An AOI inspection machine and inspection method

Abstract

The present invention relates to an AOI inspection machine and an inspection method. The AOI inspection machine includes a frame, a conveying device, a first inspection device, and a second inspection device. The first inspection device is configured to obtain the appearance information of a wafer and the first position information of the wafer on a substrate, perform a first inspection determination based on the appearance information and the first position information, mark it if it is unqualified, and proceed to the next inspection process if it is qualified; the second inspection device is configured to obtain the position feature information of a wire on an optical device, perform a second inspection determination based on the position feature information, determine that the optical device is a qualified product if it is qualified, and mark it if it is unqualified. Since the first inspection component and the second inspection component are provided, the appearance defects on the surface of the wafer and the position and angle of the wafer are first inspected, and then the three-dimensional shape information of the wire is obtained by the second inspection component and compared with a preset position feature range, which is beneficial to improving the consistency of optical device products.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular, to an AOI inspection machine and an inspection method. Background Art

[0002] Semiconductor AOI (Automated Optical Inspection) equipment is most widely used in the electronic manufacturing industry. AOI can screen out defective NG products and give an alarm in time to reduce the defective rate of products leaving the factory. The AOI inspection principle is to use imaging technology to output the reflected light intensity of the object to be inspected as a quantified grayscale value, and by comparing it with the grayscale value of the standard image, analyze and determine defects and classify them. Making an image analogy with manual inspection, the ordinary LED or special light source used in AOI is equivalent to the natural light during manual inspection, the optical sensor and optical lens used in AOI are equivalent to the human eye, and the image processing and analysis system of AOI is equivalent to the human brain, that is, the two links of "seeing" and "judging". Therefore, the working logic of AOI inspection can be simply divided into four stages: image acquisition stage (optical scanning and data collection), data processing stage (data classification and conversion), image analysis stage (feature extraction and template comparison), and defect reporting stage (defect size type classification, etc.). In order to support and implement the above four functions of AOI inspection, the hardware system of AOI equipment also includes four parts: a working platform, an imaging system, an image processing system, and an electrical system, which is an automated equipment integrating multiple disciplines such as machinery, automation, optics, and software.

[0003] In the prior art, AOI inspection equipment usually only performs one inspection on semiconductor products, and usually can only detect defects in the planar dimension of semiconductor products. Semiconductor products usually include PCB boards, wafers, and wires. The wafer is arranged on the PCB board, and the PCB board and the wafer are electrically connected through wires. When the wire is connected between the wafer and the PCB board, the bending degree and height of the wire will be different due to bending, resulting in poor consistency of semiconductor products. In the application of some high-end equipment or precision instruments, if the height of the wire is too high, it may cause other components to be blocked and prevent their use. In addition, if multiple wires of semiconductor products cross or overlap, it will cause a short circuit in the circuit, resulting in serious consequences that the semiconductor product or even the entire equipment cannot be used. Summary of the Invention

[0004] The first object of the present invention is to provide an AOI inspection machine, which aims to solve the technical problem that the existing AOI inspection equipment can only perform one defect inspection on the planar dimension of semiconductor products, and the lack of inspection dimensions leads to poor consistency of semiconductor products.

[0005] To solve the above technical problems, an AOI inspection machine is provided, which is applied to optical devices. The optical device includes a substrate, a wafer, and a wire. The wafer is disposed on the substrate, and the substrate and the wafer are electrically connected through the wire. The AOI inspection machine includes:

[0006] A frame including a first detection position and a second detection position;

[0007] A conveying device for sequentially moving the optical device on the jig to the first detection position and the second detection position;

[0008] A first detection device including a first mounting frame, a first detection component, and a first light source component. The first light source component is slidably mounted on the first mounting frame to adjust the position height of the first light source component, and the first light source component is disposed between the first detection component and the conveying device. The first detection component is connected to the first mounting frame;

[0009] A second detection device including a second mounting frame, a second detection component, and a second light source component. The second light source component is slidably mounted on the second mounting frame to adjust the position height of the second light source component, and the second light source component is disposed between the second detection component and the conveying device. The second detection component is connected to the second mounting frame;

[0010] Wherein, the first detection device is configured to obtain the appearance information of the wafer and the first position information of the wafer on the substrate, perform a first detection determination according to the appearance information and the first position information, mark it if it is unqualified, and proceed to the next detection process if it is qualified; the second detection device is configured to obtain the position feature information of the wire on the optical device, perform a second detection determination according to the position feature information, determine that the optical device is a qualified product if it is qualified, and mark it if it is unqualified.

[0011] Further, the first detection device further includes a first adjustment component. The first detection component is mounted on the first mounting frame through the first adjustment component, and the first adjustment component is used to adjust the position of the first detection device;

[0012] The second detection device further includes a second adjustment component. The second detection component is mounted on the second mounting frame through the second adjustment component, and the second adjustment component is used to adjust the position of the second detection device.

[0013] Further, the first light source assembly includes a first sliding rod, a first carrier plate, and a first light source member. The first sliding rod and the first light source member are respectively fixedly installed on the first carrier plate. The first mounting bracket includes a first sliding slot and a first fixing member. The first sliding rod is engaged with the first sliding slot, and the first fixing member acts on the first sliding rod to make the first sliding rod in a movable or fixed state;

[0014] The second light source assembly includes a second sliding rod, a second carrier plate, and a second light source member. The second sliding rod and the second light source member are respectively fixedly installed on the second carrier plate. The second mounting bracket includes a second sliding slot and a second fixing member. The second sliding rod is engaged with the second sliding slot, and the second fixing member acts on the second sliding rod to make the second sliding rod in a movable or fixed state.

[0015] Further, the first light source member includes a first light emitting surface and a first through hole. The first through hole is disposed directly above the first detection position, and the first light emitting surface is used to emit light along the Z-axis direction; the second light source member includes a second light emitting surface and a second through hole. The second through hole is disposed directly above the second detection position, and the second light emitting surface is used to form an irradiation space within the circumferential range of the second detection.

[0016] Further, the conveying device includes a conveying track, a moving gripper, a first in-place sensor, and a second in-place sensor. The moving gripper is connected to the conveying track to drive the optical device to move. The first in-place sensor is disposed at the first detection position, and the second in-place sensor is disposed at the second detection position.

[0017] Further, the AOI inspection machine further includes a loading module and an unloading module disposed at opposite ends of the conveying device. The loading module includes a main body frame, a bracket, and an X-axis moving component, a Y-axis moving component, and a Z-axis moving component all installed on the main body frame. The bracket is connected to the Z-axis moving component, and the bracket is used to carry the fixtures in the cassette. The unloading module is configured to have the same structure as the loading module.

[0018] Further, the main body frame includes a loading position and a first cavity and a second cavity independently provided respectively. The Z-axis moving component is disposed in the first cavity, the Y-axis moving component is disposed in the second cavity, and the height position of the X-axis moving component is flush with the loading position;

[0019] The Y-axis moving component includes a Y-axis motor, a belt, a driving wheel, a driven wheel, and a moving member. The driving wheel is connected to the Y-axis motor, the driving wheel and the driven wheel are coupled by the belt, the moving member is connected to the belt, and the moving member is formed with a plurality of placement positions for placing the cassettes;

[0020] The Z-axis moving component includes a Z-axis motor, a ball screw, a guide rod, and a first slider. The Z-axis motor and the guide rod are fixedly installed on the main frame. The first slider is slidably installed on the ball screw and the guide rod, and the bracket is connected to the first slider.

[0021] Furthermore, the Y-axis moving component further includes a guide rail and a second slider. The second slider is slidably installed on the guide rail. The moving member includes a moving plate and a plurality of cylinder groups fixedly installed on the moving plate. The plurality of cylinder groups are arranged at intervals on the moving plate, and a placement position is formed between adjacent cylinder groups. The moving plate is fixedly connected to the second slider.

[0022] The second object of the present invention is to provide a detection method, using the above AOI inspection machine. The method includes:

[0023] Presetting appearance defect features, position deviation ranges, and position feature ranges;

[0024] Moving the optical device to the first detection position through the conveying device;

[0025] Obtaining the appearance information of the wafer and the first position information of the wafer on the substrate;

[0026] Comparing the first position information with the position deviation range, and comparing the appearance information with the appearance defect features. If the first position information is within the position deviation range and the appearance information does not conform to the appearance defect features, then transfer the optical device to the second detection position for the next detection process. If the first position information exceeds the position deviation range and / or the appearance information conforms to the appearance defect features, then mark it;

[0027] Obtaining the position feature information of the wire on the optical device;

[0028] Comparing the position feature information with the position feature range. If the position feature information conforms to the position feature range, then determine that the optical device is qualified. If the position feature information does not conform to the position feature range, then mark it.

[0029] Further, the position feature information includes the height information, length information, and bending angle information of the wire, and the position feature range includes a height position range, a length position range, and a bending angle range. Among them, the height information is compared with the height position range, the length information is compared with the length position range, and the bending angle information is compared with the bending angle range. If any one of the height information, the length information, and the bending angle information does not conform to the position feature range, it is determined that the optical device is unqualified.

[0030] Implementing the embodiments of the present invention will have the following beneficial effects:

[0031] In one embodiment, the AOI inspection machine of the present application, due to the setting of the first detection component and the second detection component, first checks the appearance defects on the surface of the wafer and the position angle of the wafer set on the substrate through the first detection component. At this time, mainly the top surface of the wafer is detected. After confirming that the wafer is not damaged and the position of the wafer is okay, then the three-dimensional shape information of the wire is obtained through the second detection component, specifically including the height information, length information, and bending angle information of the wire, and compared with the preset position feature range. This makes the position of the wire meet strict technical requirements, avoids circuit failures or performance degradation caused by wire position deviation, and is beneficial to improving the consistency of optical device products;

[0032] In another embodiment, both the first detection device and the second detection device are equipped with adjustment components, and these adjustment components allow precise adjustment of the position of the detection piece to focus. In addition, the first light source component is slidably mounted on the first mounting frame, and the second light source component is slidably mounted on the second mounting frame. This enables the height positions of the first light source component and the second light source component to be adjusted, facilitating the user to adjust the light source according to the actual situation to achieve the best lighting environment, so that the first detection component and the second detection component can obtain clearer pictures, which is beneficial to further improving the accuracy of the detection results. Description of the Drawings

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0034] Figure 1 It is a schematic structural diagram of the AOI inspection machine according to the embodiment of the present invention;

[0035] Figure 2 It is a top view of the AOI inspection machine according to the embodiment of the present invention;

[0036] Figure 3 Schematic diagram of the structure of the first detection device according to an embodiment of the present invention from one perspective;

[0037] Figure 4 Schematic diagram of the structure of the first detection device according to an embodiment of the present invention from another perspective;

[0038] Figure 5 Schematic diagram of the structure of the second detection device according to an embodiment of the present invention from one perspective;

[0039] Figure 6 Schematic diagram of the structure of the second detection device according to an embodiment of the present invention from another perspective;

[0040] Figure 7 Schematic diagram of the structure of the conveying device according to an embodiment of the present invention;

[0041] Figure 8 Schematic diagram of the structure of the loading module according to an embodiment of the present invention;

[0042] Figure 9 Schematic diagram of the structure of the loading module after removing part of the main frame according to an embodiment of the present invention;

[0043] Figure 10 Schematic diagram of the structure of the combination of the Y-axis moving component and the Z-axis moving component according to an embodiment of the present invention;

[0044] Figure 11 Front view of the combination of the Y-axis moving component and the Z-axis moving component according to an embodiment of the present invention;

[0045] Figure 12 Schematic diagram of the structure of the optical device according to an embodiment of the present invention;

[0046] Figure 13 is Figure 12 Partial enlarged schematic diagram at A in;

[0047] Figure 14 Top view of the optical device according to an embodiment of the present invention;

[0048] Figure 15 Schematic diagram of the jig placed in the magazine according to an embodiment of the present invention;

[0049] Figure 16 Schematic diagram of the optical device placed on the jig according to an embodiment of the present invention;

[0050] Figure 17 Detection method for detecting the quality of an optical device using the AOI detector according to an embodiment of the present invention.

[0051] Wherein: 100, AOI inspection machine; 110, frame; 111, first inspection position; 112, second inspection position; 120, conveying device; 121, conveying track; 122, moving gripper; 123, first in-place sensor; 124, second in-place sensor; 130, first inspection device; 131, first mounting bracket; 1311, first sliding groove; 132, first inspection component; 133, first light source component; 1331, first sliding rod; 1332, first bearing plate; 1333, first light source element; 1333A, first light-emitting surface; 1333B, first through hole; 134, first adjustment component; 140, second inspection device; 141, second mounting bracket; 1411, second sliding groove; 142, second inspection component; 143, second light source component; 1431, second sliding rod; 1432, second bearing plate; 1433, second light source element; 1433A, second light-emitting surface; 1433B, second through hole; 144, second adjustment component; 150, loading module; 151, main body frame; 1511, first cavity; 1512, second cavity; 152, bracket; 153, X-axis moving component; 154, Y-axis moving component; 1541, Y-axis motor; 1542, belt; 1543, driving pulley; 1544, driven pulley; 1545, moving part; 1545A, moving plate; 1545B, cylinder group; 1545C, placing position; 1546, guide rail; 1547, second slider; 155, Z-axis moving component; 1551, Z-axis motor; 1552, ball screw; 1553, guide rod; 1554, first slider; 160, unloading module;

[0052] 200, optical device; 210, substrate; 220, wafer; 230, wire;

[0053] 300, cassette; 310, material placing groove;

[0054] 400, fixture; 410, placing groove. Detailed implementation manners

[0055] For ease of understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided so that the understanding of the disclosure of the present invention is more thorough and comprehensive.

[0056] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element present at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0058] Please refer to Figures 1 - 16, an embodiment of the present invention provides an AOI inspection machine 100, which is applied to an optical device 200. The optical device 200 includes a substrate 210, a wafer 220, and a wire 230. The wafer 220 is disposed on the substrate 210, and the substrate 210 and the wafer 220 are electrically connected through the wire 230. The AOI inspection machine 100 includes a frame 110, a conveying device 120, a first detection device 130, and a second detection device 140. The frame 110 includes a first detection position 111 and a second detection position 112. The conveying device 120 is configured to sequentially move the optical device 200 on the jig 400 to the first detection position 111 and the second detection position 112. The first detection device 130 includes a first mounting bracket 131, a first detection component 132, and a first light source component 133. The first light source component 133 is slidably mounted on the first mounting bracket 131 to adjust the position height of the first light source component 133, and the first light source component 133 is disposed between the first detection component 132 and the conveying device 120. The first detection component 132 is connected to the first mounting bracket 131. The second detection device 140 includes a second mounting bracket 141, a second detection component 142, and a second light source component 143. The second light source component 143 is slidably mounted on the second mounting bracket 141 to adjust the position height of the second light source component 143, and the second light source component 143 is disposed between the second detection component 142 and the conveying device 120. The second detection component 142 is connected to the second mounting bracket 141. Wherein, the first detection device 130 is configured to obtain the appearance information of the wafer 220 and the first position information of the wafer 220 on the substrate 210, perform a first detection determination according to the appearance information and the first position information. If it is unqualified, it will be marked. If it is qualified, the next detection process will be carried out; the second detection device 140 is configured to obtain the position feature information of the wire 230 on the optical device 200, perform a second detection determination according to the position feature information. If it is qualified, the optical device 200 is determined to be a qualified product. If it is unqualified, it will be marked. Exemplarily, the marking of the unqualified optical device 200 mentioned above refers to <map>A label for client - side image mapping. That is, when a non - compliant optical device 200 is detected, the AOI inspection machine 100 of the present application will not reject it but will package it together. When the user uses it, the user can view the position and quantity of the non - compliant optical devices 200 in the whole box of optical devices 200, etc.

[0059] In addition, it should be noted that in this embodiment, the AOI inspection machine 100 is provided with two inspection positions, namely the first inspection position 111 and the second inspection position 112. Corresponding inspection devices are arranged at each inspection position to inspect the optical device 200. Of course, in specific applications, the number of inspection positions is not limited to this. Corresponding inspections can be configured according to its requirements and functions. For example, as an alternative solution, the number of inspection positions can be set to one, or three, or four. When multiple inspection positions are provided, the multiple inspection positions can be arranged in a linear distribution in a straight line or in a disk - rotating distribution.

[0060] Please refer to Figure 1 and Figure 2 In this embodiment, for the AOI inspection machine 100 of the present application, due to the setting of the first detection component 132 and the second detection component 142, first, the appearance defects on the surface of the wafer 220 and the position angle of the wafer 220 arranged on the substrate 210 are inspected by the first detection component 132. At this time, the top surface of the wafer 220 is mainly detected. After confirming that the wafer 220 is not damaged and the position of the wafer 220 is okay, the three - dimensional shape information of the wire 230 is obtained by the second detection component 142, specifically including the height information, length information, and bending angle information of the wire 230, and compared with the preset position feature range. This makes the position of the wire 230 meet strict technical requirements, avoiding circuit failures or performance degradation caused by the position deviation of the wire 230;

[0061] Please refer to Figure 4 and Figure 6 , in a possible implementation, the first detection device 130 further includes a first adjustment component 134. The first detection component 132 is installed on the first mounting bracket 131 through the first adjustment component 134, and the first adjustment component 134 is used to adjust the position of the first detection device 130. The second detection device 140 further includes a second adjustment component 144. The second detection component 142 is installed on the second mounting bracket 141 through the second adjustment component 144, and the second adjustment component 144 is used to adjust the position of the second detection device 140. In another embodiment, both the first detection device 130 and the second detection device 140 are equipped with adjustment components, and these adjustment components allow precise adjustment of the position of the detection piece to achieve focus. Both the first adjustment component 134 and the second adjustment component 144 are two-axis movement mechanisms, which can respectively adjust the position of the detection component in the X-axis direction and the Z-axis direction, and both the first adjustment component 134 and the second adjustment component 144 are manually adjusted. In addition, the first light source component 133 is slidably installed on the first mounting bracket 131, and the second light source component 143 is slidably installed on the second mounting bracket 141. This enables the height positions of the first light source component 133 and the second light source component 143 to be adjusted, facilitating the user to adjust the light source according to the actual situation to achieve the best lighting environment, so that the first detection component 132 and the second detection component 142 can obtain clearer pictures, which is conducive to further improving the accuracy of the detection results.

[0062] Please refer to Figure 4 and Figure 5 , in a possible implementation, the first light source component 133 includes a first slide bar 1331, a first carrier plate 1332, and a first light source element 1333. The first slide bar 1331 and the first light source element 1333 are respectively fixedly installed on the first carrier plate 1332. The first mounting bracket 131 includes a first sliding groove 1311 and a first fixing member (not shown in the figure). The first slide bar 1331 cooperates with the first sliding groove 1311, and the first fixing member acts on the first slide bar 1331 to make the first slide bar 1331 in a movable or fixed state.

[0063] Please refer to Figure 6 and Figure 7 , the second light source component 143 includes a second slide bar 1431, a second carrier plate 1432, and a second light source element 1433. The second slide bar 1431 and the second light source element 1433 are respectively fixedly installed on the second carrier plate 1432. The second mounting bracket 141 includes a second sliding groove 1411 and a second fixing member (not shown in the figure). The second slide bar 1431 cooperates with the second sliding groove 1411, and the second fixing member acts on the second slide bar 1431 to make the second slide bar 1431 in a movable or fixed state. Exemplarily, the height positions of the first light source element 1333 and the second light source element 1433 are manually adjusted.

[0064] Please refer to Figure 4 and Figure 6 In a possible implementation, the first light source component 1333 includes a first light emitting surface 1333A and a first through hole 1333B. The first through hole 1333B is disposed directly above the first detection position 111, and the first light emitting surface 1333A is configured to emit light along the Z-axis direction; the second light source component 1433 includes a second light emitting surface 1433A and a second through hole 1433B. The second through hole 1433B is disposed directly above the second detection position 112, and the second light emitting surface 1433A is configured to form an illumination space within the circumferential range of the second detection. Exemplarily, since the first detection device 130 can only detect the information of the wafer 220 on a two-dimensional plane, the first light source component 1333 only needs to concentrate on irradiating the upper surface of the wafer 220. However, the second detection device 140 needs to detect the three-dimensional position information of the wire 230. Therefore, the illumination space formed by the second light source component 1433 should be able to illuminate the surroundings of the wafer 220 and the wire 230, so as to facilitate the second detection device 140 to obtain the position information on the three-dimensional solid of the guide. In addition, it should be noted that the first through hole 1333B is used to avoid the first detection component 132. The first detection component 132 obtains the image information of the wafer 220 through the first through hole 1333B. The second through hole 1433B is used to avoid the second detection component 142. The second detection component 142 obtains the image information of the wafer 220 through the second through hole 1433B.

[0065] Please refer to Figure 1 and Figure 7 In a possible implementation, the conveying device 120 includes a conveying track 121, a moving gripper 122, a first in-place sensor 123, and a second in-place sensor 124. The moving gripper 122 is connected to the conveying track 121 to drive the optical device 200 to move. The first in-place sensor 123 is disposed at the first detection position 111, and the second in-place sensor 124 is disposed at the second detection position 112. Exemplarily, the in-place sensor can ensure that the optical device 200 is accurately positioned at the first detection position 111 and the second detection position 112 during the conveying process. In addition, by automatically sensing whether the optical device 200 is in place, the waiting time and manual intervention time can be reduced, thereby improving the working efficiency of the entire AOI inspection machine 100.

[0066] Please refer to Figure 8 、 Figure 9 、 Figure 10 and Figure 11 , in a possible implementation, the AOI inspection machine 100 further includes a loading module 150 and an unloading module 160 disposed at opposite ends of the conveying device 120. The loading module 150 includes a main frame 151, a bracket 152, and an X-axis moving component 153, a Y-axis moving component 154, and a Z-axis moving component 155 all installed on the main frame 151. The bracket 152 is connected to the Z-axis moving component 155. The bracket 152 is used to carry the fixture 400 in the cassette 300. The unloading module 160 is configured to have the same structure as the loading module 150. Exemplarily, in this embodiment, the cassette 300 has a plurality of material placing grooves 310 for placing the fixture 400. The plurality of material placing grooves 310 are distributed at intervals in a single row. The fixture 400 is strip-shaped, and a plurality of placing grooves 410 distributed at intervals in a single row are formed on the fixture 400. The placing grooves 410 are used to place the substrate 210 or the optical device 200. In a possible implementation, the main frame 151 includes a loading position and a first cavity 1511 and a second cavity 1512 independently provided respectively. The Z-axis moving component 155 is disposed in the first cavity 1511, the Y-axis moving component 154 is disposed in the second cavity 1512, and the height position of the X-axis moving component 153 is flush with the loading position.

[0067] Please refer to Figure 8 , Figure 9 , Figure 10 and Figure 11 , the Y-axis moving component 154 includes a Y-axis motor 1541, a belt 1542, a driving wheel 1543, a driven wheel 1544, and a moving member 1545. The driving wheel 1543 is connected to the Y-axis motor 1541. The driving wheel 1543 and the driven wheel 1544 are coupled and connected by the belt 1542. The moving member 1545 is connected to the belt 1542. The moving member 1545 is formed with a plurality of placing positions 1545C for placing the cassette 300.

[0068] Please refer to Figure 8 , Figure 9 , Figure 10 and Figure 11 , the Z-axis moving component 155 includes a Z-axis motor 1551, a ball screw 1552, a guide rod 1553, and a first slider 1554. The Z-axis motor 1551 and the guide rod 1553 are fixedly installed on the main frame 151. The first slider 1554 is slidably installed on the ball screw 1552 and the guide rod 1553. The bracket 152 is connected to the first slider 1554.

[0069] Please refer to Figure 8 , Figure 9 , Figure 10 and Figure 11 , in a possible implementation, the Y-axis moving component 154 further includes a guide rail 1546 and a second slider 1547. The second slider 1547 is slidably mounted on the guide rail 1546. The moving member 1545 includes a moving plate 1545A and a plurality of cylinder groups 1545B fixedly mounted on the moving plate 1545A. The plurality of cylinder groups 1545B are arranged at intervals on the moving plate 1545A, and a placement position 1545C is formed between adjacent cylinder groups 1545B. The moving plate 1545A is fixedly connected to the second slider 1547. Exemplarily, a plurality of placement positions 1545C are formed, and one placement position 1545C can hold one cartridge 300. One cylinder group 1545B includes two cylinders respectively disposed at both ends of the moving plate 1545A. The provision of the guide rail 1546 and the second slider 1547 in the Y-axis moving component 154 is conducive to improving the stability and accuracy of the moving member 1545 during movement and improving the control accuracy. The loading process includes: the Y-axis motor 1541 is used to drive the cartridge 300 to move along the Y-axis direction so that the cartridge 300 is placed on the bracket 152. Thereafter, the Z-axis motor 1551 drives the bracket 152 to rise along the Z-axis direction to reach the loading position. Thereafter, the X-axis moving component 153 moves along the X-axis direction to push the fixture 400 in the cartridge 300 onto the track of the conveying device 120. In this embodiment, the structure of the unloading module 160 is the same as that of the loading module 150. During unloading, the moving gripper 122 of the conveying device 120 is used to push the fixture 400 into the cartridge 300. Thereafter, the Z-axis motor 1551 drives the bracket 152 to descend along the Z-axis direction. Subsequently, the Y-axis motor 1541 is used to drive the cartridge 300 to move along the Y-axis direction to move the cartridge 300 out, completing the unloading.

[0070] Please refer to Figure 17 , the second object of the present invention is to provide a detection method, using the above AOI inspection machine 100, the method includes:

[0071] Preset appearance defect features, position deviation ranges, and position feature ranges;

[0072] Move the optical device 200 to the first detection position 111 through the conveying device 120;

[0073] Obtain the appearance information of the wafer 220 and the first position information of the wafer 220 on the substrate 210; Exemplarily, the first position information includes the position distance and position angle of the wafer 220 on the substrate 210. The appearance information includes the appearance state of the upper surface of the wafer 220, and check whether there are damages, cracks, stains, etc.

[0074] Compare the first position information with the position deviation range, and compare the appearance information with the appearance defect characteristics. If the first position information is within the position deviation range and the appearance information does not conform to the appearance defect characteristics, transfer the optical device 200 to the second detection position 112 for the next detection process. If the first position information exceeds the position deviation range and / or the appearance information conforms to the appearance defect characteristics, mark it;

[0075] Obtain the position characteristic information of the wire 230 located on the optical device 200;

[0076] Compare the position characteristic information with the position characteristic range. If the position characteristic information conforms to the position characteristic range, determine that the optical device 200 is qualified. If the position characteristic information does not conform to the position characteristic range, mark it.

[0077] Please refer to Figure 13 、 Figure 14 and Figure 17 , in a possible implementation, the position feature information includes the height information, length information, and bending angle information of the wire 230, and the position feature range includes the height position range, length position range, and bending angle range. Among them, the height information is compared with the height position range, the length information is compared with the length position range, and the bending angle information is compared with the bending angle range. If any one of the height information, length information, and bending angle information does not meet the position feature range, the optical device 200 is determined to be unqualified. Exemplarily, the wafer 220 is disposed on the substrate 210. One end of the wire 230 has a solder joint with the wafer 220, and the other end has a solder joint with the substrate 210. Since the wire 230 cannot be in contact with the epitaxy of the wafer 220 to avoid circuit short - circuit, at this time, the wire 230 is in a bent state between the two solder joints. That is to say, the length of the wire 230 should be greater than the straight - line distance between the two solder joints. During assembly and manufacturing, the length of the guide wire should be controlled within a certain range. Specifically, defining the height D of the wafer 220, the height H of the wire 230 takes values within the range of [1 / 2D, D]. For example, the height H of the wire 230 can be equal to 1 / 2D, or 2 / 3D, or 3 / 4D, or 4 / 5D. Defining the distance between two adjacent wafers 220 as L, the height H of the wire 230 should satisfy H < 1 / 2L to avoid cross - contact between adjacent wires 230. It should be noted that H < 1 / 2L and 1 / 2D ≥ H ≥ D should be satisfied simultaneously. Defining the bending angle of the wire 230 as α, the value range of the bending angle α of the wire 230 is within the range of [75°, 135°]. The significance of restricting the bending angle of the wire 230 is to avoid contact between the wire 230 and the epitaxy of the wafer 220, resulting in circuit short - circuit. Defining the length of the wire 230 as S, the value range of the length S of the wire 230 is [2.5D, 5D]. On the one hand, restricting the length, bending angle, and height of the wire 230 aims to improve the product consistency. With the positions of the two solder joints fixed and then the length of the wire 230 fixed, it is more conducive to the consistency of the bending angle and height of the wire 230 during connection.

[0078] In addition, it should be noted that when applied to the specific TO optical device 200, the specific standard values of the length S, height H, and bending angle α of the wire 230 can be set according to the actual situation. The height position range, length position range, and bending angle range can all be set according to their standard values. For example, if the length S of the wire 230 is set to 4D, the bending angle α is set to 100°, and the height H is set to 3 / 4D, then 4D is the length standard value of the length S, 100° is the angle standard value of the bending angle α, and 3 / 4D is the height standard value of the height H. The height position range is the allowable deviation range of the height standard value, the length position range is the allowable deviation range of the length standard value, and the angle standard value is the allowable deviation range of the bending angle range. The length S of the wire 230 is obtained by the second detection component 142 extracting the three-dimensional stereo image of the wire 230. That is to say, the length information of the wire 230 obtained by the second detection device 140 is equal to or close to the actual length of the wire 230. Its specific value can be set according to the actual situation and will not be elaborated here.

[0079] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of this invention patent shall be subject to the appended claims.< / map>

Claims

1. An AOI inspection machine, applied to an optical device, wherein the optical device comprises a substrate, a wafer and a wire, wherein the wafer is arranged on the substrate, and the substrate and the wafer are electrically connected through the wire, wherein: The AOI inspection machine comprises: A frame, including a first detection position and a second detection position; A conveying device, used for moving the optical device on the fixture to the first detection position and the second detection position in sequence; A first detection device, comprising a first mounting frame, a first detection assembly and a first light source assembly, wherein the first light source assembly is slidably mounted on the first mounting frame to adjust the position height of the first light source assembly, and the first light source assembly is arranged between the first detection assembly and the conveying device, and the first detection assembly is connected to the first mounting frame; A second detection device, comprising a second mounting frame, a second detection assembly and a second light source assembly, wherein the second light source assembly is slidably mounted on the second mounting frame to adjust the position height of the second light source assembly, and the second light source assembly is arranged between the second detection assembly and the conveying device, and the second detection assembly is connected to the second mounting frame; The first detection device is configured to obtain appearance information of the wafer and first position information of the wafer on the substrate, and perform a first detection and determination based on the appearance information and the first position information, and mark the wafer if it is unqualified, and perform the next detection process if it is qualified; the second detection device is configured to obtain position feature information of the wire on the optical device, and perform a second detection and determination based on the position feature information, and determine the optical device as a qualified product if it is qualified, and mark the optical device if it is unqualified; The first detection device further includes a first adjustment component, the first detection component is mounted on the first mounting frame through the first adjustment component, and the first adjustment component is used to adjust the position of the first detection device; The second detection device further comprises a second adjustment component, the second detection component is mounted on the second mounting frame through the second adjustment component, and the second adjustment component is used to adjust the position of the second detection device; The first light source assembly includes a first slide bar, a first bearing plate and a first light source component, the first slide bar and the first light source component are respectively fixedly mounted on the first bearing plate, the first mounting frame includes a first sliding slot and a first fixing component, the first slide bar cooperates with the first sliding slot, and the first fixing component acts on the first slide bar to make the first slide bar in an active or fixed state; The second light source assembly includes a second sliding rod, a second supporting plate and a second light source component. The second sliding rod and the second light source component are respectively fixedly mounted on the second supporting plate. The second mounting frame includes a second sliding groove and a second fixing component. The second sliding rod cooperates with the second sliding groove. The second fixing component acts on the second sliding rod to make the second sliding rod in an active or fixed state.

2. The AOI inspection machine according to claim 1, characterized in that: The first light source component includes a first light-emitting surface and a first through hole, the first through hole is arranged directly above the first detection position, and the first light-emitting surface is used to form light emitted along the Z-axis direction; the second light source component includes a second light-emitting surface and a second through hole, the second through hole is arranged directly above the second detection position, and the second light-emitting surface is used to form an irradiation space within the circumferential range of the second detection.

3. The AOI inspection machine according to claim 1, characterized in that: The conveying device includes a conveying track, a mobile gripper, a first in-place sensor and a second in-place sensor. The mobile gripper is connected to the conveying track to drive the optical device to move. The first in-place sensor is set at the first detection position, and the second in-place sensor is set at the second detection position.

4. The AOI inspection machine according to claim 3, characterized in that: The AOI inspection machine also includes a loading module and a unloading module arranged at opposite ends of the conveying device, the loading module includes a main frame, a bracket, and an X-axis moving component, a Y-axis moving component and a Z-axis moving component all installed on the main frame, the bracket is connected to the Z-axis moving component, the bracket is used to carry the jig in the material box, and the unloading module is configured to have the same structure as the loading module.

5. The AOI inspection machine according to claim 4, characterized in that: The main frame includes a loading position and a first cavity and a second cavity which are independently arranged respectively, the Z-axis moving assembly is arranged in the first cavity, the Y-axis moving assembly is arranged in the second cavity, and the height position of the X-axis moving assembly is arranged flush with the loading position; The Y-axis moving assembly includes a Y-axis motor, a belt, a driving wheel, a driven wheel and a moving member, wherein the driving wheel is connected to the Y-axis motor, the driving wheel and the driven wheel are coupled and connected via the belt, the moving member is connected to the belt, and the moving member is formed with a plurality of placement positions for placing the material box; The Z-axis moving assembly includes a Z-axis motor, a ball screw, a guide rod and a first slider. The Z-axis motor and the guide rod are fixedly mounted on the main frame, the first slider is slidably mounted on the ball screw and the guide rod, and the bracket is connected to the first slider.

6. The AOI inspection machine according to claim 5, characterized in that: The Y-axis moving assembly also includes a guide rail and a second slider, the second slider is slidably installed on the guide rail, the moving member includes a moving plate and a plurality of column groups fixedly installed on the moving plate, and the plurality of column groups are arranged on the moving plate at intervals, and the placement positions are formed between adjacent column groups, and the moving plate is fixedly connected to the second slider.

7. A detection method, characterized in that: Using the AOI inspection machine according to any one of claims 1 to 6, the method comprises: Preset appearance defect characteristics, position deviation range and position feature range; Moving the optical device to the first detection position by the conveying device; Acquiring appearance information of the wafer and first position information of the wafer on the substrate; Comparing the first position information with the position deviation range, and comparing the appearance information with the appearance defect characteristics, if the first position information is within the position deviation range, and the appearance information does not conform to the appearance defect characteristics, moving the optical device to the second inspection position for the next inspection process, and if the first position information exceeds the position deviation range, and / or the appearance information conforms to the appearance defect characteristics, marking it; Acquiring position characteristic information of a wire located on the optical device; The position characteristic information is compared with the position characteristic range. If the position characteristic information conforms to the position characteristic range, the optical device is determined to be qualified. If the position characteristic information does not conform to the position characteristic range, the optical device is marked.

8. The detection method according to claim 7, characterized in that: The position feature information includes the height information, length information and bending angle information of the wire, and the position feature range includes a height position range, a length position range and a bending angle range, wherein the height information is compared with the height position range, the length information is compared with the length position range, and the bending angle information is compared with the bending angle range, and if any one of the height information, the length information and the bending angle information does not conform to the position feature range, the optical device is judged to be unqualified.

Images