Method, device and system for eliminating stray light and mobile terminal

Abstract

The invention discloses a method, a device and a system for eliminating stray light and a mobile terminal. The method comprises the following steps: acquiring a material damage threshold of an optical device and a target position for generating stray light; according to the target position and the material damage threshold value, internal carving parameters of laser equipment are determined, and the internal carving parameters comprise the laser wavelength and the internal carving path of laser; and controlling laser equipment to perform laser internal engraving on the target position of the optical device according to the internal engraving parameters. Thus, the laser is focused at the target position, where the stray light is generated, of the optical device, the target position is heated and exploded, the light transmittance of the target position is greatly reduced, and therefore the stray light generated in the optical device is eliminated.

Description

Technical Field

[0001] The present invention relates to the field of optical technology, and in particular to a method, device, system and mobile terminal for eliminating stray light. Background Art

[0002] In the imaging module of the terminal device, there are generally many optical devices, such as glass lenses, prisms, light columns, etc. In optical imaging, stray light may be generated when light passes through these substances.

[0003] In order to reduce or eliminate stray light, the strategies usually adopted by existing technologies are: applying anti-reflection or ultra-low reflection coatings to reduce reflection on the surface of components; using multi-layer coatings, broadband AR coatings and other technologies to reduce dispersion; optimizing optical system design, etc.

[0004] However, when some optical devices are irradiated with light, birefringence will occur inside the optical devices, causing the light to propagate inside the optical devices, and some of the propagated light is not required by the design, which affects the imaging effect. Summary of the invention

[0005] In view of the above problems, the present invention provides a method, device, system and mobile terminal for eliminating stray light, so as to eliminate stray light generated inside an optical device and ensure imaging effect.

[0006] According to a first aspect of the present invention, there is provided a method for eliminating stray light, comprising:

[0007] Obtain the material damage threshold of optical devices and the target location of stray light;

[0008] Determining the inner engraving parameters of the laser device according to the target position and the material damage threshold, wherein the inner engraving parameters include the laser wavelength and the inner engraving path of the laser;

[0009] According to the inner engraving parameters, a laser device is controlled to perform laser inner engraving on a target position of the optical device.

[0010] Optionally, the method further includes:

[0011] Place the laser engraved optical device into the dye mechanism;

[0012] The dye of the target color in the dye mechanism is heated and pressurized so that the dye of the target color penetrates into the target position of the optical device along the cracks generated by the laser inner engraving.

[0013] Optionally, before obtaining the material damage threshold of the optical device and the target position where stray light is generated, the method further includes:

[0014] Performing a light simulation test on the optical device, marking a target position where stray light is generated, and generating image model data;

[0015] The image model data marked with the target position is sent to the laser device.

[0016] Optionally, the laser device includes a light source emitter for emitting laser light, a galvanometer for changing the propagation path of the laser light, and a workbench for placing the optical device;

[0017] Determining the inner engraving parameters of the laser device according to the target position and the material damage threshold includes:

[0018] Determining the laser wavelength of the laser emitted by the light source emitter according to the material damage threshold;

[0019] According to the target position, the galvanometer is controlled to deflect and the workbench is controlled to move, so as to adjust the inner engraving path of the laser to reach the target position.

[0020] Optionally, controlling the deflection of the galvanometer and the movement of the workbench according to the target position includes:

[0021] According to the target position, the galvanometer is controlled to deflect and the inner engraving path of the laser in the X-axis direction and the Y-axis direction is adjusted;

[0022] According to the target position, the workbench is controlled to move, and the inner engraving path of the laser in the Z-axis direction is adjusted.

[0023] Optionally, the method further includes:

[0024] The width of the structure formed by laser engraving at the target position by the laser is within the first target range in the Z-axis direction.

[0025] Optionally, the method further includes:

[0026] The surface roughness of the structure is within the second target range.

[0027] According to a second aspect of the present invention, there is provided a device for eliminating stray light, comprising:

[0028] An acquisition module, used to acquire a material damage threshold of an optical device and a target position generating stray light;

[0029] A determination module, used to determine the inner carving parameters of the laser device according to the target position and the material damage threshold, wherein the inner carving parameters include the laser wavelength and the inner carving path of the laser;

[0030] The laser inner engraving module is used to control the laser device to perform laser inner engraving at the target position of the optical device according to the inner engraving parameters.

[0031] According to a third aspect of the present invention, there is provided a system for eliminating stray light, comprising:

[0032] An optical device, and a laser device for laser engraving a target position of the optical device;

[0033] The laser device comprises a light source emitter, a first lens group, a galvanometer, a second lens group and a workbench;

[0034] The laser device determines the inner engraving parameters according to the acquired target position and material damage threshold, and the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; according to the laser wavelength, the light source emitter is controlled to emit the laser; according to the inner engraving path, the first lens group, the galvanometer, the second lens group and the workbench are controlled so that the laser performs laser inner engraving on the target position of the optical device.

[0035] Optionally, the system further comprises a dye mechanism for performing dye treatment on the optical device after laser engraving.

[0036] According to a fourth aspect of the present invention, a mobile terminal is provided, the mobile terminal comprising an optical device, and the target position where stray light is generated on the optical device is subjected to stray light elimination using the aforementioned stray light elimination method.

[0037] The above one or more technical solutions in the embodiments of this specification have at least the following technical effects:

[0038] The embodiments of this specification provide a method, device, system and mobile terminal for eliminating stray light, which obtains the material damage threshold of the optical device and the target position where the stray light is generated; according to the target position and the material damage threshold, determines the inner engraving parameters of the laser device, the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; according to the inner engraving parameters, controls the laser device to perform laser inner engraving on the target position of the optical device. In this way, by focusing the laser on the target position where the stray light is generated by the optical device, the target position is heated and exploded, greatly reducing the light transmittance at the target position, thereby eliminating the stray light generated inside the optical device and ensuring the imaging effect.

[0039] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented according to the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the detailed description of the preferred embodiments below. The accompanying drawings are only for the purpose of illustrating the preferred embodiments and are not to be considered as limiting the present invention. Also, throughout the accompanying drawings, the same reference figures are used to represent the same components. In the drawings:

[0041] Figure 1 A flow chart of a method for eliminating stray light in an embodiment of the present invention is shown.

[0042] Figure 2 A schematic diagram of an optical device in an embodiment of the present invention is shown.

[0043] Figure 3 A block diagram of a device for eliminating stray light in an embodiment of the present invention is shown.

[0044] Figure 4 A schematic diagram of a system for eliminating stray light in an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0046] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0048] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0049] There are many existing optical devices, such as glass lenses, glass prisms, light columns, etc. In optical imaging, light passes through these materials. The reasons for the stray light generated by optical imaging mainly involve the following aspects:

[0050] Non-imaging light: In an optical system, in addition to the light emitted from the target object and ultimately forming a clear image on the imaging plane, there may be other non-imaging light. These lights may be scattered light from the environment around the target object, stray light sources (such as sunlight, indoor lighting, etc.) that directly illuminate the surface of the optical device, or reflected light from internal components of the system (such as reflectors, prisms, etc.). If these non-imaging lights are not properly controlled or blocked, they will enter the imaging light path and form a blurred background or light spot on the imaging plane, becoming stray light.

[0051] Surface reflection and scattering of optical devices refers to the fact that the surfaces of optical devices such as lenses, filters, prisms, etc. are not completely ideal and may have tiny defects such as roughness, scratches, and dust. These defects will cause the incident light to be diffusely reflected and scattered on its surface, generating non-imaging stray light. In addition, even if the surface quality is good, there may be a certain reflectivity due to manufacturing tolerances and material properties, especially for components without anti-reflection (AR) coatings. After multiple reflections and scattering, some stray light may eventually reach the imaging surface.

[0052] Internal reflections in the system: In the complex optical path of an optical system, light may be reflected multiple times between different components, inside components, or with the system housing (such as secondary reflection, tertiary reflection, etc.), forming so-called "ghost images" or "glare". These additional reflected light paths are often not effectively used for imaging, but appear in the image in the form of stray light, reducing image contrast and clarity.

[0053] Non-monochromaticity of light source: The actual light source is usually not a single wavelength (monochromatic light), but a composite light with a certain spectral width. This non-monochromaticity may cause light of different wavelengths to exhibit different refractive indices, reflectivities, and transmittances in the optical system, thus causing dispersion effects. Dispersion will cause light of different colors to focus at different positions on the imaging surface, resulting in chromatic aberration, which is also a form of stray light.

[0054] Optical aberrations of optical systems: such as spherical aberration, coma, astigmatism, distortion, etc. These aberrations will cause the light that should have converged at one point to be distributed in an area, resulting in image blur and reduced contrast, and are also one of the sources of stray light. In order to reduce or eliminate stray light, the following strategies are usually adopted in optical design: use high-quality optical devices and ensure surface flatness and coating performance.

[0055] To reduce or eliminate stray light, the following strategies are usually adopted in optical design: use high-quality optical components to ensure surface flatness and coating performance; apply anti-reflection (AR) or very low reflection (VLR) coatings to reduce component surface reflections; design a reasonable optical path layout and light shield to prevent non-imaging light from entering the system; use multi-layer coating, broadband AR coating and other technologies to reduce dispersion; optimize optical system design, correct various aberrations, and improve imaging quality.

[0056] The above contents are all about reducing or eliminating stray light from the outside. However, in the prior art, after the optical device is designed, the propagation path of each light can be tested through simulation software. Inside the optical device, when the light reaches the medium surface of two materials with different densities, double refraction will occur, generating stray light that propagates inside the optical device. Some of the refracted light is required by the design, and some of the refracted light is unnecessary, that is, non-imaging messy light. This will significantly reduce the image quality seen by the user. Based on the above situation, it is necessary to eliminate the stray light generated inside the optical device.

[0057] Combination Figure 1 As shown, the present invention provides a method for eliminating stray light, and the method for eliminating stray light includes steps 101 to 103:

[0058] Step 101: Obtaining a material damage threshold of an optical device and a target position where stray light is generated;

[0059] In this embodiment, the optical device can be a white cycloolefin lens, a polyethylene chemical synthetic material lens, a glass prism, etc. in the imaging module. The optical device has multiple mirror surfaces on its surface, and some mirror surfaces may have coatings, such as silver coatings. When the light reaches the coated mirror surface, the propagation path changes, and the refracted light propagates inside the optical device. For the unwanted refracted light, the position where the refraction occurs is set as the target position.

[0060] Specifically, after the optical device is designed, the software can be used to perform light simulation tests on the optical device. For useless refracted light that produces stray light, the refracted position, i.e., the target position, is marked, and image model data is generated; the image model data marked with the target position is then sent to the laser device.

[0061] It should be noted that the target position is generally an area, not a point. Because when the user can clearly see that there is abnormal light (for example, halo, etc.), it means that the optical device generates stray light in at least a small area. If the area generating stray light is relatively small, for example, some refraction points, it is not easy for the user to not see it.

[0062] In addition, different materials of optical devices have different corresponding damage thresholds. In actual production testing, the same batch of optical devices are generally tested. The same materials are used for the same batch of optical devices, and the material damage threshold can be determined based on the material of the optical devices. Therefore, before performing stray light elimination testing on optical devices, the material damage threshold can be input into the laser equipment in advance. It is also possible to pre-store material damage thresholds of multiple common materials in the laser equipment. When performing stray light elimination testing on optical devices, the staff can select the corresponding material damage threshold based on the optical devices.

[0063] Step 102: Determine the inner engraving parameters of the laser device according to the target position and the material damage threshold, wherein the inner engraving parameters include the laser wavelength and the inner engraving path of the laser;

[0064] In this embodiment, combined with Figure 4 As shown, the laser device includes a light source transmitter, a first lens group, a galvanometer, a second lens group, and a workbench. The light source transmitter is used to emit laser light, and after the laser light is emitted from the light source transmitter, it reaches the first lens group. The first lens group collimates the laser light to keep the divergent laser light parallel. After that, the laser light reaches the galvanometer, and the galvanometer is deflected by the motor, thereby changing the path of laser propagation. Then the laser light reaches the second lens group, and the second lens group focuses the laser light and makes the focal point of the laser fall on the target position of the optical device.

[0065] The optical device is fixed at the detection position of the workbench. Each optical device corresponds to image model data. When performing stray light elimination detection on the optical device, the laser device determines the target position of the optical device based on the image model data of the optical device, and then controls the movement of the galvanometer and the workbench to adjust the laser's inner engraving path. And according to the material damage threshold, the wavelength of the laser emitted by the light source transmitter is determined. Among them, the inner engraving path refers to the path of laser propagation.

[0066] It should be noted that when the laser is focused on the target position of the optical device, the material at the target position is instantly heated and cracked, resulting in micron to millimeter-level microcracks. In this embodiment, the size of the laser spot can be changed by adjusting the laser wavelength, thereby changing the size of the microcracks. The laser wavelength emitted by the light source transmitter is determined by the material of the optical device itself. Different optical devices may have different materials. Different materials correspond to different material damage thresholds. Therefore, the wavelength of the laser can be determined according to the material damage threshold corresponding to the optical device, thereby determining the size of the microcracks at the target position.

[0067] In this embodiment, the laser device acquires image model data of the optical device, and the image model data includes the target position where stray light is generated. There may be multiple target positions. The laser device can control the deflection of the galvanometer of the laser device and the movement of the workbench according to the target position to adjust the inner engraving path of the laser to reach the target position.

[0068] In detail, the laser device can take a picture of the optical device on the workbench, combine it with the image model data, and then perform image recognition to determine the medium surface where the target position is located. Then, according to the target position, the galvanometer motor of the laser device is controlled to operate, drive the galvanometer deflection, and adjust the inner engraving path of the laser reflected from the galvanometer in the X-axis direction and the Y-axis direction; and according to the target position, the workbench of the laser device is controlled to move, and the inner engraving path of the laser in the Z-axis direction is adjusted. Among them, the positive direction of the Z axis is the direction of the workbench toward the second lens group, and the plane where the X axis and the Y axis are located is perpendicular to the Z axis.

[0069] Step 103: According to the inner engraving parameters, control the laser device to perform laser inner engraving on the target position of the optical device.

[0070] In this embodiment, after the inner engraving parameters are determined, the laser wavelength and the inner engraving path of the laser are determined. According to the laser wavelength, the light source emitter can be controlled to emit a laser of the corresponding wavelength, and finally the laser is focused on the target position of the optical device, and the target position is laser engraved, so that the material at the target position of the optical device is instantly heated and cracked locally, and micro cracks of micrometer to millimeter level are generated.

[0071] When laser engraving is performed, the optical device can be in a flat plate state before cutting, can be cut into strips, or can be a finished optical device.

[0072] In addition, laser engraving can be understood as laser dotting at the target position multiple times, thereby forming a laser engraved structure at the target position. The width of the structure in the laser emission direction (i.e., the Z-axis direction of this embodiment) is within the first target range. In this embodiment, the first target range can be 1um-1000um. It should be noted that the width of the structure should not be too large, otherwise it may cause the optical device to crack.

[0073] The structure formed by the inner carving can be in the center of the optical device, or in any position on one side or both sides of the optical device. The positions on both sides refer to the top, bottom, left, and right positions. It can also be inside the optical device without contacting any side of the optical device. In general, the structure formed by the inner carving can be completely located in the optical device, or it can be partially located on the surface of the structure.

[0074] In addition, the height of the structure formed by the inner carving is generally between 1um and 100000um. The number of the inner carving structures in the optical device can be one or more. And the multiple structures may also have different shapes, which is not limited in this embodiment.

[0075] It should be noted that the surface roughness of the structure formed by the inner carving is within the second target range, and the difference between the peak and the valley value shown on the surface of the structure is 1 nanometer to 1000 nanometers.

[0076] Combination Figure 2 As shown, Figure 2 The left half is a front view of the basic shape of an optical device, and the target position of the optical device is laser engraved. The shape after laser engraving can be referred to Figure 2 The right half of . Figure 2 The right half of is the structure shape carved by the laser in the cross-sectional view at position D in the main view. Figure 2 This is just an example, and it should be understood that the structure formed by laser engraving may also be a door shape, a mountain shape, or even other special shapes, which is not limited in this embodiment. The surface morphology of the structure may be a plane, or may be a uniform or uneven arc, a small semicircle, a convexity, etc.

[0077] After laser engraving, the microcracks at the target position scatter light, making the target position appear white, yellow or other colors. The rest of the optical device remains intact. At this time, the light transmittance at the target position decreases from 100% to about 5%. It should be explained that the color of the optical device after laser engraving is related to the material of the optical device, the laser energy and the color center of the transparent material.

[0078] This embodiment can achieve the effect of eliminating stray light at the target position inside the optical device through the above method. From the user's perspective, the influence of stray light on imaging will not be obviously felt.

[0079] However, in order to further improve the stray light elimination effect, this embodiment, based on the above method content, may further include the following steps:

[0080] The optical device after laser engraving is placed in a dye mechanism, and a target position of the optical device is subjected to dye treatment.

[0081] The dye mechanism refers to a dye container capable of heating and pressurizing, in which a dye of a target color is placed. The target color used in this embodiment is generally a darker color, such as black dye, blue dye, brown dye, yellow dye, purple dye, red dye, etc., which is not limited in this embodiment. Generally, the target color dye commonly used in detection is black dye, which has a better light absorption effect.

[0082] For example: when performing black dye processing, the optical device is placed in a black dye mechanism, and then the black dye in the dye mechanism is heated and pressurized, so that the black dye penetrates into the target position of the optical device along the microcracks generated by laser engraving.

[0083] In addition, the process used for black dye treatment can also be screen printing, spraying, optical black plating, etc. The order between them may be plating first and then printing, or printing first and then plating.

[0084] It should be noted that, for optical devices that can be subjected to dye penetration treatment, at least part of the laser engraved structure is located on the surface of the optical device.

[0085] After the dye treatment, the light transmittance at the target position of the optical device is further reduced to about 0.5%, thereby further improving the effect of eliminating stray light at the target position inside the optical device.

[0086] In summary, the embodiment of this specification provides a method for eliminating stray light, which obtains the material damage threshold of the optical device and the target position where the stray light is generated; according to the target position and the material damage threshold, the inner engraving parameters of the laser device are determined, and the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; according to the inner engraving parameters, the laser device is controlled to perform laser inner engraving on the target position of the optical device. In this way, on the inner engraving path of the stray light line, the target position is ablated and atomized by laser inner engraving at high temperature to reduce the light transmittance and eliminate stray light; and the principle of high-pressure penetration of chemical dyes is used to fill black dyes through small holes at the laser inner engraving position to allow the black dyes to penetrate, further providing the effect of eliminating stray light. Thereby solving the glare problem caused by multiple reflections inside the optical device, reducing the process difficulty, further reducing costs, and improving product reliability.

[0087] Based on the same inventive concept, Figure 3 As shown, an embodiment of the present invention further provides a device for eliminating stray light, comprising:

[0088] An acquisition module, used to acquire a material damage threshold of an optical device and a target position generating stray light;

[0089] A determination module, used to determine the inner carving parameters of the laser device according to the target position and the material damage threshold, wherein the inner carving parameters include the laser wavelength and the inner carving path of the laser;

[0090] The laser inner engraving module is used to control the laser device to perform laser inner engraving at the target position of the optical device according to the inner engraving parameters.

[0091] Optionally, the laser engraving module is also used for:

[0092] Place the laser engraved optical device into the dye mechanism;

[0093] The dye in the dye mechanism is heated and pressurized so that the dye penetrates into the target position of the optical device along the cracks generated by laser engraving.

[0094] Optionally, the dye is a black dye.

[0095] Optionally, the acquisition module is also used to:

[0096] Performing a light simulation test on the optical device, marking a target position where stray light is generated, and generating image model data;

[0097] The image model data marked with the target position is sent to the laser device.

[0098] Optionally, the determination module is further configured to:

[0099] Determining the wavelength of the laser emitted by the light source emitter according to the material damage threshold;

[0100] According to the target position, the galvanometer deflection of the laser device is controlled and the movement of the workbench is controlled to adjust the inner engraving path of the laser to reach the target position, wherein the optical device is fixed on the workbench.

[0101] Optionally, the determination module is further configured to:

[0102] According to the target position, the galvanometer deflection of the laser device is controlled to adjust the inner engraving path of the laser in the X-axis direction and the Y-axis direction;

[0103] According to the target position, the movement of the workbench of the laser device is controlled to adjust the inner engraving path of the laser in the Z-axis direction.

[0104] In summary, the embodiment of this specification provides a device for eliminating stray light, which obtains the material damage threshold of the optical device and the target position where the stray light is generated; according to the target position and the material damage threshold, determines the inner engraving parameters of the laser device, the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; according to the inner engraving parameters, controls the laser device to perform laser inner engraving on the target position of the optical device. In this way, by focusing the laser on the target position where the stray light is generated by the optical device, the target position is heated and exploded, and the transmittance at the target position is greatly reduced, thereby eliminating the stray light generated inside the optical device.

[0105] Based on the same inventive concept, Figure 4 As shown, an embodiment of the present invention further provides a system for eliminating stray light, comprising:

[0106] An optical device, and a laser device for laser engraving a target position of the optical device;

[0107] The laser device comprises a light source emitter, a first lens group, a galvanometer, a second lens group and a workbench;

[0108] The laser device determines the inner engraving parameters according to the acquired target position and material damage threshold, and the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; according to the laser wavelength, the light source emitter is controlled to emit the laser; according to the inner engraving path, the first lens group, the galvanometer, the second lens group and the workbench are controlled so that the laser performs laser inner engraving on the target position of the optical device.

[0109] Optionally, the system further comprises a dye mechanism for performing dye treatment on the optical device after laser engraving.

[0110] Among them, the light source transmitter is used to emit laser, and the laser is emitted from the light source transmitter and reaches the first lens group. The first lens group collimates the laser to keep the divergent laser light parallel. After that, the laser reaches the galvanometer, which is deflected by the motor to change the path of laser propagation. Then the laser reaches the second lens group, which focuses the laser and makes the focal point of the laser fall on the target position of the optical device.

[0111] The optical device is fixed at the detection position of the workbench. Each optical device corresponds to image model data. When performing stray light elimination detection on the optical device, the laser device determines the target position of the optical device based on the image model data of the optical device, and then controls the movement of the galvanometer and the workbench to adjust the laser's inner engraving path. And according to the material damage threshold, the wavelength of the laser emitted by the light source transmitter is determined. Among them, the inner engraving path refers to the path of laser propagation.

[0112] It should be noted that when the laser is focused on the target position of the optical device, the material at the target position is instantly locally heated and cracked, resulting in micron to millimeter-level microcracks. In this embodiment, the size of the laser spot can be changed by adjusting the laser wavelength, thereby changing the size of the microcracks. The laser wavelength emitted by the light source transmitter is determined by the material of the optical device itself. Different optical devices may have different materials. Different materials correspond to different material damage thresholds. Therefore, the wavelength of the laser can be determined according to the material damage threshold corresponding to the optical device, thereby changing the size of the microcracks at the target position.

[0113] It should be noted that after the laser wavelength is determined, the energy of the laser emitted by the light source transmitter, after being focused on the target position, is greater than the material damage threshold, so that the transparent material can abnormally absorb a large amount of energy in a short period of time, and instantly burst due to local heat.

[0114] In this embodiment, the laser device acquires image model data of the optical device, and the image model data includes a target position where stray light is generated. There can be multiple target positions. The laser device can control the deflection of the galvanometer of the laser device and the movement of the workbench according to the target position to adjust the inner engraving path of the laser to reach the target position.

[0115] Specifically, the laser device can take a picture of the optical device on the workbench, and then perform image recognition to determine the medium surface where the target position is located. Then, according to the target position, the galvanometer motor of the laser device is controlled to operate, drive the galvanometer deflection, and adjust the inner engraving path of the laser reflected from the galvanometer in the X-axis direction and the Y-axis direction; and according to the target position, the workbench of the laser device is controlled to move, and the inner engraving path of the laser in the Z-axis direction is adjusted. Among them, the positive direction of the Z-axis is the direction of the workbench toward the second lens group, and the plane where the X-axis and the Y-axis are located is perpendicular to the Z-axis.

[0116] After laser engraving, the light transmittance at the target position of the optical device is reduced from 100% to about 5%.

[0117] However, in order to further improve the effect of eliminating stray light, the present embodiment provides a dye mechanism for placing the optical device after laser inner engraving into a dye mechanism to perform dye treatment on the target position of the optical device.

[0118] The dye mechanism refers to a dye container that can be heated and pressurized, and contains dye. The dye used in this embodiment is generally a darker dye, such as black dye, blue dye, brown dye, etc. The commonly used dye in the detection is black dye, which has a higher light absorption effect.

[0119] When dye treatment is performed, the optical device is placed in the dye mechanism, and then the dye in the dye mechanism is heated and pressurized, so that the dye can penetrate into the target position of the optical device along the microcracks generated by laser engraving. It should be noted that the target position is generally at the interface of two materials with different densities, that is, the medium surface. The medium surface is generally on the surface of the optical device. Therefore, the dye will not penetrate too much into the optical device.

[0120] After the dye treatment, the light transmittance at the target position of the optical device is further reduced to about 0.5%, thereby further improving the effect of eliminating stray light at the target position inside the optical device.

[0121] In summary, the embodiment of this specification provides a system for eliminating stray light, which obtains the material damage threshold of the optical device and the target position where the stray light is generated; according to the target position and the material damage threshold, the inner engraving parameters of the laser device are determined, and the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; according to the inner engraving parameters, the laser device is controlled to perform laser inner engraving on the target position of the optical device. In this way, on the inner engraving path of the stray light line, the target position is ablated and atomized by laser inner engraving at high temperature to reduce the light transmittance and eliminate stray light; and the principle of high-pressure penetration of chemical dyes is used to fill black dyes through small holes at the laser inner engraving position to allow the black dyes to penetrate, further providing the effect of eliminating stray light. Thereby solving the glare problem caused by multiple reflections inside the optical device, reducing the process difficulty, further reducing costs, and improving product reliability.

[0122] Based on the same inventive concept, an embodiment of the present invention further provides a mobile terminal, the mobile terminal comprising an optical device. The target position where stray light is generated on the optical device is subjected to stray light elimination using the stray light elimination method in the aforementioned embodiment. Please refer to the aforementioned steps in the method, which will not be repeated here.

[0123] The above are only various embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A method for eliminating stray light, characterized in that: include: Obtain the material damage threshold of optical devices and the target location of stray light; Determining the inner engraving parameters of the laser device according to the target position and the material damage threshold, wherein the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; According to the inner engraving parameters, a laser device is controlled to perform laser inner engraving on a target position of the optical device.

2. The method according to claim 1, characterized in that The method further comprises: Place the laser engraved optical device into the dye mechanism; The dye of the target color in the dye mechanism is heated and pressurized so that the dye of the target color penetrates into the target position of the optical device along the cracks generated by the laser inner engraving.

3. The method according to claim 1, characterized in that Before obtaining the material damage threshold of the optical device and the target position where stray light is generated, the method further includes: Performing a light simulation test on the optical device, marking a target position where stray light is generated, and generating image model data; The image model data marked with the target position is sent to the laser device.

4. The method according to claim 1, characterized in that: The laser device comprises a light source emitter for emitting laser light, a galvanometer for changing the propagation path of the laser light, and a workbench for placing the optical device; Determining the inner engraving parameters of the laser device according to the target position and the material damage threshold includes: Determining the laser wavelength of the laser emitted by the light source emitter according to the material damage threshold; According to the target position, the galvanometer is controlled to deflect and the workbench is controlled to move, so as to adjust the inner engraving path of the laser to reach the target position.

5. The method according to claim 4, characterized in that According to the target position, controlling the deflection of the galvanometer and controlling the movement of the workbench includes: According to the target position, the galvanometer is controlled to deflect and the inner engraving path of the laser in the X-axis direction and the Y-axis direction is adjusted; According to the target position, the workbench is controlled to move, and the inner engraving path of the laser in the Z-axis direction is adjusted.

6. The method according to claim 5, characterized in that The method further comprises: The width of the structure formed by laser engraving at the target position by the laser is within the first target range in the Z-axis direction.

7. The method according to claim 6, characterized in that The method further comprises: The surface roughness of the structure is within the second target range.

8. A device for eliminating stray light, characterized in that: include: An acquisition module, used to acquire a material damage threshold of an optical device and a target position generating stray light; A determination module, used to determine the inner carving parameters of the laser device according to the target position and the material damage threshold, wherein the inner carving parameters include the laser wavelength and the inner carving path of the laser; The laser inner engraving module is used to control the laser device to perform laser inner engraving at the target position of the optical device according to the inner engraving parameters.

9. A system for eliminating stray light, characterized in that: include: An optical device, and a laser device for laser engraving a target position of the optical device; The laser device comprises a light source emitter, a first lens group, a galvanometer, a second lens group and a workbench; The laser device determines the inner engraving parameters according to the acquired target position and material damage threshold, and the inner engraving parameters include the laser wavelength and the inner engraving path of the laser; according to the laser wavelength, the light source emitter is controlled to emit the laser; according to the inner engraving path, the first lens group, the galvanometer, the second lens group and the workbench are controlled so that the laser performs laser inner engraving on the target position of the optical device.

10. A mobile terminal, characterized in that: The mobile terminal comprises an optical device, and the target position where stray light is generated on the optical device is subjected to stray light elimination using the stray light elimination method according to any one of claims 1 to 7.

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