Electronic equipment, electronic equipment middle frame and manufacturing method of electronic equipment middle frame

Abstract

The invention provides an electronic equipment middle frame, which comprises an external part and an internal part, and is characterized in that the external part comprises a first transverse part and a first longitudinal part; the inner part comprises a second transverse part and a second longitudinal part; the second transverse part is connected to the inner side of the first transverse part, and the second longitudinal part is connected to the inner side of the first longitudinal part, so that the inner part is connected to the inner side of the outer part; the outer part is manufactured through the additive manufacturing technology, the outer part does not need to be connected again after being separately manufactured into a first transverse part and a first longitudinal part, the integrally-formed outer part is manufactured through the metal powder bed additive manufacturing technology, the machining steps are simple, material waste is small, the inner part is formed on the inner side of the outer part in a die-casting mode, and the inner part is integrally formed in a die-casting mode; connection forming after respective generation of the second transverse part and the second longitudinal part is not needed, the processing steps are simple, the internal part and the external part are separately manufactured, different materials are conveniently selected, and the strength requirement of the internal part and the appearance requirement of the external part are met.

Description

Technical Field

[0001] The present invention relates to the technical field of mobile communication equipment manufacturing, and in particular to an electronic equipment middle frame and a manufacturing method thereof. Background Art

[0002] With the rapid development of electronic products, the requirements for electronic products to be lighter, thinner and more beautiful are becoming higher and higher. Electronic products such as electronic devices and tablets are equipped with metal middle frames. The middle frames are attached to the outside of the electronic devices and have a certain thickness, which can affect the appearance and thickness of the electronic devices. People have put forward requirements for the middle frames to be lighter, stronger and have a high-end metal texture.

[0003] In the prior art, the traditional middle frame is divided into four metal parts: upper, lower, left and right. The four metal parts are formed by die casting or forging, and then connected into one by CNC precision machining and / or nano injection molding (NMT) to form a final integrated middle frame.

[0004] Since four metal parts need to be manufactured separately, the steps for producing the middle frame are relatively cumbersome and the manufacturing cost is high. In addition, there is a serious waste of material for the middle frame through CNC precision machining, and the material utilization rate is low. The outer and inner sides of the middle frame formed by die-casting or forging are made of the same material, and the different material requirements for the outer and inner sides of the middle frame cannot be met. The material and appearance of the middle frame are limited. Summary of the invention

[0005] The object of the present invention is to provide a middle frame of an electronic device to solve the technical problems in the prior art of having to manufacture four parts separately, low material utilization rate, and poor appearance due to the inner and outer sides of the middle frame being made of the same material.

[0006] The present invention provides an electronic device middle frame, characterized by comprising:

[0007] an outer member including a first transverse portion and a first longitudinal portion;

[0008] an inner member, comprising a second transverse portion and a second longitudinal portion; the second transverse portion is connected to the inner side of the first transverse portion, and the second longitudinal portion is connected to the inner side of the first longitudinal portion, so that the inner member is connected to the inner side of the outer member;

[0009] The outer component is manufactured by additive manufacturing technology, and the inner component is die-casted inside the outer component.

[0010] In some embodiments of the present application, the material of the outer component is titanium alloy, and the material of the inner component is aluminum alloy.

[0011] In some embodiments of the present application, the outer component includes a first connecting surface located on the inner side thereof, and a recessed portion is provided on the first connecting surface, and the recessed portion is recessed in a direction away from the inner component.

[0012] In some embodiments of the present application, the lattice in the recessed portion is a lattice that is completely connected in all directions.

[0013] In some embodiments of the present application, the recessed portion includes a recessed portion bottom surface and at least one recessed portion side surface, the recessed portion bottom surface and the first connecting surface are arranged opposite to each other, and the recessed portion side surface is connected to the side edge of the recessed portion bottom surface; the thickness direction of the external component is defined as the first direction, and the direction perpendicular to the thickness direction of the external component is defined as the second direction; the recessed portion has a top opening, the extension width of the top opening along the second direction is D1, and the extension width of the recessed portion bottom surface along the second direction is D2, and D2≥D1.

[0014] In some embodiments of the present application, an extension depth of the recessed portion along the first direction is H1, and 0.5 mm ≤ H1 ≤ 1.5 mm.

[0015] In some embodiments of the present application, an extension width D1 of the top opening along the second direction is any value between 2 mm and 4 mm.

[0016] In some embodiments of the present application, the angle between the side surface of the recessed portion and the bottom surface of the recessed portion is θ. It should be noted that 30°≤θ≤60°.

[0017] The present application provides an electronic device, characterized by comprising an electronic device middle frame provided by the present application.

[0018] The present application provides a method for manufacturing a middle frame of an electronic device, characterized by comprising:

[0019] S1: inputting a model of an external component into a controller of a metal powder bed, and manufacturing the external component using an additive manufacturing technology;

[0020] S2: Assembling the external component into a die-casting mold as an insert in a die-casting mold;

[0021] S3: Combining the inner component and the outer component by die casting, and die casting the integral features of the inner component;

[0022] S4: The die-cast electronic device middle frame is subjected to CNC precision machining of the assembly surface and the polished surface.

[0023] This application has at least the following positive effects:

[0024] The present invention provides a middle frame of an electronic device, comprising an outer component and an inner component, the outer component comprising a first transverse portion and a first longitudinal portion; the inner component comprising a second transverse portion and a second longitudinal portion; the second transverse portion is connected to the inner side of the first transverse portion, and the second longitudinal portion is connected to the inner side of the first longitudinal portion, so that the inner component is connected to the inner side of the outer component; the outer component is made by additive manufacturing technology and is made by processing a metal powder bed layer by layer. The outer component does not need to be separately made into a first transverse portion and a first longitudinal portion and then connected again. The outer component is made into an integral part by the metal powder bed additive manufacturing technology, the processing steps are simple, and material waste is less. The inner component is die-cast on the inner side of the outer component. The inner component is die-cast as an integral part, and there is no need to generate the second transverse portion and the second longitudinal portion separately and then connect them. The processing steps are simple, the inner component and the outer component are manufactured separately, which facilitates the selection of different materials for the inner component and the outer component, and can meet the appearance requirements of the outer component and the strength requirements of the inner component. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 A schematic diagram of a metal middle frame of an electronic device provided by an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of an outer component of a metal middle frame of an electronic device provided by an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of a partial structure of an outer part of a metal middle frame of an electronic device provided by an embodiment of the present invention being cut off by a plane;

[0029] Figure 4 A schematic diagram of internal components of a metal middle frame of an electronic device provided by an embodiment of the present invention;

[0030] Figure 5 A front view and an AA-direction cross-sectional view of an outer component of a metal middle frame of an electronic device provided by an embodiment of the present invention;

[0031] Figure 6 for Figure 5 The enlarged view in B;

[0032] Figure 7 for Figure 5 The enlarged view in B;

[0033] Figure 8A partial view and a partial enlarged view of an outer part of a metal middle frame of an electronic device provided by an embodiment of the present invention;

[0034] Fig. 9 A schematic diagram of a lattice structure in a recessed portion of a metal middle frame of an electronic device provided by an embodiment of the present invention;

[0035] Icon: 100, middle frame of electronic device; 1, external component; 11, first transverse portion; 12, first longitudinal portion; 13, first connecting surface; 14, recessed portion; 141, bottom surface of recessed portion; 142, side surface of recessed portion; 143, top opening; 15, lattice; 2, internal component; 21, second transverse portion; 22, second longitudinal portion; 23, protruding portion. DETAILED DESCRIPTION

[0036] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0038] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0039] In the present invention, unless otherwise clearly specified and limited, a first feature being above or below a second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, a first feature being above, above, and above a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being below, below, and below a second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] In the prior art, a conventional electronic device middle frame 100 is divided into four metal parts, namely, upper, lower, left, and right parts. The four metal parts are formed by die casting or forging, and then connected into one by CNC precision machining and / or nano injection molding (NMT) to form a final integrated electronic device middle frame 100.

[0041] Since four metal parts need to be manufactured separately, the steps of producing the electronic device middle frame 100 are relatively complicated and the manufacturing cost is high. In addition, the CNC precision machining of the electronic device middle frame 100 results in serious waste of materials and low material utilization. The outer side and inner side of the electronic device middle frame 100 formed by die casting or forging are made of the same material, and the different material requirements for the outer side and inner side of the electronic device middle frame 100 cannot be met. The material and appearance effect of the electronic device middle frame 100 are limited.

[0042] Reference Figure 1-9 The present application provides an electronic device middle frame 100 manufactured by an additive manufacturing method, including two metal materials. The two metal materials are tightly attached to each other. The manufacturing precision of the electronic device middle frame 100 is high, which can meet the appearance requirements of the appearance surface of the electronic device middle frame 100, and at the same time take into account the connection requirements of the inner side of the electronic device middle frame 100.

[0043] The electronic device middle frame 100 includes an outer part 1 and an inner part 2 , wherein the inner part 2 is connected in the middle of the outer part 1 . The outer component 1 includes a first transverse portion 11 and a first longitudinal portion 12, and the inner component 2 includes a second transverse portion 21 and a second longitudinal portion 22. The second transverse portion 21 is connected to the inner side of the first transverse portion 11, and the second longitudinal portion 22 is connected to the inner side of the first longitudinal portion 12, so that the inner component 2 is connected to the inner side of the outer component 1. The outer component 1 is made by additive manufacturing technology and is made by processing a metal powder bed layer by layer. The outer component 1 does not need to be separately made into the first transverse portion 11 and the first longitudinal portion 12 and then connected again. The outer component 1 is made into an integral part by the metal powder bed additive manufacturing technology, and the processing steps are simple and the material waste is less. The inner component 2 is die-cast on the inner side of the outer component 1. The inner component 2 is die-cast and integrally formed, and there is no need to generate the second transverse portion 21 and the second longitudinal portion 22 separately and then connect them. The processing steps are simple. The inner component 2 and the outer component 1 are manufactured separately, which is convenient for the inner component 2 and the outer component 1 to select different materials, and can meet the appearance requirements of the outer component 1 and the strength requirements of the inner component 2.

[0044] In the prior art, since four metal parts need to be manufactured separately, the steps for producing the electronic device middle frame 100 are relatively cumbersome and the manufacturing cost is high. The present application only needs to produce two parts, which improves the production speed and simplifies the production steps. In the prior art, the CNC precision machining of the electronic device middle frame 100 has serious material waste and low material utilization. The present application adopts additive manufacturing technology, which wastes very little material. In the prior art, the outer side and inner side of the electronic device middle frame 100 formed by die casting or forging are made of the same material. The outer part 1 and the inner part 2 of the present application can be made of two different alloys, which can meet the appearance requirements of the outer part 1 and the strength requirements of the inner part 2, and have significant improvements compared with the prior art.

[0045] Specifically, the outer member 1 includes at least one first transverse portion 11 and at least one first longitudinal portion 12, and the first transverse portion 11 and the first longitudinal portion 12 are connected to form the outer member 1. In some embodiments of the present application, the outer member 1 includes two first transverse portions 11 and two first longitudinal portions 12, the two first transverse portions 11 are arranged opposite to each other, and the two first longitudinal portions 12 are respectively connected to the two ends of the two first transverse portions 11, and the outer member 1 is similar to a rectangular parallelepiped with a hollow center.

[0046] In some embodiments of the present application, the connection between two connected parts of the outer part 1 is provided with rounded corners, so that the two adjacent parts have a smooth transition at the connection and have a more beautiful appearance.

[0047] The shapes and sizes of the inner component 2 and the outer component 1 match each other so that the inner component 2 fits tightly against the inner side of the outer component 1. The inner component 2 includes at least one second transverse portion 21 extending transversely and at least one second longitudinal portion 22 extending longitudinally.

[0048] The first transverse portion 11 and the second transverse portion 21 extend along the width direction of the electronic device, so that the first transverse portion 11 and the second transverse portion 21 are closely attached to the upper side and the lower side of the electronic device.

[0049] The first longitudinal portion 12 and the second longitudinal portion 22 extend along the length direction of the electronic device, so that the first longitudinal portion 12 and the second longitudinal portion 22 are close to the left side and the right side of the electronic device.

[0050] The maximum width of the first transverse portion 11 extending along the width direction of the electronic device is D1, and the maximum width of the second transverse portion 21 extending along the width direction of the electronic device is D2, D1>D2; the maximum length of the first longitudinal portion 12 extending along the length direction of the electronic device is L1, and the maximum length of the second longitudinal portion 22 extending along the length direction of the electronic device is L2, L1>L2, so that the inner component 2 is connected to the inner side of the outer component 1.

[0051] The outer component 1 and the inner component 2 are made of two different metal materials, so that the outer component 1 meets the metal appearance requirement, and the inner component 2 meets the requirements of close fit with the electronic equipment and shock absorption.

[0052] In some embodiments of the present application, the material of the outer component 1 is titanium alloy, and the material of the inner component 2 is aluminum alloy. Titanium alloy has a relatively high-end metal texture, and the weight of titanium alloy is relatively light, which can reduce the weight of the electronic device middle frame 100. The weight of aluminum alloy is relatively light, which can reduce the overall weight of the electronic device, and can reduce the overall cost of the electronic device middle frame 100. Aluminum alloy has high strength, and the probability of deformation during long-term use is low. Aluminum alloy also has good corrosion resistance, which can reduce the probability of deformation of the electronic device middle frame 100 due to corrosion during long-term use of the electronic device.

[0053] In the prior art, the electronic device middle frame 100 is mostly made of stainless steel and / or aluminum alloy materials. Stainless steel is heavy, and the surface of aluminum alloy has an oxide film, which results in poor metallic gloss of aluminum alloy. The outer component 1 of the electronic device middle frame 100 of the present application is titanium alloy, and the inner component 2 is aluminum alloy. The density of titanium alloy is much lower than that of stainless steel, which can effectively reduce the weight of the electronic device middle frame 100. Titanium alloy as the outer component 1 has a good metallic texture compared to aluminum alloy, and the use of aluminum alloy for the inner component 2 can reduce the cost of the electronic device middle frame 100. The present application is a significant improvement over the prior art.

[0054] In some embodiments of the present application, the outer component 1 is an integral component manufactured by metal additive manufacturing technology, and the inner component is an integral component manufactured by metal additive manufacturing technology.

[0055] Metal additive manufacturing is a metal manufacturing technology with a high yield rate. This technology uses laser as an energy source. According to the path planned in the three-dimensional model, it is layered on the metal powder bed. The heat of the laser beam melts and solidifies the metal powder, thereby achieving metallurgical bonding and finally manufacturing metal parts of the designed shape. Compared with traditional precision machining, which is subtractive manufacturing, this technology is additive manufacturing. Compared with traditional CNC precision machining, it has a higher material utilization rate and lower manufacturing cost.

[0056] Since the outer part 1 of the present application is made of titanium alloy material, it is difficult to process titanium alloy material with traditional precision machining technology, the yield rate is low, the tool wear is serious, the cost is high, and it is difficult to process titanium alloy material with complex structure. Selective laser melting technology SLM is one of the metal additive manufacturing technologies. It uses a 30-100μm fine laser spot to scan the selected area on the newly laid powder layer point by point in line. After forming the surface contour, the layers are stacked and formed to directly obtain functional parts of almost any shape and with complete metallurgical bonding, with a density of nearly 100%. SLM can form parts of arbitrarily complex structures, improve design freedom, break through traditional machining constraints, and meet the manufacturing needs of parts based on the functionality of the parts.

[0057] In some embodiments of the present application, the outer part 1 includes a first inner connecting surface located on the inner side thereof, and the first inner connecting surface is in the shape of an elongated strip, and its width is the thickness of the outer part 1. Depending on the shape of the outer part 1, the first inner connecting surface is in the shape of an annular or bent strip.

[0058] A recessed portion 14 is provided in the middle of the first connecting surface 13. The recessed portion 14 may be a strip-shaped groove. When the inner aluminum alloy is die-cast on the outer titanium alloy component 1, the recessed portion 14 can increase the contact area between the titanium alloy and the aluminum alloy, so that the titanium alloy and the aluminum alloy are closely attached to meet the strength required for the combination of the titanium alloy and the aluminum alloy.

[0059] In some embodiments of the present application, a lattice 15 structure is provided in the recess 14. When the inner component 2 of the aluminum alloy is die-cast inside the outer component 1 of the titanium alloy, the outer side surface of the inner component 2 and the lattice 15 structure inside the recess 14 are tightly fitted to increase the bonding strength between the aluminum alloy and the titanium alloy, thereby meeting the strength required for the bonding of the titanium alloy and the aluminum alloy.

[0060] Specifically, the lattice 15 structure in the recessed portion 14 is a completely through lattice 15, which can effectively increase the contact area between the titanium alloy and the aluminum alloy, so that the aluminum alloy in the die-casting process can be tightly embedded in the titanium alloy, thereby enhancing the bonding strength between the aluminum alloy and the titanium alloy.

[0061] In some embodiments of the present application, the lattice 15 structure within the recess 14 is designed and formed by lattice 15 design software, and the lattice 15 is directly generated by metal powder bed processing. The lattice 15 structure is isotropically penetrating. When the titanium alloy and the aluminum alloy are die-cast, the lattice 15 structure can increase the contact area between the aluminum alloy and the titanium alloy, so as to make the bonding degree between the aluminum alloy and the titanium alloy higher. During the long-term use of the metal electronic device middle frame 100, the probability of separation of the aluminum alloy and the titanium alloy is greatly reduced.

[0062] In other embodiments of the present application, the recessed portion 14 is provided with a frosted surface or a concave-convex surface to increase the contact area between the aluminum alloy and the titanium alloy during the die-casting process, thereby enhancing the bonding strength between the aluminum alloy and the titanium alloy.

[0063] It should be noted that a rough surface is provided in the recessed portion 14 to increase the contact area. The structure of the rough surface is set according to the properties of the alloy and the bonding strength. The rough surface is not limited to a surface with a lattice 15 structure, a frosted surface and a concave-convex surface. The rough surface structure that can enhance the contact area between the aluminum alloy and the titanium alloy is within the protection scope of this application.

[0064] In some embodiments of the present application, the recessed portion 14 includes a recessed portion bottom surface 141 and a recessed portion side surface 142. The recessed portion bottom surface 141 and the first inner connecting surface are arranged opposite to each other. The recessed portion side surface 142 is connected to the two side edges of the recessed portion bottom surface 141. The recessed portion side surface 142 at least partially extends along the thickness direction of the outer component 1 so that the recessed portion 14 has a certain depth, so that the aluminum alloy melted during the die-casting process flows into the recessed portion 14 and solidifies in the recessed portion 14, thereby enhancing the connection strength between the recessed portion 14 and the aluminum alloy.

[0065] The thickness direction of the outer member 1 is defined as a first direction, and the direction perpendicular to the thickness direction of the outer member 1 is defined as a second direction.

[0066] The depth of the recessed portion 14 along the first direction is H1, 0.5mm≤H1≤1.5mm, so that a small amount of aluminum alloy melted during the die-casting process can enter the recessed portion 14, and the molten aluminum alloy can fully contact the recessed portion 14, thereby enhancing the bonding strength between the aluminum alloy and the titanium alloy; and the depth of the recessed portion 14 is relatively shallow, so a large amount of aluminum alloy does not need to be melted to fill the recessed portion 14, which can reduce the impact on the original shape of the aluminum alloy during the die-casting process.

[0067] The width of the top opening 143 of the recessed portion 14 along the second direction is D2, 2mm≤D2≤4mm, so that the aluminum alloy in the die-casting process can enter the recessed portion 14 through the top opening 143 of the recessed portion 14, D2≤4mm allows the aluminum alloy to flow into the recessed portion 14 during the die-casting process and can reduce the volume of the recessed portion 14; 2mm≤D2 allows the aluminum alloy in the die-casting process to flow into the recessed portion 14 faster and shorten the die-casting time.

[0068] A plane extending along the first direction and the second direction is defined as a first plane. A cross section of the recessed portion 14 cut by the first plane is a trapezoid with a top opening 143 .

[0069] Specifically, the extension length of the bottom surface 141 of the recessed portion along the second direction is D3, and D3 ≥ D2, so that the volume of the recessed portion 14 gradually expands from the top opening 143 to the outside.

[0070] The side surface 142 of the recessed portion and the bottom surface 141 of the recessed portion are set at an angle. In some embodiments, the angle between the side surface 142 of the recessed portion and the bottom surface 141 of the recessed portion is θ, 30°≤θ≤60°. On the one hand, the molten aluminum alloy in the die-casting process can gradually flow to the bottom surface 141 of the recessed portion along the inclined side surface 142 of the recessed portion, and the side surface 142 of the recessed portion plays a role of guiding flow. On the other hand, after the die-casting is completed, the aluminum alloy flows into the recessed portion 14. When the aluminum alloy and the titanium alloy have a tendency to separate, that is, the aluminum alloy moves in a direction away from the bottom surface 141 of the recessed portion or has a tendency to move, the side surface 142 of the recessed portion gives the aluminum alloy a force toward the bottom surface 141 of the recessed portion, so that part of the aluminum alloy is limited inside the recessed portion 14, and the aluminum alloy inside the recessed portion 14 cannot separate from the recessed portion 14, so as to enhance the bonding strength between the aluminum alloy and the titanium alloy.

[0071] In some embodiments of the present application, at least one protrusion 23 is provided on the inner side surface of the inner component 2 .

[0072] The protrusion 23 extends toward the center of the inner part 2. During the die-casting process, the protrusion 23 can be clamped or squeezed to make the inner part 2 close to the outer part 1, making the operation during the die-casting process more convenient. After the die-casting is completed, the protrusion 23 can be cut off or ground off to make the inner side of the inner part 2 smoother.

[0073] It can be arranged that there are two protrusions 23, the two protrusions 23 are arranged opposite to each other, and the two protrusions 23 are respectively connected to the inner side surface of the second longitudinal portion 22. The two protrusions 23 can make the inner component 2 more evenly stressed during the die-casting process.

[0074] In some embodiments of the present application, the cross section of the recessed portion 14 cut by the first plane is a quadrilateral with a top opening 143, and at least one side of the quadrilateral is curved. That is, at least one side surface 142 of the recessed portion is a curved surface, and the angle between the tangent direction of the recessed portion side surface 142 of the curved surface and the bottom surface 141 of the recessed portion is α, 30°≤α≤60°, and the recessed portion side surface 142 of the curved surface has a better flow guiding effect, and the molten aluminum alloy in the die-casting process can gradually flow to the bottom surface 141 of the recessed portion along the inclined recessed portion side surface 142, and the aluminum alloy flows more smoothly along the side surface of the recessed portion 14 of the curved surface.

[0075] It can be arranged that one side surface 142 of the recessed portion 14 is a curved surface, and the other side surface 142 of the recessed portion 14 is a flat surface.

[0076] Optionally, the two recessed portion side surfaces 142 of the recessed portion 14 are curved surfaces.

[0077] It should be noted that the recessed portion side surface 142 can be set to different planes and curved surfaces as needed, and is not limited to the embodiments in the drawings of the present application. Embodiments in which the recessed portion side surface 142 is a curved surface or a flat surface are all within the protection scope of the present application.

[0078] The present application provides a method for manufacturing a middle frame 100 of an electronic device:

[0079] S1: inputting the model of the designed external component 1 into the controller of the metal powder bed, and manufacturing the external component 1 by using the metal powder bed with additive manufacturing technology;

[0080] S2: Assemble the outer component 1 into the die-casting mold as an insert in the die-casting mold;

[0081] S3: die-casting the inner part 2 and the outer part 1 together, and die-casting the internal features of the inner part 2;

[0082] S4: The die-cast electronic device middle frame 100 is subjected to CNC precision machining of the assembly surface and the polished surface.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A middle frame of an electronic device, characterized in that: include: an outer member including a first transverse portion and a first longitudinal portion; an inner member, comprising a second transverse portion and a second longitudinal portion; the second transverse portion is connected to the inner side of the first transverse portion, and the second longitudinal portion is connected to the inner side of the first longitudinal portion, so that the inner member is connected to the inner side of the outer member; The outer component is manufactured by additive manufacturing technology, and the inner component is die-casted inside the outer component.

2. The electronic device middle frame according to claim 1, characterized in that: The material of the outer component is titanium alloy, and the material of the inner component is aluminum alloy.

3. The electronic device middle frame according to claim 1 or 2, characterized in that: include: The outer component comprises a first connection surface located on the inner side thereof, a recessed portion is provided on the first connection surface, and the recessed portion is recessed in a direction away from the inner component.

4. The electronic device middle frame according to claim 3, characterized in that: include: The lattice in the recessed portion is a lattice that is completely penetrated in all directions.

5. The electronic device middle frame according to claim 3, characterized in that: include: The recessed portion includes a recessed portion bottom surface and at least one recessed portion side surface, the recessed portion bottom surface and the first connecting surface are arranged opposite to each other, and the recessed portion side surface is connected to the side edge of the recessed portion bottom surface; The thickness direction of the outer component is defined as the first direction, and the direction perpendicular to the thickness direction of the outer component is defined as the second direction; the recessed portion has a top opening, the extension width of the top opening along the second direction is D1, and the extension width of the bottom surface of the recessed portion along the second direction is D2, and D2≥D1.

6. The electronic device middle frame according to claim 5, characterized in that: include: An extension depth of the recessed portion along the first direction is H1, and 0.5 mm≤H1≤1.5 mm.

7. The electronic device middle frame according to claim 5, characterized in that: include: An extension width D1 of the top opening along the second direction is any value between 2 mm and 4 mm.

8. The electronic device middle frame according to claim 5, characterized in that: include: The angle between the side surface of the recessed portion and the bottom surface of the recessed portion is θ, and 30°≤θ≤60°.

9. An electronic device, characterized in that: The electronic device middle frame comprises the electronic device middle frame according to claims 1 to 8.

10. A method for manufacturing a middle frame of an electronic device, characterized in that: include: S1: inputting a model of an external component into a controller of a metal powder bed, and manufacturing the external component using an additive manufacturing technology; S2: Assembling the external component into a die-casting mold as an insert in a die-casting mold; S3: Combining the inner component and the outer component by die casting, and die casting the integral features of the inner component; S4: The die-cast electronic device middle frame is subjected to CNC precision machining of the assembly surface and the polished surface.

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