A semiconductor heat exchange device for coating temperature control

Abstract

The present invention relates to the technical field of heat exchange equipment, and specifically to a semiconductor heat exchange device for controlling the temperature of a coating, which includes a shell, a flow guide tube and a heat exchange tube; the heat exchange tube spirals from top to bottom, and the horizontal projection is a spiral linear, and the large diameter part is located above the small diameter part. This spiral method can guide the spiral flow of the coating, and the coating is constantly thrust by the wall of the heat exchange tube during the spiral flow, so that the flow direction of the coating is constantly changed, causing disturbances, and increasing the contact area between the fluid and the wall of the heat exchange tube and the contact area between the fluid and the fluid, so that the temperature of the coating in the heat exchange tube tends to be consistent, avoiding the problems of precipitation sticking to the wall and uneven heat exchange, optimizing the heat exchange effect, and improving the heat exchange efficiency. In addition, an inwardly protruding spoiler groove is provided on the heat exchange tube, and the spoiler groove is spirally wound along the length direction of the heat exchange tube. Further disrupting the fluid in the heat exchange tube, the present invention improves the cleaning efficiency while ensuring the heat exchange effect and efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of heat exchange equipment, and in particular to a semiconductor heat exchange device for controlling the temperature of a coating. Background Art

[0002] The working principle of semiconductor heat exchange devices is based on the thermoelectric effect, that is, when electric current passes through semiconductor materials, heat transfer occurs. In paint production workshops, it is often used to adjust the temperature of paint, thereby optimizing the performance and construction quality of the paint. Most of the current semiconductor heat exchange devices use semiconductors to dissipate heat from the pipeline, and common pipeline arrangements include U-type and parallel types. However, when this connection method is used to exchange heat for materials, the material flow rate in the pipeline is uneven, resulting in poor heat exchange effect.

[0003] To this end, the related art proposes a spirally arranged tubular heat exchange device, which reduces the difference in flow velocity in the pipeline to a certain extent. However, during the heat exchange process of the spirally arranged tubular heat exchanger, the flow direction of the material in the pipeline is relatively regular, and the flow velocity has significant characteristics: the material flow velocity at the inner periphery is the largest, the material flow velocity at the outer periphery is slower, and the material flow velocity at the lower periphery is less than the coating flow velocity at the upper periphery; due to the difference in the flow velocity of the material in the pipeline, the heat dissipated during heat exchange is also different, and the position with a small flow velocity has a relatively more sufficient contact time with the pipeline. After the same cooling time, the temperature of the material in this part is lower, and the material at the position with a large flow velocity cannot be fully cooled. The material flowing out through the discharge joint still has the problem of uneven temperature, and the heat exchange effect is poor. In addition, since the material flow velocity at the lower periphery is the smallest, it is easy to be overcooled, and the material will precipitate and stick to the wall in the pipeline, affecting the subsequent heat exchange effect and efficiency. After the heat exchange is completed, it is difficult to clean the pipeline. Summary of the invention

[0004] In view of the deficiencies of the prior art, the present invention proposes a semiconductor heat exchange device for controlling the temperature of a coating, which solves the problem of uneven heat dissipation of tubular heat dissipation devices in the prior art, as well as the problem of precipitation sticking to the wall and difficulty in cleaning in the pipeline.

[0005] A semiconductor heat exchange device for controlling the temperature of a coating according to the present invention adopts the following technical solution, including a shell, a flow guide tube and a heat exchange tube;

[0006] The guide tube extends horizontally, with one end extending out of the shell and the other end connected to the heat exchange tube. The end extending out of the shell is the feed port. The heat exchange tube is installed in the shell, and the end of the heat exchange tube away from the guide tube is the discharge port. The heat exchange tube spirals from top to bottom, and the horizontal projection is a spiral line, with the large diameter part located above the small diameter part.

[0007] Optionally, an outer wall of the heat exchange tube is provided with an inwardly recessed spoiler groove, and the spoiler groove is spirally wound along the length direction of the heat exchange tube.

[0008] Optionally, the pitch of the spoiler groove gradually decreases from the feed inlet to the discharge outlet.

[0009] Optionally, a mounting groove having the same shape as the flow guide tube and the heat exchange tube is provided in the shell.

[0010] Optionally, a heat exchange plate is detachably connected above the shell, and the heat exchange plate is arranged horizontally.

[0011] Optionally, a plurality of semiconductor refrigeration fins are arranged above the heat exchange plate.

[0012] Optionally, a placement plate is connected above the heat exchange plate, and placement grooves are provided on the placement plate, and a semiconductor refrigeration plate is installed in each placement groove.

[0013] Optionally, a heat conducting plate is connected above the placement plate.

[0014] Optionally, a plurality of heat exchange fins are densely arranged above the heat conducting plate, and the heat conducting plate and the heat exchange fins are integrally formed.

[0015] Optionally, the feed inlet is connected to a feed connector.

[0016] The beneficial effects of the present invention are as follows: a semiconductor heat exchange device for controlling the temperature of a coating material of the present invention comprises a shell, a guide tube and a heat exchange tube; the heat exchange tube spirals from top to bottom, and the horizontal projection is a spiral linear, with the large diameter portion located at the upper end of the small diameter portion. This spiral method can guide the spiral flow of the coating material, and the coating material is continuously thrust by the wall of the heat exchange tube during the spiral flow, so that the flow direction of the coating material continuously changes and becomes disturbed, and the contact area between the fluid and the wall of the heat exchange tube and the contact area between the fluid and the fluid are increased, so that the temperature of the coating material in the heat exchange tube tends to be consistent, avoiding the problems of precipitation sticking to the wall and uneven heat exchange, optimizing the heat exchange effect, and improving the heat exchange efficiency.

[0017] Furthermore, spiral flow disturbance grooves are provided in the flow guide tube and the heat exchange tube, so as to further disturb the coating in the flow guide tube and the heat exchange tube, so that the coating flow speed on the same cross section tends to be consistent, thereby optimizing the heat exchange effect and improving the heat exchange efficiency. And due to the presence of the flow disturbance grooves, during the flushing process, the flushing liquid can be disturbed after entering at a relatively low speed, without the need for an additional pressurized acceleration device. The present invention improves the cleaning efficiency while ensuring the heat exchange effect and efficiency. In addition, the spiral heat exchange tube cooperates with the variable pitch spiral flow disturbance groove to make the coating flow speed through the feed port and the coating flow speed through the discharge port tend to be consistent, thereby further improving the heat exchange efficiency and optimizing the heat exchange effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 This is a schematic diagram of the overall structure of a semiconductor heat exchange device for controlling the temperature of a coating according to the present invention;

[0020] Figure 2 It is a front view of a semiconductor heat exchange device for controlling the temperature of a coating according to the present invention;

[0021] Figure 3 This is a schematic diagram of the explosion structure of Example 1;

[0022] Figure 4 It is a schematic diagram of the structure of the flow guide tube and the heat exchange tube in Example 1;

[0023] Figure 5 This is a schematic diagram of the explosion structure of Example 2;

[0024] Figure 6 It is a schematic diagram of the structure of the flow guide tube and the heat exchange tube in the second embodiment;

[0025] Figure 7 It is a front view of the flow guide tube and the heat exchange tube in the second embodiment.

[0026] In the figure:

[0027] 100, housing; 110, mounting slot;

[0028] 200, flow guide pipe; 210, feed connector;

[0029] 300, heat exchange tube; 310, spoiler groove; 320, discharge joint;

[0030] 400, heat exchange plate;

[0031] 500, placement plate; 510, semiconductor cooling sheet;

[0032] 600, heat conduction plate; 610, heat exchanger plate. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0034] Embodiment 1

[0035] like Figures 1 to 4 As shown, a semiconductor heat exchange device for controlling the temperature of a coating proposed in this embodiment includes a shell 100, a flow guide tube 200 and a heat exchange tube 300; the flow guide tube 200 extends horizontally, one end of which extends out of the shell 100, and the other end is connected to the heat exchange tube 300, and the end of the flow guide tube 200 extending out of the shell 100 is a feed port, and the feed port is connected to a feed connector 210; the heat exchange tube 300 is installed in the shell 100, and the end of the heat exchange tube 300 away from the flow guide tube 200 is a discharge port, and the discharge port is connected to a discharge connector 320; the heat exchange tube 300 spirals from top to bottom, and the horizontal projection is a spiral line, and the large diameter part is located above the small diameter part.

[0036] A heat exchange plate 400 is bolted to the top of the shell 100. The heat exchange plate 400 is arranged horizontally. A placement plate 500 is connected to the top of the heat exchange plate 400. The placement plate 500 is provided with placement slots. A semiconductor refrigeration plate 510 is installed in each placement slot. The cold side of the semiconductor refrigeration plate 510 faces downward and the hot side faces upward. A heat conducting plate 600 is connected to the top of the placement plate 500 and the semiconductor refrigeration plate 510. A plurality of heat exchange plates 610 are densely arranged above the heat conducting plate 600. The heat conducting plate 600 and the heat exchange plates 610 are integrally formed. The heat exchange plates 610 are made of aluminum.

[0037] During the production process, when the temperature of the paint is too high, the paint needs to be cooled. At this time, the paint is injected into the guide tube 200 from the feed joint 210, and then the paint enters the heat exchange tube 300 through the guide tube 200. When the paint flows in the guide tube 200 and the heat exchange tube 300, heat conduction occurs between the guide tube 200 and the heat exchange tube 300, thereby reducing the temperature of the paint and completing the control of the paint temperature. Then the paint flows out from the discharge joint 320.

[0038] After the coating material is heat-conducted with the flow guide tube 200 and the heat exchange tube 300, the temperature of the coating material decreases, the temperature of the flow guide tube 200 and the heat exchange tube 300 increases, the flow guide tube 200 and the heat exchange tube 300 exchange heat with the housing 100, the cold surface of the semiconductor cooling sheet 510 contacts the heat exchange plate 400, and the temperature of the heat exchange plate 400 and the housing 100 is reduced; the hot surface of the semiconductor contacts the heat conduction plate 600, and the heat is dissipated through the closely arranged heat exchange sheets 610 on the heat conduction plate 600. The heat exchange efficiency is accelerated by arranging the heat exchange plate 400, the semiconductor cooling sheet 510, the heat conduction plate 600 and the heat exchange sheets 610.

[0039] The heat exchange device of the present invention sets the heat exchange tube 300 as a vortex spiral structure and spirally winds it from top to bottom. When the paint flows in the heat exchange tube 300, the paint is guided to flow in a spiral flow, and the paint is continuously thrust by the wall of the heat exchange tube 300 during the spiral flow, so that the flow direction of the paint is constantly changed, and the peripheral fluid and the inner shaft fluid are disturbed, while the contact between the fluid and the wall of the heat exchange tube 300 is increased, so that the temperature of the paint in the heat exchange tube 300 tends to be consistent, avoiding the problems of precipitation sticking to the wall and uneven heat exchange, optimizing the heat exchange effect, and improving the heat exchange efficiency.

[0040] Embodiment 2

[0041] like Figure 1 , Figure 2 , Figure 5 , Figure 6 and Figure 7 As shown, compared with the first embodiment, in a semiconductor heat exchange device for controlling the temperature of a coating provided in this embodiment, an outer wall of a heat exchange tube 300 is provided with an inwardly recessed spoiler groove 310, and the spoiler groove 310 is spirally wound along the length direction of the heat exchange tube 300, and an installation groove 110 consistent with the shape of the guide tube 200 and the heat exchange tube 300 is provided in the shell 100, and the guide tube 200 and the heat exchange tube 300 are installed in the installation groove 110.

[0042] The present invention obstructs and guides the paint by setting spiral spoiler grooves 310 in the guide tube 200 and the heat exchange tube 300; when the paint flows in the guide tube 200 and the heat exchange tube 300, the peripheral paint is obstructed by the spoiler grooves 310, causing the paint originally located at the periphery and the paint originally located at the inner periphery to be disturbed, thereby reducing the flow velocity difference between the inner and outer peripheral paints, and making the paint flow velocity of the same cross section in the heat exchange tube 300 tend to be consistent.

[0043] The spoiler groove 310 guides the paint in the circumferential direction of the guide tube 200 and the heat exchange tube 300, and guides the paint originally located below the outer periphery upward, thereby increasing the flow rate of this part of the paint, thereby preventing the paint that is always located below the outer periphery of the guide tube 200 and the heat exchange tube 300 from precipitating and sticking to the wall; at the same time, the paint flow rate of the same cross section in the heat exchange tube 300 is further made consistent, thereby optimizing the heat exchange effect and improving the heat exchange efficiency. And due to the existence of the spoiler groove 310, during the flushing process, the flushing liquid can be turbulent after entering at a relatively low speed, without the need for an additional pressurization acceleration device. The present invention improves the cleaning efficiency while ensuring the heat exchange effect and efficiency.

[0044] Furthermore, the pitch of the spoiler groove 310 gradually decreases from the feed port to the discharge port. When the coating flows in the heat exchange tube 300, the kinetic energy of the coating is lost, and the flow speed gradually slows down, which will affect the efficiency and effect of heat exchange. The present invention sets the pitch of the spoiler groove 310 to gradually decrease, so that in the direction from the feed port to the discharge port, the volume in the latter unit length of the heat exchange tube 300 is smaller than the volume in the former unit length of the heat exchange tube 300. When the coating flows in the heat exchange tube 300, since the volume in the unit length of the heat exchange tube 300 gradually decreases, the speed of flowing through the latter unit length is greater than the speed of flowing through the former unit length, thereby compensating for the loss of kinetic energy and making the speed of the coating when flowing through the feed port and the discharge port tend to be consistent, thereby further improving the efficiency of heat exchange and optimizing the heat exchange effect.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor heat exchange device for controlling the temperature of a coating, characterized in that: It includes a shell, a flow guide tube and a heat exchange tube; a heat exchange plate is detachably connected to the top of the shell, the heat exchange plate is arranged horizontally, a plurality of semiconductor refrigeration plates are arranged above the heat exchange plate, the cold surface of the semiconductor refrigeration plates faces downward and the hot surface faces upward, a heat conduction plate is connected to the top of the semiconductor refrigeration plates, and a plurality of heat exchange plates are closely arranged above the heat conduction plate; the flow guide tube extends horizontally, one end of which extends out of the shell, and the other end is connected to the heat exchange tube, and the end extending out of the shell is a feed port; The heat exchange tube is installed in the shell, and an installation groove with the same shape as the guide tube and the heat exchange tube is provided in the shell. The end of the heat exchange tube away from the guide tube is the discharge port; the heat exchange tube spirals from top to bottom, and the horizontal projection is a spiral line. The large diameter part is located above the small diameter part. The outer wall of the heat exchange tube is provided with an inwardly concave spoiler groove, which is spirally wound along the length direction of the heat exchange tube, and the pitch of the spoiler groove gradually decreases from the feed port to the discharge port.

2. A semiconductor heat exchange device for controlling the temperature of a coating material according to claim 1, characterized in that: A placement plate is connected above the heat exchange plate, and placement slots are provided on the placement plate. A semiconductor refrigeration plate is installed in each placement slot.

3. A semiconductor heat exchange device for controlling the temperature of a coating material according to claim 2, characterized in that: The heat conducting plate is connected above the placement plate.

4. A semiconductor heat exchange device for controlling the temperature of a coating material according to claim 3, characterized in that: The heat conducting plate and the heat exchanging fin are integrally formed.

5. The semiconductor heat exchange device for controlling the temperature of coating material according to claim 1, characterized in that: The feed inlet is connected with a feed connector.

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