Bonding wire arc rigidity detection equipment and bonding wire arc rigidity detection method

Abstract

The invention relates to the technical field of bonding wire arc detection equipment, in particular to bonding wire arc rigidity detection equipment and a bonding wire arc rigidity detection method, and the bonding wire arc rigidity detection equipment comprises a control part, a vibration simulation assembly, a test piece and an acquisition assembly. The vibration simulation assembly comprises a driving part and a vibration platform which are in transmission connection, and the control part is in communication connection with the driving part to control the driving part to drive the vibration platform to vibrate according to a preset mode. The test piece is used for bonding a to-be-tested bonding wire arc, and the test piece is detachably connected with the vibration simulation assembly. The acquisition assembly is in communication connection with the control part. According to the bonding wire arc rigidity detection equipment and the bonding wire arc rigidity detection method provided by the invention, the offset obtained by the actual vibration test through the vibration platform is closer to the actual vibration service condition, the data is more real and reliable, and the reliability and safety of bonding wire packaging are improved.

Description

Technical Field

[0001] The present application relates to the technical field of bonding wire arc detection equipment, and in particular to a bonding wire arc rigidity detection equipment and a bonding wire arc rigidity detection method. Background Art

[0002] Bonding wire is a thin metal wire used to connect the chip and pins or external circuits in semiconductor devices. Bonding wire is the bridge for the chip to achieve electrical connection and information exchange with the external circuit. The bonding wire is formed by one welding, arc drawing and two welding. As the density of chip I / O pins increases, the pad spacing of each pin decreases, which makes the semiconductor device in a vibration environment (for example, in the manufacturing process of semiconductor devices, semiconductor devices need to move between processes such as assembly, testing, and glue encapsulation, and vibrate due to the bumps of mobile devices; for example, in the service and use of semiconductor devices, semiconductor devices are in a special use environment of vibration and shaking). The arc of the bonding wire will deviate with the vibration. Once the stiffness of the bonding wire arc is insufficient, the deviation during the vibration process is too large, and it is very easy for the bonding wire arc to contact other adjacent bonding wires, thereby causing the semiconductor device to short-circuit and fail or the calculation result to be wrong. Therefore, in the process of bonding wire selection and wire arc design for specific applications, checking the matching degree of wire arc rigidity and the spacing between adjacent bonding wires becomes the key to ensuring the reliability of bonding wire packaging.

[0003] However, most of the existing detection schemes for bonding wire arcs are to obtain the resonant frequency and amplitude of the arc through computer modeling calculations to achieve simulation prediction of the usage status of the bonding wire arc. However, the input bonding wire physical properties, arc models, and boundary conditions have a great influence on the simulation prediction data, resulting in a large deviation between the simulation prediction data and the actual bonding wire arc service results, causing the reliability of the bonding wire packaging to deteriorate. Summary of the invention

[0004] The purpose of the present application is to provide a bonding wire arc rigidity detection device and a bonding wire arc rigidity detection method, so as to solve the existing detection schemes for bonding wire arc in the prior art to a certain extent, most of which are to obtain the resonance frequency and amplitude of the wire arc through computer modeling calculation, and to realize the simulation and prediction of the use status of the bonding wire arc based on the input bonding wire physical property parameters, wire arc model, and boundary conditions. The simulation and prediction are greatly affected by the input bonding wire physical property parameters, wire arc model accuracy, and boundary conditions, and there is a large deviation from the actual bonding wire arc vibration service environment, resulting in the technical problem of poor reliability of bonding wire packaging.

[0005] According to a first aspect of the present application, a bonding wire arc rigidity detection device is provided, including a control unit, a vibration simulation component, a test piece and a collection component;

[0006] The vibration simulation component includes a driving part and a vibration platform which are transmission-connected to each other, and the control part is in communication connection with the driving part to control the driving part to drive the vibration platform to vibrate according to a predetermined mode;

[0007] The test piece is used for bonding the arc of the bonding wire to be tested, and the test piece is detachably connected to the vibration simulation component;

[0008] The acquisition component is in communication with the control unit to acquire image information of the arc of the bonding wire to be tested during the vibration process.

[0009] Preferably, the vibration simulation component further comprises a vibration body, a placement wall and an adsorption platform, wherein the placement wall and the adsorption platform are both fixed to one side of the vibration body in the first direction;

[0010] The supporting end surface of the adsorption platform facing away from the vibration platform is used to support the test piece. The placement wall is arranged to form a placement cavity for accommodating the adsorption platform. The placement cavity forms a collection window at one end of the placement wall away from the vibration platform. The collection component obtains the image information through the collection window.

[0011] Preferably, the vibration simulation component is provided with a negative pressure cavity and a capillary hole, one end of the capillary hole is connected to the negative pressure cavity, and the other end of the capillary hole is terminated at the supporting end surface of the adsorption platform;

[0012] In the first direction, the size of the placement wall is larger than that of the adsorption platform, so that an end of the placement wall away from the vibration body exceeds a predetermined height of the adsorption platform.

[0013] Preferably, the vibration simulation component further comprises:

[0014] A heating part, wherein the heating part is arranged on the adsorption platform;

[0015] A mist blowing part is arranged on a part of the placement wall that exceeds the adsorption platform, the placement wall includes two side walls arranged opposite to each other, the mist blowing part is arranged on one of the two side walls, and an air outlet of the mist blowing part is directed to the other of the two side walls;

[0016] The fill-in light part is arranged on the part of the placement wall that exceeds the adsorption platform, and the fill-in light part is arranged around the adsorption platform for at least one circle.

[0017] Preferably, the collection component includes a bracket, a reflector and a collection part, the reflector is fixed to the vibration platform via the bracket, the reflector and the collection window are spaced apart along the first direction, the collection part is arranged on one side of the vibration platform, and the image information of the collection window is reflected to the collection part via the reflector.

[0018] Preferably, the angle between the reflection plane of the reflector and the supporting end surface is 45°.

[0019] Preferably, a sliding portion, the vibrating body is fixedly connected to the sliding portion;

[0020] a base, slidably connected to the sliding part along a third direction, the driving part drivingly connected to the base and the sliding part to drive the sliding part to reciprocate relative to the base along the third direction, the third direction intersecting the first direction;

[0021] An acceleration sensor is disposed on the sliding part, and the acceleration sensor is communicatively connected with the control part to transmit acceleration information of the sliding part collected by the acceleration sensor to the control part;

[0022] A speed sensor is disposed on the sliding part, and the speed sensor is communicatively connected with the control part to transmit the speed information of the sliding part collected by the speed sensor to the control part;

[0023] A displacement sensor is fixed to the base, and the displacement sensor is in communication connection with the control unit to transmit the displacement information of the sliding unit relative to the base collected by the displacement sensor to the control unit.

[0024] Preferably, the base comprises a driving wall, and the driving wall and the sliding portion are arranged opposite to each other along the third direction;

[0025] The driving portion includes a magnetic member and an electromagnetic driving coil, one of which is disposed on the driving wall, and the other of which is disposed on a side of the sliding portion facing the driving wall.

[0026] Preferably, the electromagnetic drive coil is communicatively connected with the acceleration sensor, the velocity sensor and the displacement sensor via the control unit, so as to adjust the input current of the electromagnetic drive coil through feedback of the acceleration information, the velocity information and the displacement information.

[0027] According to the second aspect of the present application, a bonding wire arc rigidity detection method is provided, which is used for the bonding wire arc rigidity detection device described in any of the above technical solutions. Therefore, it has all the beneficial technical effects of the bonding wire arc rigidity detection device, which will not be repeated here.

[0028] Specifically, the steps include:

[0029] Acquire the vibration characteristics of the intended service environment of the bond wire arc to be tested, arrange a displacement acquisition component, a velocity acquisition component and an acceleration acquisition component in the service environment of the bond wire arc to be tested, so as to acquire the displacement, velocity and acceleration time domain characteristic curves of the bond wire arc to be tested in the service environment, and obtain the amplitude, frequency and phase information of the bond wire arc to be tested in the service environment according to the displacement, velocity and acceleration time domain characteristic curves;

[0030] The output parameters of the driving unit are set according to the vibration characteristics, the driving parameters of the driving unit are set according to the amplitude, frequency and phase information of the arc of the bonding wire in the service environment, and the displacement, velocity and acceleration time domain characteristic curves are set as reference quantities, and the acquisition time is set;

[0031] Fine-tune the driving parameters according to the reference amount, turn on the driving unit, compare the acceleration information, velocity information and displacement information collected by the acceleration sensor, the velocity sensor and the displacement sensor with the reference amount, and adjust the driving parameters until the acceleration information, velocity information and displacement information collected by the acceleration sensor, the velocity sensor and the displacement sensor are consistent with the reference amount, the parameters of the driving unit are set, and turn off the driving unit;

[0032] Installing a test piece, arc-bonding the bonding wire to be tested to the test piece, and placing the test piece at a predetermined position on the vibration platform;

[0033] Collecting image information, starting the driving unit, and starting a simulation test so that the acquisition component collects image information at the acquisition time;

[0034] The deviation is calculated, the pixel offset of the arc of the bonding wire to be measured on the image information is measured, the actual offset of the arc of the bonding wire to be measured is obtained, and the vibration feature-offset relationship is fitted.

[0035] Compared with the prior art, the beneficial effects of this application are:

[0036] The bonding wire arc rigidity detection device provided in the present application, by bonding the bonding wire arc to be tested to a test piece, and detachably setting the test piece on a vibration platform that can vibrate according to a predetermined pattern, so as to simulate the use state of the bonding wire arc to be tested in a vibration service environment, and collecting the image information of the bonding wire arc to be tested during the vibration process through the acquisition component, so as to analyze the offset data of the bonding wire arc to be tested in the vibration service environment through the image information, and then judge whether the rigidity of the bonding wire arc to be tested can meet the design gap requirement based on the offset data. If the offset is less than the design gap requirement, the rigidity of the bonding wire arc to be tested is qualified, if the offset is greater than or equal to the design gap requirement, the rigidity of the bonding wire arc to be tested is unqualified, and the bonding wire arc to be tested needs to be redesigned. Compared with the simulation data, the offset obtained by performing an actual vibration test on the bonding wire arc to be tested through an actual vibration platform is closer to the actual vibration service condition, the data is more real and reliable, and the reliability and safety of the bonding wire package are effectively improved.

[0037] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are specifically cited below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0039] Figure 1 A schematic diagram of the isometric structure of a bonding wire arc rigidity detection device provided in an embodiment of the present application;

[0040] Figure 2 A schematic diagram of a partial cross-section structure of a bonding wire arc rigidity detection device provided in an embodiment of the present application;

[0041] Figure 3 A schematic diagram of another partial cross-section structure of a bonding wire arc rigidity detection device provided in an embodiment of the present application;

[0042] Figure 4 Another partial cross-sectional structural schematic diagram of a bonding wire arc rigidity detection device provided in an embodiment of the present application;

[0043] Figure 5 A schematic diagram of the isometric structure of a test piece of a bonding wire arc rigidity detection device provided in an embodiment of the present application;

[0044] Figure 6A schematic diagram of the front view structure of a test piece of a bonding wire arc rigidity detection device provided in an embodiment of the present application;

[0045] Figure 7 The displacement-time curve of the component under the service environment collected according to the bonding wire arc rigidity detection method provided in the present application;

[0046] Figure 8 The speed-time curve of the component in the service environment collected according to the bonding wire arc rigidity detection method provided in the present application;

[0047] Fig. 9 The acceleration-time curve of the component in the service environment collected according to the bonding wire arc rigidity detection method provided in the present application;

[0048] Fig.10 The output voltage-time driving parameters obtained according to the bonding wire arc rigidity detection method provided in the present application;

[0049] Fig.11 It is the output current-time driving parameter obtained according to the bonding wire arc rigidity detection method provided in the present application.

[0050] Reference numerals:

[0051] 1-control unit; 21-vibration body; 211-placement wall; 212-adsorption platform; 213-capillary; 214-negative pressure chamber; 215-heating unit; 216-mist blowing unit; 217-light filling unit; 22-sliding unit; 23-base; 231-driving wall; 24-slide rail; 25-speed sensor; 26-acceleration sensor; 27-displacement sensor; 3-driving unit; 31-electromagnetic driving coil; 32-magnetic part; 4-test piece; 41-first connection point; 42-second connection point; 43-ruler; 51-collection unit; 52-reflector; 53-bracket; 6-bonding wire arc to be tested.

[0052] F1-first direction; F2-second direction; F3-third direction. DETAILED DESCRIPTION

[0053] The technical solution of the present application will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0054] The components of the embodiments of the present application generally described and shown in the drawings herein may be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed, but merely represents the selected embodiments of the present application.

[0055] Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of this application.

[0056] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0057] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0058] Refer to the following Figures 1 to 6 A bonding wire arc rigidity detection device and a bonding wire arc rigidity detection method according to some embodiments of the present application are described.

[0059] See also Figures 1 to 6 As shown, an embodiment of the first aspect of the present application provides a bonding wire arc rigidity detection device, which includes a control unit 1, a vibration simulation component, a test piece 4 and a collection component. The vibration simulation component includes a driving unit 3 and a vibration platform that are transmission-connected to each other, and the control unit 1 is communicatively connected to the driving unit 3 to control the driving unit 3 to drive the vibration platform to vibrate according to a predetermined mode. The test piece 4 is used to bond the bonding wire arc to be tested, and the test piece 4 is detachably connected to the vibration simulation component. The collection component is communicatively connected to the control unit 1 to collect image information of the bonding wire arc to be tested during the vibration process.

[0060] According to the bonding wire arc rigidity detection device provided by the above technical features, the bonding wire arc 6 to be tested is bonded to the test piece 4, and the test piece 4 is detachably set on a vibration platform that can vibrate according to a predetermined mode to simulate the use state of the bonding wire arc 6 to be tested in a vibration service environment, and the image information of the bonding wire arc to be tested is collected by the acquisition component during the vibration process, so as to analyze the offset data of the bonding wire arc 6 to be tested in the vibration service environment through the image information, and then it can be judged whether the rigidity of the bonding wire arc 6 to be tested can meet the design gap requirement based on the offset data. If the offset is less than the design gap requirement, the rigidity of the bonding wire arc 6 to be tested is qualified, and if the offset is greater than or equal to the design gap requirement, the rigidity of the bonding wire arc 6 to be tested is unqualified, and the bonding wire arc 6 to be tested needs to be redesigned. Compared with the simulation data, the offset obtained by the actual vibration test of the bonding wire arc 6 to be tested on the actual vibration platform is closer to the actual vibration service condition, and the data is more real and reliable, which effectively improves the reliability and safety of the bonding wire package.

[0061] Preferably, if Figure 1 , Figure 2 and Figure 4 As shown, F1 shown in the figure may be an example of the first direction F1 described below, F2 shown in the figure may be an example of the second direction F2 described below, and F3 shown in the figure may be an example of the third direction F3 described below, wherein the first direction F1 intersects with the second direction F2, and the third direction F3 intersects with the first direction F1. Preferably, as Figure 1 , Figure 2 and Figure 4 As shown, the first direction F1 may be perpendicular to a plane defined by the second direction F2 and the third direction F3. The third direction F3 may be perpendicular to the second direction F2.

[0062] Preferably, if Figure 1As shown, the vibration simulation component may include a vibration body 21, a placement wall 211 and an adsorption platform 212, and the placement wall 211 and the adsorption platform 212 are both fixed to one side of the vibration body 21 in the first direction F1. The supporting end surface of the adsorption platform 212 facing away from the vibration platform is used to support the test piece 4, and the placement wall 211 is surrounded to form a placement cavity for accommodating the adsorption platform 212, and the placement cavity forms a collection window at one end of the placement wall 211 away from the vibration platform, and the collection component obtains image information through the collection window. In this way, on the one hand, through the adsorption effect of the adsorption platform 212 and the test piece 4, the test piece 4 and the vibration simulation component are effectively connected detachably; on the other hand, by arranging the adsorption platform 212 in the placement cavity surrounded by the placement wall 211, and forming a collection window at one end of the placement cavity away from the vibration platform, it is not only convenient for the collection unit 51 to collect image information, but also can effectively ensure the stability of the setting environment of the test piece 4, thereby reducing external environmental interference and improving the accuracy of the test results.

[0063] Preferably, if Figure 2 As shown, the vibration simulation component can be provided with a negative pressure chamber 214 and a capillary hole 213, one end of the capillary hole 213 is connected to the negative pressure chamber 214, and the other end of the capillary hole 213 is terminated at the supporting end surface, so that the adsorption of the test piece 4 is achieved by negative pressure.

[0064] Preferably, if Figure 2 As shown, there may be a plurality of capillary holes 213 , which may be evenly distributed on the supporting end surface of the adsorption platform 212 , and each capillary hole 213 is connected to the negative pressure chamber 214 to improve the adsorption stability of the adsorption platform 212 on the test piece 4 .

[0065] Optionally, the vibration body 21 may be provided with a negative pressure interface connected to the negative pressure chamber 214 for connecting to a negative pressure device (e.g., an air pump, an air compressor, a vacuum pump, etc.) to control the action of adsorbing / releasing the test piece 4 on the adsorption platform 212.

[0066] However, it is not limited to this, the adsorption method of the test piece 4 by the adsorption platform 212 is not limited to negative pressure adsorption, as long as the detachable fixation of the test piece 4 can be achieved, the adsorption platform 212 and the test piece 4 can also be fixed by magnetic attraction, snap-on fixation or threaded connection, etc.

[0067] Preferably, if Figure 2 As shown, in the first direction F1, the size of the placement wall 211 is larger than the adsorption platform 212, so that the end of the placement wall 211 away from the vibration body 21 exceeds the predetermined height of the adsorption platform 212, so as to further ensure the stability of the setting environment of the test piece 4 and reduce external environmental interference.

[0068] Preferably, if Figure 2 As shown, the vibration simulation component may further include a heating unit 215 , which may be disposed on the adsorption platform 212 to heat the test piece 4 disposed on the adsorption platform 212 , thereby simulating a high temperature service environment of the arc of the bonding wire to be tested.

[0069] Preferably, if Figure 2 As shown, the heating part 215 may be disposed around the adsorption platform 212 to improve the heating uniformity of the heating part 215 .

[0070] Optionally, the heating part 215 may be an electric heating coil, so that the heating part 215 is disposed around the adsorption platform 212 .

[0071] Preferably, the vibration simulation component may further include a mist blowing unit 216, which is disposed at a portion of the surrounding wall 211 that exceeds the adsorption platform 212. Figure 2 As shown in the figure, an example is shown in which the mist blowing part 216 is arranged on one of the two side walls of the mounting wall 211 that are arranged opposite to each other along the second direction F2. Correspondingly, the air outlet of the mist blowing part 216 points to the other of the two side walls that are arranged opposite to each other along the second direction F2, so as to output gas through the air outlet of the mist blowing part 216, so as to disperse the hot air flow generated by the heating effect of the heating part 215, thereby avoiding the fluttering phenomenon of the image observed in the field of view of the acquisition component caused by the rising hot air flow, thereby ensuring the image acquisition quality of the acquisition component.

[0072] Optionally, not shown in the figures, the mist blowing part may also be arranged on one of two side walls of the mounting wall that are arranged opposite to each other along the third direction.

[0073] Preferably, if Figure 2 As shown, the mist blowing unit 216 may include an air duct extending along the third direction F3 and the plurality of air outlets, and the plurality of air outlets are arranged on the air duct at intervals along the third direction F3.

[0074] Preferably, if Figure 2 As shown, the vibration simulation component may further include a fill light unit 217, which may be disposed on a portion of the surrounding wall 211 that extends beyond the adsorption platform 212, so as to provide fill light for the test piece 4 disposed on the adsorption platform 212, thereby improving the clarity of image acquisition.

[0075] Preferably, if Figure 2 As shown, the above-mentioned fill-in light part 217 can be arranged at least one circle around the adsorption platform 212, so as to eliminate the shadow on the test piece 4 set on the adsorption platform 212 through the multi-angle covering of the fill-in light part 217, and achieve an effect similar to a "shadowless lamp" to prevent the shadow from interfering with the calculation of the offset.

[0076] In an embodiment, Figure 1 As shown, the above-mentioned collection component may include a bracket portion 53, a reflector 52 and a collection portion 51. The reflector 52 is fixed to the vibration platform via the bracket portion 53. The reflector 52 and the collection window are spaced apart along the first direction F1. The collection portion 51 is arranged on one side of the vibration platform. The image information of the collection window is reflected to the collection portion 51 via the reflector 52. In this way, the collection portion 51 is separated from the vibration platform through the reflection effect of the reflector 52, so as to effectively avoid the influence of the vibration of the vibration platform on the collection portion 51.

[0077] Preferably, if Figure 1 As shown, the angle between the reflection plane of the reflector 52 and the supporting end surface can be 45°. In this way, the reflector 52 is stationary relative to the vibration platform during the vibration process. The reflector 52 is always aimed at the test piece 4 during the vibration process. The reflected light is emitted from the horizontal direction. When the vibration platform reciprocates along the third direction F3, the reflected light maintains horizontal propagation. This makes it unnecessary to adjust the optical path all the time during the vibration process. The collection unit 51 can clearly observe the swing of the line arc on the test piece 4 under the vibration condition from the horizontal direction.

[0078] Optionally, the acquisition unit 51 may be an image acquisition device, such as a high-speed camera.

[0079] Preferably, the acquisition unit 51 may have a continuous magnification function of 1 to 100X to ensure the clarity and analyzability of the image information acquired by the acquisition unit 51 .

[0080] In an embodiment, Figures 1 to 4 As shown, the vibration platform may further include a sliding portion 22 and a base 23, and the vibration body 21 is fixedly connected to the sliding portion 22. The base 23 is slidably connected to the sliding portion 22 along a third direction F3. The driving portion 3 may be connected to the base 23 and the sliding portion 22 to drive the sliding portion 22 to reciprocate relative to the base 23 along the third direction F3, so as to realize the vibration platform simulating vibration according to a predetermined mode.

[0081] Preferably, the vibration platform may also be provided with a slide rail 24 extending along a third direction F3. Figure 3 and Figure 4 The slide rail 24 is shown to be fixedly arranged on the base 23, and a slide groove adapted to the shape of the slide rail 24 is arranged at the bottom of the sliding part 22 to improve the sliding accuracy of the sliding part 22 relative to the base 23. However, it is not limited to this, and the slide rail can also be fixedly arranged at the bottom of the sliding part, and the slide groove can be arranged at a corresponding position of the base.

[0082] Preferably, if Figure 3 and Figure 4As shown, the cross section of the slide rail 24 may be wedge-shaped to further improve the sliding accuracy of the sliding portion 22 .

[0083] Preferably, if Figure 1 , Figure 3 and Figure 4 As shown, the vibration platform may further include an acceleration sensor 26 , which may be disposed on the sliding portion 22 , and the acceleration sensor 26 is communicatively connected to the control portion 1 to transmit acceleration information of the sliding portion 22 collected by the acceleration sensor 26 to the control portion 1 .

[0084] Preferably, if Figure 1 , Figure 3 and Figure 4 As shown, the vibration platform may further include a speed sensor 25 , which may be disposed on the sliding portion 22 , and the speed sensor 25 is communicatively connected with the control portion 1 to transmit speed information of the sliding portion 22 collected by the speed sensor 25 to the control portion 1 .

[0085] Preferably, if Figure 1 , Figure 3 and Figure 4 As shown, the vibration platform may further include a displacement sensor 27 , which may be fixed to the base 23 , and the displacement sensor 27 is communicatively connected to the control unit 1 to transmit the displacement information of the sliding unit 22 relative to the base 23 collected by the displacement sensor 27 to the control unit 1 .

[0086] Preferably, the base 23 may include a driving wall 231, and the driving wall 231 and the sliding portion 22 are arranged opposite to each other along the third direction F3. The driving member may include a magnetic member 32 and an electromagnetic driving coil 31. Figure 3 As shown, the electromagnetic driving coil 31 can be arranged on the driving wall 231, and the magnetic part 32 can be arranged on the side of the sliding part 22 facing the driving wall 231, so as to control the input current and input voltage of the electromagnetic driving coil 31 to control the magnetic force exerted on the magnetic part 32, thereby realizing the driving part 3 being able to simulate different vibration modes.

[0087] Optionally, the magnetic member 32 may be a permanent magnet.

[0088] Optionally, not shown in the figures, the electromagnetic drive coil 31 may also be disposed on the sliding portion, and the magnetic member 32 may be disposed on the drive wall.

[0089] Preferably, the magnetic drive coil is communicated with the acceleration sensor 26, the velocity sensor 25 and the displacement sensor 27 via the control unit 1, so as to adjust the input current of the electromagnetic drive coil 31 through the acceleration information, velocity information and displacement information feedback, thereby ensuring that the vibration of the sliding part 22 is always consistent with the predetermined pattern, improving the realism and accuracy of the simulated vibration of the vibration platform, and further improving the detection reliability of the bonding wire arc rigidity detection equipment.

[0090] Optionally, the control unit 1 may be a programmable power supply, a PLC electric control cabinet, an industrial computer, etc.

[0091] In an embodiment, Figure 5 and Figure 6 As shown, the test piece 4 may be provided with a first connection point 41 and a second connection point 42, wherein the first connection point 41 is used to bond with one end of the bonding wire arc 6 to be tested, and the second connection point 42 is used to bond with the other end of the bonding wire arc 6 to be tested, wherein the connection distance between the first connection point 41 and the second connection point 42 is the design span of the bonding wire arc 6 to be tested.

[0092] Preferably, if Figure 5 and Figure 6 As shown, the test piece 4 may also be provided with a ruler 43 to provide a reference when analyzing the image information collected by the collection unit 51 .

[0093] It should be noted that when the bond wire arc 6 to be tested and the test piece 4 are bonded, the first connection point 41 , the second connection point 42 and the point of the bond wire arc 6 to be tested that is farthest from the test piece 4 are coplanar.

[0094] Preferably, the extension direction of the above-mentioned scale 43 is perpendicular to the plane where the first connection point 41, the second connection point 42 and the farthest point of the bonding wire arc 6 to be tested from the test piece 4 are located, so as to directly read the displacement of the bonding wire arc 6 to be tested after vibration.

[0095] The embodiment of the second aspect of the present application also provides a bonding wire arc rigidity detection method, including the bonding wire arc rigidity detection device described in any of the above embodiments, and thus has all the beneficial technical effects of the bonding wire arc rigidity detection device, which will not be repeated here.

[0096] Specifically, the steps include:

[0097] S01 obtains the vibration characteristics of the intended service environment of the bonding wire arc 6 to be tested, arranges displacement acquisition components, velocity acquisition components and acceleration acquisition components in the service environment of the bonding wire arc 6 to be tested, so as to obtain the displacement, velocity and acceleration time domain characteristic curves of the bonding wire arc 6 to be tested in the service environment, and obtains the amplitude, frequency and phase information of the bonding wire arc 6 to be tested in the service environment based on the displacement, velocity and acceleration time domain characteristic curves.

[0098] S02 sets the output parameters of the driving unit 3 according to the vibration characteristics, sets the driving parameters of the driving unit 3 according to the amplitude, frequency and phase information of the arc of the bonding wire in the service environment, sets the time domain characteristic curves of displacement, velocity and acceleration as reference quantities, and sets the collection time.

[0099] S03 fine-tunes the driving parameters according to the reference amount, turns on the driving unit 3, compares the acceleration information, velocity information and displacement information collected by the acceleration sensor 26, the velocity sensor 25 and the displacement sensor 27 with the reference amount, and adjusts the driving parameters until the acceleration information, velocity information and displacement information collected by the acceleration sensor 26, the velocity sensor 25 and the displacement sensor 27 are consistent with the reference amount. In this way, the accuracy of the vibration simulation is effectively improved.

[0100] Preferably, the above-mentioned step S03 of fine-tuning the driving parameters according to the reference value may also include S031 storing parameter data to set a trigger signal, fitting the adjusted driving parameters into voltage and current time domain characteristic curves, and storing them; and selecting the moment to be measured within one cycle of the fitted voltage and current time domain characteristic curves as a trigger condition.

[0101] S04: installing the test piece 4, bonding the bonding wire arc 6 to be tested to the test piece 4, and setting the test piece 4 at a predetermined position of the vibration platform.

[0102] S05 sets the simulated service environment, and sets the test temperature according to the service environment of the bond wire arc 6 to be tested. Optionally, the setting of the test temperature can be achieved by setting the heating parameters of the heating unit 215 .

[0103] Preferably, the step S05 of setting the simulated service environment may also include setting the mist blowing unit 216, that is, setting the opening timing of the mist blowing unit 216. For example, according to the heating temperature of the heating unit 215, when the temperature of the heating unit 215 reaches a predetermined temperature, the mist blowing unit 216 is opened.

[0104] Preferably, the step S05 of setting the simulated service environment may further include turning on the fill light unit 217 .

[0105] S06 calibrates the optical path and adjusts the acquisition component to ensure that the acquisition component can clearly obtain the image information within the acquisition window.

[0106] Optionally, S06 calibrating the optical path may include S061 adjusting the optical path, adjusting the relative positions of the collecting unit 51 and the reflecting mirror 52 so that the collecting unit 51 is aligned with the reflecting optical path of the reflecting mirror 52 .

[0107] Optionally, S06 calibrating the optical path may include S062 focusing the collecting unit 51 , adjusting the focal length of the collecting unit 51 so that the collecting unit 51 is in focus with the reflecting mirror 52 .

[0108] S07 collects image information, starts the driving unit 3, and starts a simulation test, so that the collection component collects image information at the collection time.

[0109] S08 calculates the deviation, measures the pixel offset of the bonding wire arc 6 to be tested on the image information, obtains the actual offset of the bonding wire arc 6 to be tested, and fits the vibration feature-offset relationship.

[0110] Preferably, the above step S08 of calculating the offset may include:

[0111] S081 performs binary processing on the image to make the image present obvious black and white contrast features, so as to facilitate the analysis of image data and reduce the influence of image color on the test conclusion;

[0112] S082 Describes the contour of the offset arc based on the contrast feature, see Figure 6 The dashed line shows the outline.

[0113] S083 identifies the positions of the first connection point 41 and the second connection point 42, and connects the center points of the first connection point 41 and the second connection point 42. This line is the first center axis (a straight line) of the bonding wire arc 6 to be tested before the test.

[0114] S084 makes a second central axis (a curve) of the offset arc according to the contour of the offset arc.

[0115] S085: Make a marking line parallel to the first central axis on the second central axis so that the marking line is tangent to the second central axis. The distance from the tangent point to the first central axis is the offset of the arc 6 of the bonding wire to be measured at the current vibration characteristic moment.

[0116] Preferably, the standard distance of each small grid of the scale 43 on the test piece 4 can be 25 μm. It should be noted that the image processing software is used to calculate a certain distance (L 标尺 ) is the number of pixels occupied by 标尺 ), the actual length represented by each pixel is The image processing software is used to calculate the number of pixels P occupied by the offset of the arc 6 of the bond wire to be tested at the current vibration characteristic moment. 偏移 , then the actual offset of the arc is d 偏移=P 偏移 ×L 像素 , and finally obtain the "vibration characteristic-offset" relationship of the corresponding wire arc. In this way, according to the "vibration characteristic-offset" relationship, the maximum offset of the wire arc 6 to be tested during the vibration process can be obtained, and then the safety distance around the wire arc 6 to be tested can be confirmed, and then it can be accurately judged whether the wire arc 6 to be tested can meet the target environment.

[0117] Based on the characteristics described above, Figures 7 to 11 The vibration waveform of the vibration environment shown is a sine wave, the vibration frequency is 21.28 Hz, the vibration amplitude is 2 mm, the maximum vibration speed is 200 mm / s, and the maximum vibration acceleration is 20 m / s 2 Taking this as an example, the specific test process under this vibration characteristic will be described in detail below.

[0118] Step 1: Collect the vibration characteristics of 51 parts during service. The time domain characteristic curves of displacement, velocity and acceleration are as follows: Figures 7 to 9 shown.

[0119] Step 2: Figures 7 to 9 The waveform of the output current / voltage of the control unit 1 is a sine wave, and the voltage amplitude is initially set to 100V and the current amplitude is 20A. Figures 7 to 9 The time domain curve of the vibration characteristics shown is set as the reference value. Turn on the vibration platform, and the current parameters and voltage parameters of the control unit 1 enter the self-adjustment process (that is, the controller compares the acceleration information, velocity information and displacement information collected by the acceleration sensor 26, the velocity sensor 25 and the displacement sensor 27 with the reference value) to obtain the real-time data deviation value, and the control unit 1 adjusts the current / voltage parameters (that is, adjusts the magnitude and direction of the voltage and current) until the acceleration information, velocity information and displacement information collected by the acceleration sensor 26, the velocity sensor 25 and the displacement sensor 27 are consistent with the reference value, and stores the voltage and current output waveforms at this time, that is, as shown in FIG. Fig.10 and Fig.11 The curve shown.

[0120] Step 3, install the test piece 4.

[0121] Step 4: Usually the chip's operating temperature is between -55°C and 125°C. In this example, the test temperature is set to 100°C. Wait for the vacuum chuck to be preheated to 100°C and turn on the compressed air.

[0122] Step 5, calibrating the light path so that the test piece 4 can be clearly observed in the collection unit 51.

[0123] Step 6, triggering the acquisition unit 51 to take photos according to the trigger signal of the control unit 1, and acquiring the line arc image at the corresponding moment.

[0124] Step 7, process the image, draw the center line of the line arc, measure the number of pixels occupied by the micro ruler 43 in the length direction, the length of the 10-grid ruler 43 is 250μm, and the number of pixels occupied is 500, so the actual length represented by each pixel is 0.5μm, and the number of pixels occupied by the line arc offset at the triggering moment 1 is measured to be 200, so the offset of the line arc at this time is 100μm; the number of pixels occupied by the line arc offset at the triggering moment 2 is measured to be 0, so the offset of the line arc at this time is 0μm; the number of pixels occupied by the line arc offset at the triggering moment 3 is measured to be 70, so the offset of the line arc at this time is 35μm.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A bonding wire arc rigidity detection device, characterized in that: It includes a control unit, a vibration simulation component, a test piece and a collection component; The vibration simulation component includes a driving part and a vibration platform which are transmission-connected to each other, and the control part is in communication connection with the driving part to control the driving part to drive the vibration platform to vibrate according to a predetermined mode; The test piece is used for bonding the arc of the bonding wire to be tested, and the test piece is detachably connected to the vibration simulation component; The acquisition component is in communication connection with the control unit, so as to acquire image information of the arc of the bonding wire to be tested at a specified time during the vibration process.

2. The bonding wire arc rigidity detection device according to claim 1, characterized in that: The vibration simulation component further includes a vibration body, a placement wall and an adsorption platform, wherein the placement wall and the adsorption platform are both fixed to one side of the vibration body in the first direction; The supporting end surface of the adsorption platform facing away from the vibration platform is used to support the test piece. The placement wall is arranged to form a placement cavity for accommodating the adsorption platform. The placement cavity forms a collection window at one end of the placement wall away from the vibration platform. The collection component obtains the image information through the collection window.

3. The bonding wire arc rigidity detection device according to claim 2, characterized in that: The vibration simulation component is provided with a negative pressure cavity and a capillary hole, one end of the capillary hole is connected to the negative pressure cavity, and the other end of the capillary hole is terminated at the supporting end surface of the adsorption platform; In the first direction, the size of the placement wall is larger than that of the adsorption platform, so that an end of the placement wall away from the vibration body exceeds a predetermined height of the adsorption platform.

4. The bonding wire arc rigidity detection device according to claim 3, characterized in that: The vibration simulation component also includes: A heating part, wherein the heating part is arranged on the adsorption platform; A mist blowing part is arranged on a part of the placement wall that exceeds the adsorption platform, the placement wall includes two side walls arranged opposite to each other, the mist blowing part is arranged on one of the two side walls, and an air outlet of the mist blowing part is directed to the other of the two side walls; The fill-in light part is arranged on the part of the placement wall that exceeds the adsorption platform, and the fill-in light part is arranged around the adsorption platform for at least one circle.

5. The bonding wire arc rigidity detection device according to claim 2, characterized in that: The collection component includes a bracket, a reflector and a collection part. The reflector is fixed to the vibration platform via the bracket. The reflector and the collection window are spaced apart along the first direction. The collection part is arranged on one side of the vibration platform. Image information of the collection window is reflected to the collection part via the reflector.

6. The bonding wire arc rigidity detection device according to claim 5, characterized in that: The angle between the reflection plane of the reflector and the supporting end surface is 45°.

7. The bonding wire arc rigidity detection device according to any one of claims 2 to 6, characterized in that: The vibration platform also includes: A sliding part, the vibrating body being fixedly connected to the sliding part; a base, slidably connected to the sliding part along a third direction, the driving part drivingly connected to the base and the sliding part to drive the sliding part to reciprocate relative to the base along the third direction, the third direction intersecting the first direction; An acceleration sensor is disposed on the sliding part, and the acceleration sensor is communicatively connected with the control part to transmit acceleration information of the sliding part collected by the acceleration sensor to the control part; A speed sensor is disposed on the sliding part, and the speed sensor is communicatively connected with the control part to transmit the speed information of the sliding part collected by the speed sensor to the control part; A displacement sensor is fixed to the base, and the displacement sensor is in communication connection with the control unit to transmit the displacement information of the sliding unit relative to the base collected by the displacement sensor to the control unit.

8. The bonding wire arc rigidity detection device according to claim 7, characterized in that: The base includes a driving wall, and the driving wall and the sliding part are arranged opposite to each other along the third direction; The driving portion includes a magnetic member and an electromagnetic driving coil, one of which is disposed on the driving wall, and the other of which is disposed on a side of the sliding portion facing the driving wall.

9. The bonding wire arc rigidity detection device according to claim 8, characterized in that: The electromagnetic drive coil is communicatively connected with the acceleration sensor, the velocity sensor and the displacement sensor via the control unit, so as to adjust the input current of the electromagnetic drive coil through feedback of the acceleration information, the velocity information and the displacement information.

10. A bonding wire arc rigidity detection method, characterized in that: A bonding wire arc rigidity detection device for use in any one of claims 7 to 9; The steps include: Acquire the vibration characteristics of the intended service environment of the bond wire arc to be tested, arrange a displacement acquisition component, a velocity acquisition component and an acceleration acquisition component in the service environment of the bond wire arc to be tested, so as to acquire the displacement, velocity and acceleration time domain characteristic curves of the bond wire arc to be tested in the service environment, and obtain the amplitude, frequency and phase information of the bond wire arc to be tested in the service environment according to the displacement, velocity and acceleration time domain characteristic curves; The output parameters of the driving unit are set according to the vibration characteristics, the driving parameters of the driving unit are set according to the amplitude, frequency and phase information of the arc of the bonding wire to be tested in the service environment, the displacement, velocity and acceleration time domain characteristic curves are set as reference quantities, and the acquisition time is set; Fine-tune the driving parameters according to the reference amount, turn on the driving unit, compare the acceleration information, velocity information and displacement information collected by the acceleration sensor, the velocity sensor and the displacement sensor with the reference amount, and adjust the driving parameters until the acceleration information, velocity information and displacement information collected by the acceleration sensor, the velocity sensor and the displacement sensor are consistent with the reference amount, the parameters of the driving unit are set, and turn off the driving unit; Installing a test piece, arc-bonding the bonding wire to be tested to the test piece, and placing the test piece at a predetermined position on the vibration platform; Collecting image information, starting the driving unit, and starting a simulation test so that the acquisition component collects image information at the acquisition time; The deviation is calculated, the pixel offset of the arc of the bonding wire to be measured on the image information is measured, the actual offset of the arc of the bonding wire to be measured is obtained, and the vibration feature-offset relationship is fitted.

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