Optical module heat dissipation device

Abstract

The embodiment of the invention provides an optical module heat dissipation device, and the device comprises an optical module which comprises an upper housing and a lower housing, and the upper housing comprises a fixed housing part which is fixedly assembled and a floating housing part which is elastically assembled; and the radiator comprises a first radiator area and a second radiator area, the first radiator area is in contact with the fixed shell part, and the second radiator area is in contact with the floating shell part and is used for radiating the optical module. According to the embodiment of the invention, the problem of how to perform heat dissipation on devices in the optical module in a targeted manner in related technologies is solved, and the effect of targeted heat dissipation is achieved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of heat dissipation of optical communication equipment, and more specifically, to a heat dissipation device for an optical module. Background Art

[0002] The increasing complexity and diversification of network requirements and the rapid expansion of the scale have promoted the explosive growth of the overall bandwidth of optical networks. The core component of optical network transmission, high-performance coherent optical modules, is developing in the direction of high power consumption, small packaging, and high flexibility. As the power consumption of optical modules increases, the internal components of existing optical modules and heat dissipation devices are fixedly assembled, and the internal components share the shell for heat dissipation, which has the influence of thermal interconnection. In addition, due to the tolerance of components, circuit boards, optical module shells, etc., it is necessary to use a thermal conductive interface material with a certain thickness to compensate for the tolerance, which will lead to large thermal resistance and heat transfer. That is, the internal components of the optical module cannot be targeted based on their own characteristics. Dissipation, thus affecting the performance of the device, therefore, the heat dissipation problem of the optical module is a key factor restricting the reliable application of the optical module. How to dissipate heat for the components in the optical module in a targeted manner is an urgent problem to be solved in the current optical module technology. Summary of the invention

[0003] The embodiment of the present application provides a heat dissipation device for an optical module, which solves the problem of how to dissipate heat for components in an optical module in a targeted manner in the related art.

[0004] According to one embodiment of the present application, an optical module heat dissipation device is provided, comprising: an optical module, comprising an upper shell and a lower shell, wherein the upper shell comprises: a fixed shell part fixedly assembled and an elastically assembled floating shell part; a heat sink, comprising a first heat sink area and a second heat sink area, the first heat sink area is in contact with the fixed shell part, and the second heat sink area is in contact with the floating shell part, for dissipating heat from the optical module.

[0005] Through the above-mentioned embodiments of the present application, since the optical module is equipped with a floating shell part, and the floating shell part is in contact with the second heat sink area, the heat of the internal components of the optical module can be transferred to the floating shell part, and then the heat is dissipated into the air through the heat sink in contact with the floating shell part; at the same time, since the floating shell part is elastically assembled, it can be separated from the corresponding shells of other components to reduce the influence of thermal interconnection; and the elastic contact between the shell and the component can be filled with ultra-thin low thermal resistance thermal conductive interface material, so that the heat in the component is dissipated outward in time, ensuring the performance of the component. Therefore, the problem of how to dissipate the heat of the components in the optical module in a targeted manner in the related technology can be solved, and the effect of targeted heat dissipation can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1It is an exploded schematic diagram of a conventional optical module device;

[0007] Figure 2 This is an exploded diagram of the traditional optical module assembly on the board;

[0008] Figure 3 This is a schematic diagram of the assembly of a traditional optical module on a board;

[0009] Figure 4 is an exploded schematic diagram of an optical module device according to an embodiment of the present application;

[0010] Figure 5 is an exploded schematic diagram of an optical module device according to another embodiment of the present application;

[0011] Figure 6 is an exploded schematic diagram of an optical module device according to another embodiment of the present application;

[0012] Figure 7 is an exploded schematic diagram of a radiator device according to an embodiment of the present application;

[0013] Figure 8 is an exploded schematic diagram of a radiator device according to another embodiment of the present application;

[0014] Fig. 9 is a schematic diagram of assembling a heat sink device and an optical module device according to an embodiment of the present application. DETAILED DESCRIPTION

[0015] The embodiments of the present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0016] It should be noted that the terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0017] The embodiment of the present application provides an optical module equipped with a fixed shell and a floating shell, and a heat sink device matching it. The optical module shell includes a fixed shell part and a floating shell part, and the two parts can be interconnected or separated; the heat sink device matching it includes multiple heat sink parts, which correspond to the fixed shell and the floating shell respectively. The fixed shell and the floating shell are respectively connected to the corresponding devices in the optical module that need heat dissipation, and each device transfers the heat to the fixed shell part and the floating shell part respectively (the thermal interface material can be filled between the device and the shell to reduce the interface thermal resistance), and then dissipates it into the air through the matching heat sink part; through the zoned targeted heat dissipation design, the heat dissipation problem of the bottleneck device inside the optical module is effectively solved. In order to facilitate the understanding of the technical solution provided by the present application, the following will be explained in detail in combination with the embodiments of specific scenarios.

[0018] Figure 1 This is a schematic diagram of the traditional optical module heat dissipation device. Figure 1 As shown, the optical module heat dissipation device includes: an optical module 1, a heat sink 2 and a communication device board 3.

[0019] The optical module 1 includes an upper shell 11 , a lower shell 12 , a circuit board assembly 13 , and a thermal interface material 14 .

[0020] The circuit board assembly 13 is used to carry the circuit of the optical module 1 and has functions such as a signal link. It includes a printed circuit board PCB 131, other devices such as devices 132 / 133 (other devices are not shown in the figure), and a connector 134. The circuit board assembly 13 is fastened to the lower shell 12 or hoisted on the upper shell 11 (the embodiment of the present application is described as being fixed on the lower shell 12). Devices 132 and 133 are connected to the upper shell 11 of the optical module 1 through a thermal interface material 14 (depending on whether they are placed on the A or B side of the PCB to determine whether to connect to the upper shell 11 or the lower shell 12. The embodiments of the present application are described as being placed on the A side of the PCB). The upper shell 11 is fixed on the lower shell 12 to achieve the encapsulation of the optical module 1.

[0021] The heat sink 2 is fixed on the guide rail 37 of the communication device board 3 by means of spring screws 21 (or fixed on the cage 35 of the communication device board 3 by means of buckles), and the heat sink 2 has floating capability.

[0022] Figure 2 This is a schematic diagram of the traditional optical module assembly on the board. Figure 2 As shown, the communication device board 3 includes a panel 31, a support plate 32, a board PCB 33, a head frame 34, a cage 35, a board optical connector 36, a guide rail 37, etc.

[0023] The panel 31 is provided with an opening 311 , and the head frame 34 is assembled inside the opening 311 .

[0024] The board optical connector 36 is welded to the board PCB 33, and the tail of the squirrel cage 35 is matched with the board optical connector 36 and then inserted into the PCB 33. The board PCB 33 is fixed to the panel 31 and the support plate 32 by screws, etc. At the same time, during the board installation process, it is necessary to ensure that the head of the squirrel cage 35 matches the head frame 34.

[0025] Figure 3It is a schematic diagram of the assembly of a traditional optical module on a board. The assembly and heat dissipation principles of the optical module device include: the optical module 1 is inserted into the cage 35 through the head frame 34 along the board opening 311; the connector 134 of the optical module 1 is plugged into the board optical connector 36 to realize the signal path between the optical module 1 and the board 3. The base plate 22 of the heat sink 2 is in hard contact with the upper shell 11 of the optical module 1 through the hole 351 of the cage 35 or through the heat conductive material. The components 132, 133, etc. in the optical module 1 transfer heat to the upper shell 11, and then to the heat sink 2, realizing the heat conduction path from the internal components to the external heat sink, and finally dissipating into the air. It is a traditional form of optical module heat dissipation device.

[0026] In this embodiment, most of the components 132, 133, etc. inside the optical module 1 are fixed on the PCB 31 and share the upper shell 11 for heat transfer. On the one hand, the upper shell 11 is a good thermal conductor, which leads to the thermal interconnection between the components 132, 133, etc.; on the other hand, the components 132, 133, etc. are mostly fixed in a fixed form and share the upper shell 11, which needs to be filled with tolerance-type thermal conductive interface materials, resulting in large thermal resistance and difficulty in heat transfer.

[0027] Based on the problem that traditional optical modules cannot dissipate heat in a targeted manner, this embodiment provides an optical module heat dissipation device provided with a solid and floating shell and a heat sink matched therewith based on the above-mentioned traditional optical module heat dissipation device. The other assemblies on the board are similar to those of traditional optical modules, such as Figure 4 , Figure 5 , Figure 6 As shown, the optical module 1' includes an upper shell 11' and a lower shell 12', and the upper shell 11' includes a fixed shell part 11'-1 and a floating shell part 11'-2, wherein the fixed shell part 11'-1 is tightly assembled with the optical module and is relatively immovable, and the floating shell part 11'-2 is elastically assembled with the optical module, floating perpendicular to the direction of the heat dissipation substrate, and also has a certain movable space in the plane direction; the fixed shell part 11'-1 and the floating shell part 11'-2 can be interconnected or separated.

[0028] Figure 4 is a schematic diagram of an exploded view of an optical module device according to an embodiment of the present application. Figure 4 As shown, the fixed housing part 11'-1 and the floating housing part 11'-2 can be in a separate form. The lower housing 12' can be the same as the lower housing 12 of the conventional optical module 1, or can be set to a fixed or floating solution (not specifically described in the embodiments of this application); the circuit board assembly 13 is fixed in the lower housing 12'; the fixed housing part 11'-1 of the upper housing 11' is fixed to the lower housing 12' by means of a limit screw 11'-11, and the floating housing part 11'-2 is fixed to the lower housing 12' by means of a spring screw 11'-21, so as to realize the floating assembly of the floating housing part 11'-2 and the lower housing 12'.

[0029] Figure 5 is an exploded schematic diagram of an optical module device according to another embodiment of the present application, Figure 6 is an exploded schematic diagram of an optical module device according to another embodiment of the present application. Figure 5 As shown in FIG. 6 , the fixed shell part 11 ′-1 leaves a space for installing the floating shell part 11 ′-2, wherein the installation space may be an opening (such as a hole) provided in the upper shell 11 ′. Figure 5 ), at this time, the upper shell 11' with the opening is the fixed shell part 11'-1, and the floating shell part 11'-2 is fixed to the fixed shell part 11'-1 through the opening of the fixed shell part 11'-1; the installation space can also be as Figure 6 The arrangement shown in the figure is to divide the upper shell 11' into two parts, left and right, and the right part is fixedly connected to the protruding structure of the left part; specifically, the upper floating shell part 11'-2 is fixed to the fixed shell part 11'-1 by spring screws 11'-21, etc., to form an interconnected upper shell 11', and the upper shell 11' is fixed to the lower shell 12' by the limit screws 11'-11 of the fixed shell part 11'-1 to realize the packaging of the optical module 1'.

[0030] A thermal interface material is provided between the components in the circuit board assembly 13 and the upper shell 11'. Components 132 and the like are connected to the fixed shell portion 11'-1 through the tolerance thermal interface material 14, and the fixed shell portion 11'-1 is shared to achieve heat transfer from the components to the upper shell; components 133 and the like are connected to the floating shell portion 11'-2 through the ultra-thin low thermal resistance thermal interface material 14', and the floating shell portion 11'-2 is used to achieve heat transfer from the components to the upper shell. The floating shell portion uses ultra-thin low thermal resistance thermal conductive material, which can reduce thermal resistance by about 60% compared to tolerance thermal conductive material. In this way, the thermal resistance of the material is greatly reduced, so that the heat of the components can be more easily transferred to the upper shell.

[0031] The heat sink 2' matched with the solid and floating upper shell 11' includes a first heat sink area 2'-1 and a second heat sink area 2'-2. The present application defines that the first heat sink area 2'-1 matches the fixed shell part 11'-1 for contact heat transfer, and the second heat sink area 2'-2 matches the floating shell part 11'-2 for contact heat transfer.

[0032] Similar to the module upper shell 11 ′, the first heat sink area 2 ′- 1 and the second heat sink area 2 ′- 2 of the heat sink 2 ′ may also be interconnected or separated to cooperate with the design of the upper shell 11 ′ to achieve joint heat dissipation. Figure 7 is an exploded schematic diagram of a radiator device according to an embodiment of the present application. Figure 7As shown, the first heat sink area 2'-1 and the second heat sink area 2'-2 of the heat sink 2' are separated, and the first heat sink area 2'-1 and the second heat sink area 2'-2 are respectively fixed on the guide rail 37 by spring screws 2'-11 and 2'-21 to achieve the installation of the optical module heat sink.

[0033] Figure 8 is an exploded schematic diagram of a radiator device according to another embodiment of the present application. Figure 8 As shown, the first heat sink area 2'-1 and the second heat sink area 2'-2 of the heat sink 2' are interconnected. In addition to the heat dissipation functional area of ​​the main body, the first heat sink area 2'-1 reserves space for the installation of the second heat sink area 2'-2. The second heat sink area 2'-2 is assembled on the first heat sink area 2'-1 by spring screws 2'-21, etc., to form an interconnected heat sink 2'; the heat sink 2' is fixed to the guide rail 37 by the spring screws 2'-11 of the first heat sink area 2'-1 to realize the installation of the optical module heat sink. The installation effect of the heat sink is as shown in FIG. Fig. 9 shown.

[0034] The two heat sink devices and the three optical module devices mentioned above can be matched and applied arbitrarily.

[0035] Through the above-mentioned embodiments of the present application, since the optical module is equipped with a floating shell part, and the floating shell part is in contact with the second heat sink area, the heat of the internal components of the optical module can be transferred to the floating shell part, and then the heat sink in contact with the floating shell part dissipates the heat into the air; at the same time, since the floating shell part is elastically assembled, "separation from the corresponding shells of other components is achieved, reducing the impact of thermal interconnection; and the elastic contact between the shell and the component can be filled with ultra-thin low thermal resistance thermal conductive interface material", so that the heat in the component is dissipated outward in time, ensuring the performance of the component. Therefore, the problem of how to dissipate the heat of the components in the optical module in a targeted manner in the related technology can be solved, and the effect of targeted heat dissipation can be achieved.

[0036] The design of the floating shell and the floating heat sink makes it possible for the optical module to dissipate heat efficiently within a standard package size without the need for an additional heat dissipation device. Compared with other heat dissipation devices with the same heat dissipation effect, the heat dissipation device of the optical module in the embodiment of the present application occupies less space.

[0037] In this embodiment, the assembly and heat dissipation principle of the optical module device includes: the optical module 1' is installed along the board opening 311, and is inserted into the mouse cage 35 through the head frame 34; the fixed housing part 11'-1 of the optical module 1' is matched with the first heat sink area 2'-1 of the heat sink 2', and the floating housing part 11'-2 of the optical module 1' is matched with the second heat sink area 2'-2 of the heat sink 2'. The heat of the device 132 and the like is transferred to the fixed housing part 11'-1, and then transferred to the first heat sink area 2'-1 and then dissipated into the air; the heat of the device 133 and the like is transferred to the floating housing part 11'-2, and then transferred to the second heat sink area 2'-2 and then dissipated into the air.

[0038] In one embodiment, the floating forms of the floating housing part 11 ′- 2 are not limited to the above two forms, and floating can also be achieved through other forms such as spring clamping, flexible connection, etc.

[0039] In one embodiment, the floating solutions of the housing and the heat sink include, but are not limited to, the following in addition to the above-mentioned embodiments:

[0040] (1) The floating part of the optical module housing can be in the form of a card-mounted or position-limited fixed form, and a spring sheet, a flexible thermal pad, etc. are arranged in the connecting area to achieve floating; or a sealing elastic structural member can be used to achieve floating while playing the role of sealing the upper housing.

[0041] (2) A matching heat sink may also be provided with a fixing bracket, and the first heat sink area and the second heat sink area are fixed on the bracket respectively, so as to achieve the purpose of matching the solid and floating shells of the optical module.

[0042] (3) The fixed shell part may not be used for heat transfer of the device, but is mainly used to support the installation of the floating shell part.

[0043] In the above embodiments of the present application, through the solid and floating shells and the matching heat sink devices, based on the differences in power consumption and thermal sensitivity of the components inside the optical module, targeted heat dissipation design is performed to eliminate the influence of thermal interconnection of the components. After a detailed analysis of the optical module, the heat dissipation efficiency of the optical module device in the embodiment of the present application is greatly improved, which can effectively solve the heat dissipation problem of the bottleneck components inside the high-power optical module, and greatly improve the reliability of the optical module.

[0044] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the principles of the present application shall be included in the protection scope of the present application.

Claims

1. An optical module heat dissipation device, characterized in that: include: The optical module (1') comprises an upper shell (11') and a lower shell (12'), wherein the upper shell (11') comprises: a fixed shell part (11'-1) which is fixedly assembled and a floating shell part (11'-2) which is elastically assembled; The heat sink (2') comprises a first heat sink area (2'-1) and a second heat sink area (2'-2), wherein the first heat sink area (2'-1) contacts the fixed housing part (11'-1), and the second heat sink area (2'-2) contacts the floating housing part (11'-2), and is used for dissipating heat for the optical module (1').

2. The optical module heat dissipation device according to claim 1, characterized in that: in, The fixed shell part (11'-1) is fixedly assembled on the lower shell (12'), and the floating shell part (11'-2) is elastically assembled on the lower shell (12').

3. The optical module heat dissipation device according to claim 1, characterized in that: in, The fixed shell part (11'-1) is fixedly assembled on the lower shell (12'), an installation space is provided on the fixed shell part (11'-1), and the floating shell part (11'-2) is elastically configured on the fixed shell part (11'-1) through the installation space.

4. The optical module heat dissipation device according to claim 1, characterized in that: in, The first heat sink area (2'-1) and the second heat sink area (2'-2) are respectively elastically assembled on the card board (3) of the optical module heat dissipation device.

5. The optical module heat dissipation device according to claim 1, characterized in that: in, The first heat sink area (2'-1) is elastically mounted on the cardboard (3') of the optical module heat dissipation device, and the second heat sink area (2'-2) is elastically mounted on the first heat sink area (2'-1) through an installation space provided on the first heat sink area (2'-1).

6. The optical module heat dissipation device according to claim 1, characterized in that: in, The lower shell (12') is connected to the upper shell (11'), and a circuit board assembly (13) is installed in the space enclosed between the lower shell (12') and the upper shell (11').

7. The optical module heat dissipation device according to claim 6, characterized in that: in, A thermally conductive interface material is provided between the components in the circuit board assembly (13) and the upper shell (11').

8. The optical module heat dissipation device according to claim 6, characterized in that: in, A thermally conductive interface material is provided between a first component in the circuit board assembly (13) corresponding to a position of the fixed housing part (11'-1) and the fixed housing part (11'-1); A heat-conducting interface material is arranged between a second component in the circuit board assembly (13) corresponding to the position of the floating housing part (11'-2) and the floating housing part (11'-2).

9. The optical module heat dissipation device according to claim 1, characterized in that: in, The lower shell (12') comprises a floating part and a fixed part, and the floating part and the fixed part are separated or interconnected.

10. The optical module heat dissipation device according to claim 1, characterized in that: in, The elastic assembly includes one of the following: spring screw, spring sheet clamping, and flexible connection.

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