Back scattering imaging device based on double detectors

Abstract

The invention relates to the technical field of detectors, in particular to a back scattering imaging device based on double detectors, which comprises a back scattering imaging detector, a mechanical arm and a linear array imaging detector, the back scattering imaging detector comprises a radiation source, a collimator arranged at a line outlet of the radiation source and a first scintillator arranged at the line outlet of the radiation source. The fixed end of the mechanical arm is connected with the back scattering imaging detector; the linear array imaging detector is connected with the driving end of the mechanical arm, the linear array imaging detector is arranged on the wire outlet side of the back scattering imaging detector, and a placement space is formed between the back scattering imaging detector and the linear array imaging detector; wherein a second scintillator in the linear array imaging detector is aligned with a wire outlet of the back scattering imaging detector. The back scattering imaging device based on the double detectors can simultaneously discover foreign matters and combine the images of the linear array imaging detector, and can identify the fine microstructure of the object with higher definition.

Description

Technical Field

[0001] The invention relates to the technical field of detectors, and in particular to a backscatter imaging device based on dual detectors. Background Art

[0002] X-ray backscatter imaging technology has been widely used in the field of security inspection of human bodies, cargoes and vehicles due to its advantages such as low radiation dose, good safety and sensitivity to lightweight materials.

[0003] X-ray backscatter imaging technology detects the strength of X-ray scattering by different materials to obtain images of materials within a certain depth from the surface of an object.

[0004] The backscatter inspection system includes an X-ray source and a detector, wherein the X-rays emitted by the X-ray source are formed into a pencil beam by a pencil beam forming device, and the surface of the object to be inspected is scanned point by point; the detector receives the scattered signal of the object and forms a depth image of the object surface.

[0005] Existing backscatter inspection systems are mostly used in fixed security inspection equipment for containers, vehicles, personnel and packages. With the advancement of X-ray source and detector technology, backscatter inspection systems have been miniaturized. Portable backscatter inspection systems can be close to the object to be inspected and scan and image the object from multiple angles and in all directions. At the same time, portable backscatter inspection systems are light and easy to carry, which fully expands the application occasions of the inspection system.

[0006] Based on the existing backscatter imaging system, since the Compton effect is more obvious for organic matter with a lower atomic number, it can distinguish organic matter well; however, the reflected dose is very weak, and the image clarity, penetration and resolution are much inferior to those of penetrating imaging. Summary of the invention

[0007] In view of this, the present invention provides a backscatter imaging device based on dual detectors to solve the problem in existing backscatter imaging systems that the reflected dose is very weak and the image clarity, penetration and resolution are much inferior to those of penetrating imaging.

[0008] In a first aspect, the present invention provides a backscatter imaging device based on dual detectors, comprising:

[0009] A backscatter imaging detector, comprising a ray source, a collimator arranged at an outlet of the ray source, and a first scintillator arranged at the outlet of the ray source;

[0010] A mechanical arm, wherein a fixed end of the mechanical arm is connected to the backscatter imaging detector;

[0011] A linear array imaging detector connected to the driving end of the mechanical arm, the linear array imaging detector is arranged on the side of the wire outlet of the backscatter imaging detector, and a placement space is formed between the backscatter imaging detector and the linear array imaging detector;

[0012] Wherein, the second scintillator inside the linear array imaging detector is aligned with the line outlet of the backscatter imaging detector.

[0013] The backscatter imaging detector is combined with the linear array imaging detector by a mechanical arm, and the second scintillator inside the linear array imaging detector is aligned with the outlet of the backscatter imaging detector. This design can only be provided with a ray source and a collimator inside the backscatter imaging detector. When detecting an object, the object is placed in the placement space formed between the backscatter imaging detector and the linear array imaging detector. The ray source inside the backscatter imaging detector emits X-rays and passes through the collimator to the object. Some of the X-rays are reflected by the object and absorbed by the first scintillator inside the backscatter imaging detector, and some of the X-rays are absorbed by the second scintillator inside the linear array imaging detector after passing through the object. Then, the data of the backscatter imaging detector and the linear array imaging detector are integrated. The backscatter imaging device based on dual detectors can simultaneously detect foreign matter and combine the image of the linear array imaging detector, and can identify the fine microscopic structure of the object with higher definition. The problem that the backscatter imaging detector cannot distinguish between materials is solved. In combination with the linear array imaging detector, imaging of different energy levels can be achieved in one scan. Two objects with similar atomic numbers can be completely distinguished when placed together.

[0014] In an optional embodiment, the back side of the first scintillator inside the backscatter imaging detector is protected from X-rays by a lead-based composite polymer shielding material.

[0015] In order to prevent X-rays in other directions from being absorbed by the first scintillator, thereby affecting the backscattering imaging effect of the backscattering imaging detector, a lead-based composite polymer shielding material is arranged on the back of the first scintillator in the present invention to protect against X-rays, so that the first scintillator can only absorb X-rays from its front side (i.e., the direction in which the above-mentioned item is arranged) to ensure the backscattering imaging effect.

[0016] In an optional implementation, a light-shielding and sealing treatment is performed using carbon fiber in front of the first scintillator in the backscatter imaging detector.

[0017] In an optional implementation, a carbon fiber panel is fixed to the line outlet side of the backscatter imaging detector.

[0018] A carbon fiber panel is fixed on the outlet side of the backscatter imaging detector. By fixing the carbon fiber panel on the outlet side of the backscatter imaging detector, the distance to the object to be measured is shortened, and the backscatter imaging detector is brought closer to the surface of the object to be measured to receive more reflected doses.

[0019] In an optional implementation, the collimator is in a horn shape.

[0020] In an optional implementation, the collimator is fixed to the housing of the backscatter imaging detector, and the collimator and the housing of the backscatter imaging detector are staggeredly combined.

[0021] In an optional embodiment, a step surface is provided around the wire outlet on the housing of the backscatter imaging detector, and after the collimator is inserted into the wire outlet, the boss provided around the collimator abuts against the step surface.

[0022] A step surface is provided around the outlet of the housing of the backscatter imaging detector, and after the collimator is inserted into the outlet, the boss provided around the collimator abuts against the step surface. By abutting the boss provided around the collimator against the step surface around the outlet, the gap between the outlet and the collimator can be blocked.

[0023] In an optional implementation, the second scintillator inside the linear array imaging detector is protected from radiation by a lead-based composite polymer shielding material, and one side of the second scintillator detection area is exposed.

[0024] In an optional embodiment, the robotic arm includes a plurality of sub-robotic arms articulated with each other.

[0025] The linear array imaging detector is connected to the backscatter imaging detector through a mechanical arm, and the object to be measured is placed in the placement space formed between the backscatter imaging detector and the linear array imaging detector. Since the sizes of the objects to be measured are inconsistent, the mechanical arm is composed of a plurality of mutually articulated sub-mechanical arms to facilitate the adjustment of the distance between the backscatter imaging detector and the linear array imaging detector to adapt to objects to be measured of different sizes.

[0026] The dual-detector backscatter imaging device provided by the present invention has the following advantages:

[0027] 1. The dual-detector backscatter imaging device provided by the present invention comprises a backscatter imaging detector, a mechanical arm and a linear array imaging detector, wherein the backscatter imaging detector comprises a ray source, a collimator arranged at the line outlet of the ray source and a first scintillator arranged at the line outlet of the ray source; the fixed end of the mechanical arm is connected to the backscatter imaging detector; the linear array imaging detector is connected to the driving end of the mechanical arm, the linear array imaging detector is arranged on the line outlet side of the backscatter imaging detector, and a placement space is formed between the backscatter imaging detector and the linear array imaging detector; wherein the second scintillator inside the linear array imaging detector is aligned with the line outlet of the backscatter imaging detector.

[0028] The backscatter imaging device based on this structure is combined with the backscatter imaging detector and the linear array imaging detector by a mechanical arm, and the second scintillator in the linear array imaging detector is aligned with the outlet of the backscatter imaging detector. This design can only be provided with a ray source and a collimator in the backscatter imaging detector. When detecting an object, the object is placed in the placement space formed between the backscatter imaging detector and the linear array imaging detector. The ray source in the backscatter imaging detector emits X-rays and then passes through the collimator to the object. Part of the X-rays are reflected by the object and absorbed by the first scintillator in the backscatter imaging detector, and part of the X-rays are absorbed by the second scintillator in the linear array imaging detector after passing through the object. Then, the data of the backscatter imaging detector and the linear array imaging detector are integrated. The backscatter imaging device based on the dual detector can simultaneously detect foreign matter and combine the image of the linear array imaging detector, and can identify the fine microscopic structure of the object with higher definition. The problem that the backscatter imaging detector cannot distinguish between materials is solved. In combination with the linear array imaging detector, imaging of different energy levels can be achieved in one scan. Two objects with similar atomic numbers can be placed together and completely distinguished.

[0029] 2. In the dual-detector backscatter imaging device provided by the present invention, the back side of the first scintillator inside the backscatter imaging detector is protected from X-rays by a lead-based composite polymer shielding material.

[0030] In order to prevent X-rays in other directions from being absorbed by the first scintillator, thereby affecting the backscattering imaging effect of the backscattering imaging detector, the back of the first scintillator is provided with a lead-based composite polymer shielding material for X-ray protection in the dual-detector backscattering imaging device of this structure, so that the first scintillator can only absorb X-rays from its front side (i.e., the direction in which the above-mentioned object is set) to ensure the backscattering imaging effect.

[0031] 3. In the dual-detector based backscatter imaging device provided by the present invention, a light-shielding and sealing treatment is performed by using carbon fiber in front of the first scintillator inside the backscatter imaging detector.

[0032] In this structure of a dual-detector backscatter imaging device, a carbon fiber panel is fixed on the outlet side of the backscatter imaging detector. By fixing the carbon fiber panel on the outlet side of the backscatter imaging detector, the distance to the object to be measured is shortened, and the backscatter imaging detector is brought closer to the surface of the object to be measured to receive more reflected dose.

[0033] 4. In the dual-detector based backscatter imaging device provided by the present invention, the collimator is fixed to the housing of the backscatter imaging detector, and the collimator and the housing of the backscatter imaging detector are staggeredly combined.

[0034] The backscatter imaging device based on dual detectors of this structure is specifically staggered and combined as follows: a step surface is provided on the peripheral side of the outlet of the housing of the backscatter imaging detector, and the collimator is configured so that after the collimator is inserted into the outlet, the boss provided on the peripheral side of the collimator abuts against the step surface. By abutting the boss provided on the peripheral side of the collimator against the step surface on the peripheral side of the outlet, the gap between the outlet and the collimator can be blocked.

[0035] 5. The dual-detector backscatter imaging device provided by the present invention has a mechanical arm including a plurality of mutually articulated sub-mechanical arms. The linear array imaging detector is connected to the backscatter imaging detector through the mechanical arm, and the object to be measured is placed in the placement space formed between the backscatter imaging detector and the linear array imaging detector. Since the sizes of the objects to be measured are inconsistent, the mechanical arm is configured to be composed of a plurality of mutually articulated sub-mechanical arms to facilitate the adjustment of the distance between the backscatter imaging detector and the linear array imaging detector to accommodate objects of different sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A schematic structural view of a backscatter imaging device based on dual detectors provided in an embodiment of the present invention;

[0038] Figure 2 A schematic structural view of a ray source and a collimator provided in an embodiment of the present invention;

[0039] Figure 3 It is a schematic diagram of the installation of the collimator provided in the embodiment of the present invention.

[0040] Description of reference numerals:

[0041] 1- Backscatter imaging detector;

[0042] 2-Robotic arm;

[0043] 3-Linear array imaging detector;

[0044] 4-Ray source;

[0045] 5- Collimator. DETAILED DESCRIPTION

[0046] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0048] Example

[0049] X-ray backscatter imaging technology has been widely used in the field of security inspection of human bodies, cargoes and vehicles due to its advantages such as low radiation dose, good safety and sensitivity to lightweight materials.

[0050] X-ray backscatter imaging technology detects the strength of X-ray scattering by different materials to obtain images of materials within a certain depth from the surface of an object.

[0051] The backscatter inspection system includes an X-ray source and a detector, wherein the rays emitted by the X-ray source are formed into a pencil beam by a pencil beam forming device, and the surface of the object to be inspected is scanned point by point; the detector receives the scattered signal of the object and forms a depth image of the object surface.

[0052] Existing backscatter inspection systems are mostly used in fixed security inspection equipment for containers, vehicles, personnel and packages. With the advancement of X-ray source and detector technology, backscatter inspection systems have been miniaturized. Portable backscatter inspection systems can be close to the object to be inspected and scan and image the object from multiple angles and in all directions. At the same time, portable backscatter inspection systems are light and easy to carry, which fully expands the application occasions of the inspection system.

[0053] Based on the existing backscatter imaging system, since the Compton effect is more obvious for organic matter with a lower atomic number, it can distinguish organic matter well; however, the reflected dose is very weak, and the image clarity, penetration and resolution are much inferior to those of penetrating imaging.

[0054] To this end, this embodiment provides a backscatter imaging device based on dual detectors to solve the problem in existing backscatter imaging systems that the reflected dose is very weak and the image clarity, penetration and resolution are much inferior to those of penetrating imaging.

[0055] Figure 1 FIG. 1 is a schematic structural diagram of a dual-detector backscatter imaging device provided in this embodiment. Figure 1 As shown, the backscatter imaging device based on dual detectors includes a backscatter imaging detector 1, a mechanical arm 2 and a linear array imaging detector 3, wherein the backscatter imaging detector 1 includes a ray source 4, a collimator 5 arranged at the line outlet of the ray source 4 and a first scintillator arranged at the line outlet of the ray source 4; the fixed end of the mechanical arm 2 is connected to the backscatter imaging detector 1; the linear array imaging detector 3 is connected to the driving end of the mechanical arm 2, the linear array imaging detector 3 is arranged on the line outlet side of the backscatter imaging detector 1, and a placement space is formed between the backscatter imaging detector 1 and the linear array imaging detector 3; wherein the second scintillator inside the linear array imaging detector 3 is aligned with the line outlet of the backscatter imaging detector 1.

[0056] As can be seen from the above records, the traditional backscatter inspection system uses the X-rays emitted by the X-ray source to form a pencil beam through a pencil beam forming device, and scans the surface of the object to be inspected point by point; the detector receives the scattered signal of the object and forms a depth image of the object surface. However, the dose reflected back by the object is very weak, and the clarity, penetration and resolution of the image are much inferior to those of penetrating imaging, and it is impossible to effectively distinguish objects with similar material density. In this embodiment, the backscatter imaging detector 1 and the linear array imaging detector 3 are combined by the mechanical arm 2, and the second scintillator inside the linear array imaging detector 3 is aligned with the outlet of the backscatter imaging detector 1. This design can only provide a ray source 4 and a collimator 5 inside the backscatter imaging detector 1. When detecting an object, the object is placed in the placement space formed between the backscatter imaging detector 1 and the linear array imaging detector 3. The ray source 4 inside the backscatter imaging detector 1 emits X-rays and passes through the collimator 5 to the object. Part of the X-rays are reflected by the object and absorbed by the first scintillator inside the backscatter imaging detector 1, and part of the X-rays pass through the object and are absorbed by the second scintillator inside the linear array imaging detector 3. Then, the data of the backscatter imaging detector 1 and the linear array imaging detector 3 are integrated. The backscatter imaging device based on dual detectors can simultaneously detect foreign matter and combine the image of the linear array imaging detector 3, so as to identify the fine microstructure of the object with higher definition. To solve the problem that the backscatter imaging detector 1 cannot distinguish between substances, the linear array imaging detector 3 can be combined with a single scan to achieve imaging of different energy levels, and two objects with similar atomic numbers can be completely distinguished when placed together. The detection and imaging principles of the backscatter imaging detector 1 and the linear array imaging detector 3 both adopt existing technologies, which are directly used in this embodiment, so they are not described in detail here.

[0057] In this embodiment, as mentioned above, the backscatter imaging detector 1 alone cannot realize the function of distinguishing substances, so in this embodiment, a multi-level linear array detector is combined, and imaging of different energy levels can be realized in one scan, and two objects with similar atomic numbers can be completely distinguished when placed together. As for other current penetrating imaging technologies, such as flat-panel imaging, it is impossible to realize multi-energy spectrum imaging, so in this embodiment, a linear array imaging detector 3 is selected, which can realize multi-energy spectrum imaging, so that the internal structure of the object can be seen more clearly.

[0058] In this embodiment, the back side of the first scintillator inside the backscatter imaging detector 1 is protected from X-rays by a lead-based composite polymer shielding material.

[0059] In order to prevent X-rays in other directions from being absorbed by the first scintillator, thereby affecting the backscatter imaging effect of the backscatter imaging detector 1, in this embodiment, a lead-based composite polymer shielding material is arranged on the back of the first scintillator to protect against X-rays, so that the first scintillator can only absorb X-rays from its front side (i.e., the direction in which the above-mentioned items are arranged) to ensure the backscatter imaging effect.

[0060] Specifically, a partition made of a lead-based composite polymer shielding material can be directly provided on the back of the second scintillator, or the shell of the backscatter imaging detector 1 located in the back direction of the second scintillator can be directly made of a lead-based composite polymer shielding material.

[0061] In this embodiment, the front of the first scintillator inside the backscatter imaging detector 1 is subjected to light shielding and sealing treatment by using carbon fiber.

[0062] Specifically, a carbon fiber panel is fixed on the outlet side of the backscatter imaging detector 1. By fixing the carbon fiber panel on the outlet side of the backscatter imaging detector 1, the distance to the object to be measured is shortened, and the backscatter imaging detector 1 is closer to the surface of the object to be measured to receive more reflected doses.

[0063] In this embodiment, if Figure 2 and Figure 3 As shown, the collimator 5 is in a trumpet shape. The collimator 5 is fixed to the housing of the backscatter imaging detector 1, and the collimator 5 and the housing of the backscatter imaging detector 1 are staggered.

[0064] In this embodiment, the staggered combination is specifically as follows: a step surface is provided on the peripheral side of the outlet of the housing of the backscatter imaging detector 1, and the collimator 5 is configured such that after the collimator 5 is inserted into the outlet, the boss provided on the peripheral side of the collimator 5 abuts against the step surface. By abutting the boss provided on the peripheral side of the collimator 5 against the step surface on the peripheral side of the outlet, the gap between the outlet and the collimator 5 can be blocked.

[0065] In this embodiment, the second scintillator inside the linear array imaging detector 3 is protected from radiation by a lead-based composite polymer shielding material, and one side of the second scintillator detection area is exposed.

[0066] Similarly, in order to prevent the influence of external radiation on the second scintillator, a lead-based composite polymer shielding material is used around the second scintillator inside the linear array imaging detector 3 for radiation protection, so as to improve the imaging effect of the linear array imaging detector 3. At the same time, in order to enable the X-rays emitted by the ray source 4 in the backscatter imaging detector 1 to be smoothly absorbed by the second scintillator in the linear array imaging detector 3, one side of the second scintillator detection area is exposed. The above-mentioned detection area refers to the direction in which the second scintillator is close to the object to be measured.

[0067] In this embodiment, the robot arm 2 includes a plurality of mutually articulated sub-robot arms 2. The linear array imaging detector 3 is connected to the backscatter imaging detector 1 through the robot arm 2, and the object to be measured is placed in the placement space formed between the backscatter imaging detector 1 and the linear array imaging detector 3. Since the sizes of the objects to be measured are different, Figure 1 As shown, the mechanical arm 2 is composed of a plurality of mutually hinged sub-mechanical arms 2, so as to facilitate the adjustment of the distance between the backscatter imaging detector 1 and the linear array imaging detector 3 to adapt to objects of different sizes.

[0068] The backscatter imaging device based on dual detectors provided in this embodiment is used as follows:

[0069] First, the object is placed in the placement space formed between the backscatter imaging detector 1 and the linear array imaging detector 3, and then the ray source 4 inside the backscatter imaging detector 1 emits X-rays and passes through the collimator 5 to the object. Part of the X-rays are reflected by the object and absorbed by the first scintillator inside the backscatter imaging detector 1, and part of the X-rays pass through the object and are absorbed by the second scintillator inside the linear array imaging detector 3. Then, the data of the backscatter imaging detector 1 and the linear array imaging detector 3 are integrated. The backscatter imaging device based on dual detectors can simultaneously detect foreign matter and, combined with the image of the linear array imaging detector 3, can identify the fine microstructure of the object with higher definition. To solve the problem that the backscatter imaging detector 1 cannot distinguish between substances, combined with the linear array imaging detector 3, one scan can achieve imaging of different energy levels, and two objects with similar atomic numbers can be completely distinguished when placed together.

[0070] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention.

Claims

1. A backscatter imaging device based on dual detectors, characterized in that: include: A backscatter imaging detector (1) comprises a ray source (4), a collimator (5) arranged at the ray outlet of the ray source (4), and a first scintillator arranged at the ray outlet of the ray source (4); A mechanical arm (2), wherein a fixed end of the mechanical arm (2) is connected to the backscatter imaging detector (1); A linear array imaging detector (3) is connected to the driving end of the mechanical arm (2), the linear array imaging detector (3) is arranged on the wire outlet side of the backscatter imaging detector (1), and a placement space is formed between the backscatter imaging detector (1) and the linear array imaging detector (3); Wherein, the second scintillator inside the linear array imaging detector (3) is aligned with the line outlet of the backscatter imaging detector (1).

2. The dual-detector backscatter imaging device according to claim 1, characterized in that: The back side of the first scintillator inside the backscatter imaging detector (1) is protected from X-rays by a lead-based composite polymer shielding material.

3. The dual-detector backscatter imaging device according to claim 2, characterized in that: The front of the first scintillator inside the backscatter imaging detector (1) is subjected to light shielding and sealing treatment by means of carbon fiber.

4. The dual-detector backscatter imaging device according to claim 3, characterized in that: A carbon fiber panel is fixed on the wire outlet side of the backscatter imaging detector (1).

5. The dual-detector backscatter imaging device according to any one of claims 1 to 4, characterized in that: The collimator (5) is in the shape of a horn.

6. The dual-detector backscatter imaging device according to claim 5, characterized in that: The collimator (5) is fixed to the outer shell of the backscatter imaging detector (1), and the collimator (5) and the outer shell of the backscatter imaging detector (1) are staggeredly combined.

7. The dual-detector backscatter imaging device according to claim 6, characterized in that: A step surface is provided on the peripheral side of the wire outlet on the shell of the backscatter imaging detector (1), and the collimator (5) is configured such that after being inserted into the wire outlet, a boss provided on the peripheral side of the collimator (5) abuts against the step surface.

8. The dual-detector backscatter imaging device according to claim 1, characterized in that: The second scintillator inside the linear array imaging detector (3) is protected against radiation by a lead-based composite polymer shielding material on its periphery, and one side of the second scintillator detection area is exposed.

9. The dual-detector backscatter imaging device according to claim 1, characterized in that: The mechanical arm (2) comprises a plurality of sub-mechanical arms articulated with each other.

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