Display modules and electronic devices

Abstract

This application discloses a display module and an electronic device, belonging to the display field. The display module includes: a screen body and a flexible circuit board layer; the screen body has a non-display surface, and the flexible circuit board layer is disposed adjacent to the non-display surface of the screen body; the screen body has a first direction, the flexible circuit board layer is bent on a first side in the first direction, and the flexible circuit board layer is divided into a first bent portion and a straight portion, the straight portion is disposed adjacent to the non-display surface, the first bent portion is disposed away from the non-display surface, the plane of the straight portion is parallel to the non-display surface, the first bent portion at least partially covers the straight portion after bending, and a first clearance hole is provided on the first bent portion, and an electronic component is disposed on the straight portion, at least one electronic component being located in the first clearance hole.

Description

Technical Field

[0001] This application belongs to the field of display technology, specifically relating to a display module and an electronic device. Background Technology

[0002] With the development of technology, users not only demand powerful functions from electronic devices but also place increasing emphasis on extreme thinness and lightness. Specifically, they require not only powerful functions but also outstanding aesthetics, and that devices be sufficiently light, thin, and durable. However, as electronic devices become increasingly feature-rich, the number of components required also increases. The pursuit of thinness and lightness pushes the space constraints of component layout to the limit, making component miniaturization a current pain point. For example, in the pursuit of extreme thinness and lightness, the battery capacity of electronic devices is affected. A smaller battery capacity leads to shorter usage time, impacting the user experience. However, to ensure both battery capacity and thinness, space needs to be freed up for other components, making space-saving and increasing component density particularly important. In related technologies, the display module's transition circuit board in electronic devices currently houses many components, requiring a large wiring space. This results in a large area of ​​the display module's transition circuit board, occupying more space in the overall device, which in turn reduces the installation space for the battery, leading to a smaller battery capacity. Summary of the Invention

[0003] The purpose of this application is to provide a display module and electronic device that at least solves the problem that the large area of ​​the adapter circuit board of the display module occupies more space in the whole device, which in turn reduces the installation space of the battery in the electronic device and results in a smaller battery capacity.

[0004] In a first aspect, embodiments of this application provide a display module, the display module comprising: a screen body and a flexible circuit board layer;

[0005] The screen body has a non-display surface, and the flexible circuit board layer is disposed adjacent to the non-display surface of the screen body.

[0006] The screen body has a first direction, the flexible circuit board layer is bent on a first side in the first direction, and the flexible circuit board layer is divided into a first bent portion and a straight portion. The straight portion is disposed adjacent to the non-display surface, the first bent portion is disposed away from the non-display surface, the plane where the straight portion is located is parallel to the non-display surface, the first bent portion at least partially covers the straight portion after bending, and a first clearance hole is provided on the first bent portion. An electronic component is disposed on the straight portion, and at least one of the electronic components is located in the first clearance hole.

[0007] Secondly, embodiments of this application provide an electronic device, which includes a device body and a display module as described in any one of the first aspects;

[0008] The display module is installed on the main body of the device.

[0009] In this embodiment, since the flexible circuit board layer is positioned adjacent to the non-display surface of the flexible circuit board layer and is parallel to the non-display surface, it is equivalent to the flexible circuit board being laid flat on the non-display surface of the screen body. The flexible circuit board does not affect the display of the screen body, and it can transmit signals to the screen body. Because the flexible circuit board layer is bent on a first side in the first direction, and is divided into a first bent portion and a straight portion, with the straight portion adjacent to the non-display surface, and the first bent portion at least partially covering the straight portion after bending, it is equivalent to the first bent portion and the straight portion being stacked. This allows integrated circuits to be integrated into the first bent portion, avoiding an increase in the area of ​​the flexible circuit board layer in the first direction, thus preventing the flexible circuit board layer from occupying too much space in the first direction. Furthermore, a first clearance hole is provided on the first bent portion, and an electronic component is provided on the straight portion. At least one electronic component is located in the first clearance hole, thus the first bent portion can protect the electronic component. During the transportation or assembly of the display module, the first bent portion can protect the electronic component, preventing damage from stress. In other words, in this embodiment, by setting the flexible circuit board layer to bend, and dividing the flexible circuit board layer into a first bending portion and a straight portion, integrated circuits can be placed on the first bending portion, and electronic components can be placed on the straight portion. This avoids the problem of the flexible circuit board layer occupying too much space in the first direction, which would reduce the installation space of the battery inside the electronic device. As a result, the installation space of the battery of the electronic device can be increased, and the battery capacity of the electronic device can be improved. Furthermore, the electronic components are located in the first clearance hole of the first bending portion, and the first bending portion can protect the electronic components. That is, in this embodiment, on the one hand, the space occupied by the flexible circuit board layer in the first direction can be reduced, thereby increasing the battery capacity of the electronic device; on the other hand, it does not affect the installation of electronic components and can protect the electronic components. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of one embodiment of a display module provided in this application;

[0011] Figure 2 This is a second schematic diagram illustrating a display module provided in an embodiment of this application;

[0012] Figure 3 This is a third schematic diagram illustrating a display module provided in an embodiment of this application;

[0013] Figure 4 This is the fourth schematic diagram illustrating a display module provided in an embodiment of this application;

[0014] Figure 5 This is the fifth schematic diagram illustrating a display module provided in an embodiment of this application.

[0015] Figure label:

[0016] 10: Screen body; 101: Non-display surface; 20: Flexible circuit board layer; 201: First bending portion; 202: Straight portion; 203: Second bending portion; 204: Third bending portion; 205: Fourth bending portion; 2011: First clearance hole; 2031: Second clearance hole; 2041: Fourth clearance hole; 2051: Fifth clearance hole; 100: First reinforcing circuit board layer; 110: Third clearance hole; 001: Electronic component; 002: Adhesive layer; 003: Connector; 004: Mounting circuit board; 005: Connecting circuit board; 006: Adhesive; 007: Conductive component; 008: Adhesive; X: First direction; Y: Second direction. Detailed Implementation

[0017] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0018] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0019] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0020] like Figures 1 to 5As shown, the display module includes: a screen body 10 and a flexible circuit board layer 20;

[0021] The screen body 10 has a non-display surface 101, and the flexible circuit board layer 20 is disposed adjacent to the non-display surface 101 of the screen body 10. The screen body 10 has a first direction X, and the flexible circuit board layer 20 is bent on a first side in the first direction X. The flexible circuit board layer 20 is divided into a first bent portion 201 and a straight portion 202. The straight portion 202 is disposed adjacent to the non-display surface 101, and the first bent portion 201 is disposed away from the non-display surface 101. The plane where the straight portion 202 is located is parallel to the non-display surface 101. After the first bent portion 201 is bent, it at least partially covers the straight portion 202. A first clearance hole 2011 is provided on the first bent portion 201, and an electronic component 001 is disposed on the straight portion 202. At least one electronic component 001 is located in the first clearance hole 2011.

[0022] In this embodiment, since the flexible circuit board layer 20 is disposed adjacent to the non-display surface 101 of the flexible circuit board layer 20, it is equivalent to the flexible circuit board being laid flat on the non-display surface 101 of the screen body 10, and the flexible circuit board does not affect the display of the screen body 10. The flexible circuit board can transmit signals to the screen body 10. Since the flexible circuit board layer 20 is bent on the first side in the first direction X, and the flexible circuit board layer 20 is divided into a first bent portion 201 and a straight portion 202, the straight portion 202 is disposed adjacent to the non-display surface 101, and the plane where the straight portion 202 is located is parallel to the non-display surface 101. After the first bent portion 201 is bent, it at least partially covers the straight portion 202. Therefore, it is equivalent to the first bent portion 201 and the straight portion 202 being stacked, so that integrated circuits can be integrated in the first bent portion 201, avoiding the problem of increasing the area of ​​the flexible circuit board in the first direction X, which would otherwise lead to the flexible circuit board layer 20 occupying too much space in the first direction X. In addition, a first clearance hole 2011 is provided on the first bending portion 201, and an electronic component 001 is provided on the straight portion 202. At least one electronic component 001 is located in the first clearance hole 2011, so the first bending portion 201 can protect the electronic component 001. During the transportation or assembly of the display module, the first bending portion 201 can protect the electronic component 001 and avoid the problem of the electronic component 001 being damaged by force. That is, in this embodiment, by setting the flexible circuit board layer 20 to be bent, and the flexible circuit board layer 20 being divided into a first bent portion 201 and a straight portion 202, integrated circuits can be installed on the first bent portion 201, and electronic components 001 can be installed on the straight portion 202. This avoids the problem of the flexible circuit board layer 20 occupying too much space in the first direction X, which would reduce the installation space of the battery inside the electronic device. As a result, the installation space of the battery of the electronic device can be increased, and the battery capacity of the electronic device can be improved. Furthermore, at least one electronic component 001 is located in the first clearance hole 2011 of the first bent portion 201. The first bent portion 201 can protect the electronic component 001. In other words, in this embodiment, on the one hand, the space occupied by the flexible circuit board layer 20 in the first direction X can be reduced, and the battery capacity of the electronic device can be improved. On the other hand, it does not affect the installation of the electronic component 001 and can protect the electronic component 001.

[0023] It should be noted that the non-display surface 101 of the screen body 10 may be provided with a mounting circuit board 004. The mounting circuit board 004 is adhered to the non-display surface 101 of the screen body 10 by adhesive 008. The plane on which the mounting circuit board 004 is located is parallel to the non-display surface 101. A straight portion 202 is provided on the mounting circuit board 004, that is, the straight portion 202 is mounted on the mounting circuit board 004 by an adhesive component 006, and the adhesive component 006 is provided with a conductive component 007, so that the straight portion 202 is electrically connected to the mounting circuit board 004. In addition, the screen body 10 is connected to a connecting circuit board 005, which is connected to the mounting circuit board 004, so that the screen body 10 can transmit signals to the mounting circuit board 004 through the connecting circuit board 005, thereby the mounting circuit board 004 transmits the signals to the electronic components 001 on the flexible circuit board and the circuits in the flexible circuit board.

[0024] Furthermore, in this embodiment, by setting the flexible circuit board layer 20 to be bent, and dividing the flexible circuit board layer 20 into a first bent portion 201 and a straight portion 202, integrated circuits can be integrated on the first bent portion 201, and electronic components 001 can be disposed on the straight portion 202. This also avoids the need to additionally set other components to integrate the electronic components 001 in the stacking direction of the first bent portion 201 and the straight portion 202, thereby reducing the size of the display module in the stacking direction of the first bent portion 201 and the straight portion 202. The stacking direction of the first bent portion 201 and the straight portion 202 can be the thickness direction of the electronic device. When the electronic device is a mobile phone, the stacking direction of the first bent portion 201 and the straight portion 202 is the thickness direction of the mobile phone. Figure 1 As shown, the direction in which the first bent portion 201 and the straight portion 202 are stacked can be... Figure 1 The direction in which the Z-axis of the coordinate system lies.

[0025] Additionally, in this embodiment of the application, when the electronic device is a mobile phone, the first direction X can be the length direction of the mobile phone. For example... Figure 1 As shown, the first direction X can be Figure 1 The direction in which the X-axis of the medium coordinate system lies.

[0026] Furthermore, in this embodiment, the first bent portion 201 may completely cover the straight portion 202; however, the first bent portion 201 may also only cover a portion of the straight portion 202. This embodiment does not limit the scope of the application in this regard.

[0027] In addition, in this embodiment, the first bent portion 201 and the straight portion 202 can be bonded together by the adhesive 006. Of course, there may also be a gap between the first bent portion 201 and the straight portion 202. This embodiment does not limit the scope of this application.

[0028] In addition, in some embodiments, the flexible circuit board layer 20 is also bent on a second side in the first direction X, and the flexible circuit board layer 20 is divided into a straight portion 202 and a second bent portion 203. The first side and the second side are opposite to each other in the first direction X. After the second bent portion 203 is bent, it at least partially covers the first bent portion 201, and the second bent portion 203 is located on the side of the first bent portion 201 away from the straight portion 202.

[0029] Since the second bending portion 203 at least partially covers the first bending portion 201 after bending, it is equivalent to the second bending portion 203 and the first bending portion 201 being stacked. This allows integrated circuits to be housed in the second bending portion 203, avoiding the problem of the flexible circuit board area increasing in the first direction X, which would otherwise occupy too much space inside the electronic device and reduce its battery capacity. Furthermore, the second bending portion 203 is located on the side of the first bending portion 201 away from the straight portion 202, thus minimizing its impact on the electronic component 001 on the straight portion 202 and ensuring its effective operation. In other words, by bending the flexible circuit board on the second side in the first direction X, the space occupied by the flexible circuit board in the first direction X can be further reduced, which is beneficial for improving the battery capacity of the electronic device.

[0030] It should be noted that the second bend 203 and the first bend 201 can be bonded together by the adhesive 006, so that the first bend 201 can fix the second bend 203 and prevent the second bend 203 from shaking.

[0031] In addition, in some embodiments, a second clearance hole 2031 is provided on the second bend 203, and the second clearance hole 2031 communicates at least partially with the first clearance hole 2011.

[0032] With this arrangement, the second clearance hole 2031 effectively avoids the electronic component 001 in the first clearance hole 2011, preventing the second bend 203 from obstructing the electronic component 001 and potentially affecting its performance. Specifically, by setting the second clearance hole 2031 to at least partially communicate with the first clearance hole 2011 along the stacked direction of the first bend 201 and the second bend 203, the second bend 203 will not obstruct the electronic component 001, ensuring its effective operation.

[0033] It should be noted that when the size of electronic component 001 is large, electronic component 001 can extend into the second clearance hole 2031, that is, electronic component 001 is simultaneously located in the first clearance hole 2011 and the second clearance hole 2031.

[0034] Additionally, in some embodiments, such as Figure 3 As shown, along the direction from the first bend 201 to the straight section 202, a first reinforcing circuit board layer 100 is provided on the surface of the first bend 201 facing the straight section 202, and a third clearance hole 110 is provided on the first reinforcing circuit board layer 100. Along the direction from the first bend 201 to the straight section 202, the third clearance hole 110 communicates at least partially with the first clearance hole 2011, and at least one electronic component 001 is located in the first clearance hole 2011 and the third clearance hole 110.

[0035] Since a first reinforcing circuit board layer 100 is provided on the surface of the first bent portion 201 facing the straight portion 202, an integrated circuit can be placed in the first reinforcing circuit board layer 100. This is equivalent to increasing the number of components that can be placed with integrated circuits, and it avoids the need to increase the size of the flexible circuit board in the first direction X to place additional integrated circuits, thus allowing the size of the flexible circuit board in the first direction X to be reduced. In addition, a third clearance hole 110 is provided on the first reinforcing circuit board, which is at least partially connected to the first clearance hole 2011. Therefore, at least one electronic component 001 can be located in both the first clearance hole 2011 and the third clearance hole 110, thereby avoiding the problem of the first reinforcing circuit board affecting the electronic component 001. In other words, by providing the first reinforcing circuit board layer 100, integrated circuits can be placed in the first reinforcing circuit board layer 100, which helps to reduce the space occupied by the flexible circuit board in the first direction X.

[0036] Furthermore, in this embodiment, the first reinforcing circuit board layer 100 may have a gap with the flat portion 202. Alternatively, the first reinforcing circuit board layer 100 may be bonded to the flat portion 202 via an adhesive 006, thereby allowing the flat portion 202 to fix the first reinforcing circuit board layer 100. This embodiment does not limit the scope of the application.

[0037] In some embodiments, the first reinforcing circuit board layer 100 is disposed on the surface of the first bent portion 201 facing the straight portion 202 by an adhesive layer 002, and the adhesive layer 002 is provided with a through hole, which is at least partially connected to the third clearance hole 110 and the first clearance hole 2011; wherein, a connector 003 is disposed in the through hole, and the connector 003 is respectively connected to the first reinforcing circuit board layer 100 and the first bent portion 201.

[0038] Since the first reinforcing circuit board layer 100 is disposed on the surface of the first bent portion 201 facing the straight portion 202 via the adhesive layer 002, the first bent portion 201 can fix the first reinforcing circuit board layer 100, preventing the first reinforcing circuit board layer 100 from wobbling relative to the first bent portion 201. In addition, the adhesive layer 002 is provided with through holes, and connectors 003 are disposed in the through holes. Connectors 003 connect the first reinforcing circuit board layer 100 and the first bent portion 201 respectively. Therefore, the first reinforcing circuit board layer 100 and the first bent portion 201 can be connected through connectors 003. The presence of through holes provides installation space for connectors 003, thereby facilitating the installation of connectors 003 and, consequently, facilitating the electrical connection between the first reinforcing circuit board layer 100 and the first bent portion 201. By setting the adhesive layer 002 and the connector 003, not only can the first reinforcing circuit board layer 100 be prevented from shaking relative to the first bending part 201, but it can also facilitate the electrical connection between the first reinforcing circuit board layer 100 and the first bending part 201.

[0039] It should be noted that the connector 003 can be a metal layer, which is disposed on the inner wall of the through hole, and is electrically connected to both the first reinforcing circuit board layer 100 and the first bending portion 201, thereby electrically connecting the first bending portion 201 to the first reinforcing circuit board layer 100. Of course, the connector 003 can also be other components, such as a wire or a metal rod. The specific type of connector 003 is not limited in this embodiment.

[0040] In addition, in some embodiments, the screen body 10 has a second direction Y, which intersects with the first direction X. The flexible circuit board layer 20 is bent on a third side in the second direction Y, and the flexible circuit board layer 20 is divided into a third bent portion 204 and a straight portion 202. After the third bent portion 204 is bent, it at least partially covers the first bent portion 201, and the third bent portion 204 is located on the side of the first bent portion 201 away from the straight portion 202.

[0041] Since the third bend 204 at least partially covers the first bend 201 after bending, it is equivalent to the third bend 204 and the first bend 201 being stacked. This allows integrated circuits to be housed in the third bend 204, avoiding an increase in the area of ​​the flexible circuit board layer 20 in the second direction Y, which would otherwise occupy too much space inside the electronic device and reduce its battery capacity. Furthermore, the third bend 204 is located on the side of the first bend 201 away from the straight section 202, thus minimizing its impact on the electronic components 001 on the straight section 202 and ensuring their effective operation. In other words, by bending the flexible circuit board layer 20 on a third side in the second direction Y, the space occupied by the flexible circuit board layer 20 in the second direction Y can be reduced, improving the internal space utilization of the electronic device.

[0042] It should be noted that the third bend 204 and the first bend 201 can be bonded together by the adhesive 006, so that the first bend 201 can fix the third bend 204 and prevent the third bend 204 from shaking.

[0043] Additionally, in this embodiment, when the electronic device is a mobile phone, the second direction Y can be the width direction of the mobile phone. For example... Figure 5 As shown, the second direction Y can be Figure 5 The direction of the Y-axis in the coordinate system.

[0044] Furthermore, in this embodiment, the third bend 204 may cover part of the first bend 201; of course, the third bend 204 may also cover the entire first bend 201. This embodiment does not limit the scope of the application.

[0045] In addition, in some embodiments, a fourth clearance hole 2041 is provided on the third bend 204, and the fourth clearance hole 2041 communicates at least partially with the first clearance hole 2011 along the direction from the third bend 204 to the first bend 201.

[0046] With this arrangement, the fourth clearance hole 2041 effectively avoids the electronic component 001 in the first clearance hole 2011, preventing the third bend 204 from obstructing the electronic component 001 and potentially affecting its performance. Specifically, by setting the fourth clearance hole 2041 to at least partially communicate with the first clearance hole 2011 along the direction in which the third bend 204 and the first bend 201 are stacked, the third bend 204 will not obstruct the electronic component 001, ensuring its effective operation.

[0047] It should be noted that when the size of electronic component 001 is large, electronic component 001 can extend into the fourth clearance hole 2041, that is, electronic component 001 is simultaneously located in the first clearance hole 2011 and the fourth clearance hole 2041.

[0048] In addition, in some embodiments, the flexible circuit board layer 20 is bent on the fourth side in the second direction Y, and the flexible circuit board layer 20 is divided into a straight portion 202 and a fourth bent portion 205. The fourth side is opposite to the third side in the second direction Y. After the fourth bent portion 205 is bent, it at least partially covers the third bent portion 204, and the fourth bent portion 205 is located on the side of the third bent portion 204 away from the straight portion 202.

[0049] Since the fourth bend 205 at least partially covers the third bend 204 after bending, it is equivalent to the fourth bend 205 and the third bend 204 being stacked. This allows integrated circuits to be housed in the fourth bend 205, avoiding an increase in the area of ​​the flexible circuit board layer 20 in the second direction Y, which would otherwise occupy too much space inside the electronic device and reduce its battery capacity. Furthermore, the fourth bend 205 is located on the side of the third bend 204 away from the straight section 202, thus minimizing its impact on the electronic component 001 on the straight section 202 and ensuring its effective operation. In other words, by bending the flexible circuit board layer 20 on the fourth side of the second direction Y, the space occupied by the flexible circuit board layer 20 in the second direction Y can be reduced, improving the internal space utilization of the electronic device.

[0050] It should be noted that the fourth bend 205 and the third bend 204 can be bonded together by the adhesive 006, so that the third bend 204 can fix the fourth bend 205 and prevent the fourth bend 205 from shaking.

[0051] Furthermore, in this embodiment, the fourth bend 205 may cover part of the third bend 204; of course, the fourth bend 205 may also cover the entire third bend 204. This embodiment does not limit the scope of the application in this regard.

[0052] In addition, in some embodiments, a fifth clearance hole 2051 is provided on the fourth bend 205, and the fifth clearance hole 2051 and the fourth clearance hole 2041 are at least partially connected along the direction from the third bend 204 to the fourth bend 205.

[0053] This arrangement prevents the fourth bend 205 from obstructing the electronic component 001 in the first clearance hole 2011, thus avoiding potential performance issues for the electronic component 001. Specifically, by setting the fifth clearance hole 2051 and the fourth clearance hole 2041 to at least partially communicate along the direction in which the fourth bend 205 and the third bend 204 are stacked, and by positioning the fourth clearance hole 2041 opposite to the first clearance hole 2011, the fourth bend 205 is prevented from obstructing the electronic component 001, ensuring its effective operation.

[0054] It should be noted that when the size of electronic component 001 is large, electronic component 001 can extend into the fifth clearance hole 2051, that is, electronic component 001 is simultaneously located in the first clearance hole 2011, the fourth clearance hole 2041 and the fourth clearance hole 2041.

[0055] In addition, in this embodiment, a second reinforcing circuit board layer may be provided on the surface of the fourth bend 205 away from the third bend 204, and an integrated circuit may be integrated in the second reinforcing circuit board layer.

[0056] In addition, in this embodiment of the application, when the flexible circuit board layer 20 is bent along the first side and the second side of the first direction X to form the first bent portion 201 and the second bent portion 203, and the flexible circuit board layer 20 is bent along the third side and the fourth side of the second direction Y to form the third bent portion 204 and the fourth bent portion 205, it is equivalent to bending the edge of the flexible circuit board layer 20, so that the size of the flexible circuit board layer 20 in the first direction X and the second direction Y is reduced.

[0057] In addition, in the embodiments of this application, during the production of the display module, two flexible circuit board layers 20 can be bonded and pressed together using PP material. Then, the two pressed flexible circuit board layers 20 are insulated. Next, local punching and slotting can be performed on the two flexible circuit board layers 20 to form clearance holes. Afterward, the two flexible circuit board layers 20 can be bent to form a first bent portion 201 and a straight portion 202. Alternatively, when bending the flexible circuit board layers 20, a first bent portion 201, a second bent portion 203, a third bent portion 204, and a fourth bent portion 205 can be formed respectively.

[0058] It should be noted that, in the embodiments of this application, both adhesive 008 and adhesive component 006 can be anisotropic conductive film (ACF).

[0059] In this embodiment, by setting the flexible circuit board layer 20 to be bent, and the flexible circuit board layer 20 being divided into a first bent portion 201 and a straight portion 202, integrated circuits can be mounted on the first bent portion 201, and electronic components 001 can be mounted on the straight portion 202. This avoids the problem of the flexible circuit board layer 20 occupying too much space in the first direction X, which would reduce the installation space of the battery inside the electronic device. As a result, the installation space of the battery in the electronic device can be increased, thereby increasing the battery capacity of the electronic device. Furthermore, at least one electronic component 001 is located in the first clearance hole 2011 of the first bent portion 201, and the first bent portion 201 can protect the electronic component 001. That is, in this embodiment, on the one hand, the space occupied by the flexible circuit board in the first direction X can be reduced, thereby increasing the battery capacity of the electronic device. On the other hand, it does not affect the installation of the electronic component 001, and can also protect the electronic component 001. Furthermore, in this embodiment, by providing a first reinforcing circuit board layer 100 on the surface of the first bent portion 201 facing the straight portion 202 along the stacking direction of the first bent portion 201 and the straight portion 202, it is possible to avoid increasing the size of the flexible circuit board layer 20 in the first direction X to accommodate additional integrated circuits, thus allowing the size of the flexible circuit board in the first direction X to be reduced. Additionally, the flexible circuit board layer 20 is bent on a third side in the second direction Y, and is divided into a third bent portion 204 and a straight portion 202. Integrated circuits can also be housed in the third bent portion 204, avoiding the problem of increasing the area of ​​the flexible circuit board in the second direction Y, which would otherwise result in the flexible circuit board occupying too much space inside the electronic device and thus reducing the battery capacity of the electronic device.

[0060] This application provides an electronic device, which includes a device body and a display module as described in any of the above embodiments; the display module is installed on the device body.

[0061] The main body of the device may be equipped with a control circuit board, which is electrically connected to the flexible circuit board layer 20. The control circuit board can transmit signals to the flexible circuit board layer 20, and then the flexible circuit board layer 20 can transmit signals to the screen body 10, so that the control circuit board can control the screen body 10.

[0062] It should be noted that, in the embodiments of this application, electronic devices include, but are not limited to, controllers, smart devices, terminal products, etc., wherein smart devices include, for example, smartphones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices, etc., and terminal products include, for example, personal computers, tablet computers, etc.

[0063] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0064] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that, The display module includes: a screen body and a flexible circuit board layer; The screen body has a non-display surface, and the flexible circuit board layer is disposed adjacent to the non-display surface of the screen body. The screen body has a first direction, the flexible circuit board layer is bent on a first side in the first direction, and the flexible circuit board layer is divided into a first bent part and a straight part. The straight part is disposed adjacent to the non-display surface, the first bent part is disposed away from the non-display surface, the plane where the straight part is located is parallel to the non-display surface, the first bent part is bent and at least partially covers the straight part, and a first clearance hole is provided on the first bent part. An electronic component is disposed on the straight part, and at least one of the electronic components is located in the first clearance hole. The flexible circuit board layer is also bent on a second side in the first direction, and the flexible circuit board layer is divided into a straight part and a second bent part. The first side and the second side are opposite to each other in the first direction. After the second bent part is bent, it at least partially covers the first bent part, and the second bent part is located on the side of the first bent part away from the straight part.

2. The display module according to claim 1, characterized in that, The second bend is provided with a second clearance hole, which is at least partially connected to the first clearance hole.

3. The display module according to claim 1, characterized in that, Along the direction from the first bend to the straight portion, a first reinforcing circuit board layer is provided on the surface of the first bend facing the straight portion, and a third clearance hole is provided on the first reinforcing circuit board layer. Along the direction from the first bend to the straight portion, the third clearance hole communicates at least partially with the first clearance hole, and at least one of the electronic components is located in the first clearance hole and the third clearance hole.

4. The display module according to claim 3, characterized in that, The first reinforcing circuit board layer is disposed on the surface of the first bent portion facing the straight portion through an adhesive layer, and the adhesive layer is provided with a through hole, which is at least partially connected to the third clearance hole and the first clearance hole; The through hole is provided with a connector, which connects the first reinforced circuit board layer and the first bend to the first bent portion.

5. The display module according to claim 1, characterized in that, The screen body has a second direction, which intersects with the first direction. The flexible circuit board layer is bent on a third side in the second direction, and the flexible circuit board layer is divided into a third bent portion and a straight portion. After the third bent portion is bent, it at least partially covers the first bent portion, and the third bent portion is located on the side of the first bent portion away from the straight portion.

6. The display module according to claim 5, characterized in that, The third bend is provided with a fourth clearance hole, and along the direction from the third bend to the first bend, the fourth clearance hole is at least partially connected to the first clearance hole.

7. The display module according to claim 6, characterized in that, The flexible circuit board layer is bent on the fourth side in the second direction, and the flexible circuit board layer is divided into the straight part and the fourth bent part. The fourth side is opposite to the third side in the second direction. After the fourth bent part is bent, it at least partially covers the third bent part, and the fourth bent part is located on the side of the third bent part away from the straight part.

8. The display module according to claim 7, characterized in that, The fourth bend is provided with a fifth clearance hole, and the fifth clearance hole is at least partially connected to the fourth clearance hole along the direction from the third bend to the fourth bend.

9. An electronic device, characterized in that, The electronic device includes a device body and a display module as described in any one of claims 1-8; The display module is installed on the main body of the device.

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