Optical module

Abstract

In the optical module provided by the invention, a light emitting component comprises a tube shell, a third electric connector, a flexible circuit board and a supporting structure. A bottom plate of the tube shell extends to form an extension surface; one end of the third electric connector extends into the tube shell, the other end of the third electric connector is located outside the tube shell and arranged on the surface of the extension surface, and a first bonding pad area is formed on the surface, outside the tube shell, of the third electric connector; a second bonding pad area is formed on the surface of the flexible circuit board, the second bonding pad area and the first bonding pad area are in routing connection, the flexible circuit board is used for transmitting low-frequency signals and high-frequency signals at the same time between the circuit board and the light emitting component, and the routing mode is more beneficial to improving the transmission quality of the high-frequency signals. A supporting structure is arranged between the flexible circuit board and the extension surface, the supporting structure is connected with the third electric connector, and the supporting structure is used for supporting the flexible circuit board, providing a flat surface and rigid supporting force for routing operation of the flexible circuit board and improving the routing stability, so that the transmission performance of high-frequency signals is ensured.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved.

[0003] During the conversion of photoelectric signals, the optical module transmits high-frequency signals by being electrically connected to the circuit connection board. The connection method between the optical module and the circuit connection board affects the transmission quality of the high-frequency signal, thereby affecting the high-frequency transmission performance of the optical module. Summary of the invention

[0004] The present application provides an optical module to improve the transmission quality of high-frequency signals and ensure the high-frequency transmission performance of the optical module.

[0005] The optical module provided in this application includes:

[0006] Circuit boards;

[0007] The light emitting component is electrically connected to the circuit board and includes:

[0008] The tube shell has a bottom plate extending relative to the top plate so that the bottom plate forms an extended surface;

[0009] A third electrical connector, one end of which extends into the tube shell, and one end of which is outside the tube shell and arranged on the surface of the extension surface, and a first pad area is formed on the surface of the third electrical connector outside the tube shell;

[0010] A flexible circuit board, a second pad area is formed on the surface, the second pad area is connected to the first pad area by wire bonding, and the flexible circuit board is used to simultaneously transmit low-frequency signals and high-frequency signals between the circuit board and the light emitting component;

[0011] The support structure is arranged between the flexible circuit board and the extension surface and is connected to the third electrical connector to support the flexible circuit board so that the first pad area and the second pad area are flush with each other, thereby connecting the third electrical connector and the flexible circuit board by wire bonding.

[0012] The optical module provided in the present application includes a circuit board and a light emitting component, and the light emitting component includes a tube shell, a third electrical connector, a flexible circuit board and a support structure. The bottom plate of the tube shell extends relative to the top plate to form an extension surface on the bottom plate surface; one end of the third electrical connector extends into the tube shell, and one end is outside the tube shell and arranged on the surface of the extension surface, and a first pad area is formed on the surface of the third electrical connector outside the tube shell; a second pad area is formed on the surface of the flexible circuit board, and the second pad area is connected to the first pad area by wire bonding. The flexible circuit board is used to simultaneously transmit low-frequency signals and high-frequency signals between the circuit board and the light emitting component. Since the flexible circuit board and the third electrical connector are connected by wire bonding, the wire bonding method is more conducive to improving the transmission quality of high-frequency signals and ensuring the transmission performance of high-frequency signals. A support structure is provided between the flexible circuit board and the extension surface, and the support structure is connected to the third electrical connector. The support structure is used to support the flexible circuit board so that the first pad area is flush with the second pad area surface, thereby realizing the wire bonding process between the third electrical connector and the flexible circuit board. The support structure provides a rigid support force and a flat surface for the bonding of the flexible circuit board, improves the stability of the bonding, and thus ensures the transmission performance of high-frequency signals. The present application improves the tube shell and sets a corresponding support structure on the surface of the tube shell, thereby providing a flat surface and a certain rigid support force for the bonding operation of the flexible circuit board, ensuring the stability of the bonding, which is beneficial to the transmission of high-frequency signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0014] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0015] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0016] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0017] Figure 4 is an exploded view of an optical module according to some embodiments;

[0018] Figure 5 is a structural diagram of a first light emitting component according to some embodiments;

[0019] Figure 6 A structure of a first electrical connector according to some embodiments Figure 1 ;

[0020] Figure 7 A structure of a first electrical connector according to some embodiments Figure 2 ;

[0021] Figure 8 is a side view of a first light emitting component according to some embodiments;

[0022] Fig. 9 Decomposition of a first light emitting component according to some embodiments Figure 1 ;

[0023] Fig.10 Decomposition of a first light emitting component according to some embodiments Figure 2 ;

[0024] Fig.11 is a side view of a first light emitting component according to some embodiments;

[0025] Fig.12 is a partial diagram of a first light emitting component according to some embodiments;

[0026] Fig.13 A schematic diagram of bonding between a second flexible circuit board surface and a second step surface according to some embodiments;

[0027] Fig.14 is a schematic diagram of connection between a first tube shell and a first electrical connector according to some embodiments;

[0028] Fig.15 is a schematic diagram of connection between a first tube shell, a first electrical connector and a flexible circuit board according to some embodiments;

[0029] Fig.16 is a schematic diagram of connection between a first tube shell and a second electrical connector according to some embodiments;

[0030] Fig.17 is a schematic diagram of connection between a first tube shell, a second electrical connector and a flexible circuit board according to some embodiments;

[0031] Fig.18 is a structural diagram of a second light emitting component according to some embodiments;

[0032] Fig.19 is a structural diagram of a third electrical connector according to some embodiments;

[0033] Fig. 20is an exploded view of a second light emitting component according to some embodiments;

[0034] Fig.21 is a schematic diagram of connection between a second tube shell and a third electrical connector according to some embodiments;

[0035] Fig. 22 is a side view of a second light emitting component according to some embodiments;

[0036] Fig.23 is a cross-sectional view of a second light emitting component according to some embodiments;

[0037] Fig.24 is a structural diagram of a third light emitting component according to some embodiments;

[0038] Fig.25 is an exploded view of a third light emitting component according to some embodiments;

[0039] Fig.26 is a partial exploded view of a third light emitting component according to some embodiments;

[0040] Fig. 27 is a side view of a third light emitting component according to some embodiments;

[0041] Fig.28 is a cross-sectional view of a third light emitting component according to some embodiments;

[0042] Fig.29 is a cross-sectional view of a fourth light emitting component according to some embodiments;

[0043] Fig.30 is an exploded view of a fourth light emitting component according to some embodiments;

[0044] Fig.31 is a structural diagram of a fourth tube shell according to some embodiments. DETAILED DESCRIPTION

[0045] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0046] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0047] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0048] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end of the optical fiber 101 is connected to the optical module 200 through the optical port of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the total reflection direction can almost maintain the original optical power. The optical signal undergoes multiple total reflections in the optical fiber 101 to transmit the optical signal from the remote information processing device 1000 to the optical module 200, or to transmit the optical signal from the optical module 200 to the remote information processing device 1000, thereby realizing long-distance, low-power loss information transmission.

[0049] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 are detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the working state of the optical module 200.

[0050] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 so that the host computer 100 and the optical module 200 establish a unidirectional or bidirectional electrical signal connection.

[0051] The host computer 100 also includes an external electrical interface, which can be connected to an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104, and the network cable interface 104 is configured to access the network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so as to establish an electrical signal connection between the local information processing device 2000 and the host computer 100 through the network cable 103. For example, the third electrical signal sent by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103, and the host computer 100 generates a second electrical signal according to the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200, and the optical module 200 converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber 101, and the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101. For example, the first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101, and the first optical signal from the optical fiber 101 is transmitted to the optical module 200, and the optical module 200 converts the first optical signal into a first electrical signal, and the optical module 200 transmits the first electrical signal to the host computer 100, and the host computer 100 generates a fourth electrical signal according to the first electrical signal, and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that the optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between the optical signals and electrical signals, the information does not change, but the encoding and decoding methods of the information can change.

[0052] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0053] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins to increase the heat dissipation area.

[0054] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 is connected to the electrical connector inside the cage 106, so that the optical module 200 establishes a bidirectional electrical signal connection with the host computer 100. In addition, the optical port of the optical module 200 is connected to the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101.

[0055] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0056] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0057] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0058] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0059] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical port, and the gold finger 301 of the circuit board 300 extends from the opening 204 and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0060] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, etc. into the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the above components. In addition, when assembling the circuit board 300, the light emitting component 400 and the light receiving component 500, etc., it is convenient to deploy the positioning components, heat dissipation components and electromagnetic shielding components of these components, which is conducive to the automated production.

[0061] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0062] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0063] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the fixation of the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0064] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting amplifiers (Limiting amplifier), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0065] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0066] The circuit board 300 also includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide more pins, so as to adapt to occasions where the number of pins is large. The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0067] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0068] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0069] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0070] In some embodiments, the light emitting component 400 includes a tube shell, and the electrical connection between the tube shell and the circuit board 300 is achieved through an electrical connector and a flexible circuit board. For example, one end of the electrical connector is electrically connected to the tube shell, and the other end is electrically connected to one end of the flexible circuit board, and the other end of the flexible circuit board is point-connected to the circuit board 300, thereby achieving electrical connection between the tube shell and the circuit board 300.

[0071] In the electrical connection method between the electrical connector and the flexible circuit board, exemplarily, the flexible circuit board and the electrical connector are connected by soldering. In this method, it is difficult to control the uniformity of the solder thickness between the connecting surface of the flexible circuit board and the electrical connector, resulting in uneven solder coating. When the solder thickness is uneven, the quality of high-frequency signal transmission is easily reduced. For example, the quality of high-frequency signal transmission is poor at the location where the solder thickness is large. The uneven solder thickness affects the stability of the high-frequency signal transmission quality, thereby affecting the transmission performance of the high-frequency signal.

[0072] In order to improve the transmission quality of high-frequency signals and ensure the transmission performance of high-frequency signals, in some embodiments, it can be achieved by improving the electrical connector. In some embodiments, it can also be achieved by improving the tube shell.

[0073] Figure 5 FIG. 1 is a structural diagram of a first light emitting component according to some embodiments. Figure 5 As shown, in some embodiments, the optical emitting component 400 includes a first tube shell 410a, an electrical connector and a flexible circuit board, and the electrical connection between the first tube shell 410a and the circuit board 300 is realized through the electrical connector and the flexible circuit board. Exemplarily, the first tube shell 410a is a transmitting tube shell, and a laser array 411a, a lens array 412a, an optical multiplexing component 413a and a collimating lens 414a are respectively arranged inside. The laser array 411a emits light of different wavelengths, and each light beam is sequentially processed by the converging lens in the lens array 412a, and is converted from a divergent state to a convergent state, and then is combined by the optical multiplexing component 413a to combine the light of different wavelengths into a beam of light, which is converted into parallel light after being collimated by the collimating lens 414a, and is emitted from the first tube shell 410a in the form of parallel light.

[0074] In some embodiments, the number of the flexible circuit boards is not limited. When the number of the flexible circuit boards is one, the flexible circuit board is described as a first flexible circuit board, and the first flexible circuit board can transmit low-frequency signals and high-frequency signals at the same time. A first wiring area is formed on the surface of the first flexible circuit board.

[0075] One end of the electrical connector extends into the first tube shell 410a, and the other end is outside the first tube shell 410a, wherein the end outside the first tube shell 410a is respectively formed with a first step surface and a second step surface, wherein the surface of the first step surface has a second wiring area.

[0076] In some embodiments, a wire bonding connection is made between the first flexible circuit board and the first step surface. In order to make the surfaces of the first wiring area and the second wiring area flush and provide a flat surface and support force for the wiring, a support member is fixedly provided on the surface of the second step surface. The support frame is used to support the first flexible circuit board so that the surfaces of the first wiring area and the second wiring area are flush, thereby making a wire bonding connection between the first flexible circuit board and the first step surface.

[0077] In some embodiments, the number of the above-mentioned flexible circuit boards can be two, which are described as a first flexible circuit board 440 and a second flexible circuit board 430. In this case, one of the flexible circuit boards can transmit low-frequency signals, and the other flexible circuit board can transmit high-frequency signals, thereby reducing the area of ​​the width of the flexible circuit board used. At the same time, the second flexible circuit board 430 and the first flexible circuit board 440 are stacked up and down, thereby making full use of the longitudinal space. Exemplarily, the second flexible circuit board 430 is used to transmit low-frequency signals, and the first flexible circuit board 440 is used to transmit high-frequency signals.

[0078] Similarly, one end of the electrical connector extends into the first tube shell 410a, and the other end is outside the first tube shell 410a, wherein the end outside the first tube shell 410a is respectively formed with a first step surface and a second step surface, wherein the surface of the first step surface has a second wiring area.

[0079] In some embodiments, the first flexible circuit board 440 is connected to the first step surface by wire bonding. In order to make the surfaces of the first wiring area and the second wiring area flush and provide a flat surface and support force for wiring, a support member is fixed on the surface of the second step surface. The support frame is used to support the first flexible circuit board 440 so that the surfaces of the first wiring area and the second wiring area are flush, thereby making the first flexible circuit board 440 connected to the first step surface by wire bonding.

[0080] When the flexible circuit board includes a first flexible circuit board 440 and a second flexible circuit board 430 , the electrical connector correspondingly further includes a third step surface, and the third step surface is used for electrically connecting with the second flexible circuit board 430 .

[0081] The following is an exemplary description using an example in which the flexible circuit board may include a second flexible circuit board 430 and a first flexible circuit board 440 .

[0082] In some embodiments, an end of the first tube shell 410 a is connected to an electrical connector, and the second flexible circuit board 430 and the first flexible circuit board 440 are respectively connected to the upper and lower surfaces of the electrical connector.

[0083] One end of the electrical connector extends into the first tube shell 410a, and the other end is outside the first tube shell 410a. In order to improve the transmission performance of high-frequency signals by improving the electrical connector, a plurality of step surfaces are formed at the end of the electrical connector outside the first tube shell 410a to respectively connect the second flexible circuit board 430 and the first flexible circuit board 440, so that the electrical connector is compatible with two flexible circuit boards.

[0084] The end of the electrical connector outside the first tube shell 410a is formed with multiple step surfaces, and the second flexible circuit board 430 can be electrically connected to one of the step surfaces of the electrical connector; the first flexible circuit board 440 can be electrically connected to the other step surface of the electrical connector.

[0085] In order to balance the complexity of the process and the quality of high-frequency signal transmission, in some embodiments, the second flexible circuit board 430 is used to transmit low-frequency signals, and the second flexible circuit board 430 and one of the step surfaces of the electrical connector can be connected by soldering; the first flexible circuit board 440 is used to transmit high-frequency signals, and the first flexible circuit board 440 and the other step surface of the electrical connector are connected by wire bonding. The wire bonding method can avoid the problem of uneven solder coating in the soldering process. Compared with solder connection, the wire bonding method is more conducive to the transmission of high-frequency signals. It can be understood that the second flexible circuit board 430 and one of the step surfaces of the electrical connector can also be electrically connected by wire bonding. At this time, the method of implementing the wire bonding of the second flexible circuit board 430 can refer to the wire bonding method of the first flexible circuit board 440.

[0086] The ends of the electrical connector can be provided in different forms to respectively connect the second flexible circuit board 430 and the first flexible circuit board 440. In some embodiments, the electrical connector includes a first electrical connector 420a1, and the second flexible circuit board 430 and the first flexible circuit board 440 are respectively provided on the upper and lower surfaces of the first electrical connector 420a1. Of course, in some embodiments, the electrical connector can also be in the form of a second electrical connector, a third electrical connector, etc.

[0087] When the end of the electrical connector presents different shapes, the directions of providing a flat surface and supporting force for the wiring operation between the first flexible circuit board 440 and the electrical connector are correspondingly different. In some embodiments, a flat surface and supporting force can be provided for the wiring operation of the first flexible circuit board 440 from above the first flexible circuit board 440. In some embodiments, a flat surface and supporting force can also be provided for the wiring operation of the first flexible circuit board 440 from below the first flexible circuit board 440.

[0088] Figure 6 A structure of a first electrical connector according to some embodiments Figure 1 ; Figure 7 A structure of a first electrical connector according to some embodiments Figure 2 .like Figure 6 and Figure 7 As shown, the first electrical connector 420a1 is located at one end outside the first tube shell 410a and is respectively formed with a third step surface 421a1 and a first step surface 422a1, and the third step surface 421a1 and the first step surface 422a1 are both provided with solder pads. By way of example, the second flexible circuit board 430 is connected to the third step surface 421a1, and the first flexible circuit board 440 is connected to the first step surface 422a1. The third step surface 421a1 is used for soldering connection with the second flexible circuit board 430, and the first step surface 422a1 is used for wire bonding connection with the first flexible circuit board 440.

[0089] A first pad area 424a1 and a second pad area 425a1 are formed at one end of the first electrical connector 420a1 located on the inner side of the first tube shell 410a. Pads are arranged on the surfaces of the first pad area 424a1 and the second pad area 425a1. The first pad area 424a1 is used to transmit low-frequency signals, and the second pad area 425a1 is used to transmit high-frequency signals. The pads on the surface of the first pad area 424a1 are electrically connected to the pads on the surface of the third step surface 421a1, thereby realizing the transmission of low-frequency signals; the pads on the surface of the second pad area 425a1 are electrically connected to the pads on the surface of the first step surface 422a1, thereby realizing the transmission of high-frequency signals.

[0090] In some embodiments, the surface length of the third step surface 421a1 is greater than the surface length of the first step surface 422a1, so that a second step surface 423a1 can be formed between the third step surface 421a1 and the first step surface 422a1, and the second step surface 423a1 is used to carry the support member. In some embodiments, the second step surface may not be formed between the third step surface 421a1 and the first step surface 422a1.

[0091] The heights of the third step surface 421a1, the second step surface 423a1 and the first step surface 422a1 are successively reduced to form a stepped structure.

[0092] The third step surface 421a1 is provided with a solder pad to achieve a solder connection between the second flexible circuit board 430 and the third step surface 421a1. The first step surface 422a1 is also provided with a solder pad, and a bonding wire extends from the first step surface 422a1 to achieve a bonding connection between the first flexible circuit board 440 and the first step surface 422a1.

[0093] Figure 8 FIG. 4 is a side view of a first light emitting component according to some embodiments. Figure 8 As shown, one end of the first electrical connector 420a1 is inserted into the first tube shell 410a, and the other end is located outside the first tube shell 410a.

[0094] The second flexible circuit board 430 is connected to the third step surface 421 a 1 by soldering, and the first flexible circuit board 440 is connected to the first step surface 422 a 1 by wire bonding.

[0095] Since the flexible circuit board is relatively soft, the supporting force for the gold wire during wire bonding is insufficient, resulting in a certain degree of bending of the gold wire, which is not conducive to the transmission of high-frequency signals. In addition, the wire bonding operation requires a certain flat surface. Therefore, a certain supporting force needs to be provided to the first flexible circuit board 440 to support the wire bonding. At the same time, a flat surface needs to be provided for the wire bonding operation to realize the wire bonding process.

[0096] When the second step surface 423a1 is not formed between the third step surface 421a1 and the first step surface 422a1, that is, the position of the second step surface 423a1 is a solid step surface, the solid structure can provide a certain support force for the first flexible circuit board 440. In this case, a groove needs to be dug out on the surface of the solid step surface to set the first flexible circuit board 440, and the first flexible circuit board 440 is sunk toward the third step surface 421a1 so that the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1. Usually, the thickness of the flexible circuit board is small, about 0.2mm. In order to ensure that the flexible circuit board is flush with the surface of the step surface and shorten the wire bonding length, the correspondingly dug groove is shallow. When the first flexible circuit board 440 is bonded to the surface of the groove by glue, since the glue bonding surface is close to the wire bonding area, the glue is easy to overflow to the wire bonding area between the surface of the first flexible circuit board 440 and the first step surface 422a1, which has a certain impact on the transmission quality of the high-frequency signal.

[0097] When the second step surface 423a1 is formed between the third step surface 421a1 and the first step surface 422a1, a support member 450 may be provided in the second step surface 423a1, and the support member 450 is respectively connected to the first electrical connector 420a1 and the first flexible circuit board 440. At this time, the support member 450 serves as a carrier of the first flexible circuit board 440, and the support member 450 is connected to the first flexible circuit board 440 to support the first flexible circuit board 440. Exemplarily, the support member 450 is a metal structural member, and the first electrical connector 420a1 is a ceramic structural member. The hardness of the support member 450 is greater than that of the ceramic structural member, and a larger rigid support force can be provided for the first flexible circuit board 440, thereby supporting the wire bonding and ensuring the stability of the wire bonding; at the same time, a flat surface is provided for the wire bonding operation to realize the wire bonding process.

[0098] Exemplarily, the support member 450 and the second step surface 423a1 are connected by glue, for example, the contact surface between the support member 450 and the second step surface 423a1 is coated with glue for bonding.

[0099] In some embodiments, the support member 450 serves as a carrier of the first flexible circuit board 440. The first flexible circuit board 440 can be first connected to the support member 450 by glue to form a flexible board fixing assembly. After the glue is cured, the flexible board fixing assembly is bonded to the surface of the second step surface 423a1 by glue. Since the support member 450 has a certain thickness, the height of the second step surface 423a1 is relatively large at this time, and the glue bonding surface between the support member 450 and the second step surface 423a1 is far from the wiring area. When the flexible board fixing assembly is bonded to the surface of the second step surface 423a1 by glue, the glue is not easy to overflow to the wiring area, thereby ensuring the quality of the wiring signal. For example, the surface of the support member 450 can also be formed with a notch or groove to collect the overflowed glue and prevent the glue from overflowing to the wiring area. Therefore, on the one hand, the support member 450 can provide the first flexible circuit board 440 with a relatively large rigid support and a flat surface that is convenient for wiring operations. On the other hand, the support member 450 can pre-load the first flexible circuit board 440, thereby preventing glue from overflowing onto the wiring area when pasting the first flexible circuit board 440. At the same time, through the provision of the second step surface 423a1 and the support member 450, the glue bonding surface is transferred to the surface of the second step surface 423a1, so that the glue bonding surface is away from the wiring area, thereby preventing glue from overflowing into the wiring area, thereby ensuring the transmission quality of high-frequency signals.

[0100] The surface length of the third step surface 421a1 is relatively greater than the length of the first step surface 422a1, so that a second step surface 423a1 can be formed between the third step surface 421a1 and the first step surface 422a1, and a support member 450 is arranged in the second step surface 423a1. At this time, the support member 450 is located above the first flexible circuit board 440. At this time, the support member 450 provides a flat surface and supporting force for the wire bonding operation of the first flexible circuit board 440 from above the first flexible circuit board 440, thereby realizing the wire bonding process.

[0101] Fig. 9 Decomposition of a first light emitting component according to some embodiments Figure 1 .like Fig. 9 As shown, a evacuation hole 415a is formed at the end of the first tube shell 410a, so that the first electrical connector 420a1 can extend into the interior of the first tube shell 410a.

[0102] Fig.10 Decomposition of a first light emitting component according to some embodiments Figure 2 .like Fig.10 As shown, the upper and lower surfaces of the end of the second flexible circuit board 430 are provided with solder pads, the solder pads on the lower surface are used to solder and connect with the solder pads on the surface of the third step surface 421a1, and the solder pads on the upper surface are used to achieve alignment with the solder pads on the surface of the third step surface 421a1. For example, the alignment of the solder pads can be performed from the side of the first electrical connector 420a1. Correspondingly, the solder pads on the surface of the third step surface 421a1 face the top of the first tube shell 410a to be soldered and connected with the solder pads on the lower surface of the second flexible circuit board 430.

[0103] In some embodiments, a via hole is provided between the upper and lower pads, and the upper and lower pads are electrically connected through the via hole. Solder is applied to the bonding surface of the third step surface 421a1 and the second flexible circuit board 430. After the pad positions of the third step surface 421a1 and the second flexible circuit board 430 are aligned, the solder is heated to solidify the solder, thereby achieving a solder connection between the two. During soldering, the solder is easy to overflow. Since the via hole is provided, the solder can penetrate into the via hole between the upper and lower pads.

[0104] Fig.11 is a side view of a first light emitting component according to some embodiments; Fig.12 FIG. 1 is a partial diagram of a first light emitting component according to some embodiments. Fig.11 and Fig.12As shown, the second flexible circuit board 430 is buckled on the surface of the third step surface 421a1, so as to realize the solder connection between the second flexible circuit board 430 and the first electrical connector 420a1; the surface of the first flexible circuit board 440 is connected with the surface of the first step surface 422a1 by bonding, and at the same time, the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1 to shorten the bonding length between the two and improve the high-frequency signal transmission performance.

[0105] The support member 450 is arranged in the second step surface 423a1, and the thickness of the support member 450 is less than the height of the second step surface 423a1, so that the first flexible circuit board 440 is arranged within this height difference, and the first flexible circuit board 440 is bonded to the bottom surface of the support member 450, and the top surface of the support member 450 is bonded to the surface of the second step surface 423a1, thereby realizing the fixed connection between the first flexible circuit board 440 and the support member 450, and the fixed connection between the support member 450 and the second step surface 423a1.

[0106] The height of the second step surface 423a1 and the height of the support member 450 have preset heights respectively. Exemplarily, the height of the second step surface 423a1 is such that after the support member 450 and the first flexible circuit board 440 are superimposed together, the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1, so as to shorten the wiring length between the surface of the first flexible circuit board 440 and the first step surface 422a1, thereby improving the high-frequency signal transmission performance.

[0107] Since the second flexible circuit board 430 is buckled on the surface of the third step surface 421a1, the surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1 to achieve wire bonding connection, so the second flexible circuit board 430 is closer to the first electrical connector 420a1 than the first flexible circuit board 440. Exemplarily, there is a certain gap between the second flexible circuit board 430 and the side of the first electrical connector 420a1 to collect the solder overflowing between the second flexible circuit board 430 and the third step surface 421a1.

[0108] Since the flexible circuit board has a certain length and a certain flexibility, when the flexible circuit board is bent, the wire bonding may be bent accordingly. Under the support of the support member 450, the stability of the wire bonding can be increased. In order to further increase the stability of the wire bonding, a reinforcing member 460 is provided between the second flexible circuit board 430 and the first flexible circuit board 440. The second flexible circuit board 430 and the first flexible circuit board 440 are bound by the reinforcing member 460, so as to increase the connection force between the second flexible circuit board 430 and the first flexible circuit board 440, thereby increasing the stability of the first flexible circuit board 440. The reinforcing member 460 is relatively close to the wire bonding area between the first flexible circuit board 440 and the first step surface 422a1.

[0109] In some embodiments, in order to facilitate the arrangement of the reinforcing member 460, the width of the supporting member 450 is flush with the width of the second step surface 423a1, so that the supporting member 450 is flush with the end surface of the second step surface 423a1, and the side of the reinforcing member 460 can be connected to the surface between the supporting member 450 and the second step surface 423a1, so that the reinforcing member 460 is closer to the wire bonding area, and the wire bonding is fixed and supported from the root of the wire bonding area, thereby increasing the supporting force and stability of the wire bonding. Exemplarily, the reinforcing member 460 can be formed by curing the glue between the second flexible circuit board 430 and the first flexible circuit board 440, and the supporting and stability of the first flexible circuit board 440 are further increased by relying on the connecting force between the second flexible circuit board 430 and the first flexible circuit board 440.

[0110] Fig.13 FIG. 1 is a schematic diagram of wiring between a second flexible circuit board surface and a second step surface according to some embodiments. Fig.13 As shown, the pads on the surface of the first flexible circuit board 440 are connected to the pads on the first step surface 422a1 by wire bonding, thereby achieving electrical connection between the first flexible circuit board 440 and the first electrical connector 420a1.

[0111] The surface of the first flexible circuit board 440 is flush with the surface of the first step surface 422a1, and the pads on the surface of the first flexible circuit board 440 are connected to the pads on the first step surface 422a1 to shorten the wiring length between the surface of the first flexible circuit board 440 and the first step surface 422a1 and improve the high-frequency signal transmission performance.

[0112] The soldering pads on the surface of the first flexible circuit board 440 and the soldering pads on the first step surface 422a1 are oriented in the same direction, both toward the bottom end of the first tube shell 410a, which can provide a relatively large bonding area for bonding. The bonding area is not interfered by other structures, which facilitates the bonding operation and protects the bonding wires from being entangled by other structures.

[0113] Fig.14 is a schematic diagram of connection between a first tube shell and a first electrical connector according to some embodiments; Fig.15 FIG. 1 is a schematic diagram of a connection between a first tube shell, a first electrical connector, and a flexible circuit board according to some embodiments. Fig.14 and Fig.15 As shown, as described above, the end of the electrical connector can be configured in different shapes to respectively connect the second flexible circuit board 430 and the first flexible circuit board 440. In some embodiments, the electrical connector includes a first electrical connector 420a1.

[0114] The first electrical connector 420a1 is located on the end surface of the first tube shell 410a, and a third step surface 421a1, a second step surface 423a1 and a first step surface 422a1 are respectively formed. As mentioned above, the surface length of the third step surface 421a1 is relatively greater than the length of the first step surface 422a1, so that a second step surface 423a1 can be formed between the third step surface 421a1 and the first step surface 422a1. A support member 450 is provided in the second step surface 423a1. At this time, the support member 450 provides a rigid support for the first flexible circuit board 440 from above the first flexible circuit board 440.

[0115] The width of the second step surface 423a1 can be the same as the width of the support member 450, so that the end surface of the second step surface 423a1 is flush with the end surface of the support member 450, which is convenient for setting the reinforcing member 460. It is understandable that the width of the second step surface 423a1 can also be different from the width of the support member 450.

[0116] When the electrical connector is in the form of a first electrical connector 420a1, the solder pads on the surface of the first flexible circuit board 440 and the solder pads on the first step surface 422a1 are both facing the bottom end of the first tube shell 410a, which can provide a relatively large bonding area for wiring, facilitate the bonding operation, and protect the bonding wire from being entangled by other structures.

[0117] Fig.16 is a schematic diagram of connection between a first tube shell and a second electrical connector according to some embodiments; Fig.17 FIG. 1 is a schematic diagram of a connection between a first tube shell, a second electrical connector, and a flexible circuit board according to some embodiments. Fig.16 and Fig.17 As shown, as described above, the end of the electrical connector can be configured in different shapes to respectively connect the second flexible circuit board 430 and the first flexible circuit board 440. In some embodiments, the electrical connector includes a second electrical connector 420a2.

[0118] In some embodiments, the second electrical connector 420a2 is located on the end surface of the first tube shell 410a, and a third step surface 421a2 and a first step surface 422a2 are formed respectively. The heights of the third step surface 421a2 and the first step surface 422a2 are successively reduced to form a stepped structure. The third step surface 421a2 is used for soldering connection with the second flexible circuit board 430, and the first step surface 422a2 is used for wire bonding connection with the first flexible circuit board 440.

[0119] The second flexible circuit board 430 is electrically connected to the third step surface 421 a 2 . Exemplarily, the pads on the surface of the second flexible circuit board 430 are connected to the pads on the surface of the third step surface 421 a 2 by soldering.

[0120] The first flexible circuit board 440 is electrically connected to the first step surface 422a2. For example, the pads on the surface of the first flexible circuit board 440 are connected to the pads on the surface of the first step surface 422a2 by wire bonding, thereby increasing the quality of high-frequency signal transmission and ensuring high-frequency signal transmission performance.

[0121] The height difference between the third step surface 421a2 and the first step surface 422a2 provides a larger space for the wire bonding operation. Therefore, the pads on the surface of the first flexible circuit board 440 and the pads on the surface of the first step surface 422a2 are both facing the top of the first tube shell 410a, so that the wire bonding is performed in the space formed by the height difference between the third step surface 421a2 and the first step surface 422a2. The space formed by the height difference is relatively large, thereby preventing the wire bonding from being affected by other structures and ensuring the stability of the wire bonding distribution.

[0122] In order to provide rigid support for the first flexible circuit board 440, a second step surface 423a2 is hollowed out below the first step surface 422a2 to form a second step surface 423a2, and the second step surface 423a2 is used to set the support member 450. Correspondingly, the support member 450 is also set in the second step surface 423a2. At this time, the support member 450 provides a flat surface and rigid support force for the first flexible circuit board 440 from below the first flexible circuit board 440 to ensure the stability of the wire bonding and realize the wire bonding process.

[0123] Exemplarily, the support member 450 and the second step surface 423a2 are connected by glue, for example, the contact surface between the support member 450 and the second step surface 423a2 is coated with glue for bonding.

[0124] The heights of the third step surface 421a2, the first step surface 422a2, and the second step surface 423a2 decrease successively. The second step surface 423a2 is located under the projection area of ​​the root of the first flexible circuit board 440 to provide a rigid support force from the root of the first flexible circuit board 440 to ensure the stability of the first flexible circuit board 440.

[0125] In some embodiments, in order to further increase the stability of the wire bonding, a reinforcing member 460 is provided on the side of the connection surface between the first flexible circuit board 440 and the rigid connector 450, and the reinforcing member 460 is relatively close to the wire bonding area between the first flexible circuit board 440 and the first step surface 422a2. Exemplarily, the reinforcing member 460 is provided between the bottom of the first flexible circuit board 440 and the end surface of the rigid connector 450, and the rigid connector 450 and the first flexible circuit board 440 are bound by the reinforcing member 460, so as to increase the connection force between the rigid connector 450 and the first flexible circuit board 440, thereby increasing the support force and stability of the first flexible circuit board 440.

[0126] Similarly, in order to facilitate the installation of the reinforcing member 460, the width of the supporting member 450 is the same as the width of the second step surface 423a2, so that the end surface of the supporting member 450 is flush with the end surface of the second step surface 423a2, so that the reinforcing member 460 is installed between the bottom of the first flexible circuit board 440 and the end surface of the rigid connector 450, so that the reinforcing member 460 is closer to the wire bonding area, and the wire bonding is fixed and supported from the root of the wire bonding area, thereby increasing the supporting force and stability of the wire bonding. Exemplarily, the reinforcing member 460 can be formed by curing the glue between the bottom of the first flexible circuit board 440 and the end surface of the rigid connector 450, and the supporting and stability of the first flexible circuit board 440 can be further increased by relying on the connection force between the first flexible circuit board 440 and the rigid connector 450.

[0127] The above-mentioned embodiments can be compatible with two flexible circuit boards by improving the structure of the electrical connector, and realize the soldering connection between the second flexible circuit board 430 and the electrical connector, and the wiring connection between the first flexible circuit board 440 and the electrical connector, so as to improve the quality of high-frequency signal transmission and ensure the high-frequency signal transmission performance. At the same time, a flat surface and a hard supporting force are provided to the first flexible circuit board 440 from different directions of the first flexible circuit board 440 to ensure the stability of the wiring. Among them, the support member 450 serves as a carrier of the first flexible circuit board 440. On the one hand, it can provide a flat surface and a hard supporting force for its wiring operation. On the other hand, the first flexible circuit board 440 can be pre-supported by the support member 450, thereby avoiding the glue from overflowing to the wiring area when the first flexible circuit board 440 is pasted, thereby ensuring the high-frequency signal transmission performance.

[0128] The following embodiments achieve wire bonding connection between the flexible circuit board and the electrical connector by improving the structure of the tube shell, and provide a flat surface and rigid support force for the wire bonding operation of the flexible circuit board.

[0129] Fig.18 FIG. 4 is a structural diagram of a second light emitting component according to some embodiments. Fig.18 As shown, in some embodiments, the light emitting component includes a second tube shell 410b, and the second tube shell 410b is electrically connected to the circuit board 300 through an electrical connector and a flexible circuit board. In order to distinguish the first electrical connector 420a1 and the second electrical connector 420a2, the electrical connector electrically connected to the second tube shell 410b is referred to as a third electrical connector 420b. In order to distinguish the second flexible circuit board 430 and the first flexible circuit board 440, the flexible circuit board electrically connected to the second tube shell 410b is referred to as a flexible circuit board 430b.

[0130] In some embodiments, low-frequency signals and high-frequency signals are transmitted simultaneously through the flexible circuit board 430b, and low-frequency signal pads and high-frequency signal pads are disposed on the surface of the flexible circuit board 430b, which can reduce the number of flexible circuit boards used.

[0131] In order to improve the transmission quality of high-frequency signals, the flexible circuit board 430b is connected to the third electrical connector 420b by wire bonding. For example, the pads on the surface of the flexible circuit board 430b and the pads on the surface of the third electrical connector 420b are connected by wire bonding, thereby ensuring the high-frequency signal transmission performance. In order to shorten the wire bonding length between the flexible circuit board 430b and the third electrical connector 420b, the surface of the flexible circuit board 430b should be flush with the surface of the third electrical connector 420b, thereby shortening the wire bonding length.

[0132] Fig.19 FIG. 4 is a structural diagram of a third electrical connector according to some embodiments. Fig.19 As shown, since the low-frequency signal and the high-frequency signal are transmitted simultaneously through the flexible circuit board 430b, the surface of the third electrical connector 420b located inside the second tube shell 410b only needs to be formed with a third pad area 422b, and the surface of the third electrical connector 420b located outside the second tube shell 410b only needs to be formed with a first pad area 421b. The first pad area 421b is electrically connected to the third pad area 422b, thereby realizing the signal transmission inside and outside the second tube shell 410b, including the transmission of the low-frequency signal and the high-frequency signal.

[0133] A second pad area 431b is formed on the surface of the flexible circuit board 430b. The second pad area 431b includes pads for transmitting low-frequency signals and high-frequency signals. The second pad area 431b is connected to the first pad area 421b by wire bonding, thereby realizing the transmission of low-frequency signals and high-frequency signals between the flexible circuit board 430b and the third electrical connector 420b. When the second pad area 431b is flush with the first pad area 421b, the wire bonding time between the two is short, and the transmission quality of the high-frequency signal is better.

[0134] In order to provide a flat surface and a certain support force for the wiring between the flexible circuit board 430b and the third electrical connector 420b, the bottom plate of the second tube shell 410b extends relatively to form an extension surface, and a support structure is provided on the extension surface to support the wiring between the flexible circuit board 430b and the third electrical connector 420b. At this time, the support structure is provided on the surface of the extension surface, and the support structure provides a certain support force and a flat surface for the wiring operation from the bottom of the flexible circuit board 430b. Exemplarily, the support structure is used to support the flexible circuit board so that the second pad area 431b is flush with the surface of the first pad area 421b, thereby realizing the wiring process between the flexible circuit board 430b and the third electrical connector 420b. The support structure provides a rigid support force and a flat surface for the wiring of the flexible circuit board, improves the stability of the wiring, and thus ensures the transmission performance of high-frequency signals.

[0135] The support structure of the extension surface can be in different forms to provide a flat surface and support force for the wire bonding operation between the flexible circuit board 430b and the third electrical connector 420b. In some embodiments, the support structure can be a support block 440b. In some embodiments, the support structure can also be other forms of structures.

[0136] Fig. 20 FIG. 4 is an exploded view of a second light emitting component according to some embodiments. Fig. 20 As shown, the bottom plate of the second tube shell 410b extends relatively to form an extension surface 411b. Part of the third electrical connector 420b is located inside the second tube shell 410b, and part of the third electrical connector 420b is located on the extension surface 411b, so the extension surface 411b plays a role in supporting the third electrical connector 420b.

[0137] The length of the extension surface 411b is relatively longer than the width of the third electrical connector 420b. When the third electrical connector 420b is arranged on the extension surface 411b, there is still a certain distance between the end of the extension surface 411b and the end of the third electrical connector 420b, and the end of the extension surface 411b is further away from the second tube shell 410b, so that there is still residual space on the extension surface 411b. The support block 440b is arranged on the surface of the residual space, and the flexible circuit board 430b is arranged on the surface of the support block 440b, so that the bottom of the flexible circuit board 430b provides a certain flat surface and support force for the wiring operation of the flexible circuit board 430b.

[0138] In some embodiments, the width of the support block 440b is the same as the width of the third electrical connector 420b, so that the support block 440b is flush with the third electrical connector 420b in width; the support block 440b has a preset height, and the preset height makes the surface of the flexible circuit board 430b flush with the surface of the third electrical connector 420b, that is, the surface of the second pad area 431b is flush with the surface of the first pad area 421b, thereby shortening the wiring length.

[0139] Fig.21 FIG. 1 is a schematic diagram of a connection between a second tube shell and a third electrical connector according to some embodiments. Fig.21 As shown, in some embodiments, the second tube shell 410b includes an extension surface 411b and a avoidance hole 412b. The bottom plate of the second tube shell 410b extends relatively to form the extension surface 411b, and the avoidance hole 412b is used to allow the third electrical connector 420b to extend into the second tube shell 410b.

[0140] The length of the extension surface 411b is sufficient to set the third electrical connector 420b and the support block 440b. The flexible circuit board 430b is set on the surface of the support block 440b, so that the bottom of the flexible circuit board 430b provides a certain flat surface and support force for the wiring operation of the flexible circuit board 430b.

[0141] A row of pads is provided on one end surface of the third electrical connector 420b located outside the second tube shell 410b, and bonding wires are extended therefrom, thereby realizing bonding connection between the third electrical connector 420b and the flexible circuit board 430b. At the same time, the support block 440b provides a certain flat surface and support force for the bonding operation of the flexible circuit board 430b.

[0142] Fig. 22 FIG. 4 is a side view of a second light emitting component according to some embodiments. Fig. 22 As shown, one end of the third electrical connector 420b extends into the second tube shell 410b, and the other end is placed on the surface of the extension surface 411b. At the same time, a support block 440b is set on the surface of the extension surface 411b. The flexible circuit board 430b is supported by the support block 440b, and the flexible circuit board 430b is connected with the first pad area 421b by wire bonding.

[0143] When the third electrical connector 420b is fixed to the second tube shell 410b, the third electrical connector 420b is welded to the surface of the extension surface 411b using metal solder. During the welding process, the metal solder is easy to overflow and overflow to the vicinity of the support block 440b, affecting the flatness of the support block 440b, thereby affecting the wire bonding. In some embodiments, to ensure the integrity of the third electrical connector 420b, a small corner is cut off from the bottom of the support block 440b on the side adjacent to the third electrical connector 420b to form a corner 441b to collect the overflowed metal solder, so that the overflowed metal solder is concentrated at the position of the corner 441b, so that the bottom surface of the support block 440b is not affected by the metal solder, ensuring the flatness of the support block 440b, thereby ensuring the stability of the wire bonding. In some embodiments, the integrity of the support block 440b can also be ensured by cutting off a small corner from the bottom of the third electrical connector 420b on the side adjacent to the support block 440b to form a notch. The notch has the same function as the notch 441b and can also collect the overflowed metal solder.

[0144] Fig.23 FIG. 4 is a cross-sectional view of a second light emitting component according to some embodiments. Fig.23 As shown, the surface of the flexible circuit board 430b should be flush with the surface of the third electrical connector 420b. At this time, the surface of the second pad area 431b is flush with the surface of the first pad area 421b, and the two are electrically connected by wiring to ensure the quality of high-frequency signal transmission.

[0145] The bottom plate of the second tube shell 410b extends relatively to form an extension surface 411b. The third electrical connector 420b and the support block 440b are respectively arranged on the surface of the extension surface 411b. The support block 440b and the flexible circuit board 430b are stacked. The support block 440b provides a flat surface and hard support force for the wiring operation of the flexible circuit board 430b, thereby ensuring the stability of the wiring.

[0146] The existence of the notch 441b creates a certain gap between the bottom of the third electrical connector 420b and the bottom of the support block 440b. When fixing the third electrical connector 420b, the metal solder that overflows can be concentrated in the gap, so that the bottom surface of the support block 440b is not affected by the metal solder, thereby ensuring the flatness of the support block 440b and thus ensuring the stability of the wire bonding.

[0147] The width of the support block 440b can be set according to the length and bendability of the flexible circuit board 430b. When the length of the flexible circuit board 430b is long, or the bending degree of the flexible circuit board 430b is large, the width of the support block 440b can be set larger, thereby providing a larger flat surface and rigid support force for the wiring operation of the flexible circuit board 430b, thereby ensuring the stability of the wiring.

[0148] Fig.24 FIG. 4 is a structural diagram of a third light emitting component according to some embodiments. Fig.24 As shown, in some embodiments, the light emitting component includes a third tube shell 410c, and the third tube shell 410c is electrically connected to the circuit board 300 through an electrical connector and a flexible connection board. In order to distinguish the first electrical connector 420a1, the second electrical connector 420a2, and the third electrical connector 420b, the electrical connector electrically connected to the third tube shell 410c is referred to as the third electrical connector 420c. In order to distinguish the second flexible circuit board 430 and the first flexible circuit board 440, the flexible circuit board electrically connected to the third tube shell 410c is referred to as the flexible circuit board 430c.

[0149] The structure of the third tube shell 410c is different from that of the second tube shell 410b and the first tube shell 410a. The structure of the third electrical connector 420c is the same as that of the third electrical connector 420b. The structure of the flexible circuit board 430c is the same as that of the flexible circuit board 430b.

[0150] Part of the structure of the third electrical connector 420c is located inside the third tube shell 410c, and part of the structure is located outside the third tube shell 410c.

[0151] The bottom plate of the third tube shell 410c also extends out relative to the top plate to form an extension surface.

[0152] The flexible circuit board 430c is connected to the pads on the surface of the third electrical connector 420c by wire bonding. At the same time, the flexible circuit board 430c is supported by the support plate 440c to provide a flat surface and rigid support force for the wire bonding operation.

[0153] Similarly, a first pad area 421c is provided on the surface of one end of the third electrical connector 420c outside the third tube shell 410c, and a second pad area 431c is provided on the surface of the flexible circuit board 430c. The first pad area 421c and the second pad area 431c are connected by wire bonding, so that low-frequency signals and high-frequency signals are transmitted simultaneously between the third tube shell 410c and the flexible circuit board 430c. When the surfaces of the first pad area 421c and the second pad area 431c are flush, the wire bonding between the two is shorter, and the high-frequency signal transmission quality is better.

[0154] Fig.25 FIG. 4 is an exploded view of a third light emitting component according to some embodiments. Fig.25 As shown, as mentioned above, the support structure of the extension surface can be in different forms to provide a flat surface and support force for the wiring between the flexible circuit board 430c and the third electrical connector 420c. In some embodiments, the support structure can be a support block 440b. In some embodiments, the support structure can also be a structure of other forms.

[0155] In some embodiments, the bottom plate of the third tube shell 410c also extends relative to the top plate to form an extension surface, and the tail of the extension surface protrudes upward to form a boss 412c. The boss 412c forms a supporting structure to provide a flat surface and support force for wiring between the flexible circuit board 430c and the third electrical connector 420c.

[0156] The surface of the boss 412c is relatively lower than the surface of the third electrical connector 420c with the pad, so that the flexible circuit board 430b is arranged on the surface of the boss 412c to ensure that the surface of the third electrical connector 420c with the pad is flush with the surface of the flexible circuit board 430b.

[0157] In some embodiments, the third electrical connector 420c is clamped between the avoidance hole 413c and the boss 412c. The third electrical connector 420c is a split structure, and the split parts are assembled to form the third electrical connector 420c. Exemplarily, when the third electrical connector 420c is fixed between the avoidance hole 413c and the boss 412c by metal solder, the metal solder is easy to overflow, so a solder collection structure is set between the third electrical connector 420c and the boss 412c. In some embodiments, the solder collection structure can be in the form of a gap 450c between the third electrical connector 420c and the boss 412c, and the overflowed metal solder can be collected through the gap 450c. In some embodiments, the solder collection structure can also be in other forms.

[0158] Fig.26 FIG. 4 is a partial exploded view of a third light emitting component according to some embodiments. Fig.26 As shown, a evacuation hole 413c is formed at the end of the third tube shell 410c, and the third electrical connector 420c extends into the evacuation hole 413c, so that one end of the third electrical connector 420c extends into the interior of the third tube shell 410c.

[0159] The bottom plate of the third tube shell 410c also extends relative to the top plate to form an extension surface 411c. The third electrical connector 420c is fixed to the surface of the extension surface 411c. The tail of the extension surface 411c protrudes upward to form a boss 412c. The boss 412c forms a supporting structure to provide a flat surface and support force for wiring between the flexible circuit board 430c and the third electrical connector 420c.

[0160] Fig. 27 FIG. 4 is a side view of a third light emitting component according to some embodiments. Fig. 27 As shown, as mentioned above, a gap 450c is provided between the third electrical connector 420c and the boss 412c, and the overflowed metal solder is collected through the gap 450c.

[0161] If the flexible circuit board 430c is directly arranged on the surface of the boss 412c, in order to ensure a short bonding length, the flexible circuit board 430c is directly connected to the surface of the third electrical connector 420c. Due to the existence of the gap 450c, the flexible circuit board 430c is suspended above the gap 450c, which is not conducive to bonding. If, in order to avoid being suspended, the end of the flexible circuit board 430c is aligned with the end of the boss 412c, and then the flexible circuit board 430c is connected to the surface of the third electrical connector 420c by bonding, at this time, since the flexible circuit board 430c is not directly connected to the surface of the third electrical connector 420c, but is a distance away from the surface of the third electrical connector 420c, the bonding length between the flexible circuit board 430c and the surface of the third electrical connector 420c will be increased. When the bonding length is long, it is not conducive to the transmission of high-frequency signals.

[0162] To this end, a support plate 440c is provided on the surface of the boss 412c, the end of the support plate 440c is connected to the surface of the third electrical connector 420c, the support plate 440c spans the gap 450c to cover the gap 450c, and then the flexible circuit board 430c is supported by the support plate 440c, thereby preventing the lower surface of the wiring area of ​​the flexible circuit board 430c from being suspended.

[0163] After the support plate 440c is disposed on the surface of the boss 412c, the flexible circuit board 430c is disposed on the surface of the support plate 440c, and the flexible circuit board 430c and the support plate 440c are stacked on the surface of the boss 412c.

[0164] The boss 412c has a preset height, which allows the surface of the flexible circuit board 430c to be flush with the surface of the third electrical connector 420c on which the pads are provided after the support plate 440c and the flexible circuit board 430c are sequentially arranged on the surface of the boss 412c, that is, the surface of the first pad area 421c is flush with the surface of the second pad area 431c, so as to shorten the wiring length and improve the high-frequency signal transmission performance.

[0165] Fig.28 FIG. 4 is a cross-sectional view of a third light emitting component according to some embodiments. Fig.28 As shown, the third electrical connector 420c is clamped between the avoidance hole 413c and the boss 412c. In order to collect the metal solder overflowing when the third electrical connector 420c is fixed, a gap 450c is provided between the third electrical connector 420c and the boss 412c.

[0166] In order to avoid the lower part of the wiring area of ​​the flexible circuit board from being suspended and to shorten the wiring length, a support plate 440c is set on the surface of the boss 412c. The support plate 440c spans the gap 450c to cover the gap 450c, and then the flexible circuit board 430c is supported by the support plate 440c, thereby avoiding the lower surface of the wiring area of ​​the flexible circuit board 430c from being suspended.

[0167] A flexible circuit board 430c is arranged on the surface of the support plate 440c, and the flexible circuit board 430c and the support plate 440c are stacked on the surface of the boss 412c, so that the boss 412c and the support plate 440c provide a certain flat surface and support force for the wiring area of ​​the flexible circuit board 430c to ensure the stability of the wiring.

[0168] Fig.29 is a cross-sectional view of a fourth light emitting component according to some embodiments; Fig.30 is an exploded view of a fourth light emitting component according to some embodiments; Fig.31 FIG. 4 is a structural diagram of a fourth tube shell according to some embodiments. Figure 29-Figure 31 As shown, in some embodiments, the light emitting component includes a fourth tube shell 410d, and the fourth tube shell 410d is electrically connected to the circuit board 300 through an electrical connector and a flexible connection board. In order to distinguish the first electrical connector 420a1 and the second electrical connector 420a2, the electrical connector electrically connected to the fourth tube shell 410d is called a third electrical connector 420d. In order to distinguish the second flexible circuit board 430 and the first flexible circuit board 440, the flexible circuit board electrically connected to the fourth tube shell 410d is called a flexible circuit board 430d.

[0169] The structure of the fourth tube shell 410d is different from the structures of the first tube shell 410a, the second tube shell 410b and the third tube shell 410c, the structures of the third electrical connector 420d, the third electrical connector 420c and the third electrical connector 420b are the same, and the structures of the flexible circuit board 430d, the flexible circuit board 430c and the flexible circuit board 430b are the same.

[0170] The bottom plate of the fourth tube shell 410d also extends out relative to the top plate to form an extension surface 411d, and the third electrical connector 420d is disposed on the extension surface 411d.

[0171] The tail of the extension surface 411d protrudes upward to form a boss 412d, and the boss 412d forms a support structure to provide a flat surface and support force for the wiring between the flexible circuit board 430d and the third electrical connector 420d. Similarly, a first pad area 421d is provided on the surface of one end of the third electrical connector 420d outside the fourth tube shell 410d, and a second pad area 431d is provided on the surface of the flexible circuit board 430d. The first pad area 421d and the second pad area 431d are connected by wiring. When the surface of the first pad area 421d is flush with the surface of the second pad area 431d, the length of the wiring is short, and the high-frequency signal transmission quality is better.

[0172] An escape hole 413d is formed at the end of the fourth tube shell 410d, and the third electrical connector 420d extends into the escape hole 413d to extend into the interior of the fourth tube shell 410d. Part of the structure of the third electrical connector 420d is located inside the fourth tube shell 410d, and part of the structure is located on the surface of the extension surface 411d.

[0173] The third electrical connector 420d is clamped between the avoidance hole 413d and the boss 412d. In order to avoid the metal solder overflowing when the third electrical connector 420d is fixed, a gap 440d is defined between the third electrical connector 420d and the boss 412d.

[0174] In some embodiments, in order to prevent the flexible circuit board from being suspended below the wiring area and shorten the wiring length, the top surface of the boss 412d protrudes relative to the body of the boss 412d, and the gap 440d is covered by the protruding portion, and then the flexible circuit board 430d is arranged on the surface of the boss 412d. Since the top surface of the boss 412d protrudes relative to the body of the boss 412d, the gap 440d is covered by the protruding portion, thereby preventing the flexible circuit board from being suspended below the wiring area and shortening the wiring length.

[0175] The boss 412d has a preset height, which allows the surface of the flexible circuit board 430d to be flush with the surface of the third electrical connector 420d on which the pads are provided after the flexible circuit board 430d is provided on the surface of the boss 412d, that is, the surface of the first pad area 421d is flush with the surface of the second pad area 431d, so as to shorten the wiring length and improve the high-frequency signal transmission performance.

[0176] As mentioned above, when the third electrical connector 420c is fixed between the avoidance hole 413c and the boss 412c by metal solder, the metal solder easily overflows, and thus a solder collecting structure is formed between the third electrical connector 420c and the boss 412c.

[0177] In some embodiments, the solder collection structure can be in the form of a gap 450c between the third electrical connector 420c and the boss 412c. The overflowed metal solder can be collected through the gap 450c, and then a support plate 440c is set above the gap 450c to solve the problem of the flexible circuit board being suspended.

[0178] In some embodiments, the solder collection structure can also be in the form of a gap between the third electrical connector 420d and the boss 412d, and then the top surface of the boss 412d is protruded relative to the body of the boss 412d, and the gap 440d is covered by the protruding part, thereby solving the problem of the flexible circuit board being suspended.

[0179] In some embodiments, there may be no gap between the third electrical connector and the boss, and the main structures of the third electrical connector and the boss are kept connected. Either the stability of the third electrical connector is ensured by digging out a corner at the bottom of the boss adjacent to the third electrical connector. In this case, the corner is used as a solder collection structure to collect the metal solder that overflows; or the stability of the boss is ensured by digging out a corner at the bottom of the third electrical connector adjacent to the boss. In this case, the corner is used as a solder collection structure to collect the metal solder that overflows. When the main structures of the third electrical connector and the boss are connected, there is no gap between them. Since the third electrical connector is an assembleable structure, the problem of the third electrical connector being difficult to install will not occur.

[0180] In the above embodiments, a flexible circuit board and an electrical connector are connected by wire bonding by improving the tube shell. Currently, when the number of flexible circuit boards is 1, the tube shell structure is kept unchanged, and the bottom end of the electrical connector is extended in the same manner as the tube shell is extended, so that a support structure for supporting the bonding operation of the flexible circuit board can be set on the extended structure, thereby ensuring the stability of the bonding.

[0181] In summary, each third electrical connector is formed with a first pad area on the surface outside the tube shell; a second pad area is formed on the surface of the flexible circuit board, and the second pad area is connected to the first pad area by wire bonding. The flexible circuit board is used to simultaneously transmit low-frequency signals and high-frequency signals between the circuit board and the light-emitting component. Since the flexible circuit board and the third electrical connector are connected by wire bonding, the wire bonding method is more conducive to improving the transmission quality of high-frequency signals and ensuring the transmission performance of high-frequency signals. A support structure is provided between the flexible circuit board and the extension surface, and the support structure is connected to the third electrical connector. The support structure is used to support the flexible circuit board, provide a flat surface and a rigid support force for the wire bonding of the flexible circuit board, improve the stability of the wire bonding, and thus ensure the transmission performance of the high-frequency signal. The present application improves the tube shell and sets a corresponding support structure on the surface of the tube shell, thereby providing a flat surface and a certain rigid support force for the wire bonding operation of the flexible circuit board, ensuring the stability of the wire bonding, which is conducive to the transmission of high-frequency signals.

[0182] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. An optical module, characterized in that: include: Circuit boards; The light emitting component is electrically connected to the circuit board and comprises: A tube shell, wherein the bottom plate extends relative to the top plate so that the bottom plate forms an extended surface; A third electrical connector, one end of which extends into the tube shell, and one end of which is outside the tube shell and arranged on the surface of the extension surface, wherein a first pad area is formed on the surface of the third electrical connector outside the tube shell; A flexible circuit board, having a second pad area formed on the surface, the second pad area is connected to the first pad area by wire bonding, and the flexible circuit board is used to simultaneously transmit low-frequency signals and high-frequency signals between the circuit board and the light emitting component; The support structure is arranged between the flexible circuit board and the extension surface and is connected to the third electrical connector to support the flexible circuit board so that the surface of the first pad area is flush with the surface of the second pad area, thereby connecting the third electrical connector to the flexible circuit board by wire bonding.

2. The optical module according to claim 1, characterized in that: The support structure comprises a support block, the bottom surface of the support block is arranged on the surface of the extension surface, the top surface is provided with the flexible circuit board, and the side surface is connected to the third electrical connector; The support block has a preset height so that a surface of the second pad region is flush with a surface of the first pad region.

3. The optical module according to claim 2, characterized in that: The bottom of the support block on the side adjacent to the third electrical connector is provided with a notch to collect glue overflowed when the third electrical connector is fixed; Alternatively, in the third electrical connector, a bottom portion on a side adjacent to the support block is provided with a notch to collect glue overflowing when the third electrical connector is fixed.

4. The optical module according to claim 1, characterized in that: The tail of the extension surface protrudes upward to form a boss, and the boss forms the support structure to support the flexible circuit board. The third electrical connector is arranged on one side of the boss.

5. The optical module according to claim 4, characterized in that: A gap is provided between the boss and the third electrical connector to collect glue overflowed when the third electrical connector is fixed; A support plate is provided between the boss and the flexible circuit board, and a side surface of the support plate is connected to the third electrical connector; The support plate spans across the gap to cover the gap; The surface of the support plate is used for arranging the flexible circuit board.

6. The optical module according to claim 4, characterized in that: A gap is provided between the boss and the third electrical connector to collect glue overflowed when the third electrical connector is fixed; the top surface of the boss protrudes relative to the body of the boss to cover the gap; The top surface of the boss is used to place the flexible circuit board.

7. The optical module according to claim 4, characterized in that: When there is no gap between the boss and the third electrical connector, a bottom of the boss on a side adjacent to the third electrical connector is provided with a notch to collect glue overflowing when the third electrical connector is fixed; Alternatively, in the third electrical connector, a bottom portion on a side adjacent to the boss is provided with a notch to collect glue overflowing when the third electrical connector is fixed.

8. The optical module according to claim 5, characterized in that: The boss has a preset height so that after the support plate is arranged, the surface of the second pad area is flush with the surface of the first pad area.

9. The optical module according to claim 6, characterized in that: The boss has a preset height so that a surface of the second pad region is flush with a surface of the first pad region.

10. The optical module according to claim 1, characterized in that: A third pad area is provided on a surface of one end of the third electrical connector located inside the tube shell. The third pad area is electrically connected to the first pad area to simultaneously transmit the low-frequency signal and the high-frequency signal.

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