A die bonder

Abstract

The present invention relates to a die bonder, which includes a frame, a loading module, a dispensing module, a die bonding module, a feeding module, a unloading module, a conveying module and a controller. The controller is configured to: when the real-time pressure value acquired by the pressure control member exceeds a preset pressure threshold, control the moving component and the suction head to stop moving; when the position of the wafer on the suction head acquired by the detection component exceeds the first preset position range, control the adjustment component to drive the suction head to rotate to adjust the position of the wafer. Due to the provision of the adjustment component and the detection component, if it is found that the position of the wafer deviates, the controller controls the adjustment component to adjust the angular position of the wafer to make it straight. In addition, due to the provision of the moving component and the pressure control member, the pressure of the suction head is controlled by the pressure control member. When the pressing force of the suction head on the wafer exceeds the preset pressure threshold, the controller will control the moving component and the suction head to stop moving, avoiding the problem of damage or breakage of the wafer surface caused by excessive pressure.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production equipment, and in particular to a crystal bonding machine. Background Art

[0002] A die bonder is a mechanical device for fixing crystals and semiconductor packaging. It can transfer and bond the wafer on the blue film to the substrate to complete chip mounting. It is widely used in the production of LED direct display screens, semiconductor discrete devices, DIP and SOP and other products.

[0003] Existing die bonding machines usually include a frame, a loading device, a wafer feeding device, a dispensing device, a die bonding device, a transfer device and a unloading device. When the existing transfer device grabs the wafer, residual vibration will be generated due to inertia when the transfer device moves rapidly, which may cause the wafer angle to change, or the viscosity of the blue film used is too high, which will generate additional resistance when sucking or releasing the wafer, resulting in deviation in the wafer position. On the other hand, in order to make the wafer and the substrate fit more closely during the die bonding process, pressure is usually required to be applied. However, since the wafer is a brittle material, the pressure is not controlled during the pressure application process, resulting in damage or even breakage of the wafer surface. Summary of the Invention

[0004] The purpose of the present invention is to provide a crystal bonding machine, which aims to solve the technical problems of the existing crystal bonding machine in that the angle position of the wafer is offset during the crystal bonding process, and the wafer surface is easily damaged or even broken due to uncontrolled pressure.

[0005] In order to solve the above technical problems, a die bonding machine is provided, comprising:

[0006] The frame includes the loading position, glue dispensing position, crystal bonding position and unloading position arranged in sequence;

[0007] A loading module is arranged at the loading position to load the substrate;

[0008] A glue dispensing module is arranged at the glue dispensing position to dispense glue to the substrate;

[0009] A die bonding module, comprising a pickup assembly, a correction assembly, and a moving assembly. The moving assembly is disposed at the die bonding position, and the pickup assembly and the correction assembly are both mounted on the moving assembly. The pickup assembly comprises an adsorption head and a pressure control component. The correction assembly comprises a detection component and an adjustment component. The detection component is disposed beside the die bonding position, and the adjustment component is in transmission connection with the adsorption head.

[0010] a feeding module, arranged on the frame to provide wafers;

[0011] The blanking module is arranged at the blanking position to blank the finished products.

[0012] The conveying module is arranged on the rack to sequentially transfer the substrate to the loading position, the dispensing position, the die bonding position and the blanking position.

[0013] The controller is electrically connected to the moving component, the pressure control component, the detection component and the adjustment component respectively. The controller is configured to: when the real-time pressure value obtained by the pressure control component exceeds the preset pressure threshold, control the moving component and the suction head to stop moving; when the position of the wafer on the suction head obtained by the detection component exceeds the first preset position range, control the adjustment component to drive the suction head to rotate to adjust the position of the wafer.

[0014] Further, the picking component further includes a mounting frame, an upper flexible member, a lower flexible member and a first elastic member. The upper flexible member, the lower flexible member and the pressure control component are all connected to the mounting frame. One end of the suction head is connected to the upper flexible member, and the other end is connected to the lower flexible member. The upper flexible member and the lower flexible member are configured to: allow the suction head to generate an offset in the Z-axis direction. The first elastic member is arranged between the upper flexible member and the mounting frame.

[0015] Further, the adjustment component includes a calibration motor, a driving wheel, a driven wheel and a first belt. The calibration motor is connected to the mounting frame, the calibration motor is connected to the driving wheel, the driven wheel is connected to the suction head, and the driving wheel and the driven wheel are coupled by the first belt.

[0016] Further, the die bonder further includes a thimble module. The thimble module includes a housing, a thimble, a driving member and a linear bearing. The driving member is arranged in the housing. The driving member is connected to the thimble to drive the thimble to reciprocate linearly. The housing includes a first channel, a second channel, a ventilation port, a suction port and a puncture port. The first channel is nested in the second channel. The ventilation port and the suction port are both communicated with the second channel. The puncture port is communicated with the first channel. The linear bearing is arranged in the first channel. The thimble is slidably arranged in the linear bearing.

[0017] Further, the thimble module further includes a first sealing ring and a second sealing ring. The first sealing ring is arranged near the ventilation port. The second sealing ring is arranged between the thimble and the first channel.

[0018] Further, the feeding module includes a rotating component and a tray component. The rotating component is coupled to the tray component. The die bonder further includes a detection module. The controller is electrically connected to the detection module and the rotating component respectively. The controller is further configured to: when the position of the wafer on the tray component obtained by the detection module exceeds the second preset position range, control the rotating component to drive the tray component to rotate to adjust the position of the wafer.

[0019] Further, the feeding module further includes a feeding moving platform and a locking component. The feeding moving platform is mounted on the frame. The tray component includes a wafer tray and a gear ring nested outside the wafer tray. The rotating component includes a rotating motor, a pulley and a second belt. The rotating motor is mounted on the feeding moving platform. The rotating motor is connected to the pulley. The pulley and the gear ring are coupled by the second belt. The locking component includes a telescopic cylinder, a locking member and a torsion spring. The locking member is rotatably connected to the feeding moving platform through the torsion spring to lock the wafer tray. The telescopic cylinder is used to drive the locking member to rotate to unlock the wafer tray.

[0020] Further, the detection module includes a fixing frame, a first vision camera and a second vision camera mounted on the fixing frame. The first vision camera is arranged directly above the die bonding position. The second vision camera is arranged directly above the tray component.

[0021] Further, the loading module includes a main frame, a bracket, an X-axis moving component, a Y-axis moving component and a Z-axis moving component all mounted on the main frame. The bracket is connected to the Z-axis moving component. The bracket is used to carry the cartridge. The unloading module is configured to have the same structure as the loading module.

[0022] Further, the conveying module includes a conveying track, a pressing component and a plurality of transverse moving components all mounted on the conveying track. The pressing component is configured to be able to reciprocate along the Z-axis direction to fix or release the substrate. The plurality of transverse moving components are configured to reciprocate along the X-axis direction within their respective stroke ranges, and the stroke ranges of each transverse moving component do not overlap; and / or,

[0023] The dispensing module includes a three-axis driving component, a dispensing member and a third vision camera. The dispensing member and the third vision camera are both mounted on the three-axis driving component. The three-axis driving component is used to drive the dispensing member and the third vision camera to move along the X-axis direction, Y-axis direction and Z-axis direction.

[0024] Implementing the embodiments of the present invention will have the following beneficial effects:

[0025] In the die bonder of this embodiment, due to the provision of an adjustment component and a detection component, after the suction head picks up the wafer from the feeding module and transfers it to directly above the detection component, it checks whether the wafer is damaged and whether the position of the wafer is properly aligned. If it is found that the position of the wafer is deviated, the controller controls the adjustment component to adjust the angular position of the wafer to make it properly aligned. In addition, due to the provision of a moving component and a pressure control component, when the suction head presses the wafer, the pressure control component controls the pressure magnitude of the suction head. When the pressing force of the suction head on the wafer exceeds the preset pressure threshold, the controller will control the moving component and the suction head to stop moving, so as to ensure that the pressure exerted by the suction head on the wafer will not be too large, and avoid problems such as damage or fragmentation on the surface of the wafer caused by excessive pressure. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 is a schematic three-dimensional structure diagram of the die bonder according to the embodiment of the present invention;

[0028] Figure 2 is a top view of the die bonder according to the embodiment of the present invention;

[0029] [[ID=Z17]] Figure 3 is a schematic three-dimensional structure diagram of the die bonding module according to the embodiment of the present invention;

[0030] Figure 4 is a schematic structure diagram of the combination of the picking component and the calibration component according to the embodiment of the present invention;

[0031] Figure 5 is a front view of the combination of the picking component and the calibration component according to the embodiment of the present invention;

[0032] Figure 6 is a schematic structure diagram of the picking component according to Embodiment 1 of the present invention;

[0033] Figure 7 is a schematic structure diagram of the picking component according to Embodiment 2 of the present invention;

[0034] Figure 8 is a schematic structure diagram of the ejector pin module according to the embodiment of the present invention;

[0035] Figure 9 is Figure 8 a partial enlarged schematic diagram of part A in

[0036] Figure 10 A cross-sectional view of the ejector pin module according to an embodiment of the present invention;

[0037] Figure 11 A schematic structural diagram of the feeding module according to an embodiment of the present invention;

[0038] Figure 12 A front view of the feeding module according to an embodiment of the present invention;

[0039] Figure 13 A schematic structural diagram of the loading module according to an embodiment of the present invention;

[0040] Figure 14 A schematic structural diagram of the loading module with some parts removed according to an embodiment of the present invention;

[0041] Figure 15 A schematic structural diagram of the conveying module according to an embodiment of the present invention;

[0042] Figure 16 A schematic structural diagram of the dispensing module according to an embodiment of the present invention;

[0043] Figure 17 A control schematic diagram of the die bonder according to an embodiment of the present invention.

[0044] Wherein: 100, die bonder; 110, frame; 111, loading position; 112, dispensing position; 113, die bonding position; 114, unloading position; 120, loading module; 121, main body frame; 122, bracket; 123, X-axis moving component; 124, Y-axis moving component; 125, Z-axis moving component; 130, dispensing module; 131, three-axis driving component; 132, dispensing part; 133, third vision camera; 140, die bonding module; 141, picking component; 1411, suction head; 1412, pressure control part; 1413, mounting bracket; 1414, upper flexible part; 1415, lower flexible part; 1416, first elastic part; 1417, first fixing block; 1418, second fixing block; 142, calibration component; 1421, detection part; 1422, adjustment part; 1422A, calibration motor; 1422B, driving pulley; 1422C, driven pulley; 1422D, first belt; 143, moving component; 150, feeding module; 151, rotating component; 1511, rotating motor; 1512, pulley; 1513, second belt; 152, tray component; 1521, wafer tray; 1522, gear ring part; 153, feeding moving platform; 154, locking component; 1541, telescopic cylinder; 1542, locking part; 160, unloading module; 170, conveying module; 171, conveying track; 172, pressing component; 173, transverse moving component; 180, controller; 190, ejector pin module; 191, housing; 1911, first channel; 1912, second channel; 1913, ventilation port; 1914, suction port; 1915, puncture port; 1916, first sealing ring; 1917, second sealing ring; 192, ejector pin; 193, driving part; 194, linear bearing; 200, detection module; 201, fixing bracket; 202, first vision camera; 203, second vision camera; 300, fixture. Detailed implementation manners

[0045] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this invention belongs. The terms used in the description of the present invention herein are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0048] Please refer to Figures 1 - 17, an embodiment of the present invention provides a die bonder 100, which includes a frame 110, a loading module 120, a dispensing module 130, a die bonding module 140, a feeding module 150, a discharging module 160, a conveying module 170, and a controller 180. The frame 110 includes a loading position 111, a dispensing position 112, a die bonding position 113, and a discharging position 114 arranged in sequence. The loading module 120 is arranged at the loading position 111 to load the substrate. The dispensing module 130 is arranged at the dispensing position 112 to dispense glue on the substrate. The die bonding module 140 includes a picking component 141, a calibration component 142, and a moving component 143. The moving component 143 is arranged at the die bonding position 113. Both the picking component 141 and the calibration component 142 are installed on the moving component 143. The picking component 141 includes a suction head 1411 and a pressure control member 1412. The calibration component 142 includes a detection member 1421 and an adjustment member 1422. The detection member 1421 is arranged beside the die bonding position 113. The adjustment member 1422 is in transmission connection with the suction head 1411. The feeding module 150 is arranged on the frame 110 to provide wafers. The discharging module 160 is arranged at the discharging position 114 to discharge the finished products. The conveying module 170 is arranged on the frame 110 to sequentially transfer the substrate to the loading position 111, the dispensing position 112, the die bonding position 113, and the discharging position 114. The controller 180 is electrically connected to the moving component 143, the pressure control member 1412, the detection member 1421, and the adjustment member 1422 respectively. The controller 180 is configured to: when the real-time pressure value obtained by the pressure control member 1412 exceeds the preset pressure threshold, control the moving component 143 and the suction head 1411 to stop moving; when the position of the wafer on the suction head 1411 obtained by the detection member 1421 exceeds the first preset position range, control the adjustment member 1422 to drive the suction head 1411 to rotate to adjust the position of the wafer. Exemplarily, the loading position 111, the dispensing position 112, the die bonding position 113, and the discharging position 114 are arranged in sequence along the X-axis direction. The first preset position range is the allowable angular deviation range of the wafer. The specific numerical ranges of the preset pressure threshold and the first preset position range can be set by the user according to actual needs, and no excessive limitation is made here. The detection member 1421 uses a CCD vision camera. On the one hand, the detection member 1421 can detect the position and placement angle of the wafer sucked by the suction head 1411. When the position of the wafer is deviated, the position of the wafer is adjusted by the adjustment member 1422. On the other hand, the detection member 1421 can also check whether the wafer sucked by the suction head 1411 is damaged. The above-mentioned finished product refers to the product formed after the wafer is fixed on the substrate. The moving component 143 can drive the picking component 141 to move in three directions: the X-axis direction, the Y-axis direction, and the Z-axis direction.

[0049] In this embodiment, the pressure control member 1412 uses a voice coil motor, which can achieve precise position control at the micron level and fast response at the millisecond level. This fast response ability enables the voice coil motor to quickly adjust the pressing force to meet different die bonding requirements. The voice coil motor can adjust the output pressure by changing the magnitude of the current. This allows the voice coil motor to provide an appropriate pressing force according to different wafer materials and thicknesses, avoiding wafer damage caused by excessive pressure. The voice coil motor has precise position control capabilities and can achieve precise pick-and-place position control. This helps to ensure the stability of the wafer during the die bonding process and reduce the risk of fragmentation. Among them, in another embodiment, the pressure control member 1412 can also use a pressure sensor. The pressure sensor is arranged at the end of the suction head 1411, specifically at the position where the suction head 1411 contacts the wafer, and can directly detect the pressure exerted by the suction head 1411 on the wafer.

[0050] In the die bonder 100 of this embodiment, due to the setting of the adjustment component 1422 and the detection component 1421, after the suction head 1411 sucks the wafer from the feeding module 150 and is transferred to directly above the detection component 1421, it checks whether the wafer is damaged and whether the position of the wafer is properly aligned. If it is found that the position of the wafer is deviated, the controller 180 controls the adjustment component 1422 to adjust the angular position of the wafer to make it properly aligned. In addition, due to the setting of the moving assembly 143 and the pressure control member 1412, when the suction head 1411 presses the wafer, the pressure control member 1412 controls the magnitude of the pressure of the suction head 1411. When the pressing force of the suction head 1411 on the wafer exceeds the preset pressure threshold, the controller 180 controls the moving assembly 143 and the suction head 1411 to stop moving, so as to ensure that the pressure exerted by the suction head 1411 on the wafer will not be too large and avoid problems such as surface damage or fragmentation of the wafer caused by excessive pressure.

[0051] Please refer to Figure 4 、 Figure 5 and Figure 6, in a possible implementation, the picking component 141 further includes a mounting bracket 1413, an upper flexible member 1414, a lower flexible member 1415, and a first elastic member 1416. The upper flexible member 1414, the lower flexible member 1415, and the pressure control member 1412 are all connected to the mounting bracket 1413. One end of the suction head 1411 is connected to the upper flexible member 1414, and the other end is connected to the lower flexible member 1415. The upper flexible member 1414 and the lower flexible member 1415 are configured to allow the suction head 1411 to deflect in the Z-axis direction. The first elastic member 1416 is disposed between the upper flexible member 1414 and the mounting bracket 1413. Exemplarily, in this embodiment, the picking component 141 further includes a fixing block. The upper flexible member 1414 and the lower flexible member 1415 are both made of flexible materials and can undergo elastic deformation. The fixing block fixes the upper flexible member 1414 and the lower flexible member 1415 to the mounting bracket 1413, and at the same time fixes the two flexible members on the upper side of the suction head 1411, and sets the lengths of the upper flexible member 1414 and the lower flexible member 1415 to be the same. That is to say, the distance between the suction head 1411 and the fixing block for fixing the upper flexible member 1414 is equal to the distance between the suction head 1411 and the fixing block for fixing the lower flexible member 1415. When the suction head 1411 presses down on the wafer, when the suction head 1411 undergoes a slight deformation, the upper flexible member 1414 and the lower flexible member 1415 with the same length have the same amount of deformation. Therefore, it can ensure that the suction head 1411 is always in a vertical state, avoid the suction head 1411 from deflecting in the horizontal direction, and make the pressure exerted by the suction head 1411 on the wafer always uniform, which is beneficial to avoiding damage or cracking of the wafer surface. In addition, the first elastic member 1416 is a compression spring. When the suction head 1411 exerts pressure on the wafer, through the cooperation of the upper flexible member 1414, the lower flexible member 1415, and the first elastic member 1416, it plays a buffering role, which is beneficial to reducing the impact force of the suction head 1411 on the wafer and avoiding damage or cracking of the wafer surface.

[0052] Please refer to Figure 7 , in another embodiment, the upper flexible member 1414 and the lower flexible member 1415 can also be made of rigid materials. At the same time, one end of the upper flexible member 1414 is rotatably connected to the first fixing block 1417, and the other end is rotatably connected to the suction head member. One end of the lower flexible member 1415 is rotatably connected to the second fixing block 1418, and the other end is rotatably connected to the suction head member. It can be understood that the upper flexible member 1414, the lower flexible member 1415, the fixing block, and the suction head member form a deformable parallelogram. Among them, the first fixing block 1417 and the second fixing block 1418 are fixed, and during the up and down movement of the suction head member, the suction head member is always kept in a vertical state, avoiding the suction head 1411 from deflecting in the horizontal direction, and making the pressure exerted by the suction head 1411 on the wafer always uniform, which is beneficial to avoiding damage or cracking of the wafer surface.

[0053] Please refer to Figure 4 、 Figure 5 and Figure 6 , in a possible implementation, the adjustment component 1422 includes a calibration motor 1422A, a driving pulley 1422B, a driven pulley 1422C, and a first belt 1422D. The calibration motor 1422A is connected to the mounting bracket 1413, the calibration motor 1422A is connected to the driving pulley 1422B, the driven pulley 1422C is connected to the suction head 1411, and the driving pulley 1422B and the driven pulley 1422C are coupled by the first belt 1422D. Exemplarily, in this embodiment, the adjustment component 1422 uses a belt drive mechanism. From the first aspect, the belt drive mechanism can provide higher control accuracy, which is beneficial to improving the positioning accuracy of the wafer. From the second aspect, the belt drive mechanism has the characteristic of smooth transmission, which can reduce the wafer position deviation caused by mechanical vibration or impact, and is beneficial to further improving the accuracy of adjusting the angular position of the wafer. From the third aspect, using the belt drive mechanism can place the calibration motor 1422A beside the suction head 1411, and the picking component 141 can generate flexible deformation, which not only does not affect the operation of the adjustment component 1422, but also can save the installation space of the adjustment component 1422.

[0054] Please refer to Figure 8 、 Figure 9 and Figure 10In a possible embodiment, the crystal bonding machine 100 further includes a pin module 190, which includes a housing 191, a pin 192, a driving member 193 and a linear bearing 194. The driving member 193 is disposed in the housing 191, and the driving member 193 is connected to the pin 192 to drive the pin 192 to reciprocate along a straight line. The housing 191 includes a first channel 1911, a second channel 1912, a vent 1913, a suction port 1914 and a puncture port 1915. The first channel 1911 is nested in the second channel 1912, the vent 1913 and the suction port 1914 are both connected to the second channel 1912, the puncture port 1915 is connected to the first channel 1911, the linear bearing 194 is disposed in the first channel 1911, and the pin 192 is slidably disposed in the linear bearing 194. For example, the cross-section of the first channel 1911 is roughly circular, and the cross-section of the second channel 1912 is roughly annular. A vacuum pump (not shown) is connected to the second channel 1912 through the vent 1913, and the drive member 193 is used to drive the ejector pin 192 to move along the Z-axis. The linear bearing 194 has high precision and can provide precise positioning and guidance for the ejector pin 192 during the up and down sliding process. At the same time, it can reduce the friction between the ejector pin 192 and the linear bearing 194, which helps to reduce the wear of the ejector pin 192 and extend the service life of the ejector pin 192. The working principle of the ejector pin module 190 is as follows: The wafer is attached to the blue film. When the wafer needs to be removed, the vacuum pump is started, and the suction port 1914 absorbs the blue film, fixing the blue film. At this time, the drive member 193 drives the ejector pin 192 to rise and pass the ejector pin 192 through the puncture port 1915, thereby ejecting the wafer and separating it from the blue film.

[0055] Please refer to Figure 8 、 Figure 9 and Figure 10 In one possible embodiment, the ejector module 190 further includes a first sealing ring 1916 and a second sealing ring 1917. The first sealing ring 1916 is arranged near the vent 1913, and the second sealing ring 1917 is arranged between the ejector 192 and the first channel 1911. For example, in this embodiment, the first sealing ring 1916 is arranged near the vent 1913 to prevent gas leakage. It ensures that no gas leakage occurs during the sliding process of the ejector 192 through close contact with the ejector 192 and the housing 191. The second sealing ring 1917 is arranged between the ejector 192 and the first channel 1911 through the upper abutment portion, which plays a further sealing role. Together with the first sealing ring 1916, it ensures good sealing of the ejector 192 during the sliding process.

[0056] Please refer to Figure 11 and Figure 12, in a possible implementation, the feeding module 150 includes a rotating component 151 and a tray component 152. The rotating component 151 is coupled to the tray component 152. The die bonder 100 further includes a detection module 200. The controller 180 is electrically connected to the detection module 200 and the rotating component 151 respectively. The controller 180 is further configured to: when the wafer position on the tray component 152 obtained by the detection module 200 exceeds the second preset position range, control the rotating component 151 to drive the tray component 152 to rotate to adjust the position of the wafer. Exemplarily, the second preset position range is also the allowable angular deviation range of the wafer, and the specific numerical range can be set by the user according to actual needs, and no excessive limitation is made here. In this embodiment, the angular position of the wafer on the tray component 152 is corrected for the first time by the detection module 200, and the angular position of the wafer adsorbed on the suction head 1411 is corrected for the second time by the detection component 1421. The angular position of the wafer on the tray component 152 is adjusted as a whole macroscopically by the detection module 200, and the angular position of the wafer on the suction head 1411 is adjusted microscopically by the detection component 1421. Since the detection component 1421 and the detection module 200 are provided to correct the position of the wafer twice, the deviation of the wafer position can be effectively reduced, which is beneficial to improving the stability and accuracy of the wafer during the die bonding process. Through precise positioning and stable process control, it can be ensured that the wafer is subjected to uniform pressure during the die bonding process, thereby improving the quality and consistency of the chip.

[0057] Please refer to Figure 11 and Figure 12, in a possible implementation, the feeding module 150 further includes a feeding moving platform 153 and a locking component 154. The feeding moving platform 153 is installed on the frame 110. The tray assembly 152 includes a wafer tray 1521 and a gear ring member 1522 nested outside the wafer tray 1521. The rotating component 151 includes a rotating motor 1511, a pulley 1512, and a second belt 1513. The rotating motor 1511 is installed on the feeding moving platform 153. The rotating motor 1511 is connected to the pulley 1512. The pulley 1512 and the gear ring member 1522 are coupled and connected through the second belt 1513. The locking component 154 includes a telescopic cylinder 1541, a locking member 1542, and a torsion spring (not shown in the figure). The locking member 1542 is rotatably connected to the feeding moving platform 153 through the torsion spring to lock the wafer tray 1521. The telescopic cylinder 1541 is used to drive the locking member 1542 to rotate to unlock the wafer tray 1521. Exemplarily, there are two locking members 1542 and torsion springs. Under normal conditions, the locking member 1542 holds the wafer tray 1521 under the action of the torsion spring. When the wafer tray 1521 needs to be disassembled, the output shaft of the telescopic cylinder 1541 extends, pushing the locking member 1542 to rotate. The locking member 1542 disengages from the wafer tray 1521. At this time, the user can remove the wafer tray 1521. Subsequently, the output shaft of the telescopic cylinder 1541 retracts, and the pressure exerted by the telescopic cylinder 1541 on the locking member 1542 also disappears. At this time, the locking member 1542 is re-engaged with the wafer tray 1521 under the action of the torsion spring. The feeding moving platform 153 can drive the wafer tray 1521 to move in the X-axis direction and the Y-axis direction. Since the wafers on the blue film are arranged in an array, the position of the wafer tray 1521 is moved by means of the feeding moving platform 153, and the suction head 1411 is used to pick up the wafers in cooperation.

[0058] Please refer to Figure 1 and Figure 2, in a possible implementation, the detection module 200 includes a fixing frame 201, a first vision camera 202 and a second vision camera 203 mounted on the fixing frame 201. The first vision camera 202 is disposed directly above the die bonding position 113, and the second vision camera 203 is disposed directly above the tray assembly 152. Exemplarily, the first vision camera 202 has three functions. The first function is to determine the coordinate system of the die bonder 100. The second function is to check the shape and size of the glue dispensed on the substrate to confirm whether the dispensing meets the standard. The third function is to check the quality of the finished product after the wafer is fixed to the substrate, check whether the wafer on the substrate is damaged or cracked, and whether the angular position of the wafer attached to the substrate is qualified. The second vision camera 203 has three functions. The first function is to determine the coordinate system of the die bonder 100. The second function is to check whether the wafers on the wafer tray 1521 are damaged or cracked, and the defective wafer pick-up head 1411 will not pick them up. The third function is to detect the placement position of the wafer tray 1521. When the position of the wafer tray 1521 is offset, the rotation assembly 151 adjusts the angular position of the wafer tray 1521.

[0059] Please refer to Figure 13 and Figure 14 , in a possible implementation, the loading module 120 includes a main frame 121, a bracket 122, an X-axis moving component 123, a Y-axis moving component 124 and a Z-axis moving component 125 all mounted on the main frame 121. The bracket 122 is connected to the Z-axis moving component 125, and the bracket 122 is used to carry the cassette. The unloading module 160 is configured to have the same structure as the loading module 120. Exemplarily, the cassette is used to carry the fixture 300, and the substrate is placed on the fixture 300. The Y-axis moving component 124 moves the cassette along the Y-axis direction to the bracket 122. Then, the Z-axis moving component 125 drives the cassette to rise (in the Z-axis direction) to the specified position. Subsequently, the X-axis moving component 123 pushes the fixture 300 along the X-axis direction onto the conveying track 171. Specifically, the X-axis moving component 123 uses a telescopic cylinder 1541 or a telescopic motor, the Y-axis moving component 124 uses a belt transmission mechanism, and the Z-axis moving component 125 uses a ball screw structure. In this embodiment, the unloading module 160 uses the same structure as the loading module 120. Of course, as another embodiment, the structure used by the unloading module 160 may also be different from the structure of the loading module 120.

[0060] Please refer to Figure 1 and Figure 15, in a possible implementation, the conveying module 170 includes a conveying track 171, a pressing assembly 172 and a plurality of transverse movement assemblies 173 that are all mounted on the conveying track 171. The pressing assembly 172 is configured to be able to reciprocate along the Z-axis direction to fix or release the substrate. The plurality of transverse movement assemblies 173 are configured to reciprocate along the X-axis direction within their respective stroke ranges, and the stroke ranges of each transverse movement assembly 173 do not overlap. Exemplarily, in this embodiment, three transverse movement assemblies 173 are provided. The first transverse movement assembly 173 reciprocates along the X-axis direction within the stroke range between the loading position 111 and the dispensing position 112. The second transverse movement assembly 173 reciprocates along the X-axis direction within the stroke range between the dispensing position 112 and the die bonding position 113. The third transverse movement assembly 173 reciprocates along the X-axis direction within the stroke range between the die bonding position 113 and the unloading position 114. When dispensing and die bonding are required, the pressing assembly 172 can fix the wafer at the dispensing position 112 and the die bonding position 113 for the dispensing and die bonding processes. The transverse movement assemblies 173 are used to move the wafer sequentially on the conveying track 171.

[0061] Please refer to Figure 1 and Figure 16 , the dispensing module 130 includes a three-axis driving assembly 131, a dispensing member 132 and a third vision camera 133. The dispensing member 132 and the third vision camera 133 are both mounted on the three-axis driving assembly 131. The three-axis driving assembly 131 is used to drive the dispensing member 132 and the third vision camera 133 to move along the X-axis direction, Y-axis direction and Z-axis direction. Exemplarily, it should be noted that in the three-axis driving assembly 131 of the present application, the moving mechanism in the Z-axis direction uses a ball screw structure. When powered off, the dispensing member 132 and the third vision camera 133 will not drop, avoiding the sudden drop of the dispensing member 132 and colliding with the substrate after power off, which is beneficial to protecting the dispensing member 132 and the third vision camera 133. The third vision camera 133 can capture the current position information of the wafer in real time during the die bonding process. Through high-precision image processing technology, the third vision camera 133 can accurately determine whether the wafer has been correctly placed. The setting of the third vision camera 133 improves the stability and accuracy of the dispensing process. Since continuous monitoring and correction can be performed during the movement of the wafer, the wafer position deviation caused by mechanical vibration or improper operation is reduced.

[0062] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent shall be subject to the appended claims.

Claims

1. A die bonder, characterized in that, Comprising: A frame, including a loading position, a dispensing position, a die bonding position, and an unloading position arranged in sequence; A loading module, arranged at the loading position to load a substrate; A dispensing module, arranged at the dispensing position to dispense glue on the substrate; A die bonding module, the die bonding module includes a picking component, a correction component, and a moving component, the moving component is arranged at the die bonding position, the picking component and the correction component are both installed on the moving component, the picking component includes a suction head and a pressure control member, the correction component includes a detection component and an adjustment component, the detection component is arranged beside the die bonding position, and the adjustment component is in transmission connection with the suction head; A feeding module, arranged on the frame to provide wafers; An unloading module, arranged at the unloading position to unload the finished products; A conveying module, arranged on the frame to sequentially transfer the substrate to the loading position, the dispensing position, the die bonding position, and the unloading position; A controller, electrically connected to the moving component, the pressure control member, the detection component, and the adjustment component respectively, and the controller is configured to: when the real-time pressure value obtained by the pressure control member exceeds a preset pressure threshold, control the moving component and the suction head to stop moving; when the position of the wafer on the suction head obtained by the detection component exceeds a first preset position range, control the adjustment component to drive the suction head to rotate to adjust the position of the wafer; The picking component further includes a mounting frame, an upper flexible member, a lower flexible member, and a first elastic member, the upper flexible member, the lower flexible member, and the pressure control member are all connected to the mounting frame, one end of the suction head is connected to the upper flexible member, and the other end is connected to the lower flexible member, and the upper flexible member and the lower flexible member are configured to: allow the suction head to generate an offset in the Z-axis direction, and the first elastic member is arranged between the upper flexible member and the mounting frame.

2. The die bonder according to claim 1, wherein The adjustment component includes a correction motor, a driving wheel, a driven wheel, and a first belt, the correction motor is connected to the mounting frame, the correction motor is connected to the driving wheel, the driven wheel is connected to the suction head, and the driving wheel and the driven wheel are coupled by the first belt.

3. The die bonder according to claim 1, wherein The die bonder further includes a thimble module, the thimble module includes a housing, a thimble, a driving member, and a linear bearing, the driving member is arranged in the housing, the driving member is connected to the thimble to drive the thimble to reciprocate linearly, the housing includes a first channel, a second channel, a ventilation port, a suction port, and a puncture port, the first channel is nested in the second channel, the ventilation port and the suction port are both communicated with the second channel, the puncture port is communicated with the first channel, the linear bearing is arranged in the first channel, and the thimble is slidably arranged in the linear bearing.

4. The die bonder according to claim 3, characterized in that, The thimble module further includes a first sealing ring and a second sealing ring, the first sealing ring is arranged close to the ventilation port, and the second sealing ring is arranged between the thimble and the first channel.

5. The die bonder according to claim 1, characterized in that, The feeding module includes a rotating component and a tray component. The rotating component is coupled to the tray component. The die bonder further includes a detection module. The controller is electrically connected to the detection module and the rotating component respectively. The controller is further configured to: when the position of the wafer on the tray component obtained by the detection module exceeds the second preset position range, control the rotating component to drive the tray component to rotate to adjust the position of the wafer.

6. The die bonder according to claim 5, wherein, The feeding module further includes a feeding moving platform and a locking component. The feeding moving platform is installed on the frame. The tray component includes a wafer tray and a gear ring nested outside the wafer tray. The rotating component includes a rotating motor, a belt pulley, and a second belt. The rotating motor is installed on the feeding moving platform. The rotating motor is connected to the belt pulley. The belt pulley and the gear ring are coupled through the second belt. The locking component includes a telescopic cylinder, a locking member, and a torsion spring. The locking member is rotatably connected to the feeding moving platform through the torsion spring to lock the wafer tray. The telescopic cylinder is used to drive the locking member to rotate to unlock the wafer tray.

7. The die bonder according to claim 5, wherein, The detection module includes a fixed frame, a first vision camera and a second vision camera installed on the fixed frame. The first vision camera is arranged directly above the die bonding position. The second vision camera is arranged directly above the tray component.

8. The die bonder according to claim 1, wherein, The loading module includes a main frame, a bracket, an X-axis moving component, a Y-axis moving component and a Z-axis moving component all installed on the main frame. The bracket is connected to the Z-axis moving component. The bracket is used to carry the cartridge. The unloading module is configured to have the same structure as the loading module.

9. The die bonder according to claim 1, wherein The conveying module includes a conveying track, a pressing component and a plurality of transverse moving components all installed on the conveying track. The pressing component is configured to be able to reciprocate in the Z-axis direction to fix or release the substrate. The plurality of transverse moving components are configured to reciprocate in the X-axis direction within their respective stroke ranges, and the stroke ranges of each transverse moving component do not overlap; and / or, The dispensing module includes a three-axis driving component, a dispensing member and a third vision camera. The dispensing member and the third vision camera are both installed on the three-axis driving component. The three-axis driving component is used to drive the dispensing member and the third vision camera to move in the X-axis direction, Y-axis direction and Z-axis direction.

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