A fast and low-cost manufacturing method for glass interposers used in chip 3D packaging

Abstract

This application relates to the field of 3D packaging and discloses a rapid and low-cost manufacturing method for glass adapter plates used in chip 3D packaging. It employs a single-plate electrode electric field-driven multi-nozzle jet deposition micro / nano 3D printing technology, using optimized printing process parameters and a set printing path to achieve efficient and defect-free metallization of high aspect ratio glass through-holes and rapid printing of conductive patterns on the surface of the glass adapter plate. The rapid and low-cost manufacturing method for glass adapter plates for chip 3D packaging proposed in this application can achieve the integrated manufacturing of double-sided conductive patterns and metallized TGV on the glass adapter plate using a single electric field-driven jet micro / nano 3D printing device.

Description

Technical Field

[0001] This application belongs to the field of advanced 3D packaging technology, specifically glass interposers and micro / nano additive manufacturing technology, and particularly relates to a rapid and low-cost manufacturing method for glass interposers used in chip 3D packaging. Background Technology

[0002] Chips are the cornerstone of the booming information society, and mastering high-end chip manufacturing technology is crucial to a nation's future global competitiveness in key areas such as artificial intelligence, high-performance computing, 5G / 6G communications, and the Internet of Things. As the nanometer-scale manufacturing processes of integrated circuits gradually approach their physical limits, the importance of extending and expanding Moore's Law through three-dimensional heterogeneous chip integration is becoming increasingly prominent. The key to the development and integration of heterogeneous integration technology lies in achieving multi-scale, multi-dimensional chip interconnects, thereby improving bandwidth and power efficiency and reducing latency, providing smaller and higher-performance chips for high-performance computing, artificial intelligence, and smart terminals. Vertical interconnects rely on technologies such as through-silicon vias (TSVs) or through-glass vias (TGVs), while horizontal interconnects are achieved through redistribution layers (RDLs).

[0003] Silicon-based 2.5D integration technology, as an advanced system integration technology, has seen rapid development in recent years. However, silicon-based PCBs have two main problems: 1) High cost: Through-silicon vias (TSVs) are fabricated using silicon etching processes, followed by the need for oxide insulating layers and thin wafer handling techniques; 2) Poor electrical performance: Silicon is a semiconductor material, and when transmission lines transmit signals, there is a strong electromagnetic coupling effect between the signal and the substrate material, generating eddy currents in the substrate, resulting in poor signal integrity (insertion loss, crosstalk, etc.). As a potential alternative to silicon-based PCBs, through-glass vias (TGVs) are becoming a research hotspot for domestic and international semiconductor companies and research institutions due to their numerous advantages.

[0004] Compared to silicon-based adapters, glass adapters offer several advantages: 1) Low cost: Benefiting from readily available large-size ultra-thin glass panels and the elimination of the need for insulating layer deposition, the manufacturing cost of glass adapters is approximately 1 / 8 that of silicon-based adapters; 2) Excellent high-frequency electrical properties: Glass is an insulating material with a dielectric constant only about 1 / 3 that of silicon, and a loss factor 2-3 orders of magnitude lower than silicon, significantly reducing substrate loss and parasitic effects, effectively improving the integrity of transmitted signals; 3) Easy availability of large-size ultra-thin glass substrates; 4) Simple process flow: No insulating layer needs to be deposited on the substrate surface and the inner wall of the TGV, and ultra-thin adapters do not require secondary thinning; 5) Strong mechanical stability: Warpage remains minimal even when the adapter thickness is less than 100μm; 6) Wide range of applications: In addition to its promising application prospects in high-frequency fields, the advantages of transparency, good hermeticity, and corrosion resistance make glass vias highly promising for applications in optoelectronic system integration and MEMS packaging.

[0005] Glass micropore metallization is one of the most important process steps in glass transition plate manufacturing. It is mainly achieved through metallization filling, and the main methods currently include chemical vapor deposition (CVD), physical vapor deposition (PVD), electroless plating, and electroplating. Copper electroplating is currently the most widely used technology (especially in industry). However, all of the above methods have certain shortcomings and limitations, such as expensive equipment, high production costs, low efficiency, and numerous and complex processes, and none of them can achieve defect-free, high-quality metallization of glass through-holes.

[0006] To achieve low-cost and rapid manufacturing of high-precision, high-density conductive patterns on the surface of glass adapter boards, current manufacturing processes still have significant shortcomings. For example, while laser ablation technology can achieve high-density circuit fabrication, it suffers from low efficiency, expensive equipment, and high production costs, making large-scale production difficult. Wet etching or electroplating technologies involve complex processes and generate large amounts of waste liquid and waste materials. Screen printing, due to its low precision, is also unsuitable for high-density circuit manufacturing.

[0007] Existing technologies are insufficient to meet the requirements of defect-free, high aspect ratio glass via metallization in glass transition plates; effective and reliable connection between the metallized glass vias and the surface conductive pattern with controllable connection point size and shape; and high precision, high density, excellent impact resistance, stability, and reliability of the surface conductive pattern. In particular, current technologies for manufacturing the surface conductive pattern and TGV metallization of glass transition plates require dozens of processes and dozens of pieces of equipment, resulting in long production cycles, high production costs, and expensive equipment. Therefore, existing technologies and solutions cannot meet the actual needs of the glass transition plate product development stage (which is merely design verification, requiring few prototypes; and involves constantly changing design schemes). There is an urgent need to develop new technologies and solutions for efficient and low-cost manufacturing of TGV metallization and surface conductive patterns in glass transition plates, especially new methods and equipment capable of integrated manufacturing of TGV metallization and surface conductive patterns in glass transition plates.

[0008] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0009] To achieve a short production cycle, low production cost, and short process flow for the integrated manufacturing of metallized TGV glass transition plates and surface conductive patterns; high production flexibility (adapting to the manufacturing of different conductive patterns, hole shapes, hole diameters, and aspect ratios); reliable connection between the metallized TGV and the surface conductive patterns with controllable connection point size and shape; and environmentally friendly production, this application discloses a rapid and low-cost manufacturing method for glass transition plates used in chip 3D packaging based on electric field-driven jet micro-nano 3D printing. Employing single-plate electrode electric field-driven multi-nozzle jet deposition micro-nano 3D printing technology, and following optimized printing process parameters and a set printing path, the method achieves efficient and defect-free metallization of high aspect ratio glass through-holes and rapid printing of conductive patterns on the glass transition plate surface.

[0010] The proposed method for rapid and low-cost manufacturing of glass adapters for chip 3D packaging enables the integrated manufacturing of double-sided conductive patterns (high-density redistribution printing in the XY plane to achieve horizontal interconnection of the chip) and metallized TGV (interlayer vertical interconnection glass via metallization to achieve vertical interconnection of the chip) using a single electric field driven jet micro-nano 3D printing equipment.

[0011] Furthermore, this application employs an array of multiple nozzles, enabling efficient parallel filling of multiple micropores and efficient printing of conductive patterns on the surfaces of multiple glass adapter plates.

[0012] In some embodiments of this application, a rapid and low-cost manufacturing method for a glass adapter plate for chip 3D packaging is provided, comprising the following steps:

[0013] Step 1: Glass plate pretreatment;

[0014] Step 2: Micropore forming. Using TGV hole forming technology, holes are drilled into the pretreated glass plate according to the design requirements. After drilling, the glass plate is cleaned and dried.

[0015] Step 3: Micro-hole 3D printing metal filling, specifically: (1) Place the perforated glass plate onto the fixture and clamp it in place; (2) Place the fixture onto the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Evacuate the printing chamber; (5) According to the set printing process parameters, printing mode and printing path, start from the bottom of the microhole and continuously spray deposited filling metal material to achieve defect-free complete filling of the microhole; (6) After completing the filling of the first or first group of microholes, repeat the operation of (5) and complete the printing of all microholes according to the pre-designed printing path; (7) The printing nozzle returns to the initial printing position and the vacuum environment of the printing chamber is broken.

[0016] Step 4: Filling with conductive metal. Place the glass plate with the completed micropore metal filling in a vacuum sintering furnace, set the sintering time, temperature and sintering curve for sintering treatment; conduct a filling effect evaluation. If the filling effect meets the requirements, the glass plate through-hole filling is completed; if not, repeat steps 3 and 4 to fill the filled micropores a second or multiple times to finally achieve the expected filling effect.

[0017] Step 5: Printing conductive patterns on the surface of the glass adapter plate, specifically: (1) Place the glass plate after filling the holes onto the fixture and clamp it in place; (2) Place the fixture onto the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Vacuum the printing chamber and perform vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters and printing path, and according to the electrical performance requirements of the conductive pattern, determine the number of printing layers and start printing from the set starting point; (6) Continue until all conductive patterns on the surface of the glass plate are printed; (7) The printing nozzle returns to the initial printing position and the vacuum environment of the printing chamber is broken.

[0018] Step 6: Curing of the conductive pattern on the surface of the glass adapter plate;

[0019] Step 7: Manufacturing the conductive pattern on the bottom surface of the glass adapter plate. Repeat steps 5 and 6 to complete the printing and curing of the required conductive pattern on the bottom surface of the glass adapter plate, resulting in an integrated glass adapter plate with metallized TGV and double-sided conductive pattern.

[0020] In some embodiments of this application, the micro-hole forming method in step 2 includes: laser etching, laser-induced denaturation, sandblasting, mechanical drilling, ultrasonic drilling, wet etching, deep reactive ion etching, photosensitive glass, laser-induced deep etching, focused discharge hole forming, etc.

[0021] In some embodiments of this application, the micropore forming method in step 2 is laser-induced denaturation.

[0022] In some embodiments of this application, the printing material metal ink in step 3 includes, but is not limited to, the following materials: high solids content nano-metal (gold, silver, copper) conductive paste, with nano-metal particle size of 10nm-1μm and solids content of 85-98wt.%.

[0023] In some embodiments of this application, the printing process parameters of step 3 are as follows: printing voltage 300-2000V; printing speed 0.1-20mm / s; printing air pressure 0.1-300kPa; printing nozzle size: 1-100μm.

[0024] In some embodiments of this application, the printing mode of step 3 includes, but is not limited to, the following modes: spiral lifting printing mode; stacked lifting printing mode; and Z-axis vertical lifting printing mode. For micropores smaller than 20 μm, the Z-axis vertical lifting printing mode is used. For circular micropores or irregularly shaped pores larger than 20 μm, spiral or stacked lifting printing modes are used.

[0025] In some embodiments of this application, the printing device in step 3 includes a plurality of printing nozzles (array nozzles), and the nozzles of the printing nozzles are all at the same height (Z direction); the nozzle spacing is consistent with the glass plate spacing in the fixture.

[0026] In some embodiments of this application, the fixture in step 3 can linearly array several glass plates, and the number of glass plates in the direction of the array nozzles should be an integer multiple of the number of nozzles.

[0027] In some embodiments of this application, the printing path in step 3 is as follows: when setting the printing path, the array nozzles should be treated as a unit, and the glass plate on the fixture should be divided into several unit printing areas. After each unit area of ​​glass plate is filled, the machine moves to the next unit printing area, and so on to complete the filling of all glass plates. The filling of microholes is planned with a path based on the correspondence between a single nozzle and a single glass plate.

[0028] In some embodiments of this application, the sintering temperature of step 4 is 50-300°C, and the sintering time is 20-120 minutes.

[0029] In some embodiments of this application, the printing material metal ink in step 5 includes, but is not limited to, the following materials: high solids content nano-metal (gold, silver, copper) conductive paste, with nano-metal particle size of 10nm-1μm and solids content of 85-98wt.%.

[0030] In some embodiments of this application, the printing process parameters of step 5 are: printing voltage 100-5000V; printing speed 0.01-200mm / s; printing air pressure 0.01-800kPa; printing nozzle size: 1-1000μm.

[0031] In some embodiments of this application, the conductive pattern printing path generation method in step 5 includes, but is not limited to, the following: drawing a printing pattern, using CAM software to convert the conductive pattern into printer adaptation code, and then importing the code into a 3D printer for conductive pattern printing.

[0032] In some embodiments of this application, step 5 can control the amount of printing material at the connection between the conductive pattern on the substrate surface and the metallized TGV to fill the uneven surface or depressions of the metallized TGV, and adjust the size and shape of the connection point between the conductive pattern on the surface and the metallized TGV, so that the connection between the conductive pattern on the surface and the metallized TGV is more reliable after curing.

[0033] In some embodiments of this application, the number of conductive pattern printing layers in step 5 is 1-10 layers.

[0034] In some embodiments of this application, the printing device in step 5 includes a plurality of printing nozzles (array nozzles), and the nozzles of the printing nozzles are all at the same height (Z direction); the nozzle spacing is consistent with the glass plate spacing in the fixture.

[0035] In some embodiments of this application, the fixture in step 5 can linearly array several glass plates, and the number of glass plates in the direction of the array nozzles should be an integer multiple of the number of nozzles.

[0036] In some embodiments of this application, the printing path in step 5 is as follows: when setting the printing path, the array nozzles should be treated as a unit, and the glass plate on the fixture should be divided into several unit printing areas. After printing the conductive pattern on the surface of the glass plate in each unit area, the process moves to the next unit printing area, and so on, to complete the printing of conductive patterns on the surface of all glass plates. The printing of conductive patterns on the surface is planned with a correspondence between a single nozzle and a single glass plate.

[0037] In some embodiments of this application, the sintering temperature of step 6 is 50-250°C, and the sintering time is 10-120 minutes.

[0038] Compared with the prior art, the beneficial effects of this application are as follows:

[0039] (1) The manufacturing method provided in this application has unique advantages in the product development stage of glass transition plate: short production cycle; fewer processes; low production cost; high production flexibility (can adapt to the manufacturing of conductive patterns with different densities, precision, and patterns, as well as holes with different shapes, diameters, and aspect ratios). Furthermore, the TGV filling and surface conductive pattern printing of the glass transition plate are entirely carried out using additive manufacturing methods, avoiding material waste and environmental pollution, and is a green and environmentally friendly manufacturing process.

[0040] (2) The manufacturing method provided in this application has the advantage of a short production cycle. Compared with the most commonly used electroplating copper method, the production cycle of TGV metallization is shorter. For micro-holes with larger apertures (>100μm), in order to achieve defect-free filling of micro-holes, the electroplating copper method usually needs to reduce the copper deposition rate, use low current density and low temperature, but the electroplating time is greatly extended, which ultimately leads to relatively low efficiency of electroplating filling. Compared with dry etching processes such as physical etching, chemical etching, and physicochemical etching, and wet etching processes such as dissolution etching and redox etching, the production cycle is also shorter.

[0041] (3) The manufacturing method provided in this application has the advantage of fewer steps. Common electroplated copper TGV metallization processes include cumbersome steps such as depositing barrier and seed layers, electroplating-depositing copper, annealing, and CMP chemical mechanical polishing. Common surface circuit fabrication methods such as photolithography include surface coating, photolithography, electroplating, and film removal. Wet etching methods include metal coating, fabrication of a mask with conductive patterns, etching, and film removal. However, the integrated manufacturing method of metallized TGV and surface conductive patterns provided in this application only includes the steps of filling holes, curing, and printing and curing the surface conductive patterns. The number of steps is small and the process flow is short.

[0042] (4) The manufacturing method provided in this application has the advantage of low production cost. Only one fully functional electric field driven jet micro-nano 3D printer and curing sintering equipment are needed to complete the preparation of metallized TGV and surface conductive patterns. The required equipment is small and does not require expensive equipment, so the equipment investment is small. The additive manufacturing method requires fewer types of materials and consumes less material.

[0043] (5) The manufacturing method provided in this application has high production flexibility and unique advantages in the product development stage. It can prepare conductive patterns with different line widths, densities, precision and patterns according to different application requirements; it can adapt to the preparation of blind holes or through holes with different hole shapes (such as V-shaped, X-shaped, columnar), hole diameters (10-500μm) and different aspect ratios (1-50), and in particular, it can realize the metallization of blind holes and through holes with different hole shapes, hole diameters and different aspect ratios on the same glass plate.

[0044] (6) The manufacturing method provided in this application is a green and environmentally friendly manufacturing method. Common electroplated copper TGV metallization methods and surface circuit manufacturing methods using photolithography or etching are quite polluting, generating a large amount of waste materials and waste liquids. The glass adapter plate metallization TGV and surface conductive pattern preparation in this application adopt green additive manufacturing methods, avoiding many problems such as material waste and the generation of "three wastes" (wastewater, waste gas and solid waste).

[0045] (7) The manufacturing method provided in this application has unique advantages in the defect-free metal filling of ultra-large high aspect ratio glass through holes and defect-free metal filling of small diameter glass through holes; it can realize the manufacturing of surface conductive patterns with high efficiency, high precision, high density and strong adhesion to the glass adapter plate.

[0046] (8) The manufacturing method provided in this application can control the amount of printing material at the connection between the conductive pattern on the substrate surface and the metallized TGV to fill the uneven surface or depression of the metallized TGV, and adjust the size and shape of the connection point between the conductive pattern on the surface and the metallized TGV, so that the connection between the conductive pattern on the surface and the metallized TGV is more reliable after curing.

[0047] (9) The manufacturing method provided in this application can achieve high-precision glass through-hole filling and RDL printing. Error compensation of the printing nozzle is achieved by relying on the X-motion vision module and the Y-motion vision module; and the precise positioning of the glass plate and the fixture is achieved by relying on the Z-axis vision positioning module installed at the nozzle.

[0048] (10) The manufacturing method provided in this application is a revolutionary glass transition plate manufacturing technology. Using high-solids-content micro / nano silver paste (or nano-conductive silver paste) as the printing metal material, it exhibits excellent conductivity after sintering. In particular, when using a metal paste containing glass powder, the metal filling the glass through-holes and the surface conductive pattern can be integrated with the glass plate. The prepared glass transition plate has excellent impact resistance, stability, and reliability, and can be used in extreme environments such as high vibration and extreme temperatures. Examples include aerospace, aviation, and hypersonic missiles. Attached Figure Description

[0049] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0050] Figure 1 A schematic diagram of the glass adapter plate resulting from the rapid and low-cost manufacturing method for the glass adapter plate used in chip 3D packaging provided in this application.

[0051] Figure 2 This is a flowchart illustrating the rapid and low-cost manufacturing method for the glass adapter plate used in chip 3D packaging provided in this application.

[0052] Figure 3 A schematic diagram of the rapid and low-cost manufacturing process for the glass adapter plate provided in this application.

[0053] Figure 4 A schematic diagram of the glass plate clamp provided in this application.

[0054] Figure 5 A schematic diagram of the micro / nano 3D printing working device based on single-plate electrode electric field driven multi-nozzle jet deposition provided in this application.

[0055] Figure 6 This is a schematic diagram of the path for the nozzle to metallize and fill the glass through-hole (printing mode) provided in this application. Detailed Implementation

[0056] The technical solution of this application will be clearly and completely described below with reference to the accompanying drawings and specific embodiments. However, those skilled in the art will understand that the embodiments described below are some embodiments of this application, but not all embodiments, and are only used to illustrate this application, and should not be regarded as limiting the scope of this application.

[0057] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0058] In the description of this application, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or relative positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and for simplification, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Unless otherwise specified, the above-mentioned orientational descriptions can be flexibly set in practical applications, provided that the relative positional relationships shown in the accompanying drawings are satisfied.

[0059] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0060] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "communication" should be interpreted broadly, such as fixed connection, detachable connection, or integral connection. Connections can be direct or indirect through an intermediate medium; they can be internal connections between two components or electrical connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0061] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, article, or apparatus that includes that element.

[0062] In the embodiments of this application, the words "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Rather, the use of the words "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0063] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall apply. Reagents or instruments whose manufacturers are not specified are all commercially available conventional products.

[0064] A rapid and low-cost manufacturing method for glass adapter plates used in chip 3D packaging based on electric field-driven jet micro / nano 3D printing. Specific implementation methods are as follows: Figure 2 As shown:

[0065] Step 1: Glass plate pretreatment.

[0066] Step 2: Micropore formation.

[0067] Step 3: Micro-hole 3D printing metal filling. (1) Place the perforated glass plates one by one onto the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them in place; (2) Place the fixture onto the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Vacuum the printing chamber. Perform vacuum treatment on the entire printing chamber. Reach the set vacuum level to ensure that there is no residual air in the micro-holes; (5) According to the set printing process parameters (printing voltage, back pressure, printing speed, etc.), printing mode and printing path, start from the bottom of the micro-hole and continuously spray deposited filling metal material to achieve defect-free complete filling of the micro-holes; (6) After completing the filling of the first (first group) micro-holes, repeat the operation of (5) and complete the printing of all micro-holes according to the pre-designed printing path; (7) The printing nozzle returns to the initial printing position and the vacuum environment of the printing chamber is broken.

[0068] Step 4: Fill with conductive metal.

[0069] Step 5: Printing conductive patterns on the surface of the glass adapter plate. (1) Place the glass plates after filling the holes one by one onto the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them in place; (2) Place the fixture on the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Vacuum the printing chamber. Perform vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters (printing voltage, back pressure, printing speed, etc.) and printing path, and determine the number of printing layers (repeated printing times with the same printing path) according to the electrical performance requirements of the conductive pattern, start printing from the set starting point; (6) Until the conductive patterns on the surface of all glass plates are printed; (7) The printing nozzle returns to the initial printing position, and the vacuum environment in the printing chamber is broken.

[0070] Step 6: Curing of the conductive pattern on the surface of the glass adapter plate.

[0071] Step 7: Fabrication of conductive pattern on the bottom surface of the glass adapter plate. This results in an integrated glass adapter plate with a metallized TGV and double-sided conductive pattern.

[0072] Example 1

[0073] The selected glass plate has dimensions of 35×35×0.25mm. The diameters of the micropores to be filled are 50μm and 100μm, and the depth of the through-holes is 250μm (aspect ratios of 5:1 and 2.5:1). The 50μm through-holes are arranged in a 9×9 array with a spacing of 300μm on the left side of the glass plate, and the 100μm through-holes are arranged in a 6×6 array with a spacing of 300μm on the right side of the glass plate.

[0074] Step 1: Glass plate pretreatment. Clean the glass plate with acetone, alcohol and deionized water in sequence under ultrasonic treatment for 5 minutes, and then heat and dry the cleaned glass plate.

[0075] Step 2: Micropore Forming. Using laser-induced denaturation pore-forming technology, holes are drilled into the pretreated glass plate according to the design requirements. After drilling, the glass plate is cleaned and dried.

[0076] Steps 3-7 as follows Figure 3 As shown.

[0077] Step 3: Micro-hole 3D printing metal filling. (1) Place the perforated glass plates one by one onto the fixture and clamp them in place, such as... Figure 4 As shown; (2) Place the fixture on the worktable of the multi-nozzle single-plate electrode electric field driven jet deposition micro / nano 3D printing equipment, as shown. Figure 5 As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing equipment, move the printing nozzle to the marked point on the glass plate; (4) Vacuum the printing chamber. Perform vacuum treatment on the entire printing chamber. Set the vacuum degree to -20kPa to ensure that there is no residual air in the micropores; (5) Set the printing process parameters (printing voltage 1600V, back pressure 100kPa, printing speed 0.1mm / s), and use a spiral lifting method for the filling path, such as Figure 6 (b) As shown, the pitch is 30μm, the spiral diameter is 15μm, and the nozzle diameter is 20μm; starting from the bottom of the micropore, the deposited metal material is continuously sprayed and filled, and the micropore of a single glass plate is completely filled without defects in one filling; (6) until the first glass plate (the first unit area) is filled, the operation of (5) is repeated, and the printing and filling of the micropores of all unit areas of the glass plate is completed according to the pre-designed printing path; (7) the printing nozzle returns to the initial printing position; the vacuum environment of the printing forming chamber is broken.

[0078] Step 4: Conductivity of the filling metal. In this embodiment, the filling metal material is low-temperature sintering silver paste. After the microporous metal filling is completed, the glass plate is placed in a vacuum sintering furnace and heated at 180°C for 30 minutes to complete the conductivity treatment of the filling metal.

[0079] Step 5: Printing conductive patterns on the surface of the glass adapter plate. (1) Place the glass plates after filling the holes one by one onto the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them in place; (2) Place the fixture on the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Perform vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters (printing voltage 1800V, back pressure 300kPa, printing speed 0.3mm / s) and printing path, set the number of conductive pattern printing layers to 2 layers, and start printing from the set starting point; (6) Continue until the conductive patterns on the surface of all glass plates are printed; (6) The printing nozzle returns to the initial printing position, and the vacuum environment in the printing chamber is broken.

[0080] Step 6: Curing the conductive pattern on the surface of the glass adapter plate. Place the glass plate with the printed conductive pattern in a vacuum sintering furnace and set the sintering time to 50 minutes and the temperature to 150℃ for sintering treatment.

[0081] Step 7: Fabrication of the conductive pattern on the bottom surface of the glass adapter plate. Repeat steps 5 and 6 to complete the printing and curing of the required conductive pattern on the bottom surface of the glass adapter plate. This results in an integrated glass adapter plate with a metallized TGV and double-sided conductive pattern, as shown below. Figure 1 As shown.

[0082] Example 2

[0083] The selected glass plate has dimensions of 20×20×0.2mm, the diameter of the micropores to be filled is 10μm, and the depth of the through-holes is 200μm (depth-to-width ratio 20:1). Multiple units of through-holes are arrayed on the surface of the glass plate, with each unit distributed at a 4×4 equidistant interval on the glass plate.

[0084] Step 1: Glass plate pretreatment. The glass plate is cleaned with acetone, alcohol and deionized water in sequence under ultrasonic treatment for 10 minutes, and then the cleaned glass plate is heated and dried.

[0085] Step 2: Micropore Forming. Using laser-induced denaturation pore-forming technology, holes are drilled into the pretreated glass plate according to the design requirements. After drilling, the glass plate is cleaned and dried.

[0086] Steps 3-7 as follows Figure 3 As shown

[0087] Step 3: Micro-hole 3D printing metal filling. (1) Place the perforated glass plates one by one onto the fixture and clamp them in place, such as... Figure 4 As shown; (2) Place the fixture on the worktable of the multi-nozzle single-plate electrode electric field driven jet deposition micro / nano 3D printing equipment, as shown. Figure 5As shown; (3) Using the CCD machine vision positioning module of the micro-nano 3D printing equipment, move the printing nozzle to the marked point on the glass plate; (4) Vacuum the printing chamber. Perform vacuum treatment on the entire printing chamber. Set the vacuum degree to -20kPa to ensure that there is no residual air in the micropores; (5) Set the printing process parameters (printing voltage 1800V, back pressure 50kPa, printing speed 0.08mm / s), and adopt the vertical lifting method for the filling path, such as Figure 6 (a) As shown, the nozzle diameter is 5μm; starting from the bottom of the micropore, the deposited metal material is continuously sprayed and filled, and the micropores of a single glass plate are completely filled without defects in one filling; (6) until the first glass plate (the first unit area) is filled, the operation of (5) is repeated, and the printing and filling of the micropores of all unit areas of the glass plate is completed according to the pre-designed printing path; (7) the printing nozzle returns to the initial printing position; the vacuum environment of the printing forming chamber is broken.

[0088] Step 4: Conductivity of the filling metal. In this embodiment, the filling metal material is low-temperature sintering silver paste. After the microporous metal filling is completed, the glass plate is placed in a vacuum sintering furnace and heated at 150°C for 60 minutes to complete the conductivity treatment of the filling metal.

[0089] Step 5: Printing conductive patterns on the surface of the glass adapter plate. (1) Place the glass plates after filling the holes one by one onto the fixture (the maximum number of glass plates placed is an integer multiple of the number of nozzles) and clamp them in place; (2) Place the fixture on the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Perform vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters (printing voltage 2000V, back pressure 400kPa, printing speed 0.2mm / s) and printing path, set the number of conductive pattern printing layers to 1 layer and start printing from the set starting point; (6) Continue until the conductive patterns on all glass plate surfaces are printed; (6) The printing nozzle returns to the initial printing position and the vacuum environment in the printing chamber is broken.

[0090] Step 6: Curing the conductive pattern on the surface of the glass adapter plate. Place the glass plate with the printed conductive pattern in a vacuum sintering furnace and set the sintering time to 40 minutes and the temperature to 170℃ for sintering treatment.

[0091] Step 7: Fabrication of the conductive pattern on the bottom surface of the glass adapter plate. Repeat steps 5 and 6 to complete the printing and curing of the required conductive pattern on the bottom surface of the glass adapter plate. This results in an integrated glass adapter plate with a metallized TGV and double-sided conductive pattern, as shown below. Figure 1 As shown.

[0092] Example 3

[0093] Based on the above embodiments, a micro / nano 3D printing device is proposed, such as... Figure 5 As shown, it includes: XYZ three-axis motion module 1, pneumatic module 2, multi-nozzle module 3, high-voltage power supply 4, signal generator 5, frame 6, printing platform 7, and nozzle error compensation module 8.

[0094] The XYZ three-axis motion module 1 includes an X-axis motion module 101, a Z-axis motion module 102, and a Y-axis motion module 103. The Z-axis motion module 102 of the XYZ three-axis motion module 1 is connected to the X-axis motion module 101 of the XYZ three-axis motion module 1, and the X-axis motion module 101 is connected to the Y-axis motion module 103 of the XYZ three-axis motion module 1; the Y-axis motion module 103 of the XYZ three-axis motion module 1 is fixed on the frame 6.

[0095] The multi-nozzle module 3 includes a CCD machine vision positioning module (Z-axis vision positioning module) 301, a first connecting frame 302, a second connecting frame 303, a back pressure connecting unit 304, a laser rangefinder 305, a printing needle 306, and a cartridge 307. The multi-nozzle module 3 includes 25 printing nozzle modules (distributed in a 5×5 array). Each printing nozzle module includes a printing needle 306 and a cartridge 307. The printing needle 306 is positioned at the bottom of the nozzle and perpendicular to the glass plate. The upper part of the cartridge 307 is connected to the back pressure connecting unit 304. The back pressure connecting unit 304 is connected to the pneumatic module 2. The CCD machine vision positioning module 301 is fixed to the first connecting frame 302. The first connecting frame 302 and the laser rangefinder 305 are connected to the Z-axis motion module 102 of the XYZ three-axis motion module. The multi-nozzle module is fixed to the Z-axis motion module 102 of the XYZ three-axis motion module 1 by the second connecting frame 303.

[0096] The printing platform 7 includes a base 701, a flat electrode 702, and a fixture 703. The flat electrode 702 is placed on and fixed to the base 701. The positive (or negative) terminal of the high-voltage power supply 4 connected to the signal generator 5 is connected to the flat electrode 702. The fixture 703 (fixed on the glass plate after micro-hole forming) is in direct contact with the flat electrode 702 and is placed on the flat electrode 702.

[0097] The nozzle error compensation module 8 includes a Y-motion direction vision module 801, a connecting frame 802, and an X-motion direction vision module 803. The Y-motion direction vision module 801 and the X-motion direction vision module 803 are fixed on two connecting frames 802, and the connecting frames 802 are fixed on the frame 6.

[0098] The XYZ three-axis motion module 1 adopts a gantry structure. The self-weight X-axis motion module 101 includes a precision motion platform such as a linear motor module and a servo motor module. The X-axis motion module 101 has a stroke of 200mm, a repeatability of ±0.5μm, a positioning accuracy of ±1μm, and a maximum acceleration of 1g. The Y-axis motion module 103 also includes a precision motion platform such as a linear motor module and a servo motor module. The Y-axis motion module 103 has a stroke of 200mm, a repeatability of ±0.5μm, a positioning accuracy of ±1μm, and a maximum acceleration of 1g. The Z-axis motion module 102 uses a servo motor module. The Z-axis motion module 102 has a stroke of 50mm, a repeatability of ±0.5μm, and a positioning accuracy of ±3μm.

[0099] The pressure range of the pneumatic module 2 is 0 bar to 4 bar, and the pressure regulation accuracy of the back pressure control module is greater than or equal to 1 kPa.

[0100] The printing needle 306 is made of glass, with an inner diameter ranging from 0.1 to 1000 μm.

[0101] The high-voltage power supply 4 has the following functions: outputting DC high voltage; outputting AC high voltage; outputting pulsed high voltage, and can set the bias voltage. The bias voltage setting range is continuously adjustable from 0-2kV, the DC high voltage is 0-5kV, the output pulsed DC voltage is continuously adjustable from 0-±4kV, the output pulse frequency is continuously adjustable from 0Hz-3000Hz, and the AC high voltage is 0-±4kV.

[0102] The flat plate electrode 702 is a copper electrode with a thickness ranging from 15 mm. The flatness of the flat plate electrode 702 is tolerance grade 5.

[0103] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these fall within the scope of protection of this application. Therefore, the scope of protection of this patent application should be determined by the appended claims.

Claims

1. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging, characterized in that, Includes the following steps: Step 1: Glass plate pretreatment; Step 2: Micropore forming. Using TGV hole forming technology, holes are drilled into the pretreated glass plate according to the design requirements. After drilling, the glass plate is cleaned and dried. Step 3: Micro-hole 3D printing metal filling, specifically: (1) Place the perforated glass plate onto the fixture and clamp it in place; (2) Place the fixture onto the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Evacuate the printing chamber; (5) According to the set printing process parameters, printing mode and printing path, start from the bottom of the microhole and continuously spray the deposited filling metal material to achieve defect-free complete filling of the microhole; (6) After completing the filling of the first or first group of micropores, repeat the operation of (5) and complete the printing of all micropores according to the pre-designed printing path; (7) The printing nozzle returns to the initial printing position and the vacuum environment of the printing chamber is broken. Step 4: Filling with conductive metal. Place the glass plate with the completed micropore metal filling in a vacuum sintering furnace, set the sintering time, temperature and sintering curve for sintering treatment; conduct a filling effect evaluation. If the filling effect meets the requirements, the glass plate through-hole filling is completed; if not, repeat steps 3 and 4 to fill the filled micropores a second or multiple times to finally achieve the expected filling effect. Step 5: Printing conductive patterns on the surface of the glass adapter plate, specifically: (1) Place the glass plate after filling the holes onto the fixture and clamp it in place; (2) Place the fixture onto the worktable of the single-plate electrode electric field driven multi-nozzle jet deposition micro-nano 3D printing equipment; (3) Use the CCD machine vision positioning module of the micro-nano 3D printing equipment to move the printing nozzle to the marked point on the glass plate; (4) Vacuum the printing chamber and perform vacuum treatment on the entire printing chamber; (5) According to the set printing process parameters and printing path, and according to the electrical performance requirements of the conductive pattern, determine the number of printing layers and start printing from the set starting point; (6) Continue until all conductive patterns on the surface of the glass plate are printed; (7) The printing nozzle returns to the initial printing position and the vacuum environment of the printing chamber is broken. Step 6: Curing of the conductive pattern on the surface of the glass adapter plate; Step 7: Manufacturing the conductive pattern on the bottom surface of the glass adapter plate. Repeat steps 5 and 6 to complete the printing and curing of the required conductive pattern on the bottom surface of the glass adapter plate, resulting in an integrated glass adapter plate with metallized TGV and double-sided conductive pattern.

2. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging according to claim 1, characterized in that, The micro-hole forming method in step 2 includes: laser etching, laser-induced denaturation, sandblasting, mechanical drilling, ultrasonic drilling, wet etching, deep reactive ion etching, photosensitive glass, laser-induced deep etching, and focused discharge hole formation.

3. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging according to claim 1, characterized in that, The printing material in step 3 includes: a high-solids-content nano-metal conductive paste, with nano-metal particle size of 10nm-1μm and solid content of 85-98wt.%; the printing process parameters in step 3 are: printing voltage 300-2000V; printing speed 0.1-20mm / s; printing air pressure 0.1-300kPa; and printing nozzle size 1-100μm.

4. A rapid and low-cost manufacturing method for a glass adapter plate for chip 3D packaging according to claim 1, characterized in that, The printing modes in step 3 include: spiral lifting printing mode; stacked lifting printing mode; Z-axis vertical lifting printing mode; for micropores smaller than 20μm, the Z-axis vertical lifting printing mode is used; for circular micropores or irregularly shaped pores larger than 20μm, the spiral or stacked lifting printing mode is used.

5. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging according to claim 1, characterized in that, The printing device in step 3 includes several printheads, and the nozzles of all printheads are at the same height; the spacing between the printheads is consistent with the spacing between the glass plates in the fixture; the fixture in step 3 can linearly array several glass plates, and the number of glass plates in the direction of the array printheads should be an integer multiple of the number of printheads; the printing path in step 3: when setting the printing path, the array printheads should be treated as a unit, and the glass plates on the fixture should be divided into several unit printing areas. After each unit area of ​​glass plate is filled, it moves to the next unit printing area, and so on until all glass plates are filled; the filling of microholes is planned according to the correspondence between a single printhead and a single glass plate.

6. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging according to claim 1, characterized in that, The sintering temperature in step 4 is 50-300℃, and the sintering time is 20-120 minutes.

7. A rapid and low-cost manufacturing method for a glass adapter plate for chip 3D packaging according to claim 1, characterized in that, The printing material in step 5 includes: a high-solids-content nano-metal conductive paste, with nano-metal particle size of 10nm-1μm and solid content of 85-98wt.%; the printing process parameters in step 5 are: printing voltage 100-5000V; printing speed 0.01-200mm / s; printing air pressure 0.01-800kPa; printing nozzle size: 1-1000μm; the conductive pattern printing path generation method in step 5 includes, but is not limited to, the following: drawing the printing pattern, using CAM software to convert the conductive pattern into printer adaptation code, and then importing the code into the 3D printer for conductive pattern printing.

8. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging according to claim 1, characterized in that, Step 5 involves controlling the amount of printing material at the connection point between the conductive pattern on the glass plate surface and the metallized TGV to fill uneven surfaces or depressions on the metallized TGV, and adjusting the size and shape of the connection point between the conductive pattern on the surface and the metallized TGV to make the connection between the conductive pattern on the surface and the metallized TGV more reliable after curing.

9. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging according to claim 1, characterized in that, The conductive pattern printing layer in step 5 is 1-10 layers; the printing device in step 5 includes several printing nozzles, and the nozzles of the printing nozzles are all at the same height; the nozzle spacing is consistent with the glass plate spacing in the fixture; the fixture in step 5 can linearly array several glass plates, and the number of glass plates in the direction of the array nozzles should be an integer multiple of the number of nozzles; the printing path in step 5: when setting the printing path, the array nozzles should be treated as a unit, and the glass plates on the fixture should be divided into several unit printing areas. After printing the conductive pattern on the surface of each unit area of ​​the glass plate, the device moves to the next unit printing area, and so on, until all the conductive patterns on the surface of the glass plates are printed; the conductive pattern printing path is planned based on the correspondence between a single nozzle and a single glass plate.

10. A rapid and low-cost manufacturing method for a glass adapter plate for 3D chip packaging according to claim 1, characterized in that, The sintering temperature in step 6 is 50-250℃, and the sintering time is 10-120 minutes.

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