Composite heat insulation mica plate structure and preparation method thereof

Abstract

The invention discloses a composite heat insulation mica plate structure and a preparation method thereof, the composite heat insulation mica plate structure comprises a sandwich layer and support plates respectively located on two sides of the sandwich layer, the thickness of the support plates is 0.2-0.5 mm, and the thickness of the heat insulation sandwich layer in an original state is 0.8-1.5 mm. According to experimental inspection, the thickness of the supporting plate is 0.2-0.5 mm, and the thickness of the heat insulation sandwich layer in an original state is 0.8-1.5 mm. The heat insulation sandwich layer has elastic performance and high tensile toughness performance, and when the heat insulation sandwich layer wraps the outer surface of a battery, the heat insulation sandwich layer can provide good damage resistance and stably wraps the outer surface of the battery pack to achieve heat insulation and fire insulation capacity.

Description

Technical Field

[0001] The invention relates to the technical field of composite heat-insulating mica board structures, and in particular to a composite heat-insulating mica board structure and a preparation method thereof. Background Art

[0002] With the development of passive safety technology requirements in the new energy industry, single mica products can no longer meet the diverse requirements of different customers. In this context, many companies have developed a variety of "composite mica boards" to meet the requirements of different customers for thermal insulation and toughness. When the target thickness of the "composite mica board" made according to the existing solution is too high, especially when it reaches more than 1.5mm, it will cause large-area delamination, soft surface, and low strength.

[0003] Therefore, there is still a need for a composite thermal insulation mica board structure and a preparation method thereof to solve the above problems. Summary of the invention

[0004] The invention provides a composite heat-insulating mica board structure and a preparation method thereof for solving the above-mentioned problems.

[0005] The purpose of the present invention is achieved by the following technical solutions:

[0006] A composite heat-insulating mica board structure comprises a sandwich layer and support plates respectively located on both sides of the sandwich layer, wherein the thickness of the support plates is 0.2-0.5 mm, and the thickness of the heat-insulating sandwich layer in its original state is 0.8-1.5 mm.

[0007] In one embodiment, the compressed thickness of the sandwich layer is 0.4-1 mm, and the sandwich layer is a heat-insulating sandwich layer or a toughening sandwich layer.

[0008] In one embodiment, the ratio of the original thickness of the sandwich layer to the thickness after compression is: (1.2-2):1.

[0009] In one embodiment, it also includes a combination of sandwich layers and support plates arranged in an alternating order on either side of the support plate.

[0010] In one embodiment, the number of the support plates is 3, and the number of the sandwich layers is two.

[0011] In one embodiment, the number of the support plates is 5, and the number of the sandwich layers is three.

[0012] A method for preparing a composite thermal insulation mica board structure, used for preparing any of the above-mentioned composite thermal insulation mica board structures, comprising:

[0013] S1: Provide multiple support plates and sandwich layers, grind both sides of the support plate in the middle, and grind one side of the other two support plates serving as outer walls;

[0014] S2: Apply glue to the polished surface of the support plate serving as the outer wall;

[0015] S3: Glue a sandwich layer onto the support plate;

[0016] S4: attaching another support plate to the top of the sandwich layer by gluing;

[0017] S5: hot pressing the stacked sandwich layer and support plate;

[0018] S6: De-mould and take out the finished product.

[0019] Preferably, the polishing includes:

[0020] One side of the support plate was polished with 200-grit sandpaper, with a removal amount of 0.02-0.03 mm.

[0021] Preferably, when the number of supporting plates of the composite thermal insulation mica board structure is 3 layers, S3 is repeated 3 times.

[0022] Preferably, when the number of supporting plates of the composite thermal insulation mica board structure is 4, S3 is repeated 4 times.

[0023] Compared with the prior art, the beneficial effects of the present invention include at least:

[0024] According to experimental tests, the thickness of the support plate is 0.2-0.5mm, and the original thickness of the thermal insulation sandwich layer is 0.8-1.5mm. The thermal insulation sandwich layer has elastic properties and strong tensile toughness. When coated on the surface of the battery, it can provide good anti-destruction ability, stably coated on the surface of the battery pack, and play the role of heat insulation and fire protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of Embodiment 1 of the present invention;

[0026] Figure 2 It is a structural diagram of embodiment 2 of the present invention.

[0027] In the figure: 1. Support plate; 2. Sandwich layer. DETAILED DESCRIPTION

[0028] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to make the present invention more comprehensive and complete and to fully convey the concepts of example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted.

[0029] The words expressing positions and directions described in the present invention are all explained with reference to the accompanying drawings as examples, but they can be changed as needed, and all such changes are included in the protection scope of the present invention.

[0030] Reference Figure 1 As shown in Figure 2, the present invention provides a composite heat-insulating mica board structure, including: a sandwich layer 2 and support plates 1 located on both sides of the sandwich layer, the thickness of the support plate 1 is 0.2-0.5 mm, and the thickness of the heat-insulating sandwich layer 2 in its original state is 0.8-1.5 mm. The heat-insulating sandwich layer 2 and the support plate 1 in this thickness range have elastic properties and strong tensile toughness. When coated on the surface of the battery, they can provide good anti-destruction ability, stably coated on the surface of the battery pack, play the role of heat insulation and fire insulation, avoid the flame inside the battery from bursting out, and block the conditions for the generation of flames.

[0031] In one embodiment, the compressed thickness of the sandwich layer 2 is 0.4-1 mm, and the sandwich layer 2 is a heat-insulating sandwich layer 2 or a toughening sandwich layer 2. Materials with excellent heat-insulating capabilities such as ceramic-based nano-aerogel felt and glass fiber-based nano-aerogel felt can also be selected, which mainly play the role of reducing product density and increasing product heat-insulating capabilities. In the process of use, a thicker original felt should be used to press into a thinner sandwich layer 2 to meet the practical needs of lightweight.

[0032] In one embodiment, the ratio of the original thickness of the sandwich layer 2 to the thickness after compression is (1.2-2): 1. Experimental tests have shown that the sandwich layer 2 within this range can avoid delamination when combined with other layered structures, effectively maintaining the integrity of the structure.

[0033] In one embodiment, it also includes a combination of sandwich layers 2 and support plates 1 arranged alternately on either side of the support plate 1. The support plate 1 and sandwich layers 2 can be repeatedly stacked flexibly and variously to meet actual usage requirements.

[0034] In one embodiment, the number of the support plates 1 is three, and the number of the sandwich layers 2 is two.

[0035] In one embodiment, the number of the support plates 1 is 5, and the number of the sandwich layers 2 is three.

[0036] Another aspect of the present invention further discloses a method for preparing a composite heat-insulating mica board structure, which is used to prepare the composite heat-insulating mica board structure as described in any one of the above, comprising:

[0037] S1: Provide multiple support plates 1 and sandwich layers 2, polish both sides of the support plate 1 in the middle, and polish one side of the other two support plates 1 as the outer wall. The support plate 1 can be made of mica paper. The mica paper roll is coated with the above silicone resin by a coating machine, and dried in a tunnel furnace to form a mica paper prepreg with a thickness of 0.07-0.08mm and a resin content of 10% to 25%. The mica paper prepreg is stacked 3 to 4 layers, and then put into a hot press to heat, pressurize and solidify to form a 0.2 to 0.5mm thin plate.

[0038] S2: Apply glue to the polished surface of the support plate 1 as the outer wall. The polishing is to use 200-grit sandpaper to polish one side of the support plate 1, and the removal amount is 0.02-0.03 mm. After polishing, glue is applied to the surface of the support plate 1 to be bonded and butted.

[0039] S3: A sandwich layer 2 is bonded to the support plate 1 by glue. A sandwich layer 2 of ceramic-based nano-aerogel felt or ceramic fiber paper or glass fiber-based nano-aerogel felt is bonded to the support plate 1 by glue.

[0040] S4: attach another support plate 1 to the top of the sandwich layer 2 by gluing. Then, glue another support plate 1 to the sandwich layer 2 of the previous step by coating with glue.

[0041] S5: hot pressing the stacked sandwich layer 2 and the support plate 1. Finally, the stacked composite heat-insulating mica board structure is heated and pressed by applying an external force to the side of the support plate 1, so that the sandwich layer 2 and the support plate 1 can be stably fixed, which can effectively avoid subsequent separation.

[0042] S6: De-mould and take out the finished product.

[0043] The polishing includes:

[0044] One side of the support plate 1 is polished with 200-grit sandpaper, and the removal amount is 0.02-0.03 mm.

[0045] Preferably, when the number of supporting plates 1 of the composite thermal insulation mica board structure is 3, S3 is repeated 3 times.

[0046] When a product with 3 layers of support plates is selected, the order of laying the layers is:

[0047] 1) Take the single-sided glue-coated mica sheet with the glue side facing up as the first layer;

[0048] 2) Take the heat-insulating sandwich and lay it as the second layer;

[0049] 3) Lay down a double-sided glue-coated mica board as the third layer;

[0050] 4) Take the heat-insulating sandwich and lay it as the fourth layer;

[0051] 5) Take the single-sided glued mica board with the glue side facing down as the fifth layer.

[0052] Preferably, when the number of supporting plates 1 of the composite thermal insulation mica board structure is 4, S3 is repeated 4 times.

[0053] When product 2 with 5-layer support plate 1 is selected, the order of ply laying is:

[0054] 1) Take the single-sided glue-coated mica sheet with the glue side facing up as the first layer;

[0055] 2) Take the heat-insulating sandwich and lay it as the second layer;

[0056] 3) Lay down a double-sided glue-coated mica board as the third layer;

[0057] 4) Take the heat-insulating sandwich and lay it as the fourth layer;

[0058] 5) Take the single-sided adhesive-coated mica sheet with the adhesive side facing downward as the fifth layer;

[0059] 6) Take the single-sided adhesive-coated mica board with the adhesive side facing downward as the sixth layer;

[0060] 7) Take the single-sided glued mica board with the glue side facing down as the seventh layer.

[0061] test:

[0062] 1. Rub product 1 and product 2 repeatedly for 100 times with a force of 100N respectively, and both product 1 and product 2 are separated into layers;

[0063] 2. Rub product 1 and product 2 repeatedly for 500 times with a force of 100N. Product 1 is not layered, while product 2 is slightly layered.

[0064] 3. Rub product 1 and product 2 repeatedly for 1000 times with a force of 100N respectively. Product 1 will be slightly layered, while product 2 will be layered.

[0065] Through experimental verification, it is found that the composite thermal insulation mica board structure disclosed in the present invention has a high anti-delamination ability.

[0066] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, substitute and modify the above embodiments within the scope of the invention without departing from the principles and purpose of the present invention. All such changes should fall within the scope of protection of the claims of the present invention.

Claims

1. A composite thermal insulation mica board structure, characterized in that: include: The sandwich layer and the support plates are respectively located on both sides of the sandwich layer, the thickness of the support plates is 0.2-0.5mm, and the thickness of the heat insulating sandwich layer in the original state is 0.8-1.5mm.

2. The composite thermal insulation mica board structure according to claim 1, characterized in that: The compressed thickness of the sandwich layer is 0.4-1 mm, and the sandwich layer is a heat-insulating sandwich layer or a toughening sandwich layer.

3. The composite thermal insulation mica board structure according to claim 2, characterized in that: The ratio of the original thickness of the sandwich layer to the thickness after compression is (1.2-2):

1.

4. The composite thermal insulation mica board structure according to claim 3, characterized in that: It also includes a combination of sandwich layers and support plates arranged in an alternating order on either side of the support plate.

5. The composite thermal insulation mica board structure according to claim 4, characterized in that: The number of the support plates is 3, and the number of the sandwich layers is two.

6. The composite thermal insulation mica board structure according to claim 4, characterized in that: The number of the support plates is 5, and the number of the sandwich layers is three.

7. A method for preparing a composite thermal insulation mica board structure, used for preparing the composite thermal insulation mica board structure as claimed in any one of claims 1 to 6, characterized in that: include: S1: Provide multiple support plates and sandwich layers, grind both sides of the support plate in the middle, and grind one side of the other two support plates serving as outer walls; S2: Apply glue to the polished surface of the support plate serving as the outer wall; S3: Glue a sandwich layer onto the support plate; S4: attaching another support plate to the top of the sandwich layer by gluing; S5: hot pressing the stacked sandwich layer and support plate; S6: De-mould and take out the finished product.

8. The preparation method according to claim 7, characterized in that: The polishing includes: One side of the support plate was polished with 200-grit sandpaper, with a removal amount of 0.02-0.03 mm.

9. The preparation method according to claim 7, characterized in that: When the number of supporting plates of the composite thermal insulation mica board structure is 3, S3 is repeated 3 times.

10. The preparation method according to claim 7, characterized in that: When the number of supporting plates of the composite thermal insulation mica board structure is 4, S3 is repeated 4 times.

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