A power semiconductor dynamic parameter alternating test system and method
By designing an alternating dynamic parameter testing system, and utilizing the rapid switching of multiple sets of test fixtures and relays, the problems of low efficiency and insufficient safety in power semiconductor dynamic parameter testing are solved, and an efficient and safe testing process is achieved.
Patent Information
- Application Number
- CN202411690321.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2044-11-25
AI Technical Summary
Existing dynamic parameter testing for power semiconductors is inefficient and poses safety risks, especially in the testing of high-power devices such as silicon carbide. The design of communication and protection devices in existing general-purpose oscilloscopes results in slow testing speed and insufficient safety.
Design an alternating dynamic parameter testing system, including multiple sets of test fixtures, protection devices, switching matrices and limit trigger circuits. The system enables rapid switching between fixtures through rotation or sliding operations, and combines high-power and high-speed relays for resource allocation to ensure the safety and efficiency of the testing process.
It significantly improves the testing efficiency of power semiconductors and enhances the safety and reliability of the testing process, making it particularly suitable for dynamic parameter testing of high-power devices such as silicon carbide.
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Figure CN119667428B_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the technical field of integrated circuit testing, and more specifically, relates to a power semiconductor dynamic parameter alternating testing system and method. Background Technology
[0002] In the testing process of power semiconductors, especially in the testing of high-power devices such as silicon carbide, efficiency has always been a major challenge for the industry and the testing field.
[0003] Specifically, power semiconductor testing typically includes the detection of static (DC) parameters and dynamic parameters. Static parameter testing is highly efficient because the conditions are relatively constant and the voltage, current, and other parameters involved can be measured quickly. In contrast, dynamic parameter testing requires monitoring signal fluctuations, including rising and falling edges and time delays, and post-test calculations such as slope and integration of the waveform are also necessary. This results in a longer testing cycle and relatively lower efficiency.
[0004] In existing technologies, general-purpose oscilloscopes are commonly used for dynamic parameter testing. A computer controls the oscilloscope to execute the test and needs to communicate with it to read and analyze the captured graphs and parameters during the test. The key parameters and graphs are then transmitted to a host computer for further processing. This process further slows down the testing speed. Furthermore, because power semiconductor testing involves high voltages and currents, there are safety risks to operators. Therefore, appropriate protective devices must be provided during the testing process. For example, fixture covers or protective covers are used, and protective devices with restricted positions are installed. In existing technologies, the test program can only be started when the protective device completely covers the test fixture; otherwise, the system remains in a protected state. Summary of the Invention
[0005] In view of the above-mentioned defects or needs of the prior art, the purpose of this invention is to provide a dynamic parameter alternating test system and method for power semiconductors. By redesigning an alternating dynamic parameter test scheme and improving the setting and working mechanism of several key components such as test fixtures, protection devices, switching matrices and limit trigger circuits, the test efficiency of power semiconductors can be significantly improved compared with the prior art, while enhancing the safety and reliability of the test process. Therefore, it is particularly suitable for dynamic parameter testing of high-power devices such as silicon carbide.
[0006] To achieve the above objectives, according to one aspect of the present invention, a power semiconductor dynamic parameter alternating testing system is provided, characterized in that the system includes a test fixture, a protection device, a switching matrix, and a limit trigger circuit, wherein:
[0007] The test fixtures are in multiple sets, each independently and controllably used to clamp and fix each test object.
[0008] The protection device is designed to switch between multiple sets of test fixtures, and after switching to a certain set of test fixtures and completely covering the test fixture, it immediately triggers the limit trigger circuit installed at the test fixture.
[0009] After being triggered, the limit trigger circuit is used to activate the switching matrix, which is used to allocate test resources to the current test fixture and perform the required dynamic parameter test; at the same time, another set of idle test fixtures is used to place new test objects.
[0010] Once the test fixture has completed the test on the fixed test object, the protection device is switched to another set of test fixtures. The corresponding limit trigger circuit is immediately triggered and the switching matrix is activated. The switching matrix then allocates test resources to perform new dynamic parameter tests and removes the test object that has completed the test, thereby realizing an alternating continuous cycle of the entire test process.
[0011] As a further preferred embodiment, the number of test fixtures is two sets, which are used in conjunction with other components for alternating testing of the two sets of test objects.
[0012] As a further preferred embodiment, the protective device is preferably a rotary structure, a seesaw type, or a sliding door structure, and the switching between two sets of test fixtures is performed by rotating, pressing, or sliding operations.
[0013] As a further preferred embodiment, the common terminal of the switching matrix is used to connect the test resources, and its switching terminal is used to connect each of the test fixtures, so that there is no redundant circuitry in the test loop.
[0014] As a further preferred embodiment, the test resources include a high-voltage power supply, a voltage capacitor, a freewheeling inductor, an oscilloscope, and a drive signal generator, etc.
[0015] As a further preferred embodiment, for high-power test resources, the above system preferably uses high-power high-voltage relays for connection and switching; for high-speed test resources, the above system preferably uses high-speed relays for switching.
[0016] As a further preferred embodiment, the protection device and the switching matrix are synchronously linked.
[0017] According to another aspect of the present invention, a corresponding testing method is also provided, characterized in that the method includes the following steps:
[0018] S1. Place the test object on an empty set of the test fixtures;
[0019] S2. Operate the protective device to completely cover the current test fixture, and simultaneously trigger the corresponding limit protection circuit.
[0020] S3. The limit protection circuit activates the switching matrix and allocates test resources to the current test fixture;
[0021] S4. Perform the required dynamic parameter tests and monitor parameters such as voltage, current and temperature in real time during the test process; at the same time, a new test object is placed on another set of test fixtures.
[0022] S5. After the current test is completed, repeat steps S2 to S4 until the dynamic parameter testing process of all test objects is completed.
[0023] In summary, compared with the prior art, the above-described technical solutions conceived by this invention mainly possess the following technical advantages:
[0024] 1. This invention closely integrates the dynamic parameter testing characteristics and specific requirements of various power semiconductors. By setting up multiple sets of test fixtures and their coordination with limit trigger circuits, switching matrices, etc., rapid switching during the testing process can be achieved, greatly reducing test preparation time and significantly improving the testing efficiency of power semiconductors compared with existing technologies.
[0025] 2. The present invention has made further improvements to the setting method of the protection device. Accordingly, the switching between different test fixtures can be realized by simple pressing, rotating or sliding operations, and it is ensured that the working area is always under protection at any time, while the non-working area can be used for the placement or removal of the device.
[0026] 3. The alternating dynamic testing scheme of the present invention not only improves the testing efficiency of power semiconductors, but also helps to enhance the safety and reliability of the entire testing process, and is therefore particularly suitable for dynamic parameter testing of high-power devices such as silicon carbide. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the main structure of the dynamic parameter alternation test system according to the present invention;
[0028] Figure 2 This is a schematic diagram illustrating the application of the protection device according to a preferred embodiment of the present invention;
[0029] Figure 3 This is a schematic diagram illustrating the sliding door structure of a preferred embodiment of the present invention;
[0030] Figure 4 This is a trigger principle diagram used to illustrate a preferred embodiment of the present invention;
[0031] Figure 5 This is a flowchart of the main process flow of the alternating testing method according to the present invention. Detailed Implementation
[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0033] It should be understood that expressions such as "comprising" and "may include" as used in this application indicate the existence of the disclosed functions, operations, or constituent elements, and do not limit one or more additional functions, operations, and constituent elements. In this application, terms such as "comprising" and / or "having" may be interpreted as indicating a specific characteristic, number, operation, constituent element, component, or combination thereof, but should not be interpreted as excluding the existence or possibility of adding one or more other characteristics, numbers, operations, constituent elements, components, or combinations thereof.
[0034] It should be understood that the terms “center,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.
[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.
[0036] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0037] Figure 1 This is a schematic diagram of the main structure of the dynamic parameter alternation test system according to the present invention. The following will refer to... Figure 1 To explain the invention in more detail.
[0038] like Figure 1 As shown, the dynamic parameter alternation test system according to the present invention mainly includes a test fixture, a protection device, a switching matrix, and a limit trigger circuit, wherein:
[0039] The test fixtures are in multiple sets, each independently and controllably used to clamp and fix various test objects. The protective device is designed to switch between multiple sets of test fixtures, and immediately triggers the limit trigger circuit installed at the test fixture after switching to a certain set of test fixtures and completely covering it. The limit trigger circuit activates the switching matrix after triggering, which allocates test resources to the current test fixture. Preferably, a single-pole multi-throw switch is used, and a single-pole double-throw switch is used when there are two sets of test fixtures. The required dynamic parameter tests are then performed. At the same time, a new test object is placed in the other idle set of test fixtures.
[0040] Once the test fixture has completed the test on the fixed test object, the protection device is switched to another set of test fixtures. The corresponding limit trigger circuit is immediately triggered and the switching matrix is activated. The switching matrix then allocates test resources to perform new dynamic parameter tests and removes the test object that has completed the test, thereby realizing an alternating continuous cycle of the entire test process.
[0041] According to a preferred embodiment of the present invention, such as Figure 2As shown, the test fixtures are designed in two sets, and the switches are single-pole double-throw switches, used in conjunction with other components for alternating testing of the two sets of test objects. Correspondingly, the protection device is preferably a rotary structure, and switching between the two sets of test fixtures is performed through rotation. When the rotating door is in fixture 1 position, limit switches A and B of fixture 1 are triggered, the device on test fixture 1 is in a test-ready state, and test fixture 2 is not connected to any test resource, allowing for device installation or removal. When the rotating door is in fixture 2 position, limit switches A and B of fixture 2 are triggered, the device on test fixture 1 is in a test-ready state, test fixture 1 is not connected to any test resource, allowing for device installation or removal. When the rotating protective cover is in the triggered state of limit switch A of fixture 1 and limit switch A of fixture 2, or in the triggered state of limit switch B of fixture 1 and limit switch B of fixture 2, it indicates that the rotating protective cover is in an intermediate state and does not completely cover and protect fixture 1 or fixture 2. At this time, the test resources connected to the matrix switch are in the closed state, and the program waits for the protective cover to return to the fully protected position of fixture 1 or fixture 2.
[0042] According to a preferred embodiment of the present invention, such as Figure 3 As shown, the test fixtures are designed in two sets, and the switches are single-pole double-throw switches, used in conjunction with other components for alternating testing of the two sets of test objects. Correspondingly, the protection device is preferably a sliding door structure, and switching between the two sets of test fixtures is performed by sliding left and right. When the sliding door is in position 1, the device on test fixture 1 is in a test-ready state, and test fixture 2 is not connected to any test resources, allowing for device installation or removal. When the sliding door is in position 2, the device on test fixture 2 is in a test-ready state, and test fixture 1 is not connected to any test resources, allowing for device installation or removal. When the sliding door is in the triggered state of fixture 1 limit switch A and fixture 2 limit switch A, or in the triggered state of fixture 1 limit switch B and fixture 2 limit switch B, it indicates that the sliding door is in an intermediate state, not fully covering and protecting fixture 1 or fixture 2. At this time, the test resources connected to the matrix switch are in a closed state, and the program waits for the protective cover to return to the fully protected position of fixture 1 or fixture 2.
[0043] Based on the above concept, the protective device, designed as a seesaw, rotating, or sliding mechanism, ensures that at all times, half of the area is protected while the other half is operational. When one fixture is in a protected state and triggers a test, the other fixture is in a standby state, allowing operators to place or remove devices. In this way, while one fixture is being tested, the other can be prepared. Once the current fixture has completed testing and the new device is ready on the other fixture, the protective device can be switched, allowing the newly prepared fixture to begin testing, while the fixture that has completed testing is exposed for operator removal and replacement of devices. This parallelizes the testing process and operator work, significantly improving overall testing efficiency.
[0044] According to another preferred embodiment of the present invention, such as Figure 4 As shown, regarding the connection and switching of test resources, the common terminal of the matrix switch is connected to various test resources, including oscilloscopes, drive signal generators, and high-voltage power supplies. Through intelligent switching, these resources can be flexibly allocated to any test fixture. For high-power test resources, such as freewheeling inductors and high-voltage capacitors, the system preferably uses high-power high-voltage relays for connection and switching to ensure the stability and safety of the test. For high-speed signal resources, the system uses high-speed relays for switching to ensure the signal transmission speed and quality.
[0045] According to another preferred embodiment of the present invention, the system further optimizes the selection of relays, preferentially using single-pole double-throw or double-pole double-throw relays to improve the flexibility and reliability of switching. In addition, the system is designed with a switch capable of simultaneously managing multiple fixtures, allowing more than two test fixtures to be set simultaneously, but at any given time, only one fixture is in the actual testing state, while the other fixtures are in the ready-to-test state.
[0046] Accordingly, compared with existing technologies, this invention significantly improves overall operational efficiency, and its operation process is simple and clear: First, the device under test (DUT) is placed on an idle fixture, and the protection device is adjusted to trigger the limit protection circuit, activating the matrix switch and connecting the test resource to the fixture. Then, the device is placed on another idle fixture in front of the tester, and the test on the previous fixture is completed. Afterwards, by rotating or switching the protection device, the limit switch at the fixture where the new device is placed is triggered, connecting the test resource to that fixture, and the device from the fixture that has completed testing is removed, thus achieving a continuous cycle of the testing process. In this way, this invention not only improves the testing efficiency of power semiconductors but also enhances the safety and reliability of the testing process, bringing significant technological progress to the field of semiconductor testing.
[0047] Figure 5This is a flowchart of the main process flow of the alternating testing method according to the present invention. The following will be combined with... Figure 5 Let me explain in detail one specific embodiment of the present invention.
[0048] Implementation Preparation: Test System Setup: Configure dedicated test fixtures, precision switching matrix, protection devices, limit trigger circuits, and intelligent control circuits.
[0049] Test resource configuration: Ensure that all test resources, including oscilloscopes, drive signal generators, high-voltage power supplies, freewheeling inductors, and high-voltage capacitors, are connected to the matrix switch.
[0050] Relay selection: Select appropriate relays according to test requirements to achieve switching between high-speed and high-power signals. High-speed relays are used for signal generators and oscilloscopes, while high-power switching relays are used for high-power devices such as freewheeling inductors.
[0051] System calibration: Calibrate all test equipment to ensure test accuracy and consistency.
[0052] Implementation process:
[0053] (1) Fixture preparation: Place the power semiconductor to be tested on an empty test fixture;
[0054] (2) Adjust the protection device to ensure that the protection device is in a certain protective position of the test fixture;
[0055] (3) Operate the protective device to cover the current test fixture while exposing the other fixture;
[0056] (4) Triggering the test process: By rotating or pressing the protection device, the limit trigger circuit is triggered, the matrix switch is activated, and the test resources are allocated to the current fixture;
[0057] (5) Test resource allocation: According to the test requirements, the matrix switch connects the corresponding test resources (such as voltage source, current monitor, etc.) to the current test fixture;
[0058] (6) Test execution: Start the test program and the intelligent control circuit executes the test according to the preset test parameters;
[0059] (7) Test monitoring: Real-time monitoring of parameters such as voltage, current and temperature during the test process to ensure that the test is carried out within a safe range;
[0060] (8) Test completion and switching: After the test is completed, the limit switch of another fixture is triggered by rotating or switching the protection device to prepare for the next round of testing;
[0061] (9) Device replacement: While the previous fixture test is completed, the operator can place a new device under test on another fixture;
[0062] (10) Data recording: Record all test data, including test results and system status.
[0063] Continuous loop testing: Repeat steps (3) to (8) above to achieve continuous loop testing process and improve testing efficiency.
[0064] In summary, this invention provides a more efficient, safe, and reliable alternating testing scheme. During the testing process, operators can place and remove devices from other fixtures. After the test is completed, the fixtures that have been placed and prepared are directly transferred to the protection device for testing. This not only improves the testing efficiency of power semiconductors but also enhances the safety and reliability of the testing process without significantly increasing the testing hardware overhead and cost. Therefore, it is particularly suitable for dynamic parameter testing of high-power devices such as silicon carbide.
[0065] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A power semiconductor dynamic parameter alternating testing system, characterized in that, The system includes a test fixture, a protection device, a switching matrix, and a limit trigger circuit, wherein: The test fixtures are in multiple sets, each independently and controllably used to clamp and fix each test object. The protection device is designed to switch between multiple sets of test fixtures, and after switching to a certain set of test fixtures and completely covering the test fixture, it immediately triggers the limit trigger circuit installed at the test fixture. The limit trigger circuit, upon triggering, activates the switching matrix, which allocates test resources to the current test fixture and performs the required dynamic parameter tests. Simultaneously, another set of idle test fixtures is used to place new test objects. The test resources include an oscilloscope, a drive signal generator, a high-voltage power supply, a freewheeling inductor, and a high-voltage capacitor. The common terminal of the switching matrix is used to connect the test resources, and the switching terminals of the switching matrix are used to connect each test fixture, ensuring that there are no redundant circuits in the test loop. Once the test fixture has completed the test on the fixed test object, the protection device is switched to another set of test fixtures. The corresponding limit trigger circuit is immediately triggered and the switching matrix is activated. The switching matrix then allocates test resources to perform new dynamic parameter tests and removes the test object that has completed the test, thereby realizing an alternating continuous cycle of the entire test process.
2. The system as described in claim 1, characterized in that, The test fixtures are in two sets and are used in conjunction with other components for alternating testing of the two sets of test objects.
3. The system as described in claim 2, characterized in that, The protective device is a rotary structure, a seesaw type, or a sliding door structure, and switches between two sets of test fixtures by rotating, pressing, or sliding operations.
4. The system as described in claim 3, characterized in that, For high-power test resources, the above system uses high-power high-voltage relays for connection and switching; for high-speed test resources, the above system uses high-speed relays for switching.
5. The system as described in claim 4, characterized in that, The protection device and the switching matrix are synchronized.
6. A method for alternating testing of dynamic parameters of power semiconductors, characterized in that, The method is performed using the system described in any one of claims 1-5, and includes the following steps: S1. Place the test object on an empty set of the test fixtures; S2. Operate the protective device to completely cover the current test fixture, and simultaneously trigger the corresponding limit trigger circuit; S3. The limit trigger circuit activates the switching matrix to allocate test resources to the current test fixture; wherein, the test resources include an oscilloscope, a drive signal generator, a high-voltage power supply, a freewheeling inductor, and a high-voltage capacitor; the common terminal of the switching matrix is used to connect the test resources, and the switching terminals of the switching matrix are used to connect each of the test fixtures, so that there are no redundant circuits in the test loop; S4. Perform the required dynamic parameter tests and monitor the voltage, current and temperature parameters in real time during the test process; at the same time, a new test object is placed on another set of test fixtures. S5. After the current test is completed, repeat steps S2 to S4 until the dynamic parameter testing process of all test objects is completed.
Citation Information
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