An integrated laser gyro inertial measurement device

Abstract

The present invention relates to the technical field of inertial measurement, and specifically discloses an integrated laser gyro inertial measurement device, including a box and a detection component, the detection component including a frame, a sealing cover, and a laser gyroscope; the frame is separated by a horizontal partition, the sealing cover is detachably arranged on the top of the frame, and the horizontal partition, the sealing cover and the frame are surrounded by a second installation chamber for installing a circuit board; the lower part of the horizontal partition forms a plurality of first installation chambers for installing laser gyroscopes and accelerometers through a vertical partition; the horizontal partition, the side wall of the second installation chamber and the sealing cover are all made of heat-insulating materials; a heat-conducting plate is arranged in the sealing cover, and a heat-dissipating hole is arranged on the heat-conducting plate, a heat-conducting cavity is formed between the heat-conducting plate and the sealing cover, and a heat-conducting pipe for connecting the heat-conducting cavity and the outside of the box is arranged on the sealing cover, and a one-way air-permeable film is arranged in the heat-conducting pipe. The measuring device of the present invention can reduce the influence of the internally generated heat on the measurement accuracy of the laser gyroscope.

Description

Technical Field

[0001] The present invention relates to the technical field of inertial measurement, and in particular to an integrated laser gyro inertial measurement device. Background Art

[0002] The laser gyro inertial measurement device is the core component of the laser gyro inertial navigation system. The integrated laser gyro inertial measurement device is a device that integrates all signal acquisition modules. It has the advantages of high integration and small size. It mainly includes a box and a measurement component arranged in the box. The measurement component includes a support and a laser gyroscope, accelerometer, signal acquisition and processing circuit board, power supply module and other signal acquisition modules installed on the support. Among them, three laser gyroscopes and accelerometers are set, which are installed on the support in an orthogonal manner.

[0003] Laser gyro inertial navigation systems are widely used in real-time navigation of moving carriers such as vehicles, ships, and aircraft. The accuracy of the laser gyro inertial measurement device determines the accuracy of the laser gyro inertial navigation system, and the measurement accuracy of the laser gyro is the main factor affecting the accuracy of the laser gyro inertial measurement device.

[0004] Environmental factors such as temperature, humidity, acceleration and vibration in the environment where the laser gyroscope is located may have a negative impact on the performance of the laser gyroscope, resulting in deviations in the measurement results. For example, temperature changes may cause the frequency of the laser source to drift, thereby affecting the measurement accuracy. The source of temperature needs to consider the temperature changes caused by the heat and electromagnetic radiation generated by the circuit board and power module in the laser gyroscope inertial measurement device during operation and the external high temperature environment; and as the use time increases, the error of the laser gyroscope may gradually accumulate, resulting in reduced accuracy; especially in long-term operation, due to system noise, temperature changes, mechanical vibration and other factors, the error may increase significantly.

[0005] Therefore, in order to reduce the impact of environmental factors on the accuracy of the laser gyroscope, it is necessary to reduce the impact of vibration and temperature on the laser gyroscope as much as possible. The existing technology usually uses rubber shock absorbers to achieve vibration reduction of the laser gyroscope inertial measurement device. However, if the rubber shock absorber is affected by temperature for a long time, the vibration reduction performance of the rubber shock absorber will also be weakened. Summary of the invention

[0006] The object of the present invention is to provide an integrated laser gyro inertial measurement device to reduce the influence of heat generated inside the measurement device on the measurement accuracy of the laser gyro.

[0007] The present invention is achieved through the following technical solutions:

[0008] An integrated laser gyro inertial measurement device comprises a box and a detection component arranged in the box, wherein the detection component comprises a frame, a sealing cover, a laser gyro, an accelerometer and a circuit board;

[0009] The rack is divided by a horizontal partition, and a sealing cover is detachably arranged on the top of the rack. A second installation chamber for installing a circuit board is formed between the horizontal partition, the sealing cover and the rack;

[0010] A plurality of first installation chambers for installing laser gyroscopes and accelerometers are formed at the lower part of the horizontal partition through vertical partitions;

[0011] The horizontal partition, the side wall of the second installation chamber and the sealing cover are all made of heat-insulating materials;

[0012] A heat conduction plate is arranged in the sealing cover. The heat conduction plate is made of heat conducting material and has a plurality of heat dissipation holes. A heat conduction cavity is formed between the heat conduction plate and the sealing cover. A heat conduction pipe for connecting the heat conduction cavity and the outside of the box is arranged on the sealing cover. A one-way air permeable membrane is arranged in the heat conduction pipe.

[0013] The heat insulating material of the present invention is a prior art, and may be a vacuum panel, aerated concrete, etc.; the heat conducting material also adopts a prior art, and may specifically be a metal plate such as a copper plate, an aluminum plate, etc.

[0014] Firstly, the present invention arranges a horizontal partition in the frame, and the horizontal partition is made of heat-insulating material, so that the internal space of the frame can be divided into two spaces, the upper and the lower spaces, so as to realize the partitioning and placement of different components. Among them, the electronic components (circuit boards, etc.) that generate heat during operation are placed in the upper space, and the laser gyroscope and accelerometer that need precise measurement are placed in the lower space, so as to avoid the influence of the heat emitted by electronic components such as circuit boards on the measurement accuracy of the laser gyroscope and the accelerometer as much as possible.

[0015] Secondly, the present invention arranges a heat conducting plate in the sealing cover. The heat conducting plate is arranged opposite to the horizontal partition. The horizontal partition insulates and the heat conducting plate conducts. Such performance difference will accelerate the flow of heat generated by the electronic components during operation to one side of the heat conducting plate, and then enter the heat conducting cavity and be discharged from the box body through the heat conducting pipe, so as to reduce the heat in the second installation room, thereby reducing the temperature in the entire detection assembly, and avoiding the influence of the heat generated inside the measuring device on the measurement accuracy of the laser gyroscope.

[0016] Thirdly, the horizontal partition, the side wall of the second installation chamber and the sealing cover of the present invention are all made of heat-insulating materials, which can realize that the heat generated by the electronic components during operation is discharged out of the box body through the heat pipe as much as possible, thereby preventing the heat in the second installation chamber from flowing into the gap between the detection component and the box body, and further preventing the heat flowing into the gap from affecting the measurement accuracy of the laser gyroscope.

[0017] In a preferred embodiment, the edge of the heat conducting plate contacts the inner wall of the sealing cover; and a plurality of grooves are arranged on the surface of the heat conducting plate.

[0018] The above arrangement of the present invention can increase the surface area of ​​the heat conducting plate as much as possible, thereby improving the heat conducting effect of the heat conducting plate and accelerating the heat conduction.

[0019] In a preferred embodiment, the middle portion of the heat conducting plate bulges upward so that a gathering cavity is formed on the lower side of the heat conducting plate.

[0020] The gathering cavity provided in the present invention has a certain gathering and guiding effect on the hot air flow in the second installation chamber, and can accelerate the hot air flow to the side of the heat conduction plate, thereby increasing the hot air flow extraction speed.

[0021] The specific structure of the heat conducting plate capable of achieving the above-mentioned gathering effect may be: 1) the edge of the heat conducting plate contacts the inner wall of the sealing cover and a conical protrusion is formed in the middle of the heat conducting plate; 2) the heat conducting plate is composed of two symmetrically arranged flat plates, which are arranged at an angle.

[0022] In a preferred embodiment, the heat conducting plate comprises a copper plate, on which a plurality of strip-shaped through grooves for connecting the upper side and the lower side of the copper plate are arranged; a plurality of heat dissipation chambers connected to the strip-shaped through grooves are arranged in the copper plate, an aluminum plate is arranged in the heat dissipation chamber, and a heat dissipation gap connected to the strip-shaped through grooves is provided between the aluminum plate and the heat dissipation chamber;

[0023] Both the copper plate and the aluminum plate are provided with a plurality of heat dissipation holes.

[0024] The above-mentioned structure of the present invention adopts the alternating arrangement of copper plates and aluminum plates, which can improve the thermal conductivity effect compared with the single arrangement of copper plates. In addition, by arranging interconnected strip-shaped through grooves, heat dissipation gaps and heat dissipation holes, the air flow speed can be accelerated and the thermal conductivity effect of the heat conduction plate can be improved.

[0025] In a preferred embodiment, a plurality of protrusions are provided on both the upper surface and the lower surface of the aluminum plate, and a heat dissipation gap is formed between the aluminum plate and the copper plate through the plurality of protrusions.

[0026] The above arrangement can form heat dissipation gaps on both the upper and lower surfaces of the aluminum plate, and combined with the heat dissipation holes arranged in the aluminum plate and the copper plate, the air flow speed can be further accelerated, thereby improving the heat conduction effect of the heat conduction plate.

[0027] In a preferred embodiment, a plurality of groups of flow-around components are arranged on a horizontal partition in the second installation room; each group of flow-around components includes two buffer columns, and the two buffer columns are connected by a second thin silicone sheet, and the second thin silicone sheet can fluctuate under the action of the buffer columns.

[0028] The second thin silicone sheet of the present invention is a sheet made of silicone, and its thickness can be 0.1-0.3 mm. Preferably, a plurality of through holes are provided on the second thin silicone sheet to reduce the weight of the second thin silicone sheet and improve the wave effect of the second thin silicone sheet.

[0029] The buffer column is usually made of a buffer material with a certain elasticity (restoring force), which can be rubber, etc. When the buffer material expands and contracts, it can cause the second thin silicone sheet to produce a certain small fluctuation, thereby driving the airflow in the second installation room and accelerating the heat flow to the side of the heat transfer plate.

[0030] In a preferred embodiment, a first gap is provided between the circuit board and the inner wall of the second installation chamber, and the plurality of circuit boards are arranged in an up-and-down staggered manner, and a second gap is provided between two adjacent circuit boards.

[0031] The above arrangement enables an air flow channel to be formed between the second thin silicone sheet and the heat conducting plate, which can accelerate the flow of heat to one side of the heat conducting plate, thereby achieving rapid heat extraction from the second installation chamber.

[0032] In a preferred embodiment, the laser gyroscope is fixed in the first installation chamber by a vibration-damping fixture, and two adjacent vibration-damping fixtures are connected by a first thin silicone sheet, and the first thin silicone sheet can fluctuate under the action of the vibration-damping fixture.

[0033] The vibration-damping fixing piece is provided with a buffer material. When the buffer material expands and contracts, the first thin silicone sheet can produce a certain small fluctuation, thereby generating a small airflow around the laser gyroscope, thereby achieving cooling around the laser gyroscope.

[0034] In a preferred embodiment, the sealing cover is sealed to the top of the frame to prevent heat in the second installation chamber from leaking to the gap between the detection assembly and the box body.

[0035] In a preferred embodiment, a rubber vibration damper is provided between the detection assembly and the box; the box is made of heat-insulating material to prevent the influence of the ambient temperature of the outer wall of the measuring device on the laser gyroscope.

[0036] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0037] On the one hand, the present invention realizes the partitioned placement of the laser gyroscope and the circuit board by arranging a horizontal partition in the rack, and the horizontal partition, the side wall of the second installation chamber and the sealing cover are all made of heat-insulating materials, thereby realizing the closed isolation of the circuit board; on the other hand, a heat-conducting plate is arranged in the sealing cover, so that the heat generated by the electronic components during operation flows to one side of the heat-conducting plate, and then enters the heat-conducting cavity and is discharged from the box body through the heat-conducting pipe, so as to reduce the heat in the second installation chamber, thereby reducing the temperature in the entire detection assembly, and avoiding the influence of the heat generated inside the measuring device on the measurement accuracy of the laser gyroscope. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] The drawings described herein are used to provide a further understanding of the embodiments of the present invention, constitute a part of this application, and do not constitute a limitation of the embodiments of the present invention. In the drawings:

[0039] Figure 1 It is a structural schematic diagram of the integrated laser gyro inertial measurement device of the present invention;

[0040] Figure 2 It is a structural schematic diagram of the detection component of the present invention;

[0041] Figure 3 for Figure 2 A partial enlarged view of the center

[0042] Figure 4 is a longitudinal cross-sectional view of the heat conducting plate of the present invention;

[0043] Figure 5 for Figure 4 A partial enlarged view of point B in the middle;

[0044] Figure 6 A transverse cross-sectional view of the heat conducting plate of the present invention

[0045] Figure 7 It is a schematic diagram of the laser gyroscope of the present invention being fixed on a base;

[0046] Figure 8 This is a schematic diagram of fixing a laser gyroscope using a vibration reduction fixing member of the present invention.

[0047] Marks and corresponding parts names in the attached drawings:

[0048] 1-box body; 2-box cover; 3-detection component; 4-rubber shock absorber; 5-vibration damping fixture; 6-first thin silicone sheet; 7-laser gyroscope; 11-interface; 31-frame; 32-sealing cover; 33-horizontal partition; 34-vertical partition; 35-first installation chamber; 36-second thin silicone sheet; 37-buffer column; 38-circuit board; 39-heat conducting plate; 51-fastening bolt; 52-first T-shaped seal; 53-second T-shaped seal; 71-connector; 311-base; 312-fixing block; 321-heat conducting cavity; 322-heat conducting pipe; 323-insertion block; 324-sealing ring; 391-copper plate; 392-aluminum plate; 393-strip through groove; 394-protrusion; 395-heat dissipation gap; 396-heat dissipation chamber. DETAILED DESCRIPTION

[0049] In order to make the purpose, technical scheme and advantages of the present invention clearer, the present invention is further described in detail below in conjunction with the embodiments. The schematic implementation mode of the present invention and its description are only used to explain the present invention and are not intended to limit the present invention. The embodiments described below are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0050] In the following description, a large number of specific details are set forth in order to provide a thorough understanding of the present invention. However, it is apparent to those of ordinary skill in the art that these specific details do not have to be employed to practice the present invention. In other embodiments, in order to avoid confusing the present invention, known structures, materials or methods are not specifically described. The materials, instruments and reagents used in the following examples, unless otherwise specified, can be obtained from commercial sources. The technical means used in the examples, unless otherwise specified, are conventional means well known to those skilled in the art.

[0051] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0052] Embodiment 1:

[0053] like Figure 1-Figure 8As shown, in order to reduce the problem that the heat generated by the electronic components inside the measuring device affects the accuracy of the laser gyroscope 7, this embodiment provides an integrated laser gyro inertial measurement device, including a box 1 and a detection component 3 arranged in the box 1, an interface is arranged on the box 1, the top of the box 1 is an open end, and a box cover 2 is arranged at the open end, the box cover 2 is detachably connected to the box 1, and the box cover 2 and the box 1 form a closed space. Preferably, the box 1 and the box cover 2 are made of heat-insulating materials to prevent the external environment temperature from affecting the detection component 3 inside. The heat-insulating material can be a vacuum board or aerated concrete. The function of the box 1 is to protect the detection component 3.

[0054] The detection component 3 includes a frame 31, a sealing cover 32, a laser gyroscope 7, an accelerometer, a circuit board 38 and a power module; wherein the power module is used to supply power to other electrical components, and three laser gyroscopes 7 and three accelerometers are respectively provided, and the three laser gyroscopes 7 are orthogonally installed on the frame 31, and the three accelerometers are orthogonally installed on the frame 31.

[0055] The rack 31 is divided by a horizontal partition 33, so that the rack 31 forms two parts, the upper and lower parts, so as to realize the partition arrangement of the parts in the rack 31, and the components such as the circuit board 38 and the power module are placed in the space above the horizontal partition 33, and the laser gyroscope 7 and the accelerometer are placed in the upper and lower spaces above the horizontal partition 33. The sealing cover 32 is detachably arranged on the top of the rack 31, and is used for the top opening of the rack 31, so that the second installation chamber for installing the circuit board 38 is enclosed between the closed horizontal partition 33, the sealing cover 32 and the rack 31. Preferably, the sealing cover 32 is sealedly connected to the top of the rack 31, so as to realize the closed environment in the second installation chamber. A specific structure of the sealing cover 32 and the top of the rack 31 is as follows: an insert block 323 is arranged at the bottom of the sealing cover 32, and the insert block 323 is embedded in the card slot at the top of the rack 31, and sealing rings 324 are arranged on both sides of the insert block 323 between the sealing cover 32 and the rack 31 to improve the sealing effect.

[0056] The lower part of the horizontal partition 33 forms a plurality of first installation chambers 35 for installing the laser gyroscope 7 and the accelerometer through the vertical partition 34; specifically, four first installation chambers 35 can be set, one first installation chamber 35 is used to install three accelerometers, and the other three first installation chambers 35 are respectively installed with three laser gyroscopes 7. In order to prevent vibration from affecting the measurement accuracy of the laser gyroscope 7, the laser gyroscope 7 is fixed in the first installation chamber 35 through a vibration-damping fixture 5. A specific structure of the vibration-damping fixture 5 is as follows: it includes a fastening bolt 51, a first T-shaped seal 52, and a second T-shaped seal 53; a connecting member 71 is provided on the laser gyroscope 7, and a through hole for passing the fastening bolt 51 is provided on the connecting member 71. A base 311 is provided in the first installation chamber 35, and a fixing block 312 is provided on the base 311. When the laser gyroscope 7 is fixed, the connecting member 71 is arranged above the fixing block 312. The fixing process is as follows: first, the two second T-shaped seals 53 are respectively sleeved on the two first T-shaped seals 52, and then the small ends of the two first T-shaped seals 52 are respectively inserted into the through hole from the upper and lower sides of the connecting member 71, and then the fastening bolt 51 is inserted into the first T-shaped seal 52 until the end of the fastening bolt 51 is fixed in the groove on the fixing block 312.

[0057] In order to further reduce the influence of vibration on the measurement accuracy of the laser gyroscope 7, a rubber vibration damper 4 is provided between the detection component 3 and the box body 1, and the rubber vibration damper 4 is a prior art.

[0058] In a preferred case, in order to generate airflow around the laser gyroscope 7 and reduce the temperature, two adjacent vibration-damping fixtures 5 are connected by a first thin silicone sheet 6. The first thin silicone sheet 6 can fluctuate under the action of the vibration-damping fixture 5. The thickness of the first thin silicone sheet 6 is 0.1-0.3 mm. Preferably, a plurality of through holes are provided on the first thin silicone sheet 6 to reduce the weight of the first thin silicone sheet 6. When used specifically, positioning holes are provided at both ends of the first thin silicone sheet 6. The ends of the first thin silicone sheet 6 are sleeved on the outer wall of the small end of the first T-shaped seal 52 through the positioning holes, and the ends of the first thin silicone sheet 6 are provided between the second T-shaped seal 53 and the connector 71.

[0059] In a preferred case, the horizontal partition 33, the side wall of the second installation chamber and the sealing cover 32 are all made of heat insulating material.

[0060] A heat conducting plate 39 is arranged in the sealing cover 32. The heat conducting plate 39 is made of a heat conducting material, which can be a copper sheet or an aluminum sheet, etc. A plurality of heat dissipation holes are arranged on the heat conducting plate 39. A heat conducting cavity 321 is formed between the heat conducting plate 39 and the sealing cover 32. The hot air flow in the second installation room is quickly introduced into the heat conducting cavity 321 through the heat dissipation holes. A heat conducting pipe 322 for connecting the heat conducting cavity 321 and the outer side of the box cover 2 at the top of the box body 1 is arranged on the sealing cover 32. A one-way air permeable membrane is arranged in the heat conducting pipe 322. The one-way air permeable membrane can allow the air flow in the heat conducting cavity 321 to enter the outside, and the air flow on the outside cannot enter the heat conducting cavity 321. The number of the heat conducting pipe 322 can be arranged as one or more. Preferably, the outlet end of the heat conducting pipe 322 is flush with the top of the box cover 2.

[0061] In a preferred case, in order to increase the heat conduction area of ​​the heat conduction plate 39 and improve the heat conduction effect, the edge of the heat conduction plate 39 contacts the inner wall of the sealing cover 32; and a plurality of grooves are provided on the surface of the heat conduction plate.

[0062] In a preferred case, in order to improve the flow-conducting effect of the heat-conducting plate 39, the middle part of the heat-conducting plate 39 bulges upward to form a gathering cavity on the lower side of the heat-conducting plate. One structure for realizing the formation of a gathering cavity on the lower side of the heat-conducting plate 39 is as follows: the heat-conducting plate 39 is composed of two symmetrically arranged flat plates, which are arranged obliquely, and the high ends of the two flat plates are in contact at the top. One of the fixing methods of the flat plates is: an axis is arranged between the two symmetrical side walls of the sealing cover 32, one end of the flat plate is rotatably connected to the axis, and the other end is clamped to the inside of the sealing cover 32 or detachably connected by other methods.

[0063] like Figure 4-Figure 6 As shown, in a preferred case, in order to further improve the heat conduction effect of the heat conducting plate 39; the heat conducting plate 39 includes a copper plate 391, and the copper plate 391 is provided with a plurality of strip-shaped through grooves 393 for connecting the upper side and the lower side of the copper plate 391; a plurality of heat dissipation chambers 396 connected with the strip-shaped through grooves 393 are provided in the copper plate 391, and an aluminum plate 392 is provided in the heat dissipation chamber 396, and a heat dissipation gap 395 connected with the strip-shaped through grooves 393 is provided between the aluminum plate 392 and the heat dissipation chamber 396; the heat dissipation gap 395 here refers to the aluminum plate 392 that does not completely fill the heat dissipation chamber 396, and specifically, the heat dissipation chamber 396 can be formed between the upper and lower sides of the aluminum plate 392 and the top and bottom of the heat dissipation chamber 396, or the heat dissipation chamber 396 can be formed between the front and rear vertical side walls on both sides of the aluminum plate 392 and the side walls of the heat dissipation chamber 396, such as Figure 6 As shown, in a preferred case, the upper surface and the lower surface of the aluminum plate 392 are both provided with a plurality of protrusions 394, and a heat dissipation gap 395 is formed between the aluminum plate 392 and the copper plate 391 through the plurality of protrusions 394, that is, Figure 6In the embodiment, the protrusions 394 are provided on the upper and lower surfaces of the aluminum plate 392 so that the heat dissipation chamber 396 is formed between the upper and lower sides of the aluminum plate 392 and the top and bottom of the heat dissipation chamber 396; in addition, the front and back, left and right of this embodiment are relative to Figure 6 In terms of.

[0064] The copper plate 391 and the aluminum plate 392 are both provided with a plurality of heat dissipation holes, and the heat dissipation holes, the heat dissipation gaps 395 and the strip-shaped through grooves 393 are connected to accelerate the flow speed of the hot air flow.

[0065] In a specific case, the manufacturing process of the heat conducting plate 39 is as follows: two copper plates 391 arranged in an upper and lower manner can be provided, and a heat dissipation chamber 396 and a strip-shaped through groove 393 can be formed between the two copper plates 391. The aluminum plate 392 can be placed at the corresponding heat dissipation chamber 396 position on the lower copper plate 391, and then the upper copper plate 391 can be connected to the lower copper plate 391 to form the heat conducting plate 39.

[0066] In this embodiment, the heat dissipation process of the heat conducting plate 39 is as follows: utilizing the heat conducting function of the heat conducting plate 39 (the materials of the heat conducting plate 39 and the horizontal partition plate 33 have a difference in thermal conductivity), the hot air flow in the second installation chamber is guided to the lower side of the heat conducting plate 39, the hot air flow on the lower side of the heat conducting plate 39 moves upward into the heat dissipation holes and the strip through grooves 393, and because the heat dissipation holes, the heat dissipation gaps 395 and the strip through grooves 393 are connected, a part of the hot air flow in the strip through grooves 393 moves upward into the heat conducting cavity 321 on the upper side of the heat conducting plate 39, and the other part is diverted horizontally into the heat dissipation gaps 395, the hot air flow in the heat dissipation gaps 395 can move upward through the heat dissipation holes on the copper plate 391 to enter the upper side of the heat conducting plate 39, the hot air flow on the lower side of the heat conducting plate 39 can also pass through the heat dissipation holes on the copper plate 391, the heat dissipation holes on the aluminum plate 392 and the heat dissipation holes on the copper plate 391 in sequence to enter the upper side of the heat conducting plate 39, and the air flow entering the upper side of the heat conducting plate 39 is guided out of the measuring device through the heat conducting pipe 322.

[0067] On the one hand, this embodiment realizes the partitioning of the laser gyroscope 7 and the circuit board 38 by setting a horizontal partition 33 in the frame, and the horizontal partition 33, the side wall of the second installation chamber and the sealing cover 32 are all made of heat-insulating materials, thereby realizing the closed isolation of the circuit board 38; on the other hand, by utilizing the performance difference of the heat conduction effect of the heat conduction plate 39 and the horizontal partition 33, the heat generated by the electronic components during operation is accelerated to flow to the side of the heat conduction plate 39, and then enters the heat conduction cavity 321 and is discharged from the box body 1 through the heat conduction pipe 322, so as to reduce the heat in the second installation chamber, thereby reducing the temperature in the entire detection assembly 3, and avoiding the influence of the heat generated inside the measuring device on the measurement accuracy of the laser gyroscope 7.

[0068] The thin silicone sheet can produce small fluctuations under vibration due to its thin size. Although the small fluctuations produced by the thin silicone sheet will not cause huge fluctuations in the airflow, but only small disturbances, compared with the static state, a little disturbance, combined with the difference in thermal conductivity between the materials of the heat conducting plate 39 and the horizontal partition 33 in a closed space, can play a role in assisting the airflow to flow to the side of the heat conducting plate 39. That is, the actual role of the thin silicone sheet is to speed up the flow of hot air to the side of the heat conducting plate 39.

[0069] Conventional heat dissipation structures basically realize air circulation inside and outside the box, and the gyro inertial measurement system of this embodiment will be used in a high temperature environment, so the entire box 1 needs to be set to a heat-insulating and closed structure to prevent the heat from the external environment from entering the box 1 and affecting the measurement accuracy of the gyroscope. However, in the closed space, the heat dissipation of electronic components will also affect the measurement accuracy of the laser gyroscope 7. First, in order to prevent the heat dissipation of electronic components in the closed space from affecting the measurement accuracy of the laser gyroscope 7, this embodiment improves the arrangement of various components in the box 1, and separates the laser gyroscope 7 from the electronic components by setting a horizontal partition 33, and the electronic components are independently set The heat in the second installation room where the electronic components are located is discharged through a heat pipe 322 connected to the outside of the box body 1. Since a one-way air-permeable membrane is arranged in the heat pipe 322, the air flow can only enter the outside from the inside of the box body 1, and the ambient temperature outside the box body 1 will not affect the inside of the box body. Secondly, in order to speed up the discharge of hot air flow, a heat conducting plate 39 with a heat conducting function is arranged on the side opposite to the horizontal partition 33, and the difference in heat conducting effects between the two is utilized to speed up the flow of air to the side of the heat conducting plate 39. Thirdly, in order to further improve the heat conducting effect, the structure of the heat conducting plate 39 is optimized.

[0070] Embodiment 2:

[0071] like Figure 1-Figure 8 As shown, this embodiment is based on the embodiment 1, and multiple groups of flow-around parts are arranged on the horizontal partition 33 in the second installation room; each group of flow-around parts includes two buffer columns 37, and the two buffer columns 37 are connected by a second thin silicone sheet 36, and the second thin silicone sheet 36 can fluctuate under the action of the buffer column 37. The buffer column 37 is made of a buffer material, specifically, the buffer column 37 includes a T-shaped column, the small end of the T-shaped column is fixed on the horizontal partition 33, and two buffer sleeves are sleeved on the horizontal partition 33. The buffer sleeves are made of a buffer material, and the two ends of the second thin silicone sheet 36 are sleeved on the T-shaped column and arranged between the two T-shaped columns. When the buffer sleeve is extended and retracted, the second thin silicone sheet 36 can produce a certain small fluctuation, thereby driving the airflow in the second installation room and accelerating the heat flow to the side of the heat transfer plate 39.

[0072] This embodiment utilizes the performance difference of the heat conduction effect of the heat conduction plate 39 and the horizontal partition 33 to accelerate the flow of heat generated by the electronic components when working to the side of the heat conduction plate 39, and then utilizes the tiny fluctuations generated by the second thin silicone sheet 36 to drive the airflow. Since the second thin silicone sheet 36 is arranged relative to the heat conduction plate 39, the speed at which the hot air flows to the heat conduction plate 39 can be accelerated.

[0073] In a preferred case, there is a first gap between the circuit board 38 and the inner wall of the second installation chamber, and the plurality of circuit boards 38 are arranged in an up-and-down staggered manner, and there is a second gap between two adjacent circuit boards 38, so that Figure 2 Take the arrangement of the two circuit boards 38 shown as an example: one side of one circuit board 38 is connected to the left side wall of the second installation chamber, and the other three sides of the circuit board 38 have gaps with the inner wall of the second installation chamber, and the other circuit board 38 is connected to the right side wall of the second installation chamber, and the other three sides have gaps with the inner wall of the second installation chamber. The above arrangement forms an air flow channel between the second thin silicone sheet 36 and the heat conducting plate 39, which can speed up the flow of heat to the side of the heat conducting plate 39 and quickly remove the heat in the second installation chamber.

[0074] The specific implementation methods described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific implementation method of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

[0075] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportional relationship or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and the like cited in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of the relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

Claims

1. An integrated laser gyro inertial measurement device, comprising a housing (1) and a detection component (3) arranged in the housing (1), characterized in that: The detection assembly (3) comprises a frame (31), a sealing cover (32), a laser gyroscope (7), an accelerometer and a circuit board (38); The frame (31) is divided by a horizontal partition (33), the sealing cover (32) is detachably arranged on the top of the frame (31), and a second installation chamber for installing the circuit board (38) is formed between the horizontal partition (33), the sealing cover (32) and the frame (31); A plurality of first installation chambers (35) for installing the laser gyroscope (7) and the accelerometer are formed at the lower part of the horizontal partition (33) through a vertical partition (34); The horizontal partition (33), the side wall of the second installation chamber and the sealing cover (32) are all made of heat-insulating material; A heat conducting plate (39) is arranged inside the sealing cover (32); the heat conducting plate (39) is made of a heat conducting material and is provided with a plurality of heat dissipation holes; a heat conducting cavity (321) is formed between the heat conducting plate (39) and the sealing cover (32); a heat conducting pipe (322) is arranged on the sealing cover (32) for connecting the heat conducting cavity (321) and the outside of the box body (1); a one-way air permeable membrane is arranged inside the heat conducting pipe (322); A plurality of groups of flow-around components are arranged on the horizontal partition (33) in the second installation room; each group of the flow-around components comprises two buffer columns (37), the two buffer columns (37) are connected via a second thin silicone sheet (36), and the second thin silicone sheet (36) can fluctuate under the action of the buffer columns (37).

2. The integrated laser gyro inertial measurement device according to claim 1, characterized in that: The edge of the heat conducting plate (39) contacts the inner wall of the sealing cover (32); and a plurality of grooves are provided on the surface of the heat conducting plate.

3. The integrated laser gyro inertial measurement device according to claim 1, characterized in that: The middle part of the heat conducting plate (39) protrudes upwards so that a gathering cavity is formed on the lower side of the heat conducting plate.

4. The integrated laser gyro inertial measurement device according to claim 1, characterized in that: The heat conducting plate (39) comprises a copper plate (391), the copper plate (391) being provided with a plurality of strip-shaped through grooves (393) for connecting the upper side and the lower side of the copper plate (391); the copper plate (391) being provided with a plurality of heat dissipation chambers (396) connected to the strip-shaped through grooves (393); an aluminum plate (392) being provided in the heat dissipation chamber (396); and a heat dissipation gap (395) connected to the strip-shaped through grooves (393) being provided between the aluminum plate (392) and the heat dissipation chamber (396); The copper plate (391) and the aluminum plate (392) are both provided with a plurality of heat dissipation holes.

5. The integrated laser gyro inertial measurement device according to claim 4, characterized in that: The upper surface and the lower surface of the aluminum plate (392) are both provided with a plurality of protrusions (394), and the heat dissipation gap (395) is formed between the aluminum plate (392) and the copper plate (391) through the plurality of protrusions (394).

6. The integrated laser gyro inertial measurement device according to claim 1, characterized in that: A first gap is provided between the circuit board (38) and the inner wall of the second installation chamber, and a plurality of the circuit boards (38) are arranged in an up-and-down staggered manner, and a second gap is provided between two adjacent circuit boards (38).

7. The integrated laser gyro inertial measurement device according to claim 1, characterized in that: The laser gyroscope (7) is fixed in the first installation chamber (35) via a vibration-damping fixture (5), and two adjacent vibration-damping fixtures (5) are connected via a first thin silicone sheet (6), and the first thin silicone sheet (6) can achieve fluctuations under the action of the vibration-damping fixture (5).

8. The integrated laser gyro inertial measurement device according to claim 1, characterized in that: The sealing cover (32) is sealedly connected to the top of the frame (31).

9. An integrated laser gyro inertial measurement device according to any one of claims 1 to 8, characterized in that: A rubber vibration damper (4) is provided between the detection component (3) and the box body (1); the box body (1) is made of heat-insulating material.

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