Metal film layer processing device
By designing a metal film processing device, using technical means such as pressurized plate, piston press pad, leading column, rear guide column and magnetic transformer components, the problems of easy cracking and uneven electroplating after heat treatment of titanium tubes are solved, and efficient electroplating processing of titanium tubes is achieved.
Patent Information
- Application Number
- CN202510194613.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-21
- Publication Date
- 2025-03-25
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The rapid cooling of titanium tubes after heat treatment is prone to cracks, and the electrolyte fluidity of the long titanium tubes is poor during the electroplating process, resulting in uneven plating of the inner wall.
A metal film layer processing device is designed, including a pressurized plate and a piston pressure pad to simulate the pressure bearing state of the titanium tube and detect the pressure bearing strength through a pressure sensor; at the same time, electrical contact is achieved using the leading column and the rear guide column, and the combination of magnetic variable components and impeller parts improves the flowability of the electrolyte.
By detecting the pressure bearing strength of the titanium tube, it is ensured that it enters the electroplating process after passing the titanium tube, and avoids waste of resources; at the same time, improve the uniformity of the electroplating of the inner wall of the titanium tube to ensure the uniformity and quality of the plating layer.
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Figure CN119685905A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of metal processing, and in particular to a metal film layer processing device. Background Art
[0002] Titanium tube is a tube made of titanium. It has the characteristics of light weight, high strength and corrosion resistance. When titanium tube is used for ship pipelines, it is usually electroplated during the production process to further improve its corrosion resistance.
[0003] During the production process, the titanium tubes used in ships will be heat treated to improve the hardness of the pipes, and then the surface of the titanium tubes will be cleaned and electroplated to achieve the strength, corrosion resistance and wear resistance required for the use of titanium tubes. The titanium tubes need to be quickly cooled after heat treatment and insulation to ensure that the hardness of the titanium tubes before electroplating meets the standard. However, the rapid cooling of the titanium tubes after heat treatment is prone to cracks. It is necessary to ensure that the hardness of the titanium tubes is qualified before electroplating to avoid unqualified titanium tubes from entering the subsequent electroplating process, resulting in a waste of processing resources. In addition, during the electroplating process of marine titanium tubes, the inner wall of the pipes needs to be electroplated simultaneously. However, the size of ships sailing at sea is usually large, and their use The length of the titanium tube is also long. During the electroplating process of the long titanium tube, the electrolyte in the tube has poor fluidity, which makes the electrolyte in the tube have a lower ion concentration than the electrolyte outside the tube, resulting in uneven electroplating on the inner wall of the titanium tube. At the same time, for the long titanium tube, the edge effect of the current will cause the electric lines to concentrate on the end edge of the titanium tube (the edge effect of the current refers to the uneven flow of the electrolyte on the electrode surface during the electroplating process, which causes the current to flow concentratedly at the edge of the electrode, causing uneven electroplating). The current density is large and the coating thickness increases, while in the middle there are fewer electric lines, the current density is small, and the coating thickness decreases. Therefore, a metal film layer processing device is proposed. Summary of the invention
[0004] The purpose of the present invention is to solve the problem that rapid cooling of titanium tubes after heat treatment in the prior art is prone to cracks. It is necessary to ensure that the hardness of the titanium tube is qualified before electroplating to avoid unqualified titanium tubes from entering the subsequent electroplating process, resulting in a waste of processing resources. In addition, the inner wall of the marine titanium tube needs to be electroplated synchronously during the electroplating process. However, the volume of ships sailing at sea is usually large, and the length of the titanium tubes used is also long. During the electroplating process of the long titanium tube, the electrolyte in the tube has poor fluidity, so that the electrolyte in the tube has a lower ion concentration than the electrolyte outside the tube, resulting in uneven electroplating on the inner wall of the titanium tube. A metal film layer processing device is proposed.
[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A metal film processing device, comprising a processing table and an electroplating tank for electroplating a titanium tube, wherein the inner side wall of the electroplating tank is fixedly connected to an electric control rail, and the inner side wall of the electric control rail is connected to four sliding push plates, and one side of the two sliding push plates located in the middle is provided with a limiting component for docking the titanium tube, and the two sliding push plates located at both ends are fixedly connected to a sealing seat, and the end of the sealing seat on one side is fixedly connected to a pressure sensor, and the end of the sealing seat on the other side is connected to a booster component for detecting the pressure bearing strength of the inner wall of the titanium tube; The top end of the processing table is fixedly connected to a capping plate by a plurality of pillars, the bottom end of the capping plate is fixedly connected to a pressure plate by two hydraulic cylinders, the bottom end of the capping plate is fixedly connected to two annular mechanical grippers by two electric push rods, a plurality of front guide pillars and rear guide pillars for electroplating conductive circuits are arranged in the annular mechanical grippers, a clamping assembly for conductive circuits is arranged in the front guide pillars, one end of the front guide pillars and the rear guide pillars are respectively provided with mutually adaptable docking slots, the other ends of the front guide pillars and the rear guide pillars are connected to external components through adapters, a rotating shaft is arranged between two adjacent adapters, the outer side walls of the rotating shaft are respectively fixedly connected with impeller components and annular rotating plates, and a magnetic variable assembly is arranged outside the annular rotating plate.
[0006] Preferably, the top of the processing table is fixedly connected to the bottom of the electroplating tank, and the outer wall of the electroplating tank is fixedly connected to a combined power supply with two output positive and negative poles, and the combined power supply on the positive pole side is connected to a nickel plate through a circuit.
[0007] Preferably, a through hole is opened on the side wall of the electroplating tank, and a placement groove for placing the titanium tube is fixedly connected to the outer wall of the electroplating tank located at the through hole, and the inner wall of the electric control guide rail is slidably connected to the side wall of the sliding push plate.
[0008] Preferably, the limiting assembly consists of two left limiting plates and two right limiting plates, the two left limiting plates are respectively fixedly connected to the output end of the sliding push plate located in the middle, and the right limiting plate is fixedly connected to the inner wall of the electroplating tank.
[0009] Preferably, the booster assembly is composed of a hydraulic push rod and a piston pad, and the sealing seat on the other side is fixedly connected to the end of the piston pad through the hydraulic push rod.
[0010] Preferably, two sliding holes are provided on the pressure plate, and the outer side wall of the piston rod of the electric push rod is slidably connected to the inner side wall of the sliding hole.
[0011] Preferably, the clamping assembly consists of a clamping telescopic rod and an electrically conductive column, a receiving groove is provided at one end of the front conductive column, the inner end surface of the receiving groove is fixedly connected to the electrically conductive column through the clamping telescopic rod, and a slot adapted to the electrically conductive column is provided at one end of the rear conductive column.
[0012] Preferably, the external connection component is composed of multiple external connection rods and multiple docking arc plates, the other end of the front guide column is fixedly connected to the other end of the rear guide column through an adapter seat, and the outer side wall of the adapter seat is fixedly connected to the inner side wall of the docking arc plate through the external connection rod.
[0013] Preferably, the magnetic variable component consists of an annular chamber and an electromagnetic coil, the outer wall of the fixed end of the external rod on one side is fixedly connected to the outer wall of the annular chamber through a fixed plate, the inner wall of the annular chamber is fixedly connected to the electromagnetic coil, the end of the rotating shaft is rotatably connected to the adapter seat, and a fan-shaped magnetic plate is arranged in the annular rotating plate.
[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. This scheme can use the pressure plate and the piston pressure pad to simulate the pressure-bearing state of the outer wall and the inner wall of the titanium tube when it is in use. According to the pressure change sensed by the pressure sensor, it is judged whether the pressure-bearing strength of the outer wall and the inner wall of the titanium tube is qualified, so as to ensure that the titanium tubes that enter the electroplating process later are qualified products.
[0015] 2. This scheme can achieve electrical contact with multiple butt arc plates and the inner wall of the titanium tube by setting up the front guide pillar and the rear guide pillar, so as to facilitate more uniform distribution of current density in the titanium tube and ensure better electroplating effect. The combination of multiple front guide pillars and rear guide pillars is convenient for electroplating of titanium tubes of different lengths.
[0016] 3. Through the arrangement of the magnetic variable component and the impeller, this scheme can utilize the change of the magnetic field of multiple electromagnetic coils to drive the rotation of the impeller, so that the electrolyte flows under the action of the rotating impeller, thereby significantly increasing the flow capacity of the electrolyte in the titanium tube, ensuring that the concentration of nickel ions in the electrolyte in the titanium tube is consistent with that outside the tube, making the electroplating of the inner wall of the titanium tube more uniform. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A schematic diagram of the three-dimensional structure of a metal film layer processing device proposed by the present invention; Figure 2 An assembly diagram of a metal film layer processing device proposed by the present invention; Figure 3 for Figure 2 The enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the structure inside an electroplating tank in a metal film layer processing device proposed by the present invention; Figure 5 It is a structural schematic diagram of a limited component in a metal film layer processing device proposed by the present invention; Figure 6 This is a schematic structural diagram of a hydraulic push rod and a piston pressure pad in a metal film layer processing device proposed by the present invention; Figure 7 This is a schematic diagram of the structure below the pressure plate in a metal film layer processing device proposed by the present invention; Figure 8 This is a structural schematic diagram of the positions of the front guide pillar and the rear guide pillar in a metal film layer processing device proposed by the present invention; Fig. 9 This is a schematic structural diagram of an external component in a metal film layer processing device proposed by the present invention; Fig.10 This is a schematic diagram of the structure of the interior of an annular chamber in a metal film processing device proposed by the present invention.
[0018] In the figure: 1. processing table; 2. electroplating tank; 3. titanium tube; 4. placement tank; 5. combined power supply; 6. nickel plate; 7. electric control guide rail; 8. sliding push plate; 9. left limit plate; 10. right limit plate; 11. sealing seat; 12. pressure sensor; 13. hydraulic push rod; 14. piston pressure pad; 15. capping plate; 16. hydraulic cylinder; 17. pressure plate; 18. electric push rod; 19. annular mechanical gripper; 20. front guide column; 21. clamping telescopic rod; 22. connecting conductive column; 23. rear guide column; 24. adapter seat; 25. external rod; 26. docking arc plate; 27. rotating shaft; 28. impeller; 29. annular rotating plate; 30. annular chamber; 31. electromagnetic coil. DETAILED DESCRIPTION
[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0021] Example, see Figures 1 to 10A metal film processing device comprises a processing table 1 and an electroplating tank 2 for electroplating a titanium tube 3, the inner wall of the electroplating tank 2 is fixedly connected with an electric control rail 7, the inner wall of the electric control rail 7 is connected with four sliding push plates 8, one side of the two sliding push plates 8 located in the middle is provided with a limiting component for docking the titanium tube 3, the two sliding push plates 8 located at both ends are fixedly connected with a sealing seat 11, the end of the sealing seat 11 on one side is fixedly connected with a pressure sensor 12, and the end of the sealing seat 11 on the other side is connected with a booster component for detecting the pressure bearing strength of the inner wall of the titanium tube 3; Furthermore, the top of the processing table 1 is fixedly connected to the bottom of the electroplating tank 2, the outer side wall of the electroplating tank 2 is fixedly connected to a combined power supply 5 with two output positive and negative electrodes, the combined power supply 5 on the positive side is connected to a nickel plate 6 through a line, a through hole is opened on the side wall of the electroplating tank 2, and the outer side wall of the electroplating tank 2 located at the through hole is fixedly connected to a placement groove 4 for placing the titanium tube 3, the inner side wall of the electric control guide rail 7 is slidably connected to the side wall of the sliding push plate 8, the limiting assembly is composed of two left limit plates 9 and two right limit plates 10, the two left limit plates 9 are respectively fixedly connected to the output end of the sliding push plate 8 located in the middle, the right limit plate 10 is fixedly connected to the inner side wall of the electroplating tank 2, the booster assembly is composed of a hydraulic push rod 13 and a piston pressure pad 14, and the sealing seat 11 on the other side is fixedly connected to the end of the piston pressure pad 14 through the hydraulic push rod 13; It should be noted that oxides and other impurities will form on the surface of the titanium tube 3 after heat treatment. In order to ensure the quality of electroplating and ensure sufficient stress relief time after heat treatment, electroplating processing will be carried out after surface cleaning and waiting for a certain period of time. The treatment before electroplating is the existing technology and will not be described in detail here. During electroplating, the titanium tube 3 to be electroplated is placed in the placement groove 4, and then the titanium tube 3 is pushed into the electroplating groove 2 through the through hole on the side wall of the electroplating groove 2 (to facilitate positioning the horizontal height of the titanium tube 3 in the placement groove 4, which is achieved by existing mechanical arm means during the pushing process). The inner arc side walls of the left limit plate 9 and the right limit plate 10 are aligned with the inner side walls of the through hole to facilitate the limiting and positioning of the titanium tube 3 after it is pushed in. Then the sliding push plates 8 at both ends are started to push out the two sealing seats 11. The sliding push plates 8 are hydraulic push plate structures, and then the electric control guide rails 7 are started to control the two sealing seats 11 through the sliding push plates 8 at both ends. The sealing seat 11 moves closer to the middle to compress and seal the two ends of the titanium tube 3, and then the pressure plate 17 is controlled to move downward by the hydraulic cylinder 16 to apply a certain pressure to the electrolyte in the electroplating tank 2 (the tank 4 is placed in this process for sealing treatment), simulating the pressure-bearing state of the outer wall of the titanium tube 3 during use. If the outer wall of the titanium tube 3 is not strong enough to withstand pressure and is broken and damaged, the high hydraulic pressure outside the tube will be transmitted to the inside of the tube through the damaged part, which will cause the pressure sensor 12 to sense the hydraulic pressure suddenly increase, indicating that the test is unqualified. After this test, the hydraulic push rod 13 is started to push the piston pressure pad 14 in the titanium tube 3, so that the electrolyte in the titanium tube 3 is pressed, so that the pressure on the inner wall of the titanium tube 3 continues to increase. If the pressure sensor 12 senses a sudden decrease in the hydraulic pressure during this process, the high hydraulic pressure in the tube is released to the outside of the tube through the damaged part, indicating that the inner wall of the titanium tube 3 is not strong enough to withstand pressure and is damaged. The above benefits are as follows: in this way, the pressure plate 17 and the piston pressure pad 14 can be used to respectively simulate the pressure-bearing state of the outer wall and the inner wall of the titanium tube 3 when in use, and according to the pressure change sensed by the pressure sensor 12, it is judged whether the pressure-bearing strength of the outer wall and the inner wall of the titanium tube 3 is qualified, so as to ensure that the titanium tubes 3 that enter the electroplating process later are all qualified products; The top of the processing table 1 is fixedly connected to a capping plate 15 through multiple pillars, the bottom of the capping plate 15 is fixedly connected to a pressure plate 17 through two hydraulic cylinders 16, and the bottom of the capping plate 15 is fixedly connected to two annular mechanical grippers 19 through two electric push rods 18. The annular mechanical grippers 19 are provided with multiple front guide pillars 20 and rear guide pillars 23 for electroplating conductive circuits, and the front guide pillars 20 are provided with clamping components for conductive circuits. One end of the front guide pillars 20 and the rear guide pillars 23 are respectively provided with mutually adapted docking slots, and the other ends of the front guide pillars 20 and the rear guide pillars 23 are connected to external components through adapters 24; Furthermore, the pressure plate 17 is provided with two sliding holes, the outer side wall of the piston rod of the electric push rod 18 is slidably connected to the inner side wall of the sliding hole, the clamping assembly is composed of a clamping telescopic rod 21 and an electrical connection conductive column 22, a storage groove is provided at one end of the front guide column 20, the inner end surface of the storage groove is fixedly connected to the electrical connection conductive column 22 through the clamping telescopic rod 21, a slot adapted to the electrical connection conductive column 22 is provided at one end of the rear guide column 23, the external connection assembly is composed of a plurality of external connection rods 25 and a plurality of docking arc plates 26, the other end of the front guide column 20 is fixedly connected to the other end of the rear guide column 23 through the adapter seat 24, and the outer side wall of the adapter seat 24 is fixedly connected to the inner side wall of the docking arc plate 26 through the external connection rod 25; It should be particularly noted that: when the front guide post 20 and the rear guide post 23 are combined and docked, the power connection post 22 on the front guide post 20 is aligned with the slot on the rear guide post 23, and the power connection post 22 is pressed into the slot by pressing the telescopic rod 21, and then the docking slots of the front guide post 20 and the rear guide post 23 that are adapted to each other are rotated relative to each other, so that the two docking slots are mutually limited, and are tightened by the elastic force of the compression of the telescopic rod 21 to ensure the firmness of the combination of the front guide post 20 and the rear guide post 23. In this process, the front guide post 20 and the rear guide post 23 are in a state of circuit connection; It should be noted that: after the pressure test of the inner and outer walls of the titanium tube 3 is completed, the titanium tube 3 is allowed to re-enter the placement groove 4, and then the electric push rod 18 is used to push the annular mechanical gripper 19 downward to push the combined front guide column 20 and the rear guide column 23 into the electrolyte to a position horizontal to the through hole, and then the titanium tube 3 is pushed into the electroplating tank 2 again, so that the combined front guide column 20 and the rear guide column 23 enter the interior of the titanium tube 3, and the docking arc plate 26 connected to the external connecting rod 25 will slide with the inner side wall of the titanium tube 3, and the annular mechanical gripper 19 will be opened and separated one by one. After the titanium tube 3 is completely passed through, the combined front guide column 20 and the rear guide column 23 are connected to the cathode end of the combined power supply 5 to realize the circuit connection (this is the existing conventional technical means). At this time, the cathode ends of the two combined power supplies 5 are electrically connected to the combined front guide column 20 and the rear guide column 23 components in the titanium tube 3, and the anode ends of the two combined power supplies 5 are electrically connected to the nickel plate 6. Turning on the combined power supply 5 can realize the electroplating of the titanium tube 3; The above advantages are as follows: multiple butt arc plates 26 can be used to achieve electrical contact with the inner wall of the titanium tube 3 (the diameter of the annular surface where the outer arc surfaces of the multiple butt arc plates 26 are located is the same as the inner diameter of the titanium tube 3, so that the outer arc surfaces of the butt arc plates 26 can be adapted to contact with the inner wall of the titanium tube 3 after being pushed in), which facilitates a more uniform distribution of current density in the titanium tube 3, ensuring a better electroplating effect, and the combination of multiple front guide pillars 20 and rear guide pillars 23 is convenient for electroplating titanium tubes 3 of different lengths; A rotating shaft 27 is disposed between two adjacent adapter seats 24, and an outer wall of the rotating shaft 27 is respectively fixedly connected with an impeller 28 and an annular rotating plate 29, and a magnetic variable component is disposed outside the annular rotating plate 29; Furthermore, the magnetic variable assembly is composed of an annular chamber 30 and an electromagnetic coil 31, the outer wall of the fixed end of the external connecting rod 25 on one side is fixedly connected to the outer wall of the annular chamber 30 through a fixed plate, the inner wall of the annular chamber 30 is fixedly connected to the electromagnetic coil 31, the end of the rotating shaft 27 is rotatably connected to the adapter 24, and a sector-shaped magnetic plate is arranged in the annular rotating plate 29; It should be noted that: during the process of electroplating by energizing, the circuit formed by the combination of the front guide column 20 and the rear guide column 23 will generate an annular magnetic field along the front guide column 20 and the rear guide column 23 during the flow of current, and in this process, multiple electromagnetic coils 31 will be alternately energized in sequence, and the fan-shaped magnetic plate in the annular rotating plate 29 will rotate due to the magnetic attraction of the electromagnetic coils 31 that are energized one by one, and the fan-shaped magnetic plate in the annular rotating plate 29 will rotate, and the rotation direction of the fan-shaped magnetic plate in the annular rotating plate 29 is consistent with the direction of the annular magnetic field along the front guide column 20 and the rear guide column 23, so that the annular rotating plate 29 drives the rotating shaft 27 to rotate between the two adapter seats 24, and then drives the impeller 28 to rotate. The rotation of the impeller 28 will continuously rotate the electrolyte, so that the electrolyte in the electroplating tank 2 is rotated into one end of the titanium tube 3 and rotated out from the other end; The above advantages are as follows: the change of the magnetic field of the plurality of electromagnetic coils 31 can be used to drive the rotation of the impeller 28, so that the electrolyte flows under the action of the rotating impeller 28, thereby significantly increasing the flow capacity of the electrolyte in the titanium tube 3, ensuring that the concentration of nickel ions in the electrolyte in the titanium tube 3 is consistent with that outside the tube, so that the inner wall of the titanium tube 3 is electroplated more evenly; When the present invention is used, oxides and other impurities will be formed on the surface of the titanium tube 3 after heat treatment. In order to ensure the quality of electroplating and ensure that the stress relief time after heat treatment is sufficient, electroplating processing will be carried out after the surface is cleaned and waiting for a certain period of time. The treatment before electroplating is a prior art and will not be described in detail here. When electroplating is carried out, the titanium tube 3 to be electroplated is placed in the placement tank 4, and then the titanium tube 3 is pushed into the electroplating tank 2 through the through hole on the side wall of the electroplating tank 2 (to facilitate the horizontal height of the titanium tube 3 in the placement tank 4, and to facilitate the horizontal height of the titanium tube 3 in the pushing tank 4). During the insertion process, the inner arc side walls of the left limit plate 9 and the right limit plate 10 are aligned with the inner side walls of the through hole, which is convenient for limiting and positioning after the titanium tube 3 is pushed in. Then, the sliding push plates 8 at both ends are started to push out the two sealing seats 11. The sliding push plates 8 are hydraulic push plate structures. Then, the electric control guide rail 7 is started to control the two sealing seats 11 to move closer to the middle through the sliding push plates 8 at both ends, and the two ends of the titanium tube 3 are pressed and sealed. Then, the pressure plate 17 is controlled to move downward by the hydraulic cylinder 16 to press the titanium tube 3 in the electroplating tank 2. The electrolyte applies a certain pressure (in this process, a groove 4 is placed to perform a sealing treatment) to simulate the pressure-bearing state of the outer wall of the titanium tube 3 during use. If the pressure-bearing strength of the outer wall of the titanium tube 3 is insufficient and ruptures and damages occur, the high hydraulic pressure outside the tube will be transmitted to the inside of the tube through the damaged part, which will cause the pressure sensor 12 to sense the hydraulic pressure to suddenly increase, indicating that the test is unqualified. After this test, the hydraulic push rod 13 is started to push the piston pressure pad 14 in the titanium tube 3, so that the electrolyte in the titanium tube 3 is pressed, and the pressure on the inner wall of the titanium tube 3 continues to increase. If the pressure sensor 12 senses a sudden decrease in the hydraulic pressure during this process, the high hydraulic pressure in the tube is released to the outside of the tube through the damaged part, indicating that the pressure-bearing strength of the inner wall of the titanium tube 3 is insufficient and damaged. In this way, the pressure plate 17 and the piston pressure pad 14 can be used to simulate the pressure-bearing state of the outer wall and the inner wall of the titanium tube 3 when in use, respectively. According to the pressure change sensed by the pressure sensor 12, it is judged whether the pressure-bearing strength of the outer wall and the inner wall of the titanium tube 3 is qualified, so as to ensure that the titanium tubes 3 that enter the electroplating process later are all qualified products; After the pressure test of the inner and outer walls of the titanium tube 3 is completed, the titanium tube 3 is allowed to re-enter the placement groove 4, and then the electric push rod 18 is used to push the annular mechanical gripper 19 downward to push the combined front guide column 20 and the rear guide column 23 into the electrolyte to a position horizontal to the through hole, and then the titanium tube 3 is pushed into the electroplating tank 2 again, so that the combined front guide column 20 and the rear guide column 23 enter the interior of the titanium tube 3, and the docking arc plate 26 connected by the external rod 25 will slide with the inner wall of the titanium tube 3, and the annular mechanical gripper 19 will open and separate one by one. After the titanium tube 3 has completely passed through, the combined front guide column 20 and the rear guide column 23 are allowed to pass through the electroplating tank 2 again. The circuit connection is realized at the cathode end of the combined power source 5 (this is an existing conventional technical means), then the cathode ends of the two combined power sources 5 are electrically connected to the combined front guide column 20 and the rear guide column 23 components in the titanium tube 3, and the anode ends of the two combined power sources 5 are electrically connected to the nickel plate 6. The combined power source 5 can be turned on to realize electroplating of the titanium tube 3. In this way, multiple docking arc plates 26 and the inner wall of the titanium tube 3 can be used to achieve electrical contact, which is convenient for the current density to be more evenly distributed in the titanium tube 3, ensuring a better electroplating effect. The combination of multiple front guide columns 20 and rear guide columns 23 is convenient for electroplating of titanium tubes 3 of different lengths; During the electroplating process, the circuit formed by the front guide column 20 and the rear guide column 23 will generate a circular magnetic field along the front guide column 20 and the rear guide column 23 during the flow of current, and multiple electromagnetic coils 31 will be alternately energized in sequence during this process, and the fan-shaped magnetic plate in the annular rotating plate 29 will rotate due to the magnetic attraction of the electromagnetic coils 31 that are energized one by one, and the rotation direction of the fan-shaped magnetic plate in the annular rotating plate 29 is consistent with the direction of the annular magnetic field along the front guide column 20 and the rear guide column 23, so that the annular rotating plate 29 drives the rotating shaft 27 rotates between the two adapters 24, thereby driving the impeller 28 to rotate. The rotation of the impeller 28 will continuously rotate the electrolyte, so that the electrolyte in the electroplating tank 2 is rotated into one end of the titanium tube 3 and rotated out of the other end. In this way, the change of the magnetic field of the multiple electromagnetic coils 31 can be used to drive the rotation of the impeller 28, so that the electrolyte flows under the action of the rotating impeller 28, thereby significantly increasing the flow capacity of the electrolyte in the titanium tube 3, ensuring that the concentration of nickel ions in the electrolyte in the titanium tube 3 is consistent with that outside the tube, so that the electroplating of the inner wall of the titanium tube 3 is more uniform.
[0022] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A metal film processing device, comprising a processing table (1) and an electroplating tank (2) for electroplating a titanium tube (3), characterized in that: The inner wall of the electroplating tank (2) is fixedly connected to an electric control rail (7), and the inner wall of the electric control rail (7) is connected to four sliding push plates (8), and one side of the two sliding push plates (8) located in the middle is provided with a limiting component for docking with the titanium tube (3), and the two sliding push plates (8) located at the two ends are fixedly connected to a sealing seat (11), and the end of the sealing seat (11) on one side is fixedly connected to a pressure sensor (12), and the end of the sealing seat (11) on the other side is connected to a booster component for detecting the pressure bearing strength of the inner wall of the titanium tube (3); The top of the processing table (1) is fixedly connected to a capping plate (15) via a plurality of pillars, the bottom of the capping plate (15) is fixedly connected to a pressure plate (17) via two hydraulic cylinders (16), the bottom of the capping plate (15) is fixedly connected to two annular mechanical grippers (19) via two electric push rods (18), the annular mechanical grippers (19) are provided with a plurality of front guide pillars (20) and rear guide pillars (23) for electroplating conduction circuits, the front guide pillars (20) are provided with A clamping assembly for conducting a circuit, wherein one end of the front guide column (20) and the rear guide column (23) are respectively provided with mutually adaptable docking slots, and the other ends of the front guide column (20) and the rear guide column (23) are connected to an external component via an adapter seat (24), and a rotating shaft (27) is provided between two adjacent adapter seats (24), and an outer side wall of the rotating shaft (27) is respectively fixedly connected to an impeller component (28) and an annular rotating plate (29), and a magnetic variable component is provided outside the annular rotating plate (29).
2. A metal film processing device according to claim 1, characterized in that: The top of the processing table (1) is fixedly connected to the bottom of the electroplating tank (2), and the outer wall of the electroplating tank (2) is fixedly connected to a combined power supply (5) with two output positive and negative electrodes, and the combined power supply (5) located on the positive electrode side is connected to a nickel plate (6) through a line.
3. The metal film processing device according to claim 1, characterized in that: The side wall of the electroplating tank (2) is provided with a through hole, the outer side wall of the electroplating tank (2) located at the through hole is fixedly connected with a placement groove (4) for placing the titanium tube (3), and the inner side wall of the electric control guide rail (7) is slidably connected to the side wall of the sliding push plate (8).
4. The metal film processing device according to claim 1, characterized in that: The limiting assembly consists of two left limiting plates (9) and two right limiting plates (10), the two left limiting plates (9) being respectively fixedly connected to the output ends of the sliding push plate (8) located in the middle, and the right limiting plate (10) being fixedly connected to the inner wall of the electroplating tank (2).
5. The metal film processing device according to claim 1, characterized in that: The booster assembly is composed of a hydraulic push rod (13) and a piston pressure pad (14), and the sealing seat (11) on the other side is fixedly connected to the end of the piston pressure pad (14) through the hydraulic push rod (13).
6. The metal film processing device according to claim 1, characterized in that: The pressure plate (17) is provided with two sliding holes, and the outer side wall of the piston rod of the electric push rod (18) is slidably connected to the inner side wall of the sliding hole.
7. The metal film processing device according to claim 1, characterized in that: The clamping assembly is composed of a clamping telescopic rod (21) and an electrical connection conductive column (22); a receiving groove is provided at one end of the front conductive column (20); an inner end surface of the receiving groove is fixedly connected to the electrical connection conductive column (22) via the clamping telescopic rod (21); and a slot adapted to the electrical connection conductive column (22) is provided at one end of the rear conductive column (23).
8. The metal film processing device according to claim 1, characterized in that: The external connection assembly is composed of a plurality of external connection rods (25) and a plurality of docking arc plates (26); the other end of the front guide column (20) is fixedly connected to the other end of the rear guide column (23) via a transfer seat (24); and the outer side wall of the transfer seat (24) is fixedly connected to the inner side wall of the docking arc plate (26) via the external connection rods (25).
9. The metal film processing device according to claim 8, characterized in that: The magnetic variable component is composed of an annular chamber (30) and an electromagnetic coil (31); the outer wall of the fixed end of the external connecting rod (25) on one side is fixedly connected to the outer wall of the annular chamber (30) through a fixed plate; the inner wall of the annular chamber (30) is fixedly connected to the electromagnetic coil (31); the end of the rotating shaft (27) is rotatably connected to the adapter seat (24); and a fan-shaped magnetic plate is arranged inside the annular rotating plate (29).
Citation Information
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