High-flux electron special gas corrosion simulation system

Abstract

The invention belongs to the technical field of simulation equipment, and relates to a high-flux electronic special gas corrosion simulation system which comprises a high-temperature gas corrosion module, a normal-temperature gas corrosion module, a part simulation operation module and a high-flux electronic special gas supply module, and the pressure adjusting module is used for respectively adjusting the pressure in the first reaction chamber, the second reaction chamber and the multiple groups of metal gasket surface sealing joints, and simulating the corrosion of the electronic special gas on the first sample and the influence of the electronic special gas on the operation precision of the second sample under different pressures. According to the invention, the operating environment of each part in semiconductor processing equipment and a gas conveying system thereof can be simulated, the corrosion resistance of materials used by various parts can be tested in electronic special gas under different temperatures and different pressure environments, and the influence of the corrosion of the electronic special gas on the operating precision of the parts can be monitored; and a reliable basis is provided for material selection and service life of each part in semiconductor processing equipment and a gas conveying system thereof.

Description

Technical Field

[0001] The invention belongs to the technical field of simulation equipment and relates to a high-throughput electronic special gas corrosion simulation system. Background Art

[0002] Semiconductor chips are not only the heart of traditional consumer electronics, but also the cornerstone of the development of emerging technologies such as artificial intelligence, autonomous driving, and supercomputers. In recent years, equipment expenditures in the integrated circuit manufacturing industry have continued to increase, and photolithography, plasma etching, and thin film deposition equipment account for nearly 80% of total equipment expenditures.

[0003] In the semiconductor manufacturing process, the etching and thin film deposition processes require the use of a large amount of corrosive gases such as F2, HF, Cl2, HCl, BCl3, HBr, NF3, etc., which are used to etch wafers or clean chambers. In the semiconductor process equipment and its gas delivery system, there are a large number of fluororubber / perfluororubber O-rings, stainless steel gas pipelines and valves, aluminum alloy vacuum chambers and gas distribution plates, SiO2 / Al2O3 / Y2O3 window mirrors and electrostatic chucks and other parts. While etching the wafer or cleaning the chamber, the corrosive gas will also corrode the various parts in the etching equipment and gas delivery system, which will not only shorten the service life of each part and cause the equipment to be shut down for maintenance, but also cause the corrosion products on the surface of each part to form particles, which will contaminate the wafer and reduce the chip yield.

[0004] Therefore, the corrosion resistance test of the materials used for each part in the semiconductor process equipment and its gas delivery system and the monitoring of the operation accuracy of the parts can provide a reliable basis for the material selection of each part and the operation life of the parts, thereby effectively improving the chip yield rate. However, there is currently no simulation device for the corrosion resistance test of the materials used for each part in the semiconductor process equipment and its gas delivery system and the monitoring of the operation accuracy of the parts. Summary of the invention

[0005] The purpose of the present invention is to provide a high-throughput electronic special gas corrosion simulation system, which can test the corrosion resistance of materials used for various parts in semiconductor process equipment and its gas delivery system, and monitor the operating accuracy of parts, so as to provide a reliable basis for the material selection and operating life of various parts in semiconductor process equipment and its gas delivery system.

[0006] To achieve the above purpose, the specific technical solution of a high-throughput electronic special gas corrosion simulation system provided by the present invention is as follows: A high-throughput electronic special gas corrosion simulation system, comprising: The high-temperature gas corrosion module comprises at least one first reaction chamber, on which a heating element is arranged. The first reaction chamber is used to place a first sample and provide a high-temperature environment for the first sample.

[0007] The room temperature gas corrosion module comprises at least one second reaction chamber, wherein the second reaction chamber is used for placing the first sample and providing a room temperature environment for the first sample.

[0008] The parts simulation operation module includes multiple sets of metal gasket face sealing joints, which are used to hang multiple second specimens. The second specimens are used to provide a conveying structure for electronic special gases, thereby simulating a gas conveying system.

[0009] The high-throughput electronic special gas supply module is connected to the first reaction chamber, the second reaction chamber, and multiple groups of metal gasket surface sealing joints, respectively, and is used to provide electronic special gas to the first reaction chamber, the second reaction chamber, and multiple groups of metal gasket surface sealing joints, respectively, to simulate the corrosion of the electronic special gas on the first sample at different temperatures and the influence on the operating accuracy of the second sample.

[0010] The pressure regulating module is respectively connected to the first reaction chamber, the second reaction chamber, and multiple groups of metal gasket surface sealing joints, and is used to respectively adjust the pressures in the first reaction chamber, the second reaction chamber, and multiple groups of metal gasket surface sealing joints to simulate the corrosion of the first sample by the electronic special gas under different pressures and the influence on the operating accuracy of the second sample.

[0011] The present invention is also characterized in that: The high temperature gas corrosion module also includes: The heat-insulating layer is arranged outside the first reaction chamber, and the heating element is arranged between the first reaction chamber and the heat-insulating layer.

[0012] The temperature measuring element is arranged between the first reaction chamber and the insulation layer, and is used to measure the temperature of the outer wall of the first reaction chamber.

[0013] A first bellows is arranged between the first reaction chamber and the pressure regulating module, one end of which is connected to the first reaction chamber; a second bellows is arranged between the second reaction chamber and the pressure regulating module, one end of which is connected to the second reaction chamber; the other end of the first bellows and the other end of the second bellows are connected to the pressure regulating module through a vacuum measuring module respectively, and the vacuum measuring module is composed of a resistance gauge and a thin film gauge.

[0014] The high-throughput electronic special gas supply module includes: At least one gas storage tank has an outlet respectively connected to the first reaction chamber, the second reaction chamber, and a plurality of sets of metal gasket surface sealing joints.

[0015] The first argon tank and the water tank, the first argon tank stores argon, the water tank stores water, the outlet of the first argon tank is connected to the inlet of the water tank, and the outlet of the water tank is connected to the inlet of the gas tank.

[0016] There are a plurality of second argon gas tanks, each of which stores argon gas.

[0017] Multiple gas mixing tanks correspond one to one with multiple second argon gas tanks, and the inlet of each gas mixing tank is connected to the outlet of the corresponding second argon gas tank. The multiple gas mixing tanks are arranged in sequence from left to right, and the inlet of the leftmost gas mixing tank is connected to the outlet of the water storage tank. From left to right, the outlet of each gas mixing tank is respectively connected to the inlet of the gas storage tank and the inlet of the next gas mixing tank.

[0018] The outlets of the multiple gas cylinders are respectively connected to the inlets of the gas storage tanks, and the multiple gas cylinders are respectively used to store multiple different corrosive gases.

[0019] The dew point meter is installed at the outlet of the water storage tank to measure the water vapor content of the argon gas output from the water storage tank.

[0020] The pressure regulation module includes: One end of the vacuum tube is respectively connected with two vacuum measuring modules and a plurality of sets of metal gasket surface sealing joints.

[0021] The inlet of the vortex pump is connected to the other end of the vacuum tube.

[0022] The molecular pump has an inlet connected to a position of the vacuum tube close to the vortex pump, and an outlet connected to an inlet of the vortex pump.

[0023] The first stop valve, the second stop valve and the third stop valve, the first stop valve is arranged at the inlet position of the molecular pump, the second stop valve is arranged at the outlet position of the molecular pump, and the third stop valve is arranged at the end of the vacuum tube close to the vortex pump.

[0024] A dryer is arranged on the vacuum tube between the high-temperature gas corrosion module and the molecular pump, and the inlet and outlet of the dryer are respectively connected to the vacuum tube.

[0025] It also includes a gas composition monitoring module, the inlet of which is respectively connected to the first reaction chamber, the second reaction chamber, and multiple sets of metal gasket surface sealing joints, and the outlet of the gas composition monitoring module is connected to the inlet position of the vacuum tube near the dryer.

[0026] The outlet of the vortex pump is connected with a tail gas combustion absorber.

[0027] It also includes a nitrogen tank, the outlet of which is respectively connected to the first reaction chamber, the second reaction chamber and multiple groups of metal gasket surface sealing joints.

[0028] The high-throughput electronic special gas corrosion simulation system of the present invention has the following advantages: First, through the cooperation of the high-temperature gas corrosion module, the normal-temperature gas corrosion module, the parts simulation operation module, the high-throughput electronic special gas supply module and the pressure regulation module, it is possible to simulate the operating environment of each part in the semiconductor process equipment and its gas delivery system, and to conduct corrosion resistance tests on the materials used for various parts in the electronic special gases under different temperatures and pressures. It also monitors the influence of electronic special gas corrosion on the operating accuracy of parts, providing a reliable basis for the material selection and operating life of each part in the semiconductor process equipment and its gas delivery system.

[0029] Second, through the cooperation of the first argon tank, the water storage tank, multiple second argon tanks, multiple mixing tanks and the gas storage tank, the water content of the electronic special gas can be flexibly adjusted by adjusting the flow rate of the water-containing argon gas, the dry argon gas and the corrosive gas. The water vapor content in the electronic special gas can be controlled within the range of 0ppm~10000ppm, and the dew point meter only contacts the water-containing argon gas in the first buffer tank, which can prevent it from being damaged by the corrosive gas.

[0030] Third, the present invention can flexibly configure electronic special gases according to actual production needs and temporarily store them in gas storage tanks. The electronic special gases configured once can simultaneously supply gas to the high-temperature gas corrosion module, the normal-temperature gas corrosion module, and the parts simulation operation module, thereby achieving high-throughput gas supply, greatly reducing the time spent on gas configuration, and improving equipment utilization efficiency. Compared with purchasing standard gas, self-gas configuration can greatly reduce the cost of experimental gas.

[0031] Fourth, the present invention can simultaneously carry out material and corrosion tests under different temperatures, different gas types, and different gas partial pressure conditions, and can simultaneously carry out parts simulation operation tests, and the equipment utilization efficiency is high. At the same time, multiple first reaction chambers and multiple second reaction chambers can be operated simultaneously, and the mixed corrosion gas type, pressure and water vapor content, and test temperature in each first reaction chamber and each second reaction chamber can be set separately. After measuring the temperature distribution of multiple first reaction chambers, multiple sample racks can be placed, and gas corrosion tests under the same gas environment and different temperature conditions can be carried out simultaneously in a single first reaction chamber.

[0032] Fifth, the present invention can configure mixed corrosive gas during the gas corrosion test and store it in a mixed gas storage system to reduce the test preparation time. Since the corrosion test takes a long time, after a single ventilation is completed, the mass flow meters in the gas supply system are idle. Currently, the mass flow meters for corrosive gases are all produced by Brooks Instruments in the United States and are expensive. Combining a high-throughput electronic special gas supply system and a mixed storage system to supply gas to multiple corrosion test chambers can greatly improve the utilization rate of the mass flow meters and reduce equipment costs.

[0033] Sixth, by setting up a dryer, the water vapor in the gas discharged after the reaction can be absorbed. Compared with the corrosive gas containing water, the corrosiveness of the dry corrosive gas is weaker, and the corrosion of the corrosive gas to the vortex pump can be reduced to a minimum. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0035] Figure 2 It is a schematic diagram of the internal structure of the high temperature gas corrosion module in the present invention.

[0036] Figure 3 It is a schematic diagram of the internal structure of the room temperature gas corrosion module in the present invention.

[0037] Figure 4 It is a schematic diagram of the internal structure of the part simulation operation module in the present invention.

[0038] Figure 5 It is a schematic diagram of the cooling module structure in the present invention.

[0039] Figure 6 It is a schematic diagram of the structure of the high-temperature gas corrosion module and the correction temperature measuring component in the present invention.

[0040] Reference numerals: 1. High-temperature gas corrosion module, 11. First reaction chamber, 12. First plugging cover, 13. Insulation layer, 14. Heating element, 15. Temperature measuring element, 16. First bellows, 2. Normal-temperature gas corrosion module, 21. Second reaction chamber, 22. Second plugging cover, 23. Second bellows, 3. Part simulation operation module, 31. Metal gasket face sealing joint, 4. High-throughput electronic special gas supply module, 41. First argon tank, 42. Water storage tank, 43 , the second argon tank, 44, gas cylinder, 45, gas storage tank, 46, dew point meter, 47, nitrogen tank, 48, mixing tank, 5, gas composition monitoring module, 6, pressure regulation module, 61, molecular pump, 62, the first stop valve, 63, vortex pump, 64, the second stop valve, 65, the third stop valve, 66, vacuum tube, 7, vacuum measurement module, 71, resistance gauge, 72, film gauge, 8, dryer, 9, exhaust gas combustion absorber, 10, control module. DETAILED DESCRIPTION

[0041] The technical solution in the present application will be described clearly and in detail below in conjunction with the accompanying drawings. Among them, in the description of the embodiments of the present application, unless otherwise specified, " / " means or, for example, A / B can mean A or B: "and / or" in the text is only a description of the association relationship of associated objects, indicating that there can be three relationships, such as A and / or B, which can mean: A exists alone, A and B exist at the same time, and B exists alone. In addition, in the description of the embodiments of the present application, "multiple" refers to two or more than two. The following terms "first" and "second" are used for descriptive purposes only and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0042] like Figure 1 As shown, the present invention provides a high-throughput electronic special gas corrosion simulation system, including a high-temperature gas corrosion module 1, a normal-temperature gas corrosion module 2, a part simulation operation module 3, a high-throughput electronic special gas supply module 4 and a pressure regulating module 6. The high-temperature gas corrosion module 1, the normal-temperature gas corrosion module 2 and the part simulation operation module 3 all have an inlet and an outlet. The high-temperature gas corrosion module 1 is used to place a first sample therein and provide a high-temperature environment for the first sample. The normal-temperature gas corrosion module 2 is used to place a first sample therein and provide a normal-temperature environment for the first sample. The first sample is a part used in semiconductor process equipment. The part simulation operation module 3 is used to hang a second sample therein, and a conveying structure is provided for the electronic special gas through the second sample, thereby simulating a gas conveying system. The second sample is a part used in the gas conveying system. The high-throughput electronic special gas supply module 4 is connected to the high-temperature gas corrosion module 1, the normal-temperature gas corrosion module 2 and the part simulation operation module 3, respectively. The high-throughput electronic special gas supply module 4 is used to respectively The high-temperature gas corrosion module 1, the normal-temperature gas corrosion module 2, and the part simulation operation module 3 provide electronic special gases to simulate the corrosion of the first sample by the electronic special gases at different temperatures and the influence on the operation accuracy of the second sample. The pressure regulating module 6 is connected to the high-temperature gas corrosion module 1, the normal-temperature gas corrosion module 2, and the part simulation operation module 3, respectively. The pressure regulating module 6 is used to adjust the pressures in the high-temperature gas corrosion module 1, the normal-temperature gas corrosion module 2, and the part simulation operation module 3, respectively, to simulate the corrosion of the first sample by the electronic special gases at different pressures and the influence on the operation accuracy of the second sample. A high-throughput electronic special gas corrosion simulation system of the present invention can simulate the operating environment of each part in semiconductor process equipment and its gas delivery system, perform corrosion resistance tests on materials used for various parts in electronic special gases under different temperatures and pressures, and monitor the influence of electronic special gas corrosion on the operation accuracy of parts, thereby providing a reliable basis for material selection and operation life of each part in semiconductor process equipment and its gas delivery system.

[0043] like Figure 2 As shown, the high-temperature gas corrosion module 1 includes at least one first reaction chamber 11, a heating element 14 and a temperature measuring element 15. The two ends of the first reaction chamber 11 are open structures. One end of the first reaction chamber 11 is connected to the high-throughput electronic special gas supply module 4, and the other end of the first reaction chamber 11 is connected to the pressure regulating module 6, that is, one end of the first reaction chamber 11 is provided with a first air inlet, and the first air inlet is connected to the high-throughput electronic special gas supply module 4. The other end of the first reaction chamber 11 is provided with a first air outlet, and the first air outlet is connected to the pressure regulating module 6. Module 6 is connected, the interior of the first reaction chamber 11 is used to place the first sample, the outside of the first reaction chamber 11 is provided with a thermal insulation layer 13, the first reaction chamber 11 is insulated by the thermal insulation layer 13 to avoid heat loss when the interior of the first reaction chamber 11 is heated, the heating element 14 is arranged between the first reaction chamber 11 and the thermal insulation layer 13, the heating element 14 is used to heat the interior of the first reaction chamber 11, the temperature measuring element 15 is arranged between the first reaction chamber 11 and the thermal insulation layer 13, the temperature measuring element 15 is used to measure the temperature of the outer wall of the first reaction chamber 11.

[0044] Among them, the heating element 14 is a silicon-molybdenum rod or a nickel-chromium wire, the temperature measuring element 15 is an S-type thermocouple, and the thick insulation layer 13 is wrapped around the heating element 14, which can ensure that when the reaction chamber is heated to 1500°C, the outer shell temperature of the first reaction chamber 11 is lower than 40°C to avoid scalding the operator.

[0045] like Figure 2 As shown, both ends of the first reaction chamber 11 are open structures, and the two ends of the first reaction chamber 11 are detachably connected with first blocking covers 12, a first air inlet is arranged on one of the first blocking covers 12, and a first air outlet is arranged on another first blocking cover 12, and each first sample is placed in the first reaction chamber 11 through a sample rack. There are preferably four first reaction chambers 11, and the four first air inlets of the four first reaction chambers 11 are connected to one end of the first gas pipe through a five-way pipe, and the other end of the first gas pipe serves as the inlet of the high-temperature gas corrosion module 1.

[0046] like Figure 3 As shown, the room temperature gas corrosion module 2 includes at least one second reaction chamber 21, one end of the second reaction chamber 21 is connected to the high-throughput electronic special gas supply module 4, and the other end of the second reaction chamber 21 is connected to the pressure regulating module 6, that is, a second air inlet is provided at one end of the second reaction chamber 21, and the second air inlet is connected to the high-throughput electronic special gas supply module 4, and a second air outlet is provided at the other end of the second reaction chamber 21, and the second air outlet is connected to the pressure regulating module 6, and the interior of the second reaction chamber 21 is used to place the first sample.

[0047] like Figure 3As shown, both ends of the second reaction chamber 21 are open structures, and the two ends of the second reaction chamber 21 are detachably connected with second blocking covers 22, the second air inlet is arranged on one of the second blocking covers 22, and the second air outlet is arranged on the other second blocking cover 22, and each first sample is placed in the second blocking cover 22 through a sample rack. There are preferably four second reaction chambers 21, and the four second air inlets of the four second reaction chambers 21 are connected to one end of the second gas pipe through a five-way pipe, and the other end of the second gas pipe serves as the outlet of the normal temperature gas corrosion module 2.

[0048] like Figure 2 , Figure 3 As shown, the materials of the first reaction chamber 11 and the second reaction chamber 21 are both high-purity quartz or high-purity corundum. The high-purity quartz reaction chamber is used for non-HF gas tests below 1100° C., and the high-purity corundum reaction chamber is used for gas tests above 1100° C. or HF gas tests at any temperature.

[0049] like Figure 2 , Figure 3 As shown, a first bellows 16 is arranged between the first reaction chamber 11 and the pressure regulating module 6, and one end of the first bellows 16 is connected to the first reaction chamber 11, that is, one end of the first bellows 16 is connected to the first gas outlet, and a second bellows 23 is arranged between the second reaction chamber 21 and the pressure regulating module 6, and one end of the second bellows 23 is connected to the second reaction chamber 21, that is, one end of the second bellows 23 is connected to the second gas inlet, and the other end of the first bellows 16 and the other end of the second bellows 23 are respectively connected to the pressure regulating module 6 through a vacuum measuring module 7, and the vacuum measuring module 7 is composed of a resistance gauge 71 and a film gauge 72, and the resistance gauge 71 measures the vacuum degree The range is 0.1Pa~105Pa, and the vacuum measurement range of the thin film gauge 72 is 133Pa~133kPa. The resistance gauge 71 and the thin film gauge 72 are used to measure the vacuum in the first reaction chamber 11 and the second reaction chamber 21. The other ends of the four first bellows 16 are connected to one end of the first exhaust pipe through a five-way pipe, and the other end of the first exhaust pipe serves as the outlet of the high-temperature gas corrosion module 1. The other ends of the four first bellows 16 are connected to one end of the second exhaust pipe through a five-way pipe, and the other end of the second exhaust pipe serves as the outlet of the normal temperature gas corrosion module 2. The resistance gauge 71 and the thin film gauge 72 are connected through a standard vacuum KF25 interface, which is convenient for installation and disassembly.

[0050] The first reaction chamber 11 and the two first blocking covers 12, and the second reaction chamber 21 and the two second blocking covers 22 are connected by screw connection, clamp connection or flange screw connection. In the present embodiment, the connection method is flange screw connection. When delivering and taking samples, an Allen wrench is used to open the first blocking cover 12 connected to the first reaction chamber 11 and its rear end, and the second blocking cover 22 connected to the second reaction chamber 21 and its rear end, and the first blocking cover 12 together with the first bellows 16 is separated from the first reaction chamber 11, and the second blocking cover 22 together with the second bellows 23 is separated from the second reaction chamber 21. A stainless steel telescopic sampling rod is used to put the first sample and the sample rack into / take out the first reaction chamber 11 and the second reaction chamber 21, and finally the first reaction chamber 11 and the second reaction chamber 21 are sealed. The material of the sample holder is high-purity quartz or high-purity corundum. When conducting non-HF gas tests below 1100°C, use the high-purity quartz sample holder. When conducting gas experiments above 1100°C or HF gas tests at any temperature, use the high-purity corundum sample holder.

[0051] like Figure 4 As shown, the part simulation operation module 3 includes multiple groups of metal gasket surface sealing joints 31, and the multiple groups of metal gasket surface sealing joints 31 are used to hang multiple second specimens. The metal gasket surface sealing joints 31 are preferably three groups, each group of metal gasket surface sealing joints 31 has four pairs, each pair of metal gasket surface sealing joints 31 has two, and the two metal gasket surface sealing joints 31 are arranged opposite to each other. The second specimens are specifically mass flow meters, mass flow testers, gas valves and other parts. The mass flow meters, mass flow testers, gas valves and other parts are respectively hung through twelve pairs of metal gasket surface sealing joints 31, so that electronic special gases pass through the inside of the parts to simulate the working environment of the parts in the gas delivery system. When the mechanical structure inside the parts is corroded and damaged After the injury, the flow measured by the part is inconsistent with the actual flow, that is, the part is considered to have failed and the operation accuracy does not meet the requirements. One of the metal gasket surface sealing joints 31 is connected to one end of the intake pipe, and the other metal gasket surface sealing joint 31 is connected to one end of the outlet pipe. The other ends of the four intake pipes are connected to one end of the intake main pipe through a five-way pipe, and the other ends of the three intake main pipes are connected to one end of the third air supply pipe through a four-way pipe. The other end of the third air supply pipe serves as the inlet of the part simulation operation module 3, and the other ends of the four outlet pipes are connected to one end of the outlet main pipe through a five-way pipe, and the other ends of the three outlet main pipes are connected to one end of the third exhaust pipe through a four-way pipe. The other end of the third exhaust pipe serves as the outlet of the part simulation operation module 3.

[0052] like Figure 1As shown, the high-throughput electronic special gas supply module 4 includes at least one gas storage tank 45, a first argon tank 41, a water tank 42, multiple second argon tanks 43, multiple mixing tanks 48, multiple gas bottles 44 and a dew point meter 46. The outlet of the gas storage tank 45 is respectively connected to the inlet of the high-temperature gas corrosion module 1, the inlet of the normal-temperature gas corrosion module 2, and the inlet of the part simulation operation module 3. Argon is stored in the first argon tank 41, and water is stored in the water tank 42. The outlet of the first argon tank 41 is connected to the inlet of the water tank 42, and the outlet of the water tank 42 is connected to the inlet of the gas tank 45, so that the argon in the first argon tank 41 can enter the water tank 42 to increase the water vapor content in the argon, and then transport it into the gas tank 45. Each second argon tank 43 stores argon, and multiple mixing tanks 48 correspond to the multiple second argon tanks 43 one by one. Each mixing tank 48 The inlet of the mixing tank 48 is connected to the outlet of the corresponding second argon tank 43, and multiple mixing tanks 48 are arranged in sequence from left to right. The inlet of the mixing tank 48 on the far left is connected to the outlet of the water storage tank 42. The outlet of each mixing tank 48 from left to right is respectively connected to the inlet of the gas storage tank 45 and the inlet of the next mixing tank 48. After the dry argon gas and the water-containing argon gas are mixed by the multiple mixing tanks 48, the water content of the argon gas finally input into the gas storage tank 45 is adjusted. The outlets of the multiple gas cylinders 44 are respectively connected to the inlet of the gas storage tank 45. The multiple gas cylinders 44 are respectively used to store a variety of different corrosive gases. The number of gas cylinders 44 is preferably 8, and the 8 gas cylinders 44 are respectively used to store Cl2, F2, O2, HF, HCl, HBr, HI, and PH3. A dew point meter 46 is arranged at the outlet of the water storage tank 42. The dew point meter 46 is used to measure the water vapor content of the argon gas output from the water storage tank 42.

[0053] Among them, the gas storage tank 45 is made of stainless steel, and the inner wall is lined with PTFE to prevent water-containing corrosive gas from damaging the stainless steel tank. The gas pipelines connected to the first argon tank 41 and multiple second argon tanks 43 are made of 316lvv stainless steel, and the inner wall is electrolytically polished to reduce the adhesion of water vapor. The gas pipelines connected to multiple gas cylinders 44 are made of nickel-based alloy, and the inner wall is electrolytically polished to reduce the adsorption of corrosive gas and increase the life of the pipeline.

[0054] like Figure 1 As shown, there are preferably three gas storage tanks 45, and the outlet of each gas storage tank 45 is respectively connected to the inlet of the high-temperature gas corrosion module 1, the inlet of the normal-temperature gas corrosion module 2, and the inlet of the part simulation operation module 3.

[0055] like Figure 1As shown, the pressure regulating module 6 includes a vacuum tube 66, a vortex pump 63, a molecular pump 61, a first stop valve 62, a second stop valve 64 and a third stop valve 65. One end of the vacuum tube 66 is respectively connected to the outlet of the high-temperature gas corrosion module 1, the outlet of the normal-temperature gas corrosion module 2, and the outlet of the part simulation operation module 3. The inlet of the vortex pump 63 is connected to the other end of the vacuum tube 66, the inlet of the molecular pump 61 is connected to the position of the vacuum tube 66 close to the vortex pump 63, the outlet of the molecular pump 61 is connected to the inlet of the vortex pump 63, the first stop valve 62 is arranged at the inlet position of the molecular pump 61, the second stop valve 64 is arranged at the outlet position of the molecular pump 61, and the third stop valve 65 is arranged at the end of the vacuum tube 66 close to the vortex pump 63.

[0056] like Figure 1 As shown, a dryer 8 is provided on the vacuum tube 66 between the high-temperature gas corrosion module 1 and the molecular pump 61. The inlet and outlet of the dryer 8 are respectively connected to the vacuum tube 66. The dryer 8 is a serpentine structure. A highly water-absorbent material is provided in the dryer 8, preferably cross-linked sodium polyacrylate or porous alumina particles.

[0057] like Figure 1 As shown, a high-throughput electronic special gas corrosion simulation system of the present invention also includes a gas composition monitoring module 5, the inlet of the gas composition monitoring module 5 is respectively connected to the outlet of the high-temperature gas corrosion module 1, the outlet of the normal temperature gas corrosion module 2, and the outlet of the part simulation operation module 3, and the outlet of the gas composition monitoring module 5 is connected to the inlet position of the vacuum tube 66 near the dryer 8.

[0058] Among them, the gas composition monitoring module 5 includes a gas chromatograph. The lower limit of the gas composition content monitoring of the gas chromatograph is 0.01ppm, and the maximum error is less than 2%. It can monitor the changes in gas composition during the experiment and is used to evaluate whether the electronic special gas needs to be replaced.

[0059] like Figure 1 As shown, the outlet of the vortex pump 63 is connected to the tail gas combustion absorber 9, and the discharged electronic special gas is processed by the tail gas combustion absorber 9 to prevent its discharge from polluting the environment.

[0060] like Figure 1As shown, a high-throughput electronic special gas corrosion simulation system of the present invention also includes a nitrogen tank 47, in which nitrogen is stored. The outlet of the nitrogen tank 47 is respectively connected to the inlet of the high-temperature gas corrosion module 1, the inlet of the normal-temperature gas corrosion module 2, and the inlet of the part simulation operation module 3. The nitrogen is used when delivering samples and taking samples, and can form a N2 protective atmosphere in the reaction chamber and the vacuum pipeline to prevent external air from entering. At the same time, in order to ensure that there is no residual water vapor on the inner walls of the first reaction chamber 11, the second reaction chamber 21 and the vacuum tube 66, it is necessary to heat up to 150°C and continuously introduce N2 into the first reaction chamber 11, the second reaction chamber 21 and the vacuum tube 66 for purging to ensure the accuracy of the reaction chamber test results.

[0061] like Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, the outlet of the first argon tank 41, the outlet of each second argon tank 43, the outlet of each gas cylinder 44, the first gas inlet of each first reaction chamber 11, the second gas inlet of each second reaction chamber 21, and each gas inlet main pipe are sequentially provided with an MFC (mass flow controller) and a first pneumatic diaphragm valve, and the rear end of each first bellows 16, the rear end of each second bellows 23, after each vacuum measuring module 7, and each gas outlet pipe are provided with a second pneumatic diaphragm valve, and the supply of each gas is controlled by the MFC, the first pneumatic diaphragm valve, and the second pneumatic diaphragm valve.

[0062] like Figure 5 As shown, the two first sealing covers 12 on each first reaction chamber 11 are connected to a cooling module, which is used to cool the two first sealing covers 12 by circulating cooling water to ensure that the sealing rubber rings in the two first sealing covers 12 will not be damaged during the high-temperature experiment. Since there is a temperature gradient in the high-temperature reaction first reaction chamber 11, gas corrosion simulation experiments in different temperature ranges can be carried out simultaneously in one first reaction chamber 11.

[0063] like Figure 1As shown, a high-throughput electronic special gas corrosion simulation system of the present invention also includes a control module 10, on which a vacuum meter is provided, and the vacuum meter is connected to each vacuum measuring module 7 for observing the vacuum degree of each vacuum measuring module 7. The control module 10 is a distributed monitoring system based on the RS485 communication protocol. The control module 10 uses a touch screen computer as a host computer. The control module 10 includes a PLC controller, and the high-throughput electronic special gas supply module, a cooling module, a gas composition monitoring module, a vacuum measuring module, and a pressure regulating module are controlled by the PLC controller. The control module 10 displays the supply gas type, gas flow rate, cooling water circulation state of the cooling module, temperature and pressure of the first reaction chamber 11, temperature and pressure of the second reaction chamber 21, and working parameters of the parts in the part simulation operation module of the high-throughput electronic special gas supply module through the touch screen computer. The control module 10 is a distributed control system of RS485 digital communication technology, and the host computer is a touch screen computer. The PLC controller is electrically connected to the resistance gauge 71 and the film gauge 72 in each vacuum measuring module 7. The pressure in the first reaction chamber 11 and the second reaction chamber 21 is monitored by the resistance gauge 71 and the film gauge 72 and transmitted to the vacuum gauge. The pressure in the test reaction chamber can be observed in real time through the vacuum gauge. The PLC controller is electrically connected to the molecular pump power controller and the vortex pump controller. The molecular pump power controller is electrically connected to the molecular pump 61. The vortex pump controller power controller is electrically connected to the vortex pump 63. The molecular pump 61 is controlled by the PLC controller to evacuate the first reaction chamber 11 and the second reaction chamber 21 to the ultimate vacuum, and the pressure value of the vacuum measurement system is observed through the vacuum gauge. After reaching the predetermined value, the molecular pump 61 is turned off. During the insulation process of the first reaction chamber 11 and the second reaction chamber 21, the second pneumatic diaphragm valve at the rear end of the bellows is closed. The PLC controller controls the vortex pump 63 to evacuate the vacuum measurement system and the rear end vacuum tube to discharge the electronic special gas therein. The PLC controller is electrically connected to each first pneumatic diaphragm valve, each second pneumatic diaphragm valve, and each MFC, and controls the supply of various gases to provide corresponding gas conditions for the first sample in the electronic special gas corrosion experiment.

[0064] The present invention also provides a high-throughput electronic special gas corrosion simulation method, the specific steps are as follows: Step 1, evacuate, open the second pneumatic diaphragm valve at the rear end of each first bellows 16, the second pneumatic diaphragm valve at the rear end of the second bellows 23, the second pneumatic diaphragm valve on each outlet pipe, and the third stop valve 65 in sequence, then start the vortex pump 63 to evacuate, observe the reading of the vacuum gauge, after the pressure of the first reaction chamber 11 and the second reaction chamber 21 drops below 100Pa, open the first stop valve 62 and the second stop valve 64, close the third stop valve 65, start the molecular pump 61 to continue evacuating, and complete the evacuation after evacuating to vacuum (less than 0.001Pa). If pressure maintenance operation is required, then after the evacuation is completed, first close the molecular pump 61, and after the molecular pump 61 is completely closed (the molecular pump speed is 0), close the first stop valve 62 and the second stop valve 64, and then close the vortex pump 63 to maintain pressure.

[0065] Step 2, temperature calibration, turn on each heating element 14, wait for the power indicator light of the control module 10 to light up, set the heating, heat preservation and cooling programs, the heating rate should be less than 8°C / minute, and at the same time ensure the normal operation of the vortex pump 63, ensure that the chamber pressure is lower than one atmosphere, and then start heating, wait for the temperature of the outer wall of the first reaction chamber 11 to reach the set temperature T1, observe the reading of the temperature measuring element 15, record the difference ΔT between the set temperature and the reading of the temperature measuring element 15, and adjust the set temperature of the PLC temperature controller to T2, such as Figure 6 As shown, the temperature measured by the temperature measuring element 15 in the first reaction chamber 11 reaches T1, and then the temperature measuring element 15 is used to measure the temperature gradient distribution from the center to the two ends of the first reaction chamber 11.

[0066] Step 3, heating, turn on each heating element 14, wait for the power indicator light of the control module 10 to light up, set the heating, insulation and cooling programs, the heating rate should be less than 8°C / minute, and at the same time ensure the normal operation of the vortex pump 63 and the chamber pressure is lower than one atmosphere, then start heating, and wait until the temperature of the outer wall of the first reaction chamber 11 reaches the set temperature T2.

[0067] Step 4, ventilation, after the vacuum is drawn, close the molecular pump 61, open the third stop valve 65 when its speed is 0, close the first stop valve 62 and the second stop valve 64, and only keep the vortex pump 63 to evacuate, close the second pneumatic diaphragm valve at the rear end of each first bellows 16 and the second pneumatic diaphragm valve at the rear end of the second bellows 23, open the corresponding first pneumatic diaphragm valve of the gas required for the test, and then open the corresponding MFC, and gradually increase the flow rate of the gas introduced from a small amount to a specified flow rate to avoid instantaneous introduction of a large amount of low-temperature gas to damage the first reaction chamber 11 and the second reaction chamber 21, and wait for When the pressure in the first reaction chamber 11 and the second reaction chamber 21 reaches the specified pressure, first close the corresponding MFC, and then close the corresponding first pneumatic diaphragm valve to avoid inaccurate flow value display due to reversing the order, close the second pneumatic diaphragm valve in front of each vacuum measuring module 7, open the second pneumatic diaphragm valve behind each vacuum measuring module 7 and the second pneumatic diaphragm valve at the rear end of the second bellows 23, and pump air for five minutes. After the electronic special gas is discharged, close the second pneumatic diaphragm valve behind each vacuum measuring module 7, close the third stop valve 65, and close the vortex pump 63.

[0068] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this application are within the scope of protection of the present invention.

Claims

1. A high-throughput electronic special gas corrosion simulation system, characterized in that: include: A high-temperature gas corrosion module (1) comprises at least one first reaction chamber (11), wherein a heating element (14) is arranged on the first reaction chamber (11), and the first reaction chamber (11) is used to place a first sample and provide a high-temperature environment for the first sample; A room temperature gas etching module (2) comprises at least one second reaction chamber (21), wherein the second reaction chamber (21) is used to place a first sample and provide a room temperature environment for the first sample; A parts simulation operation module (3) comprises a plurality of sets of metal gasket face sealing joints (31), wherein the plurality of sets of metal gasket face sealing joints (31) are used to mount a plurality of second specimens, and provide a delivery structure for the electronic special gas through the second specimens, thereby simulating a gas delivery system; A high-throughput electronic special gas supply module (4) is respectively connected to the first reaction chamber (11), the second reaction chamber (21), and the plurality of sets of metal gasket surface sealing joints (31), and is used to respectively provide electronic special gas to the first reaction chamber (11), the second reaction chamber (21), and the plurality of sets of metal gasket surface sealing joints (31), so as to simulate the corrosion of the electronic special gas on the first sample and the influence on the running accuracy of the second sample at different temperatures; The pressure regulating module (6) is respectively connected to the first reaction chamber (11), the second reaction chamber (21), and the plurality of metal gasket surface sealing joints (31), and is used to respectively regulate the pressures in the first reaction chamber (11), the second reaction chamber (21), and the plurality of metal gasket surface sealing joints (31), so as to simulate the corrosion of the electronic special gas on the first sample and the influence on the running accuracy of the second sample under different pressures.

2. The high-throughput electronic special gas corrosion simulation system according to claim 1 is characterized in that: The high temperature gas corrosion module (1) further comprises: A heat-insulating layer (13) is arranged outside the first reaction chamber (11), and the heating element (14) is arranged between the first reaction chamber (11) and the heat-insulating layer (13); The temperature measuring element (15) is arranged between the first reaction chamber (11) and the thermal insulation layer (13) and is used to measure the temperature of the outer wall of the first reaction chamber (11).

3. The high-throughput electronic special gas corrosion simulation system according to claim 2 is characterized in that: A first bellows (16) is arranged between the first reaction chamber (11) and the pressure regulating module (6), one end of the first bellows (16) is connected to the first reaction chamber (11), a second bellows (23) is arranged between the second reaction chamber (21) and the pressure regulating module (6), one end of the second bellows (23) is connected to the second reaction chamber (21), the other end of the first bellows (16) and the other end of the second bellows (23) are respectively connected to the pressure regulating module (6) via a vacuum measuring module (7), and the vacuum measuring module (7) is composed of a resistance gauge (71) and a film gauge (72).

4. The high-throughput electronic special gas corrosion simulation system according to claim 3 is characterized in that: The high-throughput electronic special gas supply module (4) comprises: At least one gas storage tank (45), the outlet of which is respectively connected to the first reaction chamber (11), the second reaction chamber (21), and a plurality of sets of metal gasket surface sealing joints (31); a first argon gas tank (41) and a water storage tank (42), wherein the first argon gas tank (41) stores argon gas, and the water storage tank (42) stores water, the outlet of the first argon gas tank (41) is connected to the inlet of the water storage tank (42), and the outlet of the water storage tank (42) is connected to the inlet of the gas storage tank (45); a plurality of second argon gas tanks (43), each of the second argon gas tanks (43) storing argon gas; A plurality of gas mixing tanks (48) corresponding one to the plurality of second argon gas tanks (43), the inlet of each gas mixing tank (48) being connected to the outlet of the corresponding second argon gas tank (43), the plurality of gas mixing tanks (48) being arranged in sequence from left to right, the inlet of the leftmost gas mixing tank (48) being connected to the outlet of the water storage tank (42), and the outlet of each gas mixing tank (48) being connected to the inlet of the gas storage tank (45) and the inlet of the next gas mixing tank (48) from left to right; A plurality of gas cylinders (44), the outlets of which are respectively connected to the inlets of the gas storage tank (45), and the interiors of the plurality of gas cylinders (44) are respectively used to store a plurality of different corrosive gases; A dew point meter (46) is arranged at the outlet of the water storage tank (42) and is used to measure the water vapor content of the argon gas output from the water storage tank (42).

5. The high-throughput electronic special gas corrosion simulation system according to claim 3 is characterized in that: The pressure regulating module (6) comprises: A vacuum tube (66), one end of which is respectively connected to two vacuum measurement modules (7) and a plurality of sets of metal gasket surface sealing joints (31); A vortex pump (63), the inlet of which is connected to the other end of the vacuum tube (66); A molecular pump (61), wherein the inlet is connected to a position of the vacuum tube (66) close to the vortex pump (63), and the outlet is connected to the inlet of the vortex pump (63); A first stop valve (62), a second stop valve (64) and a third stop valve (65), wherein the first stop valve (62) is arranged at the inlet position of the molecular pump (61), the second stop valve (64) is arranged at the outlet position of the molecular pump (61), and the third stop valve (65) is arranged at the end of the vacuum tube (66) close to the vortex pump (63).

6. The high-throughput electronic special gas corrosion simulation system according to claim 5 is characterized in that: A dryer (8) is provided on the vacuum tube (66) at a position between the high-temperature gas corrosion module (1) and the molecular pump (61), and the inlet and outlet of the dryer (8) are respectively connected to the vacuum tube (66).

7. The high-throughput electronic special gas corrosion simulation system according to claim 6 is characterized in that: It also includes a gas composition monitoring module (5), wherein the inlet of the gas composition monitoring module (5) is respectively connected to the first reaction chamber (11), the second reaction chamber (21), and a plurality of sets of metal gasket surface sealing joints (31), and the outlet of the gas composition monitoring module (5) is connected to the vacuum tube (66) near the inlet position of the dryer (8).

8. The high-throughput electronic special gas corrosion simulation system according to claim 5 is characterized in that: The outlet of the vortex pump (63) is connected to a tail gas combustion absorber (9).

9. The high-throughput electronic special gas corrosion simulation system according to claim 1 is characterized in that: It also includes a nitrogen tank (47), the outlet of which is respectively connected to the first reaction chamber (11), the second reaction chamber (21), and a plurality of sets of metal gasket surface sealing joints (31).

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