Power conversion device and inter-component connection structure

Abstract

The invention provides a power conversion device and an inter-component connection structure. A power conversion device is provided with a first component, a second component, and a plurality of pairs of fitting members each including a male fitting member and a female fitting member. The male fitting member has a substantially flat-plate-shaped insertion portion. The female fitting member has a first clamping portion and a second clamping portion disposed facing each other. In each of the plurality of pairs of fitting members, the male fitting member is disposed in one of the first component and the second component, and the female fitting member is disposed in the other of the first component and the second component. In each of the plurality of pairs of fitting members, the first component and the second component are joined by the female fitting member sandwiching an insertion portion inserted between the first sandwiching portion and the second sandwiching portion. The first clamping part and the second clamping part are respectively bent towards the opposite surfaces of the first clamping part and the second clamping part in a manner of forming a convex part. A gap is provided at the tip of each of the first clamping portion and the second clamping portion.

Description

[0001] This application is a divisional application of an application filed on August 25, 2021, with application number 202110981046.6, and invention name “Power conversion device and connection structure between components”. Technical Field

[0002] The present disclosure relates to a power conversion device and a component connection structure. Background Art

[0003] Conventionally, a power conversion device mounted on an electric vehicle or the like is provided with a plurality of circuit boards on which circuit structures such as DC / DC converters and inverters are mounted. For example, such a power conversion device is required to be miniaturized from the viewpoint of the mountability on the vehicle.

[0004] Among them, the following technology is known: by stacking a plurality of circuit substrates, the mounting area on the plurality of circuit substrates is maintained, and the power conversion device is miniaturized at the same time. In such a power conversion device, there is a case where electrical connection between components is performed by fitting a fitting portion such as a connector provided to each circuit substrate or other component.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2000-14128 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] However, if the mounting accuracy of the fitting portion with respect to each component is reduced, the fitting portion may not be properly fitted in the assembly process of the power conversion device, and electrical connection between the components may be defective.

[0010] The present disclosure provides a power conversion device and a component connection structure capable of expanding a geometrically permissible range of a fitting portion for electrically connecting components.

[0011] Solutions for solving problems

[0012] The power conversion device disclosed in the present invention comprises a first component, a second component and a plurality of pairs of interlocking members. The plurality of pairs of interlocking members respectively include a male interlocking member and a female interlocking member. The male interlocking member has an insertion portion in a substantially flat plate shape. The female interlocking member has a first clamping portion and a second clamping portion arranged opposite to each other. In each pair of interlocking members of the plurality of pairs of interlocking members, the male interlocking member is arranged in one of the first component and the second component, and the female interlocking member is arranged in the other of the first component and the second component. In each pair of interlocking members of the plurality of pairs of interlocking members, the female interlocking member clamps the insertion portion of the male interlocking member inserted between the first clamping portion and the second clamping portion, so that the first component is combined with the second component. The first clamping portion and the second clamping portion are bent toward the opposite surfaces of each other in a manner of forming a convex portion. A gap is provided at the top end of each of the first clamping portion and the second clamping portion.

[0013] Effects of the Invention

[0014] According to the power conversion device and the component connection structure of the present disclosure, it is possible to expand the geometrical tolerance range of the fitting portion for electrically connecting the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic cross-sectional view showing an example of a layered structure of a plurality of circuit boards in the power conversion device according to the first embodiment.

[0016] Figure 2 Yes means Figure 1 A schematic three-dimensional diagram of an example of the structure of a male fitting member.

[0017] Figure 3 Yes means Figure 1 A schematic three-dimensional view of another example of the structure of the male fitting member.

[0018] Figure 4 Yes means Figure 1 A schematic three-dimensional view of another example of the structure of the male fitting member.

[0019] Figure 5 Yes means Figure 1 A schematic perspective view of an example of the structure of a female fitting member.

[0020] Figure 6 Yes means Figure 1 A schematic perspective view of another example of the structure of the female fitting member.

[0021] Figure 7 Yes means Figure 5A schematic three-dimensional view of a state in which a female fitting component is mounted on a circuit board.

[0022] Figure 8 Yes means Figure 2 or Figure 3 The male chimeric component and Figure 5 A schematic cross-sectional view of an example of a mating state between female-type mating components.

[0023] Fig. 9 Yes means Figure 4 The male chimeric component and Figure 6 A schematic cross-sectional view of an example of a mating state between female-type mating components.

[0024] Fig.10 It is a diagram for explaining the mounting of the male fitting member of the first embodiment to the circuit board.

[0025] Fig.11 It is a diagram for explaining the expansion of the geometrically permissible range of the fitting between the male fitting member and the female fitting member according to the first embodiment.

[0026] Fig.12 It is a schematic perspective view showing another example of the insulating portion according to the first embodiment.

[0027] Fig.13 It is used to explain the installation and fixing Fig.12 FIG. 1 is a diagram showing an expansion of a geometrically permissible range of engagement between a male engaging member and a female engaging member in the case of a covering member.

[0028] Fig.14 This is a flowchart showing an example of the flow of connection between substrates in the first embodiment.

[0029] Fig.15 It is a schematic cross-sectional view showing an example of a connection structure between components in the power conversion device according to the second embodiment.

[0030] Fig.16 It is a schematic cross-sectional view showing an example of a connection structure between components in a power conversion device according to a third embodiment.

[0031] Fig.17 It is a schematic cross-sectional view showing an example of a connection structure between components in a power conversion device according to a fourth embodiment.

[0032] Fig.18 It is a schematic cross-sectional view showing an example of a connection structure between components in a power conversion device according to a fifth embodiment.

[0033] Fig.19This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the fifth embodiment.

[0034] Fig. 20 This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the fifth embodiment.

[0035] Fig.21 This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the fifth embodiment.

[0036] Fig. 22 This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the fifth embodiment.

[0037] Fig.23 This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the fifth embodiment.

[0038] Fig.24 It is a schematic cross-sectional view showing an example of a connection structure between components in a power conversion device according to a sixth embodiment.

[0039] Fig.25 It is a schematic perspective view showing an example of the structure of a male fitting member according to the seventh embodiment.

[0040] Fig.26 It is a schematic cross-sectional view showing an example of a connection structure between components in a power conversion device according to the seventh embodiment.

[0041] Fig. 27 This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the seventh embodiment.

[0042] Fig.28 This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the seventh embodiment.

[0043] Fig.29 This is a schematic perspective view showing an example of an electronic component to which a male fitting member is mounted according to a seventh embodiment.

[0044] Fig.30 This is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device according to the seventh embodiment.

[0045] Fig.31 It is a diagram for explaining the expansion of the geometrically permissible range of the fitting between the male fitting member and the female fitting member according to the eighth embodiment.

[0046] Fig.32 It is a schematic cross-sectional view showing an example of the structure of the power conversion device according to the embodiment. DETAILED DESCRIPTION

[0047] Hereinafter, embodiments of a power conversion device, a component connection structure, and a component connection method according to the present disclosure will be described with reference to the drawings.

[0048] (First embodiment)

[0049] As an example, the power conversion device of the embodiment is a vehicle charger that is mounted on an electric vehicle, etc., converts AC power supplied from a power source (external power source) into DC power of a predetermined voltage, and outputs the converted DC power to a battery such as a lithium-ion battery. Such a power conversion device is equipped with a plurality of circuit substrates on which circuit structures such as DC / DC converters and inverters are installed.

[0050] Figure 1 It is a schematic cross-sectional view showing an example of a layered structure of a plurality of circuit boards in the power conversion device 1 according to the embodiment. Figure 1 Among the plurality of circuit boards included in the power conversion device 1 , a first substrate PCB1 , a second substrate PCB2 , a third substrate PCB3 , and a fourth substrate PCB4 are exemplified.

[0051] The first substrate PCB1, the second substrate PCB2, the third substrate PCB3 and the fourth substrate PCB4 are printed circuit boards (PCB: Printed Circuit Board). As an example, the printed circuit board is a glass epoxy substrate formed with an aluminum alloy or a copper alloy as a base material. By making a part of the aluminum alloy or copper alloy of the printed circuit board contact with a water-cooled bracket in a heat exchangeable manner, the temperature rise of the electronic components mounted on the printed circuit board can be suppressed. In addition, by using a printed circuit board with a metal as a base material, the cooling efficiency can be improved compared with the case of using a printed circuit board with a resin as a base material.

[0052] The first substrate PCB1 is combined with the second substrate PCB2 using a plurality of pairs of interlocking components B. In addition, in the following description, there is also a case where a plurality of pairs of interlocking components B are recorded as a plurality of pairs of interlocking components B. In addition, there is also a case where a pair of interlocking components B is described as an interlocking portion. The first substrate PCB1 is electrically connected to the second substrate PCB2, and outputs power corresponding to the power supplied from the second substrate PCB2 to a battery or the like. The first substrate PCB1 is electrically connected to the fourth substrate PCB4, forming a substrate unit X. The main surface of the first substrate PCB1 on the side of the second substrate PCB2 is equipped with a plurality of male interlocking components Bm. As an example, the first substrate PCB1 is equipped with 24 male interlocking components Bm.

[0053] In addition, the first substrate PCB1 is also connected to the transformer unit (not shown) by a pair of interlocking components B. As an example, the first substrate PCB1 is equipped with 12 male interlocking components Bm or female interlocking components Bf for electrical connection with the transformer unit. In addition, the first substrate PCB1 and the fourth substrate PCB4 of the substrate unit X can also be connected by multiple pairs of interlocking components B of the embodiment. In other words, the substrate connection structure of the embodiment can be applied to the connection between substrates in the substrate unit such as the substrate unit X, the connection between substrate units, and the connection between the substrate unit and the substrate outside the substrate unit.

[0054] The second substrate PCB2 is respectively connected to the first substrate PCB1 and the third substrate PCB3 by using a plurality of pairs of interlocking components B. The second substrate PCB2 is respectively electrically connected to the first substrate PCB1 and the third substrate PCB3, and outputs power corresponding to the power supplied from the third substrate PCB3 to the first substrate PCB1. The main surface of the second substrate PCB2 on the side of the first substrate PCB1 and the main surface of the second substrate PCB2 on the side of the third substrate PCB3 are respectively equipped with a plurality of female interlocking components Bf.

[0055] The third substrate PCB3 is combined with the second substrate PCB2 by using a plurality of pairs of interlocking components B. The third substrate PCB3 is electrically connected to an external power source, for example, and inputs power from the external power source. The main surface of the third substrate PCB3 on the side of the second substrate PCB2 is equipped with a plurality of male interlocking components Bm. As an example, the third substrate PCB3 is equipped with six male interlocking components Bm.

[0056] In addition, some of the multiple circuit substrates of the power conversion device 1 can be set as printed circuit substrates. For example, at least one of the first substrate PCB1, the second substrate PCB2, and the third substrate PCB3 can be set as a printed circuit substrate. In addition, the connection between the circuit substrates by a pair of interlocking components B may not necessarily be an electrical connection. However, the embodiment mainly illustrates the case where two circuit substrates are electrically connected using multiple pairs of interlocking components B.

[0057] In addition, the embodiment exemplifies the following case: a plurality of male-type interlocking components Bm are arranged on the first substrate PCB1 and the third substrate PCB3, and a plurality of female-type interlocking components Bf are arranged on both main surfaces of the second substrate PCB2, but the present invention is not limited thereto. For example, a plurality of female-type interlocking components Bf may be arranged on the first substrate PCB1 and the third substrate PCB3, and a plurality of male-type interlocking components Bm may be arranged on both main surfaces of the second substrate PCB2.

[0058] In addition, for example, the structure can also be set as follows: a plurality of male fitting members Bm are arranged on one main surface of the second substrate PCB2, and a plurality of female fitting members Bf are arranged on the other main surface of the second substrate PCB2. That is, when a layered structure of three or more layers is formed on the plurality of circuit boards of the power conversion device 1, among the boards forming the intermediate layer, either the male fitting member Bm or the female fitting member Bf is arranged on both main surfaces.

[0059] In addition, for example, in the first substrate PCB1, the second substrate PCB2, and the third substrate PCB3 respectively, the structure can also be set such that a plurality of male fitting members Bm and a plurality of female fitting members Bf are arranged on one main surface.

[0060] Thus, in the power conversion device 1 of the embodiment, two of the at least two stacked circuit boards are joined by a plurality of pairs of fitting members B. The plurality of pairs of fitting members B respectively include a male fitting member Bm and a female fitting member Bf. That is, the plurality of pairs of fitting members B are multiple sets of a pair of fitting members B. In addition, each of the plurality of pairs of fitting members B, that is, a pair of fitting members B, is a set of a male fitting member Bm and a female fitting member Bf. Here, one of the plurality of pairs of fitting members B is arranged on the mutually opposing main surfaces of the two stacked circuit boards respectively. Specifically, as described above, among the plurality of pairs of fitting members B, the male fitting member Bm is arranged on one of the two stacked circuit boards, and the female fitting member Bf is arranged on the other of the two stacked circuit boards. In addition, as described above, as an example, only either the male fitting member Bm or the female fitting member Bf is arranged on the two circuit boards joined by the fitting of the plurality of pairs of fitting members B. As another example, at least one male fitting member Bm and at least one female fitting member Bf are arranged on the two circuit boards joined by the fitting of the plurality of pairs of fitting members B. The male fitting member Bm is a blade-shaped connector (plug) on the insertion side. The male fitting member Bm can also be described as a flat bolt blade (in Japanese: 平栓刃). The female fitting member Bf is a connector (receptacle) on the side to be inserted. The female fitting member Bf can also be described as a blade receiving spring.

[0061] Figure 2 is a schematic perspective view showing Figure 1 an example of the structure of the male fitting member Bm. Figure 2 The male fitting member Bm1 of

[0062] The insertion portion 11 of the male interlocking component Bm1 has a roughly flat plate shape. The top end portion 13 of the insertion portion 11 is chamfered, and the thickness decreases toward the top end side. As a result, the insertion portion 11 can be easily inserted into the receiving portion 20 of the female interlocking component Bf. The connecting portion 15 of the insertion portion 11 is each part divided into two by the gap 17 on the rear end side of the insertion portion 11. The connecting portion 15, that is, each connecting portion on the rear end side of the divided insertion portion 11, is bent in a direction roughly perpendicular to the insertion portion 11. The connecting portion 15 is welded and joined to a predetermined position on the PCB substrate to electrically connect the insertion portion 11 to the wiring on the PCB substrate. The insertion portion 11 and the connecting portion 15 can be formed by, for example, bending a sheet of metal.

[0063] Figure 3 Yes means Figure 1 A schematic perspective view of another example of the structure of the male fitting member Bm. Figure 3 The male fitting member Bm2 of FIG. 1 is an example of the male fitting member Bm of the embodiment. Here, mainly the difference from the male fitting member Bm1 will be described.

[0064] The length from the tip 13 of the insertion portion 11 to the connection portion 15 of the male fitting member Bm2 is greater than that of the male fitting member Bm1. On the other hand, the width and thickness of the insertion portion 11 of the male fitting member Bm2 are about the same as those of the male fitting member Bm1. The connection portion 15 of the insertion portion 11 is a portion on the rear end side of the insertion portion 11 divided into three by the gap 17.

[0065] The number of divisions of the rear end side of the insertion portion 11 of the male fitting members Bm1 and Bm2 can be arbitrarily designed to be more than two. As an example, the longer the length of the insertion portion 11 is, the larger the number of divisions is.

[0066] Figure 4 Yes means Figure 1 A schematic perspective view of another example of the structure of the male fitting member Bm. Figure 4 The male fitting member Bm3 of FIG. 1 is an example of the male fitting member Bm of the embodiment. Here, mainly the differences from the male fitting members Bm1 and Bm2 will be described.

[0067] The connection portion 15 of the insertion portion 11 is located on the rear end side of the insertion portion 11, similarly to the male interlocking components Bm1 and Bm2 described above. On the other hand, the rear end side of the insertion portion 11 is not divided, unlike the male interlocking components Bm1 and Bm2. In addition, a support member 19 for supporting the insertion portion 11 is provided at a position closer to the top end side than the connection portion 15 of the insertion portion 11. The support member 19 is formed, for example, of PPA (polyphthalamide resin), or may be formed of a non-conductive material, such as PA (polyamide) or the like. The support member 19 has an insertion portion 19a. The insertion portion 19a is inserted into a hole that has been set at a predetermined position on the PCB substrate. Thus, the position on the PCB substrate where the male interlocking component Bm3 is to be installed can be specified, thereby improving the installation accuracy of the male interlocking component Bm3. In addition, Figure 4 Although the support member 19 having two insertion portions 19 a is exemplified, the present invention is not limited thereto and the support member 19 may have a plurality of insertion portions 19 a of three or more.

[0068] Figure 5 Yes means Figure 1 A schematic perspective view of an example of the structure of the female fitting member Bf. Figure 5 The female fitting member Bf1 is an example of the female fitting member Bf of the embodiment. The female fitting member Bf1 clamps the insertion portion 11 of the male fitting member Bm inserted into the receiving portion 20. The female fitting member Bf1 is formed by, for example, bending a metal plate. The female fitting member Bf1 has a substantially Y-shaped shape with the top end side open when viewed from the side, that is, the first base 26a or the second base 26b.

[0069] Specifically, the female fitting member Bf has a first clamping portion 21 and a second clamping portion 22. The first clamping portion 21 and the second clamping portion 22 are arranged opposite to each other. The surface of the first clamping portion 21 opposite to the second clamping portion 22 and the surface of the second clamping portion 22 opposite to the first clamping portion 21 form a receiving portion 20. In other words, the first clamping portion 21 and the second clamping portion 22 are opposite to each other across the receiving portion 20. The female fitting member Bf clamps the insertion portion 11 of the receiving portion 20 of the male fitting member Bm inserted between the first clamping portion 21 and the second clamping portion 22. The first clamping portion 21 is bent at the first bent portion 23a into a shape that protrudes toward the opposite second clamping portion 22. Similarly, the second clamping portion 22 is bent at the first bent portion 23a into a shape that protrudes toward the opposite first clamping portion 21. In other words, the first clamping portion 21 and the second clamping portion 22 are bent at the first bent portion 23a toward the opposing surfaces of each other to form a convex portion. The first bent portion 23a of the first clamping portion 21 and the first bent portion 23a of the second clamping portion 22 are separated by the receiving portion 20. The distance between the first bent portion 23a of the first clamping portion 21 and the first bent portion 23a of the second clamping portion 22 is smaller than the thickness of the insertion portion 11 of the male fitting member Bm.

[0070] A gap 27 is provided from the top end side to the rear end side in the first clamping portion 21 and the second clamping portion 22, respectively. That is, the first clamping portion 21 and the second clamping portion 22 are respectively divided into two by the gap 27. In other words, the top end portion of the female fitting member Bf1 is divided into four by the gap 27. Specifically, the first clamping portion 21 includes a first elastic portion 21a and a second elastic portion 21b divided by the gap 27. Similarly, the second clamping portion 22 includes a third elastic portion 22a and a fourth elastic portion 22b divided by the gap 27. Here, it can also be expressed as the first elastic portion 21a and the second elastic portion 21b are separated by the gap 27. Similarly, it can also be expressed as the third elastic portion 22a and the fourth elastic portion 22b are separated by the gap 27.

[0071] also, Figure 5 The female interlocking member Bf is exemplified as being divided into four by the gap 27, but is not limited thereto. The number of divisions performed by the gap 27 may be 5 or more. However, it is preferred that the number of divisions of the first clamping portion 21 is equal to the number of divisions of the second clamping portion 22, and the number of divisions performed by the gap 27 is, for example, an even number of 6 or more. There is a possibility that the relative rotational misalignment between the pair of interlocking members B discussed later occurs in either direction. Therefore, by making the number of divisions of the first clamping portion 21 equal to the number of divisions of the second clamping portion 22, the geometrically permissible range of the interlocking portion can be expanded regardless of the direction of the rotational misalignment.

[0072] The first elastic portion 21a and the third elastic portion 22a are respectively extended from the first base 26a. In other words, the first elastic portion 21a and the third elastic portion 22a are respectively connected to the first base 26a continuously and integrally by means of the second curved portion 23b. In addition, the second elastic portion 21b and the fourth elastic portion 22b are respectively extended from the second base 26b. In other words, the second elastic portion 21b and the fourth elastic portion 22b are respectively connected to the second base 26b continuously and integrally by means of the second curved portion 23b. In addition, the first base 26a and the second base 26b are respectively extended from the connecting portion 25 connected to the printed circuit board. In other words, the first base 26a and the second base 26b are respectively connected to the connecting portion 25 continuously and integrally by means of the third curved portion 23c.

[0073] Therefore, the first elastic portion 21a, the second elastic portion 21b, the third elastic portion 22a, and the fourth elastic portion 22b correspond to shapes obtained by dividing the first clamping portion 21 or the second clamping portion 22, and can be deformed independently according to the contact state with the insertion portion 11.

[0074] Figure 6 Yes means Figure 1 A schematic perspective view of another example of the structure of the female fitting member Bf. Figure 6 The female fitting member Bf2 is an example of the female fitting member Bf of the embodiment. Here, mainly the difference from the female fitting member Bf1 will be described. The female fitting member Bf2 has a substantially M-shaped shape when viewed from the side.

[0075] A gap 27 is provided at the top end of each of the first clamping portion 21 and the second clamping portion 22. The gap 27 is different from the female fitting member Bf1 and is provided only at the top end. However, the top end of each of the first clamping portion 21 and the second clamping portion 22 is divided into two by the gap 27, similarly to the female fitting member Bf1. In other words, the top end of the female fitting member Bf2 is also divided into four by the gap 27. Here, it can also be expressed that at least a portion of the first elastic portion 21a is separated from at least a portion of the second elastic portion 21b by the gap 27. Similarly, it can also be expressed that at least a portion of the third elastic portion 22a is separated from at least a portion of the fourth elastic portion 22b by the gap 27.

[0076] The first elastic portion 21a and the second elastic portion 21b are respectively extended from the first base portion 26a. The first base portion 26a is extended from the first connecting portion 25a connected to the printed circuit board. In other words, the first elastic portion 21a and the second elastic portion 21b are respectively extended from the first connecting portion 25a. In other words, the first elastic portion 21a and the second elastic portion 21b are respectively connected to the first connecting portion 25a continuously and integrally via the first base portion 26a.

[0077] In addition, the third elastic portion 22a and the fourth elastic portion 22b are respectively extended from the second base portion 26b. The second base portion 26b is extended from the second connecting portion 25b connected to the printed circuit board. In other words, the third elastic portion 22a and the fourth elastic portion 22b are respectively extended from the second connecting portion 25b. In other words, the third elastic portion 22a and the fourth elastic portion 22b are respectively connected to the second connecting portion 25b continuously and integrally via the second base portion 26b.

[0078] In addition, unlike the female fitting member Bf1, the first connecting portion 25a and the second connecting portion 25b are separated. On the other hand, the first clamping portion 21 and the second clamping portion 22 are continuously and integrally connected via the fourth bent portion 23d.

[0079] Even with this structure, the first elastic portion 21 a , the second elastic portion 21 b , the third elastic portion 22 a , and the fourth elastic portion 22 b can be deformed independently according to the contact state with the insertion portion 11 .

[0080] The male fitting member Bm and the female fitting member Bf are each formed of a metal material. As an example, the male fitting member Bm and the female fitting member Bf are formed of copper, a copper alloy including brass, aluminum, or an aluminum alloy.

[0081] In addition, conductor plating is applied to a part or the whole of the surface area of ​​the male fitting member Bm and the female fitting member Bf. As the conductor plating, for example, tin plating, silver plating, or gold plating can be appropriately used.

[0082] Among them, tin has the property of being easily alloyed with nickel used for the base of the male interlocking component Bm and the female interlocking component Bf. If the ambient temperature becomes high, tin and nickel are alloyed, and the resistance value becomes 1 [mΩ] or more. On the other hand, silver and gold are difficult to alloy with nickel, but if silver and gold are used, the cost is high. If the contact resistance between the male interlocking component Bm and the female interlocking component Bf is large, the temperature rise occurs at the contact part of the male interlocking component Bm and the female interlocking component Bf. Therefore, in the power conversion device 1 of the embodiment, the contact resistance at the contact part of the male interlocking component Bm and the female interlocking component Bf is set to 1 [mΩ] or less. In other words, the contact resistance between the insertion portion 11 of the male interlocking component Bm and the convex portion of the first clamping portion 21 or the convex portion of the second clamping portion 22 in the state where a pair of interlocking components B are interlocked is set to 1 [mΩ] or less.

[0083] The magnitude of the contact resistance is determined by "contact pressure (contact pressure)", "material (tin on the surface, etc.)" and "contact area". Therefore, in the power conversion device 1 of the embodiment, as an example, the contact resistance is adjusted to 1 [mΩ] or less by adjusting the elastic force of the four elastic parts of the female fitting component Bf. In other words, the female fitting component Bf of the embodiment designs the elastic force of the four elastic parts in such a way that the contact resistance becomes 1 [mΩ] or less. In addition, the elastic force of the four elastic parts depends on, for example, the material (parent material) of the female fitting component Bf and its shape.

[0084] In addition, the insertion portion 11 of the male interlocking member Bm of the embodiment has a substantially flat plate shape. In addition, the female interlocking member Bf of the embodiment is configured to be interlocked with the male interlocking member Bm by clamping the inserted substantially flat plate-shaped insertion portion 11. Thus, the substrate-to-substrate connection structure of the embodiment can increase the contact area between the pair of interlocking members B, and thus can reduce the contact resistance, compared with the substrate-to-substrate connection structure realized by using, for example, a male interlocking member having a needle-shaped insertion portion. The reduction in the contact resistance between the pair of interlocking members B helps to suppress heat generation and power loss in the pair of interlocking members B, increase the degree of freedom related to the shape and material of the female interlocking member Bf, and simplify the determination of the connection state described below.

[0085] For example, when the diameter of the needle shape and the thickness of the flat plate shape are set to be the same, the width of the flat plate shape can be set arbitrarily, and therefore, the flat plate-shaped male fitting member Bm can increase the contact area with the female fitting member Bf compared to the needle-shaped male fitting member of the same length. In addition, for example, when the cross-sectional area of ​​the cross section parallel to the substrate of the needle shape and the flat plate shape is set to be the same, by appropriately setting the thickness and width of the flat plate shape, the area of ​​the main surface of the flat plate shape can be made larger than the surface area of ​​the needle shape of the same length. That is, the flat plate-shaped male fitting member Bm can increase the contact area with the female fitting member Bf compared to the needle-shaped male fitting member of the same length.

[0086] Here, the thickness of the insertion portion 11 refers to Figure 1 The length of the insertion portion 11 is the size of the insertion portion 11 in the left-right direction in the state shown. Figure 1 The size of the insertion portion 11 in the vertical direction in the state shown. Figure 1 The size of the insertion portion 11 in the state shown is in the direction perpendicular to the paper surface.

[0087] In addition, an insulating portion is provided on the outer periphery of the female fitting member Bf. As an example, the insulating portion is a layer 31 of an insulator formed on the outer periphery of the female fitting member Bf (see Fig.11 ). The insulating layer 31 can be formed by applying an insulator to the outer periphery of the female fitting component Bf, or by adhering an insulating film formed by the insulator to the outer periphery of the female fitting component Bf. As an example, the insulator is a resin. Here, the outer periphery of the female fitting component Bf refers to the surface area of ​​the female fitting component Bf except for the area on the side of the first clamping portion 21 opposite to the second clamping portion 22, the area on the side of the second clamping portion 22 opposite to the first clamping portion 21, and the area of ​​the connecting portion 25 in contact with the printed circuit board (refer to Fig.11 ). Thus, when the male fitting member Bm and the female fitting member Bf are not properly fitted due to the positional deviation between the insertion portion 11 and the receiving portion 20, the poor connection can be detected by electrical inspection. Here, the electrical inspection refers to the measurement of the resistance value at the contact point between the male fitting member Bm and the female fitting member Bf.

[0088] Figure 7 Yes means Figure 5 A schematic three-dimensional diagram of a state where the female fitting component Bf1 is mounted on a circuit board. Figure 7 As shown, the female fitting component Bf1 is surface mounted on the printed circuit board. Specifically, the connection portion 25 of the female fitting component Bf1 is electrically connected to the printed circuit board by soldering with solder SL. Figure 7 Although the female fitting member Bf1 is exemplified, the same applies to the male fitting members Bm1 and Bm2.

[0089] Figure 8 Yes means Figure 2 or Figure 3 The male chimeric component Bm and Figure 5 A schematic cross-sectional view of an example of a mating state between the female mating components Bf. Figure 8 As shown, the female fitting component Bf clamps the insertion portion 11 of the male fitting component Bm inserted between the first clamping portion 21 and the second clamping portion 22, so that the substrate PCB provided with the female fitting component Bf is combined with the substrate PCB provided with the male fitting component Bm. Figure 8 Example of (a1) Figure 2 The male chimeric construct Bm1 and Figure 5 A combination of the female chimeric component Bf1. Figure 8 (a2) Example Figure 3 The male chimeric construct Bm2 and Figure 5 The female chimeric component Bf1 is combined with Figure 2 and Figure 3As described above, the male fitting member Bm1 and the male fitting member Bm2 have different lengths of, for example, the insertion portion 11. Thus, the male fitting members Bm1, Bm2 and the female fitting member Bf1 can be appropriately combined according to the distance between the substrates to be combined. Figure 8 (b1) illustrates a state where the distal end of the insertion portion 11 is inserted to a position in contact with the bottom of the receiving portion 20 of the female fitting member Bf1. Figure 8 (b2) shows a state where the tip of the insertion portion 11 is inserted to an arbitrary position before contacting the bottom of the receiving portion 20 of the female fitting member Bf1. In this way, the length of insertion of the male fitting members Bm1 and Bm2 into the female fitting member Bf1, i.e., the insertion height, can be appropriately set according to the distance between the substrates to be connected.

[0090] In addition, when selecting Figure 8 When the illustrated combination is a combination of a pair of fitting members B constituting the inter-substrate connection structure of the power conversion device 1 , surface mounting is easy, and thus the man-hours for assembling the power conversion device 1 can be reduced.

[0091] Fig. 9 Yes means Figure 4 The male chimeric construct Bm3 and Figure 6 A schematic cross-sectional view of an example of a mating state between the female mating member Bf2. Fig. 9 As shown, the female fitting component Bf2 clamps the insertion portion 11 of the male fitting component Bm3 inserted between the first clamping portion 21 and the second clamping portion 22, so that the substrate PCB configured with the female fitting component Bf2 is combined with the substrate PCB configured with the male fitting component Bm3. Fig. 9 As shown, the male type fitting component Bm3 is installed on the printed circuit board in a state where the connecting portion 15 is inserted into the hole portion H3 set at a predetermined position on the printed circuit board, and the inserting portion 19a is inserted into the holes H4 and H5. Specifically, the connecting portion 15 inserted in a manner of penetrating the printed circuit board is electrically connected to the printed circuit board by dip soldering. In addition, the female type fitting component Bf2 is installed on the printed circuit board in a state where the first connecting portion 25a is inserted into the hole portion H1 set at a predetermined position on the printed circuit board, and the second connecting portion 25b is inserted into the hole portion H2. Specifically, the first connecting portion 25a and the second connecting portion 25b inserted in a manner of penetrating the printed circuit board are electrically connected to the printed circuit board by dip soldering.

[0092] In addition, when selecting Fig. 9 In the case where the illustrated combination is a combination of a pair of fitting members B constituting the inter-substrate connection structure of the power conversion device 1 , the power conversion device 1 capable of handling a large current can be realized because of the high robustness of the DIP mounting.

[0093] Fig.10 This is a diagram for explaining the mounting of the male fitting member Bm on the circuit board according to the embodiment. Fig.10 (a) shows the male fitting member Bm in a state of being installed in a predetermined arrangement. Fig.10 (b) shows the male fitting member Bm in a state of being mounted after being rotated by an angle θ with respect to a predetermined arrangement. Fig.11 It is a diagram for explaining the expansion of the geometrically permissible range of the fitting between the male fitting member Bm and the female fitting member Bf according to the embodiment. Fig.11 The cross-sectional view schematically illustrates a cross section of the fitting portion of the embodiment. Fig.11 The A-A' portion of the mating part represents the contact portion where the male mating member Bm and the female mating member Bf come into contact. Fig.11 The figure of the A-A' section is shown as an example of a cross-sectional view of the A-A' section. Fig.10 The state shown in (a) corresponds to the state shown in (a). Fig.10 Corresponding to the state shown in (b).

[0094] like Figure 8 and Fig. 9 As shown in FIG. 1 , the male fitting component Bm mounted on the printed circuit board is inserted into the receiving portion 20 of the female fitting component Bf. Specifically, the insertion portion 11 is inserted in a manner that expands the interval between the first clamping portion 21 and the second clamping portion 22 while contacting the first clamping portion 21 and the second clamping portion 22. However, when the male fitting component Bm is mounted on the printed circuit board, for example, Fig.10 As shown in FIG. 1 , there is a case where the male interlocking component Bm is arranged out of the predetermined position. Similarly, when the female interlocking component Bf is mounted on the printed circuit board, there is a case where the arrangement is deviated. In such a case, there is a possibility that the pair of interlocking components B are not properly interlocked, resulting in a poor connection between the substrates. In addition, even when the male interlocking component Bm and the female interlocking component Bf are respectively mounted in a predetermined arrangement, there is a possibility that the pair of interlocking components B are not properly interlocked, resulting in a poor connection between the substrates, due to the positional accuracy during assembly.

[0095] In the power conversion device 1 of the embodiment, the first clamping portion 21 and the second clamping portion 22 are respectively bent into a convex shape toward the receiving portion 20. Fig.11 As shown in the cross-sectional view of FIG. 1 , the top end of the female fitting member Bf is formed in a shape that is open toward the male fitting member Bm. Thus, the top end of the female fitting member Bf can guide the insertion portion 11 of the male fitting member Bm toward the receiving portion 20. Specifically, even if the insertion portion 11 is in Fig.10In the state shown in (b), the distal end 13 of the insertion portion 11 can be inserted into the receiving portion 20 along the inner wall of the distal end of the female fitting member Bf. Therefore, according to the fitting portion of the embodiment, the relative rotational misalignment range in which the pair of fitting members B can be properly fitted can be expanded.

[0096] In the power conversion device 1 of the embodiment, a gap 27 is provided at the top end of each of the first clamping portion 21 and the second clamping portion 22. In other words, the top end of each of the first clamping portion 21 and the second clamping portion 22 is divided into at least two by the gap 27. That is, the top end of the female fitting member Bf of the embodiment is divided into at least four. Fig.11 The rotation diagram shows a state where the third elastic portion 22a receives a force from the rotationally displaced insertion portion 11 and is displaced in the direction of arrow D. In addition, Fig.11 The rotation diagram shows that the first elastic portion 21a is deformed in the direction of the arrow R by the force from the rotationally displaced insertion portion 11. In this way, the first elastic portion 21a, the second elastic portion 21b, the third elastic portion 22a and the fourth elastic portion 22b, that is, the four divided top portions are independently displaced and / or deformed by the force from the insertion portion 11. Therefore, even if the insertion portion 11 is in Fig.10 The state shown in (b) of the four divided top portions can also be Fig.11 As shown by the hollow circle mark in the figure of the rotation, the insertion part 11 is properly contacted. Therefore, according to the fitting part of the embodiment, the range of relative rotational misalignment between the pair of fitting members B that can achieve good connection can be expanded.

[0097] As described above, according to the inter-substrate connection structure implemented by the pair of fitting members B of the embodiment, the geometrical allowable range of the fitting portion can be expanded.

[0098] In addition, if Fig.11 As shown in FIG. 1 , an insulating layer 31 is formed as an insulating portion on the outer periphery of the female fitting member Bf. Thus, in the flow of connecting the substrates in the embodiment described below, the connection state between the substrates can be determined.

[0099] In addition, the insulating portion is not limited to the insulating layer 31, and can also be realized by other structures. Fig.12 It is a schematic perspective view showing another example of the insulating portion according to the embodiment. Fig.13 It is used to explain the installation and fixing Fig.12 FIG. 3 is a diagram showing an expansion of the geometrically permissible range of engagement between the male engaging member Bm and the female engaging member Bf in the case of the covering member 32. Fig.12As shown, the insulating portion may also be formed by a covering member 32 mounted and fixed to the outer periphery of the female fitting member Bf. The covering member 32 is flexible. The covering member 32 may also be stretchable. The covering member 32 is formed by an insulator. As an example, the insulator is an insulating material such as silicone. The covering member 32 is formed into a substantially cylindrical shape. The diameter of the upper end side of the covering member 32, i.e., the dimension L1, is smaller than the dimension L2 of the lower end side. Accordingly, for the inner periphery 321 of the covering member 32, the dimension of the upper end side is also smaller than the dimension of the lower end side. As shown in FIG. Figure 5 and Figure 6 As shown in FIG. 1 and FIG. 2 , this is a dimension determined in accordance with the fact that the shape of the outer peripheral portion of the female fitting member Bf becomes smaller from the lower end side toward the upper end side. Fig.13 As shown in FIG. 1 , when the covering member 32 is mounted and fixed to the outer periphery of the female fitting member Bf, the inner periphery 321 of the covering member 32 is externally connected to the first clamping portion 21 and the second clamping portion 22. Fig.13 As shown in FIG. 1 , there is a gap G at both ends of the insertion portion 11 in the width direction. Fig.13 As shown in the figure of the rotation of the covering member 32, the covering member 32 can deform by following the four divided top ends that are independently displaced and / or deformed by the rotationally misaligned insertion portion 11, respectively, by utilizing the flexibility of the covering member 32 and the degree of freedom of deformation of the gap G. Even with this structure, the connection state between the substrates can be determined in the process of connecting the substrates in the embodiment described below. In addition, the covering member 32 utilizes its flexibility to realize the insulating portion in a state where it is attached to the outer periphery of the female fitting member Bf with almost no gap, simply by being installed and fixed to the female fitting member Bf.

[0100] Hereinafter, an example of the flow of connection between substrates according to the embodiment will be described with reference to the drawings. Fig.14 This is a flowchart showing an example of the flow of connection between substrates according to the embodiment.

[0101] First, the male type fitting component Bm is arranged on the main surface of the first substrate PCB1 on the side of the second substrate PCB2 (S201). In addition, the female type fitting component Bf is arranged on the main surface of the second substrate PCB2 on the side of the first substrate PCB1 (S202). After the pair of fitting components B are respectively arranged on the printed circuit board, the installation state of the pair of fitting components B on the printed circuit board is inspected using, for example, an optical automatic appearance inspection device (AOI: Automated Optical Inspection). In the case where the inspection detects that the installation state of the pair of fitting components B on the printed circuit board is defective, the subsequent process is not implemented for the printed circuit board detected to be defective.

[0102] Afterwards, the first substrate PCB1 and the second substrate PCB2 are combined by the engagement of a pair of engagement members B (S203). In this step, after the contact between the male engagement member Bm and the female engagement member Bf is detected by the sensor, the printed circuit board of one side is pressed into the printed circuit board of the other side, thereby forming a fixed state of the layered structure. The female engagement member Bf has an elastic force (spring force) on the side opposite to the insertion direction of the insertion portion 11 of the male engagement member Bm. Therefore, if a plurality of male engagement members Bm are simultaneously pressed into a plurality of female engagement members Bf, there is a situation where several male engagement members Bm are disengaged from the receiving portion 20 of the female engagement member Bf. Therefore, in this step, after a reliable engagement state is once formed, the printed circuit board of one side is further pressed into the printed circuit board of the other side, thereby achieving a good engagement. Here, the reliable engagement state refers to a stable state in which the insertion portion 11 is pressed into the receiving portion 20, for example, about 1 mm.

[0103] Then, the resistance is measured by the fitting part (S204). The resistance measurement by the fitting part is, for example, the measurement of the resistance between an arbitrary position of the circuit structure on the first substrate PCB1 electrically connected to the male fitting member Bm and an arbitrary position of the circuit structure on the second substrate PCB2 electrically connected to the female fitting member Bf.

[0104] When the resistance measured by the fitting part indicates an insulation state (S205: Yes), the fitting part is judged to be in a poor connection (S206). On the other hand, when the resistance measured by the fitting part does not indicate an insulation state (S205: No), the fitting part is judged to be in a good connection (S207). After S206 or S207, Fig.14 The process ends.

[0105] As described above, according to the method of connecting substrates using the pair of fitting members B of the embodiment, it is possible to expand the geometrical allowable range of the fitting portion.

[0106] As described above, the power converter 1 of the first embodiment can expand the geometrical tolerance of the fitting portion for electrically connecting the circuit boards. This allows a plurality of circuit boards to be appropriately stacked, thereby miniaturizing the power converter 1.

[0107] (Second embodiment)

[0108] Hereinafter, an embodiment of a power conversion device, a component connection structure, and a component connection method according to a second embodiment will be described with reference to the drawings. Here, differences from the first embodiment will be mainly described, and duplicate descriptions will be appropriately omitted.

[0109] In the first embodiment, the component connection structure of the present disclosure is described by taking the connection between substrates as an example, but the present disclosure is not limited thereto. The component connection structure of the present disclosure can be applied to the connection between a circuit substrate and an electronic component, for example. Fig.15 It is a schematic cross-sectional view showing an example of a connection structure between components in the power conversion device 1 according to the second embodiment. Fig.15 A first substrate PCB1 , a plurality of pairs of fitting members B, and an electronic component 51 are illustrated.

[0110] The electronic component 51 is mounted on the first substrate PCB1. The electronic component 51 includes a second substrate PCB2 and a third substrate PCB3. The first substrate PCB1 and the third substrate PCB3 are coupled by fitting with a plurality of pairs of fitting members B, so that the electronic component 51 is mounted on the first substrate PCB1.

[0111] also, Fig.15 The example shows that the first substrate PCB1 is provided with a female fitting component and the third substrate PCB3 is provided with a male fitting component, but the present invention is not limited thereto. The first substrate PCB1 may be provided with a male fitting component and the third substrate PCB3 may be provided with a female fitting component. In addition, the number of substrates of the electronic component 51 may be one or more than three. For example, Fig.15 The electronic component 51 illustrated is a magnetic component such as a transformer, a mutual inductor, a reactor or a choke. In the substrate of the electronic component 51, for example, a conductor pattern forms a winding. Moreover, by making the magnetic core penetrate the inside and outside of the winding formed on the substrate to form a closed magnetic circuit, the electronic component 51 has a function as a magnetic component. In this case, it can be described as the electronic component 51 is a printed circuit board transformer, or a transformer-integrated printed circuit board.

[0112] In this way, the component connection structure disclosed in the present invention can also be applied to the electrical connection between the circuit substrate and the electronic component 51. As a result, the mounting density of components such as the electronic component, the circuit substrate, and the substrate unit in the power conversion device 1 can be improved, or the degree of freedom of component configuration can be improved. The increase in the mounting density of components and the increase in the degree of freedom of configuration each contribute to the miniaturization of the power conversion device 1.

[0113] (Third embodiment)

[0114] Hereinafter, embodiments of a power conversion device, a component connection structure, and a component connection method according to a third embodiment will be described with reference to the drawings. Here, differences from the first embodiment will be mainly described, and duplicate descriptions will be appropriately omitted.

[0115] Fig.16It is a schematic cross-sectional view showing an example of a connection structure between components in the power conversion device 1 according to the third embodiment. Fig.16 A first substrate PCB1, a second substrate PCB2, a third substrate PCB3, and a plurality of pairs of fitting members B are illustrated.

[0116] The first substrate PCB1 and the third substrate PCB3 are engaged and combined by using a plurality of pairs of engaging members B. The second substrate PCB2 is provided between the first substrate PCB1 and the third substrate PCB3. The second substrate PCB2 is provided with, for example, a plurality of holes H. The plurality of male engaging members provided to the first substrate PCB1 or the third substrate PCB3 pass through the plurality of holes H in the assembled state.

[0117] Thus, according to the component connection structure disclosed in the present invention, a substrate outside the connection object can be interposed between the substrates of the connection object. Of course, according to the component connection structure disclosed in the present invention, electronic components and substrate units outside the connection object can also be interposed between the substrates of the connection object. Thus, the mounting density of components such as electronic components, circuit substrates, and substrate units in the power conversion device 1 can be improved, or the degree of freedom of configuration of components can be improved. The increase in the mounting density of components and the increase in the degree of freedom of configuration respectively contribute to the miniaturization of the power conversion device 1.

[0118] also, Fig.16 The case where the second substrate PCB2 is interposed between the first and third substrate PCB3 is described as an example, but the present invention is not limited thereto. An electronic component or substrate unit other than the connection object may be interposed between the first and third substrate PCB1.

[0119] (Fourth embodiment)

[0120] Hereinafter, an embodiment of a power conversion device, a component connection structure, and a component connection method according to a fourth embodiment will be described with reference to the drawings. Here, differences from the first embodiment will be mainly described, and duplicate descriptions will be appropriately omitted.

[0121] In the first embodiment, a case where a pair of circuit boards are connected substantially in parallel by using a plurality of pairs of fitting members B is described as an example, but the present invention is not limited thereto. A plurality of pairs of fitting members B may be used to connect a pair of circuit boards substantially perpendicularly. Fig.17 It is a schematic cross-sectional view showing an example of a connection structure between components in the power conversion device 1 according to the fourth embodiment. Fig.17 The connection between the first substrate PCB1 and the second substrate PCB2 and the connection between the first substrate PCB1 and the third substrate PCB3 are exemplified.

[0122] Fig.17 (a) shows an example in which a female fitting component Bf is provided on the first substrate PCB1 and a male fitting component Bm is provided on the second substrate PCB2. Fig.17 As shown, the male fitting component Bm is provided at the end of the second substrate PCB2. The support member 40 is provided at the end of the second substrate PCB2 and clamps the end of the second substrate PCB2. The support member 40 defines the angle of the male fitting component Bm relative to the second substrate PCB2. The connection portion 15 of the male fitting component Bm is engaged with the support member 40. The insertion portion 11 of the male fitting component Bm is substantially parallel to the main surface of the second substrate PCB2.

[0123] In addition, Fig.17 In the structure of (a), the male fitting member Bm and the second substrate PCB2 can also be electrically connected via the supporting member 40.

[0124] Fig.17 (b) illustrates a case where a male interlocking member Bm is provided on the first substrate PCB1 and a female interlocking member Bf is provided on the third substrate PCB3. In this case, the support member 40 is provided at the end of the third substrate PCB3 and clamps the end of the third substrate PCB3. The support member 40 defines the angle of the female interlocking member Bf relative to the third substrate PCB3. Fig.17 Unlike (a), the connection portion 25 of the female fitting component Bf is engaged with the supporting member 40. The receiving portion 20 of the female fitting component Bf is substantially parallel to the main surface of the third substrate PCB3. In other words, the main surface of the third substrate PCB3 provided with the female fitting component Bf is substantially parallel to the insertion portion 11 of the male fitting component Bm fitted with the female fitting component Bf.

[0125] In addition, Fig.17 In the structure of (b), the female fitting member Bf and the third substrate PCB3 can also be electrically connected via the supporting member 40.

[0126] Thus, according to the component connection structure of the present embodiment, a pair of components can be connected approximately vertically by using at least one pair of interlocking members B. In other words, according to the component connection structure of the present embodiment, a pair of components can be connected at an angle specified by the support member 40 by using at least one pair of interlocking members B. Thus, the mounting density of components such as electronic components, circuit substrates, and substrate units in the power conversion device 1 can be increased, or the degree of freedom of configuration of components can be increased. The increase in the mounting density of components and the increase in the degree of freedom of configuration each contribute to the miniaturization of the power conversion device 1.

[0127] The support member 40 may be formed integrally with any one of the male fitting member Bm, the female fitting member Bf and the second substrate PCB2, or may be formed as a component independent of the male fitting member Bm, the female fitting member Bf and the second substrate PCB2.

[0128] In addition, Fig.17 In the structure of , the first substrate PCB1 provided with at least one of the male fitting member Bm and the female fitting member Bf can be replaced with the electronic component 51 provided with at least one of the male fitting member Bm and the female fitting member Bf.

[0129] (Fifth embodiment)

[0130] Hereinafter, embodiments of a power conversion device, a component connection structure, and a component connection method according to a fifth embodiment will be described with reference to the drawings. Here, differences from the first embodiment will be mainly described, and duplicate descriptions will be appropriately omitted.

[0131] Fig.18 It is a schematic cross-sectional view showing an example of a connection structure between components in the power conversion device 1 according to the fifth embodiment. Fig.18 The connection between the first substrate PCB1 provided with the male fitting member Bm and the second substrate PCB2 provided with the female fitting member Bf is illustrated. The first substrate PCB1 is provided with a supporting member 41. The supporting member 41 defines the angle of the male fitting member Bm relative to the first substrate PCB1. The supporting member 41 has, for example, a rectangular parallelepiped shape. The bottom surface 411 of the supporting member 41 is fixed to the first substrate PCB1. The connecting portion 15 of the male fitting member Bm is joined to the side surface 412 of the supporting member 41. The insertion portion 11 of the male fitting member Bm is substantially parallel to the main surface of the first substrate PCB1.

[0132] Fig.19 1 is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the fifth embodiment. Fig.19 As shown, Fig.18 The first substrate PCB1 provided with the male fitting member Bm can also be electrically connected to the electronic component 51 provided with the female fitting member Bf.

[0133] In addition, Fig.18 In the structure of FIG. 1 , it is not limited to that the male fitting component Bm is joined to the supporting component 41 of the first substrate PCB1 , but the female fitting component Bf may be joined to the supporting component 41 of the first substrate PCB1 . Fig. 20 It is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the fifth embodiment. Fig. 20The connection between the first substrate PCB1 provided with the female fitting member Bf and the second substrate PCB2 provided with the male fitting member Bm is exemplified. Fig. 20 In the structure of the present invention, the support member 41 defines the angle of the male fitting member Bm relative to the first substrate PCB1. The connection portion 25 of the female fitting member Bf is engaged with the side surface 412 of the support member 41. The main surface of the first substrate PCB1 of the female fitting member Bf provided with the receiving portion 20 of the female fitting member Bf is substantially parallel to the main surface of the first substrate PCB1, and the insertion portion 11 of the male fitting member Bm provided on the second substrate PCB2 to be fitted with the female fitting member Bf is substantially parallel.

[0134] Fig.21 1 is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the fifth embodiment. Fig.21 As shown, Fig. 20 The first substrate PCB1 provided with the female fitting member Bf can also be electrically connected to the electronic component 51 provided with the male fitting member Bm. In addition, the male fitting member Bm can also be formed as one body with the electronic component 51. In this case, Fig.21 As shown, there may be a case where the connection portion 15 is provided inside the electronic component 51 .

[0135] In addition, Fig. 20 In the structure of FIG. 1 , the receiving portion 20 of the female fitting component Bf may be substantially perpendicular to the main surface of the first substrate PCB1. Fig. 22 It is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the fifth embodiment. Fig. 22 The connection between the first substrate PCB1 provided with the female fitting member Bf and the second substrate PCB2 provided with the male fitting member Bm is shown as an example. Fig. 20 and Fig.21 The structure is different from that of the first substrate PCB1, which is substantially perpendicular to the main surface of the first substrate PCB1. Fig. 22 In the structure, the support member 41 defines the angle of the female fitting member Bf relative to the first substrate PCB1. The main surface of the first substrate PCB1 provided with the female fitting member Bf is substantially perpendicular to the insertion portion 11 of the male fitting member Bm provided on the second substrate PCB2 and fitted with the female fitting member Bf.

[0136] Fig.23 1 is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the fifth embodiment. Fig.23 As shown, Fig. 22The first substrate PCB1 provided with the female fitting member Bf can also be electrically connected to the electronic component 51 provided with the male fitting member Bm. Fig.21 The structure is similarly formed integrally with the electronic component 51.

[0137] In addition, Fig.18 and Fig.19 In the structure of Fig. 22 and Fig.23 Similarly to the structure of , the insertion portion 11 of the male fitting member Bm may be substantially perpendicular to the main surface of the first substrate PCB1.

[0138] In addition, Fig.18 and Fig.19 In the structure of , the male type fitting member Bm and the first substrate PCB1 can be electrically connected with the support member 41 or without the support member 41. Figure 20 to Figure 23 In the structure of , the female fitting component Bf and the first substrate PCB1 can be electrically connected with the support component 41 or without the support component 41. Figure 20 to Figure 23 In the structure, when the female interlocking component Bf is electrically connected to the first substrate PCB1 without the aid of the supporting component 41, any position on the rear end side of the female interlocking component Bf, such as the first base 26a and the second base 26b on the rear end side of the female interlocking component Bf1 and the side surface of the connecting portion 25 on the rear end side of the female interlocking component Bf2, can be electrically connected to the first substrate PCB1.

[0139] In addition, Figure 18 to Figure 23 In the structure, the first substrate PCB1 and the supporting member 41 can be formed as one body or as independent parts. Fig.18 and Fig.19 In the structure, the male type fitting member Bm and the supporting member 41 can be formed as one piece or as independent parts. Figure 20 to Figure 23 In the structure of , the female fitting member Bf and the supporting member 41 may be formed as one body or as separate parts.

[0140] Thus, according to the component connection structure of the present embodiment, a pair of components can be connected substantially vertically by at least one pair of interlocking members B. In other words, according to the component connection structure of the present embodiment, a pair of components can be connected at an angle defined by the support member 41 by at least one pair of interlocking members B.

[0141] (Sixth embodiment)

[0142] Hereinafter, embodiments of a power conversion device, a component connection structure, and a component connection method according to a sixth embodiment will be described with reference to the drawings. Here, differences from the first embodiment will be mainly described, and duplicate descriptions will be appropriately omitted.

[0143] In the first embodiment, a case where a pair of circuit boards are connected substantially in parallel by a plurality of pairs of fitting members B is described as an example, but the present invention is not limited thereto. A pair of circuit boards can also be connected by a plurality of pairs of fitting members B at an arbitrary angle. Fig.24 It is a schematic cross-sectional view showing an example of a connection structure between components in a power conversion device according to a sixth embodiment. Fig.24 The connection between the first substrate PCB1 provided with the female fitting member Bf and the second substrate PCB2 provided with the male fitting member Bm is exemplified.

[0144] A supporting member 44 is provided on the second substrate PCB2. The supporting member 44 is provided on the main surface of the second substrate PCB2. The supporting member 44 defines the angle of the male fitting member Bm relative to the second substrate PCB2. The supporting member 44 has, for example, a triangular prism shape. The first side surface 441 of the rectangular shape of the supporting member 44 is fixed to the second substrate PCB2. The connecting portion 15 of the male fitting member Bm is joined to the second side surface 442 of the rectangular shape of the supporting member 44. The insertion portion 11 of the male fitting member Bm is substantially parallel to the main surface of the first substrate PCB1, and has an arbitrary angle with the main surface of the second substrate PCB2 corresponding to the triangular shape of the bottom surface of the supporting member 44, that is, the angle between the side surfaces 441 and 442.

[0145] Thus, according to the component connection structure of the present embodiment, a pair of components can be connected at an arbitrary angle defined by the support member 44 using at least one pair of fitting members B. As a result, the mounting density of components such as electronic components, circuit boards, and substrate units in the power conversion device 1 can be increased, or the degree of freedom of component arrangement can be increased. The increase in the mounting density of components and the increase in the degree of freedom of arrangement contribute to the miniaturization of the power conversion device 1.

[0146] In addition, Fig.24 In the structure of, the support member 44 may also be provided between the first substrate PCB1 and the female fitting member Bf. In other words, the support member 44 may also be a member that defines the angle of the female fitting member Bf relative to the first substrate PCB1. In addition, the support member 44 may also be provided on both the first substrate PCB1 and the second substrate PCB2.

[0147] In addition, Fig.24In the structure of , the support member 44 may be formed integrally with either the male fitting member Bm or the second substrate PCB2, or may be formed as a component independent of the male fitting member Bm and the second substrate PCB2.

[0148] In addition, Fig.24 In the structure of , at least one of the first substrate PCB1 and the second substrate PCB2 can be replaced with the electronic component 51.

[0149] (Seventh Implementation Method)

[0150] Hereinafter, embodiments of a power conversion device, a component connection structure, and a component connection method according to a seventh embodiment will be described with reference to the drawings. Here, differences from the first embodiment will be mainly described, and duplicate descriptions will be appropriately omitted.

[0151] Fig.25 It is a schematic perspective view showing an example of the structure of the male fitting member Bm according to the seventh embodiment. Fig.25 The male fitting member Bm4 is an example of the male fitting member Bm of the embodiment. The side portion 14 of the male fitting member Bm4 is chamfered similarly to the top portion 13 of the male fitting member Bm of the first embodiment, and the thickness decreases toward the top side. Thus, the insertion portion 11 can be easily inserted into the receiving portion 20 of the female fitting member Bf from the side.

[0152] Fig.26 It is a schematic cross-sectional view showing an example of a connection structure between components in the power conversion device 1 according to the seventh embodiment. Fig.26 The connection between the first substrate PCB1 provided with the male fitting component Bm4 and the second substrate PCB2 provided with the female fitting component Bf is illustrated. The male fitting component Bm4 is joined to the first substrate PCB1 at the connection portion 15. The insertion portion 11 of the male fitting component Bm4 is substantially perpendicular to the main surface of the first substrate PCB1 and the main surface of the second substrate PCB2.

[0153] Fig. 27 1 is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the seventh embodiment. Fig. 27 As shown, Fig.26 The second substrate PCB2 provided with the male fitting member Bm4 can also be electrically connected to the electronic component 51 provided with the female fitting member Bf.

[0154] Fig.28 It is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the seventh embodiment. Fig.28The connection between the first substrate PCB1 provided with the female fitting member Bf and the second substrate PCB2 provided with the male fitting member Bm4 is illustrated. The insertion portion 11 of the male fitting member Bm4 is substantially perpendicular to the main surface of the first substrate PCB1 and the main surface of the second substrate PCB2. Fig.28 In the structure of the second substrate PCB2, the moving direction of the second substrate PCB2 when assembling the second substrate PCB2 with the first substrate PCB1 is Fig.26 The structure of the situation is different.

[0155] also, Fig.28 The first substrate PCB1 provided with the female fitting member Bf can also be electrically connected to the electronic component 51 provided with the male fitting member Bm4. Fig.29 1 is a schematic perspective view showing an example of an electronic component 51 to which the male fitting member Bm4 of the seventh embodiment is mounted. Fig.29 In the structure of , the male engaging member Bm4 and the electronic component 51 are formed integrally. Fig.30 It is a schematic cross-sectional view showing another example of the connection structure between components in the power conversion device 1 according to the seventh embodiment. Fig.30 The connection between the first substrate PCB1 provided with the female fitting member Bf and the electronic component 51 formed with the male fitting member Bm4 is exemplified.

[0156] Thus, according to the component connection structure of the present embodiment, a pair of components can be connected substantially vertically by using at least a pair of interlocking members B. In addition, by changing which side of the components to be connected the male interlocking member Bm4 is provided, the assembly direction of the components can be changed. Thus, the degree of freedom of the arrangement of the components in the power conversion device 1 can be increased.

[0157] (Eighth Implementation Method)

[0158] Hereinafter, an embodiment of a power conversion device, a component connection structure, and a component connection method according to an eighth embodiment will be described with reference to the drawings. Here, differences from the first embodiment will be mainly described, and duplicate descriptions will be appropriately omitted.

[0159] Fig.31 It is a diagram for explaining the expansion of the geometrically permissible range of the fitting between the male fitting member Bm and the female fitting member Bf according to the eighth embodiment. Fig.31 The cross-sectional view schematically illustrates a cross section of the fitting portion of the embodiment. Fig.31 The A-A' portion of the mating part represents the contact portion where the male mating member Bm and the female mating member Bf come into contact. Fig.31 The figure of the A-A' section is shown as an example of a cross-sectional view of the A-A' section. Fig.11 Likewise with Fig.10 The state shown in (a) corresponds to the state shown in (a). Fig.11 Likewise with Fig.10 Corresponding to the state shown in (b).

[0160] like Fig.31 As shown, in the first clamping portion 21 and the second clamping portion 22 of the female fitting member Bf of the present embodiment, a substantially hemispherical convex portion 33a bulging toward the receiving portion 20 is provided in the fitting portion that is bent into a convex shape toward the receiving portion 20. Each convex portion 33a can be formed by, for example, stamping. In this case, a concave portion 33b that is concave into a hemispherical shape is provided on the opposite side of each convex portion 33a in the first clamping portion 21 and the second clamping portion 22.

[0161] According to this structure, even when the four divided top ends of the female fitting member Bf are displaced and / or deformed independently by the force from the insertion portion 11 of the male fitting member Bm, the substantially hemispherical convex portion 33a can be continuously in contact with the insertion portion 11. That is, according to the structure of this embodiment, the contact state between the male fitting member Bm and the female fitting member Bf can be maintained in a point contact mode. Thus, the electrical contact between the male fitting member Bm and the female fitting member Bf can be stabilized.

[0162] (Application example)

[0163] Fig.32 It is a schematic cross-sectional view showing an example of the structure of the power conversion device 1 according to the embodiment. Fig.32 The first substrate PCB1, the second substrate PCB2, the third substrate PCB3, the fourth substrate PCB4 and the cooling plate WJ are exemplified. Various electronic components 51 can be mounted on these substrates using the component connection structures of the above-mentioned embodiments. Fig.32 In order to ensure visibility and schematically represent each component, there may be a gap between components that are in contact by fastening, fixing, etc. As an example, the cooling plate WJ is a metal plate-like component having a refrigerant flow path formed inside. In addition, the cooling plate WJ is not limited to a metal plate having a refrigerant flow path inside, and a heat sink, a heat pipe, a non-metallic heat diffusion plate, a metal shell, or a combination thereof can be appropriately used. Among them, the use of a metal shell is not limited to the use of a metal plate-like component that does not have a refrigerant flow path inside as the cooling plate WJ, and includes the case where the shell of the power conversion device 1 is formed of metal and a part of the shell is used as the cooling plate WJ.

[0164] For example, the electronic component 51 includes at least one of a semiconductor element, a semiconductor module, a magnetic body, a capacitor, and a circuit breaker. The semiconductor module is composed of a plurality of semiconductor elements, for example. Here, the magnetic body is a transformer, a transformer-integrated printed circuit board, a mutual inductor, a reactor, and a choke. The circuit breaker is a relay or a fuse. Fig.32 As magnetic bodies, transformer TR and coil Coil are exemplified. Fig.32 Transistors MOSFET1, MOSFET2 and diodes D1, D2 are exemplified as semiconductor modules or semiconductor elements. Fig.32 A plurality of capacitors Cap are illustrated. Fig.32 An example relay RL is shown.

[0165] In the power conversion device 1, the semiconductor elements, semiconductor modules, magnetic bodies, capacitors, and circuit breakers, which are exemplified as electronic components 51, have large losses during operation, and the component temperatures tend to become high. Therefore, in order to efficiently cool the electronic components 51, it is preferred that each electronic component 51 is installed close to the cooling plate WJ.

[0166] In the past, when assembling Fig.32 When the power conversion device 1 of such a structure is illustrated, it is customary to first fasten the electronic component 51 to the cooling plate WJ with screws or the like, or to fix the electronic component 51 to the cooling plate WJ with TIM (thermal interface material), and then solder each substrate PCB2, PCB3, PCB4 to the electronic component 51 for installation. In this case, there are problems in assembly and quality, such as the need for large-scale soldering equipment and the concern of contamination by solder balls or the like.

[0167] Among them, according to the connection structure disclosed in the present invention, a free component configuration that takes into account both assembly performance and component cooling performance can be performed. Specifically, after the electronic component 51 is fastened to the cooling plate WJ using screws or the like, or the electronic component 51 is fixed to the cooling plate WJ using a TIM, the respective substrates PCB2, PCB3, PCB4 are combined with the electronic component 51 using a fitting member B, so that the electronic component 51 and the respective substrates PCB2, PCB3, PCB4 can be easily and reliably connected.

[0168] In addition, the electronic component 51 may be arranged on the substrate via the support member 45, for example, as in the fifth embodiment, the male fitting component Bm or the female fitting component Bf is provided on the substrate via the support member 41, or as in the sixth embodiment, the male fitting component Bm or the female fitting component Bf is provided on the substrate via the support member 44. That is, the fastening of the electronic component 51 to the cooling plate WJ by screws or the like and the fixing of the electronic component 51 to the cooling plate WJ by TIM may be connected via the support member 45, respectively.

[0169] Here, the supporting member 45 is a member that thermally connects the electronic component 51 to the cooling plate WJ. Therefore, the shape and material of the supporting member 45 can be appropriately selected so that the heat transfer from the electronic component 51 to the cooling plate WJ becomes larger. As an example, in the case where the electronic component 51 and the cooling plate WJ are electrically insulated, the supporting member 45 can be formed of metal. Of course, other materials besides metal can also be used as the supporting member 45. In addition, the supporting member 45 can be formed as a whole with the cooling plate WJ, or a refrigerant flow path can be provided inside the supporting member 45. In addition, the shapes and materials of the supporting members 19, 40, 41, and 44 of the above-mentioned embodiments can also be appropriately selected so that the heat transfer from the electronic component 51 to each substrate PCB1, PCB2, PCB3, and PCB4 via a pair of interlocking members B becomes larger. In this case, the substrate can also be used to diffuse or dissipate the heat generated in the electronic component 51.

[0170] As described above, according to the power conversion device 1 of the present disclosure, it is possible to expand the geometrical tolerance range of the fitting portion that electrically connects components.

[0171] In addition, as described above, the component connection structure disclosed in the present invention is a structure that connects components of any connected object among electronic components, circuit substrates, and substrate units. As an example, the component connection structure is a connection structure between circuit substrates. As another example, the component connection structure is a connection structure between an electronic component and a circuit substrate or substrate unit. As another example, the component connection structure is a connection structure between a circuit substrate and a substrate unit.

[0172] In addition, the techniques of the above-mentioned embodiments can be combined arbitrarily. For example, in a plurality of pairs of interlocking components B connecting a pair of circuit substrates, a different inter-component connection structure can be applied to each pair of interlocking components B. In addition, for example, for two or more circuit substrates connected to an arbitrary circuit substrate, the angles relative to the arbitrary circuit substrate can be made different.

[0173] In addition, in the description of the present disclosure, in the drawings shown, for components having the same or substantially the same functions as the aforementioned components, there are cases where the same reference numerals are marked and the description is appropriately omitted. In addition, even in the case of representing the same or substantially the same parts, there are cases where the sizes and proportions of each other are different due to the difference in the drawings. In addition, from the perspective of ensuring the visibility of the drawings, for example, only the main components are marked with reference numerals in the description of each drawing, and even in the drawings shown, components having the same or substantially the same functions as the aforementioned components are not marked with reference numerals.

[0174] Several embodiments of the present invention have been described, but these embodiments are provided as examples and are not intended to limit the scope of protection of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and changes can be made without departing from the scope of the invention. These embodiments and their variations are included in the scope and purpose of the invention, and are also included in the invention described in the claims and their equivalents.

Claims

1. A power conversion device comprising: Part 1; Part 2; and A plurality of pairs of fitting members, each comprising a male fitting member and a female fitting member, wherein the male fitting member has an insertion portion in a substantially flat plate shape, and the female fitting member has a first clamping portion and a second clamping portion arranged opposite to each other, In each pair of the plurality of pairs of interlocking members, The male fitting member is arranged on one of the first component and the second component. The female fitting member is arranged on the other of the first component and the second component. In each of the plurality of pairs of fitting members, the female fitting member clamps the insertion portion of the male fitting member inserted between the first clamping portion and the second clamping portion, so that the first component is combined with the second component. The first clamping portion and the second clamping portion each include a first curved portion curved toward the opposing surfaces thereof to form a convex portion. A gap is provided at each of the top ends of the first clamping portion and the second clamping portion. The first clamping portion includes a first elastic portion and a second elastic portion divided by the gap, The second clamping portion includes a third elastic portion and a fourth elastic portion divided by the gap, The first elastic portion and the second elastic portion are respectively extended from a first connecting portion as a connecting portion to a component provided on the rear end side of the female fitting member. The third elastic portion and the fourth elastic portion are respectively extended from the second connection portion as a connection portion connected to a component provided on the rear end side of the female fitting member. The first elastic portion, the second elastic portion, the third elastic portion, and the fourth elastic portion each include a curved second curved portion. The second bent portion is provided between the first bent portion and the first connecting portion, The second bending portion is provided between the first bending portion and the second connecting portion, The first connecting portion, the first bending portion, and the second bending portion are integrally connected. The second connection portion, the first curved portion, and the second curved portion are integrally connected.

2. The power conversion device according to claim 1, wherein: The female fitting member has an M-shape.

3. The power conversion device according to claim 2, wherein: At least one pair of the multiple pairs of interlocking components also includes: a connecting portion connected to a component provided on the rear end side of the male interlocking component or the female interlocking component; and a supporting member provided between the male interlocking component or the female interlocking component and the component to define an angle of the male interlocking component or the female interlocking component relative to the component.

4. The power conversion device according to claim 3, wherein: The first component and the second component are substrates, respectively. The first component is coupled to the second component at an angle defined by the support member.

5. The power conversion device according to claim 1, wherein: The first component and the second component are substrates, respectively. The first component and the second component are connected approximately vertically.

6. The power conversion device according to claim 1, wherein: The number of divisions of the first clamping portion and the second clamping portion divided by the gap is six.

7. The power conversion device according to claim 1, wherein: The electronic component includes at least one of a semiconductor element, a semiconductor module, a magnetic body, a capacitor, and a circuit breaker.

8. The power conversion device according to claim 1, wherein: The convex portions formed in the first clamping portion and the second clamping portion respectively have a substantially hemispherical shape.

9. The power conversion device according to claim 1, wherein: The male fitting member and the female fitting member are respectively formed of a metal material.

10. The power conversion device according to claim 9, wherein: Conductor plating is applied to a part or the entire surface area of ​​the metal material.

11. The power conversion device according to claim 1, wherein: An insulating layer is formed on the outer periphery of the female fitting member.

12. A component connection structure, comprising: a male fitting member having an insertion portion in a substantially flat plate shape; and A female fitting member having a first clamping portion and a second clamping portion disposed opposite to each other, clamping an insertion portion of the male fitting member inserted between the first clamping portion and the second clamping portion, wherein a pair of the male fitting member and the female fitting member are disposed in different parts. The first clamping portion and the second clamping portion each include a first curved portion curved toward the opposing surfaces thereof to form a convex portion. A gap is provided at each of the top ends of the first clamping portion and the second clamping portion. The first clamping portion includes a first elastic portion and a second elastic portion divided by the gap, The second clamping portion includes a third elastic portion and a fourth elastic portion divided by the gap, The first elastic portion and the second elastic portion are respectively extended from a first connecting portion as a connecting portion to a component provided on the rear end side of the female fitting member. The third elastic portion and the fourth elastic portion are respectively extended from the second connection portion as a connection portion connected to a component provided on the rear end side of the female fitting member. The first elastic portion, the second elastic portion, the third elastic portion, and the fourth elastic portion each include a curved second curved portion. The second bent portion is provided between the first bent portion and the first connecting portion, The second bending portion is provided between the first bending portion and the second connecting portion, The first connecting portion, the first bending portion, and the second bending portion are integrally connected. The second connection portion, the first curved portion, and the second curved portion are integrally connected.

13. The component connection structure according to claim 12, wherein: The female fitting member has an M-shape.

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