Photosensitive element module, camera module and electronic device

Abstract

A photosensitive element module, a camera module and an electronic device are provided, the photosensitive element module includes a photosensitive surface, a filter element facing the photosensitive surface, and a first anti-reflection microstructure disposed on the photosensitive surface. The light filtering element comprises a substrate, an optical deposition layer structure and an optical coating, the optical deposition layer structure is arranged on one side of the substrate far away from the light sensing surface, and the optical coating and the optical deposition layer structure are oppositely arranged on one side of the substrate facing the light sensing surface. And the optical deposition layer structure comprises a plurality of layers. An air layer is formed between the first anti-reflection microstructure and the light filtering element, and the first anti-reflection microstructure and the air layer are partially overlapped in the direction perpendicular to the light sensing face. Therefore, the imaging quality of night shooting can be improved.

Description

Technical Field

[0001] The present disclosure relates to a photosensitive element module and a camera module, and in particular to a photosensitive element module and a camera module applied to a portable electronic device. Background Art

[0002] In recent years, portable electronic devices have developed rapidly, such as smart electronic devices and tablet computers, which have been prevalent in modern people's lives, and camera modules and photosensitive element modules installed on portable electronic devices have also developed rapidly. Specifically, the photosensitive element module has high penetration of visible light and has the property of blocking invisible light to improve the optical quality.

[0003] Furthermore, the existing photosensitive element module combines a variety of coating layers to give the filter element in the photosensitive element module more functions in order to improve the optical quality, but this causes a serious decrease in the transmittance of the filter element. Therefore, with the increasing requirements for night photography, the development of a photosensitive element module with high transmittance has become an important demand in the industry. Summary of the invention

[0004] The present disclosure provides a photosensitive element module, a camera module and an electronic device, which use a new coating configuration to improve the light collection efficiency of the photosensitive element module and reduce the glare, thereby improving the imaging quality of night shots.

[0005] According to one embodiment of the present disclosure, a photosensitive element module is provided, which includes a photosensitive surface, a filter element and a first anti-reflective microstructure, wherein the filter element faces the photosensitive surface, and the first anti-reflective microstructure is arranged on the photosensitive surface. The filter element includes a substrate, an optical deposition layer structure and an optical coating, wherein the optical deposition layer structure is arranged on a side of the substrate away from the photosensitive surface, and the optical coating and the optical deposition layer structure are arranged on a side of the substrate facing the photosensitive surface opposite to each other. The optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10. The number of layers of the optical coating includes one, and the thickness of the optical coating is between 900nm and 5μm. An air layer is formed between the first anti-reflective microstructure and the filter element, and the first anti-reflective microstructure and the air layer partially overlap in a direction perpendicular to the photosensitive surface. The transmittance of the filter element to light with a wavelength of 450nm to 550nm is greater than or equal to 80%; the transmittance of the filter element is 50% and a first wavelength greater than 550nm is T50; the reflectivity of the first anti-reflective microstructure to 450nm to the first wavelength T50 is less than or equal to 0.93%, which meets the following conditions: 600nm≤T50≤720nm.

[0006] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflectivity of the first anti-reflection microstructure at 450 nm to the first wavelength T50 may be less than or equal to 0.48%.

[0007] According to the photosensitive element module of the embodiment described in the previous paragraph, the filter element may further include a second anti-reflective microstructure, which is arranged on the side of the optical coating away from the optical deposition layer structure and partially overlaps with the air layer in the direction perpendicular to the photosensitive surface, and the average reflectivity of the second anti-reflective microstructure from 450nm to the first wavelength T50 may be less than 0.93%.

[0008] The photosensitive element module according to the embodiment described in the previous paragraph may further include a light shielding film layer, wherein the light shielding film layer is disposed between the optical coating layer and the first anti-reflection microstructure.

[0009] According to the photosensitive element module of the embodiment described in the previous paragraph, the filter element may further include an isolation layer, and the isolation layer is disposed between the optical coating layer and the air layer.

[0010] According to the photosensitive element module of the embodiment described in the previous paragraph, the substrate may include a side surface, the side surface extends along the direction of the optical deposition layer structure toward the optical coating, and the optical coating is not disposed on the side surface.

[0011] The photosensitive element module according to the embodiment described in the previous paragraph may further include an electronic photosensitive element, which forms a photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a portion of the non-photosensitive surface.

[0012] The photosensitive element module according to the embodiment described in the preceding paragraph may further include an electronic photosensitive element and a molded body. The electronic photosensitive element forms a photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface. The molded body is molded on the electronic photosensitive element, and the molded body may include an inner side surface, and the inner side surface faces the center of the photosensitive surface, wherein the inner side surface extends from the non-photosensitive surface in a direction away from the photosensitive surface, and the first anti-reflection microstructure is disposed on at least a portion of the inner side surface.

[0013] According to the photosensitive element module of the embodiment described in the previous paragraph, the photosensitive element module may include a mounting position and a filter element holder. The filter element holder is disposed at the mounting position, wherein the filter element holder supports the filter element, and the first anti-reflection microstructure is disposed at least a portion of the mounting position.

[0014] According to the photosensitive element module of the embodiment described in the previous paragraph, the substrate can be a red light absorbing glass.

[0015] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflectivity of the optical deposition layer structure to light with a wavelength of 450nm to 550nm can be less than or equal to 10%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which can meet the following conditions: 600nm≤R50≤720nm; and R50≥T50.

[0016] According to the photosensitive element module of the embodiment described in the previous paragraph, the transmittance of the filter element is 50% and a second wavelength less than 450nm is T50-B, the second wavelength is in the wavelength range of 400nm to 450nm, and the reflectivity of the first anti-reflective microstructure from the second wavelength T50-B to the first wavelength T50 can be less than or equal to 0.93%.

[0017] According to the photosensitive element module of the above-mentioned embodiment, the optical coating layer can be an organic material layer.

[0018] According to an embodiment of the present disclosure, a camera module is provided, comprising an imaging lens and a photosensitive element module as described in the above embodiment, wherein the photosensitive element module is disposed on the image side of the imaging lens.

[0019] According to an embodiment of the present disclosure, an electronic device is provided, including a camera module as described in the above embodiment.

[0020] According to one embodiment of the present disclosure, a photosensitive element module is provided, which includes a photosensitive surface, a filter element, an air layer and an anti-reflective microstructure, wherein the filter element faces the photosensitive surface. The filter element includes a substrate, an optical deposition layer structure and an optical coating, wherein the optical deposition layer structure is disposed on a side of the substrate away from the photosensitive surface, and the optical coating and the optical deposition layer structure are disposed opposite to each other on a side of the substrate facing the photosensitive surface. The optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10. The number of layers of the optical coating includes one, and the thickness of the optical coating is between 900nm and 5μm. The air layer is formed between the optical coating and the photosensitive surface. The anti-reflective microstructure is adjacent to the air layer and partially overlaps with the air layer in a direction perpendicular to the photosensitive surface. The transmittance of the filter element to light with a wavelength of 450nm to 550nm is greater than or equal to 80%; the transmittance of the filter element is 50% and a first wavelength greater than 550nm is T50; the reflectivity of the anti-reflective microstructure to 450nm to the first wavelength T50 is less than or equal to 0.93%, which meets the following conditions: 600nm≤T50≤720nm.

[0021] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflectivity of the anti-reflection microstructure at 450nm to the first wavelength T50 can be less than or equal to 0.48%.

[0022] The photosensitive element module according to the embodiment described in the previous paragraph may further include a light-shielding film layer, wherein the light-shielding film layer is disposed between the optical coating and the anti-reflection microstructure.

[0023] According to the photosensitive element module of the embodiment described in the previous paragraph, the substrate may include a side surface, the side surface extends along the thickness direction of the substrate, and the optical coating is not disposed on the side surface.

[0024] The photosensitive element module according to the embodiment described in the previous paragraph may further include a filter element holder, wherein the filter element holder and the anti-reflection microstructure at least partially overlap on a projection parallel to the photosensitive surface, and the filter element is disposed on the filter element holder.

[0025] According to the photosensitive element module of the embodiment described in the previous paragraph, the substrate can be a red light absorbing glass.

[0026] According to the photosensitive element module of the embodiment described in the previous paragraph, the reflectivity of the optical deposition layer structure to light with a wavelength of 450nm to 550nm can be less than or equal to 10%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which can meet the following conditions: 600nm≤R50≤720nm; and R50≥T50.

[0027] According to the photosensitive element module of the embodiment described in the previous paragraph, the transmittance of the filter element is 50% and a second wavelength less than 450nm is T50-B, the second wavelength is in the wavelength range of 400nm to 450nm, and the reflectivity of the anti-reflective microstructure from the second wavelength T50-B to the first wavelength T50 can be less than or equal to 0.93%.

[0028] According to the photosensitive element module of the above-mentioned embodiment, the optical coating layer can be an organic material layer.

[0029] According to the photosensitive element module of the embodiment described in the previous paragraph, the filter element may further include an isolation layer, which is disposed between the optical coating and the anti-reflection microstructure, and the isolation layer may be a multi-layer film.

[0030] According to the photosensitive element module of the embodiment described in the previous paragraph, the transmittance of the filter element to light with a wavelength of 450nm to 550nm can be greater than or equal to 84%; the maximum transmittance of the filter element to light with a wavelength of 450nm to 550nm can be greater than or equal to 88%; the reflectivity of the anti-reflective microstructure to 400nm to 750nm can be less than or equal to 0.25%; the reflectivity of the optical deposition layer structure to light with a wavelength of 450nm to 550nm can be less than or equal to 5%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which can meet the following conditions: 600nm≤T50≤700nm; 650nm≤R50≤720nm; and R50-T50≥3nm.

[0031] According to an embodiment of the present disclosure, a camera module is provided, comprising an imaging lens and a photosensitive element module as described in the above embodiment, wherein the photosensitive element module is disposed on the image side of the imaging lens.

[0032] According to an embodiment of the present disclosure, an electronic device is provided, including a camera module as described in the above embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1A A schematic diagram illustrating a camera module according to a first embodiment of the present disclosure is shown;

[0034] Figure 1B Draw according to Figure 1A A cross-sectional schematic diagram of a camera module in a first embodiment;

[0035] Figure 1C Draw according to Figure 1A A schematic diagram of a photosensitive element module in a first example of a first implementation mode;

[0036] Figure 1D Draw according to Figure 1C A partial enlarged view of the photosensitive element module in the first embodiment of the first implementation mode;

[0037] Figure 1E Draw according to Figure 1C Data diagram of the photosensitive element module in the first embodiment of the first implementation mode;

[0038] Figure 1F Draw according to Figure 1A A schematic diagram of a photosensitive element module in a second embodiment of the first embodiment;

[0039] Figure 1G Draw according to Figure 1F A partial enlarged view of the photosensitive element module in the second embodiment of the first embodiment;

[0040] Figure 1H Draw according to Figure 1A A schematic diagram of a photosensitive element module in a third example of the first embodiment;

[0041] Fig. 1I Draw according to Figure 1A A schematic diagram of a photosensitive element module in a fourth example of the first embodiment;

[0042] Figure 1J Draw according to Figure 1A A schematic diagram of a photosensitive element module in a fifth embodiment of the first embodiment;

[0043] Figure 1K Draw according to Figure 1A A schematic diagram of a photosensitive element module in a sixth embodiment of the first embodiment;

[0044] Figure 1L Draw according to Figure 1A A schematic diagram of a photosensitive element module in a seventh embodiment of the first embodiment;

[0045] Figure 1M Draw according to Figure 1A Transmittance data diagram of the filter element in the first embodiment;

[0046] Figure 1N Draw according to Figure 1A Another transmittance data diagram of the filter element in the first embodiment;

[0047] Fig.1O Draw according to Figure 1A A reflectivity data diagram of the optical deposition layer structure in the first embodiment;

[0048] Figure 1P Draw according to Figure 1A A graph showing the reflectivity data of the anti-reflective microstructure in the first embodiment;

[0049] Figure 2A A schematic diagram of an electronic device according to a second embodiment of the present disclosure is shown;

[0050] Figure 2B Draw according to Figure 2A Another schematic diagram of the electronic device in the second embodiment;

[0051] Figure 3 A schematic diagram illustrating an electronic device installed on a drone according to a third embodiment of the present disclosure; and

[0052] Figure 4 A schematic diagram showing an electronic device installed in a car according to a fourth embodiment of the present disclosure is shown.

[0053]

Explanation of symbols

[0054] 10: Camera module

[0055] 11: Imaging lens

[0056] 12: Photosensitive element module

[0057] 13: Carrier board

[0058] 110a, 110b, 110c, 110d, 110e, 110f, 110g: electronic photosensitive element

[0059] 111a, 111b, 111c, 111d, 111e, 111f, 111g: Photosensitive surface

[0060] 112e, 112f: non-photosensitive surface

[0061] 120a, 120b, 120c, 120d, 120e, 120f, 120g: filter element

[0062] 121a, 121b, 121c, 121d, 121e, 121f, 121g: substrate

[0063] 122a, 122b, 122c, 122d, 122e, 122f, 122g: optical deposition layer structure

[0064] 123a,123b,123c,123d,123e,123f,123g: Optical coating

[0065] 124a, 124b, 124c, 124f, 124g: Isolation layer

[0066] 125a,125c,125f: Side

[0067] 130a, 130c, 130f, 130g: Anti-reflective microstructure

[0068] 131a,131b,131c,131d,131e,131f,131g: air layer

[0069] 141b, 141d, 141e: first anti-reflection microstructure

[0070] 142b, 142d, 142e: Second anti-reflection microstructure

[0071] 150c, 150d: light-shielding film layer

[0072] 160e, 160g: Molded body

[0073] 161e, 161g: inner side

[0074] 162f: Molded base

[0075] 171e,171f: Installation position

[0076] 172a, 172b, 172c, 172d, 172e, 172f: filter element bracket

[0077] 173e:Fixed element

[0078] 20: Electronic devices

[0079] 210: Image acquisition control interface

[0080] 211: Video playback button

[0081] 212: Camera module switch button

[0082] 213: Focus and photo button

[0083] 214: Integrated menu button

[0084] 215: Zoom control key

[0085] 221: Front camera module

[0086] 222: Wide-angle camera module

[0087] 223: Telephoto camera module

[0088] 224:Ultra-wide-angle camera module

[0089] 225: Macro camera module

[0090] 226:TOF module

[0091] 23: Tip light

[0092] 24: Circuit Board

[0093] 241: Connector

[0094] 242: Electronic components

[0095] 25: System on a Chip

[0096] 26: Focus assist element

[0097] 261: Light-emitting element

[0098] 30: Drones

[0099] 31a, 41a: Front camera module

[0100] 31b, 41b: Side camera module

[0101] 41c: Rear camera module

[0102] 40: Car

[0103] G: Colloid

[0104] OV: Overlapping Area

[0105] BL: Basal layer

[0106] L: Center optical path

[0107] I1, I2, I3, I4: External space information DETAILED DESCRIPTION

[0108] The present disclosure provides a photosensitive element module, which includes a photosensitive surface and a filter element. The filter element faces the photosensitive surface and includes a substrate, an optical deposition layer structure and an optical coating. The optical deposition layer structure is disposed on a side of the substrate away from the photosensitive surface, the optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10. The optical coating and the optical deposition layer structure are disposed oppositely on the side of the substrate facing the photosensitive surface, wherein the number of layers of the optical coating includes one, and the thickness of the optical coating is between 900nm and 5μm. The transmittance of the filter element to light with a wavelength of 450nm to 550nm is greater than or equal to 80%; the transmittance of the filter element is 50% and a first wavelength greater than 550nm is T50, which satisfies the following conditions: 600nm≤T50≤720nm.

[0109] Furthermore, the air layer is used to prevent thermal effects from affecting the life of the optical coating, and the photosensitive surface has a focusing array to improve the light collection efficiency of the photosensitive element.

[0110] Specifically, the number of layers of the optical deposition layer structure can be greater than or equal to 36, and can be greater than or equal to 72, wherein the optical deposition layer structure with a high number of layers can be a superposition of multiple sets of coatings, but is not limited thereto. Adjacent layers of the optical deposition layer structure have different compositions to provide different reflectivities.

[0111] The photosensitive element module may include an air layer and an anti-reflective microstructure, wherein the air layer is formed between the optical coating and the photosensitive surface, the anti-reflective microstructure is adjacent to the air layer, and the anti-reflective microstructure and the air layer partially overlap in a direction perpendicular to the photosensitive surface. The reflectivity of the anti-reflective microstructure from 450nm to the first wavelength T50 may be less than or equal to 0.93%. The reflectivity of the anti-reflective microstructure corresponds to the transmittance of the filter element, thereby reducing the loss on the photosensitive surface, and the anti-reflective microstructure is arranged on the surface of the focusing array of the photosensitive surface. Furthermore, the reflectivity of the anti-reflective microstructure from 450nm to the first wavelength T50 may be less than or equal to 0.48%.

[0112] Furthermore, the overlapping portion of the anti-reflection microstructure and the air layer in the direction perpendicular to the photosensitive surface can define an overlapping region, which allows light to gradually enter the photosensitive surface to improve light transmittance, wherein the thickness of the overlapping region can be between 50nm and 500nm, and can further be between 75nm and 250nm. The overlapping region can be in direct contact with the photosensitive surface, or there can be a substrate layer between the overlapping region and the photosensitive surface.

[0113] The transmittance of the filter element is 50% and a second wavelength less than 450nm is T50-B, the second wavelength is in the wavelength range of 400nm to 450nm, and the reflectivity of the anti-reflective microstructure from the second wavelength T50-B to the first wavelength T50 can be less than or equal to 0.93%.

[0114] Alternatively, the photosensitive element module may include a first anti-reflection microstructure, and the filter element may further include a second anti-reflection microstructure, wherein the first anti-reflection microstructure is disposed on the photosensitive surface, an air layer is formed between the first anti-reflection microstructure and the filter element, and the first anti-reflection microstructure and the air layer partially overlap in a direction perpendicular to the photosensitive surface; the second anti-reflection microstructure is disposed on a side of the optical coating away from the optical deposition layer structure, and partially overlaps with the air layer in a direction perpendicular to the photosensitive surface. The reflectivity of the first anti-reflection microstructure from 450nm to the first wavelength T50 may be less than or equal to 0.93%, and the average reflectivity of the second anti-reflection microstructure from 450nm to the first wavelength T50 may be less than 0.93%. Specifically, the reflectivity of the first anti-reflection microstructure corresponds to the transmittance of the filter element, thereby reducing the loss on the photosensitive surface, and further reducing the reflection of the filter element facing the photosensitive surface to further improve the transmittance. Furthermore, the reflectivity of the first anti-reflection microstructure from 450nm to the first wavelength T50 may be less than or equal to 0.48%.

[0115] The transmittance of the filter element is 50% and a second wavelength less than 450nm is T50-B, the second wavelength is in the wavelength range of 400nm to 450nm, and the reflectivity of the first anti-reflective microstructure from the second wavelength T50-B to the first wavelength T50 can be less than or equal to 0.93%.

[0116] The photosensitive element module may further include a light shielding film layer, wherein the light shielding film layer is disposed between the optical coating and the first anti-reflection microstructure or between the optical coating and the anti-reflection microstructure, thereby preventing glare from being generated by reflection on the surface of the light shielding film layer, thereby improving the optical quality.

[0117] The filter element may further include an isolation layer, wherein the isolation layer is disposed between the optical coating and the air layer or between the optical coating and the anti-reflection microstructure. This can improve the adhesion of the anti-reflection microstructure and the chemical stability of the optical coating to improve and ensure the yield. Specifically, the isolation layer can be a metal oxide layer, and can be a single layer or include multiple layers.

[0118] The substrate may include a side surface, wherein the side surface extends along the direction of the optical deposition layer structure toward the optical coating or the thickness direction of the substrate, and the optical coating is not disposed on the side surface, thereby avoiding uneven coating of the optical coating to ensure optical quality.

[0119] The photosensitive element module may further include an electronic photosensitive element, wherein the electronic photosensitive element forms a photosensitive surface and a non-photosensitive surface, the photosensitive surface is used to receive light passing through the filter element, the non-photosensitive surface is adjacent to the periphery of the photosensitive surface, and the first anti-reflective microstructure is disposed on at least a portion of the non-photosensitive surface. In this way, the optical quality affected by the structural defects at the edge of the first anti-reflective microstructure can be reduced to ensure the peripheral optical quality. Specifically, the non-photosensitive surface may include a plurality of contacts, which may be electrically connected to the circuit through the contacts.

[0120] The photosensitive element module may further include a molded body, wherein the molded body is molded on the electronic photosensitive element, and the molded body may include an inner side surface. The inner side surface faces the center of the photosensitive surface, the inner side surface extends from the non-photosensitive surface to a direction away from the photosensitive surface, and the first anti-reflective microstructure is disposed on at least a portion of the inner side surface. Thereby, the possibility of glare generated by the molded body can be reduced. Specifically, the molded body and the electronic photosensitive element can be integrally molded by embedded injection molding.

[0121] The photosensitive element module may further include a mounting position and a filter element bracket, wherein the filter element bracket is disposed at the mounting position, the filter element bracket supports the filter element, and the first anti-reflection microstructure is disposed at least in a portion of the mounting position. By further extending the first anti-reflection microstructure to the mounting position of the filter element bracket, glare caused by reflection of light through the internal structure can be avoided, thereby further optimizing the optical quality.

[0122] Furthermore, the filter element holder and the anti-reflection microstructure at least partially overlap on a projection parallel to the photosensitive surface, and the filter element is disposed on the filter element holder. Specifically, the anti-reflection microstructure further partially overlaps with the filter element, which can avoid glare caused by reflection of light through the internal structure, thereby further optimizing the optical quality.

[0123] The substrate may be a red light absorbing glass. The red light absorbing glass can absorb part of the red light to match the photosensitive characteristics of the photosensitive element, thereby improving the optical quality. Specifically, the red light absorbing glass appears blue or blue-green due to its absorption of red light, and the infrared light absorbing glass may be blue glass, but is not limited thereto.

[0124] The optical coating may be an organic material layer. This can reduce the thermal degradation of the optical deposition layer structure during the process of setting the optical coating, thereby increasing the life of the filter element. Specifically, the process of the optical coating may include spin coating, photocuring, thermal curing, etc., but is not limited thereto.

[0125] The reflectivity of the optical deposition layer structure to light with a wavelength of 450nm to 550nm can be less than or equal to 10%. The reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which can meet the following conditions: 600nm≤R50≤720nm; and R50≥T50. In this way, the transmittance of the filter element corresponds to the reflectivity of the optical deposition layer structure to reduce the occurrence of glare.

[0126] The transmittance of the filter element to the light of wavelength 450nm to 550nm can be greater than or equal to 84%; the maximum transmittance of the filter element to the light of wavelength 450nm to 550nm can be greater than or equal to 88%; the reflectance of the anti-reflection microstructure to the light of wavelength 400nm to 750nm can be less than or equal to 0.25%; the reflectance of the optical deposition layer structure to the light of wavelength 450nm to 550nm can be less than or equal to 5%; the reflectance of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which can meet the following conditions: 600nm≤T50≤700nm; 650nm≤R50≤720nm; and R50-T50≥3nm. In this way, under the premise that the optical coating must exist, the transmittance can be further improved and the probability of glare generation can be reduced.

[0127] The various technical features of the photosensitive element module disclosed above can be configured in combination to achieve corresponding effects.

[0128] The present disclosure provides a camera module, comprising an imaging lens and the aforementioned photosensitive element module, wherein the photosensitive element module is disposed on the image side of the imaging lens.

[0129] The present disclosure provides an electronic device including the aforementioned camera module.

[0130] According to the above-mentioned implementation modes, specific implementation modes and examples are proposed below and described in detail with reference to the accompanying drawings.

[0131] <First embodiment>

[0132] Please refer to Figure 1A and Figure 1B ,in Figure 1A FIG. 1 is a schematic diagram showing a camera module 10 according to a first embodiment of the present disclosure. Figure 1B Draw according to Figure 1A A schematic cross-sectional view of the camera module 10 in the first embodiment. Figure 1A and Figure 1B It can be seen that the camera module 10 includes an imaging lens 11 , a photosensitive element module 12 and a carrier board 13 in sequence along a central optical path L, wherein the photosensitive element module 12 is disposed on the image side of the imaging lens 11 , and the photosensitive element module 12 is disposed on the carrier board 13 .

[0133] Please refer to Figure 1C and Figure 1D ,in Figure 1C Draw according to Figure 1A A schematic diagram of a photosensitive element module 12 in a first example of a first embodiment, Figure 1D Draw according to Figure 1C A partial enlarged view of the photosensitive element module 12 in the first example of the first embodiment. Figure 1C and Figure 1D It can be seen that the photosensitive element module 12 includes a photosensitive surface 111a, a filter element 120a, an anti-reflective microstructure 130a and an air layer 131a, wherein the filter element 120a faces the photosensitive surface 111a, the anti-reflective microstructure 130a is adjacent to the air layer 131a, and the anti-reflective microstructure 130a and the air layer 131a partially overlap in a direction perpendicular to the photosensitive surface 111a.

[0134] The filter element 120a includes a substrate 121a, an optical deposition layer structure 122a, and an optical coating 123a, wherein the optical deposition layer structure 122a is disposed on a side of the substrate 121a away from the photosensitive surface 111a, the optical coating 123a and the optical deposition layer structure 122a are disposed opposite to each other on a side of the substrate 121a facing the photosensitive surface 111a, and an air layer 131a is formed between the optical coating 123a and the photosensitive surface 111a. Specifically, the optical deposition layer structure 122a is multi-layered, the number of layers of the optical deposition layer structure 122a is greater than 10, the number of layers of the optical coating 123a includes one, and the thickness of the optical coating 123a is between 900nm and 5μm.

[0135] Specifically, the air layer 131a can be used to prevent the thermal effect from affecting the life of the optical coating 123a, and the photosensitive surface 111a has a focusing array to improve the light collection efficiency of the photosensitive element module 12, and the anti-reflection microstructure 130a can be set on the surface of the focusing array of the photosensitive surface 111a.

[0136] The photosensitive element module 12 may further include an electronic photosensitive element 110 a , wherein the electronic photosensitive element 110 a forms a photosensitive surface 111 a , and the photosensitive surface 111 a is used to receive light passing through the filter element 120 a .

[0137] The substrate 121a may include a side surface 125a, wherein the side surface 125a extends along the thickness direction of the substrate 121a, and the optical coating 123a is not disposed on the side surface 125a. In this way, uneven coating of the optical coating 123a can be avoided to ensure optical quality.

[0138] The photosensitive element module 12 may further include a filter element holder 172a, and the filter element holder 172a and the anti-reflection microstructure 130a at least partially overlap on a projection parallel to the photosensitive surface 111a, wherein the imaging lens 11 and the filter element 120a are disposed on the filter element holder 172a. Specifically, the anti-reflection microstructure 130a further partially overlaps with the filter element 120a, which can avoid glare caused by reflection of light through the internal structure, thereby further optimizing the optical quality.

[0139] The filter element 120a may further include an isolation layer 124a, wherein the isolation layer 124a is disposed between the optical coating 123a and the anti-reflection microstructure 130a, and the isolation layer 124a may be a multilayer film, thereby improving the adhesion of the anti-reflection microstructure 130a and improving the chemical stability of the optical coating 123a to ensure the yield.

[0140] Furthermore, the partially overlapping portion of the anti-reflective microstructure 130a and the air layer 131a in a direction perpendicular to the photosensitive surface 111a can define an overlapping area OV, and the overlapping area OV allows light to gradually enter the photosensitive surface 111a to improve the transmittance, wherein the thickness of the overlapping area OV can be between 50nm and 500nm, and can further be between 75nm and 250nm.

[0141] The side surface 125a of the filter element 120a is bonded to the filter element bracket 172a by means of colloid G. The anti-reflective microstructure 130a and the air layer 131a overlap in the overlapping area OV in a direction perpendicular to the photosensitive surface 111a. The anti-reflective microstructure 130a may further include a base layer BL, and the base layer BL is disposed between the overlapping area OV and the photosensitive surface 111a.

[0142] The substrate 121a may be a red light absorbing glass. The red light absorbing glass may absorb part of the red light to match the photosensitive characteristics of the electronic photosensitive element 110a, thereby improving the optical quality. Specifically, the red light absorbing glass appears blue or blue-green due to its absorption of red light, wherein the infrared light absorbing glass may be blue glass, but is not limited thereto.

[0143] The optical coating 123a may be an organic material layer. Thus, the optical deposition layer structure 122a may be reduced from being degraded by heat during the process of setting the optical coating 123a, thereby increasing the life of the filter element 120a. Specifically, the process of the optical coating 123a may include spin coating, photocuring, thermal curing, etc., but is not limited thereto.

[0144] The number of layers of the optical deposition layer structure 122a can be greater than or equal to 36, and can be greater than or equal to 72, wherein the optical deposition layer structure 122a with a high number of layers can be a superposition of multiple sets of coatings, but is not limited thereto. Adjacent layers of the optical deposition layer structure 122a have different compositions and can provide different reflectivities.

[0145] Please refer to Table 1, which lists the number of layers, high or low refractive index, and thickness of the optical deposition layer structure 122a in the first example of the first embodiment. As can be seen from Table 1, the optical deposition layer structure 122a includes a first group of optical deposition layer structures and a second group of optical deposition layer structures, wherein the number of layers of the first group of optical deposition layer structures is 34, the number of layers of the second group of optical deposition layer structures is 36, and H and L in the refractive index represent high and low refractive indexes, respectively. By stacking high and low refractive index layers, light of a specific wavelength has a higher reflectivity, thereby achieving a filtering effect.

[0146]

[0147]

[0148] Please refer to Figure 1E , which is shown in accordance with Figure 1C Data diagram of the photosensitive element module 12 in the first example of the first embodiment. Figure 1E It can be seen that the transmittance of the filter element 120a is 50% and a first wavelength greater than 550nm is T50, the transmittance of the filter element 120a is 50% and a second wavelength less than 450nm is T50-B, the reflectivity of the optical deposition layer structure 122a is 50% and a wavelength greater than 550nm is R50, the maximum reflectivity is RA, wherein RA[450, T50] corresponds to a wavelength range of 450nm to the first wavelength T50, RA[T50-B, T50] corresponds to a wavelength range of the second wavelength T50-B to the first wavelength T50, and RA[400, 800] corresponds to a wavelength range of 400nm to 800nm, and the parameters meet the conditions of Table 2 below.

[0149]

[0150] Please refer to Figure 1F and Figure 1G ,in Figure 1F Draw according to Figure 1A A schematic diagram of the photosensitive element module 12 in the second embodiment of the first embodiment, Figure 1G Draw according to Figure 1F A partial enlarged view of the photosensitive element module 12 in the second embodiment of the first embodiment. Figure 1F and Figure 1GIt can be seen that the photosensitive element module 12 includes a photosensitive surface 111b, a filter element 120b and a first anti-reflection microstructure 141b, wherein the filter element 120b faces the photosensitive surface 111b, an air layer 131b is formed between the first anti-reflection microstructure 141b and the filter element 120b, and the first anti-reflection microstructure 141b and the air layer 131b partially overlap in a direction perpendicular to the photosensitive surface 111b.

[0151] The filter element 120b includes a substrate 121b, an optical deposition layer structure 122b and an optical coating 123b, wherein the optical deposition layer structure 122b is disposed on a side of the substrate 121b away from the photosensitive surface 111b, the optical coating 123b and the optical deposition layer structure 122b are disposed on a side of the substrate 121b facing the photosensitive surface 111b opposite to each other, and the first anti-reflection microstructure 141b is disposed on the photosensitive surface 111b. Specifically, the optical deposition layer structure 122b is multi-layered, the number of layers of the optical deposition layer structure 122b is greater than 10, the number of layers of the optical coating 123b includes one, and the thickness of the optical coating 123b is between 900nm and 5μm.

[0152] The photosensitive element module 12 may further include an electronic photosensitive element 110 b , wherein the electronic photosensitive element 110 b forms a photosensitive surface 111 b , and the photosensitive surface 111 b is used to receive light passing through the filter element 120 b .

[0153] The photosensitive element module 12 may further include a filter element bracket 172 b , wherein the filter element bracket 172 b supports the filter element 120 b , and a side of the filter element 120 b away from the photosensitive surface 111 b is bonded to the filter element bracket 172 b via a colloid G.

[0154] The filter element 120b may further include an isolation layer 124b and a second anti-reflection microstructure 142b, wherein the second anti-reflection microstructure 142b is arranged on the side of the optical coating 123b away from the optical deposition layer structure 122b, and partially overlaps with the air layer 131b in a direction perpendicular to the photosensitive surface 111b, the isolation layer 124b is arranged between the optical coating 123b and the second anti-reflection microstructure 142b, and the isolation layer 124b may be a multilayer film.

[0155] Please refer to Figure 1H , which is shown in accordance with Figure 1A A schematic diagram of the photosensitive element module 12 in the third example of the first embodiment. Figure 1HIt can be seen that the photosensitive element module 12 includes a photosensitive surface 111c, a filter element 120c, an anti-reflective microstructure 130c and an air layer 131c, wherein the filter element 120c faces the photosensitive surface 111c, the anti-reflective microstructure 130c is adjacent to the air layer 131c, and the anti-reflective microstructure 130c and the air layer 131c partially overlap in a direction perpendicular to the photosensitive surface 111c.

[0156] The filter element 120c includes a substrate 121c, an optical deposition layer structure 122c, and an optical coating 123c, wherein the optical deposition layer structure 122c is disposed on a side of the substrate 121c away from the photosensitive surface 111c, the optical coating 123c and the optical deposition layer structure 122c are disposed opposite to each other on a side of the substrate 121c facing the photosensitive surface 111c, and an air layer 131c is formed between the optical coating 123c and the photosensitive surface 111c. Specifically, the optical deposition layer structure 122c is multi-layered, the number of layers of the optical deposition layer structure 122c is greater than 10, the number of layers of the optical coating 123c includes one, and the thickness of the optical coating 123c is between 900nm and 5μm.

[0157] The photosensitive element module 12 may further include an electronic photosensitive element 110 c , wherein the electronic photosensitive element 110 c forms a photosensitive surface 111 c , and the photosensitive surface 111 c is used to receive light passing through the filter element 120 c .

[0158] The photosensitive element module 12 may further include a filter element holder 172c, wherein the filter element holder 172c and the anti-reflection microstructure 130c at least partially overlap on a projection parallel to the photosensitive surface 111c, and the side surface 125c of the filter element 120c and the filter element holder 172c are bonded by the colloid G. Specifically, the anti-reflection microstructure 130c further partially overlaps with the filter element 120c, which can avoid glare caused by reflection of light through the internal structure, thereby further optimizing the optical quality.

[0159] The filter element 120c may further include an isolation layer 124c, wherein the isolation layer 124c is disposed between the optical coating layer 123c and the anti-reflection microstructure 130c, and the isolation layer 124c may be a multi-layer film.

[0160] The photosensitive element module 12 may further include a light shielding film layer 150c, wherein the light shielding film layer 150c is disposed between the optical coating layer 123c and the isolation layer 124c. Thus, glare caused by reflection on the surface of the light shielding film layer 150c can be avoided to improve the optical quality.

[0161] Please refer to Fig. 1I , which is shown in accordance with Figure 1A A schematic diagram of the photosensitive element module 12 in the fourth example of the first embodiment. Fig. 1IIt can be seen that the photosensitive element module 12 includes a photosensitive surface 111d, a filter element 120d and a first anti-reflection microstructure 141d, wherein the filter element 120d faces the photosensitive surface 111d, the first anti-reflection microstructure 141d is arranged on the photosensitive surface 111d, an air layer 131d is formed between the first anti-reflection microstructure 141d and the filter element 120d, and the first anti-reflection microstructure 141d and the air layer 131d partially overlap in a direction perpendicular to the photosensitive surface 111d.

[0162] The filter element 120d includes a substrate 121d, an optical deposition layer structure 122d, and an optical coating 123d, wherein the optical deposition layer structure 122d is disposed on a side of the substrate 121d away from the photosensitive surface 111d, and the optical coating 123d and the optical deposition layer structure 122d are disposed on a side of the substrate 121d facing the photosensitive surface 111d opposite to each other. Specifically, the optical deposition layer structure 122d is multi-layered, the number of layers of the optical deposition layer structure 122d is greater than 10, the number of layers of the optical coating 123d includes one, and the thickness of the optical coating 123d is between 900nm and 5μm.

[0163] The photosensitive element module 12 may further include an electronic photosensitive element 110d, wherein the electronic photosensitive element 110d forms a photosensitive surface 111d, and the photosensitive surface 111d is used to receive light passing through the filter element 120d.

[0164] The photosensitive element module 12 may further include a filter element bracket 172d, wherein the filter element bracket 172d supports the filter element 120d, and the filter element bracket 172d and the filter element 120d may be combined into one by a heat pressing process.

[0165] The filter element 120d may further include a second anti-reflection microstructure 142d, wherein the second anti-reflection microstructure 142d is disposed on a side of the optical coating 123d away from the optical deposition layer structure 122d, and partially overlaps with the air layer 131d in a direction perpendicular to the photosensitive surface 111d. In this way, the reflection of the filter element 120d facing the photosensitive surface can be further reduced to further improve the light transmittance.

[0166] Specifically, the anti-reflection microstructures (ie, the first anti-reflection microstructure 141d and the second anti-reflection microstructure 142d) are disposed on both the photosensitive surface 111d and the filter element 120d, and the second anti-reflection microstructure 142d is further disposed on at least a portion of the filter element bracket 172d.

[0167] The photosensitive element module 12 may further include a light shielding film layer 150d, wherein the light shielding film layer 150d is disposed on a side of the optical deposition layer structure 122d away from the optical coating layer 123d.

[0168] Please refer to Figure 1J, which is shown in accordance with Figure 1A A schematic diagram of the photosensitive element module 12 in the fifth example of the first embodiment. Figure 1J It can be seen that the photosensitive element module 12 includes a photosensitive surface 111e, a filter element 120e and a first anti-reflection microstructure 141e, wherein the filter element 120e faces the photosensitive surface 111e, the first anti-reflection microstructure 141e is arranged on the photosensitive surface 111e, an air layer 131e is formed between the first anti-reflection microstructure 141e and the filter element 120e, and the first anti-reflection microstructure 141e and the air layer 131e partially overlap in a direction perpendicular to the photosensitive surface 111e.

[0169] The filter element 120e includes a substrate 121e, an optical deposition layer structure 122e, and an optical coating 123e, wherein the optical deposition layer structure 122e is disposed on a side of the substrate 121e away from the photosensitive surface 111e, and the optical coating 123e and the optical deposition layer structure 122e are disposed on a side of the substrate 121e facing the photosensitive surface 111e opposite to each other. Specifically, the optical deposition layer structure 122e is multi-layered, the number of layers of the optical deposition layer structure 122e is greater than 10, the number of layers of the optical coating 123e includes one, and the thickness of the optical coating 123e is between 900nm and 5μm.

[0170] The photosensitive element module 12 may further include an electronic photosensitive element 110e and a molded body 160e. The electronic photosensitive element 110e forms a photosensitive surface 111e and a non-photosensitive surface 112e, wherein the non-photosensitive surface 112e is adjacent to the periphery of the photosensitive surface 111e. The molded body 160e is molded on the electronic photosensitive element 110e, and the molded body 160e includes an inner side surface 161e, and the inner side surface 161e faces the center of the photosensitive surface 111e, wherein the inner side surface 161e extends from the non-photosensitive surface 112e in a direction away from the photosensitive surface 111e, and the first anti-reflective microstructure 141e is disposed on at least a portion of the inner side surface 161e. Thereby, the possibility of glare generated by the molded body 160e can be reduced. Specifically, the molded body 160e and the electronic photosensitive element 110e can be integrally molded by embedded injection molding.

[0171] The photosensitive element module 12 may further include a mounting position 171e, a filter element bracket 172e and a fixing element 173e, wherein the filter element bracket 172e is disposed at the mounting position 171e, the filter element bracket 172e supports the filter element 120e, the first anti-reflection microstructure 141e is disposed at at least a portion of the mounting position 171e, and the fixing element 173e fixes the filter element 120e to the filter element bracket 172e. By further extending the first anti-reflection microstructure 141e to the mounting position 171e, glare caused by reflection of light through the internal structure can be avoided, thereby further optimizing the optical quality.

[0172] The filter element 120e may further include a second anti-reflective microstructure 142e, wherein the second anti-reflective microstructure 142e is arranged on the side of the optical coating 123e away from the optical deposition layer structure 122e, and partially overlaps with the air layer 131e in a direction perpendicular to the photosensitive surface 111e, and the second anti-reflective microstructure 142e partially overlaps with the filter element bracket 172e in a projection parallel to the photosensitive surface 111e.

[0173] Specifically, the anti-reflection microstructures (i.e., the first anti-reflection microstructure 141e and the second anti-reflection microstructure 142e) are disposed on the photosensitive surface 111e and the filter element 120e at the same time, the second anti-reflection microstructure 142e is further disposed on at least a portion of the filter element bracket 172d, and the molded body 160e further forms a mounting position 171e.

[0174] Please refer to Figure 1K , which is shown in accordance with Figure 1A A schematic diagram of the photosensitive element module 12 in the sixth embodiment of the first embodiment. Figure 1K It can be seen that the photosensitive element module 12 includes a photosensitive surface 111f, a filter element 120f, an anti-reflective microstructure 130f and an air layer 131f, wherein the filter element 120f faces the photosensitive surface 111f, the anti-reflective microstructure 130f is adjacent to the air layer 131f, and the anti-reflective microstructure 130f and the air layer 131f partially overlap in a direction perpendicular to the photosensitive surface 111f.

[0175] The filter element 120f includes a substrate 121f, an optical deposition layer structure 122f, and an optical coating 123f, wherein the optical deposition layer structure 122f is disposed on a side of the substrate 121f away from the photosensitive surface 111f, the optical coating 123f and the optical deposition layer structure 122f are disposed opposite to each other on a side of the substrate 121f facing the photosensitive surface 111f, and an air layer 131f is formed between the optical coating 123f and the photosensitive surface 111f. Specifically, the optical deposition layer structure 122f is multi-layered, the number of layers of the optical deposition layer structure 122f is greater than 10, the number of layers of the optical coating 123f includes one, and the thickness of the optical coating 123f is between 900nm and 5μm.

[0176] The photosensitive element module 12 may further include an electronic photosensitive element 110f and a molded base 162f, wherein the electronic photosensitive element 110f forms a photosensitive surface 111f and a non-photosensitive surface 112f, and the molded base 162f is in physical contact with the non-photosensitive surface 112f. The photosensitive surface 111f is used to receive light passing through the filter element 120f, the non-photosensitive surface 112f is adjacent to the periphery of the photosensitive surface 111f, and the anti-reflective microstructure 130f is arranged on the non-photosensitive surface 112f. In this way, the optical quality of the anti-reflective microstructure 130f can be reduced due to structural defects at the edge, so as to ensure the peripheral optical quality. Specifically, the non-photosensitive surface 112f may include a plurality of contacts, which can be electrically connected to the circuit through the contacts.

[0177] The substrate 121f may include a side surface 125f, wherein the side surface 125f extends along a direction from the optical deposition layer structure 122f to the optical coating layer 123f, and the optical coating layer 123f is not disposed on the side surface 125f.

[0178] The photosensitive element module 12 may further include a mounting position 171f and a filter element bracket 172f, wherein the filter element bracket 172f is disposed at the mounting position 171f, the filter element bracket 172f supports the filter element 120f, the anti-reflection microstructure 130f is disposed at least a portion of the mounting position 171f, and the filter element bracket 172f and the anti-reflection microstructure 130f at least partially overlap on a projection parallel to the photosensitive surface 111f. Further, the non-photosensitive surface 112f includes the mounting position 171f, and the filter element bracket 172f and the filter element 120f are integrally formed by insert injection molding.

[0179] The filter element 120f may further include an isolation layer 124f, wherein the isolation layer 124f is disposed between the optical coating 123f and the anti-reflection microstructure 130f, and the isolation layer 124f may be a multi-layer film.

[0180] Please refer to Figure 1L , which is shown in accordance with Figure 1A A schematic diagram of the photosensitive element module 12 in the seventh embodiment of the first embodiment. Figure 1L It can be seen that the photosensitive element module 12 includes a photosensitive surface 111g, a filter element 120g, an anti-reflective microstructure 130g and an air layer 131g, wherein the filter element 120g faces the photosensitive surface 111g, the anti-reflective microstructure 130g is adjacent to the air layer 131g, and the anti-reflective microstructure 130g and the air layer 131g partially overlap in a direction perpendicular to the photosensitive surface 111g.

[0181] The filter element 120g includes a substrate 121g, an optical deposition layer structure 122g and an optical coating 123g, wherein the optical deposition layer structure 122g is disposed on a side of the substrate 121g away from the photosensitive surface 111g, the optical coating 123g and the optical deposition layer structure 122g are disposed on a side of the substrate 121g facing the photosensitive surface 111g opposite to each other, and an air layer 131g is formed between the optical coating 123g and the photosensitive surface 111g. Specifically, the optical deposition layer structure 122g is multi-layered, the number of layers of the optical deposition layer structure 122g is greater than 10, the number of layers of the optical coating 123g includes one, and the thickness of the optical coating 123g is between 900nm and 5μm.

[0182] The photosensitive element module 12 may further include an electronic photosensitive element 110g and a molded body 160g, wherein the electronic photosensitive element 110g forms a photosensitive surface 111g, and the molded body 160g is molded on the electronic photosensitive element 110g. The molded body 160g includes an inner side surface 161g, and the inner side surface 161g faces the center of the photosensitive surface 111g, wherein the anti-reflection microstructure 130g is simultaneously disposed on the photosensitive surface 111g and the inner side surface 161g. The photosensitive surface 111g and the inner side surface 161g are disposed by the anti-reflection microstructure 130g, and the filter element 120g is in contact with the molded body 160g, thereby achieving the effect of sealing the photosensitive surface 111g. Furthermore, the molded body 160g is molded by curing a colloid, but is not limited thereto.

[0183] The filter element 120g may further include an isolation layer 124g, wherein the isolation layer 124g is disposed between the optical coating 123g and the anti-reflection microstructure 130g, and the isolation layer 124g may be a multi-layer film.

[0184] Please refer to Figure 1M and Figure 1N ,in Figure 1M Draw according to Figure 1A Transmittance data diagram of the filter element in the first embodiment, Figure 1N Draw according to Figure 1A Another transmittance data diagram of the filter element in the first embodiment. Figure 1M and Figure 1N It can be seen that the transmittance of the filter element to the light with a wavelength of 450nm to 550nm is Tmin450-550, the transmittance of the filter element is 50% and the first wavelength is greater than 550nm is T50, the transmittance of the filter element is 50% and the second wavelength is less than 450nm is T50-B, the maximum transmittance of the filter element to the light with a wavelength of 450nm to 550nm is Tmax, and the parameters meet the conditions of the following Table 3. It must be noted that samples i to xv can all be applied to the first embodiment of the first embodiment to the seventh embodiment of the first embodiment.

[0185]

[0186] Please refer to Fig.1O , which is shown in accordance with Figure 1A Reflectivity data diagram of the optical deposition layer structure in the first embodiment. Fig.1O It can be seen that the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50, and the parameters meet the conditions in Table 4. It must be noted that samples a to h can be applied to the first embodiment to the seventh embodiment of the first embodiment.

[0187]

[0188] Please refer to Figure 1P , which is shown in accordance with Figure 1A Reflectivity data diagram of the anti-reflective microstructure in the first embodiment. Figure 1P It can be seen that the maximum reflectivity of the anti-reflection microstructure for wavelengths of 400nm to 800nm ​​is Rmax, and the parameters meet the conditions in Table 5. It must be noted that samples 1 to 10 can be applied to the first embodiment to the seventh embodiment of the first embodiment.

[0189]

[0190] In order to clearly indicate the relative positions between components, Figure 1C , Figure 1D and Figure 1F to Figure 1L The light-shielding film layer, optical coating and anti-reflective microstructure are not drawn according to the actual scale.

[0191] <Second embodiment>

[0192] Please refer to Figure 2A and Figure 2B ,in Figure 2A A schematic diagram of an electronic device 20 according to a second embodiment of the present disclosure is shown. Figure 2B Draw according to Figure 2A Another schematic diagram of the electronic device 20 in the second embodiment. Figure 2A and Figure 2B It can be seen that the electronic device 20 is a smart phone, wherein the electronic device 20 can also be a notebook computer, a tablet computer, a driving recorder, etc., but not limited thereto. The electronic device 20 includes a camera module and an image capture control interface 210, wherein the camera module includes an imaging lens and a photosensitive element module, and the photosensitive element module is disposed on the image side of the imaging lens. Further, the photosensitive element module can be the photosensitive element module of the first embodiment to the seventh embodiment of the first embodiment, but the present disclosure is not limited thereto.

[0193] In the second embodiment, the camera modules are respectively a front camera module 221, a wide-angle camera module 222, a telephoto camera module 223, an ultra-wide-angle camera module 224, a macro camera module 225 and a TOF module (Time-Of-Flight) 226, wherein the TOF module 226 may also be other types of camera modules and is not limited to this configuration.

[0194] Specifically, in the second embodiment, the front camera module 221 and the TOF module 226 are disposed on the front side of the electronic device 20 , while the wide-angle camera module 222 , the telephoto camera module 223 , the ultra-wide-angle camera module 224 and the macro camera module 225 are disposed on the back side of the electronic device 20 .

[0195] The image capture control interface 210 may be a touch screen, which is used to display images and has a touch function, and can be used to manually adjust the shooting angle. Specifically, the image capture control interface 210 includes an image playback button 211, a camera module switching button 212, a focus and photo button 213, an integrated menu button 214, and a zoom control button 215. Specifically, the user enters the shooting mode through the image capture control interface 210 of the electronic device 20. The camera module switching button 212 can freely switch to use one of the front camera module 221, wide-angle camera module 222, telephoto camera module 223, ultra-wide-angle camera module 224 and macro camera module 225 for shooting. The zoom control button 215 is used to adjust the zoom. The focus and photo button 213 is used to capture images after taking a good view and confirming one of the front camera module 221, wide-angle camera module 222, telephoto camera module 223, ultra-wide-angle camera module 224 and macro camera module 225. The image playback button 211 allows the user to view the photos after capturing the photos. The integrated menu button 214 is used to adjust the details of the image capture (such as timed photo capture, photo ratio, etc.).

[0196] The electronic device 20 may further include a reminder light 23 , which is disposed on the front of the electronic device 20 and can be used to remind the user of unread messages, missed calls and the status of the phone.

[0197] Furthermore, after the user enters the shooting mode through the image capture control interface 210 of the electronic device 20, the camera module collects imaging light on the photosensitive element and outputs electronic signals related to the image to the image signal processor (not shown) of the single-chip system 25, wherein the single-chip system 25 may also include a random access memory (RAM) (not shown), a central processing unit (not shown) and a storage unit (Storage Unit) (not shown), and may also include but not limited to a display unit (Display), a control unit (Control Unit), a read-only storage unit (ROM) or a combination thereof.

[0198] Furthermore, the electronic device 20 may further include an image software processor and an image signal processor, and may further integrate the image software processor, the image signal processor, a position locator, a transmission signal processor, a gyroscope, a storage unit and a random access memory into a single chip system 25 .

[0199] In response to the camera specifications of the electronic device 20, the electronic device 20 may further include an optical image stabilization component (not shown in the figure). Furthermore, the electronic device 20 may further include at least one focus assisting element 26 and at least one sensing element (not shown in the figure). The focus assisting element 26 may include a light emitting element 261 for compensating color temperature, an infrared ranging element (not shown in the figure), a laser focus module (not shown in the figure), etc. The sensing element may have the function of sensing physical momentum and actuation energy, such as an accelerometer, a gyroscope, a Hall Effect Element, a position locator, and a transmission signal processor to sense the shaking and jitter imposed by the user's hand or the external environment, thereby facilitating the automatic focus function and the optical image stabilization component configured in the camera module of the electronic device 20 to obtain good imaging quality, and helping the electronic device 20 according to the present disclosure to have multiple modes of shooting functions, such as optimized Selfie, low-light HDR (High Dynamic Range), high-resolution 4K (4K Resolution) video recording, etc. In addition, the user can directly view the shooting screen of the camera through the image capture control interface 210 and manually control the framing range on the image capture control interface 210 to achieve a WYSIWYG auto focus function.

[0200] Further, the camera module, optical image stabilization component, sensor element, focus auxiliary element 26 and electronic element 242 can be arranged on a circuit board 24, and electrically connected to image signal processor and other related elements through connector 241 to execute the shooting process, wherein the circuit board 24 can be a flexible printed circuit board (Flexible Printed Circuitboard, FPC). Current electronic devices such as smart phones have a trend of being thin and light. The camera module and related elements are arranged on the circuit board, and the circuit is integrated to the main board of the electronic device by using the connector, which can meet the requirements of the mechanism design and circuit layout of the limited space inside the electronic device and obtain a greater margin, and also make the automatic focus function of its camera module more flexible through the touch screen of the electronic device. In the second embodiment, the sensor element and the focus auxiliary element 26 are arranged on the circuit board 24 and at least one other flexible circuit board (not shown in the figure), and are electrically connected to the imaging signal processing element and other related elements through the corresponding connector to execute the shooting process. In other embodiments (not shown in the figure), the sensor element and the auxiliary optical element can also be arranged on the main board of the electronic device or other forms of carrier according to the mechanism design and circuit layout requirements.

[0201] Furthermore, the wide-angle camera module 222 can capture images with high pixels within a certain range, and has the function of high resolution and low distortion. The imaging result of the telephoto camera module 223 may have a smaller viewing angle and depth of field than the wide-angle camera module 222, and can be used to capture moving targets, that is, the actuator (not shown) of the electronic device 20 can drive the telephoto camera module 223 to quickly and continuously auto focus on the target, so that the target object is not blurred due to being far away from the focus position. The imaging result of the ultra-wide-angle camera module 224 may have a larger viewing angle and depth of field than the wide-angle camera module 222, but it is often accompanied by greater distortion.

[0202] Specifically, by using camera modules with different focal lengths to frame and combining with image processing technology, the zoom function can be implemented in the electronic device 20 .

[0203] <Third Embodiment>

[0204] Please refer to Figure 3 , which is a schematic diagram showing an electronic device installed in a drone 30 according to a third embodiment of the present disclosure. Figure 3 It can be seen that the electronic device (not shown) includes a camera module, wherein the camera module includes an imaging lens and a photosensitive element module, and the photosensitive element module is disposed on the image side of the imaging lens. Further, the photosensitive element module can be the photosensitive element module of the first embodiment to the seventh embodiment of the first embodiment, but the present disclosure is not limited thereto.

[0205] In the third embodiment, the camera modules are respectively a front camera module 31 a and a side camera module 31 b .

[0206] Specifically, the front camera module 31a is disposed at the front end of the drone 30, and the side camera module 31b is disposed at the side of the drone 30. In this way, the electronic device can cope with complex ambient light.

[0207] <Fourth embodiment>

[0208] Please refer to Figure 4 , which is a schematic diagram showing an electronic device installed in a car 40 according to a fourth embodiment of the present disclosure. Figure 4 It can be seen that the electronic device (not shown) includes a camera module, wherein the camera module includes an imaging lens and a photosensitive element module, and the photosensitive element module is disposed on the image side of the imaging lens. Further, the photosensitive element module can be the photosensitive element module of the first embodiment to the seventh embodiment of the first embodiment, but the present disclosure is not limited thereto.

[0209] In the fourth embodiment, the camera modules are respectively a front camera module 41 a , a side camera module 41 b , and a rear camera module 41 c .

[0210] The front camera module 41a, the side camera module 41b and the rear camera module 41c are respectively disposed at the front, side and rear of the car 40, so as to help the driver obtain external space information outside the car 40, such as external space information I1, I2, I3, I4, but not limited thereto. In this way, more viewing angles can be provided to reduce blind spots, thereby helping to improve driving safety.

[0211] Although the present invention has been disclosed as above by means of implementation modes and examples, they are not intended to limit the present invention. Any person having ordinary knowledge in the technical field may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

Claims

1. A photosensitive element module, characterized in that: Include: A photosensitive surface; A filter element facing the photosensitive surface and comprising: a substrate; an optical deposition layer structure, disposed on a side of the substrate away from the photosensitive surface, wherein the optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10; and an optical coating, disposed on a side of the substrate facing the photosensitive surface opposite to the optical deposition layer structure, wherein the number of layers of the optical coating comprises one, and the thickness of the optical coating is between 900 nm and 5 μm; and a first anti-reflection microstructure disposed on the photosensitive surface, wherein an air layer is formed between the first anti-reflection microstructure and the filter element, and the first anti-reflection microstructure and the air layer partially overlap in a direction perpendicular to the photosensitive surface; The filter element has a transmittance of 80% or more to light with a wavelength of 450nm to 550nm; the transmittance of the filter element is 50% and a first wavelength greater than 550nm is T50; the reflectance of the first anti-reflection microstructure to the wavelength from 450nm to the first wavelength T50 is less than or equal to 0.93%, which meets the following conditions: 600nm≤T50≤720nm.

2. The photosensitive element module according to claim 1, wherein: The reflectivity of the first anti-reflection microstructure from 450 nm to the first wavelength T50 is less than or equal to 0.48%.

3. The photosensitive element module according to claim 1, wherein: The filter element also includes: A second anti-reflection microstructure is arranged on a side of the optical coating away from the optical deposition layer structure and partially overlaps with the air layer in a direction perpendicular to the photosensitive surface. The average reflectivity of the second anti-reflection microstructure from 450nm to the first wavelength T50 is less than 0.93%.

4. The photosensitive element module according to claim 3, characterized in that: Also includes: A light-shielding film layer is disposed between the optical coating and the first anti-reflection microstructure.

5. The photosensitive element module according to claim 1, wherein: The filter element also includes: An isolation layer is disposed between the optical coating and the air layer.

6. The photosensitive element module according to claim 1, wherein: The substrate contains: A side surface extends along the direction of the optical deposition layer structure toward the optical coating, and the optical coating is not disposed on the side surface.

7. The photosensitive element module according to claim 1, wherein: Also includes: An electronic photosensitive element forms the photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface, and the first anti-reflection microstructure is arranged on at least a portion of the non-photosensitive surface.

8. The photosensitive element module according to claim 1, wherein: Also includes: an electronic photosensitive element, forming the photosensitive surface and a non-photosensitive surface, wherein the non-photosensitive surface is adjacent to the periphery of the photosensitive surface; and A molded body is molded on the electronic photosensitive element, the molded body includes an inner side surface, and the inner side surface faces the center of the photosensitive surface, wherein the inner side surface extends from the non-photosensitive surface toward a direction away from the photosensitive surface, and the first anti-reflective microstructure is arranged on at least a portion of the inner side surface.

9. The photosensitive element module according to claim 1, wherein: The photosensitive element module includes: a mounting position; and A filter element support is arranged at the installation position, wherein the filter element support supports the filter element, and the first anti-reflection microstructure is arranged at least a part of the installation position.

10. The photosensitive element module according to claim 1, wherein: The substrate is a red light absorbing glass.

11. The photosensitive element module according to claim 1, wherein: The reflectivity of the optical deposition layer structure to light with a wavelength of 450nm to 550nm is less than or equal to 10%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which meets the following conditions: 600nm≤R50≤720nm; and R50≥T50.

12. The photosensitive element module according to claim 1, wherein: The transmittance of the filter element is 50% and a second wavelength less than 450nm is T50-B, the second wavelength is in the wavelength range of 400nm to 450nm, and the reflectivity of the first anti-reflective microstructure from the second wavelength T50-B to the first wavelength T50 is less than or equal to 0.93%.

13. The photosensitive element module according to claim 1, wherein: The optical coating is an organic material layer.

14. A camera module, characterized in that: Include: an imaging lens; and The photosensitive element module as claimed in claim 1 is disposed on the image side of the imaging lens.

15. An electronic device, characterized in that: Include: The camera module of claim 14.

16. A photosensitive element module, characterized in that: Include: A photosensitive surface; A filter element facing the photosensitive surface and comprising: a substrate; an optical deposition layer structure, disposed on a side of the substrate away from the photosensitive surface, wherein the optical deposition layer structure is multi-layered, and the number of layers of the optical deposition layer structure is greater than 10; and an optical coating, disposed on a side of the substrate facing the photosensitive surface opposite to the optical deposition layer structure, wherein the number of layers of the optical coating comprises one, and the thickness of the optical coating is between 900 nm and 5 μm; an air layer formed between the optical coating and the photosensitive surface; and an anti-reflection microstructure, adjacent to the air layer and partially overlapping the air layer in a direction perpendicular to the photosensitive surface; The filter element has a transmittance of 80% or more for light with a wavelength of 450nm to 550nm; a first wavelength T50 is a wavelength with a transmittance of 50% and greater than 550nm; and a reflectance of the anti-reflection microstructure from 450nm to the first wavelength T50 is less than or equal to 0.93%, which satisfies the following conditions: 600nm≤T50≤720nm.

17. The photosensitive element module according to claim 16, wherein: The reflectivity of the anti-reflection microstructure from 450 nm to the first wavelength T50 is less than or equal to 0.48%.

18. The photosensitive element module according to claim 16, wherein: Also includes: A light-shielding film layer is disposed between the optical coating and the anti-reflection microstructure.

19. The photosensitive element module according to claim 16, wherein: The substrate contains: A side surface extends along the thickness direction of the substrate, and the optical coating is not disposed on the side surface.

20. The photosensitive element module according to claim 16, wherein: Also includes: A filter element support at least partially overlaps with the anti-reflection microstructure on a projection parallel to the photosensitive surface, wherein the filter element is disposed on the filter element support.

21. The photosensitive element module according to claim 16, wherein: The substrate is a red light absorbing glass.

22. The photosensitive element module according to claim 16, wherein: The reflectivity of the optical deposition layer structure to light with a wavelength of 450nm to 550nm is less than or equal to 10%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which meets the following conditions: 600nm≤R50≤720nm; and R50≥T50.

23. The photosensitive element module according to claim 16, wherein: The transmittance of the filter element is 50% and a second wavelength less than 450nm is T50-B, the second wavelength is in the wavelength range of 400nm to 450nm, and the reflectivity of the anti-reflection microstructure from the second wavelength T50-B to the first wavelength T50 is less than or equal to 0.93%.

24. The photosensitive element module according to claim 16, wherein: The optical coating is an organic material layer.

25. The photosensitive element module according to claim 16, wherein: The filter element also includes: An isolation layer is arranged between the optical coating and the anti-reflection microstructure, and the isolation layer is a multi-layer film.

26. The photosensitive element module according to claim 16, wherein: The transmittance of the filter element to light with a wavelength of 450nm to 550nm is greater than or equal to 84%; the maximum transmittance of the filter element to light with a wavelength of 450nm to 550nm is greater than or equal to 88%; the reflectivity of the anti-reflection microstructure to light with a wavelength of 400nm to 750nm is less than or equal to 0.25%; the reflectivity of the optical deposition layer structure to light with a wavelength of 450nm to 550nm is less than or equal to 5%; the reflectivity of the optical deposition layer structure is 50% and a wavelength greater than 550nm is R50; the transmittance of the filter element is 50% and the first wavelength greater than 550nm is T50, which meets the following conditions: 600nm≤T50≤700nm; 650nm≤R50≤720nm; and R50-T50≥3nm.

27. A camera module, characterized in that: Include: an imaging lens; and The photosensitive element module as claimed in claim 16 is disposed on the image side of the imaging lens.

28. An electronic device, characterized in that: Include: The camera module of claim 27.

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