Semiconductor wafer suction robot

Abstract

The application discloses a semiconductor wafer adsorption manipulator and relates to the technical field of semiconductors. The application comprises a bottom plate, the upper surface of the bottom plate is provided with a manipulator, the manipulator is fixedly provided with a connecting seat, the upper surface of the connecting seat is fixedly provided with a vacuum pump, the upper surface of the bottom plate is fixedly provided with a gas storage tank, the gas storage tank is connected with a first gas guide pipe, the other end of the first gas guide pipe is connected with the vacuum pump, the vacuum pump is connected with a second gas guide pipe, the interval of symmetrically arranged suction cups can be adjusted according to the size of a wafer, the connecting block at the output end of the electric telescopic rod can be moved by starting the electric telescopic rod, one of the sliding plates can be driven to move to the middle part of the connecting plate, the two sliding plates can be moved to the middle part of the connecting plate through the inclined plate and the rotating plate, the interval of the suction cups can be adjusted through the rectangular guide pipe and the corrugated pipe, the suction cups can be adapted to wafers with various diameters, and the flexibility and the versatility in use are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a semiconductor wafer adsorption manipulator. BACKGROUND

[0002] In the processing of semiconductor wafers, sometimes need to use the operation such as mechanical arm to transfer the wafer in the chamber, the wafer refers to the silicon wafer used for the manufacture of silicon semiconductor integrated circuit, because its shape is circular, so called wafer, for example, in the test, need to transfer the wafer from the wafer boat (also known as wafer carrier, flower basket, sheet box, sheet basket, etc.) to the test tray in the machine. Among them, the wafer boat is a tool for loading wafers, which includes a plurality of wafer slots, similar to a CD loading device, wafers are clamped in each wafer slot of the wafer carrier one by one.

[0003] The existing manipulator processing equipment cannot be adjusted according to the size of the wafer diameter, thereby reducing the versatility of use, the liquid is left on the surface of the wafer after cleaning, making it difficult for the suction cup to adsorb, and even causing the wafer to fall off, and when the suction cup on the manipulator is partially damaged, it is not convenient to replace quickly, thereby reducing the work efficiency, in view of the above problems, the inventor puts forward a semiconductor wafer adsorption manipulator to solve the above problems. SUMMARY

[0004] In order to solve the problem that the existing manipulator processing equipment cannot be adjusted according to the size of the wafer diameter, thereby reducing the versatility of use, the liquid is left on the surface of the wafer after cleaning, making it difficult for the suction cup to adsorb, and even causing the wafer to fall off, and when the suction cup on the manipulator is partially damaged, it is not convenient to replace quickly, thereby reducing the work efficiency, the purpose of the present application is to provide a semiconductor wafer adsorption manipulator.

[0005] To solve the above technical problems, the present application adopts the following technical scheme: a semiconductor wafer adsorption manipulator, comprising a bottom plate, a manipulator is arranged on the upper surface of the bottom plate, a connecting seat is fixedly arranged on the manipulator, a vacuum pump is fixedly arranged on the upper surface of the connecting seat, a gas storage tank is fixedly arranged on the upper surface of the bottom plate, a first gas guide pipe is connected to the gas storage tank, the other end of the first gas guide pipe is connected with the vacuum pump, a second gas guide pipe is connected to the vacuum pump, a bellows is arranged at the other end of the second gas guide pipe, a rectangular guide pipe is fixedly arranged at the lower end of the bellows, a suction cup is arranged at the lower end of the rectangular guide pipe, a connecting plate is fixedly arranged on the lower surface of the connecting seat, a first through slot is arranged on the upper surface of the connecting plate, and an adjusting and cleaning assembly is connected to the connecting plate.

[0006] The adjusting and cleaning assembly comprises a support frame fixedly connected to the inner surface of the connecting plate, four support frames are arranged symmetrically on the inner surface of the connecting plate, a sliding plate is slidably arranged on the support frame, the rectangular conduit penetrates through the first through slot and the sliding plate, two sliding plates are arranged symmetrically on the inner surface of the connecting plate, the sliding plate is in sliding fit with the inner surface of the connecting plate, a partition plate is fixedly arranged on the inner surface of the connecting plate, an electric telescopic rod is fixedly arranged on the upper surface of the partition plate, a connecting block is arranged at the output end of the electric telescopic rod, the upper surface of the connecting block is fixedly connected to the lower surface of one of the sliding plates, a first circular rod is rotatably arranged between the upper surface of the partition plate and the inner surface of the connecting plate, a rotating plate is fixedly arranged on the outer surface of the first circular rod, a first circular block is rotatably arranged at one end of the rotating plate, an inclined plate is fixedly arranged on the outer surface of the first circular block, a second circular block is rotatably arranged at the other end of the inclined plate, the second circular block is rotatably connected to the lower surface of the sliding plate, a vertical block is fixedly arranged on the lower surface of the sliding plate, a toothed plate is fixedly arranged on the lower surface of the vertical block, a fan blade penetrates through the partition plate, an arc-shaped slot matched with the fan blade is arranged on the partition plate, a second circular rod is rotatably arranged on the upper surface of the partition plate, a first gear is fixedly arranged at the upper end of the second circular rod, the first gear is engaged with the toothed plate, a first spiral bevel gear is fixedly arranged on the outer surface of the second circular rod, a second spiral bevel gear is engaged with the first spiral bevel gear, an inclined rod is fixedly arranged on one side of the second spiral bevel gear, the inclined rod penetrates through the partition plate, and the fan blade is fixedly arranged at the other end of the inclined rod.

[0007] Preferably, the upper surface of the suction cup is fixedly provided with a positioning ring, the side surface of the positioning ring is provided with a insertion hole, the lower end of the rectangular conduit is provided with a positioning groove, the inner surface of the positioning ring and the positioning groove is movably attached, the outer side surface of the rectangular conduit is fixedly provided with a cylinder, the inner surface of the cylinder is fixedly provided with a spring, the other end of the spring is fixedly provided with a circular plate, the inner surface of the cylinder and the circular plate is slidably attached, the side of the circular plate away from the spring is fixedly provided with an insertion block, the insertion block movably penetrates the positioning groove, the insertion block is movably inserted into the insertion hole, the upper surface of the positioning ring is fixedly provided with an annular sealing ring, the inner surface of the positioning groove is provided with an annular sealing groove, the annular sealing ring and the inner surface of the annular sealing groove is movably attached, the cross section of the pull rod is "L" shape, the spring is provided with five, and the spring is annularly arranged between the inner surface of the cylinder and the circular plate, the outer side surface of the cylinder is provided with a second through slot, the second through slot is slidably provided with a pull rod, and the pull rod is fixedly connected with one side of the circular plate, when the old suction cup needs to be disassembled, the circular plate can be moved through the pull rod, the insertion block is separated from the insertion hole, the spring is compressed under stress, the suction cup moves downward under the influence of gravity, the annular sealing ring is separated from the annular sealing groove, and the positioning ring is separated from the positioning groove, so that the old suction cup can be disassembled, then the positioning ring on the new suction cup can be inserted into the positioning groove, and the annular sealing ring on the positioning ring can be further inserted into the annular sealing groove, so that the sealing performance after connection can be improved, and the possibility of liquid leakage can be avoided, and after the pull rod is loosened, the insertion block can be inserted into the insertion hole through the force of the spring, so that the new suction cup can be connected with the rectangular conduit, and quick replacement is facilitated.

[0008] Compared with the prior art, the beneficial effects of the present application are that:

[0009] 1、The present application can adjust the interval of the symmetrically arranged suction cups according to the size of the wafer, and the output end of the electric telescopic rod can be moved by starting the electric telescopic rod, so that one of the sliding plates can be moved to the middle of the connecting plate, and the two sliding plates can be moved to the middle of the connecting plate through the inclined plate and the rotating plate, so that the interval of the suction cups can be adjusted through the rectangular conduit and the corrugated pipe, so that the suction cups can be adapted to wafers of various diameters, and the flexibility and universality of use are improved.

[0010] 2、During the movement of the sliding plate, the tooth plate connected to one side of the sliding plate moves, the tooth plate drives the first gear meshing therewith to rotate, so that the second circular rod rotates, the first helical bevel gear connected to the outer side surface of the second circular rod drives the second helical bevel gear to rotate, the fan blades are rotated through the inclined rod, so that the water on the wafer can be dried first, and the stability during suction can be improved.

[0011] 3、The old suction cup can be disassembled through the pull rod, the circular plate moves, the plug block is separated from the insertion hole, and then the old suction cup can be disassembled, the positioning ring on the new suction cup is inserted into the positioning groove, the plug block is inserted into the insertion hole through the force of the spring after the pull rod is loosened, and then the new suction cup can be connected with the rectangular conduit, so that the quick replacement is facilitated. BRIEF DESCRIPTION OF DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of these drawings.

[0013] Figure 1 The structure of the present application is shown in the schematic diagram.

[0014] Figure 2 The structure of the connecting plate of the present application is shown in the schematic diagram.

[0015] Figure 3 The structure of the first circular rod of the present application is shown in the schematic diagram.

[0016] Figure 4 The structure of the tooth plate of the present application is shown in the schematic diagram.

[0017] Figure 5 The structure of the suction cup of the present application is shown in the schematic diagram.

[0018] Figure 6 The structure of the present application Figure 5 The enlarged structure of position A in the present application is shown in the schematic diagram.

[0019] Figure 7 The structure of the plug block of the present application is shown in the schematic diagram.

[0020] Figure 8 The enlarged structure of position B in the present application Figure 7 The enlarged structure of position B in the present application

[0021] In the diagram: 1. Base plate; 11. Robotic arm; 12. Connecting seat; 2. Air storage tank; 21. First air guide pipe; 22. Vacuum pump; 23. Second air guide pipe; 24. Corrugated pipe; 25. Rectangular guide pipe; 3. Suction cup; 4. Connecting plate; 41. First through slot; 5. Adjustable cleaning assembly; 51. Support frame; 52. Slide plate; 53. Partition plate; 54. Electric telescopic rod; 55. Connecting block; 56. First round rod; 57. Turning plate; 58. First round block; 5 9. Inclined plate; 591. Second circular block; 6. Vertical block; 61. Toothed plate; 62. Second circular rod; 63. First gear; 64. First spiral bevel gear; 65. Second spiral bevel gear; 66. Inclined rod; 67. Fan blade; 72. Positioning ring; 73. Insertion hole; 74. Annular sealing ring; 75. Positioning groove; 76. Annular sealing groove; 77. Cylinder; 771. Second through groove; 772. Pull rod; 78. Spring; 79. Circular plate; 791. Insertion block. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] Example 1: As Figures 1-8 As shown, the present invention provides a semiconductor wafer adsorption robot, including a base plate 1, a robot arm 11 disposed on the upper surface of the base plate 1, a connecting seat 12 fixedly disposed on the robot arm 11, a vacuum pump 22 fixedly disposed on the upper surface of the connecting seat 12, a gas storage tank 2 fixedly disposed on the upper surface of the base plate 1, a first gas guide pipe 21 connected to the gas storage tank 2, the other end of the first gas guide pipe 21 connected to the vacuum pump 22, a second gas guide pipe 23 connected to the vacuum pump 22, and the other end of the second gas guide pipe 23... A corrugated pipe 24 is provided, and a rectangular guide tube 25 is fixedly provided at the lower end of the corrugated pipe 24. A suction cup 3 is installed at the lower end of the rectangular guide tube 25. There are six suction cups 3, which are symmetrically arranged below the partition plate 53. Every three suction cups 3 form a group. A connecting plate 4 is fixedly provided on the lower surface of the connecting seat 12. A first through groove 41 is opened on the upper surface of the connecting plate 4. An adjusting cleaning component 5 is connected to the connecting plate 4. The suction cup 3 can have an adsorption force through the vacuum pump 22 in conjunction with the second air guide tube 23 and the first air guide tube 21.

[0024] The adjusting and cleaning assembly 5 comprises support frames 51 fixedly connected to the inner surface of the connecting plate 4, four support frames 51 are symmetrically arranged on the inner surface of the connecting plate 4, and the support frames 51 are convenient for connecting two sliding plates 52; the sliding plates 52 are slidably arranged on the support frames 51; the sliding plates 52 are arranged symmetrically on the inner surface of the connecting plate 4, and the sliding plates 52 are convenient for driving two groups of suction cups 3 to move to the middle; the rectangular conduit 25 penetrates through the first penetrating groove 41 and the sliding plate 52; the sliding plate 52 is in sliding fit with the inner surface of the connecting plate 4; the inner surface of the connecting plate 4 is fixedly provided with a partition plate 53; the upper surface of the partition plate 53 is fixedly provided with an electric telescopic rod 54; the output end of the electric telescopic rod 54 is provided with a connecting block 55; the upper surface of the connecting block 55 is fixedly connected to the lower surface of one of the sliding plates 52; the first circular rod 56 is rotatably arranged between the upper surface of the partition plate 53 and the inner surface of the connecting plate 4; the outer side surface of the first circular rod 56 is fixedly provided with a rotating plate 57; the end of the rotating plate 57 is rotatably provided with a first circular block 58; the outer side surface of the first circular block 58 is fixedly provided with an inclined plate 59; the other end of the inclined plate 59 is rotatably provided with a second circular block 591; the second circular block 591 is rotatably connected to the lower surface of the sliding plate 52; the distance between the symmetrically arranged suction cups 3 can be adjusted according to the size of the wafer; the connecting block 55 at the output end of the electric telescopic rod 54 can be moved, so that one of the sliding plates 52 can be driven to move to the middle of the connecting plate 4; the two sliding plates 52 can be moved to the middle of the connecting plate 4 through the inclined plate 59 and the rotating plate 57; the distance between the suction cups 3 can be adjusted through the cooperation of the rectangular conduit 25 and the corrugated pipe 24, so that the suction cups 3 can be adapted to wafers of various diameters, the flexibility and universality of use are improved; the lower surface of the sliding plate 52 is fixedly provided with a vertical block 6; the lower surface of the vertical block 6 is fixedly provided with a toothed plate 61; the upper surface of the partition plate 53 is rotatably provided with a second circular rod 62; the upper end of the second circular rod 62 is fixedly provided with a first gear 63; the first gear 63 is in meshing connection with the toothed plate 61; the outer side surface of the second circular rod 62 is fixedly provided with a first spiral bevel gear 64; the first spiral bevel gear 64 is in meshing connection with a second spiral bevel gear 65; one side of the second spiral bevel gear 65 is fixedly provided with an inclined rod 66; the middle of the inclined rod 66 is provided with a convex ring; a groove matched with the convex ring is formed in the partition plate 53, so that the inclined rod 66 is prevented from being separated from the partition plate 53; the inclined rod 66 penetrates through the partition plate 53; the other end of the inclined rod 66 is fixedly provided with a fan blade 67; the fan blade 67 is provided with eight fan blades 67, which are symmetrically arranged below the partition plate 53; the fan blade 67 is arranged obliquely; the fan blade 67 penetrates through the partition plate 53; an arc-shaped groove matched with the fan blade 67 is formed in the partition plate 53; the arc-shaped groove is also provided with eight arc-shaped grooves, which are symmetrically arranged on the lower surface of the partition plate 53; the rotation of the fan blade 67 is facilitated; in the moving process of the sliding plate 52, the toothed plate 61 connected to one side of the sliding plate 52 is moved, the toothed plate 61 drives the first gear 63 in meshing connection therewith to rotate,Thus, the second circular rod 62 can be rotated, and the first spiral bevel gear 64 connected to the outer side of the second circular rod 62 drives the second spiral bevel gear 65 to rotate, and the inclined rod 66 can make the fan blade 67 rotate, so that the water on the wafer can be blown dry, thereby improving the stability during adsorption.

[0025] Embodiment two: as Figure 5 、 6 , 7, 8, the upper surface of the suction cup 3 is fixedly provided with a positioning ring 72, the side surface of the positioning ring 72 is provided with an insertion hole 73, the insertion hole 73 is provided with two, and the insertion hole 73 is symmetrically arranged on the outer side surface of the positioning ring 72, which can improve the stability after connection, the lower end of the rectangular conduit 25 is provided with a positioning groove 75, the inner surface of the positioning ring 72 and the positioning groove 75 is movably attached, the outer side surface of the rectangular conduit 25 is fixedly provided with a cylinder 77, the inner surface of the cylinder 77 is fixedly provided with a spring 78, the other end of the spring 78 is fixedly provided with a circular plate 79, the circular plate 79 and the inner surface of the cylinder 77 are slidably attached, the side of the circular plate 79 away from the spring 78 is fixedly provided with an insertion block 791, the insertion block 791 movably penetrates the positioning groove 75, the insertion block 791 is movably inserted into the insertion hole 73, the outer side surface of the cylinder 77 is provided with a second through slot 771, the second through slot 771 is slidably provided with a pull rod 772, the pull rod 772 is fixedly connected to one side of the circular plate 79;

[0026] The upper surface of the positioning ring 71 is fixedly provided with an annular sealing ring 74, the inner surface of the positioning groove 75 is provided with an annular sealing groove 76, the annular sealing ring 74 and the inner surface of the annular sealing groove 76 are movably attached, which improves the sealing performance after connection and avoids liquid leakage, the spring 78 is provided with five, and the spring 78 is annularly arranged between the inner surface of the cylinder 77 and the circular plate 79, which can improve the stability after connection, the cross-sectional shape of the pull rod 772 is "L" shape, which is convenient for connecting the circular plate 79 and also facilitates the movement of the circular plate 79, when the old suction cup 3 needs to be disassembled, the circular plate 79 can be moved by the pull rod 772, the insertion block 791 is separated from the insertion hole 73, the spring 78 is compressed under stress, the suction cup 3 moves downward under the influence of gravity, the annular sealing ring 74 is separated from the annular sealing groove 76, and the positioning ring 72 is separated from the positioning groove 75, so that the old suction cup 3 can be disassembled, then the positioning ring 72 on the new suction cup 3 is inserted into the positioning groove 75, and the annular sealing ring 74 on the positioning ring 72 is further inserted into the annular sealing groove 76, so that the sealing performance after connection can be improved and liquid leakage can be avoided, after the pull rod 772 is loosened, the insertion block 791 can be inserted into the insertion hole 73 by the force of the spring 78, so that the new suction cup 3 can be connected with the rectangular conduit 25, which is convenient for quick replacement.

[0027] Working principle: the invention can have the suction cup 3 with adsorption force through the vacuum pump 22 cooperating with the second air duct 23 and the first air duct 21 when in use.

[0028] The interval of the symmetrically arranged suction cups 3 can be adjusted according to the size of the wafer, the connecting block 55 at the output end of the electric telescopic rod 54 can be moved by starting the electric telescopic rod 54, so that one of the sliding plates 52 can be moved to the middle of the connecting plate 4, the two sliding plates 52 can be moved to the middle of the connecting plate 4 through the inclined plate 59 and the rotating plate 57, so that the interval of the suction cups 3 can be adjusted through the rectangular conduit 25 cooperating with the corrugated pipe 24, so that it can adapt to wafers of various diameters, improve the flexibility and versatility of use, and in the process of moving the sliding plate 52, the toothed plate 61 connected to one side of the sliding plate 52 moves, the toothed plate 61 drives the first gear 63 meshing therewith to rotate, so that the second circular rod 62 rotates, the first helical bevel gear 64 connected to the outer side of the second circular rod 62 drives the second helical bevel gear 65 to rotate, the fan blade 67 can be rotated through the inclined rod 66, so that the water on the wafer can be dried first, thereby improving the stability during adsorption;

[0029] When it is necessary to disassemble the old suction cup 3, the circular plate 79 can be moved through the pull rod 772, the plug block 791 is separated from the insertion hole 73, the spring 78 is compressed under force, the suction cup 3 moves downward under the influence of gravity, the annular sealing ring 74 is separated from the annular sealing groove 76, and the positioning ring 72 is separated from the positioning groove 75, so that the old suction cup 3 can be disassembled, and then the positioning ring 72 on the new suction cup 3 can be inserted into the positioning groove 75, and the annular sealing ring 74 on the positioning ring 72 can be further inserted into the annular sealing groove 76, so that the sealing performance after connection can be improved, and the possibility of liquid leakage can be avoided, and the plug block 791 can be inserted into the insertion hole 73 through the force of the spring 78 after the pull rod 772 is loosened, so that the new suction cup 3 can be connected with the rectangular conduit 25, and quick replacement can be facilitated.

[0030] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.

Claims

1. A semiconductor wafer suction robot comprising a base plate (1), characterized in that: The upper surface of the bottom plate (1) is provided with a mechanical hand (11), the mechanical hand (11) is fixedly provided with a connecting seat (12), the upper surface of the connecting seat (12) is fixedly provided with a vacuum pump (22), the upper surface of the bottom plate (1) is fixedly provided with a gas storage tank (2), the gas storage tank (2) is connected with a first air guide pipe (21), one end of the first air guide pipe (21) is connected with the vacuum pump (22), the vacuum pump (22) is connected with a second air guide pipe (23), the other end of the second air guide pipe (23) is provided with a bellows (24), the lower end of the bellows (24) is fixedly provided with a rectangular guide pipe (25), the lower end of the rectangular guide pipe (25) is mounted with a suction disc (3), the lower surface of the connecting seat (12) is fixedly provided with a connecting plate (4), the upper surface of the connecting plate (4) is provided with a first through slot (41), the connecting plate (4) is connected with an adjusting and cleaning assembly (5). The adjusting and cleaning assembly (5) comprises a supporting frame (51), the supporting frame (51) is fixedly connected to the inner surface of the connecting plate (4), the supporting frame (51) is slidably provided with a sliding plate (52), the rectangular guide pipe (25) penetrates through the first through slot (41) and the sliding plate (52), the sliding plate (52) is in sliding fit with the inner surface of the connecting plate (4), the inner surface of the connecting plate (4) is fixedly provided with a partition plate (53), the upper surface of the partition plate (53) is fixedly provided with an electric telescopic rod (54), the output end of the electric telescopic rod (54) is provided with a connecting block (55), the upper surface of the connecting block (55) is fixedly connected with the lower surface of one of the sliding plates (52), the first circular rod (56) is rotatably arranged between the upper surface of the partition plate (53) and the inner surface of the connecting plate (4), the outer surface of the first circular rod (56) is fixedly provided with a rotating plate (57), the end of the rotating plate (57) is rotatably provided with a first circular block (58), the outer surface of the first circular block (58) is fixedly provided with an inclined plate (59), the other end of the inclined plate (59) is rotatably provided with a second circular block (591), the second circular block (591) is rotatably connected with the lower surface of the sliding plate (52), the lower surface of the sliding plate (52) is fixedly provided with a vertical block (6), the lower surface of the vertical block (6) is fixedly provided with a toothed plate (61), the upper surface of the partition plate (53) is rotatably provided with a second circular rod (62), the upper end of the second circular rod (62) is fixedly provided with a first gear (63), the first gear (63) is engaged with the toothed plate (61), the outer surface of the second circular rod (62) is fixedly provided with a first spiral bevel gear (64), the first spiral bevel gear (64) is engaged with a second spiral bevel gear (65), one side of the second spiral bevel gear (65) is fixedly provided with an inclined rod (66), the inclined rod (66) penetrates through the partition plate (53), the other end of the inclined rod (66) is fixedly provided with a fan blade (67).

2. The semiconductor wafer suction robot according to claim 1, wherein The supporting frame (51) is provided with four supporting frames (51), and the supporting frames (51) are symmetrically arranged on the inner surface of the connecting plate (4).

3. The semiconductor wafer suction robot according to claim 1, wherein The sliding plate (52) is provided with two, and the sliding plate (52) is symmetrically arranged inside the connecting plate (4).

4. The semiconductor wafer suction robot according to claim 1, wherein The fan blade (67) penetrates the partition plate (53), and the partition plate (53) is provided with an arc-shaped slot matched with the fan blade (67).

5. The semiconductor wafer suction robot according to claim 1, wherein The upper surface of the suction disc (3) is fixedly provided with a positioning ring (72), the side surface of the positioning ring (72) is provided with a insertion hole (73), the lower end of the rectangular conduit (25) is provided with a positioning groove (75), the inner surface of the positioning ring (72) and the positioning groove (75) is movably attached, the outer side surface of the rectangular conduit (25) is fixedly provided with a cylinder (77), the inner surface of the cylinder (77) is fixedly provided with a spring (78), the other end of the spring (78) is fixedly provided with a circular plate (79), the circular plate (79) and the inner surface of the cylinder (77) are slidably attached, the side of the circular plate (79) away from the spring (78) is fixedly provided with an insertion block (791), the insertion block (791) movably penetrates the positioning groove (75), the insertion block (791) is movably inserted into the insertion hole (73), the outer side surface of the cylinder (77) is provided with a second through slot (771), the second through slot (771) is slidably provided with a pull rod (772), and the pull rod (772) is fixedly connected with one side of the circular plate (79).

6. A semiconductor wafer suction robot as described in claim 5, wherein, The insertion hole (73) is provided with two, and the insertion hole (73) is symmetrically arranged on the outer side surface of the positioning ring (72).

7. The semiconductor wafer suction robot according to claim 5, wherein The upper surface of the positioning ring (72) is fixedly provided with an annular sealing ring (74), and the inner surface of the positioning groove (75) is provided with an annular sealing groove (76), and the annular sealing ring (74) and the inner surface of the annular sealing groove (76) are movably attached.

8. The semiconductor wafer suction robot according to claim 5, wherein The spring (78) is provided with five, and the spring (78) is annularly arranged between the inner surface of the cylinder (77) and the circular plate (79).

9. The semiconductor wafer suction robot according to claim 5, wherein The cross-sectional shape of the pull rod (772) is "L" shape.

10. The semiconductor wafer suction robot according to claim 5, wherein The middle part of the inclined rod (66) is provided with a convex ring, and the partition plate (53) is provided with a slot matched with the convex ring.

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