Wireless circuit module capable of insulating and suppressing electromagnetic waves and manufacturing method thereof

Abstract

The invention discloses a wireless circuit module capable of insulating and inhibiting electromagnetic waves and a manufacturing method, and the wireless circuit module comprises a circuit board, a plurality of electronic elements and at least one wireless transceiver chip are welded on the surface of the circuit board, a metal shielding frame is arranged outside the plurality of electronic elements in a surrounding manner, and the bottom side of the metal shielding frame is connected to a copper foil layer in the circuit board; the insulating layer is coated on the surfaces of the circuit board and the plurality of electronic elements and is fused to form the insulating layer, but the insulating layer is not covered on the surface of the metal shielding frame; the shielding heat conduction layer is coated on a part of the insulating layer and on the surfaces of the wireless transceiver chip and the metal shielding frame, and a shielding heat conduction layer is formed on the shielding heat conduction layer; and the protective scratch-resistant layer is coated on the surface of the shielding heat-conducting layer and a part of the insulating layer, and a three-layer structure in which the protective scratch-resistant layer is larger than the insulating layer and the insulating layer is larger than the shielding heat-conducting layer is formed.

Description

Wireless circuit module capable of insulating and suppressing electromagnetic waves and manufacturing method thereof Technical Field

[0001] The present invention relates to a wireless circuit module capable of insulating and suppressing electromagnetic waves and a manufacturing method. Specifically, the present invention relates to a wireless circuit module in which electromagnetic waves, noise, and other interference from multiple electronic components and wireless transceiver chips on the module are guided through a shielding heat-conducting layer to a metal shielding frame and a copper foil layer within a circuit board for grounding and elimination. Heat energy from the multiple electronic components and wireless transceiver chips is then conducted through the shielding heat-conducting layer to the surface of a protective anti-scratch layer for rapid dissipation. This conforms to the trend toward lighter, thinner, shorter, and smaller electronic devices and effectively reduces the production cost of wireless circuit modules. Background Art

[0002] Due to the rapid changes of the times and the ever-changing technology, people now pursue a more convenient and faster life. Portable electronic devices (such as smartphones, tablets, laptops and other electronic products) are becoming more and more common and increasingly important in modern life. They have almost become an indispensable part of daily life. Coupled with the rise of the Internet and social networking sites, a single portable electronic device can handle most tasks. Whether it is communication, the Internet, multimedia applications (such as videos or games) or a variety of information, they can all be easily obtained, used or disseminated on portable electronic devices.

[0003] However, various portable electronic devices currently require electricity to start and operate. Therefore, various portable electronic devices are equipped with batteries to supply power. The batteries transmit power to various functional circuit boards to provide the power required for the circuit boards to operate. The power can be transmitted between the batteries and the circuit boards through electrical connectors. However, current electrical connectors used for power transmission utilize snap-fit ​​or clip-on assembly and positioning between the base and multiple terminals before being used directly for power transmission. However, these connectors still present some drawbacks and inconveniences in practical application and implementation. For example, after the electrical connector is assembled and positioned, a gap forms between the base and the multiple terminals, which can easily allow moisture to penetrate the circuit board through the electrical connector, causing corrosion and oxidation of the multiple contacts and pins of various electronic components on the circuit board. This can easily affect the operation of the circuit board and cause abnormal short circuits or open circuits. Furthermore, when electronic devices are exposed to rain or are accidentally spilled with other liquids containing water, moisture can easily cause short circuits within the electronic device, affecting its functionality. Therefore, the waterproofness of circuit boards is gradually receiving attention from developers.

[0004] Furthermore, current electronic devices (especially those with wireless circuit modules inside) require a large amount of signal processing, and their signal processing also needs to become high-speed. Therefore, during the use of the electronic device, the electronic components inside it will generate electromagnetic waves, crosstalk interference, and high heat energy, and will interfere with other electronic devices, or cause the internal electronic components to interfere with each other and fail to operate normally. Based on the above, in order to solve the problems of electromagnetic waves, crosstalk interference, and heat dissipation, some manufacturers install metal covers on the circuit boards of electronic devices to cover the top of the electronic components through the metal covers, and then use the metal covers to sense, absorb, and shield electromagnetic waves and crosstalk interference and provide heat dissipation. However, current electronic devices are developing towards the trend of being lighter, thinner, shorter, and smaller. The installation of metal covers will increase the overall thickness of the electronic device, and the mold opening and assembly of the metal covers will also consume a lot of manufacturing time and cost, which cannot effectively improve the market competitiveness of the electronic device.

[0005] Therefore, how to solve the above-mentioned problems of electronic devices such as waterproofness, electromagnetic wave protection, crosstalk interference, and heat dissipation, while at the same time complying with the development trend of electronic devices becoming lighter, thinner, shorter, and smaller, is the direction that manufacturers engaged in this industry are urgently researching and improving.

[0006] Summary of the Invention

[0007] Therefore, in view of the above problems and deficiencies, an object of the present invention is to provide a wireless circuit module and a manufacturing method that can insulate and suppress electromagnetic waves.

[0008] The present invention provides a wireless circuit module capable of insulating and suppressing electromagnetic waves, comprising: a circuit board, a plurality of electronic components and at least one wireless transceiver chip being welded on its surface, a metal shielding frame being provided around the outer periphery of the plurality of electronic components, and the bottom side of the metal shielding frame being connected to a copper foil layer inside the circuit board; an insulating layer being coated on the surfaces of the circuit board and the plurality of electronic components and fused to form an insulating layer, but not covering the surface of the metal shielding frame with the insulating layer; a shielding heat-conducting layer being coated on a portion of the insulating layer, the wireless transceiver chip, and the surface of the metal shielding frame to form a shielding heat-conducting layer; and a protective anti-scratch layer being coated on the surface of the shielding heat-conducting layer and a portion of the insulating layer to form a three-layer structure in which the protective anti-scratch layer is larger than the insulating layer, and the insulating layer is larger than the shielding heat-conducting layer. Through the above, electromagnetic waves, noise and other interferences from multiple electronic components and wireless transceiver chips are guided through the shielding heat-conducting layer to the metal shielding frame and the copper foil layer inside the circuit board for grounding and elimination. The heat energy from the multiple electronic components and wireless transceiver chips can be conducted through the shielding heat-conducting layer to the surface of the protective anti-scratch layer for rapid dissipation, which can meet the trend of electronic devices being lighter, thinner, shorter and smaller, and can effectively reduce the production cost of manufacturing wireless circuit modules.

[0009] In one embodiment of the present invention, the insulating layer comprises: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer cross-linking agent; and 10% to 30% by weight of ionized water.

[0010] In one embodiment of the present invention, the components of the shielding heat-conducting layer include: a base material with a weight percentage of 20% to 50%; an adhesive with a weight percentage of 0.5% to 20%; a polymer material cross-linking agent with a weight percentage of 0.5% to 30%; and deionized water with a weight percentage of 10% to 30%.

[0011] In one embodiment of the present invention, the protective anti-scratch layer comprises: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer cross-linking agent; and 10% to 30% by weight of deionized water. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] FIG1 is a schematic diagram of a first step of manufacturing a wireless circuit module according to the present invention.

[0013] FIG. 2 is a schematic diagram of a second step of manufacturing a wireless circuit module according to the present invention.

[0014] FIG3 is a schematic diagram of a third step of manufacturing a wireless circuit module according to the present invention.

[0015] FIG. 4 is a schematic diagram of a fourth step of manufacturing a wireless circuit module according to the present invention.

[0016] FIG5 is a flow chart of a method for manufacturing a wireless circuit module according to the present invention.

[0017] Explanation of reference numerals: 1-circuit board; 11-copper foil layer; 2-electronic component; 21-wireless transceiver chip; 3-metal shielding frame; 4-insulating layer; 5-shielding heat-conducting layer; 6-protective anti-scratch layer; 71-first atomizing device; 72-second atomizing device;

[0018] 81- Provide a circuit board with a plurality of electronic components soldered to its surface, wherein the plurality of electronic components include at least one wireless transceiver chip with communication functionality, and a metal shielding frame is provided around the outer periphery of the plurality of electronic components, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board;

[0019] 82- coating the insulating material on the surface of the circuit board and the plurality of electronic components and fusing them to form a thin film insulating layer, but not coating the insulating material on the surface of the metal shielding frame and forming the insulating layer;

[0020] 83- is coated on a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame to form a thin film-shaped shielding and heat-conducting layer that can shield the top side electromagnetic waves;

[0021] 84- A protective anti-scratch layer is formed on the surface of the shielding heat-conducting layer and on the portion of the insulating layer not covered by the shielding heat-conducting layer, and a three-layer structure is formed in which the protective anti-scratch layer is larger than the insulating layer and the insulating layer is larger than the shielding heat-conducting layer. DETAILED DESCRIPTION

[0022] In order to achieve the above-mentioned objectives and effects, the technical means and their structures, implementation methods, etc. adopted by the present invention are illustrated in detail below with reference to the preferred embodiments of the present invention, and their features and functions are described for a complete understanding.

[0023] Please refer to Figures 1 to 4, which are schematic diagrams of the first, second, third, and fourth steps of manufacturing a wireless circuit module according to the present invention. As can be clearly seen from the figures, the present invention is a wireless circuit module that can insulate and suppress electromagnetic waves. Its main components and features are detailed as follows:

[0024] A circuit board 1 has a plurality of electronic components 2 soldered onto its surface, wherein the plurality of electronic components 2 include at least one wireless transceiver chip 21 with communication function. A metal shielding frame 3 for shielding electromagnetic waves is provided around the outer ring of the plurality of electronic components 2, and the bottom side of the metal shielding frame 3 is connected to a copper foil layer 11 inside the circuit board 1 that can serve as a ground.

[0025] As shown in Figures 1 and 2, the insulating layer 4 is formed by a computer-controlled first piezoelectric dispensing device (not shown) that non-contactly applies insulating material to the surfaces of the circuit board 1 and the plurality of electronic components 2, where the insulating material is fused to form a thin film-like insulating layer. However, the insulating material is not applied to the surface of the metal shielding frame 3 to form the insulating layer 4, while the insulating material is applied or not applied to the surface of the wireless transceiver chip 21 to form the insulating layer 4. The aforementioned first piezoelectric dispensing device is no different from commonly available products that convert electrical energy into mechanical vibration, so it is not separately illustrated or explained in text. The first piezoelectric dispensing device can also be implemented using other non-piezoelectric dispensing devices and is also within the scope of protection of the present invention.

[0026] As shown in Figure 3, the shielding heat-conducting layer 5 is sprayed and coated on a part of the insulating layer 4, the wireless transceiver chip 21 and the surface of the metal shielding frame 3 by a first atomizing device 71, and a thin film-shaped shielding heat-conducting layer 5 that can shield the top side electromagnetic waves is formed; and the shielding heat-conducting layer 5 is directly formed on the surface of the wireless transceiver chip 21, unlike other electronic components 2 The surface is first formed with an insulating layer 4 and then formed with a shielding heat-conducting layer 5, which can further enhance the shielding and heat-conducting effects of the wireless transceiver chip 21 (the thickness of the shielding heat-conducting layer 5 is larger).

[0027] As shown in Figure 4 , the protective anti-scratch layer 6 is applied to the surface of the shielding thermal conductive layer 5 and the portion of the insulating layer 4 not covered by the shielding thermal conductive layer 5 by a second atomizing device 72 or a second piezoelectric dispensing device (not shown). This results in a three-layer structure in which the protective anti-scratch layer 6 is larger than the insulating layer 4, and the insulating layer 4 is larger than the shielding thermal conductive layer 5. The aforementioned second piezoelectric dispensing device is also no different from commonly available commercial products, so it is not separately illustrated or explained in text. The second piezoelectric dispensing device can also be implemented using other non-piezoelectric dispensing devices and is also within the scope of protection of the present invention.

[0028] It should be particularly noted that the three-layer film structure of the insulating layer 4, the shielding thermal conductive layer 5 and the protective anti-scratch layer 6 formed above the wireless circuit module of the present invention is larger in area than the shielding thermal conductive layer 5, and is bonded to each other through the polymer cross-linking agent contained in the three-layer film structure. The edges of the insulating layer 4 and the protective anti-scratch layer 6 on both sides are tightly fitted and cover the shielding thermal conductive layer 5, thus forming a structure like "hot-pressed toast" (as shown in Figure 4). When repairing the wireless circuit module, this structure only needs to be lifted up from one edge and opened to completely separate it from the circuit board 1, making it easier to reprocess or repair the circuit board.

[0029] The insulating layer 4 comprises: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer crosslinking agent; and 10% to 30% by weight of deionized water. The 30% to 90% by weight base material of the insulating layer 4 comprises one or a combination of polyurethane, polyimide, polycarbonate, polyamide, epoxy resin, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer, or polyolefin; and the 0.5% to 30% by weight polymer crosslinking agent comprises high imine methyl ether melamine resin (hmmm), aziridine, carbodiimide, or epoxy crosslinking agent, and further targets amino (-NH2), carboxyl (-COOH), and amide (-CONH- or -NHCO-) ​​functional groups.

[0030] The components of the above-mentioned shielding heat-conducting layer 5 include: 20% to 50% by weight of a base material; 0.5% to 20% by weight of a binder; 0.5% to 30% by weight of a polymer cross-linking agent; and 10% to 30% by weight of deionized water; and the shielding heat-conducting layer 5 includes 20% to 50% by weight of the base material including: nano-carbon tubes, graphene and silver-coated copper; and 0.5% to 20% by weight of the binder including: polyurethane, polyimide, polycarbonate, polyamide , polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer, or polyolefin, or a combination thereof; 0.5% to 30% by weight of the polymer material crosslinking agent includes: high imine methyl ether melamine resin (hmmm), aziridine, or carbodiimide, and further targets amino (-NH2), carboxyl (-COOH), and amide bond (-CONH- or -NHCO-) ​​functional groups. The thickness of the heat-shielding conductive layer 5 ranges from 1 to 150 μm (micrometers), and the preferred embodiment of the heat-shielding conductive layer 5 can be 20 to 60 μm (micrometers); the silver-clad copper has a flake structure, and its particle length ranges from 10 to 100 μm.

[0031] The protective anti-scratch layer 6 comprises: 30% to 90% by weight of a base material; 0.5% to 30% by weight of a polymer cross-linking agent; and 10% to 30% by weight of deionized water. The base material comprising 30% to 90% by weight of the protective anti-scratch layer 6 comprises one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer, or polyolefin; and the polymer cross-linking agent comprising 0.5% to 30% by weight comprises high imine methyl etherified melamine resin (hmmm), aziridine, or carbodiimide, and further targets amino (-NH2), carboxyl (-COOH), and amide (-CONH- or -NHCO-) ​​functional groups.

[0032] The insulating layer 4, the shielding heat-conducting layer 5 and the protective anti-scratch layer 6 formed in sequence above, the base material components of the insulating layer 4: one of polyurethane, polyimide, polycarbonate, polyamide, polyethylene imine or a combination thereof, the binder of the shielding heat-conducting layer 5: one of polyurethane, polyimide, polycarbonate, polyamide, polyethylene imine or a combination thereof, and the base material components of the protective anti-scratch layer 6: one of polyurethane, polyimide, polycarbonate, polyamide, polyethylene imine or a combination thereof, and the polymer material cross-linking agent in each layer of material, further cross-linking the amino (-NH2), carboxyl (-COOH), and amide bond (-CONH- or -NHCO-) ​​functional groups of the binder of the insulating layer 4, the shielding heat-conducting layer 5 and the protective anti-scratch layer 6, can form cross-linked chains and bonds between the polymer materials of each layer, so as to provide better bonding and better bonding effect between the insulating layer 4, the shielding heat-conducting layer 5 and the protective anti-scratch layer 6.

[0033] Please refer to FIG5 , which is a flow chart of a method for manufacturing a wireless circuit module according to the present invention, comprising the following steps:

[0034] Step 81: Provide a circuit board with a plurality of electronic components soldered on its surface, wherein the plurality of electronic components include at least one wireless transceiver chip with communication function, and a metal shielding frame is provided around the outer ring of the plurality of electronic components, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board.

[0035] Step 82: An insulating material is applied to the surfaces of the circuit board and the plurality of electronic components and fused to form a thin film insulating layer, but the insulating material is not applied to the surface of the metal shielding frame to form the insulating layer; the insulating layer is applied to the surfaces of the circuit board and the plurality of electronic components in a non-contact manner by a first piezoelectric dispensing device controlled by a computer, while the insulating material is or is not applied to the surface of the wireless transceiver chip to form the insulating layer.

[0036] Step 83: Apply to a portion of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame to form a thin film-shaped shielding heat-conducting layer that can shield the top side electromagnetic waves; the shielding heat-conducting layer is sprayed and applied to a portion of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame through a first atomizing device.

[0037] Step 84: A protective anti-scratch layer is coated on the surface of the shielding thermal conductive layer and the portion of the insulating layer not covered by the shielding thermal conductive layer, and a three-layer structure is formed in which the protective anti-scratch layer is larger than the insulating layer and the insulating layer is larger than the shielding thermal conductive layer; the protective anti-scratch layer is formed by coating the surface of the shielding thermal conductive layer and the portion of the insulating layer not covered by the shielding thermal conductive layer through a second atomizing device or a second piezoelectric dispensing device.

[0038] The main features of the present invention are that electromagnetic waves, noise, and other interference from the multiple electronic components 2 and wireless transceiver chip 21 on the wireless circuit module are guided through the shielding thermal conductive layer 5 to the metal shielding frame 3 and the internal copper foil layer 11 of the circuit board 1 for grounding and elimination. Heat energy from the multiple electronic components 2 and the wireless transceiver chip 21 is then conducted through the shielding thermal conductive layer 5 (primarily through the graphene material) to the surface of the protective anti-scratch layer 6 for rapid dissipation. This conforms to the trend toward lighter, thinner, shorter, and smaller electronic devices and effectively reduces the production cost of wireless circuit modules. The present invention has excellent practicality in the field of producing wireless communication circuit boards, and therefore an application is being filed to seek patent protection.

[0039] The above description is only a preferred embodiment of the present invention and does not limit the scope of the present invention. Therefore, all simple modifications and equivalent structural changes made using the contents of the present invention description and drawings should be included in the scope of protection of the present invention and are hereby stated.

Claims

1. A wireless circuit module capable of insulating and suppressing electromagnetic waves, characterized in that: include: A circuit board, on the surface of which a plurality of electronic components are welded, and the plurality of electronic components include at least one wireless transceiver chip with a communication function, and a metal shielding frame capable of shielding electromagnetic waves is arranged around the outer circle of the plurality of electronic components, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board as a ground; An insulating layer is formed by coating insulating material on the surface of the circuit board and the plurality of electronic components and fusing them to form a thin film insulating layer, but the insulating material is not dotted on the surface of the metal shielding frame to form the insulating layer; A shielding heat-conducting layer is coated on a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame and forms a thin film-shaped shielding heat-conducting layer capable of shielding top-side electromagnetic waves; as well as A protective anti-scratch layer is coated on the surface of the shielding heat-conducting layer and the part of the insulating layer not covered by the shielding heat-conducting layer, and forms a three-layer structure in which the protective anti-scratch layer is larger than the insulating layer and the insulating layer is larger than the shielding heat-conducting layer.

2. The wireless circuit module capable of insulating and suppressing electromagnetic waves as claimed in claim 1, characterized in that: The insulating layer is formed by applying insulating material to the surface of the circuit board and the plurality of electronic components by a first piezoelectric dispensing device controlled by a computer in a non-contact manner, while the surface of the wireless transceiver chip is dotted with the insulating material or not dotted with the insulating material to form the insulating layer; the shielding thermal conductive layer is sprayed on a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame by a first atomizing device; the protective anti-scratch layer is formed by applying a second atomizing device or a second piezoelectric dispensing device on the surface of the shielding thermal conductive layer and the part of the insulating layer not covered by the shielding thermal conductive layer.

3. The wireless circuit module capable of insulating and suppressing electromagnetic waves as claimed in claim 1, characterized in that: The components of the insulating layer include: a base material and a polymer material crosslinking agent, the base material components include: one or a combination of polyurethane, polyimide, polycarbonate, polyamide, epoxy resin, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the polymer material crosslinking agent includes: high imine methyl etherified melamine resin or aziridine or carbodiimide or epoxy crosslinking agent, and further targets amino, carboxyl and amide bond functional groups.

4. The wireless circuit module capable of insulating and suppressing electromagnetic waves as claimed in claim 1, wherein: The components of the shielding heat-conducting layer include: a base material, an adhesive and a polymer material cross-linking agent, wherein the base material components include: carbon nanotubes, graphene and silver-coated copper; the adhesive includes: one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethylene imine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the polymer material cross-linking agent includes: high-imine methyl etherified melamine resin or aziridine or carbodiimide, and further targets amino, carboxyl and amide bond functional groups; the thickness of the shielding heat-conducting layer ranges from 1 to 150 μm, and the thickness of the shielding heat-conducting layer further ranges from 20 to 60 μm; the silver-coated copper has a lamellar structure, and its particle length ranges from 10 to 100 μm.

5. The wireless circuit module capable of insulating and suppressing electromagnetic waves as claimed in claim 1, wherein: The components of the protective anti-scratch layer include: a base material and a polymer material cross-linking agent, the base material components include: one or a combination of polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethylene imine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin; the polymer material cross-linking agent includes: high imine methyl etherified melamine resin or aziridine or carbodiimide, and further targets amino, carboxyl and amide bond functional groups.

6. A method for manufacturing a wireless circuit module capable of insulating and suppressing electromagnetic waves, characterized in that: The following steps are included: (A) providing a circuit board with a plurality of electronic components soldered on its surface, wherein the plurality of electronic components include at least one wireless transceiver chip with a communication function, and a metal shielding frame is provided around the outer ring of the plurality of electronic components, and the bottom side of the metal shielding frame is connected to a copper foil layer inside the circuit board; (B) coating the insulating material on the surface of the circuit board and the plurality of electronic components and fusing them to form a thin film insulating layer, but not applying the insulating material or forming the insulating layer on the surface of the metal shielding frame; (C) a thin film-shaped shielding and heat-conducting layer is coated on a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame and is capable of shielding electromagnetic waves on the top side; and (D) A protective anti-scratch layer is coated on the surface of the shielding thermal conductive layer and on the portion of the insulating layer not covered by the shielding thermal conductive layer, and a three-layer structure is formed in which the protective anti-scratch layer is larger than the insulating layer and the insulating layer is larger than the shielding thermal conductive layer.

7. The method for manufacturing a wireless circuit module capable of insulating and suppressing electromagnetic waves as claimed in claim 6, wherein: In the step (B), the insulating layer is formed by applying the insulating material on the surface of the circuit board and the plurality of electronic components in a non-contact manner by a first piezoelectric dispensing device controlled by a computer, while the surface of the wireless transceiver chip is coated with or not coated with the insulating material to form the insulating layer.

8. The method for manufacturing a wireless circuit module capable of insulating and suppressing electromagnetic waves as claimed in claim 6, wherein: In the step (C), the shielding heat-conducting layer is sprayed and coated on a part of the insulating layer, the wireless transceiver chip and the surface of the metal shielding frame by a first atomizing device.

9. The method for manufacturing a wireless circuit module capable of insulating and suppressing electromagnetic waves as claimed in claim 6, wherein: In the step (D), the protective anti-scratch layer is coated and formed on the surface of the shielding heat-conducting layer and the part of the insulating layer not covered by the shielding heat-conducting layer by a second atomizing device or a second piezoelectric dispensing device.

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