A method for manufacturing a micro-inductor and an inductor

Abstract

This application relates to a method for manufacturing a miniature inductor and the inductor itself, belonging to the field of electronic component manufacturing technology. The method includes: first pressing pre-prepared powder into a flat mold of a first preset size to obtain a flat raw material; first painting the six sides of the flat raw material; first cutting the upper surface of the first-painted flat raw material to create several transverse grooves of a second preset size; first electroplating the several transverse grooves to obtain several electroplating tanks; filling the upper surface of the first-electroplated flat raw material with pre-prepared powder for a second pressing to obtain a semi-finished flat plate; second painting the upper surface of the semi-finished flat plate at a third preset interval to form several paint stripes on the upper surface of the semi-finished flat plate; cross-cutting the semi-finished flat plate to obtain several semi-finished blocks of a fourth preset size; third painting the front and back sides of the several semi-finished blocks; and second electroplating the unpainted parts of the several semi-finished blocks to obtain a finished inductor. This application simplifies the production process of miniature inductors and reduces production costs.

Description

Technical Field

[0001] This application relates to the field of electronic component manufacturing technology, and in particular to a method for manufacturing a miniature inductor and an inductor. Background Technology

[0002] Miniature inductors, as important electronic components, are widely used in various circuit designs, playing a crucial role, especially in high-frequency filtering and signal processing. With the miniaturization and weight reduction of electronic products, the demand for miniature inductors is increasing. To meet this demand, many research institutions and companies are dedicated to developing efficient miniature inductor manufacturing methods to improve production efficiency and product quality.

[0003] In existing technologies, common methods for manufacturing miniature inductors include wire winding, thin-film methods, and powder metallurgy. Wire winding involves winding wires around a magnetic core to create the inductor. This method is simple, but the resulting inductors are relatively large, making them unsuitable for miniaturization. Thin-film methods involve depositing a thin metal film on a substrate and then forming the inductor structure through photolithography and etching. While this method can achieve high-precision miniaturization, it is complex and costly. Powder metallurgy involves pressing powder materials into shape, sintering them, and then processing them through a series of steps to create the inductor. This method can achieve high density and mechanical strength, but the forming accuracy is lower, making it difficult to meet precision requirements. Therefore, current methods for manufacturing miniature inductors struggle to reduce production costs while ensuring accuracy. Summary of the Invention

[0004] The purpose of this application is to provide a method for manufacturing a miniature inductor and an inductor that simplifies the production process of miniature inductors and reduces production costs.

[0005] Firstly, the method for manufacturing a miniature inductor provided in this application adopts the following technical solution:

[0006] A method for manufacturing a miniature inductor, comprising:

[0007] The pre-made powder is loaded into a flat mold of the first preset size for the first pressing and forming to obtain a flat raw material;

[0008] The six sides of the flat material are painted for the first time;

[0009] The surface of the flat material after the first painting is cut for the first time, and several horizontal grooves of the second preset size are cut out according to the first preset spacing.

[0010] The first electroplating is performed on the several transverse grooves cut out in the first cut, resulting in several electroplating tanks;

[0011] The surface of the flat plate material after the first electroplating is filled with pre-made powder and then pressed and shaped a second time, so that the pre-made powder forms a third preset size sealing layer on the surface of the flat plate material, and a semi-finished flat plate is obtained.

[0012] The upper surface of the flat semi-finished product is sprayed with paint a second time at a third preset interval, forming several paint stripes on the upper surface of the semi-finished product;

[0013] The flat semi-finished product is cut in a cross shape to obtain several semi-finished product blocks of the fourth preset size;

[0014] The front and back surfaces of several semi-finished blocks are painted a third time.

[0015] A second electroplating process is performed on the unpainted parts of several semi-finished blocks to form an electroplating layer on the outer surface of the blocks, thus obtaining the finished inductor.

[0016] By adopting the above technical solutions, this application enables the efficient and low-cost fabrication of miniature inductors. Firstly, pressing and flat die-cutting ensure the dimensional accuracy and consistency of the inductors. Secondly, multiple painting and electroplating processes form reliable insulating and conductive layers, improving the electrical performance and reliability of the inductors. Furthermore, precise cutting and assembly enable high-density integration and miniaturization of the inductors, meeting the demands of modern electronic products. The entire fabrication process is simple and controllable, simplifying the production flow of miniature inductors and reducing production costs.

[0017] Preferably, the first preset dimension has a length of 80mm, a width of 60mm, and a thickness of 0.6mm.

[0018] Preferably, the second preset dimension has a length of 80mm, a width of 0.5mm, and a depth of 0.4mm.

[0019] Preferably, the third preset dimension has a length of 80mm, a width of 60mm, and a thickness of 0.4mm.

[0020] Preferably, the fourth preset dimension has a length of 2.5mm, a width of 2mm, and a thickness of 1mm.

[0021] Preferably, the first electroplating includes: sequentially electroplating a copper layer, a nickel layer, and a tin layer.

[0022] Preferably, the copper layer has a thickness of 0.005 mm, the nickel layer has a thickness of 0.003 mm, and the tin layer has a thickness of 0.01 mm.

[0023] Preferably, the first and second cuts are made using an abrasive wheel cutter.

[0024] Preferably, the first, second, and third coats of paint are all made of insulating varnish.

[0025] Secondly, the miniature inductor provided in this application adopts the following technical solution:

[0026] A miniature inductor, said inductor being manufactured by a miniature inductor manufacturing method as described in the first aspect;

[0027] The inductor includes an inductor body, the outer surface of which includes an electroplating layer and a paint layer. The electroplating layer is disposed on both sides of the left and right sides and the top surface, and the paint layer is disposed on the front and back sides, the bottom surface and the middle of the top surface.

[0028] An electroplating tank runs through the interior of the inductor body from left to right, and the electroplating tank and the electroplating layer form a passage.

[0029] By adopting the above technical solution, the manufacturing method of the WeChat inductor of this application is simple, while ensuring precision, effectively improving production efficiency, reducing costs, and ensuring product quality.

[0030] In summary, this application has the following beneficial technical effects:

[0031] This application enables the efficient and low-cost fabrication of miniature inductors. Firstly, pressing and flat die-cutting ensure dimensional accuracy and consistency of the inductors. Secondly, multiple painting and electroplating processes create reliable insulating and conductive layers, improving the inductor's electrical performance and reliability. Furthermore, precise cutting and assembly allow for high-density integration and miniaturization of the inductors, meeting the demands of modern electronic products. The entire fabrication process is simple and controllable, simplifying the production flow of miniature inductors and reducing production costs. Attached Figure Description

[0032] Figure 1 This is a flowchart of the manufacturing method of Embodiment 1 of this application;

[0033] Figure 2 This is a schematic diagram of the overall structure of the miniature inductor according to Embodiment 1 of this application;

[0034] Figure 3 This is a cross-sectional view of the miniature inductor of Embodiment 1 of this application;

[0035] In the diagram, 1 is the inductor body; 2 is the electroplating layer; 3 is the paint layer; and 4 is the electroplating tank. Detailed Implementation

[0036] The following will be combined with the appendix Figure 1-3The technical solutions in the embodiments of this application are clearly and completely described. The described embodiments are only possible technical implementations of this application and not all possible implementations. Those skilled in the art can obtain other embodiments in conjunction with the embodiments of this application without creative effort, and these embodiments are also within the protection scope of this application.

[0037] In existing technologies, common methods for manufacturing miniature inductors include wire winding, thin-film methods, and powder metallurgy. Wire winding involves winding wires around a magnetic core to create the inductor. This method is simple, but the resulting inductors are relatively large, making them unsuitable for miniaturization. Thin-film methods involve depositing a thin metal film on a substrate and then forming the inductor structure through photolithography and etching. While this method can achieve high-precision miniaturization, it is complex and costly. Powder metallurgy involves pressing powder materials into shape, sintering them, and then processing them through a series of steps to create the inductor. This method can achieve high density and mechanical strength, but the forming accuracy is lower, making it difficult to meet precision requirements. Therefore, current methods for manufacturing miniature inductors struggle to reduce production costs while ensuring accuracy.

[0038] Example 1

[0039] Because existing methods for manufacturing miniature inductors suffer from high costs, low efficiency, and inconsistent product quality, this paper refers to... Figure 1 This application provides a method for fabricating a miniature inductor, comprising:

[0040] S1. The pre-made powder is loaded into a flat mold of the first preset size for the first pressing and forming to obtain a flat raw material.

[0041] Specifically, the pre-formed powder can be ferrite powder or other materials with high magnetic permeability to ensure the performance of the inductor. The size of the flat mold can be adjusted according to actual needs. During the pressing process, a hydraulic press or pneumatic press can be used to ensure the uniformity and density of the flat raw material. In the specific implementation, the first preset dimensions are 80mm in length, 60mm in width, and 0.6mm in thickness.

[0042] S2. Apply the first coat of paint to all six sides of the flat material.

[0043] Specifically, the main purpose of spray painting is to form an insulating layer to prevent short circuits in the inductor during subsequent processing. Insulating varnishes, such as epoxy resin varnish or polyurethane varnish, can be used. Spray painting can be done using a spray gun or dip coater, ensuring that the varnish layer 3 is evenly applied to the surface of the flat material.

[0044] S3. Perform the first cutting on the surface of the flat material after the first painting. Cut several horizontal grooves of the second preset size according to the first preset spacing.

[0045] Specifically, an abrasive wheel cutter can be used as the cutting tool, and the cutting parameters need to be precisely controlled to ensure cutting quality and efficiency. In the actual implementation process, the second preset dimension is 80mm in length, 0.5mm in width, and 0.4mm in depth.

[0046] S4. Perform the first electroplating on the several transverse grooves cut out in the first cut to obtain several electroplating tanks 4.

[0047] Specifically, electroplating can be performed using direct current electroplating or pulse electroplating to improve the quality and uniformity of electroplating tank 4. In the specific implementation process, the electroplating process can be divided into several stages. First, a copper layer with a thickness of 0.005 mm is electroplated, then a nickel layer with a thickness of 0.003 mm is electroplated, and finally a tin layer with a thickness of 0.01 mm is electroplated.

[0048] S5. Fill the upper surface of the flat plate material after the first electroplating with pre-made powder and press it for the second time to form a third preset size sealing layer on the upper surface of the flat plate material, so as to obtain a semi-finished flat plate.

[0049] Specifically, during the pressing and molding process, it is necessary to carefully control the pressure and temperature to ensure the density and stability of the seal layer. In the actual implementation, the third preset dimension is 80mm in length, 60mm in width, and 0.4mm in thickness.

[0050] S6. Apply a second coat of paint to the upper surface of the flat semi-finished product at the third preset interval to form several paint stripes on the upper surface of the semi-finished product.

[0051] Specifically, the method for the second painting is the same as the first painting, but the position and interval of the painting need to be precisely controlled to ensure the uniform distribution and integrity of the paint strips, which will facilitate the subsequent second electroplating process.

[0052] S7. Cut the flat semi-finished product in a cross shape to obtain several semi-finished product blocks of the fourth preset size.

[0053] Specifically, an abrasive wheel cutter can also be used as the cutting tool, and the cutting parameters need to be precisely controlled to ensure cutting quality and efficiency. In the actual implementation process, the fourth preset dimension is 2.5mm in length, 2mm in width, and 1mm in thickness.

[0054] S8. Apply a third coat of paint to the front and back surfaces of several semi-finished blocks.

[0055] Specifically, the method for the third spray painting is the same as the first spray painting, but the spray painting position needs to be precisely controlled to facilitate the subsequent second electroplating process.

[0056] S9. Perform a second electroplating on the unpainted parts of several semi-finished blocks to form an electroplating layer 2 on the outer surface of the block, thus obtaining the finished inductor.

[0057] Specifically, the electroplating process is the same as the fourth step, but the position and area of ​​the electroplating need to be precisely controlled to ensure the uniform distribution and integrity of the electroplated layer 2, so that the electroplated layer 2 and the internal electroplating tank 4 form a passage.

[0058] The implementation principle of this embodiment is as follows: Through the above steps, efficient and low-cost manufacturing of miniature inductors can be achieved. First, pressing and flat die molding ensure the dimensional accuracy and consistency of the inductor. Second, multiple painting and electroplating processes form reliable insulating and conductive layers, improving the electrical performance and reliability of the inductor. Furthermore, precise cutting and assembly enable high-density integration and miniaturization of the inductor, meeting the needs of modern electronic products. The entire manufacturing process is simple and controllable, suitable for large-scale production and application, simplifying the production process of miniature inductors and reducing production costs.

[0059] This application also provides a miniature inductor, which is manufactured using the miniature inductor manufacturing method described above. (Refer to...) Figure 2 and Figure 3 The inductor includes an inductor body 1. The outer surface of the inductor body 1 includes an electroplating layer 2 and a paint layer 3. The electroplating layer 2 is disposed on both sides of the left and right sides and the top surface, and the paint layer 3 is disposed on the front and back sides, the bottom surface, and the middle of the top surface. An electroplating tank 4 extends through the interior of the inductor body 1 from left to right, and the electroplating tank 4 forms a passage with the electroplating layer 2.

[0060] In specific implementation, the miniature inductor provided in this application embodiment has a length of 2.5 mm, a width of 2 mm, and a thickness of 1 mm. The electroplating layer 2 and the electroplating tank 4 include a copper layer with a thickness of 0.005 mm, a nickel layer with a thickness of 0.003 mm, and a tin layer with a thickness of 0.01 mm, which are sequentially electroplated. The varnish layer 3 is an insulating varnish, such as epoxy resin varnish or polyurethane varnish.

[0061] Example 2

[0062] This embodiment provides a method for manufacturing a miniature inductor, which differs from the embodiments described above in that the composition of the pre-filled powder can be adjusted in steps S1 and S5 by adding nanoscale conductive particles, such as carbon nanotubes or graphene, to improve the conductivity and thermal conductivity of the inductor. In practice, 1% to 5% carbon nanotubes or graphene can be added to the pre-filled powder to enhance the conductivity and thermal conductivity of the inductor. During the filling process, it is necessary to ensure the uniform distribution of the conductive particles, which can be achieved through stirring or ultrasonic dispersion.

[0063] The implementation principle of this embodiment is as follows: by adding nanoscale conductive particles to the pre-formed powder, the conductivity and thermal conductivity of the inductor can be significantly improved. Carbon nanotubes and graphene have excellent electrical and thermal conductivity, which can effectively reduce the resistance and temperature rise of the inductor, improving its operating efficiency and stability. Furthermore, the nanoscale conductive particles can also enhance the mechanical strength and durability of the inductor, enabling it to maintain good performance even in harsh environments. This structure is particularly suitable for high-power and high-temperature applications, effectively extending the inductor's lifespan and reliability.

[0064] Example 3

[0065] This embodiment provides a method for manufacturing a miniature inductor, which differs from the embodiments described above in that, in step S8, laser painting can be used instead of a traditional spraying machine or dip coating machine. Laser painting allows for more precise control of the painting position and thickness, improving the painting quality. In practice, a laser painting machine can be used, with appropriate laser power and scanning speed set to ensure the uniformity and integrity of the paint layer 3. Laser painting can be used for the first, second, and third painting stages, and its advantages are particularly evident for complex geometries and small-sized components.

[0066] The implementation principle of this embodiment is as follows: By employing laser painting, more precise control over the painting position and thickness can be achieved, improving the painting quality. Laser painting can avoid problems such as uneven paint layer and inconsistent thickness caused by traditional spraying or dipping machines, ensuring the reliability and stability of the insulation layer. Furthermore, laser painting can reduce material waste and environmental pollution during the painting process, improving production efficiency and environmental performance. This technology is particularly suitable for applications requiring high precision and high quality, and can effectively improve the performance and reliability of inductors.

[0067] Example 4

[0068] This embodiment provides a method for manufacturing a miniature inductor, which differs from the previous embodiment in that: in step S9, micro-arc oxidation technology can be used instead of traditional electroplating technology to form a more uniform and dense electroplated layer 2. Micro-arc oxidation technology can generate a ceramic film on the inductor surface, which has excellent wear resistance and corrosion resistance. In specific implementation, the semi-finished inductor block can be placed in a micro-arc oxidation electrolyte, and appropriate voltage and current are set to generate a ceramic film on the inductor surface through micro-arc discharge. The thickness of the ceramic film can be set to 0.01mm~0.05mm to ensure the conductivity and mechanical strength of the inductor.

[0069] The implementation principle of this embodiment is as follows: By employing micro-arc oxidation technology, a more uniform and dense electroplated layer 2 can be formed, improving the conductivity and mechanical strength of the inductor. The ceramic film generated by micro-arc oxidation technology has excellent wear resistance and corrosion resistance, effectively protecting the inductor from the influence of the external environment and extending its service life. Furthermore, micro-arc oxidation technology can also improve the thermal conductivity of the inductor, reduce operating temperature, and improve operating efficiency and stability. This technology is particularly suitable for applications requiring high performance and long lifespan, effectively enhancing the overall performance and market competitiveness of the inductor.

[0070] The examples of this specific embodiment are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Identical components are represented by the same reference numerals. Therefore, any equivalent changes made based on the structure, shape, and principle of this application should be included in the scope of protection of this application.

Claims

1. A method for manufacturing a miniature inductor, characterized in that, include: The pre-made powder is loaded into a flat mold of the first preset size for the first pressing and forming to obtain a flat raw material; The six sides of the flat material are painted for the first time; The surface of the flat material after the first painting is cut for the first time, and several horizontal grooves of the second preset size are cut out according to the first preset spacing. The first electroplating is performed on the several transverse grooves cut out in the first cut, resulting in several electroplating tanks; The surface of the flat plate material after the first electroplating is filled with pre-made powder and then pressed and shaped a second time, so that the pre-made powder forms a third preset size sealing layer on the surface of the flat plate material, and a semi-finished flat plate is obtained. The upper surface of the flat semi-finished product is sprayed with paint a second time at a third preset interval, forming several paint stripes on the upper surface of the semi-finished product; The flat semi-finished product is cut in a cross shape to obtain several semi-finished product blocks of the fourth preset size; The front and back surfaces of several semi-finished blocks are painted a third time. A second electroplating process is performed on the unpainted parts of several semi-finished blocks to form an electroplating layer on the outer surface of the blocks, thus obtaining the finished inductor. The first preset dimension has a length of 80mm, a width of 60mm, and a thickness of 0.6mm; The second preset dimension has a length of 80mm, a width of 0.5mm, and a depth of 0.4mm; The third preset dimension has a length of 80mm, a width of 60mm, and a thickness of 0.4mm; The fourth preset dimension has a length of 2.5mm, a width of 2mm, and a thickness of 1mm.

2. The method for manufacturing a miniature inductor according to claim 1, characterized in that, The first electroplating process includes sequentially electroplating a copper layer, a nickel layer, and a tin layer.

3. The method for manufacturing a miniature inductor according to claim 2, characterized in that, The copper layer has a thickness of 0.005 mm, the nickel layer has a thickness of 0.003 mm, and the tin layer has a thickness of 0.01 mm.

4. A method for manufacturing a miniature inductor according to any one of claims 1-3, characterized in that, The first and second cuts were made using an abrasive wheel cutter.

5. A method for manufacturing a miniature inductor according to any one of claims 1-3, characterized in that, The first, second, and third coats of paint were all applied using insulating varnish.

6. A miniature inductor, characterized in that, The inductor is manufactured by a method for manufacturing a miniature inductor according to any one of claims 1-5; The inductor includes an inductor body (1), the outer surface of which includes an electroplating layer (2) and a paint layer (3). The electroplating layer (2) is disposed on both sides of the left and right sides and the top surface, and the paint layer (3) is disposed on the front and back sides, the bottom surface and the middle of the top surface. The inductor body (1) has an electroplating tank (4) running through its interior on both sides, and the electroplating tank (4) and the electroplating layer (2) form a passage.

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