Die for thermal forming of electroplated IML (in-mold labeling) membrane

Abstract

The die comprises an upper die body and a lower die body, the upper die body comprises an upper die plate, a pressing plate and a male die core, the pressing plate is located at the bottom of the upper die plate, the male die core is sequentially and vertically embedded into the pressing plate and the upper die plate, one end of the male die core protrudes out of the bottom face of the pressing plate, and the lower die body comprises a base, a lower die plate and a female die core. The lower die plate is fixed to the base, the female die core is arranged in a containing cavity in the center of the lower die plate, the working face of the male die core is coated with a magnetic silica gel layer mixed with magnetic powder, and the magnetic silica gel layer is adsorbed to the male die core. The magnetic silica gel layer is low in hardness, fine and smooth in surface after solidification, free of bubbles and excellent in buffering performance, so that when the male die core is used for hot stamping and electroplating an IML membrane, the surface of the membrane is smooth and free of abnormity, the technical pain point of pocking marks generated after hot forming of the electroplated IML membrane is solved, the appearance yield of products is effectively increased, and the production cost and defective products are reduced. And the magnetic silica gel layer is easy to fix and replace, so that the maintenance cost of the mold is reduced.

Description

Technical Field

[0001] The present application belongs to the field of IML injection molding technology, and more specifically, relates to a mold for thermoforming of electroplated IML diaphragms. Background Art

[0002] IML (In Molding Label) injection molding process is a process of film injection molding in the mold, that is, placing a film with a printed pattern in the injection mold, and then performing injection molding, so that the film and the molded plastic are closely combined together, and the film becomes a surface decoration layer on the plastic surface with properties such as wear resistance and scratch resistance. This process is widely used in injection molding products that require high-precision patterns and surface decoration.

[0003] The process of IML injection molding using electroplated IML diaphragm and plastic raw materials is as follows: Cutting: first, the film is cut into sheets of predetermined shape and size; Electroplating treatment: electroplating a layer of metal coating on the diaphragm; in addition, according to the required appearance of the product, corresponding patterns, texts, etc. can be printed on the diaphragm; Punching positioning holes: Before thermoforming, positioning holes need to be punched on the diaphragm to ensure the positioning accuracy and position accuracy in the subsequent thermoforming and injection molding process; Thermoforming: Install the corresponding mold on the punching machine to heat-press the diaphragm to form the 3D shape of the product. This step requires precise control of parameters such as temperature, pressure and molding time to ensure the molding quality and the integrity of the electroplating effect. Cut off excess material. After thermoforming, the excess material on the edge of the diaphragm needs to be cut off to ensure the size, accuracy and neatness of the product. Injection molding, put the thermoformed film into the injection mold and perform the injection molding operation. During injection molding, the molten plastic material will fill the mold and tightly combine with the film to form the final IML injection molding product.

[0004] Among them, in the hot forming step, during the process of stamping the diaphragm through the core in the mold, since the core is made of relatively rigid steel or iron material, a layer of buffer material needs to be attached to the working surface of the core. The existing method is to form a layer of AB glue on the surface of the core, for example, a layer of epoxy resin AB glue can be injection molded on the surface of the core by mold injection molding. However, in the actual production process, we found that the electroplated IML diaphragm will be punched out with pitting during the hot forming step, resulting in a poor appearance of the diaphragm. Moreover, the pitting on the diaphragm will also appear on the final injection molded product, thereby affecting the quality of the product and reducing the appearance yield of the product. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a mold for thermoforming of electroplated IML diaphragms to solve the technical problem of pitting in diaphragms punched out in the prior art.

[0006] To achieve the above-mentioned purpose, the technical solution adopted in this application is: to provide a mold for thermoforming of electroplated IML diaphragms, the mold comprising an upper mold and a lower mold, the upper mold comprising an upper mold plate, a pressure plate and a punch core, the pressure plate is located at the bottom of the upper mold plate, the punch core is vertically embedded in the pressure plate and the upper mold plate in sequence, one end of the punch core protrudes from the bottom surface of the pressure plate, the lower mold comprises a base, a lower mold plate and a die core, the lower mold plate is fixed on the base, a accommodating cavity is provided in the center of the lower mold plate, the die core is arranged in the accommodating cavity, the working surface of the punch core is covered with a magnetic silicone layer mixed with magnetic powder, and the magnetic silicone layer is adsorbed on the working surface of the punch core.

[0007] In one embodiment, the magnetic silicone layer includes a silicone layer and a magnetic powder layer which are integrated into one, and the magnetic powder layer is in contact with the working surface of the male mold core.

[0008] In one embodiment, the magnetic powder layer is formed by mixing and solidifying molten silica gel and magnetic powder, and the magnetic powder layer and the silica gel layer are combined into one by mold injection molding.

[0009] In one embodiment, the magnetic powder layer is formed by mixing and solidifying magnetic powder and an adhesive, and the magnetic powder layer is bonded to one surface of the silicone layer by brushing.

[0010] In one embodiment, the Shore hardness of the silicone layer is 85HA-90HA.

[0011] In one embodiment, the magnetic powder is neodymium iron boron powder or ferrite powder.

[0012] In one embodiment, the lower mold further includes a spring and a guide post, the guide post is vertically fixed in the accommodating cavity, and the spring is sleeved on the outer circumference of the guide post and supports the die core.

[0013] In one embodiment, the lower mold further includes a plurality of positioning pins for positioning the diaphragm, and all the positioning pins are erected on the lower mold plate at intervals.

[0014] The beneficial effect of the mold for hot forming of electroplated IML diaphragms provided by the present application is that: in the prior art, a layer of AB glue for buffering is formed on the surface of the mold core. After solidification, the surface of the AB glue is rough, has many bubbles, and has high hardness. When the electroplated IML diaphragm is hot formed, pitting will be pressed out, resulting in a poor appearance of the diaphragm. However, the present application coats the working surface of the punch core with a layer of magnetic silicone layer mixed with magnetic powder. The magnetic silicone layer is adsorbed on the working surface of the punch core. The hardness of the magnetic silicone layer is relatively soft, and the surface is delicate and free of bubbles after solidification, and has better buffering performance. When the punch core coated with the magnetic silicone layer is hot stamped with an electroplated IML diaphragm, the surface of the diaphragm is smooth and has no abnormalities, which solves the process pain point of pitting after the electroplated IML diaphragm is formed, effectively improves the appearance yield of the product, and reduces the production cost and the generation of defective products.

[0015] Second, the present application specifically sets the magnetic silicone layer on the working surface of the punch core of the upper mold, so that during stamping and forming, when the punch core of the upper mold is pressed down, the magnetic silicone layer of the punch core first contacts the diaphragm, and as the punch core continues to be pressed down, the magnetic silicone layer can play a buffering role between the punch core and the diaphragm, and the thicker coating of the diaphragm will be squeezed upward and sink into the magnetic silicone layer and will be difficult to protrude from the bottom surface of the diaphragm to form pits. Compared with the working surface of the concave mold core set on the lower mold, setting the magnetic silicone layer on the punch core of the upper mold can obtain a better buffering effect, thereby greatly improving the problem of pitting of the diaphragm when punching.

[0016] Third, the silicone material generally needs to be fixed to the surface of the metal core through injection molding. When the silicone on the surface of the core is worn and needs to be replaced, chemical reagents are needed to completely remove the silicone from the surface of the core, and then a layer of silicone needs to be coated on the surface of the core again through injection molding. The whole process is relatively complicated and time-consuming; or the silicone can be replaced together with the core, but this will waste a lot of the core and cost a lot, and each core also needs to be combined with the silicone in advance through injection molding. The present application mixes magnetic powder with silicone and prepares a magnetic silicone layer, so that the magnetic silicone layer can be adsorbed on the working surface of the core, which makes it easy to fix the magnetic silicone layer on the working surface of the core, and also makes it easy to replace the magnetic silicone layer, reducing the maintenance cost of the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] Figure 1 A schematic diagram of the three-dimensional structure of a mold for thermoforming of electroplated IML membranes provided in an embodiment of the present application; Figure 2 for Figure 1 A schematic diagram of the three-dimensional structure of the upper mold of the mold; Figure 3 for Figure 2 A schematic diagram of the three-dimensional structure of the punch core of the upper die; Figure 4 for Figure 2 A schematic diagram of the structure of the magnetic silicone layer of the upper mold; Figure 5 for Figure 1 A cross-sectional view of the lower mold of the mold.

[0019] Among them, the reference numerals in the figure are: 1-upper mold; 11-upper mold plate; 12-pressing plate; 13-convex mold core; 14-magnetic silicone layer; 141-silicone layer; 142-magnetic powder layer; 2-lower mold; 21-base; 22-lower mold plate; 2201-accommodating cavity; 23-concave mold core; 24-spring; 25-guide column; 26-positioning pin; 300-diaphragm. DETAILED DESCRIPTION

[0020] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0021] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0022] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] In the process of stamping the electroplated IML diaphragm through the core in the mold, since the core is made of relatively rigid steel or iron, a layer of buffer material needs to be attached to the working surface of the core. The existing method is to form a layer of AB glue on the surface of the concave core of the lower mold. However, in the actual production process, we found that the electroplated IML diaphragm will be punched out with pitting during the hot forming step, resulting in poor appearance of the diaphragm. Moreover, the pitting on the diaphragm will also appear on the final injection molded product, thereby affecting the quality of the product and reducing the appearance yield of the product. ‌‌ Through research, we found that pitting occurs during the hot forming process of the diaphragm. On the one hand, this is because the diaphragm is not completely flat after electroplating due to uneven electroplating, so that pitting will form in the thicker coating during the stamping process. On the other hand, after the AB glue solidifies, the surface is rough, with many bubbles and high hardness. The AB glue does not have enough buffering effect on the thicker coating during stamping, so the thicker coating protrudes on the diaphragm surface to form pitting. Furthermore, since the AB glue is arranged on the surface of the die core of the lower die, during stamping, the diaphragm needs to be positioned on the lower die first. At this time, the AB glue is located at the bottom of the diaphragm. When the punch core of the upper die is pressed down, the punch core first contacts the diaphragm, and then as the punch core continues to press down, the impact force received by the diaphragm is transmitted downward to the AB glue. Since the AB glue that plays a buffering role is located on the bottom surface of the diaphragm, the thicker coating of the diaphragm will be squeezed downward and sink into the AB glue, so that the AB glue plays a buffering role on the impact force received by the diaphragm. However, when the thicker coating of the diaphragm squeezes the AB glue downward, it is very easy to bulge out from the bottom surface of the diaphragm to form pits, so the buffering effect is not ideal.

[0025] Based on the above analysis and research, we designed a new mold for the thermoforming of electroplated IML diaphragms. The surface of the upper mold core is coated with a magnetic silicone layer mixed with magnetic powder. Compared with the AB glue set on the surface of the lower mold core, the magnetic silicone layer set on the surface of the upper mold core can provide better buffering for the thicker coating when the stamping force is applied. The surface of the diaphragm is flat and normal after stamping, thus solving the process pain point of pitting in the thermoforming process of electroplated IML diaphragms. In addition, by mixing magnetic powder in the silicone, the magnetic silicone layer can be adsorbed on the surface of the upper mold core.

[0026] like Figures 1 to 5 As shown, the mold for thermoforming of electroplated IML diaphragms provided in an embodiment of the present application is now described. The mold includes an upper mold 1 and a lower mold 2. The upper mold 1 includes an upper mold plate 11, a pressure plate 12 and a male mold core 13. The pressure plate 12 is located at the bottom of the upper mold plate 11, and the male mold core 13 is vertically embedded in the pressure plate 12 and the upper mold plate 11 in sequence, and one end of the male mold core 13 protrudes from the bottom surface of the pressure plate 12. The lower mold 2 includes a base 21, a lower mold plate 22 and a female mold core 23. The lower mold plate 22 is fixed on the base 21, and a receiving cavity 2201 is provided in the center of the lower mold plate 22, and the opening of the receiving cavity 2201 is located on the top surface of the lower mold plate 22. The female mold core 23 is arranged in the receiving cavity 2201. The working surface of the male mold core 13 is coated with a magnetic silicone layer 14 mixed with magnetic powder, and the magnetic silicone layer 14 is adsorbed on the working surface of the male mold core 13.

[0027] Specifically, in the use state, the upper mold 1 is the movable mold, and the lower mold 2 is the fixed mold. The upper mold 1 includes an upper mold plate 11, a pressure plate 12 and a punch core 13. The upper mold plate 11 is used to install the entire upper mold 1 on the punching machine. The pressure plate 12 is located at the bottom of the upper mold plate 11, that is, the upper mold plate 11 and the pressure plate 12 are two parallel plates. The center of the upper mold plate 11 and the pressure plate 12 are provided with a channel that runs through their own thickness direction. The punch core 13 is vertically embedded in the channels in the center of the upper mold plate 11 and the pressure plate 12 in turn, so that the three are fixedly combined into one; that is, the upper mold plate 11 and the pressure plate 12 are fixedly sleeved on the outer periphery of the punch core 13. One end of the punch core 13 protrudes from the bottom surface of the pressure plate 12, so that the end surface of the punch core 13 becomes the working surface for punching the diaphragm.

[0028] The lower die 2 includes a base 21, a lower mold plate 22, and a die core 23. The base 21 is used to fix the lower die 2 on the punching machine so that the upper die 1 and the lower die 2 are opposite in the vertical direction. The lower mold plate 22 is fixedly mounted on the base 21, and a receiving cavity 2201 is provided at the center of the lower mold plate 22. The die core 23 is arranged in the receiving cavity 2201 and is opposite to the male die core 13. According to the 3D shape that the diaphragm needs to be formed, the working surface shapes of the male die core 13 and the female die core 23 are reasonably designed and matched.

[0029] In particular, the working surface of the male mold core 13 is coated with a magnetic silicone layer 14 mixed with magnetic powder, and the magnetic silicone layer 14 is adsorbed on the working surface of the male mold core 13. For example, the magnetic silicone layer 14 can be formed by mixing and solidifying molten silicone and magnetic powder, so that the silicone layer has magnetism. In this way, the magnetic silicone layer 14 can be adsorbed on the working surface of the male mold core 13.

[0030] During operation, the upper mold 1 and the lower mold 2 of the mold need to be installed on the punching machine respectively. Specifically, the upper mold 1 is fixedly installed on the punching machine through the upper mold plate 11, and the lower mold 2 is fixedly installed on the punching machine through the base 21. The male mold core 13 of the upper mold 1 and the female mold core 23 of the lower mold 2 are opposite. Then the diaphragm 300 to be punched is placed on the top surface of the lower mold plate 22 and positioned and fixed. At this time, the diaphragm 300 covers the opening of the accommodating cavity 2201 of the lower mold plate 22. Then adjust the various working parameters of the punching machine so that the upper mold 1 moves downward to perform hot pressing molding on the diaphragm 300. In the process of the upper mold 1 moving downward, the magnetic silicone layer 14 coated on the working surface of the male mold core 13 first contacts the top surface of the diaphragm, and as the male mold core 13 continues to move downward and enters the accommodating cavity 2201 of the lower mold plate 22, the bottom surface of the diaphragm 300 contacts the working surface of the female mold core 23. As the punching pressure of the punch core 13 increases, the diaphragm 300 is punched into a predetermined shape. At the same time, since the magnetic silicone layer 14 is relatively soft and easy to deform, the thicker coating of the diaphragm 300 will gradually be squeezed and sunk into the magnetic silicone layer 14, so that the magnetic silicone layer 14 can play a buffering role.

[0031] It is understandable that in the prior art, a layer of AB glue for buffering is formed on the surface of the mold core. After solidification, the surface of the AB glue is rough, has many bubbles, and has high hardness. When the IML diaphragm is hot-formed and electroplated, pitting will be pressed out, resulting in a poor appearance of the diaphragm. However, the present application coats the working surface of the male mold core 13 with a layer of magnetic silicone layer 14 mixed with magnetic powder. The magnetic silicone layer 14 has low hardness, a fine surface after solidification, and no bubbles, and has better buffering performance. When the male mold core 13 coated with the magnetic silicone layer 14 is hot-stamped to form an IML diaphragm, the surface of the diaphragm 300 is smooth and has no abnormalities, which solves the process pain point of pitting after the electroplated IML diaphragm is formed, effectively improves the appearance yield of the product, and reduces the production cost and the generation of defective products.

[0032] Second, the present application specifically sets the magnetic silicone layer 14 on the working surface of the male core 13 of the upper mold 1, so that during stamping and forming, when the male core 13 of the upper mold 1 is pressed down, the magnetic silicone layer 14 coated on the working surface of the male core 13 first contacts the diaphragm 300. As the male core 13 continues to be pressed down, the magnetic silicone layer 14 can play a buffering role between the male core 13 and the diaphragm 300, and the thicker coating of the diaphragm 300 will be squeezed upward and sink into the magnetic silicone layer 14, and it is difficult to protrude from the bottom surface of the diaphragm 300 to form pits. Compared with setting the working surface of the female core 23 of the lower mold 2, setting the magnetic silicone layer 14 on the male core 13 of the upper mold 1 can obtain a better buffering effect, thereby greatly improving the problem of punching pits on the diaphragm 300.

[0033] Third, generally speaking, the silicone material needs to be fixedly bonded to the surface of the metal core 13 by injection molding. When the silicone on the surface of the core 13 is worn and needs to be replaced, chemical reagents are needed to completely remove the silicone from the surface of the core 13, and then a layer of silicone needs to be coated on the surface of the core 13 by injection molding again. The whole process is relatively complicated and time-consuming; or the silicone can be replaced together with the core 13, but this will waste a lot of the core 13 and the cost is high, and each core 13 also needs to be combined with the silicone in advance by injection molding. The present application mixes magnetic powder in the silicone so that the magnetic silicone layer 14 can be adsorbed on the working surface of the core 13, which makes it easy to fix the magnetic silicone layer 14 on the working surface of the core 13, and also makes it easy to replace the magnetic silicone layer 14, reducing the maintenance cost of the mold.

[0034] In one embodiment, the magnetic silicone layer 14 includes a silicone layer 141 and a magnetic powder layer 142 which are integrated into one body, and the magnetic powder layer 142 is in contact with the working surface of the male mold core 13 .

[0035] The magnetic silicone layer 14 is divided into two layers, one layer is a silicone layer 141 made entirely of silicone material, and the other layer is a magnetic powder layer 142 containing magnetic powder. The silicone layer 141 and the magnetic powder layer 142 are stacked together. The magnetic powder layer 142 is attached to and fixed on the working surface of the male mold core 13, while the silicone layer 141 faces the working surface of the female mold core 23 of the lower mold 2.

[0036] Compared with uniformly mixing magnetic powder in the magnetic silicone layer 14, by dividing the magnetic silicone layer 14 into two layers, the silicone layer 141 facing the die core 23 does not contain magnetic powder, but is entirely made of soft silicone material, so that the silicone layer 141 has better buffering performance; and the magnetic powder with magnetic adsorption function is all concentrated in the magnetic powder layer 142, so that the magnetic powder layer 142 has greater adsorption force and can be more firmly adsorbed on the working surface of the male die core 13. In this way, better buffering performance and magnetic adsorption capacity can be obtained at the same time.

[0037] In one embodiment, the magnetic powder layer 142 is formed by mixing and solidifying molten silicone and magnetic powder, and the magnetic powder layer 142 and the silicone layer 141 are combined into one by mold injection molding. The magnetic powder can be evenly and stably dispersed in the molten silicone material in a predetermined proportion by stirring, and after the silicone is solidified, the magnetic powder layer 142 can obtain a uniform and stable magnetic adsorption force. The silicone layer 141 is also solidified by silicone material, so a suitable mold can be prepared in advance, and the silicone layer 141 and the magnetic powder layer 142 can be formed separately by injection molding and combined into one.

[0038] The magnetic powder layer 142 is formed by mixing and solidifying molten silica gel and magnetic powder, so that the two-layer magnetic silica gel layer 14 only needs two raw materials, silica gel and magnetic powder, for injection molding, and the manufacturing process is simple.

[0039] In one embodiment, the magnetic powder layer 142 is formed by mixing and curing magnetic powder and adhesive, and the magnetic powder layer 142 is combined with one side surface of the silicone layer 141 by brushing. For example, the magnetic powder layer 142 can be formed by mixing and curing magnetic powder and glue. In the process of making the magnetic silicone layer 14, the silicone layer 141 can be prepared by injection molding of molten silicone, and the silicone layer 141 is demolded after curing for use; then the magnetic powder is added to the glue and stirred evenly; then a layer of glue mixed with magnetic powder is evenly brushed on one side surface of the silicone layer 141, and after the glue is cured, a layer of glue mixed with magnetic powder can be brushed on the surface of the cured glue, and then cured. In this way, multiple layers of glue mixed with magnetic powder can be brushed on one side surface of the silicone layer 141, so as to solidify and form a magnetic powder layer 142 of a predetermined thickness, so that the magnetic powder layer 142 has a sufficiently strong magnetic adsorption force, and the manufacturing process is also simple and easy to operate.

[0040] In one embodiment, the Shore hardness of the silicone layer 141 is 85HA-90HA. Through multiple tests and comparisons, it is found that when the Shore hardness of the silicone layer 141 is within the range of 85HA-90HA, the cushioning performance of the silicone layer 141 is in a better range, and the appearance quality of the diaphragm 300 after stamping is good.

[0041] In one embodiment, the magnetic powder is NdFeB powder or ferrite powder. The magnetic powder mixed in the magnetic silicone layer 14 is NdFeB powder or ferrite powder with strong magnetism, which can make the magnetic silicone layer 14 have a larger magnetic adsorption force and can be firmly adsorbed on the surface of the male mold core 13.

[0042] In one embodiment, the lower mold 2 further includes a spring 24 and a guide post 25 . The guide post 25 is vertically fixed in the accommodating cavity 2201 . The spring 24 is sleeved on the outer circumference of the guide post 25 and supports the die core 23 .

[0043] like Figure 5 As shown, the guide post 25 stands upright at the center of the accommodating cavity 2201 and is fixed to the lower mold plate 22. Specifically, a through hole may be provided on the bottom wall of the accommodating cavity 2201, and the guide post 25 is inserted into the through hole of the bottom wall of the accommodating cavity 2201. The spring 24 is sleeved on the outer periphery of the guide post 25, and the top of the spring 24 is higher than the guide post 25, and the die core 23 is placed on the top of the spring 24, so that the spring 24 can support the die core 23. When the male die core 13 of the upper mold 1 applies downward pressure to the female die core 23, the spring 24 located at the bottom of the female die core 23 can buffer the female die core 23, so that the stamping process is relatively gentle, the impact and vibration are reduced, and the quality of the stamping of the diaphragm 300 is improved. It can also protect the male die core 13 and the die core 23.

[0044] In one embodiment, the lower mold 2 further includes a plurality of positioning pins 26 for positioning the diaphragm 300, and all the positioning pins 26 are spaced apart and erected on the lower mold plate 22. When the diaphragm 300 is placed on the lower mold plate 22, each positioning pin 26 abuts against different positions of the edge of the diaphragm 300, thereby positioning the diaphragm 300 so that the diaphragm 300 cannot move, thereby ensuring the dimensional accuracy of the diaphragm 300 when stamped.

[0045] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A mold for thermoforming of electroplated IML membranes, characterized in that: The mold includes an upper mold and a lower mold, the upper mold includes an upper mold plate, a pressure plate and a male mold core, the pressure plate is located at the bottom of the upper mold plate, the male mold core is vertically embedded in the pressure plate and the upper mold plate in turn, one end of the male mold core protrudes from the bottom surface of the pressure plate, the lower mold includes a base, a lower mold plate and a female mold core, the lower mold plate is fixed on the base, a accommodating cavity is provided in the center of the lower mold plate, the female mold core is arranged in the accommodating cavity, the working surface of the male mold core is covered with a magnetic silicone layer mixed with magnetic powder, and the magnetic silicone layer is adsorbed on the working surface of the male mold core.

2. The mold according to claim 1, characterized in that The magnetic silicone layer comprises a silicone layer and a magnetic powder layer which are integrated into one, and the magnetic powder layer is attached to the working surface of the male mold core.

3. The mold according to claim 2, characterized in that The magnetic powder layer is formed by mixing and solidifying molten silica gel and magnetic powder, and the magnetic powder layer and the silica gel layer are combined into one by mold injection molding.

4. The mold according to claim 2, characterized in that: The magnetic powder layer is formed by mixing and curing magnetic powder and an adhesive, and the magnetic powder layer is combined with one side surface of the silicone layer by brushing.

5. The mold according to any one of claims 2 to 4, characterized in that: The Shore hardness of the silicone layer is 85HA-90HA.

6. The mold according to any one of claims 1 to 4, characterized in that: The magnetic powder is neodymium iron boron powder or ferrite powder.

7. The mold according to any one of claims 1 to 4, characterized in that: The lower die also includes a spring and a guide column, wherein the guide column is vertically fixed in the accommodating cavity, and the spring is sleeved on the outer circumference of the guide column and supports the die core.

8. The mold according to any one of claims 1 to 4, characterized in that: The lower mold also includes a plurality of positioning pins for positioning the diaphragm, and all the positioning pins are erected on the lower mold plate at intervals.

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