Substrate processing apparatus

Abstract

The present application relates to a substrate processing apparatus, comprising: a loading stage configured to receive a first substrate and a second substrate, and comprising a first substrate alignment portion for aligning the first substrate and a second substrate alignment portion for aligning the second substrate, the first substrate alignment portion being spaced apart from the first substrate alignment portion; a coating stage configured to sequentially receive the first substrate and the second substrate from the loading stage, and including a first discharge nozzle for discharging a first chemical solution onto the first substrate and a second discharge nozzle for discharging a second chemical solution onto the second substrate; and an unloading stage configured to sequentially unload the first substrate and the second substrate from the coating stage.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0125269 filed in the Korean Intellectual Property Office (KIPO) on September 20, 2023, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] Embodiments of the present disclosure relate to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method for applying a chemical solution such as a photoresist on a substrate. Background Art

[0004] In the process of applying a chemical solution to a substrate such as a liquid crystal display device, an organic light emitting display device, etc., the chemical solution may be applied to a glass plate or half of a glass plate. The coating equipment may have a processing space capable of coating one plate. When coating one plate within the processing space of the coating equipment, there are problems of reduced space utilization and increased process time (tact time). Summary of the invention

[0005] An object of the present disclosure is to provide a substrate processing apparatus capable of continuously performing a coating process on a plurality of half panels.

[0006] Another object of the present invention is to provide a substrate processing method using the substrate processing apparatus.

[0007] According to an exemplary embodiment, a substrate processing apparatus includes: a loading station configured to receive a first substrate and a second substrate, the loading station including a first substrate alignment portion for aligning the first substrate and a second substrate alignment portion for aligning the second substrate, the second substrate alignment portion being arranged to be spaced apart from the first substrate alignment portion; a coating station configured to sequentially receive the first substrate and the second substrate from the loading station, the coating station including a first discharge nozzle for discharging a first chemical solution onto the first substrate and a second discharge nozzle for discharging a second chemical solution onto the second substrate; and an unloading station configured to sequentially unload the first substrate and the second substrate from the coating station.

[0008] In an exemplary embodiment, the substrate processing apparatus may further include: a transfer apparatus configured to sequentially transfer the first substrate and the second substrate to the loading stage.

[0009] In an exemplary embodiment, the transfer device may further include a plurality of rollers aligned on one side of the loading stage and rotated to move the first substrate and the second substrate.

[0010] In an exemplary embodiment, the transfer device may further include a robot arm for transferring the first substrate and the second substrate, and the loading stage may further include a plurality of supporting pins for receiving the first substrate and the second substrate from the robot arm, respectively.

[0011] In an exemplary embodiment, the first substrate alignment portion may include: a plurality of first central pins disposed in a central area of ​​the loading stage; and a plurality of first peripheral pins disposed in a first peripheral area adjacent to one side of the central area; and the second substrate alignment portion may include: a plurality of second central pins disposed in the central area of ​​the loading stage; and a plurality of second peripheral pins disposed in a second peripheral area adjacent to the other side opposite to the one side of the central area.

[0012] In an exemplary embodiment, the first center pin and the second center pin may be arranged alternately with each other.

[0013] In an exemplary embodiment, the loading stage may align a third substrate larger than each of the first substrate and the second substrate through the first peripheral pins and the second peripheral pins.

[0014] In an exemplary embodiment, the first and second central pins and the first and second peripheral pins may be driven to move up and down and left and right to align each of the first and second substrates.

[0015] In an exemplary embodiment, when one of the first discharge nozzle and the second discharge nozzle is driven, the other discharge nozzle may stop driving.

[0016] In an exemplary embodiment, the first discharge nozzle may be disposed adjacent to the loading stage, and the second discharge nozzle may be disposed adjacent to the unloading stage.

[0017] According to an exemplary embodiment, a substrate processing device includes: a conveying device configured to convey a first half plate and a second half plate to perform a coating process; a loading station configured to receive the first half plate and the second half plate from the conveying device, the loading station including a first substrate alignment portion for aligning the first half plate and a second substrate alignment portion for aligning the second half plate, the second substrate alignment portion being arranged to be spaced apart from the first substrate alignment portion; a coating station configured to sequentially receive the first half plate and the second half plate from the loading station, the coating station including a first discharge nozzle for discharging a first chemical solution onto the first half plate and a second discharge nozzle for discharging a second chemical solution onto the second half plate; and an unloading station configured to sequentially unload the first half plate and the second half plate from the loading station.

[0018] In an exemplary embodiment, the transfer device may further include a plurality of rollers aligned on one side of the loading station and rotated to move the first half plate and the second half plate.

[0019] In an exemplary embodiment, the transfer device may further include a robot arm for transferring the first half panel and the second half panel, and the loading station may further include a plurality of support pins for receiving the first half panel and the second half panel from the robot arm, respectively.

[0020] In an exemplary embodiment, the first substrate alignment portion may include: a plurality of first central pins disposed in a central area of ​​the loading stage; and a plurality of first peripheral pins disposed in a first peripheral area adjacent to one side of the central area; the second substrate alignment portion may include: a plurality of second central pins disposed in the central area of ​​the loading stage; and a plurality of second peripheral pins disposed in a second peripheral area adjacent to the other side opposite to the one side of the central area.

[0021] In an exemplary embodiment, the first center pin and the second center pin may be alternately arranged.

[0022] In an exemplary embodiment, the loading stage may align a substrate larger than each of the first half plate and the second half plate through the first peripheral pin and the second peripheral pin.

[0023] In an exemplary embodiment, the first and second central pins and the first and second peripheral pins may be driven to move up and down and left and right to align each of the first and second half plates.

[0024] In an exemplary embodiment, when one of the first discharge nozzle and the second discharge nozzle is driven, the other discharge nozzle may stop driving.

[0025] In an exemplary embodiment, the first discharge nozzle may be disposed adjacent to the loading stage, and the second discharge nozzle may be disposed adjacent to the unloading stage.

[0026] According to an exemplary embodiment, a substrate processing device may include: a conveying device configured to convey a first half plate and a second half plate to perform a coating process; a loading station configured to receive the first half plate and the second half plate from the conveying device, the loading station having a central area and a first peripheral area and a second peripheral area on both sides of the central area, the loading station including a first substrate alignment portion and a second substrate alignment portion, wherein the first substrate alignment portion aligns the first half plate by a plurality of first central pins arranged in the central area and a plurality of first peripheral pins arranged in the first peripheral area, wherein the second substrate alignment portion aligns the first half plate by a plurality of first central pins arranged in the central area and a plurality of first peripheral pins arranged in the first peripheral area. A plurality of second central pins in the domain and a plurality of second peripheral pins arranged in the second peripheral area are used to align the second half plate, and the second central pins are arranged alternately with the first central pins; a coating station is configured to sequentially receive the first half plate and the second half plate from the loading station, the coating station has a first discharge nozzle for discharging a first chemical solution onto the first half plate and a second discharge nozzle for discharging a second chemical solution onto the second half plate, the coating station is configured to selectively drive one of the first discharge nozzle and the second discharge nozzle; and an unloading station is configured to sequentially unload the first half plate and the second half plate from the coating station to the outside.

[0027] According to an exemplary embodiment, a substrate processing apparatus may include: a loading station configured to receive a first substrate and a second substrate, and including a first substrate alignment portion for aligning the first substrate and a second substrate alignment portion for aligning the second substrate, the second substrate alignment portion being arranged to be spaced apart from the first substrate alignment portion; a coating station configured to sequentially receive the first substrate and the second substrate from the loading station, and having a first discharge nozzle for discharging a first chemical solution onto the first substrate and a second discharge nozzle for discharging a second chemical solution onto the second substrate; and an unloading station configured to sequentially unload the first substrate and the second substrate from the coating station to the outside.

[0028] Therefore, the loading stage can align the first substrate and the second substrate at the same time by the first substrate alignment part and the second substrate alignment part. The first substrate and the second substrate can be a plurality of half panels cut from a single display substrate. Since the loading stage can sequentially provide the plurality of half panels to the coating stage, the substrate processing device can continuously perform the coating process on the plurality of half panels, and the time required to align the plurality of half panels can be reduced.

[0029] In addition, the coating station may have a first discharge nozzle and a second discharge nozzle for discharging the first chemical solution and the second chemical solution onto the first substrate and the second substrate, respectively. The first substrate and the second substrate may be sequentially provided from the loading station to the coating station, and the coating process may be sequentially performed on the first substrate and the second substrate through the first discharge nozzle and the second discharge nozzle, respectively.

[0030] Since the loading stage receives the first substrate and the second substrate at the same time, and the coating stage sequentially performs the coating process on the first substrate and the second substrate, the substrate processing apparatus can reduce the process time (takt time).

[0031] However, the effects of the present disclosure are not limited to the above-mentioned effects, and various extensions can be made without departing from the idea and scope of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a plan view showing a substrate processing system according to an exemplary embodiment.

[0033] Figure 2 is a diagram showing a method according to an exemplary embodiment Figure 1 A three-dimensional view of a substrate processing device.

[0034] Figure 3 It is shown Figure 2 A plan view of a substrate processing apparatus.

[0035] Figure 4 It is shown Figure 2 Front view of a substrate processing apparatus.

[0036] Figures 5 to 7 is a view showing a step of arranging a first substrate and a second substrate.

[0037] Figures 8 to 10 is a view showing a step of applying a chemical solution on a first substrate and a second substrate.

[0038] Fig.11 and Fig.12 is a view showing the steps of placing a third substrate and discharging a solution onto the third substrate.

[0039] Fig.13 is a plan view illustrating a substrate processing apparatus including a transfer apparatus having a robot arm according to an exemplary embodiment.

[0040] Figures 14 to 17 It is shown by Fig.13 FIG. 4 is a view of the step in which the robot arm places the first substrate and the second substrate. DETAILED DESCRIPTION

[0041] Hereinafter, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings.

[0042] Since various modifications can be made to the present disclosure and the present disclosure can have various forms, the embodiments will be described in detail through the detailed description. However, this is by no means to limit the present disclosure to a specific disclosure form, and the present disclosure should be interpreted as including all modifications, equivalents and substitutes included in the thought and technical scope of the present disclosure.

[0043] The terms used herein are intended to describe only certain embodiments and should in no way limit the present disclosure. Unless the context clearly indicates otherwise, expressions in the singular include the meaning of the plural form. In the present disclosure, terms such as "comprising" or "including" are intended to indicate the presence of features, numbers, steps, operations, elements, parts, or combinations thereof described in the present disclosure, and should not be interpreted as excluding any possibility of the presence or addition of one or more other features, numbers, steps, operations, elements, parts, or combinations thereof.

[0044] When describing each of the accompanying drawings, similar reference numerals will be used for similar elements. Terms such as "first" and "second" may be used to describe various elements, but the elements are not limited by these terms, and these terms may only be used to distinguish one element from another.

[0045] Figure 1 is a plan view showing a substrate processing system according to an exemplary embodiment.

[0046] refer to Figure 1 The substrate processing system 10 may include a load port 20 and an index module 30 configured to load and unload a substrate, and a processing module arranged at one side of the index module 30 and configured to sequentially perform semiconductor processing on the substrate. For example, the substrate may include a liquid crystal display device, an organic light emitting display device, a semiconductor wafer, etc.

[0047] The load port 20 , the index module 30 , and the process module may be arranged along a first direction (X direction). The process module may include a buffer chamber 40 , a first process chamber 50 , a second process chamber 60 , and a transfer chamber 70 .

[0048] In an exemplary embodiment, the substrate processing system 10 may perform a semiconductor process, such as a developing process, a drying process, etc., on a substrate on which an exposure process and a soft bake process have been performed. For example, the first processing chamber 50 may perform a coating process in which a chemical process, a rinsing process, and an organic solvent process are sequentially performed, and the second processing chamber 60 may perform a drying process using a supercritical fluid.

[0049] like Figure 1 As shown, the load port 20 may include a support plate 24 for supporting a carrier 22 including a plurality of substrates stored therein. The load port 20 may be a port on which substrates are loaded or unloaded, and a plurality of support plates 24 may be arranged in the load port 20 along a second direction (Y direction) perpendicular to the first direction.

[0050] The indexing module 30 may include an indexing robot 34 that can move along an indexing track 32 extending in the Y direction within the indexing frame. The indexing robot 34 can transfer the substrate between the carrier 22 on the support plate 24 and the processing module. The indexing robot 34 may include a base, a robot hand, and a vertical guide. The base may be configured to move in the Y direction along the indexing track 32, the vertical guide may extend vertically on the base, and the robot hand may move in the vertical direction along the vertical guide.

[0051] The processing module may be arranged at one side of the indexing module 30. The buffer chamber 40 may be arranged at one side of the indexing frame of the indexing module 30. The buffer chamber 40 may include a plurality of buffers 42 for temporarily storing a plurality of substrates respectively. The plurality of buffers 42 may be arranged vertically to be spaced apart from each other. The buffer 42 may include a support plate for supporting the substrate. The buffer chamber 40 may also include a buffer robot disposed at one side of the buffer 42 and transferring the substrate between the buffers 42.

[0052] The transfer chamber 70 may extend from the buffer chamber 40 in a direction parallel to the X direction. The first processing chamber 50 may be arranged on one side of the transfer chamber 70. The second processing chamber 60 may be arranged on the other side of the transfer chamber 70. The first processing chamber 50 may be arranged along the X direction. The second processing chamber 60 may be arranged along the X direction. Each of the first processing chambers 50 may include a plurality of substrate processing devices 100, and the plurality of substrate processing devices 100 are vertically stacked in a plurality of stages. Each of the second processing chambers 60 may include a plurality of drying devices, and the plurality of drying devices are vertically stacked in a plurality of stages.

[0053] The buffer chamber 40 may provide a space in which a substrate to be transferred from the indexing module 30 to the first processing chamber 50 and a substrate to be transferred from the second processing chamber 60 to the indexing module 30 temporarily stay. In the first processing chamber 50, a developing process may be performed. In the first processing chamber 50, a developing process may be performed on a substrate on which an exposure process has been performed. In the second processing chamber 60, a drying process may be performed on a substrate on which a developing process has been performed.

[0054] A transfer chamber 70 for transferring a substrate may be provided between the first process chamber 50 and the second process chamber 60. The transfer robot 72 may transfer the substrate while moving along a transfer track 74 extending in the X direction. The transfer robot 72 may be installed to be vertically movable along a vertical guide.

[0055] The transfer robot 72 may transfer a substrate placed in the buffer chamber 40 to the first process chamber 50. The transfer robot 72 may transfer a substrate having undergone a development process in the first process chamber 50 to the second process chamber 60. The transfer robot 72 may transfer a substrate having undergone a development process in the second process chamber 60 to the buffer chamber 40.

[0056] In an exemplary embodiment, a plurality of first processing chambers 50 may be arranged in the X direction. The types of chemicals used in each of the first processing chambers 50 may be different from each other. As an example, the chemical may be a negative tone developer. The chemical may include n-butyl acetate. The first processing chamber 50 may include a developing device for applying a developer on the substrate on which the exposure process has been performed to perform a developing process.

[0057] A plurality of second processing chambers 60 may be arranged in the X direction. The second processing chamber 60 may perform a drying process that supplies a high pressure fluid to a substrate to which chemicals have been applied. For example, a developing process may be performed on a substrate in the first processing chamber 50, and a drying process may be performed in the second processing chamber 60.

[0058] Alternatively, in the first processing chamber 50, a chemical process, a rinsing process, and a first drying process may be sequentially performed on the substrate, and in the second processing chamber 60, a second drying process may be performed. In this case, the first drying process may be performed using an organic solvent, and the second drying process may be performed using a supercritical fluid. Isopropyl alcohol (IPA) liquid may be used as the organic solvent, and carbon dioxide (CO 2 ) may be used as a supercritical fluid. Alternatively, the first drying process may be omitted in the first processing chamber 50.

[0059] The arrangement of the load port, the index module, and the process module, and the arrangement and number of the first process chamber and the second process chamber are shown as examples, and it will be understood that the concepts of the present invention are not limited thereto.

[0060] Hereinafter, the substrate processing apparatus 100 of the first processing chamber 50 will be described in detail.

[0061] Figure 2 is a diagram showing a method according to an exemplary embodiment Figure 1 A three-dimensional view of a substrate processing device. Figure 3 It is shown Figure 2 A plan view of a substrate processing apparatus. Figure 4 It is shown Figure 2 Front view of a substrate processing apparatus.

[0062] refer to Figures 1 to 4 , the substrate processing apparatus 100 may include: a loading station 200 configured to receive a substrate for performing a coating process; a coating station 300 configured to apply chemicals to the substrate; and an unloading station 400 configured to unload the substrate to the outside. The loading station 200, the coating station 300, and the unloading station 400 may be sequentially arranged along one direction of the coating process.

[0063] The substrate processing apparatus 100 may provide air and vacuum to lower surfaces of the first and second substrates S1 and S2 to move the substrates in a floating state on the loading stage 200, the coating stage 300, and the unloading stage 400. The substrate processing apparatus 100 may precisely control the positions of the substrates by controlling the air and vacuum.

[0064] In an exemplary embodiment, the substrate may include an original glass plate, two glass half plates having a size of 1 / 2 of the original glass plate by dividing the original glass plate into two, and a substrate having a size of 1 / 3 of the original glass plate by dividing the original glass plate into three. In the present specification, the half plate may include a first substrate and a second substrate. The original plate may include a third substrate. The size of the third substrate may be larger than the size of each of the first substrate and the second substrate.

[0065] The substrate processing apparatus 100 can perform coating processes on the original plate and the half plate. The substrate processing apparatus 100 can perform coating, exposure, development, cleaning and drying processes on the original plate and the half plate as a single facility.

[0066] The substrate processing apparatus 100 can perform a coating process on one original plate or one half plate. For example, when two or more original plates are transferred from the transfer chamber 70, the substrate processing apparatus 100 can accommodate one original plate. Alternatively, when two half plates are transferred from the transfer chamber 70, the substrate processing apparatus 100 can accommodate two half plates.

[0067] In an exemplary embodiment, the substrate processing apparatus 100 may further include a conveyor 110 for conveying a substrate. The conveyor 110 may receive a substrate from a conveying chamber 70 of the substrate processing system 10. Alternatively, the conveyor 110 may be provided integrally with the conveying chamber 70. The conveyor 110 may include the same components as the conveying chamber 70. The conveyor 110 may convey the substrate received from the conveying chamber 70 to the loading stage 200. The conveyor 110 may sequentially convey the first substrate S1 and the second substrate S2 to the loading stage 200. The conveyor 110 may include: a plurality of rollers 120 that rotate to move the first substrate S1 and the second substrate S2, and a plurality of grippers 130 to support the first substrate S1 and the second substrate S2, respectively.

[0068] The plurality of rollers 120 may be aligned at one side of the loading stage 200. In addition, the plurality of rollers 120 may be aligned at one side of the unloading stage 400. When a substrate is placed on the plurality of rollers 120, the plurality of rollers 120 may rotate to move the substrate.

[0069] The plurality of rollers 120 may move the first and second substrates S1 and S2 to which a previous process has been completed to the loading stage 200 by roller driving, and may unload the first and second substrates S1 and S2 to which chemicals have been applied from the unloading stage 400 to a subsequent process by roller driving.

[0070] The clamper 130 may transport the substrates while holding the first substrate S1 and the second substrate S2, respectively. Alternatively, the clamper 130 may transport the substrates while supporting the lower surfaces of the first substrate S1 and the second substrate S2. The clamper 130 may move the first substrate S1 and the second substrate S2 in a floating state on the loading stage 200, the coating stage 300, and the unloading stage 400. The clamper 130 may move along both sides of each of the loading stage 200, the coating stage 300, and the unloading stage 400.

[0071] In an exemplary embodiment, the loading stage 200 may align the first substrate S1 and the second substrate S2, respectively. The loading stage 200 may include a first substrate alignment portion 210 aligned with the first substrate S1 and a second substrate alignment portion 220 aligned with the second substrate S2. The loading stage 200 may include: a central region CR; a first peripheral region PR1 positioned adjacent to one side of the central region CR; and a second peripheral region PR2 positioned adjacent to the other side opposite to the one side. The central region CR may be disposed between the first peripheral region PR1 and the second peripheral region PR2. The first peripheral region PR1 may be disposed to face the coating stage 300, and the second peripheral region PR2 may be disposed to face the roller 120.

[0072] The first substrate alignment part 210 may include a plurality of first central pins 212 disposed in the central region CR and a plurality of first peripheral pins 214 disposed in the first peripheral region PR1 of the loading stage 200. The first central pins 212 and the first peripheral pins 214 may be driven to move up and down and left and right to align the first substrate S1.

[0073] The second substrate alignment part 220 may include a plurality of second central pins 222 disposed in the central region CR and a plurality of second peripheral pins 224 disposed in the second peripheral region PR2 of the loading stage 200. The second central pins 222 and the second peripheral pins 224 may be driven to move up and down and left and right to align the second substrate S2.

[0074] The first substrate alignment part 210 and the second substrate alignment part 220 may align the first substrate S1 and the second substrate S2, respectively, and may align the first substrate S1 and the second substrate S2 simultaneously. Since the first substrate alignment part 210 and the second substrate alignment part 220 align the first substrate S1 and the second substrate S2 simultaneously, the time required to align the first substrate S1 and the second substrate S2 may be reduced.

[0075] The first central pin 212 and the second central pin 222 may be alternately arranged in the central region CR. The second central pin 222 may be arranged between the first central pins 212 in the central region CR. Alternatively, the first central pin 212 may be arranged between the second central pins 222 in the central region CR. Since the first central pin 212 and the second central pin 222 are alternately arranged in the central region CR, the distance between the first central pins 212 and the distance between the second central pins 222 may be increased to stably arrange the first substrate S1 and the second substrate S2.

[0076] The loading stage 200 may align the third substrate, which is larger than each of the first substrate S1 and the second substrate S2 . The loading stage 200 may align the third substrate by using the first peripheral pin 214 and the second peripheral pin 224 .

[0077] In an exemplary embodiment, the coating station 300 may sequentially receive the first substrate S1 and the second substrate S2 from the loading station 200. The coating station 300 may include a first discharge nozzle 310 and a second discharge nozzle 320 to discharge chemicals onto the substrate. For example, the chemicals may include photoresist.

[0078] For example, the coating station 300 may discharge the first chemical solution 314 onto the first substrate S1 through the first discharge nozzle 310. The coating station 300 may discharge the second chemical solution 324 onto the second substrate S2 through the second discharge nozzle 320. The first discharge nozzle 310 and the second discharge nozzle 320 may discharge the first chemical solution 314 and the second chemical solution 324 onto the first substrate S1 and the second substrate S2, respectively, in an inkjet printing manner. The first discharge nozzle 310 and the second discharge nozzle 320 may be arranged to be spaced apart from each other, and the first discharge nozzle 310 and the second discharge nozzle 320 may discharge the first chemical solution 314 and the second chemical solution 324, respectively, in μg units.

[0079] The first discharge nozzle 310 and the second discharge nozzle 320 may be driven to move between a standby position and a discharge position. The first discharge nozzle 310 and the second discharge nozzle 320 may apply the first chemical solution 314 and the second chemical solution 324 at the discharge position, respectively, and then return to the standby position. Alternatively, the first discharge nozzle 310 and the second discharge nozzle 320 may be fixedly positioned at the discharge position.

[0080] When one of the first discharge nozzle 310 and the second discharge nozzle 320 is driven to move, the other discharge nozzle may stop moving. In particular, when the first discharge nozzle 310 discharges the first chemical solution 314 onto the first substrate S1, the second discharge nozzle 320 may stop moving. When the second discharge nozzle 320 discharges the second chemical solution 324 onto the second substrate S2, the first discharge nozzle 310 may stop driving. Since the first discharge nozzle 310 and the second discharge nozzle 320 are not driven to move at the same time, a collision between the first discharge nozzle 310 and the second discharge nozzle 320 may be prevented.

[0081] The first discharge nozzle 310 may be disposed adjacent to the loading stage 200 , and the second discharge nozzle 320 may be disposed adjacent to the unloading stage 400 .

[0082] The coating station 300 may further include a plurality of piezoelectric elements. When the first substrate S1 or the second substrate S2 is located on the piezoelectric element, the first discharge nozzle 310 or the second discharge nozzle 320 may discharge chemicals. The discharge amount of the first chemical solution 314 discharged from the first discharge nozzle 310 and the discharge amount of the second chemical solution 324 discharged from the second discharge nozzle 320 may be independently controlled by controlling the voltage applied to the piezoelectric element.

[0083] The coating station 300 may further include a first priming roller 312 and a second priming roller 322 to allow the first discharge nozzle 310 and the second discharge nozzle 320 to uniformly apply the first chemical solution 314 and the second chemical solution 324. The first priming roller 312 and the second priming roller 322 may be arranged so that the first discharge nozzle 310 and the second discharge nozzle 320 respectively uniformly discharge the first chemical solution 314 and the second chemical solution 324. When the first discharge nozzle 310 and the second discharge nozzle 320 are in a standby state in which the first chemical solution 314 and the second chemical solution 324 are not applied, the first discharge nozzle 310 and the second discharge nozzle 320 may be moved to the first priming roller 312 and the second priming roller 322, respectively.

[0084] For example, before the first chemical solution 314 and the second chemical solution 324 are discharged from the first discharge nozzle 310 and the second discharge nozzle 320, the first discharge nozzle 310 and the second discharge nozzle 320 can pre-discharge the first chemical solution 314 and the second chemical solution 324 onto the first start roller 312 and the second start roller 322, so that beads of the first chemical solution 314 and the second chemical solution 324 are formed on the discharge end portions of the first discharge nozzle 310 and the second discharge nozzle 320 with uniform concentration and flow rate.

[0085] The first start roller 312 can be arranged adjacent to the first discharge nozzle 310, and the second start roller 322 can be arranged adjacent to the second discharge nozzle 320. The first start roller 312 and the second start roller 322 can be arranged at the standby position respectively. The first discharge nozzle 310 and the second discharge nozzle 320 can reciprocate between the first start roller 312, the second start roller 322 and the discharge position.

[0086] In an exemplary embodiment, the unloading stage 400 may sequentially unload the first and second substrates S1 and S2 respectively applied with the first and second chemical solutions 314 and 324. For example, the unloading stage 400 may sequentially unload the first and second substrates S1 and S2 to the transfer chamber 70 of the substrate processing system 10.

[0087] As described above, the loading stage 200 can align the first substrate S1 and the second substrate S2 simultaneously through the first substrate alignment part 210 and the second substrate alignment part 220. The first substrate S1 and the second substrate S2 may be a plurality of half panels cut from a single display substrate. Since the loading stage 200 can sequentially provide a plurality of half panels to the coating stage 300, the substrate processing apparatus 100 can continuously perform a coating process on a plurality of half panels, and the time required to align the plurality of half panels can be reduced.

[0088] In addition, the coating station 300 may have a first discharge nozzle 310 and a second discharge nozzle 320 for discharging a first chemical solution 314 and a second chemical solution 324 onto the first substrate S1 and the second substrate S2, respectively. The first substrate S1 and the second substrate S2 may be sequentially provided from the loading station 200 to the coating station 300, and a coating process may be sequentially performed on the first substrate S1 and the second substrate S2 through the first discharge nozzle 310 and the second discharge nozzle 320, respectively.

[0089] Since the loading stage 200 simultaneously receives the first substrate S1 and the second substrate S2 and the coating stage 300 sequentially performs a coating process on the first substrate S1 and the second substrate S2 , the substrate processing apparatus 100 can reduce a process time (takt time).

[0090] In the following, the use of Figure 2 A substrate processing method for a substrate processing device.

[0091] Figures 5 to 7 is a view showing a step of arranging a first substrate and a second substrate.

[0092] refer to Figures 5 to 7 In the substrate processing method, a first substrate S1 and a second substrate S2 may be aligned on a loading stage 200 .

[0093] In an exemplary embodiment, the substrate processing method may be a coating process of applying a chemical solution to a substrate such as a liquid crystal display element, an organic light emitting display element, etc. For example, the first substrate S1 and the second substrate S2 may be two separate plates each having 1 / 2 the size of the original plate by dividing the original plate into two.

[0094] like Figure 5 and Figure 6 As shown, a first substrate S1 may be placed on the loading stage 200. The first substrate S1 may be slidably moved on the plurality of rollers 120 to be loaded on the loading stage 200. When both sides of the first substrate S1 are supported by the clampers 130, the first substrate S1 may move in a floating state.

[0095] The first peripheral pins 214 may be raised to align the first substrate S1. The first peripheral pins 214 may stop the first substrate S1 moved by the clamper 130. One side of the first substrate S1 may be aligned by the first peripheral pins 214.

[0096] The first central pin 212 may be raised to align the first substrate S1. The other side of the first substrate S1 opposite to the one side may be aligned by the first central pin 212. The first central pin 212 and the first peripheral pins 214 may support the other side and one side of the first substrate S1, respectively, and may be driven to move up and down and left and right to align the first substrate S1 to a predetermined position.

[0097] like Figure 6 and Figure 7 As shown, the second substrate S2 may be placed on the loading stage 200. The second substrate S2 may be slidingly moved on the plurality of rollers 120 to be loaded on the loading stage 200. When both sides of the second substrate S2 are supported by the clampers 130, the second substrate S2 may move in a floating state.

[0098] The second central pin 222 may be raised to align the second substrate S2. The second central pin 222 may stop the second substrate S2 moved by the clamper 130. One side of the second substrate S2 may be aligned by the second central pin 222.

[0099] The second peripheral pins 224 may be raised to align the second substrate S2. The other side of the second substrate S2 opposite to the one side may be aligned by the second peripheral pins 224. The second central pin 222 and the second peripheral pins 224 may support one side and the other side of the second substrate S2, respectively, and may be driven to move up and down and left and right, thereby aligning the second substrate S2 to a preset position.

[0100] The second central pin 222 and the second peripheral pin 224 may be driven independently of the first central pin 212 and the first peripheral pin 214. The second central pin 222 and the second peripheral pin 224 may be arranged to be spaced apart from the first central pin 212 and the first peripheral pin 214. Therefore, the first substrate S1 and the second substrate S2 may be aligned simultaneously on the loading stage 200. Since the first substrate S1 and the second substrate S2 are aligned simultaneously on the loading stage 200, the process time (takt time) for performing the coating process on the first substrate S1 and the second substrate S2 may be reduced.

[0101] Figures 8 to 10 is a view showing a step of applying a chemical solution on a first substrate and a second substrate.

[0102] refer to Figures 8 to 10 In the substrate processing method, the first substrate S1 and the second substrate S2 whose positions are aligned on the loading stage 200 may be moved to the coating stage 300. The coating process for the first substrate S1 and the second substrate S2 may be performed on the coating stage 300.

[0103] like Figure 8As shown, the first substrate S1 can be moved from the loading station 200 to the coating station 300. The first substrate S1 can be moved in a floating state by the clamper 130. The first central pin 212 and the first peripheral pin 214 can be lowered, and then the first substrate S1 can be moved. The first substrate S1 can be moved to the coating station 300 in an aligned state by the first central pin 212 and the first peripheral pin 214.

[0104] like Fig. 9 As shown, the first discharge nozzle 310 may discharge the first chemical solution 314 onto the first substrate S1 in an inkjet printing manner. The first discharge nozzle 310 may be driven to move between a first standby position and a first discharge position. When the first discharge nozzle 310 is located at the first standby position, the first activation roller 312 may hold the first discharge nozzle 310 so that the first discharge nozzle 310 may uniformly discharge the first chemical solution 314. For example, the first discharge nozzle 310 may discharge the first chemical solution 314 onto the first activation roller 312 in advance so that beads of the first chemical solution 314 are formed at a uniform concentration and flow rate on the discharge end portion of the first discharge nozzle 310.

[0105] When the first substrate S1 is introduced from the loading stage 200 onto the coating stage 300, the first discharge nozzle 310 may move from the first standby position to the first discharge position. The first discharge nozzle 310 may uniformly discharge the first chemical solution 314 onto the first substrate S1 at the first discharge position.

[0106] The first discharge nozzle 310 may be disposed adjacent to the loading stage 200, and may quickly discharge the first chemical solution 314 onto the first substrate S1 introduced from the loading stage 200. For example, the first chemical solution 314 may include a photoresist.

[0107] like Fig.10 As shown, the second substrate S2 can be moved from the loading station 200 to the coating station 300. The second substrate S2 can be moved in a floating state by the clamper 130. The second central pin 222 and the second peripheral pin 224 can be lowered, and then the second substrate S2 can be moved. The second substrate S2 can be moved to the coating station 300 in an aligned state by the second central pin 222 and the second peripheral pin 224.

[0108] The second discharge nozzle 320 may discharge the second chemical solution 324 onto the second substrate S2 in an inkjet printing manner. The second discharge nozzle 320 may be driven to move between a second standby position and a second discharge position.

[0109] When the second discharge nozzle 320 is located at the second standby position, the second activation roller 322 may hold the second discharge nozzle 320 so that the second discharge nozzle 320 may uniformly discharge the second chemical solution 324. For example, the second discharge nozzle 320 may discharge the second chemical solution 324 onto the second activation roller 322 in advance so that beads of the second chemical solution 324 are formed on the discharge end portion of the second discharge nozzle 320 with uniform concentration and flow rate.

[0110] When the second substrate S2 is introduced from the loading stage 200 to the coating stage 300, the second discharge nozzle 320 may move from the second standby position to the second discharge position. The second discharge nozzle 320 may uniformly discharge the second chemical solution 324 onto the second substrate S2 at the second discharge position.

[0111] The second discharge nozzle 320 may be disposed adjacent to the unloading stage 400. When the first discharge nozzle 310 discharges the first chemical solution 314 onto the first substrate S1, the second discharge nozzle 320 may standby to discharge the second chemical solution 324 onto the second substrate S2.

[0112] After the first substrate S1 moves to the unloading stage 400, the second discharge nozzle 320 may quickly discharge the second chemical solution 324 onto the second substrate S2 introduced from the loading stage 200 to the coating stage 300. For example, the second chemical solution 324 may include photoresist.

[0113] When one of the first discharge nozzle 310 and the second discharge nozzle 320 is driven, the other discharge nozzle may stop driving. In particular, when the first discharge nozzle 310 discharges the first chemical solution 314 onto the first substrate S1, the second discharge nozzle 320 may stop driving. When the second discharge nozzle 320 discharges the second chemical solution 324 onto the second substrate S2, the first discharge nozzle 310 may stop driving. Since the first discharge nozzle 310 and the second discharge nozzle 320 are not driven at the same time, a collision between the first discharge nozzle 310 and the second discharge nozzle 320 may be prevented.

[0114] Fig.11 and Fig.12 is a view showing the steps of placing a third substrate and discharging a solution onto the third substrate.

[0115] refer to Fig.11 and Fig.12 In the substrate processing method, a coating process for a third substrate S3 may be performed. For example, the third substrate S3 may be an original plate. The third substrate S3 may be larger than each of the first substrate S1 and the second substrate S2.

[0116] In an exemplary embodiment, in the substrate processing method, the third substrate S3 may be aligned on the loading stage 200, and may then be moved to the coating stage 300. A coating process for the third substrate S3 may be performed on the coating stage 300.

[0117] like Fig.11 As shown, the third substrate S3 may be placed on the loading stage 200. The third substrate S3 may be slidably moved on the plurality of rollers 120 to be loaded on the loading stage 200. When both sides of the third substrate S3 are supported by the clampers 130, the third substrate S3 may move in a floating state.

[0118] The first peripheral pin 214 and the second peripheral pin 224 may be raised to align the third substrate S3. The first peripheral pin 214 may stop the third substrate S3 moved by the clamper 130. One side of the third substrate S3 may be aligned by the first peripheral pin 214.

[0119] The second peripheral pins 224 may be raised to align the third substrate S3. The other side of the third substrate S3 opposite to the one side may be aligned by the second peripheral pins 224. The first peripheral pins 214 and the second peripheral pins 224 may support one side and the other side of the third substrate S3, respectively, and may be driven to move up and down and left and right to align the third substrate S3 to a predetermined position.

[0120] The first peripheral pin 214 and the second peripheral pin 224 may be driven independently of the first central pin 212 and the second central pin 222. Thus, the first peripheral pin 214, the first central pin 212, the second peripheral pin 224 and the second central pin 222 may align the substrate regardless of the size of the substrate.

[0121] like Fig.12 As shown, the third substrate S3 can be moved from the loading station 200 to the coating station 300. The third substrate S3 can be moved in a floating state by the clamper 130. The first peripheral pin 214 and the second peripheral pin 224 can be lowered to move the third substrate S3. The third substrate S3 can be moved to the coating station 300 in an aligned state by the first peripheral pin 214 and the second peripheral pin 224.

[0122] The first and second discharge nozzles 310 and 320 may respectively discharge the first and second chemical solutions 314 and 324 onto the third substrate S3 in an inkjet printing manner. The first and second discharge nozzles 310 and 320 may selectively discharge the first and second chemical solutions 314 and 324 onto the third substrate S3.

[0123] When the third substrate S3 is introduced from the loading station 200 onto the coating station 300, the first discharge nozzle 310 and the second discharge nozzle 320 may move to discharge the first chemical solution 314 and the second chemical solution 324. For example, the first chemical solution 314 and the second chemical solution 324 may contain the same liquid, or alternatively, the first chemical solution 314 and the second chemical solution 324 may contain different liquids. When the first chemical solution 314 is discharged onto the third substrate S3 using the first discharge nozzle 310, the second discharge nozzle 320 may be in a standby state above the second start roller 322, and when the second chemical solution 324 is discharged onto the third substrate S3 using the second discharge nozzle 320, the first discharge nozzle 310 may be in a standby state above the first start roller 312.

[0124] Fig.13 1 is a plan view showing a substrate processing apparatus including a transfer apparatus having a robot arm according to an exemplary embodiment. The substrate processing apparatus may be used in conjunction with a reference Figure 1-Figure 4 The described substrate processing apparatus is substantially the same except for the configuration of the transfer apparatus. Therefore, the same reference numerals may be used to denote the same or similar elements, and any further repeated explanation regarding the above elements will be omitted.

[0125] refer to Fig.13 The substrate processing apparatus may include a loading station 202 for receiving a substrate for performing a coating process, a coating station for applying chemicals on the substrate, an unloading station for unloading the substrate to the outside, and a conveying device 110 for transporting the substrate.

[0126] In an exemplary embodiment, the transfer device 110 can transfer the Figure 1 ) is transferred to the loading stage 202. The transfer device 110 may sequentially transfer the first substrate S1 and the second substrate S2 to the loading stage 202.

[0127] The conveyor 110 may include a robot arm 140 for transporting the first substrate S1 and the second substrate S2. The robot arm 140 may support the lower surfaces of the first substrate S1 and the second substrate S2. The robot arm 140 may load the first substrate S1 and the second substrate S2 onto the loading stage 202 from one side of the loading stage 202. The lower surfaces of the first substrate S1 and the second substrate S2 may be spaced apart from the loading stage 202 by the robot arm 140. For example, the robot arm 140 may include a plurality of rods. The robot arm 140 may stably support the first substrate S1 and the second substrate S2 by the plurality of rods.

[0128] In an exemplary embodiment, the loading stage 202 may include a plurality of supporting pins 230 for respectively receiving the first substrate S1 and the second substrate S2 from the robot arm 140. The plurality of supporting pins 230 may be disposed between a plurality of supporting rods of the robot arm 140. The plurality of supporting pins 230 may be raised to support lower surfaces of the first substrate S1 and the second substrate S2.

[0129] In the following, the use of Fig.13 A substrate processing method for a substrate processing device.

[0130] Figures 14 to 17 It is shown by Fig.13 FIG. 4 is a view of the step in which the robot arm places the first substrate and the second substrate.

[0131] refer to Figures 14 to 17 In the substrate processing method, the first substrate S1 and the second substrate S2 may be loaded onto the loading stage 202 by the robot arm 140 , and the first substrate S1 and the second substrate S2 may be aligned on the loading stage 202 .

[0132] like Fig.14 As shown, first, the first substrate S1 and the second substrate S2 may be supported by the robot arm 140 through a plurality of rods, and may be loaded from one side of the loading stage 202 .

[0133] like Fig.15 As shown, the plurality of support pins 230 may then be raised to support the lower surfaces of the first substrate S1 and the second substrate S2, respectively. The plurality of support pins 230 may be raised in a vertical direction between the plurality of support rods of the robot arm 140 to support the first substrate S1 and the second substrate S2.

[0134] like Fig.16 As shown, the first peripheral pin 214, the first central pin 212, the second peripheral pin 224, and the second central pin 222 can be raised to align the first substrate S1 and the second substrate S2. The first peripheral pin 214 and the first central pin 212 can pressurize the two end portions of the first substrate S1, respectively, to align the first substrate S1. The second peripheral pin 224 and the second central pin 222 can pressurize the two end portions of the second substrate S2, respectively, to align the second substrate S2.

[0135] like Fig.17 As shown, after aligning the first substrate S1 and the second substrate S2, the first peripheral pin 214, the first central pin 212, the second peripheral pin 224, and the second central pin 222 may be lowered. When the robot arm 140 is used, the first substrate S1 and the second substrate S2 may be aligned simultaneously by the first peripheral pin 214, the first central pin 212, the second peripheral pin 224, and the second central pin 222. Therefore, when the robot arm 140 is used, the process time (takt time) may be reduced.

[0136] Although exemplary embodiments of the present disclosure have been described above, it will be appreciated by those skilled in the art that various modifications and changes may be made to the present disclosure without departing from the spirit and scope of the present disclosure as set forth in the appended claims.

Claims

1. A substrate processing device, comprising: a loading stage configured to receive a first substrate and a second substrate, the loading stage comprising a first substrate alignment portion for aligning the first substrate and a second substrate alignment portion for aligning the second substrate, the second substrate alignment portion being arranged to be spaced apart from the first substrate alignment portion; a coating station configured to sequentially receive the first substrate and the second substrate from the loading station, the coating station comprising a first discharge nozzle for discharging a first chemical solution onto the first substrate and a second discharge nozzle for discharging a second chemical solution onto the second substrate; as well as An unloading station is configured to sequentially unload the first substrate and the second substrate from the coating station.

2. The substrate processing apparatus according to claim 1, further comprising: A transfer device is configured to sequentially transfer the first substrate and the second substrate to the loading stage.

3. The substrate processing apparatus according to claim 2, wherein: The transfer device further includes a plurality of rollers aligned on one side of the load stage and rotated to move the first substrate and the second substrate.

4. The substrate processing apparatus according to claim 2, wherein: The conveying device further includes a robot arm for conveying the first substrate and the second substrate, and Wherein, the loading station further includes a plurality of supporting pins for receiving the first substrate and the second substrate from the robot arm respectively.

5. The substrate processing apparatus according to claim 1, wherein: The first substrate alignment portion comprises: a plurality of first central pins disposed in a central region of the loading station; and a plurality of first peripheral pins disposed in a first peripheral region adjacent to one side of the central region, and Wherein, the second substrate alignment part comprises: a plurality of second center pins disposed in the central region of the loading station; and A plurality of second peripheral pins are disposed in a second peripheral region adjacent to the other side opposite to the one side of the central region.

6. The substrate processing apparatus according to claim 5, wherein: The first center pins and the second center pins are arranged alternately with each other.

7. The substrate processing apparatus according to claim 5, wherein: The loading stage aligns a third substrate larger than each of the first substrate and the second substrate through the first peripheral pins and the second peripheral pins.

8. The substrate processing apparatus according to claim 5, wherein: The first and second central pins and the first and second peripheral pins are driven to move up and down and left and right to align each of the first and second substrates.

9. The substrate processing apparatus according to claim 1, wherein: When one of the first discharge nozzle and the second discharge nozzle is driven, the driving of the other discharge nozzle is stopped.

10. The substrate processing apparatus according to claim 1, wherein: The first discharge nozzle is disposed adjacent to the loading station, and the second discharge nozzle is disposed adjacent to the unloading station.

11. A substrate processing device, comprising: a conveying device configured to convey the first half plate and the second half plate to perform a coating process; a loading station configured to receive the first half-plate and the second half-plate from the conveying device, the loading station comprising a first substrate alignment portion for aligning the first half-plate and a second substrate alignment portion for aligning the second half-plate, the second substrate alignment portion being arranged to be spaced apart from the first substrate alignment portion; a coating station configured to sequentially receive the first half plate and the second half plate from the loading station, the coating station comprising a first discharge nozzle for discharging a first chemical solution onto the first half plate and a second discharge nozzle for discharging a second chemical solution onto the second half plate; and An unloading station is configured to sequentially unload the first half panel and the second half panel from the loading station.

12. The substrate processing apparatus according to claim 11, wherein: The transfer device further includes a plurality of rollers aligned on one side of the loading station and rotated to move the first half-plate and the second half-plate.

13. The substrate processing apparatus according to claim 11, wherein: The conveying device further comprises a robot arm for conveying the first half panel and the second half panel, and Wherein, the loading station further includes a plurality of supporting pins for receiving the first half-plate and the second half-plate from the robot arm respectively.

14. The substrate processing apparatus according to claim 11, wherein: The first substrate alignment portion comprises: a plurality of first central pins disposed in a central region of the loading station; and a plurality of first peripheral pins disposed in a first peripheral region adjacent to one side of the central region, and Wherein, the second substrate alignment part comprises: a plurality of second center pins disposed in the central region of the loading station; and A plurality of second peripheral pins are disposed in a second peripheral region adjacent to the other side opposite to the one side of the central region.

15. The substrate processing apparatus according to claim 14, wherein: The first center pins and the second center pins are arranged alternately.

16. The substrate processing apparatus according to claim 14, wherein: The loading stage aligns a substrate larger than each of the first half plate and the second half plate through the first peripheral pin and the second peripheral pin.

17. The substrate processing apparatus according to claim 14, wherein: The first and second central pins and the first and second peripheral pins are driven to move up and down and left and right to align each of the first and second half plates.

18. The substrate processing apparatus according to claim 11, wherein: When one of the first discharge nozzle and the second discharge nozzle is driven, the driving of the other discharge nozzle is stopped.

19. The substrate processing apparatus according to claim 11, wherein: The first discharge nozzle is disposed adjacent to the loading station, and the second discharge nozzle is disposed adjacent to the unloading station.

20. A substrate processing device, comprising: a conveying device configured to convey the first half plate and the second half plate to perform a coating process; a loading stage configured to receive the first half plate and the second half plate from the conveying device, the loading stage having a central area and first and second peripheral areas on both sides of the central area, the loading stage including a first substrate alignment portion and a second substrate alignment portion, wherein the first substrate alignment portion aligns the first half plate by a plurality of first central pins disposed in the central area and a plurality of first peripheral pins disposed in the first peripheral area, wherein the second substrate alignment portion aligns the second half plate by a plurality of second central pins disposed in the central area and a plurality of second peripheral pins disposed in the second peripheral area, the second central pins being arranged alternately with the first central pins; a coating station configured to sequentially receive the first half plate and the second half plate from the loading station, the coating station having a first discharge nozzle for discharging a first chemical solution onto the first half plate and a second discharge nozzle for discharging a second chemical solution onto the second half plate, the coating station configured to selectively drive one of the first discharge nozzle and the second discharge nozzle; and An unloading station is configured to sequentially unload the first half panel and the second half panel from the coating station to the outside.

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