Semiconductor workpiece box cover body cleaning device and semiconductor workpiece box cleaning equipment

Abstract

The invention relates to a semiconductor workpiece box cover body cleaning device and semiconductor workpiece box cleaning equipment. Comprising a cleaning chamber provided with a containing cavity with an opening in the first direction; the clamping piece is positioned in the accommodating cavity and is used for clamping and fixing the semiconductor workpiece box cover body; the clamping piece comprises a clamping part capable of applying clamping force, and the shape of the clamping part is matched with the shape of the outer side wall of the semiconductor workpiece box cover body; the spraying piece is located in the containing cavity and at least can spray and clean the two ends of the semiconductor workpiece box cover body in the thickness direction; the spraying piece comprises a plurality of nozzles, so that sprayed cleaning liquid covers the outer surface of the semiconductor workpiece box cover body; and the driving piece is connected with the clamping piece and is used for driving the clamping piece to rotate so as to drive the semiconductor workpiece box cover body to rotate. According to the technical scheme, the problem that the cleanliness of the box cover is not enough can be solved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular to a semiconductor workpiece box cover cleaning device and a semiconductor workpiece box cleaning equipment. Background Art

[0002] Semiconductor workpiece boxes, also commonly known as wafer boxes, are turnover containers for semiconductor workpieces during processing or transportation. Semiconductor workpiece boxes are usually made of anti-static and anti-corrosion materials, which can effectively isolate the external environment and prevent dust, moisture and other environmental factors from damaging semiconductor workpieces. They can also meet the needs of automated production and improve production efficiency.

[0003] Taking the Front Opening Unified Pod (FOUP) as an example, the existing cleaning method is to separate the box body and the box cover and then clean them. However, with the development of science and technology, the structure of semiconductors has been further miniaturized. For example, the process technology has developed from 7nm to smaller nodes (such as 5nm and 3nm), and the control of pollutants by integrated circuit manufacturers has reached the sub-micron level. Even tiny particle contaminants in the semiconductor workpiece box can cause surface defects or chemical reactions in advanced processes, affecting the quality of the wafer. As a result, there are more stringent requirements for the cleanliness of semiconductors, but the current cleaning equipment still has the problem of insufficient cleanliness after cleaning. Summary of the invention

[0004] In view of this, the present application provides a semiconductor workpiece box cover cleaning device and a semiconductor workpiece box cleaning equipment to solve at least one problem existing in the background technology.

[0005] To achieve the above purpose, the technical solution of this application is implemented as follows:

[0006] In a first aspect, an embodiment of the present application provides a semiconductor workpiece box cover cleaning device, comprising:

[0007] A cleaning chamber having a receiving cavity opened in a first direction;

[0008] A clamping member, located in the accommodating cavity, for clamping and fixing the semiconductor workpiece box cover; the clamping member comprises a clamping portion capable of applying a clamping force, and the shape of the clamping portion is adapted to the shape of the outer side wall of the semiconductor workpiece box cover;

[0009] A spraying member is located in the accommodating cavity and can at least spray and clean the two ends of the semiconductor workpiece box cover in the thickness direction; the spraying member includes a plurality of nozzles so that the sprayed cleaning liquid covers the outer surface of the semiconductor workpiece box cover;

[0010] A driving member is connected to the clamping member and is used to drive the rotation of the clamping member, thereby driving the rotation of the semiconductor workpiece box cover.

[0011] In combination with the first aspect of the present application, in an optional embodiment, the clamping portion includes a plurality of clamping claws, which are distributed in a ring with the rotation center of the clamping member as the center, and the proportion of the portion of the semiconductor workpiece box cover to be cleaned covered by the clamping claws is less than a first preset value.

[0012] In conjunction with the first aspect of the present application, in an optional implementation manner, the clamping member includes:

[0013] A first clamping member is located at a first end of the accommodating cavity and clamps an end of an outer side wall of the semiconductor workpiece box cover in a first direction;

[0014] A second clamping member is located at the second end of the accommodating cavity and clamps the other end of the outer wall of the semiconductor workpiece box cover in the first direction; the first end is the lower end of the cleaning chamber, and the second end is the upper end of the cleaning chamber;

[0015] The driving member is connected to the first clamping member and drives the first clamping member to rotate, and the second clamping member is linked to the first clamping member.

[0016] In conjunction with the first aspect of the present application, in an optional implementation manner, the spray element includes:

[0017] A first spraying member is located at a first end of the accommodating cavity in a first direction and faces one end of the semiconductor workpiece box cover;

[0018] The second spraying member is located at the second end of the accommodating cavity in the first direction and faces the other end of the semiconductor workpiece box cover.

[0019] In conjunction with the first aspect of the present application, in an optional implementation manner, the spray element includes:

[0020] The third spraying member is located at the peripheral side of the accommodating cavity and is used for cleaning the outer side wall of the semiconductor workpiece box cover.

[0021] In combination with the first aspect of the present application, in an optional embodiment, the second spray part includes a spray rod and a support rod, and the spray rod can rotate to the peripheral side of the accommodating cavity with the support rod as the rotation axis to make way for the semiconductor workpiece box cover to enter and exit from the opening of the cleaning chamber.

[0022] In combination with the first aspect of the present application, in an optional embodiment, the first clamping member and / or the second clamping member can achieve expansion and contraction in the thickness direction of the semiconductor workpiece box cover to better clamp the semiconductor workpiece box cover.

[0023] In combination with the first aspect of the present application, in an optional embodiment, the upper surface of the semiconductor workpiece box cover includes a locking hole; the upper surface of the semiconductor workpiece box cover faces the first end or the second end of the accommodating cavity; the clamping member is provided with a locking hole covering member extending from the circumference of the accommodating cavity to the center, and the locking hole covering member is provided with a blocking block corresponding to the locking hole, and when the clamping member fixes the semiconductor workpiece box cover, the blocking block can block the locking hole.

[0024] In combination with the first aspect of the present application, in an optional embodiment, the clamping claw is arranged at a position corresponding to a lock body channel of a side wall of the semiconductor workpiece box cover, and the clamping claw fits against the side wall of the semiconductor workpiece box cover to block the lock body channel.

[0025] In a second aspect, an embodiment of the present application provides a semiconductor workpiece box cleaning device, comprising any one of the semiconductor workpiece box cover cleaning devices described above.

[0026] The semiconductor workpiece box cover cleaning device and the semiconductor workpiece box cleaning equipment provided in the embodiments of the present application include: a cleaning chamber, having a accommodating cavity opening in a first direction; a clamping member, located in the accommodating cavity, used to clamp and fix the semiconductor workpiece box cover; the clamping member includes a clamping portion capable of applying a clamping force, and the shape of the clamping portion is adapted to the shape of the outer wall of the semiconductor workpiece box cover; a spraying member, located in the accommodating cavity, capable of spraying and cleaning at least both ends of the semiconductor workpiece box cover in the thickness direction; the spraying member includes a plurality of nozzles so that the sprayed cleaning liquid covers the outer surface of the semiconductor workpiece box cover; a driving member, connected to the clamping member, used to drive the rotation of the clamping member, thereby driving the rotation of the semiconductor workpiece box cover. It can be seen that the semiconductor workpiece box cover cleaning device and semiconductor workpiece box cleaning equipment of the embodiment of the present application are provided with a clamping member clamped from the outer side wall of the semiconductor workpiece box cover, which will not block the cleaning of the upper and lower end surfaces of the semiconductor workpiece box cover during cleaning, and a spraying member is provided that can spray and clean at least both ends of the semiconductor workpiece box cover in the thickness direction; the semiconductor workpiece box cover can be cleaned more comprehensively, and the problem of insufficient cleanliness can be solved. Therefore, the semiconductor workpiece box cover cleaning device and semiconductor workpiece box cleaning equipment of the embodiment of the present application can solve the problem of insufficient cleanliness of the box cover.

[0027] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0029] Figure 1 It is a schematic diagram of a semiconductor workpiece box cover;

[0030] Figure 2 A schematic diagram of a semiconductor workpiece box cover cleaning device provided in an embodiment of the present application;

[0031] Figure 3 for Figure 2 A schematic diagram of the projection in the top view after removing the cleaning chamber;

[0032] Figure 4 A schematic diagram of a first clamping member in a semiconductor workpiece box cover cleaning device provided in an embodiment of the present application;

[0033] Figure 5 A schematic diagram of a second clamping member in a semiconductor workpiece box cover cleaning device provided in an embodiment of the present application.

[0034] Description of reference numerals:

[0035] 10. Box cover; 11. First surface; 12. Lock hole; 13. Lock body channel; 20. Cleaning chamber; 31. First clamping member; 311. First rotating shaft; 312. Chassis; 313. Clamping arm; 314. Lock hole shielding member; 315. Block; 32. Second clamping member; 321. Second rotating shaft; 322. Clamping plate; 323. Clamping claw; 324. Reinforcing rod; 40. First spraying member; 41. Nozzle; 50. Second spraying member. DETAILED DESCRIPTION

[0036] In order to make the technical solutions and beneficial effects of the present application more obvious and easy to understand, the following is a detailed description by listing specific embodiments. The drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which the present application belongs.

[0037] In the description of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of simplified description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0038] In this application, the terms "first" and "second" are used only for the purpose of clear description and should not be understood as the relative importance of the indicated features or the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly include at least one of the features. In the description of this application, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly defined, the terms "install", "connect", "connect", "fix", "set", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the present application, unless otherwise clearly defined, a first feature being “on”, “above”, “above”, “below”, “below”, “below” or “below” a second feature may mean that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact with each other through an intermediate medium. Moreover, a first feature being “on”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0041] In order to thoroughly understand the present application, detailed steps and detailed structures will be presented in the following description to illustrate the technical solution of the present application. The preferred embodiments of the present application are described in detail below, but in addition to these detailed descriptions, the present application may also have other implementation methods.

[0042] The semiconductor workpiece box involved in the embodiments of the present application (hereinafter sometimes referred to as "container") can be a semiconductor storage container for storing wafers, or a mask storage box for storing masks, and of course, it can also be a storage box for other purposes. The container includes a box body and a box cover that can be separated, and the container also includes a locking mechanism. The box body and the box cover are locked or unlocked by an external knob assembly, and the box cover can also be separated from the box body. The side wall of the box cover is provided with a lock body channel for the locking mechanism to move, and the surface of the box cover is provided with a lock hole for the external knob assembly to enter and exit the box body to drive the locking mechanism to move.

[0043] The applicant of the present application found in the research and development that when cleaning the box cover of the semiconductor workpiece box, the existing cleaning method generally only cleans the lower surface of the box cover (i.e., the surface in contact with the box body). Figure 1 . This cleaning method has the following disadvantages: 1. The upper surface of the box cover (called the first surface 11) is not effectively cleaned. In the subsequent processing process (drying, locking or transferring the semiconductor workpiece box), the contaminants on the upper surface of the box cover will cause contamination to the cleaned box cover and box body; 2. In the process of cleaning the lower surface, part of the cleaning liquid will splash onto the upper surface of the box cover. The cleaning liquid on the upper surface of the box cover will also cause contamination to the box cover and box body when dripping. With the development of process technology from 7nm to smaller nodes (such as 5nm, 3nm), integrated circuit manufacturers have reached the sub-micron level in the control of pollutants. Even tiny particle contaminants in the semiconductor workpiece box can cause surface defects or chemical reactions in advanced processes, affecting the quality of the wafer. Cleaning the lower surface of the box cover alone can no longer meet the cleaning needs.

[0044] It should be noted that, in the introduction of the technical solution of the present application, the upper surface and the lower surface of the box cover are distinguished by the specific structure rather than the orientation when placed.

[0045] Therefore, after further research and development by the applicant, the following technical solution was proposed.

[0046] The present application provides a semiconductor workpiece box cover cleaning device. Figure 2 , the semiconductor workpiece box cover cleaning device comprises:

[0047] The cleaning chamber 20 has a receiving cavity opened in a first direction;

[0048] A clamping member, located in the accommodating cavity, for clamping and fixing the semiconductor workpiece box cover; the clamping member comprises a clamping portion capable of applying a clamping force, and the shape of the clamping portion is adapted to the shape of the outer side wall of the semiconductor workpiece box cover;

[0049] A spraying member, located in the accommodating cavity, can at least spray and clean the two ends of the semiconductor workpiece box cover in the thickness direction; the spraying member includes a plurality of nozzles 41, so that the sprayed cleaning liquid covers the outer surface of the semiconductor workpiece box cover;

[0050] A driving member is connected to the clamping member and is used to drive the rotation of the clamping member, thereby driving the rotation of the semiconductor workpiece box cover.

[0051] The semiconductor workpiece box cover can be a FOUP or other types of semiconductor turnover equipment, such as a front opening shipping box (FOSB) and a mask box. For simplicity, in the following description, the semiconductor workpiece box cover can be referred to as a box cover 10, that is, the semiconductor workpiece box cover and the box cover 10 have the same meaning.

[0052] It is understandable that the shape of the cleaning chamber 20 can be circular or rectangular. It is understandable that it can also be other shapes that are convenient for placing the box cover 10. In the working state, the first direction can be the vertical direction, i.e. the top opening, or the horizontal direction, i.e. the side wall opening. Of course, no matter the top opening or the side wall, the direction in which the box cover 10 is placed can be the same, so that it is necessary to distinguish the top opening from the side wall opening.

[0053] In this embodiment, reference Figure 2 , the box cover 10 is placed with the lower surface or the upper surface facing downward. Figure 2 The directions in the introduction.

[0054] In the prior art, the box cover 10 is generally fixed to an inner wall of the cleaning chamber 20, such as the top wall, so that the top of the box cover 10 cannot be cleaned. The embodiment of the present application creatively provides a clamping member that only clamps the edge of the box cover 10, so that most of the surface of the box cover 10 that needs to be cleaned is exposed.

[0055] It is understandable that, since the box cover 10 is a flat part, the surface areas of the two end faces of the box cover 10 in the thickness direction are relatively large, and are also the main cleaning areas. Therefore, the spraying member is arranged to be able to spray and clean at least at both ends of the box cover 10 in the thickness direction. That is, the spraying direction is more comprehensive. In addition, the spraying member includes a plurality of nozzles 41, which can be more comprehensive in the spraying area.

[0056] Furthermore, on the basis of comprehensive spraying direction and spraying area, the rotation of the box cover 10 is increased. First, the cleaning range of a single nozzle is improved to achieve the purpose of covering the entire box cover surface with fewer nozzles. Second, the flow rate of the cleaning liquid on the surface of the box cover 10 can also be increased to provide a cleaning effect. Third, after cleaning is completed, the centrifugal force generated by the rotation of the box cover can accelerate the removal of the cleaning liquid on the surface of the box cover.

[0057] The semiconductor workpiece box cover cleaning device and the semiconductor workpiece box cleaning equipment of the embodiments of the present application are provided with a clamping member clamped from the outer wall of the semiconductor workpiece box cover, which will not block the cleaning of the upper and lower end surfaces of the semiconductor workpiece box cover during cleaning, and a spraying member is provided that can spray and clean at least both ends of the semiconductor workpiece box cover in the thickness direction; the semiconductor workpiece box cover can be cleaned more comprehensively, and the problem of insufficient cleanliness of the box cover can be solved.

[0058] In other embodiments of the present application, the clamping portion includes a plurality of clamping claws 323, which are distributed in a ring with the rotation center of the clamping member as the center, and the proportion of the portion of the semiconductor workpiece box cover to be cleaned covered by the clamping claws 323 is less than a first preset value.

[0059] The annular distribution can maintain stable clamping while minimizing the obstruction of the cleaning surface. The annular distribution can be annularly evenly distributed, for example, 4 or 8 clamping claws 323 are provided. It can be understood that the clamping member may not be annularly distributed, as long as it can firmly clamp the box cover during cleaning.

[0060] Specifically, the first preset value may be 4%-8%, so that there is a stable clamping force and less obstruction.

[0061] In some other embodiments of the present application, the clamping member includes:

[0062] A first clamping member 31 is located at a first end of the accommodating cavity and clamps an end of an outer side wall of the semiconductor workpiece box cover in a first direction;

[0063] The second clamping member 32 is located at the second end of the accommodating cavity and clamps the other end of the outer wall of the semiconductor workpiece box cover in the first direction; the first end is the lower end of the cleaning chamber, and the second end is the upper end of the cleaning chamber;

[0064] The driving member is connected to the first clamping member 31 and drives the first clamping member 31 to rotate, and the second clamping member 32 is linked to the first clamping member 31 .

[0065] The two clamping members can make the clamping force more uniform and the clamping more stable, and is also conducive to the flexible arrangement of the driving member, for example, the driving member can be arranged at one end of the cleaning chamber 20 where the first clamping member 31 is arranged, or at the other end where the second clamping member 32 is arranged.

[0066] It can be understood that the first clamping member 31 and the second clamping member 32 may not apply a clamping force. The box cover 10 can be placed only in the placement space formed by the first clamping member 31, and then the first clamping member 31 is used to limit the position of the box cover 10 from above, so that the position of the box cover 10 is stationary relative to the placement space. And by setting the clamping surface shape of the first clamping member 31 and the second clamping member 32, the box cover 10 cannot slide relative to the first clamping member 31 and the second clamping member 32. In this way, when the first clamping member 31 rotates, the box cover 10 rotates with the first clamping member 31 or the second clamping member 32. For example, when the box cover 10 is rectangular, that is, the side wall of the box cover 10 in contact with the first clamping member 31 and the second clamping member 32 is a plane. In this way, when the first clamping member 31 rotates, the box cover 10 cannot slide relative to the first clamping member 31 and the second clamping member 32.

[0067] Further, when cleaning, the upper surface of the box cover 10, that is, the first surface 11, is placed toward the first end, that is, downward. In this way, the cleaning effect of the box cover 10 is better, and the cleaning liquid mixed with pollutants on the upper surface of the box cover 10 can be prevented from splashing onto the lower surface of the box cover to cause secondary pollution. Because, if the lower surface of the box cover 10 faces the first end of the accommodating cavity, the cleaning liquid sprayed on the upper surface of the box cover 10 will flow to the lower surface of the box cover 10 under the action of gravity, causing pollution to the lower surface of the box cover 10. It can be understood that in the process of storing semiconductor workpieces in the semiconductor workpiece box, the first surface of the box cover is the surface of the semiconductor workpiece box in contact with the outside world, and the pollutant residue on its surface is relatively large relative to the lower surface of the box cover (that is, the pollutant residue on the surfaces of the two is not of the same order of magnitude), and the lower surface of the box cover 10 is the part of the wafer box that directly faces the wafer, and has higher requirements for cleanliness. Therefore, to ensure the cleanliness of the lower surface of the box cover, it is necessary to avoid the probability of the cleaning liquid on the first surface of the cleaning box cover splashing onto the lower surface of the box cover as much as possible.

[0068] Understandably, this is also the reason introduced above that the residual pollutants on the lower surface of the box cover after cleaning by the cleaning equipment in the prior art still cannot meet the cleaning requirements.

[0069] In this embodiment, the driving member is arranged at an end away from the opening. In this way, the influence of the switch at the opening on the driving member is reduced. Specifically, the cleaning device is provided with a first rotating shaft 311, which passes through the bottom wall of the cleaning chamber 20, is connected to the driving member at one end, and is connected to the first clamping member 31 at the other end, so as to transmit the torque of the driving member to the first clamping member 31. It can be understood that in other embodiments, it can also be arranged at an end close to the opening.

[0070] Specifically, for a cleaning chamber 20 with an opening on the top, the first clamping member 31 is mounted on the bottom wall of the cleaning chamber 20, and the second clamping member 32 can be fixed on the opening and closing door of the cleaning chamber 20, so that when the cleaning chamber 20 is opened, the second clamping member 32 can be moved away with the opening and closing door, and does not hinder the entry and exit of the box cover 10. For a cleaning chamber 20 with an opening on the side wall, the first clamping member 31 and the second clamping member 32 are respectively mounted on the bottom wall and the top wall of the cleaning chamber 20, but in order to clamp the box cover 10, at least one of the first clamping member 31 and the second clamping member 32 can be retracted up and down, as described below.

[0071] Specifically, for a more stable clamping, the first clamping member 31 and the second clamping member 32 are not only in contact with each other in the up-down direction, but also can be connected, for example, by a snap connection. It can be understood that power transmission can also be achieved by other contact methods.

[0072] Specifically, refer to Figure 4 , the first clamping member 31 may include:

[0073] The bottom plate 312 is circular in shape, connected to the first rotating shaft 311, and can rotate along with the rotation of the first rotating shaft 311;

[0074] The clamping arm 313 has one end connected to the chassis 312 and the other end extending outward; the clamping arm 313 includes the clamping portion; and the clamping arm 313 is evenly distributed in the circumference of the chassis 312 .

[0075] The structure of the first clamping member 31 is made more stable by the bottom plate 312 and the clamping arms 313. The clamping arms 313 are evenly distributed in the circumference, so that the moment of inertia is relatively balanced.

[0076] Furthermore, the chassis 312 may also be configured to be partially hollowed out, so that the moment of inertia is small.

[0077] It can be understood that the chassis 312 may also be in other shapes, such as a ring.

[0078] Furthermore, a circumferential sliding groove may be provided on the chassis 312 , and the clamping arm 313 is provided with a slider that can slide in the sliding groove, so that the circumferential position of the clamping arm 313 can be adjusted more conveniently.

[0079] Furthermore, a mounting hole for mounting a spray member located below the box cover can be provided in the middle of the chassis, so that when the clamping member drives the box cover to rotate, the range of the spray member spraying cleaning liquid / gas can cover the surface of the box cover.

[0080] Specifically, refer to Figure 3 and Figure 5 , the second clamping member 32 may include:

[0081] The clamping plate 322 is annular in shape;

[0082] The clamping claw 323 has one end connected to the clamping plate 322 and the other end extending outward; the clamping claw 323 includes the clamping portion; and the clamping claw 323 is evenly distributed in the circumferential direction of the clamping plate 322 .

[0083] The clamping plate 322 is annular in shape, that is, hollow in the middle, so it does not prevent the sprayed cleaning liquid from being sprayed onto the surface of the box cover 10. And the moment of inertia is small.

[0084] Like the first clamping member 31, the second clamping member 32 is more stable through the base plate 312 and the clamping arm 313. The clamping claws 323 are evenly distributed around the circumference, so that the moment of inertia is relatively balanced.

[0085] Furthermore, the second clamping member 32 may further include a reinforcing rod 324 , and two ends of the reinforcing rod 324 are respectively connected to two side walls of the clamping plate 322 .

[0086] On the one hand, the reinforcing rod 324 is similar to the spokes of a wheel, which can make the structure of the supporting plate more stable. On the other hand, a second rotating shaft 321 can be set at the center of the reinforcing rod 324; the second rotating shaft 321 can be rotatably installed on the top wall of the cleaning chamber, and the top wall can be provided with bearings and other parts corresponding to the second rotating shaft. In this way, when the second clamping member 32 rotates, the resistance to rotation can be greatly reduced, and energy consumption can be reduced.

[0087] In addition, the reinforcing rod 324 is located in the middle of the clamping plate 322, so that the obstruction to the cleaning liquid sprayed by the spraying member can be reduced.

[0088] It should be noted that the size of the reinforcing rod 324 is as small as possible to reduce the obstruction to the cleaning liquid sprayed by the spraying member.

[0089] In some other embodiments of the present application, the spray element includes:

[0090] A first spraying member 40 is located at a first end of the accommodating cavity in a first direction and faces one end of the semiconductor workpiece box cover;

[0091] The second spraying member 50 is located at the second end of the accommodating cavity in the first direction and faces the other end of the semiconductor workpiece box cover.

[0092] In order to realize spraying at both ends of the box cover 10 in the thickness direction, two spraying parts are provided, which has a simpler structure and can also be controlled separately, for example, increasing the spraying pressure on the dirtier end.

[0093] In some other embodiments of the present application, the spray element includes:

[0094] The third spraying member is located at the peripheral side of the accommodating cavity and is used for cleaning the outer side wall of the semiconductor workpiece box cover.

[0095] In order to further reduce the dead angle of spraying and clean the box cover 10 more comprehensively, a third spraying member may be provided so that the spraying direction of the spraying member is toward the outer side wall of the box cover 10 .

[0096] In some other embodiments of the present application, the second spray member 50 includes a spray rod and a support rod. The spray rod can rotate to the peripheral side of the accommodating cavity with the support rod as the rotation axis to make way for the semiconductor workpiece box cover to enter and exit from the opening of the cleaning chamber 20.

[0097] In other embodiments, the second spraying member 50 can be directly disposed on the top wall of the cleaning chamber. If the cleaning chamber is open at the top, the second spraying member 50 is disposed on the upper cover of the cleaning chamber and can move with the upper cover without hindering the entry and exit of the box cover. If the cleaning chamber is open on the side wall, the second spraying member 50 does not affect the entry and exit of the box cover.

[0098] It can be understood that the support rod can be on the peripheral side of the accommodating cavity, and the spray rod extends from the peripheral side of the accommodating cavity to the middle of the accommodating cavity. When the box cover 10 needs to be moved in and out of the opening, the spray rod rotates with the support rod as the rotation axis, rotates to the peripheral side of the accommodating cavity, and makes way for the passage. Alternatively, the support rod rotates, driving the spray rod to rotate, so that the spray rod rotates to the peripheral side.

[0099] Specifically, the support rod is arranged in a vertical direction, with the lower end fixed to the bottom wall of the accommodating cavity and the upper end extending upward. The spray rod is rotatably mounted on the upper end of the support rod. When the box cover 10 needs to enter and exit the opening, the spray rod rotates to the peripheral side of the accommodating cavity with the support rod as the rotation axis. If the side wall is opened, the spray rod rotates to the peripheral side away from the opening.

[0100] Alternatively, the support rod is rotatably mounted on the bottom wall of the accommodating cavity. When needed, the support rod can be driven to rotate, and the support rod drives the spray rod to rotate, so as to achieve the purpose of making way for the passage.

[0101] In some other embodiments of the present application, the first clamping member 31 and / or the second clamping member 32 can achieve expansion and contraction in the thickness direction of the semiconductor workpiece box cover to better clamp the semiconductor workpiece box cover.

[0102] Since the cleaning of the box cover 10 is batch-wise, each time a box cover 10 is cleaned, it needs to be disassembled and installed, which may cause wear of the clamping member, while the retractable setting can prevent the clamping from being affected after wear. In addition, the retractable setting can also reduce the problem of insufficient contact area between the clamping member and the box cover 10 due to design or processing errors.

[0103] It is understandable that, since the first clamping member 31 and the second clamping member 32 are connected vertically, it is also possible to have only one of them be retractable, which is low-cost.

[0104] In addition, when the cleaning chamber 20 has an open side wall, the first clamping member 31 and / or the second clamping member 32 can be telescopically arranged to facilitate installation and removal of the box cover 10.

[0105] In other embodiments of the present application, the upper surface of the semiconductor workpiece box cover, i.e., the first surface 11, includes a locking hole 12; the upper surface of the semiconductor workpiece box cover faces the first end or the second end of the accommodating cavity; the clamping member is provided with a locking hole covering member 314 extending from the circumference of the accommodating cavity toward the center, and the locking hole covering member 314 is provided with a blocking block 315 corresponding to the locking hole 12, and when the clamping member fixes the semiconductor workpiece box cover, the blocking block 315 can block the locking hole 12.

[0106] During the research, the applicant discovered that due to the complex structure of the locking mechanism in the internal space of the box cover connected to the keyhole, ordinary drying methods cannot effectively dry the internal space of the box cover. If the cleaning liquid flows into the internal space of the box cover through the keyhole during the cleaning of the box cover, the cleaning liquid flowing into the box cover is not easy to be removed during the drying process of the box cover. The residual cleaning liquid is easy to flow out through the keyhole during the subsequent use of the semiconductor storage container, causing secondary contamination to the semiconductor storage container.

[0107] Therefore, when cleaning, water needs to be prevented from entering the lock hole 12. Therefore, a lock hole shielding member 314 is provided. When the upper surface of the box cover 10 faces the first end of the accommodating cavity, the lock hole shielding member 314 can be provided on the first clamping member 31, otherwise, it can be provided on the second clamping member 32.

[0108] Furthermore, the blocking block 315 may be conical, which is beneficial for sealing.

[0109] Furthermore, when the lock hole shielding member 314 is located on the first clamping member 31 , the blocking block 315 achieves positioning of the box cover by cooperating with the lock hole 12 .

[0110] In a specific implementation, the lock hole shielding member 314 is disposed on the first clamping member 31. Correspondingly, the upper surface of the box cover 10, namely the first surface 11, faces the first end of the accommodating cavity.

[0111] As mentioned above, in this way, the clamping member can better support the placement of the upper surface of the box cover 10 facing downward, thereby achieving a better cleaning effect of the box cover 10 and avoiding the problem of secondary contamination caused by splashing of the cleaning liquid on the upper surface of the box cover 10.

[0112] In some other embodiments of the present application, the clamping claw 323 is disposed at a position corresponding to the lock channel 13 of the side wall of the semiconductor workpiece box cover, and the clamping claw 323 fits the side wall of the semiconductor workpiece box cover to block the lock channel 13 .

[0113] It can be understood that the clamping claw 323 fits the side wall of the semiconductor workpiece box cover body, which can have a greater clamping force. For example, if the box cover 10 is circular and the side wall is arc-shaped, then the clamping surface of the clamping claw 323 is also set to be arc-shaped accordingly. For another example, if the box cover 10 is rectangular and the side wall is flat, then the clamping surface of the clamping claw 323 is also set to be flat accordingly. In this way, the clamping connection area is large and the clamping is more stable.

[0114] Like the lock hole 12, the lock body channel is also connected to the inner space of the box cover, so water also needs to be prevented from entering the lock body channel 13. Since the clamping claw 323 fits the side wall of the box cover 10 and the position of the clamping claw 323 corresponds to the lock body channel 13, the clamping surface of the clamping claw 323 can achieve the purpose of blocking the lock body channel 13 without the need for an additional blocking member.

[0115] If there is more than one lock body channel 13 on a side wall, for example Figure 1 If there are 2, then Figure 4 On the basis of, increase the number of grippers.

[0116] An embodiment of the present application also provides a semiconductor workpiece box cleaning device, including any one of the semiconductor workpiece box cover cleaning devices described above.

[0117] The semiconductor workpiece box cleaning equipment of the embodiment of the present application is provided with a clamping piece clamped from the outer wall of the semiconductor workpiece box cover body, which will not block the cleaning of the upper and lower end surfaces of the semiconductor workpiece box cover body during cleaning, and is provided with a spraying piece that can at least spray and clean the two ends of the semiconductor workpiece box cover body in the thickness direction; the semiconductor workpiece box cover body can be cleaned more comprehensively, and the problem of insufficient cleanliness can be solved.

[0118] It should be understood that the above embodiments are exemplary and are not intended to include all possible implementations included in the technical solution of the present application. Various modifications and changes can also be made on the basis of the above embodiments without departing from the scope disclosed in the present application. Similarly, the various technical features of the above embodiments can also be combined arbitrarily to form other embodiments of the present application that may not be clearly described. Therefore, the above embodiments only express several implementations of the present application and do not limit the scope of protection of the patent of this application.

Claims

1. A semiconductor workpiece box cover cleaning device, characterized in that: include: A cleaning chamber having a receiving cavity opened in a first direction; A clamping member, located in the accommodating cavity, for clamping and fixing the semiconductor workpiece box cover; the clamping member comprises a clamping portion capable of applying a clamping force, and the shape of the clamping portion is adapted to the shape of the outer side wall of the semiconductor workpiece box cover; A spraying member is located in the accommodating cavity and can at least spray and clean the two ends of the semiconductor workpiece box cover in the thickness direction; the spraying member includes a plurality of nozzles so that the sprayed cleaning liquid covers the outer surface of the semiconductor workpiece box cover; A driving member is connected to the clamping member and is used to drive the rotation of the clamping member, thereby driving the rotation of the semiconductor workpiece box cover.

2. The semiconductor workpiece box cover cleaning device according to claim 1, characterized in that: The clamping portion includes a plurality of clamping claws, which are distributed in a ring with the rotation center of the clamping member as the center of the circle, and the proportion of the portion of the semiconductor workpiece box cover body to be cleaned covered by the clamping claws is less than a first preset value.

3. The semiconductor workpiece box cover cleaning device according to claim 1, characterized in that: The clamping member comprises: A first clamping member is located at a first end of the accommodating cavity and clamps an end of an outer side wall of the semiconductor workpiece box cover in a first direction; A second clamping member is located at the second end of the accommodating cavity and clamps the other end of the outer side wall of the semiconductor workpiece box cover in the first direction; the first end is the lower end of the cleaning chamber, and the second end is the upper end of the cleaning chamber; The driving member is connected to the first clamping member and drives the first clamping member to rotate, and the second clamping member is linked to the first clamping member.

4. The semiconductor workpiece box cover cleaning device according to claim 1, characterized in that: The spraying part comprises: A first spraying member is located at a first end of the accommodating cavity in a first direction and faces one end of the semiconductor workpiece box cover; The second spraying member is located at the second end of the accommodating cavity in the first direction and faces the other end of the semiconductor workpiece box cover.

5. The semiconductor workpiece box cover cleaning device according to claim 4, characterized in that: The spraying part comprises: The third spraying member is located at the peripheral side of the accommodating cavity and is used for cleaning the outer side wall of the semiconductor workpiece box cover.

6. The semiconductor workpiece box cover cleaning device according to claim 4, characterized in that: The second spraying member includes a spraying rod and a supporting rod. The spraying rod can rotate to the peripheral side of the accommodating cavity with the supporting rod as the rotation axis to make way for the semiconductor workpiece box cover to enter and exit from the opening of the cleaning chamber.

7. The semiconductor workpiece box cover cleaning device according to claim 3, characterized in that: The first clamping member and / or the second clamping member can realize expansion and contraction in the thickness direction of the semiconductor workpiece box cover body so as to better clamp the semiconductor workpiece box cover body.

8. The semiconductor workpiece box cover cleaning device according to claim 1, characterized in that: The upper surface of the semiconductor workpiece box cover includes a locking hole; the upper surface of the semiconductor workpiece box cover faces the first end or the second end of the accommodating cavity; the clamping member is provided with a locking hole covering member extending from the circumference of the accommodating cavity to the center, and the locking hole covering member is provided with a blocking block corresponding to the locking hole, and when the clamping member fixes the semiconductor workpiece box cover, the blocking block can block the locking hole.

9. The semiconductor workpiece box cover cleaning device according to claim 2, characterized in that: The arrangement position of the clamping claw corresponds to the lock body channel of the side wall of the semiconductor workpiece box cover, and the clamping claw fits the side wall of the semiconductor workpiece box cover to block the lock body channel.

10. A semiconductor workpiece box cleaning device, characterized in that: A semiconductor workpiece box cover cleaning device comprising the device described in any one of claims 1-9.

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