adjust the fan speed of the target device according to the heat dissipation mode.

[0048] In the third aspect of the implementation of the present invention, there is also provided an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, a heat dissipation control method as described above is implemented.

[0049] In a fourth aspect of the implementation of the present invention, a computer-readable storage medium is further provided, on which a computer program is stored. When the computer program is executed by a processor, the heat dissipation control method as described above is implemented.

[0050] The embodiments of the present invention have the following advantages:

[0051] In the embodiment of the present invention, the internal temperature data and the ambient temperature data of the target device are collected; the air inlet temperature change rate and / or the predicted air inlet temperature of the target device are determined according to the internal temperature data and the ambient temperature data; the target hysteresis temperature of the target device is calculated according to the air inlet temperature change rate and / or the predicted air inlet temperature, and the hysteresis temperature of the target device is adjusted to the target hysteresis temperature; the heat dissipation mode is determined according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, the fan speed of the target device is adjusted according to the heat dissipation mode. The reciprocating oscillation and fluctuation of the speed of the target device system fan and the power supply body fan caused by the change of the air inlet temperature are greatly reduced, the service life of the fan of the target device is extended, and the heat dissipation efficiency is improved while reducing the heat dissipation energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.

[0053] Figure 1 is a flow chart of steps of a heat dissipation control method provided by one embodiment of the present invention;

[0054] Figure 2 is a schematic diagram of processing air inlet temperature provided by an embodiment of the present invention;

[0055] Figure 3 It is a principle block diagram of a heat dissipation control method provided by an embodiment of the present invention;

[0056] Figure 4 is a flowchart of steps for processing air inlet temperature data provided by one embodiment of the present invention;

[0057] Figure 5 This is a flowchart of steps for collecting air inlet temperature data provided by an embodiment of the present invention;

[0058] Figure 6 It is a flowchart of the steps of establishing an autoregressive integrated moving average model provided by one embodiment of the present invention;

[0059] Figure 7 is a flow chart of steps for dynamically adjusting hysteresis temperature provided by one embodiment of the present invention;

[0060] Figure 8 It is a structural block diagram of a heat dissipation control device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0061] To make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, it will be appreciated by those skilled in the art that in the embodiments of the present invention, many technical details are proposed in order to enable the reader to better understand the present application. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present application can be implemented. The division of the following embodiments is for the convenience of description, and should not constitute any limitation on the specific implementation of the present invention. The various embodiments can be combined and referenced with each other without contradiction.

[0062] In the first existing technical solution, the heat dissipation method based on the air inlet temperature handles the air inlet temperature in actual application: when the air inlet temperature rises, a heat dissipation strategy is generated to increase the speed of the switch system fan and the power supply body fan; when the air inlet temperature drops, a heat dissipation strategy is generated to reduce the speed of the switch system fan and the power supply body fan. A more reasonable fan speed is calculated based on the air inlet temperature combined with a linear calculation formula.

[0063] Although the existing technical solution 1 can respond to changes in the external ambient temperature or the switch air inlet temperature in a timely and rapid manner, it has an obvious disadvantage: when the external ambient temperature or the switch air inlet temperature jitters or fluctuates up and down in a short period of time, it will cause the speed of the switch system fan and the power supply body fan to rise and fall sharply and reciprocate, thereby affecting the stability of the cooling system. At the same time, frequent speed adjustment of the system fan and the power supply body fan in a short period of time will also accelerate the aging of the electronic components inside the fan, affecting the service life of the cooling components.

[0064] The existing technical solution 2 is further optimized on the basis of technical solution 1. Figure 2 As shown: when the air inlet temperature or the external ambient temperature rises, a cooling strategy is generated to increase the speed of the switch system fan and the power supply body fan. However, when the switch air inlet temperature or the external ambient temperature drops, a new cooling strategy is not immediately generated to reduce the speed of the switch system fan and the power supply body fan. Instead, a fixed hysteresis temperature (for example, 2 degrees Celsius, 4 degrees Celsius, etc.) is pre-set. When the switch temperature continues to drop and the drop exceeds the preset hysteresis temperature, a new cooling strategy is generated to reduce the speed of the switch system fan and the power supply body fan.

[0065] The second technical solution of the prior art avoids the reciprocating oscillation and fluctuation of the fan speed caused by the drastic changes in the fan speed when the air inlet temperature or the external ambient temperature frequently rises and falls to a certain extent, and improves the heat dissipation efficiency to a certain extent. However, the second technical solution has an obvious disadvantage: when the air inlet temperature or the ambient temperature of the switch changes too little or changes too much, since its pre-set hysteresis temperature is a fixed value, it cannot change according to the dynamic changes of the air inlet temperature or the external ambient temperature. In some scenarios, it may lead to low heat dissipation efficiency or increased heat dissipation energy consumption.

[0066] In response to the fan speed oscillation and energy consumption problems in the heat dissipation method based on the switch air inlet temperature, the present application proposes a heat dissipation control method, that is, when the switch air inlet temperature or the external ambient temperature fluctuates, the heat dissipation strategy is optimized by dynamically adjusting the hysteresis temperature, thereby achieving a dynamic balance between the heat dissipation efficiency and energy consumption of the switch. However, the present application is not limited to switches, but can also be applied to heat dissipation fields such as servers and personal PCs.

[0067] Reference Figure 1 , shows a flow chart of a heat dissipation control method provided by an embodiment of the present invention, which may specifically include the following steps:

[0068] Step 101, collecting internal temperature data and ambient temperature data of a target device.

[0069] The target device may include a switch, a server, a personal PC, etc. The embodiment of the present invention is described by taking a switch as an example.

[0070] Based on the internal air duct position, air duct wind direction, and air duct sensors distributed on the internal air duct of the switch, two temperature sensors are selected as internal temperature collection points of the switch air inlet, and at least one switch external temperature collection device is designed based on the position of the switch in the rack.

[0071] Specifically, in order to obtain a more accurate temperature of the switch air inlet, multiple switch external temperature collection devices are set based on the position of the switch in the rack and the shape of the switch to collect the external ambient temperature in real time. At the same time, two temperature sensors are selected in the internal air duct of the switch as the switch air inlet temperature collection points, one of which collects the temperature near the air inlet and the other collects the temperature near the air outlet. According to actual needs, the frequency of data collection is determined, such as collecting data once every 10 seconds. According to the collection frequency, the internal air inlet temperature data, internal air outlet temperature data and external ambient temperature data of the switch are collected in real time through two temperature sensors and multiple temperature collection devices.

[0072] Step 102: determining a temperature change rate of an air inlet of the target device and / or predicting an air inlet temperature according to the internal temperature data and the ambient temperature data.

[0073] Before determining the air inlet temperature change rate of the target device and predicting the air inlet temperature, the air inlet temperature data of the target device needs to be determined first.

[0074] Assume that the internal air duct temperature of the switch collected by the two temperature sensors is T M and T N , where T M Close to the air inlet, T N Close to the air outlet; because there are multiple external temperature collection devices according to the location of the switch cabinet and the shape of the switch, the external environment temperature T O It can be obtained by weighted average algorithm, specifically:

[0075]

[0076] Where n is the number of temperature collection devices outside the switch, T i Indicates the ambient temperature collected by multiple switch external temperature collection devices, w i Indicates the weights corresponding to the ambient temperatures collected by multiple switch external temperature collection devices.

[0077] Specifically, the weights corresponding to the ambient temperatures respectively collected by the multiple temperature sensors are determined according to the location of the switch.

[0078] The switch air inlet temperature T is:

[0079]

[0080] Among them, T M is the internal air inlet temperature actually collected by the temperature sensor near the air inlet inside the switch, T N Δt is the internal air outlet temperature actually collected by the temperature sensor near the air outlet inside the switch. M is the compensation temperature of the temperature sensor near the air inlet inside the switch, Δt N It is the compensation temperature of the temperature sensor near the air outlet inside the switch, and it is the external ambient temperature collected in real time by the temperature collection device outside the switch. O is the external ambient temperature.

[0081] It should be noted that after the air outside the switch enters the switch through the air inlet, it is affected by the heat-generating components in the air duct (such as heat-generating power supplies, heat-generating optical modules, and some other heat-generating electronic components, etc.), and the actual temperature is higher than the external ambient temperature. Therefore, a compensation temperature is required to make it closer to the external ambient temperature.

[0082] Usually, the compensation temperature is determined based on the following two methods:

[0083] (1) Select a value based on actual engineering experience;

[0084] This method mainly relies on long-term engineering practice and experience accumulation. Through a large amount of experimental data and field tests, a typical value of the temperature difference between the inside and outside of the switch under a specific environment can be summarized.

[0085] (2) Divide the temperature into sections and calculate the temperature difference between the inside and outside of the switch as the compensation temperature.

[0086] The temperature range is divided into several segments (for example, 10-20°C, 20-30°C, 30-40°C, etc.). In each temperature segment, the temperature data inside and outside the switch is collected, and the average difference between the internal and external temperatures of the switch in each temperature segment is calculated. The statistical difference is used as the compensation temperature of the temperature segment.

[0087] After the air inlet temperature data of the switch is determined, the air inlet temperature can be predicted by using an autoregressive integrated moving average model (ARIMA).

[0088] Autoregressive Integrated Moving Average Model (ARIMA), where Autoregressive (AR) is the autoregressive part, which represents the relationship between the current value and the past value; Integrated (I) is the integral part, which represents the difference processing of the time series to make it stable; Moving Average (MA) is the moving average part, which represents the relationship between the current value and the past error term.

[0089] The main parameters in the ARIMA model include the autoregressive order p, the difference order d, and the moving average order q, which is usually expressed as ARIMA (p, d, q) and can be expressed by the following formula:

[0090]

[0091] Among them, T t is the switch air inlet temperature at time t, Tt-i is the temperature sequence value of the switch air inlet at the past i moments, θ j and are the sliding average coefficient and autoregressive coefficient of the ARIMA model, respectively. m and n are the orders of the autoregressive and sliding average parts, namely p and q; α t represents a residual sequence with mean zero.

[0092] like Figure 6 As shown, it is a flowchart of the steps of establishing an autoregressive integrated moving average model provided by one embodiment of the present invention, and the specific steps are as follows:

[0093] 1. Determine model parameters

[0094] According to the time series data, that is, the collected air inlet temperature data, the autocorrelation function (ACF) and partial autocorrelation function (PACF) graphs are plotted. By observing the ACF graph and the PACF graph, in the PACF graph, the position of the first significant non-zero lag is usually considered to be a reasonable estimate of the autoregressive order p; in the ACF graph, the position of the first significant non-zero lag is usually considered to be a reasonable estimate of the sliding average order q.

[0095] Perform a differential operation on the original time series, that is, the collected inlet temperature data, until the time series is stable, and record the number of differentials required to convert the time series data into a stable series, which is the value of the differential order d. Among them, a stable series refers to a series whose mean and variance do not change over time. ADF (Augmented Dickey-Fuller Test) or other stationarity test methods can be used to confirm whether the time series is stable.

[0096] Draw the ACF and PACF diagrams for the time series after differentiation to determine the autoregressive order p and the sliding average order q.

[0097] 2. Parameter selection

[0098] The Akaike information criterion (AIC) or the Bayesian Information Criterion (BIC) was used to select the optimal model parameters.

[0099] Both AIC and BIC are statistics used for model selection. Within the preliminarily determined range of p, q, and d, multiple ARIMA models are constructed, and the AIC value or BIC value is calculated for each constructed ARIMA model. The model with the smallest AIC value or BIC value is selected as the optimal model, that is, the optimal model parameters are determined.

[0100] 3. Build the model

[0101] The ARIMA model is established using the determined optimal model parameters p, q, and d.

[0102] 4. Model Fitting

[0103] The collected air inlet temperature data is used for model fitting, and the collected air inlet temperature data is substituted into the formula of the established ARIMA model.

[0104] At this point, the fitted ARIMA model can be used to predict the switch air inlet temperature.

[0105] Specifically, the ARIMA model is used to predict the temperature, and the predicted temperature is recorded as T f .

[0106] Furthermore, the difference between the predicted air inlet temperature and the current air inlet temperature is obtained by subtracting the current air inlet temperature from the air inlet temperature predicted by the model. The difference is divided by the current air inlet temperature and then multiplied by 100% to obtain the temperature change rate r, i.e. the temperature change rate at the next moment. Among them, if the temperature change rate is less than 0, it means that the air inlet temperature of the switch is on a downward trend.

[0107] The temperature predicted by the ARIMA model is denoted as T f , the current air inlet temperature is recorded as T t , then the temperature change rate r is:

[0108]

[0109] Among them, T f To predict the air inlet temperature, record T t is the current air inlet temperature, and r is the temperature change rate.

[0110] Step 103: Calculate a target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature, and adjust the hysteresis temperature of the target device to the target hysteresis temperature.

[0111] The hysteresis temperature can be understood as the amplitude of temperature change. For example, the hysteresis temperature is 2°C. When the temperature starts to drop from a high temperature (for example, 40°C), the temperature at time t1 is 39°C. At this time, 40°C-39°C<2°C, so there is no speed adjustment at time t1; the temperature at time t2 is 38°C. At this time, 40°C-38°C=2°C, so there is no speed adjustment at time t2; the temperature at time t3 is 37.5°C. At this time, 40°C-37.5°C>2°C, so speed adjustment starts at time t3.

[0112] By analogy, the next speed adjustment should be at the time when (37.5℃-a certain temperature value)>2℃.

[0113] Set the initial hysteresis temperature of the switch air inlet temperature.

[0114] 1. If the temperature change rate |r|>|r d |, then appropriately increase the hysteresis temperature to reduce unnecessary strategy adjustments, reduce the speed regulation oscillation cycle, and improve heat dissipation efficiency; if the temperature change rate |r|<|r d |*p r , the hysteresis temperature needs to be appropriately lowered to quickly respond to temperature changes; if the temperature change rate |r d |*p r ≤|r|≤|r d |, then the hysteresis temperature is not adjusted at this time, and the hysteresis temperature is maintained unchanged. d Indicates the standard value of temperature change rate, which can be set according to measured data and experience; p r It indicates the percentage of change rate. This value can be determined based on engineering experience or through a large amount of statistical analysis. There are differences between different machine models and different machine room environments.

[0115] 2. If the switch predicts the air inlet temperature T f >T d , then the hysteresis temperature should be appropriately increased to improve the heat dissipation efficiency; if the predicted air inlet temperature T f <T d *p T , then appropriately reduce the hysteresis temperature to reduce heat dissipation energy consumption; if the switch air inlet temperature T d *p T ≤T f ≤T d , at this time, the hysteresis temperature is not adjusted and the hysteresis temperature is kept unchanged. d Indicates the standard value of the switch air inlet temperature, which can be set according to different switch models; p T Indicates the percentage of air inlet temperature, which is determined in the same way as p r same.

[0116] 3. If the switch output power P>P d, then appropriately increase the hysteresis temperature to improve the heat dissipation efficiency; if the switch output power P <P d *P p , then appropriately reduce the hysteresis temperature to reduce energy consumption. If the switch output power P d *P p ≤P≤P d , at this time, the hysteresis temperature is not adjusted and the hysteresis temperature is kept unchanged. d Indicates the standard value of the switch output power, which can be set according to the switch model; P p Indicates a percentage, which is determined in the same way as p r same.

[0117] 4. If all the fans of the whole system are in place and working normally, the hysteresis temperature should be appropriately lowered to reduce the heat dissipation energy consumption; if the number of fans in the whole system is less than 50% or the number of faulty fans is less than 50%, the hysteresis temperature should be appropriately increased to improve the heat dissipation efficiency.

[0118] 5. If the CPU occupancy rate of the switch exceeds 70%, the hysteresis temperature should be appropriately increased to improve the heat dissipation efficiency; if the CPU occupancy rate of the switch is less than 40%, the hysteresis temperature should be appropriately reduced to reduce the heat dissipation energy consumption.

[0119] It should be noted that the switch output power, the fan status of the entire system, and the switch CPU occupancy rate can all be obtained through real-time monitoring. The switch output power is related to the power module, and the power information of the power module can be obtained using SNMP (Simple Network Management Protocol). The fan status information and CPU utilization data can also be obtained through SNMP, which is not limited in this application.

[0120] like Figure 7 FIG. 1 is a flowchart of a step of dynamically adjusting the hysteresis temperature provided by an embodiment of the present invention. In this embodiment, p r Take 50%, p T Take 90%, P p Take 80%, the specific process is as follows:

[0121] 1. Determine whether the temperature change rate is greater than the standard value. If so, increase the hysteresis temperature and end the process; if not, determine whether the temperature change rate is less than the standard value multiplied by 50%;

[0122] 2. If the temperature change rate is less than the standard value multiplied by 50%, the hysteresis temperature is reduced and the process ends; if not, it is determined whether the predicted air inlet temperature is greater than the standard value;

[0123] 3. If the predicted air inlet temperature is greater than the standard value, the hysteresis temperature is increased and the process ends; if not, it is determined whether the predicted air inlet temperature is less than the standard value multiplied by 90%;

[0124] 4. If the predicted air inlet temperature is less than the standard value multiplied by 90%, the hysteresis temperature is lowered and the process ends; if not, determine whether the switch output power is greater than the standard value;

[0125] 5. If the output power of the switch is greater than the standard value, the hysteresis temperature is increased and the process ends; if not, it is determined whether the output power of the switch is less than the standard value multiplied by 80%;

[0126] 6. If the output power of the switch is less than the standard value multiplied by 80%, the hysteresis temperature is reduced and the process ends; if not, determine whether all fans of the switch are normal;

[0127] 7. If all fans of the switch are normal, lower the hysteresis temperature and end the process; if not, determine whether the normal fan is less than 50%;

[0128] 8. If the normal fan is less than 50%, the hysteresis temperature is increased and the process ends; if not, determine whether the switch CPU occupancy is greater than 70%;

[0129] 9. If the CPU occupancy rate of the switch is greater than 70%, the hysteresis temperature is increased and the process ends; if not, determine whether the CPU occupancy rate of the switch is less than 40%;

[0130] 10. If the CPU usage of the switch is less than 40%, the hysteresis temperature is reduced; if not, the process ends.

[0131] Step 104: determine a heat dissipation mode according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, adjust the fan speed of the target device according to the heat dissipation mode.

[0132] The cooling strategy can be simply understood as the fan speed value and alarm information. The fan speed is the key factor in controlling the heat dissipation of the switch. By adjusting the fan speed, the temperature of the switch can be effectively controlled to prevent overheating. The alarm information can set the alarm threshold to promptly notify the administrator when the switch temperature is abnormal or the fan fails, so that appropriate measures can be taken.

[0133] The relationship between the fan's PWM value and temperature T can be expressed using a linear equation:

[0134] PWM=k*T+b

[0135] Among them, PWM is the fan speed duty cycle, that is, the fan speed, T is the air inlet temperature, and k and b are two constants.

[0136] At different temperatures T, the PWM value of the fan is recorded. At least two data points are needed to determine the two constants of the linear equation.

[0137] After determining the linear equation between the fan's PWM value and temperature T, calculate the difference between the predicted air inlet temperature and the current air inlet temperature, and then determine whether the difference is greater than the target hysteresis temperature. If so, substitute the predicted air inlet temperature into the linear equation to calculate a new PWM value; if the difference is less than or equal to the hysteresis temperature, maintain the original PWM value.

[0138] The fan speed value in the cooling strategy, that is, the PWM value, can be set to the fan of the switch through the driver software to adjust the fan speed.

[0139] The switch air inlet temperature is obtained by using the switch external temperature acquisition device and the switch internal temperature sensor, and the air inlet temperature and temperature change rate are predicted by the ARIMA model. In combination with the switch power, system fan working status, CPU occupancy and other working conditions, the switch air inlet hysteresis temperature is dynamically adjusted, and then the heat dissipation strategy is generated and issued to the switch system fan and the power supply body fan. This greatly reduces the reciprocating oscillation and fluctuation of the switch system fan and the power supply body fan speed caused by the reduction of the air inlet temperature, extends the service life of the switch fan, and improves the heat dissipation efficiency while reducing the heat dissipation energy consumption.

[0140] The present application can also be applied to heat dissipation fields such as servers and personal PCs. The air inlet temperature is collected by the air inlet duct temperature sensor, and the hysteresis temperature is dynamically adjusted according to the temperature change trend and the actual working status inside the server and personal PC, so that the fan speed is maintained at a relatively ideal speed, thereby achieving the goal of improving heat dissipation efficiency and reducing noise and heat dissipation energy consumption.

[0141] In addition to predicting the future air inlet temperature based on the collected air inlet temperature data, the deep learning model LSTM (Long-Short Term Memory) can also be used for prediction. The LSTM is trained using historical data, and the performance of the model is evaluated using a validation set to improve the accuracy of the prediction.

[0142] Furthermore, in some embodiments of the present invention, step 102 further includes the following steps:

[0143] S1021, obtaining air inlet temperature data of the target device according to an average value of the internal temperature and the ambient temperature.

[0144] Taking a switch as an example, based on the internal air duct position, air duct wind direction, and air duct sensor distribution on the air inlet duct inside the switch, a temperature sensor is selected as the internal temperature collection point of the switch air inlet.

[0145] Specifically, temperature sensors are usually selected in the following two locations:

[0146] 1. PDB_Temp (Power Distribution Board Temperature), usually located near the power distribution board (PDB), monitors the temperature near the power distribution board, and indirectly reflects the temperature of the air inlet. Since the power distribution board is usually close to the air inlet, its temperature can be used as a reference point for the air inlet temperature.

[0147] 2. Inlet_Temp (Inlet Temperature), located directly at the air inlet, is the most direct air inlet temperature collection point. This sensor can accurately obtain the air inlet temperature data.

[0148] Selecting PDB_Temp and Inlet_Temp as the internal temperature collection points of the air inlet not only takes into account the reliability of indirect reference, but also ensures the accuracy of direct measurement. This choice is widely used in engineering practice and can effectively monitor the air inlet temperature of the switch to ensure the stable operation of the system.

[0149] The data collection frequency is determined according to actual needs. In this embodiment, the internal air inlet temperature can be collected once every 10 seconds through the first temperature sensor, which is recorded as T M .

[0150] Then, based on the internal air duct position, air duct wind direction, and air duct sensor distribution of the switch, a temperature sensor is selected on the air outlet duct inside the switch as the internal temperature collection point of the switch outlet.

[0151] Similarly, the second temperature sensor is set to collect the internal air outlet temperature every 10 seconds, which is recorded as T N .

[0152] Next, at least one switch external temperature collection device is designed based on the position of the switch in the rack.

[0153] Specifically, in order to obtain a more accurate switch air inlet temperature, at least one temperature collection device is designed at the switch external air inlet position, that is, at a position outside the switch close to the switch air inlet, and the ambient temperature is also collected every 10 seconds.

[0154] Since there are multiple external temperature collection devices according to the location of the switch cabinet and the shape of the switch, the external environment temperature T O It can be obtained by weighted average algorithm:

[0155]

[0156] Where n is the number of temperature collection devices outside the switch, T i Indicates the ambient temperature collected by multiple switch external temperature collection devices, w i Indicates the weights corresponding to the ambient temperatures collected by the external temperature collection devices of multiple switches. Specifically, in this embodiment, n=10.

[0157] Furthermore, the internal air inlet temperature collected by the first temperature sensor is T M , the preset compensation temperature of the first temperature sensor is Δt M , then the first internal air inlet temperature is: T M +Δt M .

[0158] The internal air outlet temperature collected by the second temperature sensor is T N , the preset compensation temperature of the second temperature sensor is Δt N , then the second internal temperature is: T M +Δt N .

[0159] Then the air inlet temperature T of the switch is:

[0160]

[0161] Among them, T M is the internal air inlet temperature collected by the first temperature sensor, T N is the internal air outlet temperature collected by the second temperature sensor, Δt M is the preset compensation temperature of the first temperature sensor, Δt N is the preset compensation temperature of the second temperature sensor, T O is the external ambient temperature.

[0162] S1022: predicting the air inlet temperature of the target device according to the air inlet temperature data by using an autoregressive integral moving average model to obtain a predicted air inlet temperature.

[0163] Specifically, the obtained air inlet temperature data is stored in a database or file, and noise and abnormal values ​​in the stored air inlet temperature data are removed to ensure data quality. The data processing method can be selected according to actual needs, and this application does not limit it.

[0164] The ACF and PACF diagrams are drawn based on the processed time series data (inlet temperature data). By observing the ACF and PACF diagrams, in the PACF diagram, the position of the first significant non-zero lag is usually considered to be a reasonable estimate of the autoregressive order p; in the ACF diagram, the position of the first significant non-zero lag is usually considered to be a reasonable estimate of the sliding average order q.

[0165] Perform a differential operation on the original time series, that is, the collected air inlet temperature data, until the time series is stable, and record the number of differentials required to convert the time series data into a stable series, which is the value of the differential order d.

[0166] Draw the ACF and PACF diagrams for the time series after differentiation to determine the autoregressive order p and the sliding average order q.

[0167] Use AIC or BIC to select the optimal model parameters.

[0168] The ARIMA model is established based on the determined autoregressive order p, moving average order q and difference order d.

[0169] Then, the ARIMA model is used to predict the temperature, and the predicted air inlet temperature data is T f .

[0170] Furthermore, in some embodiments of the present invention, step 102 further includes the following steps:

[0171] S102-1, obtaining an air inlet temperature change rate according to the predicted air inlet temperature and the current air inlet temperature of the target device.

[0172] Specifically, the temperature predicted by the ARIMA model is denoted as T f , the current air inlet temperature is recorded as T t , then the temperature change rate r is:

[0173]

[0174] Among them, T f To predict the air inlet temperature, record T t is the current air inlet temperature, and r is the temperature change rate.

[0175] Furthermore, in some embodiments of the present invention, step 103 further includes the following steps:

[0176] S1031, if the absolute value of the air inlet temperature change rate is greater than the absolute value of a preset temperature change rate standard value, calculating a first target hysteresis temperature according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value;

[0177] Wherein, the calculation formula of the first target hysteresis temperature is:

[0178] h new =h*(1+|r|-|r d |)

[0179] Among them, h newrepresents the adjusted hysteresis temperature, h represents the current hysteresis temperature, r represents the temperature change rate, r d Indicates the standard value of temperature change rate.

[0180] Specifically, if the temperature change rate |r|>|r d |, at this time, the first target hysteresis temperature is calculated according to the absolute value of the temperature change rate and the absolute value of the preset temperature change rate standard value:

[0181] h new =h*(1+|r|-|r d |)

[0182] Among them, h new represents the adjusted hysteresis temperature, h represents the current hysteresis temperature, r represents the temperature change rate, r d Indicates the standard value of temperature change rate, which can be set based on measured data and experience.

[0183] The hysteresis temperature of the target device is adjusted to the first target hysteresis temperature, that is, the hysteresis temperature of the target device is increased, unnecessary strategy adjustments are reduced, the speed regulation oscillation period is reduced, and the heat dissipation efficiency is improved.

[0184] S1032, if the absolute value of the air inlet temperature change rate is less than the product of the absolute value of the temperature change rate standard value and the preset change rate percentage, calculate the second target hysteresis temperature according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value;

[0185] Wherein, the calculation formula of the second target hysteresis temperature is:

[0186] h new =h*(1-|r|+|r d |).

[0187] Specifically, if the temperature change rate |r|<|r d |*p r At this time, the second target hysteresis temperature is calculated according to the absolute value of the temperature change rate and the absolute value of the preset temperature change rate standard value:

[0188] h new =h*(1-|r|+|r d |)

[0189] Then, the hysteresis temperature of the target device is adjusted to the second target hysteresis temperature, that is, the hysteresis temperature is lowered, and the temperature change can be responded to quickly. r Indicates the percentage of change rate, which can be determined based on engineering experience or through a large amount of statistical analysis. There are differences between different models and different computer room environments. r50% is acceptable.

[0190] It should be noted that if the temperature change rate |r d |*p r ≤|r|≤|r d |, then the hysteresis temperature is not adjusted at this time and the hysteresis temperature is maintained unchanged.

[0191] Furthermore, in some embodiments of the present invention, step 103 further includes the following steps:

[0192] S103-1, if the predicted air inlet temperature is greater than the standard value of the air inlet temperature, calculating a third target hysteresis temperature according to the predicted air inlet temperature and the standard value of the air inlet temperature; the standard value of the air inlet temperature is set according to the model of the target device;

[0193] Wherein, the calculation formula of the third target hysteresis temperature is:

[0194]

[0195] Among them, T f represents the predicted air inlet temperature, T d Indicates the standard value of air inlet temperature.

[0196] Specifically, if the predicted air inlet temperature T f >T d , the third target hysteresis temperature is calculated based on the predicted air inlet temperature and the standard value of the air inlet temperature:

[0197]

[0198] Among them, T f represents the predicted air inlet temperature, T d Indicates the standard value of the air inlet temperature, which can be set according to the model of different target devices.

[0199] Then, the hysteresis temperature of the target device is adjusted to a third target hysteresis temperature, that is, the hysteresis temperature is increased, thereby improving the heat dissipation efficiency.

[0200] S103-2, if the predicted air inlet temperature is less than the product of the air inlet temperature standard value and the preset air inlet temperature percentage, calculating a fourth target hysteresis temperature according to the predicted air inlet temperature and the air inlet temperature standard value;

[0201] Wherein, the calculation formula of the fourth target hysteresis temperature is:

[0202]

[0203] Specifically, if the predicted air inlet temperature T f <T d*p T , the fourth target hysteresis temperature is calculated based on the predicted air inlet temperature and the standard value of the air inlet temperature:

[0204]

[0205] Then, the hysteresis temperature of the target device is adjusted to the fourth target hysteresis temperature, that is, the hysteresis temperature is lowered, thereby reducing the heat dissipation energy consumption. T Indicates the percentage of air inlet temperature, which is determined in the same way as p r In the embodiment of the present invention, p T 90% is acceptable.

[0206] It should be noted that if the switch air inlet temperature T d *p T ≤T f ≤T d At this time, the hysteresis temperature is not adjusted and is maintained unchanged.

[0207] Furthermore, in some embodiments of the present invention, the following steps are also included:

[0208] S1, if the output power of the target device is greater than the target device output power standard value, calculating the value of the fifth target hysteresis temperature according to the output power of the target device and the target device output power standard value; the target device output power standard value is set according to the model of the target device;

[0209] Wherein, the calculation formula of the fifth target hysteresis temperature is:

[0210]

[0211] Where P represents the output power of the target device, P d Indicates the target device output power standard value.

[0212] Specifically, taking a switch as an example, if the switch output power P>P d , the fifth target hysteresis temperature is calculated according to the output power of the switch and the standard value of the switch output power:

[0213]

[0214] Where P represents the output power of the switch, P d Indicates the standard value of the switch output power, which can be set according to the switch model.

[0215] Furthermore, the hysteresis temperature of the switch is adjusted to the fifth target hysteresis temperature, that is, the hysteresis temperature is increased, thereby improving the heat dissipation efficiency.

[0216] S2, if the output power of the target device is less than the product of the target device output power standard value and the preset target device output power percentage, calculating a sixth target hysteresis temperature according to the output power of the target device and the target device output power standard value;

[0217] Wherein, the calculation formula of the sixth target hysteresis temperature is:

[0218]

[0219] Specifically, if the switch output power P <P d *P p , the sixth target hysteresis temperature is calculated according to the output power of the switch and the standard value of the switch output power:

[0220]

[0221] Then, the hysteresis temperature of the switch is adjusted to the sixth target hysteresis temperature, that is, the hysteresis temperature is lowered, thereby reducing energy consumption. p Indicates a percentage, which is determined in the same way as p r In the embodiment of the present invention, it can be 80%.

[0222] It should be noted that if the switch output power P d *P p ≤P≤P d At this time, the hysteresis temperature is not adjusted and is maintained unchanged.

[0223] In the embodiment of the present invention, the hysteresis temperature may also be adjusted according to the working state of the fan of the target device and the occupancy rate of the central processing unit.

[0224] Specifically, taking a switch as an example, if all fans of the switch system are in place and working normally, the hysteresis temperature is appropriately lowered to reduce heat dissipation energy consumption.

[0225] If the number of fans in place in the whole system is less than 50% or the number of faulty fans is less than 50%, the hysteresis temperature is appropriately increased to improve the heat dissipation efficiency.

[0226] If the CPU usage of the switch exceeds 70%, increase the hysteresis temperature appropriately to improve the heat dissipation efficiency.

[0227] If the CPU usage of the switch is lower than 40%, the hysteresis temperature can be appropriately lowered to reduce heat dissipation energy consumption.

[0228] It should be noted that after the hysteresis temperature is increased, when the temperature drops, the fan speed is still maintained at a high level within the temperature drop range. At this time, the fan speed is fast, the heat is taken away more, and the heat dissipation efficiency must be very high. After the hysteresis temperature is lowered, the fan speed is reduced a little when the temperature drops a little, the fan speed becomes slower and slower, and the energy consumption is naturally lower.

[0229] Furthermore, in some embodiments of the present invention, step 104 further includes the following steps:

[0230] S1041, obtaining the difference between the predicted air inlet temperature and the current air inlet temperature.

[0231] Specifically, the predicted air inlet temperature T f Subtract the current air inlet temperature T t Get the difference.

[0232] S1042: If the difference is greater than the target hysteresis temperature, obtaining a fan speed duty cycle of the target device based on the predicted air inlet temperature.

[0233] Specifically, if the difference between the predicted air inlet temperature and the current air inlet temperature is greater than the target hysteresis temperature, the predicted air inlet temperature is substituted into the linear equation of the fan's PWM value and temperature T to calculate a new fan speed duty cycle, ie, a fan speed value.

[0234] Among them, the linear equation between the fan's PWM value and temperature T can be expressed as:

[0235] PWM=k*T+b

[0236] Among them, PWM is the fan speed duty cycle, that is, the fan speed, T is the air inlet temperature, and k and b are two constants.

[0237] By recording the PWM value of the fan at different temperatures, the two constants k and b of the linear equation are determined. At least two data points need to be collected to determine the two constants of the linear equation.

[0238] S1043: If the difference is less than or equal to the target hysteresis temperature, maintain the fan speed duty cycle of the target device.

[0239] Specifically, if the difference between the predicted air inlet temperature and the current air inlet temperature is less than the hysteresis temperature, the original PWM value is maintained.

[0240] S1044: Set the fan speed duty cycle of the switch to the fan of the target device to adjust the fan speed of the target device.

[0241] Specifically, the fan speed value in the latest heat dissipation strategy, that is, the PWM value, is set to the fan of the target device through the driver software to adjust the fan speed.

[0242] Through the above operations, combined with the target device load, system fan working status, CPU occupancy and other working conditions, the target device air inlet hysteresis temperature is dynamically adjusted, and then the cooling strategy is generated and issued to the target device system fan and power supply body fan, which greatly reduces the reciprocating oscillation and fluctuation of the target device system fan and power supply body fan speed caused by the reduction of the air inlet temperature, extends the service life of the target device fan, and improves the cooling efficiency while reducing the cooling energy consumption.

[0243] Further, in an embodiment of the present invention, if Figure 3 As shown, a principle block diagram of a heat dissipation control method is provided. Taking a switch as an example, the specific principle is as follows:

[0244] This application is mainly composed of five modules: temperature monitoring module, data processing module, dynamic adjustment module, strategy generation module, and strategy execution module.

[0245] The temperature monitoring module is mainly responsible for monitoring and collecting the internal air inlet temperature, internal air outlet temperature and external ambient temperature of the switch. At least one external temperature collection device of the switch can be designed according to the location of the switch, or the internal temperature sensor of the switch can be used as the temperature data collection point according to the wind direction of the internal air duct of the switch. That is, the temperature monitoring module can be implemented by an independent temperature collection device outside the switch, or it can be provided by the function of the switch itself.

[0246] The data processing module analyzes the collected temperature data in real time and calculates the temperature change rate of the air inlet, predicting the temperature change trend.

[0247] The dynamic adjustment module dynamically adjusts the hysteresis temperature according to the change rate and trend of the air inlet temperature and the actual operating status of the switch.

[0248] The strategy generation module calculates the target speed of the switch system fan and the power supply body fan according to the real-time value of the air inlet temperature and the hysteresis temperature combined with the speed regulation calculation method.

[0249] The policy execution module sends the latest cooling policy to the switch system fan and the power supply body fan, and finally completes the fan speed adjustment.

[0250] Further, in an embodiment of the present invention, if Figure 4 As shown, a flowchart of the steps for processing the air inlet temperature data is also provided, and the specific steps are as follows:

[0251] 1. Temperature data collection.

[0252] 2. Autoregressive integrated moving average model is used to build the model. The model parameters are determined according to the air inlet temperature data, and the ARIMA model is established according to the model parameters.

[0253] 3. Calculate the temperature change rate: the temperature change rate of the air inlet is calculated based on the difference between the predicted air inlet temperature and the current air inlet temperature and the percentage of the current air inlet temperature.

[0254] Further, in an embodiment of the present invention, if Figure 5 As shown, a flowchart of steps for collecting air inlet temperature data is also provided, and the specific steps are as follows:

[0255] 1. Set the sampling frequency. Determine the data collection frequency according to actual needs. In the embodiment of the present invention, it can be set to collect data once every 10 seconds.

[0256] 2. Select sensors. Select two temperature sensors in the air inlet duct inside the target device, and design at least one temperature collection device at the air inlet outside the target device.

[0257] 3. Data storage: store the collected data in a database or file for subsequent processing and analysis.

[0258] 4. Data cleaning: remove noise and outliers from stored data to ensure data quality. The data processing method can be selected according to actual needs.

[0259] In the embodiment of the present invention, the internal temperature data and the ambient temperature data of the target device are collected; the air inlet temperature change rate and / or the predicted air inlet temperature of the target device are determined according to the internal temperature data and the ambient temperature data; the target hysteresis temperature of the target device is calculated according to the air inlet temperature change rate and / or the predicted air inlet temperature, and the hysteresis temperature of the target device is adjusted to the target hysteresis temperature; the heat dissipation mode is determined according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, the fan speed of the target device is adjusted according to the heat dissipation mode. The reciprocating oscillation and fluctuation of the speed of the target device system fan and the power supply body fan caused by the change of the air inlet temperature are greatly reduced, the service life of the fan of the target device is extended, and the heat dissipation efficiency is improved while reducing the heat dissipation energy consumption.

[0260] It should be noted that, for the sake of simplicity, the method embodiments are described as a series of action combinations, but those skilled in the art should be aware that the embodiments of the present invention are not limited by the order of the actions described, because according to the embodiments of the present invention, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by the embodiments of the present invention.

[0261] Reference Figure 8 , shows a structural block diagram of a heat dissipation control device provided by an embodiment of the present invention, which may specifically include the following modules:

[0262] The data acquisition module 201 is used to acquire the internal temperature data and the ambient temperature data of the target device;

[0263] A data processing module 202, configured to determine a temperature change rate of an air inlet of the target device and / or predict an air inlet temperature according to the internal temperature data and the ambient temperature data;

[0264] A hysteresis temperature adjustment module 203, configured to calculate a target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature, and adjust the hysteresis temperature of the target device to the target hysteresis temperature;

[0265] The heat dissipation mode generating module 204 is used to determine the heat dissipation mode according to the target hysteresis temperature, and adjust the fan speed of the target device according to the heat dissipation mode when the air inlet temperature of the target device changes.

[0266] Optionally, the data processing module 202 includes:

[0267] An air inlet temperature data acquisition module, used to obtain the air inlet temperature data of the target device according to the average value of the internal temperature and the ambient temperature;

[0268] A predicted air inlet temperature acquisition module is used to predict the air inlet temperature of the target device according to the air inlet temperature data through an autoregressive integral moving average model to obtain a predicted air inlet temperature;

[0269] Optionally, the data processing module 202 further includes:

[0270] The temperature change rate acquisition module is used to obtain the air inlet temperature change rate according to the predicted air inlet temperature and the current air inlet temperature of the target device.

[0271] Optionally, the hysteresis temperature adjustment module 203 includes:

[0272] A first target hysteresis temperature calculation module, configured to calculate a first target hysteresis temperature according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value if the absolute value of the air inlet temperature change rate is greater than the absolute value of the preset temperature change rate standard value;

[0273] Wherein, the calculation formula of the first target hysteresis temperature is:

[0274] h new =h*(1+|r|-|r d |)

[0275] Among them, h newrepresents the adjusted hysteresis temperature, h represents the current hysteresis temperature, r represents the temperature change rate, r d Indicates the standard value of temperature change rate;

[0276] A second target hysteresis temperature calculation module, configured to calculate a second target hysteresis temperature according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value if the absolute value of the air inlet temperature change rate is less than the product of the absolute value of the temperature change rate standard value and the preset change rate percentage;

[0277] Wherein, the calculation formula of the second target hysteresis temperature is:

[0278] h new =h*(1-r|+|r d ).

[0279] Optionally, the hysteresis temperature adjustment module 203 further includes:

[0280] A third target hysteresis temperature calculation module, used for calculating a third target hysteresis temperature according to the predicted air inlet temperature and the air inlet temperature standard value if the predicted air inlet temperature is greater than the air inlet temperature standard value; the air inlet temperature standard value is set according to the model of the target device;

[0281] Wherein, the calculation formula of the third target hysteresis temperature is:

[0282]

[0283] Among them, T f represents the predicted air inlet temperature, T d Indicates the standard value of air inlet temperature;

[0284] a fourth target hysteresis temperature calculation module, configured to calculate a fourth target hysteresis temperature according to the predicted air inlet temperature and the air inlet temperature standard value if the predicted air inlet temperature is less than the product of the air inlet temperature standard value and the preset air inlet temperature percentage;

[0285] Wherein, the calculation formula of the fourth target hysteresis temperature is:

[0286]

[0287] Optionally, the device further comprises:

[0288] a fifth target hysteresis temperature calculation module, configured to calculate a value of a fifth target hysteresis temperature according to the output power of the target device and the target device output power standard value if the output power of the target device is greater than the target device output power standard value; the target device output power standard value is set according to the model of the target device;

[0289] Wherein, the calculation formula of the fifth target hysteresis temperature is:

[0290]

[0291] Where P represents the output power of the target device, P d Indicates the standard value of the target device output power;

[0292] a sixth target hysteresis temperature calculation module, configured to calculate a sixth target hysteresis temperature according to the output power of the target device and the target device output power standard value if the output power of the target device is less than the product of the target device output power standard value and a preset target device output power percentage;

[0293] Wherein, the calculation formula of the sixth target hysteresis temperature is:

[0294]

[0295] Optionally, the heat dissipation mode generating module 204 includes:

[0296] A difference acquisition module is used to obtain the difference between the predicted air inlet temperature and the current air inlet temperature;

[0297] A first difference judgment module, configured to obtain a fan speed duty cycle of the target device based on the predicted air inlet temperature if the difference is greater than the target hysteresis temperature;

[0298] A second difference judgment module, configured to maintain the fan speed duty cycle of the target device if the difference is less than or equal to the target hysteresis temperature;

[0299] The speed adjustment module is used to set the fan speed duty cycle to the fan of the target device to adjust the fan speed of the target device.

[0300] In the embodiment of the present invention, the internal temperature data and the ambient temperature data of the target device are collected; the air inlet temperature change rate and / or the predicted air inlet temperature of the target device are determined according to the internal temperature data and the ambient temperature data; the target hysteresis temperature of the target device is calculated according to the air inlet temperature change rate and / or the predicted air inlet temperature, and the hysteresis temperature of the target device is adjusted to the target hysteresis temperature; the heat dissipation mode is determined according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, the fan speed of the target device is adjusted according to the heat dissipation mode. The reciprocating oscillation and fluctuation of the speed of the target device system fan and the power supply body fan caused by the change of the air inlet temperature are greatly reduced, the service life of the fan of the target device is extended, and the heat dissipation efficiency is improved while reducing the heat dissipation energy consumption.

[0301] An embodiment of the present invention further provides an electronic device, which may include a processor, a memory, and a computer program stored in the memory and capable of running on the processor. When the computer program is executed by the processor, the above heat dissipation control method is implemented.

[0302] An embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the above heat dissipation control method is implemented.

[0303] As for the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0304] Those skilled in the art will appreciate that the embodiments of the present invention may be provided as methods, devices, or computer program products. Therefore, the embodiments of the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the embodiments of the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0305] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of the methods, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of the processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0306] These computer program instructions may also be stored in a computer readable memory capable of directing a computer or other programmable data processing terminal device to operate in a specific manner, so that the instructions stored in the computer readable memory produce a manufactured product including an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0307] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable terminal device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0308] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0309] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the above elements.

[0310] The above is a detailed introduction to a heat dissipation control method, device, equipment and medium provided. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. Although the implementation methods of the present invention are described as above, the above description content and definition are only for the convenience of understanding the implementation methods of the present invention, and are not intended to limit the present invention. Any modifications and changes made without departing from the spirit and scope of the present invention are within the scope of protection of the present invention. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A heat dissipation control method, characterized in that: The method comprises: Collect internal temperature data and ambient temperature data of the target device; Determine the air inlet temperature change rate and / or predict the air inlet temperature of the target device according to the internal temperature data and the ambient temperature data; Calculating a target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature, and adjusting the hysteresis temperature of the target device to the target hysteresis temperature; A heat dissipation mode is determined according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, a fan speed of the target device is adjusted according to the heat dissipation mode.

2. The method according to claim 1, characterized in that The determining the temperature change rate of the air inlet of the target device and / or predicting the air inlet temperature according to the internal temperature data and the ambient temperature data includes: Obtaining air inlet temperature data of the target device according to an average value of the internal temperature and the ambient temperature; According to the air inlet temperature data, the air inlet temperature of the target device is predicted by an autoregressive integral moving average model to obtain a predicted air inlet temperature.

3. The method according to claim 2, characterized in that The determining the air inlet temperature change rate and / or predicting the air inlet temperature of the target device according to the internal temperature data and the ambient temperature data further includes: The air inlet temperature change rate is obtained according to the predicted air inlet temperature and the current air inlet temperature of the target device.

4. The method according to claim 1, characterized in that The calculating the target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature includes: If the absolute value of the air inlet temperature change rate is greater than the absolute value of the preset temperature change rate standard value, the first target hysteresis temperature is calculated according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value; wherein the calculation formula of the first target hysteresis temperature is: h new =h*(1+|r|-|r d |) Among them, h new represents the adjusted hysteresis temperature, h represents the current hysteresis temperature, r represents the temperature change rate, r d Indicates the standard value of temperature change rate; If the absolute value of the air inlet temperature change rate is less than the product of the absolute value of the temperature change rate standard value and the preset change rate percentage, the second target hysteresis temperature is calculated according to the absolute value of the air inlet temperature change rate and the absolute value of the preset temperature change rate standard value; Wherein, the calculation formula of the second target hysteresis temperature is: h new =h*(1-r|+|r d )。 5. The method according to claim 1, characterized in that: The calculating the target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature also includes: If the predicted air inlet temperature is greater than the standard value of the air inlet temperature, calculating a third target hysteresis temperature according to the predicted air inlet temperature and the standard value of the air inlet temperature; the standard value of the air inlet temperature is set according to the model of the target device; Wherein, the calculation formula of the third target hysteresis temperature is: Among them, T f represents the predicted air inlet temperature, T d Indicates the standard value of air inlet temperature; If the predicted air inlet temperature is less than the product of the air inlet temperature standard value and the preset air inlet temperature percentage, calculating a fourth target hysteresis temperature according to the predicted air inlet temperature and the air inlet temperature standard value; Wherein, the calculation formula of the fourth target hysteresis temperature is:

6. The method according to claim 1, characterized in that The method further comprises: If the output power of the target device is greater than the target device output power standard value, calculating the value of the fifth target hysteresis temperature according to the output power of the target device and the target device output power standard value; the target device output power standard value is set according to the model of the target device; Wherein, the calculation formula of the fifth target hysteresis temperature is: Where P represents the output power of the target device, P d Indicates the standard value of the target device output power; If the output power of the target device is less than the product of the target device output power standard value and the preset target device output power percentage, calculating a sixth target hysteresis temperature according to the output power of the target device and the target device output power standard value; Wherein, the calculation formula of the sixth target hysteresis temperature is:

7. The method according to claim 1 or 2, wherein determining a heat dissipation mode according to the target hysteresis temperature, and adjusting a fan speed of the target device according to the heat dissipation mode when an air inlet temperature of the target device changes, comprises: Obtaining a difference between the predicted air inlet temperature and the current air inlet temperature; If the difference is greater than the target hysteresis temperature, obtaining a fan speed duty cycle of the target device based on the predicted air inlet temperature; If the difference is less than or equal to the target hysteresis temperature, maintaining the fan speed duty cycle of the target device; The fan speed duty cycle of the switch is set to the fan of the target device to adjust the fan speed of the target device.

8. A heat dissipation control device, characterized in that: The device comprises: A data acquisition module, used to collect internal temperature data and ambient temperature data of the target device; A data processing module, used to determine the air inlet temperature change rate and / or predict the air inlet temperature of the target device according to the internal temperature data and the ambient temperature data; a hysteresis temperature adjustment module, configured to calculate a target hysteresis temperature of the target device according to the air inlet temperature change rate and / or the predicted air inlet temperature, and adjust the hysteresis temperature of the target device to the target hysteresis temperature; The heat dissipation mode generating module is used to determine the heat dissipation mode according to the target hysteresis temperature, and when the air inlet temperature of the target device changes, adjust the fan speed of the target device according to the heat dissipation mode.

9. An electronic device, characterized in that: The method comprises a processor, a memory, and a computer program stored in the memory and capable of running on the processor, wherein when the computer program is executed by the processor, the heat dissipation control method according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the heat dissipation control method according to any one of claims 1 to 7 is implemented.

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