Backlight module and display device

Abstract

The embodiment of the present disclosure provides a backlight module and a display device. Wherein, the backlight module comprises: a light-emitting substrate comprising a light-emitting area and a binding area located on one side of the light-emitting area; an electrostatic protection layer located on the non-light-emitting side of the light-emitting substrate; at least one flexible circuit board, the flexible circuit board is bound in the binding area, and the flexible circuit board comprises a fan-out area, the fan-out area is located between the light-emitting substrate and the electrostatic protection layer; at least one stretchable protruding structure located on one side of the fan-out area facing the electrostatic protection layer, one end of the protruding structure is electrically connected with the ground end of the flexible circuit board, the other end of the protruding structure protrudes towards the electrostatic protection layer and is electrically connected with the electrostatic protection layer.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of display, in particular to a backlight module and a display device. BACKGROUND

[0002] With the improvement of people's requirements for display effect of display products, mini light emitting diode (Mini LED, MLED) backlight technology emerges as the times require. The MLED backlight technology is composed of tens of thousands of super small size LEDs, and the light partition can be made more detailed, and the contrast is higher.

[0003] In a display device formed by using the MLED backlight technology, a backlight module and a driving circuit are included, wherein the backlight module includes a glass lamp plate formed based on the Mini LED backlight technology, and a metal structure layer located at a non-light-emitting side of the glass lamp plate, that is, the metal structure layer is located between the backlight module and the driving circuit. However, in the test stage of product preparation, the formed display product does not match the corresponding driving circuit, and only includes the backlight module. At this time, the glass lamp plate includes circuit structures such as flexible printed circuit boards, but the metal structure layer is bonded with the glass substrate in the glass lamp plate, and there is no electrical connection between the two. Therefore, the metal structure layer cannot avoid damage to the backlight module caused by static electricity or inrush current. SUMMARY

[0004] The present disclosure provides a backlight module and a display device.

[0005] In a first aspect, the present disclosure provides a backlight module, comprising:

[0006] a light-emitting substrate including a light-emitting area and a bonding area located at one side of the light-emitting area;

[0007] an electrostatic protection layer located at a non-light-emitting side of the light-emitting substrate;

[0008] at least one flexible printed circuit board, the flexible printed circuit board is bonded in the bonding area, and the flexible printed circuit board includes a fan-out area, the fan-out area is located between the light-emitting substrate and the electrostatic protection layer;

[0009] at least one stretchable protruding structure located at one side of the fan-out area facing the electrostatic protection layer,

[0010] one end of the protruding structure is electrically connected with a ground end of the flexible printed circuit board, and the other end of the protruding structure protrudes towards the electrostatic protection layer and is electrically connected with the electrostatic protection layer.

[0011] In some embodiments, the protruding structure includes a fixed part, a stretchable part and a cap part,

[0012] The fixing part is fixed on the fan-out area, and the fixing part is formed with a containing space having an opening towards the side of the electrostatic protection layer;

[0013] At least part of the telescopic part and the cap part is located in the containing space, and the telescopic part is configured to adjust the height of the cap part protruding from the opening, so that the cap part is in contact with the electrostatic protection layer.

[0014] In some embodiments, the fixing part includes a bottom wall fixed on the fan-out area and a side wall surrounding the bottom wall, and the bottom wall and the side wall define the containing space;

[0015] The telescopic part includes an elastic member, one end of the elastic member is connected to the bottom wall, and the other end of the elastic member is connected to the bottom of the cap part.

[0016] In some embodiments, the cap part includes a first sub-part and a second sub-part connected as one and arranged in sequence along the axial direction of the cap part, wherein the first sub-part is in contact with the electrostatic protection layer,

[0017] The surface of the first sub-part in contact with the electrostatic protection layer is a first surface, and the orthogonal projection of the first surface on the fan-out area is located in the area of the orthogonal projection of the second sub-part on the fan-out area.

[0018] In some embodiments, the first surface is a plane or an arc surface.

[0019] In some embodiments, the side wall has a first end away from the side of the bottom wall,

[0020] The fixing part further includes at least one limiting protrusion located on the inner surface of the side wall close to the first end;

[0021] At least one limiting groove is provided on the side surface of the second sub-part, the limiting groove corresponds to the limiting protrusion, and the limiting groove extends along the axial direction of the cap part, so that the limiting protrusion slides in the limiting groove.

[0022] In some embodiments, the second sub-part is further provided with a baffle, the baffle is located on the side of the limiting groove close to the bottom wall, and the limiting protrusion is located between the baffle and the bottom wall.

[0023] In some embodiments, the inner surface of the bottom wall towards the containing space is a second surface, the bottom surface of the second sub-part is a third surface,

[0024] The second surface and the third surface are both circular, and the diameter of the second surface is greater than the diameter of the third surface.

[0025] In some embodiments, the first spacing between the light-emitting substrate and the electrostatic protection layer is not less than the sum of the thickness of the fan-out area and the height of the protruding structure.

[0026] In some embodiments, the height of the retractable protruding structure is retractable in a range of 0.03mm to 0.05mm.

[0027] In some embodiments, the thickness of the fan-out area is 0.25mm to 0.26mm, and the first spacing is 0.28mm to 0.31mm.

[0028] In some embodiments, the electrostatic protection layer further comprises a hollow portion corresponding to the flexible circuit board,

[0029] The flexible circuit board further comprises a first binding connection area and a second binding connection area, and the first binding connection area, the fan-out area and the second binding connection area are sequentially connected, wherein,

[0030] The first binding connection area is bound to the binding area, and the second binding connection area extends to the side of the electrostatic protection layer away from the light-emitting substrate through the hollow portion.

[0031] In some embodiments, each of the flexible circuit boards comprises a plurality of protruding structures, and the plurality of protruding structures are arranged along a first direction intersecting with the direction of the fan-out area pointing to the second binding connection area.

[0032] In some embodiments, the backlight module further comprises a connector connected to the end of the second binding connection area away from the fan-out area.

[0033] In some embodiments, the material of the electrostatic protection layer comprises metal.

[0034] In a second aspect, the embodiments of the present disclosure provide a display device comprising the backlight module provided in the first aspect.

[0035] In the backlight module provided by the embodiments of the present disclosure, at least one protruding structure is additionally provided, one end of the protruding structure is electrically connected to the grounding end of the flexible circuit board, and the other end of the protruding structure is always in contact with the electrostatic protection layer based on the retractability of the protruding structure, so that the light-emitting substrate can be protected by the electrostatic protection layer, and the inrush current can be transmitted to the grounding end, thereby avoiding damage to the light-emitting substrate caused by static electricity or inrush current, and improving the service life of the product. BRIEF DESCRIPTION OF DRAWINGS

[0036] The accompanying drawings are included to provide a further understanding of the present disclosure and constitute a part of the specification, illustrate the present disclosure and, together with the specific embodiments described below, serve to explain the present disclosure, but do not constitute a limitation on the present disclosure. In the drawings:

[0037] Figure 1 A structural schematic diagram of a backlight module provided in the related art;

[0038] Figure 2 A structural schematic diagram of a backlight module provided in the related art;

[0039] Figure 3 、 Figure 4 A structural schematic diagram of a backlight module provided in the related art;

[0040] Figure 5a A structural schematic diagram of a backlight module provided in the related art;

[0041] Figure 5b A structural schematic diagram of a backlight module provided in the related art;

[0042] Figure 6a A structural schematic diagram of a backlight module provided in the related art;

[0043] Figure 6b A structural schematic diagram of a backlight module provided in the related art;

[0044] Figure 6c A structural schematic diagram of a backlight module provided in the related art.

[0045] Explanation of reference signs:

[0046] Light-emitting substrate E, electrostatic protection layer M, flexible printed circuit FPC, protruding structure Pin, connector C;

[0047] Light-emitting substrate E: light-emitting area AA, binding area BA;

[0048] Electrostatic protection layer M: hollow part k;

[0049] Flexible printed circuit FPC: fan-out area f1, first binding connection area f2, second binding connection area f3;

[0050] Protruding structure Pin: fixing part p1, stretchable part p2, cap part p3;

[0051] Fixing part p1: bottom wall 11, second surface a2, side wall 12, first end 120, accommodation space Sp, limiting protrusion t1;

[0052] Stretchable part p2: elastic component 20;

[0053] Cap portion p3: first sub-portion 31, first surface a1; second sub-portion 32, limiting groove t0, baffle t2, third surface a3;

[0054] First direction X, axial direction Z. DETAILED DESCRIPTION

[0055] The specific embodiments of the present disclosure will be described in detail below with reference to the drawings. It should be understood that the specific embodiments described herein are merely intended to illustrate and explain the present disclosure, and are not intended to limit the present disclosure.

[0056] To make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the scope of protection of the present disclosure.

[0057] Unless otherwise defined, the technical terms or scientific terms used in the embodiments of the present disclosure should be understood as the common meanings of the technical terms or scientific terms by those skilled in the art to which the present disclosure belongs. The terms “first”, “second” and similar terms used in the present disclosure do not represent any order, number or importance, but are only used to distinguish different components. Similarly, the terms “include” or “contain” and similar terms mean that the elements or objects before the terms encompass the elements or objects listed after the terms and their equivalents, and do not exclude other elements or objects. The terms “connect” or “connected” and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper”, “lower”, “left”, “right” and the like are only used to represent relative positional relationships, and when the absolute positions of the described objects are changed, the relative positional relationships may also be changed accordingly.

[0058] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can be that the layer or element is directly on the other layer or substrate, or there can be an intermediate layer between the layer or element and the other layer or substrate.

[0059] In the embodiments of the present disclosure, the A structure is located on the "far side from the substrate" or "above" the B structure, which only refers to the layer of the A structure is formed after the layer of the B structure in the layering relationship, and does not mean that the A structure and the B structure have projection overlap or the distance between the A structure and the B structure and the substrate satisfies a specific relationship. In the embodiments of the present disclosure, the A structure is located on the "close side to the substrate" or "below" the B structure, which only refers to the layer of the A structure is formed before the layer of the B structure in the layering relationship, and does not mean that the A structure and the B structure have projection overlap or the distance between the A structure and the B structure and the substrate satisfies a specific relationship.

[0060] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are schematic illustrations of idealized embodiments. In the drawings, the thickness of layers and regions are exaggerated for clarity. Accordingly, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region illustrated as a rectangle will typically have rounded or curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

[0061] With the increasing demand for display effects of display products, mini light emitting diode (Mini LED, MLED) backlight technology emerges as the times require. The MLED backlight technology uses tens of thousands of super-small LEDs to form a backlight module, which can make the light partitioning more detailed and has higher contrast.

[0062] In a display device formed by using the MLED backlight technology, the display device includes a backlight module and a driving circuit. The backlight module includes a glass lamp plate formed based on the Mini LED backlight technology, and a metal structure layer located on a non-light-emitting side of the glass lamp plate, i.e., the metal structure layer is located between the backlight module and the driving circuit. Figure 1 As shown in a structural schematic diagram of a backlight module provided in the related art, Figure 1 As shown, a plurality of openings are arranged on the metal structure layer; a flexible printed circuit (FPC) is arranged on the glass lamp plate, one end of the FPC is bound to a binding area BA of the glass lamp plate, and the other end of the FPC passes through the openings on the metal structure layer and is connected to a printed circuit board (not shown in the figure).

[0063] At this point, the metal structure layer can be connected to the ground terminal of the driving circuit. Utilizing the conductivity of the metal structure layer, an electrostatic discharge (ESD) protection channel is provided for the circuit structure in the display device (including the driving structure and the flexible circuit board (FPC) in the glass light panel). Furthermore, the metal structure layer can also serve as a transmission channel for transmitting surge current to the ground terminal. The metal structure layer can effectively channel static electricity and / or surge current that occurs in its surroundings.

[0064] It should be understood that during the testing phase of product preparation, the display product formed does not match the corresponding driving circuit and only includes the backlight module. Figure 1 During the testing phase, the backlight unit consisted only of the glass panel G and the metal structure layer m. While the flexible printed circuit board (FPC) and other circuit structures were bonded to the bonding area BA of the glass panel G, the metal structure layer m was bonded to the glass substrate of the glass panel G, with no electrical connection between them. Therefore, the metal structure layer could not prevent damage to the backlight unit caused by static electricity or surge current.

[0065] In order to solve at least one of the above technical problems, the embodiment of the present disclosure provides a backlight module, which connects the metal structure layer to the ground terminal on the FPC by adding a stretchable protruding structure on the FPC. On the one hand, it avoids damage to the backlight module caused by static electricity or surge current during the testing phase. On the other hand, after the display device is prepared, the contact area of ​​the electrostatic protection is increased, and the static electricity or surge current around the metal structure layer is effectively drained to the ground terminal, thereby extending the service life of the display device.

[0066] Figure 2 This is a schematic diagram of an expanded backlight module provided by an embodiment of the present disclosure. Figure 3 、 Figure 4 FIG. 1 is a schematic diagram of a stacked backlight module provided in an embodiment of the present disclosure. Figures 2-4 As shown, the backlight module includes: a light-emitting substrate E, an electrostatic protection layer M, at least one flexible circuit board FPC, and at least one retractable protruding structure Pin located on the flexible circuit board FPC.

[0067] Among them, the light-emitting substrate E includes a light-emitting area AA and a binding area BA located on one side of the light-emitting area AA; the electrostatic protection layer M is located on the non-light-emitting side of the light-emitting substrate E; the flexible circuit board FPC is bound to the binding area BA, and the flexible circuit board FPC includes a fan-out area f1, and the fan-out area f1 is located between the light-emitting substrate E and the electrostatic protection layer M; at least one retractable protruding structure Pin is located on the side of the fan-out area f1 facing the electrostatic protection layer M, one end of the protruding structure Pin is electrically connected to the ground end of the flexible circuit board FPC, and the other end of the protruding structure Pin protrudes toward the electrostatic protection layer M and is electrically connected to the electrostatic protection layer M.

[0068] In the embodiments of the present disclosure, at least one protruding structure Pin is additionally arranged, one end of the protruding structure Pin is electrically connected with the ground end of the flexible circuit board FPC, and based on the stretchability of the protruding structure Pin, the other end of the protruding structure Pin can be ensured to be in contact with the electrostatic protection layer M at all times, so that the electrostatic protection layer M can be used to protect the light-emitting substrate E from static electricity and to transmit surge current to the ground end, thereby avoiding damage to the light-emitting substrate E caused by static electricity or surge current and improving the service life of the product.

[0069] It should be understood that, as Figure 4 shown, when the light-emitting substrate E is a large-size light-emitting substrate E, a plurality of flexible circuit boards FPC are connected on the binding area BA of the light-emitting substrate E, thereby providing driving signals for the light-emitting devices on the light-emitting substrate E. Specifically, the number of the flexible circuit boards FPC can be flexibly set according to actual conditions, and the embodiments of the present disclosure do not limit this. In addition, the material of the electrostatic protection layer M is a metal material with good electrical conductivity, thereby playing a role of electrostatic protection and transmitting surge current.

[0070] Figure 5a A planar structure schematic diagram of a flexible circuit board provided by the embodiments of the present disclosure is shown in FIG. 1, Figure 5b Another planar structure schematic diagram of a flexible circuit board provided by the embodiments of the present disclosure is shown in FIG. 2. In the drawings, Figure 5a A structure schematic diagram of the surface of the side of the flexible circuit board FPC away from the light-emitting substrate E is shown in FIG. 3, Figure 5b A structure schematic diagram of the surface of the side of the flexible circuit board FPC close to the light-emitting substrate E is shown in FIG. 4.

[0071] As Figure 2 , Figure 5a and Figure 5b shown, the flexible circuit board FPC further includes a first binding connection area f2 and a second binding connection area f3 arranged on both sides of the fan-out area f1, that is, the first binding connection area f2, the fan-out area f1 and the second binding connection area f3 of the flexible circuit board FPC are sequentially connected. The fan-out area f1 is bound on the binding area BA of the light-emitting substrate E; the electrostatic protection layer M is provided with a hollow part k corresponding to the flexible circuit board FPC, and the second binding connection area f3 extends to the side of the electrostatic protection layer M away from the light-emitting substrate E through the hollow part k.

[0072] As Figure 5b shown, at least one test point Test Point is reserved on the fan-out area f1 of the flexible circuit board FPC, the test point is a ground end signal, and the protruding structure Pin is arranged above the test point to electrically connect the protruding structure Pin with the ground end.

[0073] Figure 6a A structure schematic diagram of the protruding structure provided by the embodiments of the present disclosure is shown in FIG. 6, Figure 6bA structural schematic diagram of the fixing part provided by an embodiment of the present disclosure is shown in FIG. 1. As shown in FIG. 1, the fixing part p1 includes a fixing part p1, an extension part p2, and a cap part p3. The fixing part p1 is fixed on the fan-out area f1, and the fixing part p1 is formed with an accommodation space Sp having an opening facing the side of the electrostatic protection layer M. At least part of the extension part p2 and the cap part p3 are located in the accommodation space Sp, and the extension part p2 is configured to adjust the height of the cap part p3 protruding from the opening, so that the cap part p3 is in contact with the electrostatic protection layer M. Figure 6c A structural schematic diagram of the cap part provided by an embodiment of the present disclosure is shown in FIG. 2. As shown in FIG. 2, the protruding structure Pin includes a fixing part p1, an extension part p2, and a cap part p3. The fixing part p1 is fixed on the fan-out area f1, and the fixing part p1 is formed with an accommodation space Sp having an opening facing the side of the electrostatic protection layer M. At least part of the extension part p2 and the cap part p3 are located in the accommodation space Sp, and the extension part p2 is configured to adjust the height of the cap part p3 protruding from the opening, so that the cap part p3 is in contact with the electrostatic protection layer M. Figures 6a-6c

[0074] It should be understood that the electrostatic protection layer M and the glass substrate of the light-emitting substrate E are bonded by an adhesive layer. Specifically, the adhesive layer is coated on the light-emitting substrate E, and the electrostatic protection layer M is bonded with the uncured adhesive layer. After the adhesive layer is cured, the electrostatic protection layer M and the light-emitting substrate E are firmly connected. The adhesive layer can be a reactive hot melt adhesive. The adhesive has a certain fluidity when it is not cured. Therefore, the first gap Gap between the electrostatic protection layer M and the light-emitting substrate E is not fixed.

[0075] In view of this, the protruding structure Pin provided in the embodiment of the present disclosure can adjust the height of the cap part p3 protruding from the opening of the fixing part p1 through the extension part p2, so that the protruding structure Pin has the flexibility to match the gap between the electrostatic protection layer M and the light-emitting substrate E, thereby ensuring that the cap part p3 can be in contact with the electrostatic protection layer M.

[0076] In some embodiments, the materials of the fixing part p1 and the cap part p3 can be the same or can be selected from one of the following materials. For example, steel, stainless steel, tungsten steel, etc. These materials all have good wear resistance and hardness. Among them, the steel is generally made of high-quality carbon steel or alloy steel. Carbon steel has good toughness and strength. Alloy steel can improve the hardness and corrosion resistance of steel due to the presence of other metal elements. The protruding structure Pin made of steel is hard and has a long service life. Stainless steel generally refers to non-woven stainless steel, which has good corrosion resistance and high-temperature resistance. In addition, the protruding structure Pin made of stainless steel has a smooth surface and will not scratch the surface of the contacting parts, which is beneficial to protect the workpiece. Tungsten steel is a high-hardness alloy steel material, which has excellent cutting performance and wear resistance. Therefore, the protruding structure Pin made of tungsten steel has good durability.

[0077] In some embodiments, as shown in FIG. 3, the protruding structure Pin includes a fixing part p1, an extension part p2, and a cap part p3. The fixing part p1 is fixed on the fan-out area f1, and the fixing part p1 is formed with an accommodation space Sp having an opening facing the side of the electrostatic protection layer M. At least part of the extension part p2 and the cap part p3 are located in the accommodation space Sp, and the extension part p2 is configured to adjust the height of the cap part p3 protruding from the opening, so that the cap part p3 is in contact with the electrostatic protection layer M. Figure 6a , Figure 6b ​As shown, the fixed part p1 includes a bottom wall 11 fixed on the fan-out area f1 and a side wall 12 surrounding the bottom wall 11, and the bottom wall 11 and the side wall 12 define a containing space Sp; the telescopic part p2 includes an elastic component 20, one end of the elastic component 20 is connected to the bottom wall 11, and the other end of the elastic component 20 is connected to the bottom of the cap part p3.

[0078] The elastic component 20 can be a wave spring, which has a large range of stiffness, strong shock absorption capacity, and large deformation energy per unit volume of material. Compared with ordinary springs, the wave spring has the advantages of high strength, good flexibility, and strong impact resistance. In addition, the wave spring has a compact structure size, and under the same physical parameter conditions, it requires less installation space.

[0079] In addition, one end of the elastic component 20 is connected to the bottom wall 11, and the two can be welded or bonded. Alternatively, no connecting component is provided, and one end of the elastic component 20 is directly abutted on the bottom wall 11 based on the elastic force of the elastic component 20. Similarly, the other end of the elastic component 20 is connected to the bottom of the cap part p3, and the two can be welded or bonded. Alternatively, no connecting component is provided. In the embodiment of the present disclosure, the connection mode of any end of the elastic component 20 to other structures is not limited.

[0080] In some embodiments, as shown in Figures 6a-6c As shown, the cap part p3 includes a first sub-part 31 and a second sub-part 32 which are integrated and arranged in sequence along the axial direction Z of the cap part p3, wherein the first sub-part 31 is in contact with the electrostatic protection layer M, the surface of the first sub-part 31 in contact with the electrostatic protection layer M is a first surface a1, and the orthogonal projection of the first surface a1 on the fan-out area f1 is located within the area of the orthogonal projection of the second sub-part 32 on the fan-out area f1.

[0081] Specifically, one end of the protruding structure Pin is located on the test point Test Point reserved on the fan-out area f1, and the other end protrudes towards the side of the electrostatic protection layer M. The above-mentioned "axial direction Z of the cap part p3" refers to the direction of the fan-out area f1 of the flexible printed circuit board FPC on the back side of the light-emitting substrate E pointing to the electrostatic protection layer M after the backlight module is prepared, that is, the thickness direction of the electrostatic protection layer M or the light-emitting substrate E.

[0082] In one example, the second sub-part 32 can be cylindrical, and the first sub-part 31 can be frustoconical or semispherical. For example, as shown in Figure 6cAs shown, when the first sub-part 31 is in the shape of a circular truncated cone, the diameter d1 of the surface of the first sub-part 31 in contact with the electrostatic protection part, i.e. the first surface a1, is 1.15 mm ± 0.01 mm, and the diameter d3 of the bottom surface of the second sub-part 32 is 1.35 ± 0.01 mm. Such arrangement can ensure that the first sub-part 31 can be in contact with the surface of the electrostatic protection layer M under the stretching of the elastic component 20, and can reduce the contact area between the first sub-part 31 and the electrostatic protection layer M under the premise of sufficient electrostatic discharge, so as to prevent the first sub-part 31 from causing stress damage to the electrostatic protection layer M.

[0083] In some embodiments, the first surface a1 can be a plane or an arc surface; the connecting surface of the first surface a1 and the second sub-part 32 can also be a plane or an arc surface. For example, when the first sub-part 31 is in the shape of a circular truncated cone, the first surface a1 is a plane, and the connecting surface of the first surface a1 and the second sub-part 32 is also a plane; when the first sub-part 31 is in the shape of a half-sphere, the first surface a1 is an arc surface, and the connecting surface of the first surface a1 and the second sub-part 32 is an arc surface smoothly connected with the first surface a1, which is not limited in the embodiments of the present disclosure.

[0084] In some embodiments, as shown in the figure, the side wall 12 has a first end 120 away from the bottom wall 11, and the fixing part p1 further comprises at least one limiting protrusion t1 located on the inner surface of the side wall 12 close to the first end 120; the side surface of the second sub-part 32 is provided with at least one limiting groove t0 corresponding to the limiting protrusion t1, and the limiting groove t0 extends along the axial direction Z of the cap part p3, so that the limiting protrusion t1 slides in the limiting groove t0. Figures 6a-6c

[0085] The stretching and contraction of the elastic component 20 drives the cap part p3 to move along the axial direction Z, and through the cooperation between the limiting groove t0 and the limiting protrusion t1, the axial direction Z of the cap part p3 is perpendicular to the reference surface on which the electrostatic protection layer M is located, so as to avoid the axial direction Z of the cap part p3 being inclined to cause the contact area between the cap part p3 and the electrostatic protection layer M to be too small, thereby ensuring the electrostatic protection effect of the electrostatic protection layer M and effectively releasing the surge current. The above-mentioned axial direction Z inclination refers to that the axial direction Z of the cap part p3 forms an acute angle with the above-mentioned reference surface at any angle.

[0086] In addition, it should be further pointed out that the sliding of the limiting protrusion t1 in the limiting groove t0 means that the limiting protrusion t1 is located on the inner surface of the side wall 12 of the fixing part p1, and its position does not change. When the cap part p3 moves under the action of the stretching and contraction part p2, the limiting groove moves with the movement of the cap part p3, that is, the limiting protrusion t1 is stationary, and the limiting groove moves relative to the limiting protrusion t1 in the axial direction Z.

[0087] ​In some embodiments, the second sub-portion 32 is further provided with a baffle t2 located at one side of the limiting groove t0 close to the bottom wall 11, and the limiting protrusion t1 is located between the baffle t2 and the bottom wall 11.

[0088] Specifically, the baffle t2 is located at one side of the limiting groove t0 close to the bottom wall 11, and when the cap portion p3 extends out of the opening in a direction away from the bottom wall 11, the limiting groove t0 slides relative to the limiting protrusion t1 in the axial direction Z until the limiting protrusion t1 contacts the baffle t2, so that the bottom of the cap portion p3 is always located in the accommodation space Sp, thereby avoiding that the elastic member 20 acts on the cap portion p3 with excessive elastic force to push the cap portion p3 out of the fixing portion p1, causing the cap portion p3 and the fixing portion p1 to separate.

[0089] In some embodiments, as shown in Figure 6b , Figure 6c the inner surface of the bottom wall 11 on the side facing the accommodation space Sp is a second surface a2, and the bottom surface of the second sub-portion 32 is a third surface a3, both the second surface a2 and the third surface a3 are circular, and the diameter of the second surface a2 is greater than the diameter of the third surface a3.

[0090] It should be understood that the fixing portion p1 is sleeved below the cap portion p3, and the height of the cap portion p3 protruding from the fixing portion p1 is adjusted by the telescopic portion p2. Therefore, the diameter of the inner surface of the bottom wall 11 of the fixing portion p1 is slightly larger than the diameter of the bottom surface of the cap portion p3, thereby reserving sufficient matching space for the limiting groove t0 and the limiting protrusion t1, so that the height of the cap portion p3 is adjusted along the axial direction Z. In one example, the diameter d2 of the second surface a2 is 1.39±0.01 mm, and the diameter d3 of the third surface a3 is 1.35±0.01 mm.

[0091] In some embodiments, the first spacing Gap between the light-emitting substrate E and the electrostatic protection layer M is not less than the sum of the thickness of the fan-out area f1 of the flexible printed circuit board FPC and the height H of the telescopic protrusion Pin.

[0092] In some embodiments, the telescopic range of the height H of the telescopic protrusion Pin is 0.03 mm-0.05 mm, the thickness of the fan-out area f1 is 0.25 mm-0.26 mm, and the first spacing is 0.28 mm-0.31 mm.

[0093] Specifically, the height of the cap portion p3 can be equal to the height of the fixing portion p1, and the cap portion p3 can be moved within a range of 0.02 mm under the adjustment of the telescopic portion p2. In other words, under the adjustment of the telescopic portion p2, the height H of the entire raised structure Pin can be adjusted within a range of 0.03 mm to 0.05 mm. In this way, the unevenness formed by the fluidity of the colloid between the light-emitting substrate E and the electrostatic protection layer M when it is not solidified can be absorbed, so that the first gap Gap between the electrostatic protection layer M and the light-emitting substrate E is fixed.

[0094] Furthermore, by setting a retractable protruding structure Pin, on the one hand, the protruding structure Pin is always in contact with the electrostatic protection layer M, so that the light-emitting substrate E can be electrostatically protected through the electrostatic protection layer M, and the surge current can be transmitted to the ground; on the other hand, the first distance Gap between the light-emitting substrate E and the electrostatic protection layer M is fixed, thereby improving the service life of the product.

[0095] In some embodiments, as Figure 2 As shown, each flexible circuit board (FPC) includes multiple raised structure pins, and the raised structure pins are arranged along a first direction X, which intersects the direction from the fan-out area f1 to the second bonding connection area f3. The present embodiment does not limit the location and specific data of the raised structure pins on the first bonding connection area f2 of the flexible circuit board (FPC), and they can be flexibly configured according to product requirements.

[0096] In some embodiments, the backlight module further includes a connector C, which is connected to an end of the second bonding connection region f3 away from the fan-out region f1. The connector C can be integrated into a flexible printed circuit board (FPC) to form a flexible flat cable (FFC), which can be bonded to the second bonding connection region f3 of the flexible printed circuit board (FPC) via bonding terminals, although this is not limited in the present embodiment.

[0097] An embodiment of the present disclosure further provides a display device, comprising the above-mentioned backlight module.

[0098] The display device may be any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc., and the present disclosure does not limit this.

[0099] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present disclosure, and such modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A backlight module, characterized in that: include: A light-emitting substrate comprising a light-emitting area and a binding area located on one side of the light-emitting area; An electrostatic protection layer, located on the non-light-emitting side of the light-emitting substrate; at least one flexible circuit board, the flexible circuit board being bound to the binding area, and the flexible circuit board comprising a fan-out area, the fan-out area being located between the light-emitting substrate and the electrostatic protection layer; At least one retractable protrusion structure is located on a side of the fan-out area facing the electrostatic protection layer, One end of the protruding structure is electrically connected to the ground end of the flexible circuit board, and the other end of the protruding structure protrudes toward the electrostatic protection layer and is electrically connected to the electrostatic protection layer.

2. The backlight module according to claim 1, wherein: The raised structure includes a fixing portion, a telescopic portion and a cap portion. The fixing portion is fixed on the fan-out area, and the fixing portion forms an accommodation space, and the accommodation space has an opening facing one side of the electrostatic protection layer; At least parts of the telescopic portion and the cap portion are located in the accommodating space, and the telescopic portion is configured to adjust the height of the cap portion protruding from the opening so that the cap portion contacts the electrostatic protection layer.

3. The backlight module according to claim 2, wherein: The fixing portion includes a bottom wall fixed on the fan-out area and a side wall surrounding the bottom wall, wherein the bottom wall and the side wall define the accommodation space; The telescopic portion includes an elastic component, one end of the elastic component is connected to the bottom wall, and the other end of the elastic component is connected to the bottom of the cap portion.

4. The backlight module according to claim 3, wherein: The cap portion includes a first sub-portion and a second sub-portion which are connected as a whole and arranged in sequence along the axial direction of the cap portion, wherein the first sub-portion is in contact with the electrostatic protection layer, The surface of the first sub-portion in contact with the electrostatic protection layer is a first surface, and the orthographic projection of the first surface on the fan-out area is located within the area of ​​the orthographic projection of the second sub-portion on the fan-out area.

5. The backlight module according to claim 4, wherein: The first surface is a plane or a curved surface.

6. The backlight module according to claim 4, wherein: The side wall has a first end away from the bottom wall. The fixing portion further includes at least one limiting protrusion, and the limiting protrusion is located on the inner surface of the side wall near the first end; At least one limiting groove is provided on the side surface of the second sub-part, the limiting groove corresponds to the limiting protrusion, and the limiting groove extends along the axial direction of the cap part so that the limiting protrusion slides in the limiting groove.

7. The backlight module according to claim 6, wherein: The second sub-part is further provided with a baffle, which is located on a side of the limiting groove close to the bottom wall, and the limiting protrusion is located between the baffle and the bottom wall.

8. The backlight module according to claim 4, wherein: The inner surface of the bottom wall facing the accommodating space is the second surface, and the bottom surface of the second sub-part is the third surface. The second surface and the third surface are both circular, and a diameter of the second surface is larger than a diameter of the third surface.

9. The backlight module according to claim 1, wherein: There is a first distance between the light emitting substrate and the electrostatic protection layer, and the first distance is not less than the sum of the thickness of the fan-out region and the height of the protruding structure.

10. The backlight module according to claim 9, wherein: The retractable height range of the retractable protruding structure is 0.03 mm to 0.05 mm.

11. The backlight module according to claim 10, wherein: The thickness of the fan-out area is 0.25 mm to 0.26 mm, and the first spacing is 0.28 mm to 0.31 mm.

12. The backlight module according to claim 1, wherein: The electrostatic protection layer also includes a hollow portion corresponding to the flexible circuit board. The flexible circuit board further includes a first binding connection area and a second binding connection area, and the first binding connection area, the fan-out area and the second binding connection area are connected in sequence, wherein: The first binding connection area is bound to the binding area, and the second binding connection area extends through the hollow portion to a side of the electrostatic protection layer away from the light-emitting substrate.

13. The backlight module according to claim 12, wherein: Each of the flexible circuit boards includes a plurality of the protruding structures, and the plurality of the protruding structures are arranged along a first direction, which intersects with a direction from the fan-out area to the second binding connection area.

14. The backlight module according to claim 12, wherein: The backlight module further includes a connector connected to an end of the second binding connection area away from the fan-out area.

15. The backlight module according to claim 1, wherein: The material of the electrostatic protection layer includes metal.

16. A display device, characterized in that: The backlight module comprises the backlight module according to any one of claims 1 to 15.

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