Camera module and electronic equipment
By designing lenses with different working wavelengths and filters and lens structures with non-overlapping projections in the camera module, the problem of large thickness of the existing camera module is solved, and the thickness reduction of the camera module and electronic equipment is achieved.
Patent Information
- Application Number
- CN202311207015.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-18
- Publication Date
- 2025-03-18
AI Technical Summary
The existing camera modules are relatively large in thickness, which makes it impossible for electronic devices to effectively reduce their thickness, limiting the thinning development of electronic devices.
A camera module is designed, including a circuit board, a sensor, multiple filters and multiple lenses. The working wavelengths of the lens are different, and the projection of the filter and the lens does not overlap. This structure reduces the thickness of the camera module.
The thickness of the camera module is effectively reduced, thereby further reducing the thickness of electronic equipment, in line with the development trend of electronic equipment thinning.
Smart Images

Figure CN119653211A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of cameras, and in particular to a camera module and an electronic device. Background Art
[0002] As a photo-taking tool and data entry point for smart terminals, camera modules are widely used in various electronic devices. Existing camera modules use multiple lenses to converge light and eliminate aberrations, which makes the camera modules thicker and prevents the thickness of electronic devices from being reduced, which is not conducive to the trend of electronic devices becoming thinner and thinner. Summary of the invention
[0003] The present application provides a camera module and an electronic device with reduced thickness.
[0004] The present application provides a camera module, including a circuit board, a sensor, a plurality of filters and a plurality of lenses, wherein the sensor is located above the circuit board along a first direction and coupled to the circuit board, the plurality of filters are located above the sensor along the first direction, the plurality of lenses are respectively located above the plurality of filters along the first direction, the projections of the plurality of filters on the circuit board do not overlap, the projections of the plurality of lenses on the circuit board do not overlap, and the plurality of lenses have different working wavelengths.
[0005] Furthermore, the plurality of lenses include a first lens, a second lens and a third lens, the working wavelength of the first lens is greater than or equal to 400nm and less than or equal to 500nm, the working wavelength of the second lens is greater than or equal to 500nm and less than or equal to 600nm, and the working wavelength of the third lens is greater than or equal to 600nm and less than or equal to 700nm.
[0006] Furthermore, the lens includes a transparent substrate, a shading layer arranged on a first surface of the substrate, and a lens array structure arranged on an opposite second surface of the substrate, the shading layer surrounds a light-transmitting hole to allow light to pass through, and the center of the light-transmitting hole coincides with the center of the lens array structure.
[0007] Furthermore, the lens array structure comprises a plurality of lens units arranged in an array, and the cross-section of the lens unit is 90 degrees centrally symmetrical.
[0008] Furthermore, the distance between two adjacent lens units is greater than or equal to 100nm and less than or equal to 400nm, and / or the height of the lens unit is greater than or equal to 100nm and less than or equal to 600nm, and / or the diameter of the lens unit is greater than or equal to 50nm and less than or equal to 350nm.
[0009] Furthermore, the diameter of the light-transmitting hole is greater than or equal to 0.2 mm and less than or equal to 0.8 mm, and / or the thickness of the lens is greater than or equal to 0.5 mm and less than or equal to 1.5 mm, and / or the diameter of the lens array structure is greater than or equal to 0.8 mm and less than or equal to 2 mm.
[0010] Furthermore, the camera module includes a first spacer and a second spacer, the first spacer is located between the filter and the circuit board, the first spacer is provided with a first through hole for light to pass through, and the second spacer is located between the filter and the lens, the second spacer is provided with a second through hole for light to pass through.
[0011] Further, the camera module includes a fixing part, which is fixed to the circuit board, and the sensor, the filter, the lens, the first spacer and the second spacer are located in the space enclosed by the fixing part and the circuit board. The fixing part includes a side wall, and the side wall is provided with a plurality of through holes. The plurality of through holes are respectively arranged in a one-to-one correspondence with the plurality of light-transmitting holes to allow light to pass through. The projection of the light-transmitting hole on the side wall is located within the range of the through hole, and the diameter of the through hole is greater than or equal to the diameter of the light-transmitting hole.
[0012] Furthermore, the camera module also includes an ultra-wide-angle lens, a telephoto lens and a flash.
[0013] An embodiment of the present application also provides an electronic device, comprising the above-mentioned camera module.
[0014] The camera module of the embodiment of the present application includes a circuit board, a sensor, multiple filters and multiple lenses. The filter is located above the sensor along a first direction, and the multiple lenses are respectively located above the multiple filters along the first direction. The projections of the multiple filters on the circuit board do not overlap, and the projections of the multiple lenses on the circuit board do not overlap, thereby reducing the thickness of the camera module and further reducing the thickness of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 is a schematic diagram of a camera module according to an embodiment of the present application;
[0016] Figure 2 yes Figure 1 A cross-sectional view of the camera module shown;
[0017] Figure 3 yes Figure 1 An exploded view of the camera module shown;
[0018] Figure 4 yes Figure 3 A schematic diagram of a lens of the camera module shown;
[0019] Figure 5 yes Figure 4 A schematic diagram of another viewing angle of the lens shown;
[0020] Figure 6 yes Figure 1 The optical path diagram of the camera module when imaging is shown;
[0021] Figure 7 yes Figure 1 Phase distribution diagram of the lens of the camera module shown;
[0022] Figure 8 is the MTF characteristic curve of the first lens;
[0023] Fig. 9 is the MTF characteristic curve of the second lens;
[0024] Fig.10 is the MTF characteristic curve of the third lens;
[0025] Fig.11 is a schematic diagram of an electronic device according to an embodiment of the present application;
[0026] Fig.12 yes Fig.11 A cross-sectional schematic diagram of an electronic device is shown. DETAILED DESCRIPTION
[0027] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices consistent with some aspects of the present application as detailed in the appended claims.
[0028] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The words "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one" or "one" do not indicate a quantitative limit, but indicate that there is at least one. "Multiple" or "several" means two or more. Unless otherwise specified, words such as "front", "rear", "lower" and / or "upper" are only for the convenience of explanation and are not limited to one position or one spatial orientation. Words such as "include" or "comprise" mean that the elements or objects appearing in front of "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect. The singular forms "a", "said" and "the" used in this specification and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more of the associated listed items.
[0029] The camera module 1 of the embodiment of the present application can be applied to any electronic device, such as a mobile phone, a tablet, or a wearable device.
[0030] See also Figures 1 to 3 As shown, the camera module 1 includes a circuit board 11, a sensor 12, a plurality of filters 13 and a plurality of lenses 14. The sensor 12 is located above the circuit board 11 along a first direction and coupled to the circuit board 11 to transmit signals. The plurality of filters 13 are located above the sensor 12 along the first direction. The plurality of lenses 14 are respectively located above the plurality of filters 13 along the first direction. The projections of the plurality of filters 13 on the circuit board 11 do not overlap, and the projections of the plurality of lenses 14 on the circuit board 11 do not overlap. The plurality of lenses 14 have different working wavelengths.
[0031] When the camera module 1 takes a picture, multiple lenses 14 respectively image the red component R, green component G, and blue component B in the color scene. After the sensor 12 receives the signal, it will be transmitted to the processor of the electronic device, and image fusion is performed using an algorithm, so that the electronic device outputs a color photo that is consistent with the original scene. Since the projections of the multiple filter elements 13 on the circuit board 11 do not overlap, and the projections of the multiple lenses 14 on the circuit board 11 do not overlap, the thickness of the camera module 1 is reduced. When the camera module 1 is applied to an electronic device, the thickness of the electronic device is further reduced, meeting the development trend of thinner and thinner electronic devices.
[0032] Optionally, considering that there is a certain positional offset among the multiple lenses 14, calibration needs to be done in advance, and then image processing will also be based on this calibration data to perform operations such as cropping and fusion to obtain a color image.
[0033] The multiple lenses 14 image separately, avoiding the influence of chromatic aberration. In addition, each of the multiple lenses 14 has a field of view angle of 80 degrees. Therefore, the finally obtained image is a full-color image with a field of view angle close to 80 degrees, overcoming the problems of small field of view angle and single wavelength of the existing super lens module. The camera module 1 in the embodiment of the present application realizes full-color and 80-degree large field of view imaging, and solves the problems of small field of view angle and single wavelength.
[0034] When the camera module 1 takes a picture of a color scene, the red, green, and blue lenses 14 will transmit the red component, green component, and blue component to the sensor 12 respectively.
[0035] Optionally, the multiple lenses 14 are arranged in a "pin" shape, and the multiple lenses 14 can also be arranged in a long strip shape, etc.
[0036] Optionally, the lens 14 can be a super lens.
[0037] Optionally, one or more sensors 12 can be provided. When the sensor 12 is set to one, the signals in the three imaging regions are extracted and processed respectively. When the sensor 12 is set to multiple, the multiple sensors 12 are arranged in one-to-one correspondence with the multiple lenses 14.
[0038] The multiple lenses 14 include a first lens 141, a second lens 142 and a third lens 143. The working wavelength of the first lens 141 is greater than 400nm and less than or equal to 500nm, the working wavelength of the second lens 142 is greater than or equal to 500nm and less than or equal to 600nm, and the working wavelength of the third lens 143 is greater than or equal to 600nm and less than or equal to 700nm. Optionally, the working wavelength of the first lens 141 is 473nm, the working wavelength of the second lens 142 is 550nm, and the working wavelength of the third lens 143 is 650nm. The first lens 141 is used to receive red, the second lens 142 is used to receive green, and the third lens 143 is used to receive blue. Finally, the full-color photo is output through algorithm fusion.
[0039] Optionally, the plurality of lenses 14 further include a fourth lens (not shown) and a fourth filter (not shown). The working wavelength of the fourth lens is greater than or equal to 580 nm and less than or equal to 600 nm, so as to receive yellow, provide additional information in the later fusion, and enhance the image quality. The present application does not limit the number of the lenses 14, and it can be adjusted according to actual needs.
[0040] Optionally, the fourth lens may be replaced by an infrared lens to provide additional information and enhance image quality during later fusion. The infrared lens may be an infrared super lens.
[0041] The camera module 1 includes a first spacer 15 and a second spacer 16. The first spacer 15 is located between the filter 13 and the circuit board 11. The first spacer 15 is provided with a first through hole 151 for light to pass through. The second spacer 16 is located between the filter 13 and the lens 14. The second spacer 16 is provided with a second through hole 161 for light to pass through.
[0042] The distances between the lens 14 and the optical filter 13 and between the optical filter 13 and the sensor 12 can be adjusted by adjusting the heights of the first spacer 15 and the second spacer 16 .
[0043] Optionally, the camera module 1 includes a plurality of first spacers 15 and a plurality of second spacers 16. The number of the first spacers 15, the second spacers 16 and the lenses 14 is the same.
[0044] The camera module 1 includes a fixing member 17. The fixing member 17 is fixed to the circuit board 11, for example, by gluing or welding. The sensor 12, the filter 13, the lens 14, the first spacer 15 and the second spacer 16 are located in a space surrounded by the fixing member 17 and the circuit board 11. The fixing member 17 includes a side wall 171. The side wall 171 is provided with a plurality of through holes 1711 for light to pass through.
[0045] The camera module 1 of the embodiment of the present application has a simple structure, can effectively improve the yield rate, and reduce the assembly cost.
[0046] The fixing member 17 is provided with a plurality of independent receiving cavities 172. The plurality of through holes 1711 are respectively arranged in one-to-one correspondence with the plurality of receiving cavities 172. One first spacer 15, one filter 13, one second spacer 16 and one lens 14 are sequentially stacked and received in one receiving cavity 172. One sensor 12 is located in the space surrounded by one second spacer 16.
[0047] The receiving cavity 172 includes a first receiving cavity 1721 and a second receiving cavity 1722. The width of the first receiving cavity 1721 is smaller than the width of the second receiving cavity 1722. The lens 14 and the second spacer 16 are received in the first receiving cavity 1721, and the filter 13 and the first spacer 15 are received in the second receiving cavity 1722. The first spacer 15 is crimped to the circuit board 11, the filter 13 is crimped to the first spacer 15, the fixing member 17 and the second spacer 16 are crimped to the filter 13, the lens 14 is crimped to the second spacer 16, and the side wall 171 is crimped to the lens 14, so as to improve the stability of the camera module 1.
[0048] The distance between the lens 14 and the sensor 12 is greater than or equal to 0.5 mm and less than or equal to 1 mm, and / or the focal length EFL of the lens 14 is greater than or equal to 0.5 mm and less than or equal to 1 mm, and / or the F number F.NO. of the lens 14 is greater than or equal to 1.7 and less than or equal to 2.2. Optionally, the distance between the lens 14 and the sensor 12 is 0.803 mm.
[0049] The viewing angle of the lens 14 is greater than or equal to 50 degrees and less than or equal to 100 degrees. Optionally, the viewing angle of the lens 14 is 80 degrees.
[0050] See also Figures 3 to 5As shown, the lens 14 includes a transparent substrate 144, a light shielding layer 145 disposed on a first surface of the substrate 144, and a lens array structure 146 disposed on a second surface opposite to the substrate 144. The light shielding layer 145 surrounds a light-transmitting hole 1451 to allow light to pass through. The center of the light-transmitting hole 1451 coincides with the center of the lens array structure 146.
[0051] Optionally, the lens array structure 146 is formed by etching on the substrate 144 .
[0052] See also Figure 6 As shown, the object emits light with a field of view angle of 80 degrees, which enters the substrate 144 after passing through the light-transmitting hole 1451, and then passes through the array structure 146. The array structure 146 converges the light, and reaches the sensor 12 for imaging after passing through the filter 13.
[0053] See also Figure 1 to Figure 2 As shown, the plurality of through holes 1711 are respectively arranged in one-to-one correspondence with the plurality of light-transmitting holes 1451. The projection of the light-transmitting holes 1451 on the side wall 171 is located within the range of the through holes 1711. The diameter of the through holes 1711 is greater than or equal to the diameter of the light-transmitting holes 1451, ensuring that light can be irradiated to the light-transmitting holes 1451.
[0054] Optionally, the center of the through hole 1711 coincides with the center of the light-transmitting hole 1451 .
[0055] The substrate 144 may be made of glass, etc. The light shielding layer 145 may be a metal layer, such as a gold-plated layer.
[0056] See also Figure 3 to Figure 4 As shown, the lens array structure 146 includes a plurality of lens units 1461 arranged in an array. The cross section of the lens unit 1461 is 90 degrees centrally symmetrical, for example, it can be circular, square, cross-shaped, etc.
[0057] The distance between two adjacent lens units 1461 is greater than or equal to 100 nm and less than or equal to 400 nm, and / or the height of the lens unit 1461 is greater than or equal to 100 nm and less than or equal to 600 nm, and / or the diameter of the lens unit 1461 is greater than or equal to 50 nm and less than or equal to 350 nm. Optionally, the distance between two adjacent lens units 1461 is 400 nm. Optionally, the height of the lens unit 1461 is 500 nm.
[0058] The lens unit 1461 may be made of semiconductor materials such as silicon, gallium nitride, titanium oxide, silicon nitride, etc., for example, may be made of amorphous silicon.
[0059] The diameter of the light-transmitting hole 1451 is greater than or equal to 0.2 mm and less than or equal to 0.8 mm, and / or the thickness of the lens 14 is greater than or equal to 0.5 mm and less than or equal to 1.5 mm, and / or the diameter of the lens array structure 146 is greater than or equal to 0.8 nm and less than or equal to 2 nm. Optionally, the diameter of the light-transmitting hole 1451 is 0.4 mm. Optionally, the diameter of the lens array structure 146 is equal to 1.33 mm.
[0060] In one embodiment, the thickness of the lens 14 is 1 mm, the thickness of the filter 13 is 0.21 mm, the distance between the lens 14 and the filter 13 is 0.32 mm, and the distance between the filter 13 and the sensor 12 is 0.28 mm.
[0061] The phase distribution of the lens 14 is expressed by formula (1).
[0062]
[0063] In formula (1), A1-A5 are five coefficient variables, and ρ is the normalized radius. ρ is expressed by formula (2).
[0064]
[0065] In formula (2), r is the distance between the lens unit 1461 on the lens 14 and the center of the lens array structure 146 , and R0 is the radius of the lens array structure 146 .
[0066] The value of r can be designed according to the phase distribution formula.
[0067] In one embodiment, the phase coefficients of the first lens 141, the second lens 142, and the third lens 143 are as follows:
[0068] <![CDATA[A1]]> <![CDATA[A2]]> <![CDATA[A3]]> <![CDATA[A4]]> <![CDATA[A5]]> red -2907 27 -72 81 -32 green -3426 32 -86 97 -39 blue -3960 38 -101 114 -46
[0069] The phase diagram of the first lens 141, the second lens 142 and the third lens 143 is shown in FIG. Figure 7 shown.
[0070] Taking the focal length EFL=0.74 mm and the F number F.NO.=1.86 as an example, the MTF characteristic curve of the first lens 141 is shown in Figure 8 As shown; the MTF characteristic curve of the second lens 142 is shown in Fig. 9 As shown; the MTF characteristic curve of the third lens 143 is shown in Fig.10 As shown, it can be seen that in each field of view from 0 degrees to 80 degrees, an effect close to the diffraction limit is achieved.
[0071] The length and width of the fixing member 17 are greater than or equal to 4 mm and less than or equal to 8 mm, and the height of the fixing member 17 is greater than or equal to 1.8 mm and less than or equal to 2.8 mm. In one embodiment, the length and width of the fixing member 17 are 6.4 mm, respectively, and the height is 2.35 mm. The camera module 1 is relatively thin, see Figure 11 to Figure 12 As shown, the outer surface of the camera module 1 is flush with the outer surface of the electronic device to reduce the thickness of the electronic device. At the same time, the problem of the camera module 1 protruding and affecting the user experience and aesthetics is solved.
[0072] The camera module 1 further includes an ultra-wide-angle lens 181, a telephoto lens 182 and a flash 183. The camera module 1 can be used as a rear lens of an electronic device.
[0073] The above is only a preferred implementation mode of the present application, and does not constitute any form of limitation to the present application. Although the present application has been disclosed as a preferred implementation mode as above, it is not used to limit the present application. Any technician familiar with this profession can make some changes or modify the technical contents disclosed above into equivalent implementation modes without departing from the scope of the technical solution of the present application. However, any simple modification, equivalent change and modification made to the above implementation modes based on the technical essence of the present application without departing from the content of the technical solution of the present application still fall within the scope of the technical solution of the present application.
Claims
1. A camera module, characterized in that: include: A circuit board, a sensor, a plurality of filters and a plurality of lenses, wherein the sensor is located above the circuit board along a first direction and coupled to the circuit board, the plurality of filters are located above the sensor along the first direction, the plurality of lenses are respectively located above the plurality of filters along the first direction, the projections of the plurality of filters on the circuit board do not overlap, the projections of the plurality of lenses on the circuit board do not overlap, and the plurality of lenses have different working wavelengths.
2. The camera module according to claim 1, characterized in that: The multiple lenses include a first lens, a second lens and a third lens. The working wavelength of the first lens is greater than or equal to 400nm and less than or equal to 500nm, the working wavelength of the second lens is greater than or equal to 500nm and less than or equal to 600nm, and the working wavelength of the third lens is greater than or equal to 600nm and less than or equal to 700nm.
3. The camera module according to claim 1, characterized in that: The lens includes a transparent substrate, a light-shielding layer disposed on a first surface of the substrate, and a lens array structure disposed on an opposite second surface of the substrate. The light-shielding layer forms a light-transmitting hole to allow light to pass through, and the center of the light-transmitting hole coincides with the center of the lens array structure.
4. The camera module according to claim 3, characterized in that: The lens array structure comprises a plurality of lens units arranged in an array, and the cross-section of the lens unit is 90 degrees centrally symmetrical.
5. The camera module according to claim 4, characterized in that: The distance between two adjacent lens units is greater than or equal to 100nm and less than or equal to 400nm, and / or the height of the lens unit is greater than or equal to 100nm and less than or equal to 600nm, and / or the diameter of the lens unit is greater than or equal to 50nm and less than or equal to 350nm.
6. The camera module according to claim 3, characterized in that: The diameter of the light-transmitting hole is greater than or equal to 0.2 mm and less than or equal to 0.8 mm, and / or the thickness of the lens is greater than or equal to 0.5 mm and less than or equal to 1.5 mm, and / or the diameter of the lens array structure is greater than or equal to 0.8 mm and less than or equal to 2 mm.
7. The camera module according to claim 3, characterized in that: The camera module includes a first spacer and a second spacer, the first spacer is located between the filter and the circuit board, and the first spacer is provided with a first through hole for light to pass through, the second spacer is located between the filter and the lens, and the second spacer is provided with a second through hole for light to pass through.
8. The camera module according to claim 7, characterized in that: The camera module includes a fixing part, which is fixed to the circuit board. The sensor, the filter, the lens, the first spacer and the second spacer are located in the space enclosed by the fixing part and the circuit board. The fixing part includes a side wall, which is provided with a plurality of through holes. The plurality of through holes are respectively arranged in a one-to-one correspondence with the plurality of light-transmitting holes to allow light to pass through. The projection of the light-transmitting hole on the side wall is located within the range of the through hole, and the diameter of the through hole is greater than or equal to the diameter of the light-transmitting hole.
9. The camera module according to any one of claims 1 to 8, characterized in that: The camera module also includes an ultra-wide-angle lens, a telephoto lens and a flash.
10. An electronic device, characterized in that: Comprising the camera module as claimed in any one of claims 1 to 9.
Citation Information
Patent Citations
Camera module
CN101500097A
Metasurface lens imaging device and method
CN111897137A
Camera module
CN1918903A
Imaging module and electronic equipment
CN216356952U
Capturing and processing of images using monolithic camera array with heterogeneous imagers
US20110080487A1