Ring system

Abstract

The embodiment of the present disclosure provides a ring taking system, wherein the ring taking system comprises: a stage adapted to place a wafer, the wafer comprising: a wafer main body and a tooled ring, one side of the wafer having a film; a ring taking clamp, the ring taking clamp comprising: a ring taking piece, when a first end of the ring taking piece reaches an outer edge of the wafer main body, a first end surface of the ring taking piece has a first spacing between the film on one side of the wafer main body at the first end, the first spacing being greater than the thickness of the outer edge of the wafer main body; a first adjusting assembly, the first adjusting assembly being used to drive the ring taking piece to move in a first direction, the first direction being the radial direction of the stage; a second adjusting assembly, one end of the second adjusting assembly being connected with the first adjusting assembly, and the other end being connected with the ring taking piece, the ring taking piece being adapted to move in a second direction through the second adjusting assembly, the second direction being the axial direction of the stage; and a main body part, the main body part being connected with the first adjusting assembly and being used to drive the ring taking piece to rotate. By using the above technical scheme, the tooled ring can be taken off.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor device technology, and more particularly to a ring-taking system. Background Technology

[0002] When fabricating larger wafers, Taiko rings are formed at the edges of the wafer to improve mechanical strength and stability during the wafer fabrication process. Therefore, before packaging the wafer, the following steps are performed: applying a thin film to the wafer surface; removing the Taiko rings at the outer edge of the wafer; and removing the Taiko rings from the thin film.

[0003] Therefore, how to remove the ancient ring is a question worth discussing. Summary of the Invention

[0004] In view of this, embodiments of the present disclosure provide a ring removal system capable of removing the Archean ring.

[0005] To address the aforementioned technical problems, this disclosure provides a ring retrieval system, which includes:

[0006] A stage suitable for placing a wafer, wherein the wafer includes: a wafer body and an archipelago ring, and one side of the wafer has a thin film;

[0007] Ring-removing fixture, the ring-removing fixture comprising:

[0008] The ring-taking member, when its first end reaches the outer edge of the wafer body, has a first gap between its first end face and a thin film on one side of the wafer body, wherein the first gap is greater than the thickness of the outer edge of the wafer body.

[0009] A first adjustment component is used to drive the ring-taking member to move along a first direction, wherein the first direction is the radial direction of the stage;

[0010] A second adjustment component, one end of which is connected to the first adjustment component and the other end of which is connected to the ring-taking member, wherein the ring-taking member is adapted to move along a second direction via the second adjustment component, wherein the second direction is the axial direction of the platform;

[0011] The main body is connected to the first adjustment component and is used to drive the ring-taking component to rotate.

[0012] Optionally, the first adjustment component includes:

[0013] A first support is fixed to the main body and extends radially along the platform.

[0014] A driving component, one end of which is connected to the first bracket and the other end of which is connected to the second adjustment component, is used to drive the second adjustment component to move along the first direction.

[0015] Optionally, the first support has:

[0016] A guide groove extends along the first direction, and the second adjustment component slides in conjunction with the guide groove.

[0017] The second adjustment component includes:

[0018] A sliding member, wherein the sliding member is slidably engaged with the guide groove of the first adjusting component;

[0019] A guide rod, the first end of which is disposed inside the sliding member and is adapted to move relative to the sliding member in the second direction; the second end of which is connected to the ring-taking member.

[0020] An elastic element is sleeved on the guide rod and clamped in a compressed state between the sliding element and the ring-taking element.

[0021] Optionally, the guide rod has:

[0022] A limiting part, wherein the limiting part is located at the first end of the guide rod;

[0023] The slider has:

[0024] A receiving cavity, the receiving cavity being adapted to receive the limiting portion;

[0025] A guide hole is provided, which communicates with the receiving cavity. The guide hole is located on the side of the slider away from the first adjusting component and extends along the second direction.

[0026] Optionally, the slider has:

[0027] A sliding part is located within the guide groove and slides in cooperation with the guide groove along the first direction.

[0028] Optionally, the thickness of the ring-taking member gradually increases from the first end to the second end.

[0029] Optionally, when the first end of the ring-taking member is located between the archaic ring and the film, the first end face of the ring-taking member and the film have a first included angle, the first included angle being in the range of 1 degree to 30 degrees.

[0030] Optionally, there may be multiple first adjustment components, which are arranged in a circumferential array around the main body.

[0031] Optionally, the ring retrieval system further includes:

[0032] A controller, electrically connected to the drive component, is adapted to control the first adjustment component to drive the ring-taking component along the first direction.

[0033] Compared with the prior art, the technical solution of the present disclosure has the following advantages:

[0034] The ring-removal system includes a stage and a ring-removal fixture. The stage is adapted to hold a wafer, which includes a wafer body and a terephthalic ring. One side of the wafer has a thin film. The ring-removal fixture includes a ring-removal member, a first adjustment component, a second adjustment component, and a main body. The first adjustment component drives the ring-removal member to move along a first direction. The ring-removal member is adapted to move along a second direction via the second adjustment component. The main body drives the ring-removal member to rotate. When the first end of the ring-removal member reaches the outer edge of the wafer body, a first gap exists between the first end face and the thin film on one side of the wafer body at the first end. The first gap is greater than the thickness of the outer edge of the wafer body. Using this technical solution, on the one hand, the terephthalic ring can be removed from the thin film using the ring-removal fixture; on the other hand, it can reduce the probability of the wafer body breaking due to the ring-removal member contacting the wafer body during the ring-removal process. Attached Figure Description

[0035] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the drawings used in the description of the embodiments of this disclosure or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0036] Figure 1 A schematic diagram illustrating an application scenario of a ring retrieval system according to an embodiment of this disclosure is shown.

[0037] Figure 2 A top view of a ring-retrieving clamp according to an embodiment of the present disclosure is shown;

[0038] Figure 3 It shows Figure 2 A cross-sectional schematic diagram of a portion of the ring clamping fixture along the A1-A2 direction;

[0039] Figure 4 It shows Figure 2 A cross-sectional schematic diagram of a portion of the ring clamp structure in the B1-B2 direction.

[0040] Figure label:

[0041] Platform 100;

[0042] Ring-removing clamp 200, main body 210, first bracket 221, ring-removing component 230, sliding component 241, sliding part 242, guide rod 243, limiting part 244, elastic component 245;

[0043] Taikoo Ring 300;

[0044] film 400;

[0045] Guide groove a, receiving cavity b, guide hole c. Detailed Implementation

[0046] As is known from the background art, when fabricating large-sized wafers, archaic rings are formed at the edges of the wafer to improve the mechanical strength and stability during the wafer fabrication process. Therefore, before packaging a wafer with archaic rings, the following steps can be performed: attaching a thin film to the wafer surface; removing the archaic rings at the outer edge of the wafer; and removing the archaic rings from the thin film.

[0047] In some embodiments, the step of removing the archaic ring at the outer edge of the wafer may include the following steps: first, placing the wafer on a stage and coaxially oriented with the stage; then, using a dicing tool to separate the wafer body from the archaic ring.

[0048] It should be noted that in order to reduce the damage to the wafer during the dicing process, the dicing depth cannot be too deep. Therefore, the archaic ring and the thin film on one side of the wafer body remain integrated. Thus, how to remove the archaic ring from the thin film is a question worth discussing.

[0049] To address the aforementioned technical problems, this embodiment includes a stage and a ring-removal fixture. The stage is adapted to hold a wafer, which includes a wafer body and a terrestrial ring. One side of the wafer has a thin film. The ring-removal fixture includes a ring-removal member, a first adjustment component, a second adjustment component, and a main body. The first adjustment component drives the ring-removal member to move along a first direction. The ring-removal member is adapted to move along a second direction via the second adjustment component. The main body drives the ring-removal member to rotate. When the first end of the ring-removal member reaches the outer edge of the wafer body, the first end face has a first gap between the first end and the thin film on one side of the wafer body. The first gap is greater than the thickness of the outer edge of the wafer body.

[0050] By adopting the above technical solution, on the one hand, the archaic ring can be removed from the film by the ring removal fixture, and on the other hand, the probability of the wafer body breaking due to the ring removal component contacting the wafer body during the ring removal process can be reduced.

[0051] To make the above-mentioned objectives, features and beneficial effects of this disclosure more apparent and understandable, specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings.

[0052] Reference Figures 1 to 4 ,in, Figure 1 A schematic diagram of a ring-taking system according to an embodiment of this disclosure is shown. Figure 2 A top view of a ring-retrieving clamp according to an embodiment of the present disclosure is shown. Figure 3 It shows Figure 2 A cross-sectional schematic diagram of a portion of the ring clamp structure along the A1-A2 direction. Figure 4 It shows Figure 2 A cross-sectional schematic diagram of a portion of the ring clamp structure in the B1-B2 direction.

[0053] Continue to combine with reference Figures 1 to 4 The ring retrieval system may include: a platform 100 and a ring retrieval fixture 200.

[0054] Specifically, the wafer is placed coaxially on the stage 100, and the ring-removal fixture 200 is used to perform a ring-removal operation on the wafer.

[0055] In some embodiments, the wafer (not shown) may include: a wafer body (not shown) and an archaic ring 300.

[0056] Specifically, the archaic ring 300 is formed on the outer edge of the wafer body, and the thickness of the archaic ring 300 is greater than the thickness of the wafer body. This can improve the mechanical strength of the wafer and reduce the risk of breakage during subsequent processing and transportation.

[0057] In some embodiments, one side of the wafer has a thin film 400.

[0058] Specifically, the main body and the ancient ring 300 are both attached to the thin film 400. The thin film 400 can provide protection for the wafer and reduce the chance of it being contaminated, scratched or otherwise physically damaged during subsequent processing.

[0059] In some embodiments, the wafer body may have multiple semiconductor devices (not shown).

[0060] In some embodiments, the ring-retrieving clamp 200 may include a main body 210.

[0061] Specifically, the main body 210 is connected to a drive device (not shown) and is adapted to rotate under the drive of the drive device.

[0062] In some embodiments, the ring-retrieving clamp 200 may further include: a first adjustment component and a ring-retrieving member 230.

[0063] In practical use, the main body 210 is coaxially arranged with the stage 100. One end of the first adjustment component is connected to the main body 210, and the other end is connected to the ring-taking member 230. It is adapted to drive the ring-taking member 230 to move along a first direction, such as driving the ring-taking member 230 to move radially along the ancient ring 300 or the stage 100. The ring-taking member 230 is located at the gap between the ancient ring 300 and the film 400. The main body 210 is rotated so that the ring-taking member 230 separates the ancient ring 300 and the film 400 along the circumference of the ancient ring 300. The first direction can be the radial direction of the ancient ring 300 or the radial direction of the stage 100.

[0064] In some embodiments, the number of the first adjustment components is multiple, for example, three.

[0065] In some embodiments, a plurality of first adjustment components are arranged in a circumferential array around the main body 210. For example, the plurality of first adjustment components may be evenly arranged around the circumference of the main body 210. In this way, when the plurality of first adjustment components separate the archaic ring 300 and the thin film 400, the force on the archaic ring 300 can be more uniform, thereby reducing the probability of the archaic ring 300 breaking. For example, the plurality of first adjustment components may be non-uniformly arranged around the circumference of the main body 210 to reduce the requirements for the positional arrangement of the first adjustment components.

[0066] Accordingly, the number of the ring-taking components 230 can be multiple, for example, three.

[0067] Specifically, a ring-taking component 230 is configured to correspond to a first adjustment component.

[0068] It should be noted that, in the following description, the number of the first adjustment components and the number of the ring-taking member 230 may be multiple as an example, but this does not constitute a limitation on the specific number of the first adjustment components and the ring-taking member 230. For example, the number of the first adjustment components and the ring-taking member 230 may be one.

[0069] In some embodiments, the first adjustment component may include a first support 221.

[0070] Specifically, the first bracket 221 is fixed to the main body 210 and extends along the first direction, wherein the fixing method may include a detachable connection method and other fixed connection methods.

[0071] In some embodiments, the first bracket 221 can be detachably connected to the main body 210. For example, a first end of the first bracket 221 is screwed or snapped onto the main body 210. This facilitates replacement of parts and reduces costs.

[0072] In some embodiments, the first bracket 221 is fixedly connected to the main body 210. For example, the first end of the first bracket 221 is welded to or integrally formed with the main body 210. This can improve the connection strength and stability between the first bracket 221 and the main body 210.

[0073] In some embodiments, the first adjustment component may further include a drive element (not shown).

[0074] Specifically, the driving component is fixed on the first bracket 221.

[0075] In some embodiments, the first end of the drive member can be detachably connected to the first bracket 221. For example, the first bracket 221 may have a groove in which the first end of the drive member is embedded and fixed. For example, the first end of the first bracket 221 is connected to the first bracket 221 by a screw.

[0076] In some embodiments, the first end of the ring-taking member 230 abuts against the gap between the ancient ring 300 and the thin film 400, and the second end of the ring-taking member 230 is connected to the second end of the driving member.

[0077] During the ring removal process, the second end of the driving member is controlled to move radially along the ancient ring 300, and the first end of the ring removal member 230 can move radially along the ancient ring 300 under the drive of the second end of the driving member, thereby entering the gap between the ancient ring 300 and the film 400, and realizing the separation between the ancient ring 300 and the film 400.

[0078] In some embodiments, the drive element can be a hydraulic mechanism or a pneumatic mechanism. For example, the drive element is a hydraulic mechanism having a housing and a hydraulic rod, the housing being the first end of the drive element and the driving end of the hydraulic rod being the second end of the drive element.

[0079] In some embodiments, the thickness of the ring-taking member 230 gradually increases from its first end to its second end. For example, the ring-taking member 230 may be a wedge-shaped member, with its first end being the wedge-shaped tip.

[0080] In some embodiments, the ring-taking member 230 may have a first end face and a second end face.

[0081] Specifically, when the first end of the ring-taking member 230 is located between the film 400 and the ancient ring 300, the first end face of the ring-taking member 230 is opposite to the top surface of the film 400, and the second end face of the ring-taking member 230 is opposite to the bottom surface of the ancient ring 300.

[0082] It should be noted that, due to limitations in the alignment process, although the wafer is coaxially placed on the stage 100 and the main body 210 is coaxially arranged with the stage 100, it is not guaranteed that the main body 210 and the wafer body are coaxial. This means that there may be a certain deviation between the central axis of the main body 210 and the central axis of the wafer body. Therefore, during the process of the ring-taking member 230 rotating to separate the ancient ring 300 and the thin film 400, the distance between the first end of the ring-taking member 230 and the circumferential outer edge of the wafer body is different. This may easily lead to the ancient ring 300 and the thin film 400 near the wafer body not being completely separated, or, although the ancient ring 300 and the thin film 400 are completely separated, the wafer body may be damaged due to the first end of the ring-taking member 230 contacting the outer edge of the wafer body.

[0083] In some embodiments, when the first end of the ring-taking member 230 is located between the ancient ring 300 and the thin film 400, the first end face of the ring-taking member 230 has a first included angle with the top surface of the thin film 400. When the first end of the ring-taking member 230 reaches the outer edge of the wafer body, the first end face has a first gap between the first end and the thin film 400 on one side of the wafer body, and the first gap is greater than the thickness of the outer edge of the wafer body.

[0084] Specifically, the first spacing is greater than the thickness of the outer edge of the wafer body, which can prevent the first end from touching the wafer body, thereby reducing the probability of the wafer body breaking during the ring removal process due to the first end of the ring removal member 230 contacting the wafer body.

[0085] In some embodiments, the first included angle can range from 0 degrees to 30 degrees. For example, the first included angle can range from 1 degree to 30 degrees. For example, the first included angle can be 15 degrees.

[0086] It should be noted that the smaller the first included angle, the easier it is for the first end of the ring-taking member 230 to enter the gap between the ancient ring 300 and the thin film 400, thereby realizing the separation between the ancient ring 300 and the thin film 400; the larger the first included angle, the greater the distance between the first end face and the thin film 400 on one side of the wafer body when the first end of the ring-taking member 230 reaches the outer edge of the wafer body.

[0087] It should be noted that during the ring removal process, the first end face of the ring removal member 230 abuts against the stage 100 or the thin film 400. When the first included angle is not zero, as the first end of the ring removal member 230 approaches the wafer body along the first direction, under the combined action of the stage 100 or the thin film 400, the relative positions of the ring removal member 230 and the thin film 400 in the axial direction of the thin film 400 change, wherein the axial direction of the thin film 400 is consistent with the axial direction of the stage 100.

[0088] In some embodiments, the ring-taking assembly may further include a second adjustment assembly.

[0089] Specifically, one end of the second adjustment component can be connected to the second end of the drive component, and the other end can be connected to the ring-taking component 230.

[0090] Specifically, when the ring-taking member 230 moves along the first direction under the action of the first adjusting component, the second adjusting component is adapted to provide the ring-taking member 230 with a space to move relative to the first adjusting component, the stage 100 and the film 400 along the second direction, thereby realizing a change in the relative position of the ring-taking member 230 and the film 400 in the axial direction of the film 400, wherein the axial direction of the ancient ring 300 is consistent with the axial direction of the stage 100.

[0091] In some embodiments, the number of the second adjustment components is multiple, with one second adjustment component corresponding to one ring-taking component 230.

[0092] In some embodiments, a second angle is formed between the first direction and the second direction, and the second angle can range from 30 degrees to 150 degrees. For example, the second angle is 90 degrees.

[0093] In some embodiments, the second adjustment component may include a slider 241.

[0094] Specifically, the slider 241 is connected to the second end of the drive member and is adapted to move under the drive of the second end of the drive member.

[0095] In some embodiments, the structural strength of the first bracket 221 is higher than that of the second end of the drive member.

[0096] Specifically, the deformation of the first support 221 when subjected to a force perpendicular to the first support 221 is lower than the deformation of the second end of the drive member when subjected to a force perpendicular to the second end of the drive member.

[0097] In some embodiments, the first support 221 may have a guide groove a.

[0098] Specifically, the guide groove a can extend along the first direction, and the slider 241 is located in the guide groove a and slides in cooperation with the guide groove a to ensure that the slider 241 moves along the first direction under the drive of the second end of the drive member.

[0099] In some embodiments, the cross-sectional shape of the guide groove a can be T-shaped.

[0100] In some embodiments, the second end of the drive member may be located within the guide groove a.

[0101] In some embodiments, the slider 241 may have a sliding portion 242, the outer dimensions of which are adapted to the inner wall dimensions of the guide groove a. This allows the slider 241 to move only along the extending direction of the guide groove a.

[0102] It should be noted that the matching of the external dimensions of the sliding part 242 with the inner wall dimensions of the guide groove a means that the sliding part 242 and the guide groove a move in abutting manner, so that the sliding member 241 can only move along the extension direction of the guide groove a and cannot move relative to each other on the cross-section of the guide groove a. However, it does not mean that the external shape of the sliding part 242 is consistent with the shape of the inner wall of the guide groove a. For example, the outer surface of the sliding part 242 may have a groove, which can reduce the contact area between the sliding part 242 and the inner wall of the guide groove a, reduce the friction between the two, and thus reduce the frictional loss between them.

[0103] In some embodiments, the second adjustment component may further include a guide rod 243.

[0104] Specifically, one end of the guide rod 243 is disposed on the slider 241, and the guide rod 243 can move relative to the slider 241 along the second direction.

[0105] In some embodiments, the slider 241 may have a receiving cavity b and a guide hole c.

[0106] Specifically, the accommodating cavity b is connected to the guide hole c, the guide hole c is located on the side of the slider 241 away from the first bracket 221, and the guide hole c extends along the second direction.

[0107] In some embodiments, the first end of the guide rod 243 may have a limiting portion 244.

[0108] Specifically, the limiting part 244 may be located inside the accommodating cavity b, and the size of the limiting part 244 is larger than the size of the guide hole c, so as to prevent the first end of the guide rod 243 from leaving the accommodating cavity b through the guide hole c.

[0109] In some embodiments, the second end of the guide rod 243 may be connected to the guide member. For example, the second end of the guide rod 243 may be connected to the second end face of the guide member, or the second end of the guide rod 243 may be connected to the side of the second end of the guide member.

[0110] In some embodiments, the cross-sectional shape of the guide hole c can be one of a circle, an ellipse, or a polygon, and the cross-sectional shape of the guide rod 243 is adapted to the cross-sectional shape of the guide hole c. For example, the cross-sectional shapes of both the guide hole c and the guide rod 243 can be rectangular, which can prevent relative rotation between the guide rod 243 and the guide hole c during use.

[0111] In some embodiments, the second adjustment component may further include an elastic element 245.

[0112] Specifically, the elastic element 245 is sleeved on the guide rod 243 and sandwiched between the sliding element 241 and the ring-taking element 230. The elastic element 245 is always in a compressed state. The first end of the elastic element 245 abuts against the sliding element 241, and the second end of the elastic element 245 abuts against the ring-taking element 230.

[0113] In practical use, as the first end of the ring-taking member 230 approaches the wafer body along the first direction, the distance between the first end of the ring-taking member 230 and the thin film 400 gradually increases, and the ring-taking member 230 further compresses the elastic member 245, so that while the ring-taking member 230 is connected to the sliding member 241, it can also adaptively move along the second direction according to the interaction force between the ring-taking member 230 and the thin film 400.

[0114] In some embodiments, the elastic element 245 may be a spring.

[0115] It should be noted that the greater the elastic modulus of the elastic element 245, the greater the force required to compress or stretch the elastic element 245, the less likely the elastic element 245 is to deform, and the lower the probability of the ring-taking member 230 shaking during rotation.

[0116] In some embodiments, the elastic modulus of the spring ranges from 4000 N / m to 40000 N / m.

[0117] In some embodiments, when the first end of the ring-taking member 230 is located between the ancient ring 300 and the film 400, the second end face of the ring-taking member 230 has a third included angle with the top surface of the ancient ring 300, and the range of the third included angle can be 0 degrees to 30 degrees. For example, the third included angle can be 0 degrees.

[0118] In some embodiments, the ring retrieval system may further include a controller (not shown).

[0119] Specifically, the controller is electrically connected to the drive component and is adapted to control the first adjustment component to drive the ring-taking component 230 along the first direction.

[0120] In some embodiments, the controller may include at least one of an integrated circuit with processing capabilities, or a processor. For example, the processor may be a central processing unit (CPU), a microprocessor, or a field-programmable gate array (FPGA).

[0121] It is understood that in the description of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0122] It is understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0123] It is understood that, in this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0124] It is understood that, in this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0125] Understandably, when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component.

[0126] It is understandable that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0127] It is understood that the foregoing description of multiple embodiments provided by this disclosure allows for the combination and cross-referencing of various optional methods described in each embodiment without conflict, thereby extending to various possible embodiments. These can all be considered as embodiments disclosed in this disclosure. Although the embodiments of this disclosure are as described above, this disclosure is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A ring-taking system, characterized in that, include: A stage suitable for placing a wafer, wherein the wafer includes: a wafer body and an archipelago ring, and one side of the wafer has a thin film; Ring-removing fixture, the ring-removing fixture comprising: A ring-taking device, wherein when the first end of the ring-taking device reaches the outer edge of the wafer body, the first end face of the ring-taking device has a first gap between the first end of the ring-taking device and the thin film on one side of the wafer body, wherein the first gap is greater than the thickness of the outer edge of the wafer body; A first adjustment component is used to drive the ring-taking member to move along a first direction, wherein the first direction is the radial direction of the stage; A second adjustment component, one end of which is connected to the first adjustment component and the other end of which is connected to the ring-taking member, wherein the ring-taking member is adapted to move along a second direction via the second adjustment component, wherein the second direction is the axial direction of the platform; The second adjustment component includes: A sliding member, wherein the sliding member is slidably engaged with the guide groove of the first adjusting component; A guide rod, the first end of which is disposed inside the sliding member and is adapted to move relative to the sliding member in the second direction, and the second end of which is connected to the ring-taking member; An elastic element is sleeved on the guide rod and clamped in a compressed state between the sliding element and the ring-taking element; The main body is connected to the first adjustment component and is used to drive the ring-taking component to rotate.

2. The ring-retrieving system according to claim 1, characterized in that, The first adjustment component includes: A first support is fixed to the main body and extends radially along the platform. A driving component, one end of which is connected to the first bracket and the other end of which is connected to the second adjustment component, is used to drive the second adjustment component to move along the first direction.

3. The ring-taking system according to claim 2, characterized in that, The first support has: A guide groove extends along the first direction, and the second adjustment component slides in conjunction with the guide groove.

4. The ring-retrieving system according to claim 1, characterized in that, The guide rod has: A limiting part, wherein the limiting part is located at the first end of the guide rod; The slider has: A receiving cavity, the receiving cavity being adapted to receive the limiting portion; A guide hole is provided, which communicates with the receiving cavity. The guide hole is located on the side of the slider away from the first adjusting component and extends along the second direction.

5. The ring-retrieving system according to claim 1, characterized in that, The slider has: A sliding part is located within the guide groove and slides in cooperation with the guide groove along the first direction.

6. The ring-taking system according to claim 1, characterized in that, The thickness of the ring-taking member gradually increases from the first end to the second end.

7. The ring-taking system according to claim 1, characterized in that, When the first end of the ring-taking member is located between the ancient ring and the film, the first end face of the ring-taking member and the film have a first included angle, the first included angle being in the range of 1 degree to 30 degrees.

8. The ring-taking system according to claim 1, characterized in that, The number of the first adjustment components is multiple, and the multiple first adjustment components are arranged in a circumferential array around the main body.

9. The ring-taking system according to claim 1, characterized in that, Also includes: A controller, electrically connected to the drive component, is adapted to control the first adjustment component to drive the ring-taking component along the first direction.

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