Financial equipment and protection method and device for side attack of financial equipment

Abstract

The invention discloses financial equipment and a protection method and device for side attack of the financial equipment, and the financial equipment is characterized in that a plurality of VIA holes which vertically penetrate from the top to the bottom are designed in a board edge, and two VIA holes which are separated by two in each VIA hole which is sorted in a preset direction are connected through a same signal encryption line in a line encryption manner; and the two adjacent VIA holes are not communicated, and the signal types of the signal encryption lines connected with the two adjacent VIA holes are different. Therefore, by designing the VIA holes, the plurality of VIA holes are connected through the encryption lines of different types of signals, so that when the financial equipment is subjected to side attack, different signals are in contact or an independent signal is in open circuit, thereby triggering an alarm, and improving the performance of the financial equipment in the aspect of resisting the side attack.

Description

Technical Field

[0001] The present application relates to the technical field of financial equipment, and more specifically, to a financial equipment, and a method and device for protecting the financial equipment from side attacks. Background Art

[0002] At a time when digital finance is booming, financial equipment is widely used in various business scenarios. It shoulders the important task of ensuring the security of capital flow, and its security is widely valued.

[0003] Nowadays, financial equipment is subject to a variety of attacks, including intrusion attacks during transactions and physical attacks (such as needle punctures on the sides of financial equipment). The current defense against physical attacks is that the thickness of the baffle of traditional financial equipment is more than 1.6mm, which is intended to resist external punctures. However, its PCB routing design is limited to the copper layer. Because the baffle is thicker, the distance between the dielectric layers between the copper layers increases, which makes the dielectric layer relatively loose.

[0004] When encountering external needle attacks, sharp objects can easily pierce the dielectric layer, directly threatening the key signal lines that transmit financial information within the board. Once these lines are damaged, it is very easy to cause serious consequences such as information leakage, transaction data tampering, and fund theft.

[0005] Based on this, how to design protection for financial equipment to improve its performance in resisting side attacks is an issue that needs attention. Summary of the invention

[0006] In view of the above problems, the present application provides a financial device, a method and an apparatus for protecting financial devices from side attacks, so as to improve the performance of financial devices in resisting side attacks.

[0007] In order to achieve the above objectives, the specific plan is proposed as follows:

[0008] A financial device, comprising a plurality of VIA holes and four-layer through-hole circuits;

[0009] The four-layer through-hole circuits are, from top to bottom, a top-layer circuit, an L2-layer encrypted circuit, an L3-layer encrypted circuit, and a bottom-layer circuit, wherein both the L2-layer encrypted circuit and the L3-layer encrypted circuit include signal encrypted lines;

[0010] Each VIA hole vertically penetrates from the top to the bottom;

[0011] In each VIA hole arranged in a preset direction, two VIA holes separated by 2 are connected by the same type of signal encryption line, and two adjacent VIA holes are not connected and the signal types of the signal encryption lines connected to each of them are different.

[0012] Optionally, the distance between two adjacent VIA holes is within a preset distance range.

[0013] Optionally, each layer of the four-layer through-hole circuit includes signal encryption lines of two different signals.

[0014] Optionally, each VIA hole is connected to a corresponding signal encryption line at a location where the L2 layer encryption line and the bottom layer line are located.

[0015] Optionally, among the VIA holes arranged in the preset direction of the L2 layer encryption line, the 4n-3th VIA hole is connected to the 4n-1th VIA hole through the same signal encryption line, and the 4n-2th and 4nth VIA holes are connected through the same signal encryption line, where n is a positive integer.

[0016] Optionally, among the VIA holes arranged in the preset direction in the bottom layer circuit, the 4n-1th VIA hole is connected to the 4n+1th VIA hole through the same signal encryption line, and the 4nth VIA hole is connected to the 4n+2th VIA hole through the same signal encryption line, where n is a positive integer.

[0017] Optionally, the signal encryption line of the first signal in the bottom layer circuit is soldered to a soldering pad corresponding to the first signal;

[0018] The signal encryption line of the second signal in the bottom layer circuit is soldered to the soldering pad corresponding to the second signal.

[0019] Optionally, the distance between the L2 layer encrypted line and the top layer line is not greater than a first preset distance, and the distance between the L3 layer encrypted line and the bottom layer line is not greater than a second preset distance.

[0020] A method for protecting financial equipment from side attacks is applied to the financial equipment as described above, and the method comprises:

[0021] When the financial device is attacked from the side, and the side attack causes adjacent VIA holes of the financial device to be connected, encrypted lines based on two different signals of the financial device are connected to generate a short-circuit signal;

[0022] When the financial device is attacked from the side, and the side attack destroys the target VIA hole of the financial device, an open circuit signal is generated based on the interruption of the signal of the encryption line corresponding to the target VIA hole;

[0023] An alarm is issued according to the short-circuit signal and / or the open-circuit signal to protect the financial device from side attacks.

[0024] A protection device for side attacks on financial equipment, applied to the financial equipment as described above, comprising:

[0025] A short-circuit signal generating unit, configured to generate a short-circuit signal based on the connection of encrypted lines of two different signals of the financial device when the financial device is attacked from the side and the side attack causes adjacent VIA holes of the financial device to be connected;

[0026] an open circuit signal generating unit, configured to generate an open circuit signal based on a signal interruption of an encryption line corresponding to the target VIA hole when the financial device is attacked from the side and the target VIA hole of the financial device is destroyed by the side attack;

[0027] The alarm unit is used to generate an alarm according to the short-circuit signal and / or the open-circuit signal to protect the financial device from side attacks.

[0028] By means of the above technical solution, the present application designs multiple VIA holes vertically penetrating from the top to the bottom on the edge of the financial device board, and through line encryption, in each VIA hole arranged in a preset direction, two VIA holes that are 2 VIA holes apart are connected by the same signal encryption line, and two adjacent VIA holes are not connected and the signal types of the signal encryption lines connected to each are different. It can be seen that by designing the VIA holes, different types of signal encryption lines are connected between multiple VIA holes, so that when the financial device is attacked from the side, different signals are in contact or a single signal is open, thereby triggering an alarm, thereby improving the performance of the financial device in resisting side attacks. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present application. Also, the same reference symbols are used throughout the accompanying drawings to represent the same components. In the accompanying drawings:

[0030] Figure 1 A schematic diagram of a four-layer through-hole circuit scheme for a financial device provided in an embodiment of the present application;

[0031] Figure 2 A schematic diagram of a VIA hole wiring scheme for a financial device provided in an embodiment of the present application;

[0032] Figure 3 A schematic diagram of a traditional through-hole wiring scheme for a financial device provided in an embodiment of the present application;

[0033] Figure 4 A schematic diagram of a process for implementing side attack protection for a financial device provided in an embodiment of the present application;

[0034] Figure 5 A schematic diagram of the structure of a device for implementing side attack protection on a financial device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] Figure 1 A four-layer through-hole circuit solution for financial equipment provided in the embodiment of the present application, combined with Figure 2 As shown in the figure, the four-layer through-hole circuits of POS are top-layer circuits (TOP layer), L2-layer encrypted circuits (L2 layer), L3-layer encrypted circuits (L3 layer) and bottom-layer circuits (BOT layer) from top to bottom, corresponding to Figure 1 There are four layers shown from left to right.

[0037] Wherein, the L2 layer encryption circuit and the L3 layer encryption circuit both include signal encryption lines.

[0038] It is understandable that compared with the traditional financial equipment through-hole wiring with only two layers (such as Figure 3 The TOP layer and BOT layer shown in the figure), the financial device of the present application adds two more layers of through-hole circuits, L2-layer encrypted circuits and L3-layer encrypted circuits, to provide further protection. Therefore, the L2-layer encrypted circuits can be used as an auxiliary protection layer for the top-layer circuits, and the L3-layer encrypted circuits can be used as an auxiliary protection layer for the bottom-layer circuits. Therefore, the L2-layer encrypted circuits should be closer to the top-layer circuits, and the L3-layer encrypted circuits should be closer to the bottom-layer circuits. Then, the interval between the L2-layer encrypted circuits and the top-layer circuits may not be greater than the first preset distance, and the interval between the L3-layer encrypted circuits and the bottom-layer circuits may not be greater than the second preset distance.

[0039] Specifically, both the L2 layer encryption line and the L3 layer encryption line include signal encryption lines.

[0040] A financial device may include multiple VIA apertures.

[0041] Specifically, VIA holes are mainly used to connect electrical signals between different layers of a multi-layer printed circuit board (PCB). It is a metallized hole that runs through different layers of a PCB. For example, in a four-layer PCB, if the signal needs to be transmitted from the top layer to the bottom layer or the middle layer, the electrical connection can be achieved through the VIA hole. During the PCB manufacturing process, the required holes are first drilled on the circuit board by drilling, and then the hole walls are copper-plated to make the hole walls conductive, thereby forming a VIA hole. In this way, the lines of different layers can be connected through this copper-plated VIA hole, realizing the transmission of signals between multiple layers.

[0042] Among them, Figure 2 As shown, each VIA hole vertically passes through from the top to the bottom.

[0043] In each VIA hole arranged in a preset direction, two VIA holes separated by 2 are connected by the same type of signal encryption line, and two adjacent VIA holes are not connected and the signal types of the signal encryption lines connected to each of them are different.

[0044] like Figure 2 As shown, adjacent VIA holes have different signals. The green arrow and blue arrow represent two different signals respectively. The green arrow / blue arrow connecting two VIA holes indicates that the two VIA holes are connected by the same signal encryption line.

[0045] Specifically, the distance between two adjacent VIA holes is based on a preset distance range.

[0046] The lower limit of the preset distance range may represent the minimum distance between two adjacent VIA holes, and the lower limit of the preset distance range may represent the maximum distance between two adjacent VIA holes that are densely packed. The VIA hole may include a drill hole and an annular ring, and the spacing between the drill hole and the annular ring is not less than the preset spacing distance, and the preset spacing distance may be 0.3 mm.

[0047] It is understandable that densely distributed VIA holes can be more sensitive when dealing with POS side attacks.

[0048] Furthermore, each layer of the four-layer through-hole circuit includes signal encryption lines of two different signals.

[0049] The two signal encryption lines are respectively a first signal encryption line and a second signal encryption line, which are encryption lines of different signals. The first signal encryption line and the second signal encryption line can be inserted between each VIA hole to form an encryption line barrier.

[0050] Furthermore, due to the through-hole wiring of traditional financial equipment (such as Figure 3(as shown) is continuous wiring within the same layer, so there will be stubs in the hole. A stub refers to a small unused redundant line segment connected from the via to the end of the actual trace. When the signal is transmitted to the via, part of the signal will continue to be transmitted along the expected path, while another part of the signal may enter these stubs. The presence of stubs will cause signal reflection. When the signal propagates along the transmission line and encounters the stub, part of the signal will be reflected back due to the impedance mismatch at the end of the stub. In addition, the stub will also increase the transmission delay of the signal, because the signal will enter the stub part, and the additional path length causes the signal to take more time to transmit. In high-speed signal transmission, this delay may cause timing problems and affect the normal function of the circuit.

[0051] Based on this, the VIA hole wiring method designed for the financial equipment of this application is:

[0052] Each VIA hole is connected to its corresponding signal encryption line at the location of the L2 layer encryption line and the bottom layer line.

[0053] Specifically, among the VIA holes arranged in a preset direction of the L2 layer encryption line, the 4n-3th VIA hole is connected to the 4n-1th VIA hole through the same signal encryption line, and the 4n-2th VIA hole is connected to the 4nth VIA hole through the same signal encryption line.

[0054] Wherein, n is a positive integer.

[0055] like Figure 2 As shown, in the direction from left to right in the L2 layer, the 1st VIA hole is connected to the 3rd VIA hole through a blue signal density line, the 5th VIA hole is connected to the 7th VIA hole through a blue signal density line, and the 9th VIA hole is connected to the 11th VIA hole through a blue signal density line. The 2nd VIA hole is connected to the 4th VIA hole through a green signal density line, the 6th VIA hole is connected to the 8th VIA hole through a green signal density line, and the 10th VIA hole is connected to the 12th VIA hole through a green signal density line.

[0056] Among the VIA holes arranged in a preset direction in the bottom layer circuit, the 4n-1th VIA hole is connected to the 4n+1th VIA hole through the same signal encryption line, and the 4nth VIA hole is connected to the 4n+2th VIA hole through the same signal encryption line, where n is a positive integer.

[0057] like Figure 2As shown, in the direction from left to right of the BOT layer, the 3rd VIA hole is connected to the 5th VIA hole through the blue signal density line, the 7th VIA hole is connected to the 9th VIA hole through the blue signal density line. The 4th VIA hole is connected to the 6th VIA hole through the green signal density line, and the 8th VIA hole is connected to the 10th VIA hole through the green signal density line.

[0058] Furthermore, considering that the beginning and the end of the signal line need to be welded to the pad, the signal encryption line of the first signal in the bottom line is welded to the pad corresponding to the first signal. The signal encryption line of the second signal in the bottom line is welded to the pad corresponding to the second signal.

[0059] The financial device provided in this embodiment is designed with multiple VIA holes vertically penetrating from the top to the bottom on the edge of the financial device board, and through line encryption, in each VIA hole arranged in a preset direction, two VIA holes separated by 2 are connected by the same signal encryption line, and two adjacent VIA holes are not connected and the signal types of the signal encryption lines connected to each are different. It can be seen that by designing the VIA holes, different types of signal encryption lines are connected between the multiple VIA holes, so that when the financial device is attacked, different signals are in contact or a single signal is open, thereby triggering an alarm, thereby improving the performance of the financial device in resisting side attacks.

[0060] Based on the structure of the financial device mentioned in the above embodiment, Figure 4 A schematic diagram of a process for protecting a financial device from side attacks provided by an embodiment of the present application is shown. Figure 4 , the process may include:

[0061] Step S110: When the financial device is attacked from the side, and the side attack connects adjacent VIA holes of the financial device, encryption lines based on two different signals of the financial device are connected to generate a short-circuit signal.

[0062] It is understandable that when a financial device is attacked from the side, the attack may hit two or more VIA holes, causing different types of signals to be connected, resulting in a short circuit, thereby generating a short circuit signal. It can be seen that the short circuit signal indicates that the financial device is attacked from the side.

[0063] In addition, when the financial device is attacked from the front or from top to bottom, if the attack causes two or more VIA holes to be hit, different signals will also be connected, causing a short circuit, thereby generating a short circuit signal. Therefore, the financial device provided in this application can also protect against frontal attacks or attacks from top to bottom.

[0064] Step S120: When the financial device is attacked from the side and the target VIA hole of the financial device is destroyed by the side attack, an open circuit signal is generated based on the signal interruption of the encryption line corresponding to the target VIA hole.

[0065] It is understandable that when a financial device is attacked from the side, the attack may directly damage the VIA hole, causing the signal of the encryption line corresponding to the VIA hole to be interrupted, resulting in an open circuit, thereby generating an open circuit signal. It can be seen that the open circuit signal indicates that the financial device is attacked from the side.

[0066] In addition, when the financial device is attacked from the front or from top to bottom, if the attack destroys the VIA hole, the signal of the encryption line corresponding to the VIA hole will be interrupted, causing an open circuit, thereby generating an open circuit signal. Therefore, the financial device provided by this application can also protect against frontal attacks or attacks from top to bottom.

[0067] Step S130: alarm according to the short-circuit signal and the open-circuit signal to protect the financial device from side attacks.

[0068] Specifically, a side attack may cause the financial device to generate an open circuit signal and a short circuit signal at the same time. Therefore, an alarm may be issued based on the short circuit signal and / or the open circuit signal to protect the financial device from a side attack.

[0069] It is understandable that since both the short circuit signal and the open circuit signal indicate that the financial device is under side attack or front attack, an alarm can be issued to prevent further attack. At the same time, since the financial device has a short circuit and / or an open circuit, the current transaction will be terminated in time to avoid economic losses and improve the safety of the financial device during use.

[0070] The method for protecting financial equipment from side attacks provided in this embodiment is as follows: when the financial equipment is attacked from the side and the adjacent VIA holes of the financial equipment are connected by the side attack, the encrypted lines based on two different signals of the financial equipment are connected to generate a short-circuit signal; when the financial equipment is attacked from the side and the target VIA hole of the financial equipment is destroyed by the side attack, the signal of the encrypted line corresponding to the target VIA hole is interrupted to generate an open-circuit signal, and an alarm is issued according to the short-circuit signal and / or the open-circuit signal to protect the financial equipment from the side attack. It can be seen that the multiple dense VIA holes of the financial equipment can generate short-circuit signals and / or open-circuit signals in time when attacked from the side or from the front by means of encrypted lines, and the alarm is issued in time, thereby ensuring the avoidance of economic losses, improving the performance of the financial equipment in resisting attacks, and the safety of the financial equipment during use.

[0071] The following is a description of an apparatus for implementing protection against side attacks on financial devices provided in an embodiment of the present application. The apparatus for implementing protection against side attacks on financial devices described below and the method for implementing protection against side attacks on financial devices described above can be referenced to each other.

[0072] See also Figure 5 , Figure 5 A schematic diagram of the structure of a device for protecting financial equipment from side attacks disclosed in an embodiment of the present application.

[0073] like Figure 5 As shown, the device may include:

[0074] A short-circuit signal generating unit 11, configured to generate a short-circuit signal based on the connection of encrypted lines of two different signals of the financial device when the financial device is attacked from the side and the side attack causes adjacent VIA holes of the financial device to be connected;

[0075] The open circuit signal generating unit 12 is used to generate an open circuit signal based on the signal interruption of the encryption line corresponding to the target VIA hole when the financial device is attacked from the side and the target VIA hole of the financial device is destroyed by the side attack;

[0076] The alarm unit 13 is used to generate an alarm according to the short-circuit signal and / or the open-circuit signal to protect the financial device from side attacks.

[0077] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0078] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The various embodiments can be combined as needed, and the same or similar parts can refer to each other.

[0079] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A financial device, characterized in that: Includes multiple VIA holes and four-layer through-hole circuits; The four-layer through-hole circuits are, from top to bottom, a top-layer circuit, an L2-layer encrypted circuit, an L3-layer encrypted circuit, and a bottom-layer circuit, wherein both the L2-layer encrypted circuit and the L3-layer encrypted circuit include signal encrypted lines; Each VIA hole vertically penetrates from the top to the bottom; In each VIA hole arranged in a preset direction, two VIA holes separated by 2 are connected by the same type of signal encryption line, and two adjacent VIA holes are not connected and the signal types of the signal encryption lines connected to each of them are different.

2. The financial device according to claim 1, characterized in that: The distance between two adjacent VIA holes is within a preset distance range.

3. The financial device according to claim 1, characterized in that: Each layer of the four-layer through-hole circuit includes signal encryption lines of two different signals.

4. The financial device according to claim 1, characterized in that: Each VIA hole is connected to its corresponding signal encryption line at the location of the L2 layer encryption line and the bottom layer line.

5. The financial device according to claim 4, characterized in that: Among the VIA holes arranged in the preset direction of the L2 layer encryption line, the 4n-3th VIA hole is connected to the 4n-1th VIA hole through the same signal encryption line, and the 4n-2th and 4nth VIA holes are connected through the same signal encryption line, where n is a positive integer.

6. The financial device according to claim 4, characterized in that: Among the VIA holes arranged in the preset direction in the bottom layer circuit, the 4n-1th VIA hole is connected to the 4n+1th VIA hole through the same signal encryption line, and the 4nth VIA hole is connected to the 4n+2th VIA hole through the same signal encryption line, where n is a positive integer.

7. The financial device according to claim 4, characterized in that: A signal encryption line of the first signal in the bottom layer circuit is soldered to a soldering pad corresponding to the first signal; The signal encryption line of the second signal in the bottom layer circuit is soldered to the soldering pad corresponding to the second signal.

8. The financial device according to any one of claims 1 to 7, characterized in that: The distance between the L2 layer encrypted line and the top layer line is not greater than a first preset distance, and the distance between the L3 layer encrypted line and the bottom layer line is not greater than a second preset distance.

9. A method for protecting financial equipment from side attacks, characterized in that: Applied to the financial device according to any one of claims 1 to 8, the method comprises: When the financial device is attacked from the side, and the side attack causes adjacent VIA holes of the financial device to be connected, encrypted lines based on two different signals of the financial device are connected to generate a short-circuit signal; When the financial device is attacked from the side, and the side attack destroys the target VIA hole of the financial device, an open circuit signal is generated based on the interruption of the signal of the encryption line corresponding to the target VIA hole; An alarm is issued according to the short-circuit signal and / or the open-circuit signal to protect the financial device from side attacks.

10. A protection device for side attacks on financial equipment, characterized in that: Applied to the financial device according to any one of claims 1 to 8, the device comprises: A short-circuit signal generating unit, configured to generate a short-circuit signal based on the connection of encrypted lines of two different signals of the financial device when the financial device is attacked from the side and the side attack causes adjacent VIA holes of the financial device to be connected; an open circuit signal generating unit, configured to generate an open circuit signal based on a signal interruption of an encryption line corresponding to the target VIA hole when the financial device is attacked from the side and the target VIA hole of the financial device is destroyed by the side attack; The alarm unit is used to generate an alarm according to the short-circuit signal and / or the open-circuit signal to protect the financial device from side attacks.

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