Processing method of special-shaped hole of circuit board and circuit board

Abstract

The invention belongs to the technical field of circuit board processing, and discloses a circuit board special-shaped hole processing method and a circuit board. The processing method of the special-shaped hole of the circuit board comprises the following steps: drilling a guide hole in the circuit board, and enabling the guide hole to be positioned in a set hole line of the special-shaped hole; a plurality of buffer holes are drilled in the positions, close to the set hole line, of the circuit board, the buffer holes are all located in the set hole line and located outside the guide hole, and a connecting line formed by sequentially connecting the outer edges of the buffer holes is made to follow the shape of the set hole line; and extending the milling cutter into the guide hole, and turning and milling the circuit board in the set hole line to obtain the special-shaped hole. Burrs and burrs can be reduced through milling of the milling cutter, the hole edge quality of the special-shaped hole is improved, and the machining efficiency can be improved. When the milling cutter performs turn-milling, turn-milling is performed from the inside of the guide hole to the outside, the plurality of buffer holes are drilled in the position close to the set hole line, and the connecting line formed by sequentially connecting the outer edges of the plurality of buffer holes follows the shape of the set hole line, so that the layering quality abnormity of the circuit board can be avoided, and scrapping is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board processing, and in particular to a processing method for special-shaped holes in a circuit board and a circuit board. Background Art

[0002] In order to facilitate the removal of commonly used components, special-shaped holes need to be opened on the circuit board. Figure 1 The small-sized special-shaped hole 100 shown in the figure can be processed by using a drill needle several times, but for Figure 2 The larger-sized special-shaped hole 100 shown requires multiple drillings with a drill needle to drill out the special-shaped hole, resulting in low processing efficiency. In addition, because the hole edge of the special-shaped hole is not completely circular, for larger-sized special-shaped holes, if only a drill needle is used to directly drill multiple holes, there will be quality defects such as burrs and flashes at the hole edges connecting the holes. Therefore, a milling cutter can be used to process the special-shaped holes to solve the problems of low processing efficiency and burrs and flashes at the hole edges. However, since the circuit board is made of stacked multi-layer boards, and has high brittleness and poor bonding strength, the impact force of the milling cutter is large when the milling cutter is cutting, which will cause abnormal delamination quality of the circuit board.

[0003] Therefore, there is an urgent need for a method for processing special-shaped holes in a circuit board and a circuit board to solve the above technical problems. Summary of the invention

[0004] The purpose of the present invention is to provide a method for processing special-shaped holes in a circuit board and a circuit board, which can improve the quality of the edges of the special-shaped holes on the circuit board and improve the processing efficiency, while solving the problem of abnormal delamination quality of the circuit board and avoiding the scrapping of the circuit board.

[0005] To achieve this object, the present invention adopts the following technical solutions:

[0006] On the one hand, a method for processing a special-shaped hole of a circuit board is provided, comprising:

[0007] Drilling a guide hole on the circuit board, and making the guide hole located within the set hole line of the special-shaped hole;

[0008] Drilling a plurality of buffer holes at positions close to the set hole line on the circuit board, so that the plurality of buffer holes are all located within the set hole line and outside the guide hole, and a connecting line formed by sequentially connecting the outer edges of the plurality of buffer holes is in line with the set hole line;

[0009] The milling cutter is extended into the guide hole, and the circuit board located within the set hole line is milled to obtain the special-shaped hole.

[0010] In some possible implementations, the diameter of the guide hole is greater than or equal to the diameter of the milling cutter.

[0011] In some possible implementations, the apertures of the plurality of buffer holes are all greater than or equal to the tool diameter of the milling cutter.

[0012] In some possible implementations, the apertures of the plurality of buffer holes are all the same.

[0013] In some possible implementations, the plurality of buffer holes are distributed at equal intervals.

[0014] In some possible implementations, the special-shaped hole includes two circular holes, one of which is a first hole, a diameter of the first hole is larger than a diameter of the other circular hole, and a center line of the guide hole coincides with a center line of the first hole.

[0015] In some possible implementations, extending the milling cutter into the guide hole and milling the circuit board located within the set hole line to obtain the special-shaped hole includes:

[0016] Extending a rough milling cutter into the guide hole, rough milling the circuit board located within the connection line, and reserving a set thickness relative to the set hole line;

[0017] The reserved portion of the circuit board is fine-milled by a fine milling cutter and milled to the set hole line to obtain the special-shaped hole.

[0018] In some possible embodiments, the distance from the connecting line to the set hole line is greater than or equal to 0.05 mm, and the rough milling cutter is extended into the guide hole, and the circuit board located within the connecting line is rough milled and milled to the connecting line; after milling to the connecting line, the circuit board located outside the connecting line and within the set hole line is fine milled by the fine milling cutter, and milled to the set hole line to obtain the special-shaped hole.

[0019] In some possible embodiments, the connecting line coincides with the set hole line, the rough milling cutter is extended into the guide hole, the circuit board within the set hole line is rough milled, and a set thickness is reserved relative to the set hole line; and the reserved circuit board is fine milled by the fine milling cutter and milled to the set hole line to obtain the special-shaped hole.

[0020] On the other hand, a circuit board is provided, which is manufactured using the method for processing special-shaped holes in a circuit board as described in any of the above schemes.

[0021] Beneficial effects of the present invention:

[0022] The processing method of the special-shaped holes of the circuit board provided by the present invention can reduce the generation of burrs and burrs through milling with a milling cutter, improve the quality of the edge of the special-shaped holes on the circuit board, and improve the processing efficiency. When the milling cutter mills the circuit board located within the set hole line, the milling cutter mills from the inside of the guide hole to the outside, avoiding the milling cutter directly milling downward from the top surface of the circuit board, which causes the circuit board to be delaminated due to the strong impact when the milling cutter teeth rotate, making the delamination quality of the circuit board abnormal. When the milling cutter mills the circuit board along the set hole line trajectory direction, a plurality of buffer holes are drilled at positions close to the set hole line on the circuit board, and the connecting lines formed by sequentially connecting the outer edges of the plurality of buffer holes are in line with the set hole line, which can reduce the impact force of the milling cutter teeth on the circuit board at the set hole line, avoid abnormal delamination quality of the circuit board, and avoid scrapping of the circuit board.

[0023] The present invention also provides a circuit board, wherein each layer of the circuit board has good quality, the hole edge quality is good, and there are fewer flashes and burrs. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of a method for processing a small-sized circuit board special-shaped hole in the prior art;

[0025] Figure 2 It is a schematic diagram of a method for processing special-shaped holes of a circuit board of smaller size in the prior art;

[0026] Figure 3 It is a schematic diagram of the processing method of the circuit board special-shaped hole provided by the present invention.

[0027] In the figure:

[0028] 100. Special-shaped holes;

[0029] 1. Circuit board; 11. Setting hole line; 2. Guide hole; 3. Buffer hole; 4. Connection line. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0031] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0033] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0034] like Figure 3 As shown, the present invention provides a method for processing special-shaped holes in a circuit board, comprising the following steps:

[0035] S1, drilling a guide hole 2 on the circuit board 1, and making the guide hole 2 located within the set hole line 11 of the special-shaped hole 100;

[0036] S2, drilling a plurality of buffer holes 3 near the setting hole line 11 on the circuit board 1, so that the plurality of buffer holes 3 are all located inside the setting hole line 11 and outside the guide hole 2, and the connecting line 4 formed by sequentially connecting the outer edges of the plurality of buffer holes 3 is in line with the setting hole line 11;

[0037] S3, extending the milling cutter into the guide hole 2, and milling the circuit board 1 located within the set hole line 11 to obtain the special-shaped hole 100.

[0038] The processing method of the circuit board special-shaped hole provided by the present invention can reduce the generation of burrs and burrs by milling with a milling cutter, improve the quality of the hole edge of the special-shaped hole 100 on the circuit board 1, and improve the processing efficiency. Since the outer periphery of the drill needle for drilling the guide hole 2 is designed to be relatively smooth, the impact and cutting on the hole edge during the drilling process are smaller, so the guide hole 2 is drilled on the circuit board 1 first. When the milling cutter mills the circuit board 1 located in the set hole line 11, the milling cutter mills from the inside of the guide hole 2 to the outside, avoiding the milling cutter directly milling downward from the top surface of the circuit board 1, which causes the circuit board 1 to be delaminated due to the strong impact when the milling cutter teeth rotate, making the delamination quality of the circuit board 1 abnormal, causing the circuit board 1 to be scrapped. When the milling cutter mills the circuit board 1 along the trajectory direction of the set hole line 11, a plurality of buffer holes 3 are drilled at a position close to the set hole line 11 on the circuit board 1, and the connecting line 4 formed by connecting the outer edges of the plurality of buffer holes 3 in sequence is in line with the set hole line 11, which can reduce the impact force of the milling cutter teeth on the circuit board 1 at the set hole line 11, and avoid the abnormal delamination quality of the circuit board 1.

[0039] Optionally, in this embodiment, the diameter of the guide hole 2 is greater than or equal to the diameter of the milling cutter. With this arrangement, when the milling cutter is inserted into the guide hole 2, it will not interfere with the hole wall of the guide hole 2, and the impact force on the circuit board 1 is small. In addition, when the diameter of the guide hole 2 is equal to the diameter of the milling cutter, the guide hole 2 can position the lower cutting position of the milling cutter. In other embodiments, the diameter of the guide hole 2 is smaller than the diameter of the milling cutter, which can relatively reduce the impact force on the circuit board 1.

[0040] Optionally, the apertures of the plurality of buffer holes 3 are all larger than or equal to the cutter diameter of the milling cutter, that is, among the plurality of buffer holes 3, all the buffer holes 3 are larger than the cutter diameter of the milling cutter, or all the buffer holes 3 are equal to the cutter diameter of the milling cutter, or some of the buffer holes 3 are larger than the cutter diameter of the milling cutter, and other buffer holes 3 are larger than the cutter diameter of the milling cutter. Such a configuration facilitates the milling cutter to enter the buffer hole 3, and can reduce the impact force of the milling cutter on the circuit board 1.

[0041] Optionally, in this embodiment, the apertures of the plurality of buffer holes 3 are all the same. With such a configuration, when the milling cutter mills the circuit board 1 along the direction of the set hole line 11, the force on the milling cutter can be uniform, and the same drill bit can be used to process all the buffer holes 3, which can improve the processing efficiency. Furthermore, the plurality of buffer holes 3 are distributed at equal intervals, which can make the force on the milling cutter more uniform.

[0042] Optionally, in this embodiment, the special-shaped hole 100 includes two circular holes, one of which is a first hole, the diameter of the first hole is larger than the diameter of the other circular hole, and the center line of the guide hole 2 coincides with the center line of the first hole. This arrangement is convenient for providing a processing allowance and avoiding the scrapping of the circuit board 1 due to an operation error.

[0043] Optionally, the milling cutter is extended into the guide hole 2, and the circuit board 1 located within the set hole line 11 is milled to obtain the special-shaped hole 100, specifically:

[0044] S31, extending the rough milling cutter into the guide hole 2, rough milling the circuit board 1 located in the connection line 4, and reserving a set thickness relative to the set hole line 11;

[0045] S32 , fine milling the reserved part of the circuit board 1 by a fine milling cutter, and milling to the set hole line 11 to obtain the special-shaped hole 100 .

[0046] The tool diameter of the rough milling cutter is larger than that of the fine milling cutter. The teeth of the rough milling cutter are coarser, the cutting amount is large, and the tool breakage rate is low, but the impact force on the hole is greater and the hole opening is rougher. The teeth of the fine milling cutter are finer, the cutting amount is small, and the tool breakage rate is higher, but the impact force on the hole is smaller and the hole opening is relatively smoother. The circuit board 1 is first rough milled, and then the reserved part of the circuit board 1 is fine milled. While ensuring the processing efficiency, the burrs and burrs of the hole opening after rough milling can be processed through fine milling, and the impact on the circuit board 1 at the set hole line 11 can be reduced, and the quality of the hole edge of the obtained special-shaped hole 100 can be guaranteed.

[0047] In this embodiment, the distance from the connection line 4 to the set hole line 11 is greater than or equal to 0.05 mm, the rough milling cutter is extended into the guide hole 2, the circuit board 1 located in the connection line 4 is rough milled, and the circuit board 1 is milled to the connection line 4; after milling to the connection line 4, the circuit board 1 located outside the connection line 4 and in the set hole line 11 is finely milled by the fine milling cutter, and the circuit board 1 is milled to the set hole line 11 to obtain the special-shaped hole 100. In this way, the impact force of the rough milling cutter on the circuit board 1 can be avoided by setting a plurality of buffer holes 3, and the quality of the edge of the special-shaped hole 100 can be ensured by the fine milling cutter.

[0048] In other embodiments, the connection line 4 coincides with the set hole line 11, and the rough milling cutter is extended into the guide hole 2 to rough mill the circuit board 1 located in the set hole line 11, and a set thickness is reserved relative to the set hole line 11; and the reserved circuit board 1 is finely milled by the fine milling cutter, and milled to the set hole line 11 to obtain the special-shaped hole 100. In this way, the impact force of the rough milling cutter and the fine milling cutter on the circuit board 1 can be avoided by setting a plurality of buffer holes 3, and the fine milling cutter can process the flash and burrs on the edge of the special-shaped hole 100.

[0049] The present invention also provides a circuit board, which is manufactured by using the above-mentioned processing method for processing special-shaped holes in a circuit board. The quality of each layer of the circuit board 1 is good, and the quality of the hole edge is good, with less flash and burrs.

[0050] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A method for processing special-shaped holes in a circuit board, characterized in that: include: Drilling a guide hole (2) on the circuit board (1), and making the guide hole (2) located within a set hole line (11) of the special-shaped hole (100); Drilling a plurality of buffer holes (3) at positions close to the setting hole line (11) on the circuit board (1), so that the plurality of buffer holes (3) are all located inside the setting hole line (11) and outside the guide hole (2), and a connecting line (4) formed by sequentially connecting the outer edges of the plurality of buffer holes (3) is in line with the setting hole line (11); The milling cutter is extended into the guide hole (2), and the circuit board (1) located within the set hole line (11) is milled to obtain the special-shaped hole (100).

2. The method for processing special-shaped holes in a circuit board according to claim 1, characterized in that: The diameter of the guide hole (2) is greater than or equal to the diameter of the milling cutter.

3. The method for processing special-shaped holes in a circuit board according to claim 1, characterized in that: The diameters of the plurality of buffer holes (3) are all greater than or equal to the diameter of the milling cutter.

4. The method for processing special-shaped holes in a circuit board according to claim 1, characterized in that: The apertures of the plurality of buffer holes (3) are all the same.

5. The method for processing special-shaped holes in a circuit board according to claim 4, characterized in that: The plurality of buffer holes (3) are distributed at equal intervals.

6. The method for processing special-shaped holes in a circuit board according to claim 1, characterized in that: The special-shaped hole (100) comprises two circular holes, one of which is a first hole, the diameter of the first hole is larger than the diameter of the other circular hole, and the center line of the guide hole (2) coincides with the center line of the first hole.

7. The method for processing special-shaped holes in a circuit board according to any one of claims 1 to 6, characterized in that: Extending the milling cutter into the guide hole (2) and milling the circuit board (1) located within the set hole line (11) to obtain the special-shaped hole (100) comprises: Extending a rough milling cutter into the guide hole (2), rough milling the circuit board (1) located within the connection line (4), and reserving a set thickness relative to the set hole line (11); The reserved portion of the circuit board (1) is fine-milled by a fine milling cutter and milled to the set hole line (11) to obtain the special-shaped hole (100).

8. The method for processing special-shaped holes in a circuit board according to claim 7, characterized in that: The distance between the connecting line (4) and the set hole line (11) is greater than or equal to 0.05 mm, the rough milling cutter is extended into the guide hole (2), the circuit board (1) located within the connecting line (4) is rough milled, and the circuit board (1) is milled to the connecting line (4); after milling to the connecting line (4), the circuit board (1) located outside the connecting line (4) and within the set hole line (11) is fine milled by the fine milling cutter, and the circuit board (1) is milled to the set hole line (11), so as to obtain the special-shaped hole (100).

9. The method for processing special-shaped holes in a circuit board according to claim 7, characterized in that: The connecting line (4) coincides with the set hole line (11), the rough milling cutter is extended into the guide hole (2), the circuit board (1) located within the set hole line (11) is rough milled, and a set thickness is reserved relative to the set hole line (11); and the reserved circuit board (1) is fine milled by the fine milling cutter and milled to the set hole line (11) to obtain the special-shaped hole (100).

10. A circuit board, characterized in that: The circuit board (1) is manufactured using the method for processing special-shaped holes in a circuit board as described in any one of claims 1 to 9.

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