Copper filling device and method for PCB (Printed Circuit Board)

Abstract

The invention discloses a PCB copper filling device and method, and the device comprises a copper cylinder, the top of which is provided with an electroplating bath for copper filling; and the floating table is arranged in the electroplating bath, one side of the floating table is concaved inwards to form a containing opening used for containing a PCB, and the interior of the containing opening is connected with a bubble removing assembly. The invention relates to the field of PCBs. According to the copper filling device and method for the PCB, through the arranged bubble removing assembly, the PCB can horizontally sink into the electrolytic bath, the outer wall of the PCB is infiltrated by electrolyte, the electrolyte climbs along the hole walls of the micropores, air in the micropores is squeezed out, the bubble removing effect is achieved, and the copper filling efficiency is improved. And meanwhile, the pressure generated when the PCB is in contact with the copper-containing electrolyte is used for driving the vibration table to move upwards, so that the vibration block vibrates, the PCB vibrates in the upward moving process, the liquid tension on the surface of the PCB is changed, the stress condition of bubbles is changed, the effect of removing the bubbles through vibration is achieved, and the bubble removing effect is further improved.

Description

Technical Field

[0001] The present invention relates to the field of PCB circuit boards, and in particular to a PCB circuit board copper filling device and method thereof. Background Art

[0002] PCB is a support for electronic components and a carrier for electrical connections between electronic components. PCB is widely used in electronic devices, from home appliances to high-tech equipment. The manufacture and design of PCB is crucial in the electronics industry.

[0003] In PCB design, vias are important components that connect different circuit layers. Vias allow electrical signals to be transmitted between different layers of a circuit board and are the key to achieving multi-layer PCB design. Simply opening vias will not allow different layers to be connected, so it is necessary to fill copper on the surface of the PCB circuit board. By filling copper, the conductivity of the vias is improved, the resistance is reduced, and the current conduction efficiency is improved.

[0004] Copper filling is a commonly used process in the manufacture of printed circuit boards. It is mainly used to improve the electrical performance, thermal management and mechanical strength of circuit boards. It can significantly improve electrical performance and heat dissipation capabilities and is suitable for a variety of application scenarios.

[0005] In the prior art, copper filling refers to injecting copper materials into certain areas of the PCB (such as blind holes, through holes or specific circuit areas) to fill the gaps in these areas, thereby forming better electrical connections and heat dissipation performance. However, the openings of PCB circuit boards are relatively small, resulting in the PCB circuit board sinking into the electroplating tank. Due to the relatively strong surface tension of the liquid in the small holes, after bubbles are formed in the holes, the surface tension makes it difficult for the bubbles to break through the hole wall and be discharged, resulting in poor copper filling effect of the holes of the PCB circuit board.

[0006] Therefore, those skilled in the art provide a PCB circuit board copper filling device and method thereof to solve the problems raised in the above background technology. Summary of the invention

[0007] The object of the present invention is to provide a PCB circuit board copper filling device and method thereof to solve the problems raised in the above background technology.

[0008] To achieve the above object, the present invention provides the following technical solutions: According to one aspect of the invention, a PCB circuit board copper filling device is provided.

[0009] The PCB circuit board copper filling device comprises a copper cylinder, the top of which is provided with an electroplating tank for filling copper; A floating platform is arranged in the electroplating tank, one side of the floating platform is concave to form a placement opening for placing the PCB circuit board, and a bubble removal component is connected to the placement opening; A power unit is connected to the top of the copper cylinder and is connected to the floating table through a connecting block. The degassing component includes a clamping sleeve, a vibrating table and a vibrating block. An inner wall of the placing opening is recessed to form a vibrating groove, and the vibrating table is slidably connected in the vibrating groove. One side of the vibrating table located inside the placing opening is provided with a notch, and a clamping sleeve for clamping the PCB circuit board is fixedly connected in the notch. One side wall of the vibrating table is provided with a sliding groove, a slider is slidably connected in the sliding groove, a spring is fixedly connected between the slider and the sliding groove, and a vibrating block is fixedly connected to a side of the slider extending out of the sliding groove. The bottom of the vibrating table is recessed to form a positioning groove, a guiding block is slidably connected to the bottom of the positioning groove, and the bottom of the guiding block is fixedly connected to the inner wall of the vibrating groove.

[0010] Further, one side wall of the vibrating groove close to the vibrating block gradually approaches the vibrating block from bottom to top to form an inclined surface. An oblique angle parallel to the inclined surface is machined on a side of the vibrating block close to the inclined surface, and a plurality of protrusions for vibration are arranged at intervals from bottom to top on both the oblique angle and the inclined surface.

[0011] Further, a plurality of through holes are arranged at intervals along the length direction on the top of the guiding block, the through holes extend downward and penetrate through the floating table, a jet hole communicated with the through holes is arranged on the outer wall of the vibrating table, and one-way valves are fixedly connected to an opening of the jet hole and a bottom opening of the through hole.

[0012] Further, one end of the jet hole away from the through hole gradually inclines upward so that an axis of the jet hole has an inclination angle with the horizontal plane.

[0013] Further, the floating table, the vibrating table and the clamping sleeve are all in a C shape.

[0014] Further, an inner wall of the clamping sleeve is recessed to form a clamping groove for clamping the PCB circuit board, and a depth of the clamping groove is greater than a width of the PCB circuit board.

[0015] Further, the power unit includes a motor and a lead screw. A support frame is fixedly connected to the top of the copper cylinder, a track groove is arranged on a side of the support frame close to the electroplating tank, and a bottom of the track groove extends downward into the electroplating tank. A lead screw is rotatably connected in the track groove, the connecting block is threadedly connected to the lead screw, a motor is fixedly connected to the top of the support frame, an output shaft of the motor extends into the track groove and is fixedly connected to the lead screw.

[0016] According to another aspect of the present invention, a method for filling copper on a PCB circuit board is provided for the above-mentioned PCB circuit board copper filling device.

[0017] The PCB circuit board copper filling method comprises the following steps: S101, inserting the PCB circuit board into the clamping slot; S102, sinking the PCB circuit board into the electroplating tank through the power unit; S103, the PCB circuit board is vibrated after contacting with the electroplating solution, so as to shake out the bubbles in the micropores; S104, the PCB circuit board is completely sunk into the electroplating tank, the bubble removal component is reset, the PCB circuit board is vibrated for a second time to remove bubbles, and water is sprayed to flush the PCB circuit board; S105, the copper filling of the PCB is completed, and the power unit is reversed to lift the PCB out of the electroplating tank.

[0018] Compared with the prior art, the present invention has the following beneficial effects: 1. The PCB copper filling device can make the PCB horizontally sink into the electrolytic tank through the bubble removal component, so that the electrolyte can infiltrate the outer wall of the PCB and climb along the hole wall of the micropore to squeeze out the air in the micropore, thereby achieving the effect of removing bubbles. At the same time, the pressure generated when the PCB is in contact with the copper-containing electrolyte can be used to drive the vibration table to move up, so that the vibration block can vibrate, and the PCB can vibrate during the upward movement, which is used to change the liquid tension on the surface of the PCB, thereby changing the force of the bubbles, achieving the effect of shaking off the bubbles, and further improving the bubble removal effect; 2. The copper filling device for a PCB circuit board can provide assistance to the vibration table when it moves up and down through the guide block, so that the vibration table can move up and down more smoothly, which is used to ensure the generation of vibration effect and make the bubble removal more stable. The through hole set on the guide block and the jet hole connected with the through hole are set on the outer wall of the vibration table. At the same time, a one-way valve is installed at the bottom of the through hole and the opening of the jet hole, so that when the vibration table is forced to move upward, the gap between the positioning groove and the guide block increases, thereby generating negative pressure. Subsequently, the negative pressure in the through hole increases, so that the one-way valve at the bottom of the through hole opens, and then the electrolyte is sucked into the through hole and the gap. When the vibration table is reset, the gap decreases, so that the electrolyte in the gap is pressurized. At this time, the one-way valve at the jet hole opens, so that the electrolyte is ejected through the jet hole, so that the jet is used to flush the lower surface of the PCB circuit board, disrupting the force distribution on the lower surface of the PCB circuit board, thereby destroying the force on the bubbles in the micropores, and further enhancing the bubble removal effect. 3. This PCB copper filling method can optimize the copper filling process of the PCB circuit board through the above method, and automatically clean the bubbles in the micropores during the copper filling process, so that the copper-containing electrolyte can completely cover the surface of the PCB circuit board, thereby reducing the operating difficulty of the PCB circuit board in the copper filling process, effectively improving the copper filling efficiency of the PCB circuit board, and improving the production efficiency of the PCB circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 2 is a schematic structural diagram of a PCB circuit board copper filling device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the internal structure of a PCB circuit board copper filling device according to an embodiment of the present invention; Figure 3 This is a schematic structural diagram of a floating platform in a PCB circuit board copper filling device according to an embodiment of the present invention; Figure 4 It is a structural schematic diagram of a bubble removal component in a PCB circuit board copper filling device according to an embodiment of the present invention; Figure 5 It is a structural schematic diagram of a PCB circuit board copper filling device when a bubble removal component moves upward according to an embodiment of the present invention; Figure 6 It is a schematic diagram of the internal structure of a bubble removal component in a PCB circuit board copper filling device according to an embodiment of the present invention; Figure 7 The present invention is a flowchart of a method for copper filling of a PCB circuit board according to an embodiment of the present invention.

[0021] Reference numerals: 1. Copper cylinder; 2. Floating table; 3. Power unit; 31. Motor; 32. Screw rod; 4. Plating tank; 5. Placement port; 6. Bubble removal assembly; 61. Clamping sleeve; 62. Vibration table; 63. Vibration block; 7. Connecting block; 8. Vibration groove; 9. Notch; 10. Slide groove; 11. Slider; 12. Positioning groove; 13. Guide block; 14. Inclined surface; 15. Bevel; 16. Through hole; 17. Jet hole; 18. One-way valve; 19. Clamping groove; 20. Support frame; 21. Track groove. DETAILED DESCRIPTION

[0022] The present invention is further described below with reference to the accompanying drawings and specific embodiments: Embodiment 1:

[0023] According to one aspect of the invention, a PCB circuit board copper filling device is provided.

[0024] Reference Figure 1 - Figure 6The present invention discloses a PCB copper filling device, comprising a copper cylinder 1, a top of which is provided with a plating tank 4 for copper filling; A floating platform 2 is arranged in an electroplating tank 4, one side of the floating platform 2 is concavely formed with a placement opening 5 for placing a PCB circuit board, and a bubble removal component 6 is connected to the placement opening 5; A power unit 3, which is connected to the top of the copper cylinder 1 and is connected to the floating platform 2 through a connecting block 7; The bubble removal assembly 6 includes a clamping sleeve 61, a vibration table 62 and a vibration block 63. The inner wall of the placement opening 5 is concave to form a vibration groove 8, and the vibration table 62 is slidably connected in the vibration groove 8; A notch 9 is provided on one side of the vibration table 62 located in the placement opening 5, and a clamping sleeve 61 for clamping the PCB circuit board is fixedly connected in the notch 9; A slide groove 10 is formed on one side wall of the vibration table 62. A slider 11 is slidably connected in the slide groove 10. A spring is fixedly connected between the slider 11 and the slide groove 10. A vibration block 63 is fixedly connected to one side of the slider 11 extending out of the slide groove 10. The bottom of the vibration table 62 is concavely formed with a positioning groove 12 , the bottom of the positioning groove 12 is slidably connected with a guide block 13 , and the bottom of the guide block 13 is fixedly connected to the inner wall of the vibration groove 8 .

[0025] In this embodiment, observe Figure 1 and Figure 2 It can be found that a plating tank 4 containing copper electrolyte is provided on the top of the copper cylinder 1, which can be used to sink the PCB circuit board, and use electric current to deposit copper ions in the holes to fill the holes, thereby realizing the copper filling operation of the PCB circuit board.

[0026] However, since the openings of the PCB circuit board are relatively small, when the PCB circuit board sinks into the electroplating tank, the surface tension of the liquid in the small holes is relatively strong. After bubbles are formed in the holes, the surface tension makes it difficult for the bubbles to break through the hole wall and be discharged, resulting in poor copper filling effect of the PCB circuit board.

[0027] So observe Figure 2 and Figure 3 It can be found that a power unit 3 is arranged on the top of the copper cylinder 1, and the power unit 3 is connected to the floating platform 2 through a connecting block 7, and then a placement opening 5 for placing the PCB circuit board is opened on one side of the floating platform 2, and a clamping sleeve 61 is fixedly connected to the placement opening 5, which can be used to clamp the PCB circuit board, and then the driving unit 3 is used to drive the connecting block 7 to move downward, so that the connecting block 7 moves downward with the floating platform 2 and the PCB circuit board, thereby slowly sinking the PCB circuit board into the electroplating tank 4.

[0028] When the PCB circuit board sinks into the electroplating tank 4, the PCB circuit board will gradually approach the electrolyte, allowing the electrolyte to infiltrate the outer wall of the PCB circuit board. Then, as the PCB circuit board gradually moves downward, the PCB circuit board gradually presses down the electrolyte, causing the electrolyte to climb along the pore walls of the micropores, squeezing out the air in the micropores, thereby achieving the effect of removing bubbles.

[0029] However, the efficiency of the electrolyte climbing up along the micropores to squeeze out the air will deteriorate as the pore diameter decreases. When the PCB circuit board is completely sunk below the liquid surface of the electrolyte, the electrolyte will quickly spread on the upper surface of the PCB circuit board under the action of tension. At this time, the electrolyte will quickly cover the upper surface of the PCB circuit board, resulting in the air in some micropores not being completely discharged, making the de-bubble effect worse.

[0030] Therefore, combined Figure 4 - Figure 6 It can be found that a slide groove 10 is opened on one of the side walls of the vibration table 62, and a slider 11 is slidably connected in the slide groove 10. A spring is fixedly connected between the slider 11 and the slide groove 10, and a vibration block 63 is fixedly connected to the side of the slider 11 extending out of the slide groove 10, so that when the floating table 2 is driven downward by the connecting block 7, the PCB circuit board is pressed on the page of the electrolyte and is subjected to a large pressure, so that the pressure pushes the PCB circuit board to move upward relative to the floating table 2, so that the vibration block 63 contacts the inner wall of the vibration groove 8 to generate vibration, which is used to change the liquid tension on the surface of the PCB circuit board, thereby changing the force condition of the bubbles, achieving the effect of shaking off the bubbles, and further improving the bubble removal effect.

[0031] Since the vibration table 62 will slide up and down in the vibration groove 8, in order to avoid the vibration table 62 tilting and affecting the vibration effect, observe Figure 6 It can be found that a positioning groove 12 is provided at the bottom of the vibration table 62, and a guide block 13 is slidably connected in the positioning groove 12. The bottom of the guide block 13 is fixedly connected to the bottom of the vibration groove 8, so that the vibration table 62 is restricted by the guide block 13 when sliding up and down, which can make the movement of the vibration table 62 more stable, thereby ensuring the generation of the vibration effect and making the bubble removal more stable.

[0032] In a further preferred embodiment of the present invention, Figure 4 and Figure 5 As shown, a side wall of the vibration groove 8 close to the vibration block 63 gradually approaches the vibration block 63 from bottom to top to form an inclined surface 14, and a side of the vibration block 63 close to the inclined surface 14 is processed with an oblique angle 15 parallel to the inclined surface 14, and the oblique angle 15 and the inclined surface 14 are both provided with a plurality of protrusions for vibration at intervals from bottom to top.

[0033] In this embodiment, observe Figure 4 and Figure 5It can be found that by making one side wall of the vibration groove 8 close to the vibration block 63 gradually approach the vibration block 63 from bottom to top to form an inclined surface 14, a bevel angle 15 parallel to the inclined surface 14 is machined on one side of the vibration block 63 close to the inclined surface 14. Subsequently, by arranging a plurality of protrusions at intervals from bottom to top at the bevel angle 15 and the inclined surface 14, when the vibrating table 62 moves upward in the vibration groove 8, when the bevel angle 15 of the vibration block 63 rubs against the inclined surface 14 of the vibration groove 8, the protrusions of the vibration block 63 will vibrate due to friction with the protrusions of the inclined surface 14, thereby generating a vibration effect for realizing the effect of shaking off bubbles.

[0034] At this time, when the PCB circuit board contacts the electrolyte, the relatively large pressure generated between the PCB circuit board and the electrolyte will push the PCB circuit board to move relative to the floating table 2, so that the vibrating table 62 moves from Figure 4 state to Figure 5 state. At this time, the protrusions arranged on the vibration block 63 will rub and vibrate with the protrusions of the inclined surface 14 to make the PCB circuit board vibrate to remove bubbles, improving the bubble removal effect.

[0035] When the PCB circuit board completely sinks to the bottom of the electroplating tank 4, at this time, the floating table 2 stops moving, so that the force on the PCB circuit board disappears. Therefore, the pressure applied to the vibrating table 62 disappears. At this time, under the push of the spring, the vibration block 63 squeezes the side wall of the vibration groove 8, and the inclined surface of the inclined surface 14 will decompose the received pressure, so that part of the pressure applied by the extrusion block 63 is converted into a traction force that drives the extrusion block 63 to move downward, so that the extrusion block 63 moves downward, resetting the vibrating table 62. And during the reset process, the vibration block 63 will generate vibration again, further strengthening the bubble removal effect.

[0036] In a further preferred embodiment of the present invention, as shown in Figure 3 and Figure 6 , a plurality of through holes 16 are arranged at intervals along the length direction at the top of the guide block 13. The through holes 16 extend downward and penetrate the floating table 2. A jet hole 17 communicated with the through holes 16 is opened on the outer wall of the vibrating table 62. One-way valves 18 are fixedly connected to the opening of the jet hole 17 and the bottom opening of the through hole 16; One end of the jet hole 17 away from the through hole 16 gradually inclines upward, so that the axis of the jet hole 17 has an inclination angle with the horizontal plane; The floating table 2, the vibrating table 62 and the clamping sleeve 61 are all in a C shape.

[0037] In this embodiment, observe Figure 3It can be found that by arranging the floating table 2, the vibrating table 62 and the clamping sleeve 61 in a C shape, an installation opening for installing the PCB circuit board can be reserved on one side of the floating table 2, the vibrating table 62 and the clamping sleeve 61, which is convenient for the installation of the PCB circuit board, reduces the installation difficulty of the PCB circuit board, thereby reducing the use difficulty of the copper filling device, and further improving the copper filling efficiency of the PCB circuit board and the production efficiency of the PCB circuit board.

[0038] And observing Figure 6 It can be found that since the vibrating table 62 is in a C shape, the guide block 13 for assisting the smooth sliding of the vibrating table 62 is also in a C shape. By arranging a plurality of through holes 16 at intervals along the length direction on the top of the guide block 13, the bottom of the through hole 16 extends downward and penetrates the floating table 2. Then, a jet hole 17 communicating with the through hole 16 is opened on the outer wall of the vibrating table 62. Finally, a one-way valve 18 is fixedly connected at the opening of the jet hole 17 and the bottom opening of the through hole 16. At this time, when the vibrating table 62 is forced to move upward, the gap between the positioning groove 12 and the guide block 13 increases, thereby generating negative pressure. Then, the negative pressure in the through hole 16 increases, causing the one-way valve 18 at the bottom of the through hole 16 to open, and then the electrolyte is sucked into the through hole 16 and the gap. After the PCB circuit board completely sinks to the bottom of the electrolytic cell 4, when the vibrating table 62 resets, the gap decreases, causing the electrolyte in the gap to be pressurized. At this time, the one-way valve 18 at the jet hole 17 opens, causing the electrolyte to be ejected through the jet hole 17, thereby using the jet to wash the lower surface of the PCB circuit board, disturbing the force distribution on the lower surface of the PCB circuit board, and thus destroying the force on the bubbles in the micro holes and further enhancing the bubble removal effect.

[0039] And in Figure 6 it can be found that the end of the jet hole 17 far from the through hole 16 gradually slopes upward, so that the axis of the jet hole 17 has an inclination angle with the horizontal plane, which is used to make the electrolyte in the jet hole 17 fly obliquely upward when ejected, so that the electrolyte can wash the lower surface of the PCB circuit board, which can effectively ensure the operation stability of jet bubble removal.

[0040] In a further preferred embodiment of the present invention, as Figure 3 and Figure 4 shown, a clamping groove 19 for clamping the PCB circuit board is formed by concave inward on the inner wall of the clamping sleeve 61, and the depth of the clamping groove 19 is greater than the width of the PCB circuit board.

[0041] In this embodiment, in combination with Figure 3 and Figure 4 it can be found that by arranging the clamping groove 19 on the inner wall of the clamping sleeve 61, it can be used to clamp the PCB circuit board, making the installation of the PCB circuit board more convenient and simple, so that the preparation time for copper filling of the PCB circuit board is shorter, and the copper filling efficiency of the PCB circuit board is improved.

[0042] By making the depth of the clamping groove 19 greater than the width of the PCB, the PCB can be completely inserted into the clamping groove 19 when installed, so that the edge of the PCB will not extend out of the outside of the clamping sleeve 61. When the floating platform 2 moves up and down, the PCB will not contact or collide with the wall of the electrolytic cell 4, thereby protecting the PCB, reducing the scrap rate of the PCB, and thus reducing the production cost of the PCB.

[0043] In a further preferred embodiment of the present invention, Figure 1 and Figure 2 As shown, the power unit 3 includes a motor 31 and a screw rod 32. The top of the copper cylinder 1 is fixedly connected to a support frame 20. A track groove 21 is provided on one side of the support frame 20 close to the electroplating tank 4. The bottom of the track groove 21 extends downward into the electroplating tank 4. A screw rod 32 is rotatably connected in the track groove 21 , and the connecting block 7 is threadedly connected to the screw rod 32 . A motor 31 is fixedly connected to the top of the support frame 20 , and the output shaft of the motor 31 extends into the track groove 21 and is fixedly connected to the screw rod 32 .

[0044] In this embodiment, a support frame 20 is fixedly connected to the top of the copper cylinder 1, and a track groove 21 is opened on the side of the support frame 20 close to the electroplating tank 4. The bottom of the track groove 21 extends downward into the electroplating tank 4. A connecting block 7 connected to the floating platform 2 is slidably arranged in the track groove 21. When the PCB circuit board is installed, the floating platform 2 can be moved to the top of the electroplating tank 4, which is convenient for the installation of the PCB circuit board. After the PCB circuit board is installed, the PCB circuit board is sunk into the electroplating tank 4 by the power unit 3, thereby improving the safety of the PCB circuit board when filling copper.

[0045] By installing a motor 31 on the top of the support frame 20, the output shaft of the motor 31 extends into the track groove 21 and is fixedly connected with a screw rod 32, so that the bottom of the screw rod 32 is rotatably connected to the bottom of the track groove 21, and finally the connecting block 7 is threadedly connected to the screw rod 32, so that when the motor 31 is running, it can slide up and down in the track groove 21 with the connecting block 7, so as to sink the PCB circuit board into the electrolytic cell 4, and take the PCB circuit board out of the electrolytic cell 4 after the copper filling is completed, so that the difficulty of copper filling of the PCB circuit board is further reduced. Embodiment 2:

[0046] According to another aspect of the present invention, a PCB circuit board copper filling method is provided, which is used for the above-mentioned PCB circuit board copper filling device.

[0047] The PCB circuit board copper filling method comprises the following steps: S101, inserting the PCB circuit board into the clamping groove 19; S102, sinking the PCB circuit board into the electroplating tank 4 through the power unit 3; S103, the PCB circuit board is vibrated after contacting with the electroplating solution, so as to shake out the bubbles in the micropores; S104, the PCB circuit board is completely sunk into the electroplating tank 4, the bubble removal component 6 is reset, the PCB circuit board is vibrated for a second time to remove bubbles, and water is sprayed to flush the PCB circuit board; S105, the copper filling of the PCB is completed, and the power unit 3 is reversed and lifts the PCB out of the electroplating tank 4.

[0048] Through the above scheme and method of the present invention, the copper filling process of the PCB circuit board can be optimized, and the bubbles in the micropores can be automatically cleaned during the copper filling process, so that the copper-containing electrolyte can completely cover the surface of the PCB circuit board, thereby reducing the operating difficulty of the PCB circuit board in the copper filling process, effectively improving the copper filling efficiency of the PCB circuit board, and improving the production efficiency of the PCB circuit board.

[0049] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB circuit board copper filling device, characterized in that: It includes a copper cylinder (1) with an electroplating tank (4) for filling copper opened at the top; A floating table (2) is arranged in the electroplating tank (4). One side of the floating table (2) is concave to form a placement opening (5) for placing a PCB circuit board, and a degassing component (6) is connected in the placement opening (5); A power unit (3) is connected to the top of the copper cylinder (1) and is connected to the floating table (2) through a connecting block (7); The degassing component (6) includes a clamping sleeve (61), a vibrating table (62) and a vibrating block (63). A vibrating groove (8) is formed by concave inward on the inner wall of the placement opening (5), and the vibrating table (62) is slidably connected in the vibrating groove (8); One side of the vibrating table (62) located in the placement opening (5) is provided with a notch (9), and a clamping sleeve (61) for clamping the PCB circuit board is fixedly connected in the notch (9); One side wall of the vibrating table (62) is provided with a sliding groove (10), a slider (11) is slidably connected in the sliding groove (10), a spring is fixedly connected between the slider (11) and the sliding groove (10), and one side of the slider (11) extending out of the sliding groove (10) is fixedly connected with a vibrating block (63); A positioning groove (12) is formed by concave inward at the bottom of the vibrating table (62), a guiding block (13) is slidably connected to the bottom of the positioning groove (12), and the bottom of the guiding block (13) is fixedly connected to the inner wall of the vibrating groove (8).

2. A PCB circuit board copper filling device according to claim 1, characterized in that: One side wall of the vibrating groove (8) close to the vibrating block (63) gradually approaches the vibrating block (63) from bottom to top to form an inclined surface (14). An oblique angle (15) parallel to the inclined surface (14) is machined on one side of the vibrating block (63) close to the inclined surface (14). A plurality of protrusions for vibration are arranged at intervals from bottom to top on both the oblique angle (15) and the inclined surface (14).

3. A PCB circuit board copper filling device according to claim 1, characterized in that: A plurality of through holes (16) are arranged at intervals along the length direction at the top of the guiding block (13). The through holes (16) extend downward and penetrate through the floating table (2). A jet hole (17) communicated with the through holes (16) is opened on the outer wall of the vibrating table (62). One-way valves (18) are fixedly connected to the opening of the jet hole (17) and the bottom opening of the through holes (16).

4. A PCB circuit board copper filling device according to claim 3, characterized in that: One end of the jet hole (17) far from the through hole (16) gradually inclines upward so that the axis of the jet hole (17) has an inclination angle with the horizontal plane.

5. A PCB circuit board copper filling device according to claim 1, characterized in that: The floating table (2), the vibrating table (62) and the clamping sleeve (61) are all in a C shape.

6. A PCB circuit board copper filling device according to claim 5, characterized in that: A clamping groove (19) for clamping the PCB circuit board is formed by concave inward on the inner wall of the clamping sleeve (61), and the depth of the clamping groove (19) is greater than the width of the PCB circuit board.

7. A PCB circuit board copper filling device according to claim 1, characterized in that: The power unit (3) includes a motor (31) and a lead screw (32). A support frame (20) is fixedly connected to the top of the copper cylinder (1). A track groove (21) is opened on one side of the support frame (20) close to the electroplating tank (4), and the bottom of the track groove (21) extends downward into the electroplating tank (4); A screw rod (32) is rotatably connected in the track groove (21), and the connecting block (7) is threadedly connected to the screw rod (32). A motor (31) is fixedly connected to the top of the support frame (20), and an output shaft of the motor (31) extends into the track groove (21) and is fixedly connected to the screw rod (32).

8. A method for copper filling of a PCB circuit board, characterized in that: A PCB copper filling device for use in any one of claims 1 to 7 comprises the following steps: S101, inserting the PCB circuit board into the clamping groove (19); S102, sinking the PCB circuit board into the electroplating tank (4) by means of the power unit (3); S103, the PCB circuit board is vibrated after contacting with the electroplating solution, so as to shake out the bubbles in the micropores; S104, the PCB circuit board is completely sunk into the electroplating tank (4), the bubble removal component (6) is reset, the PCB circuit board is vibrated a second time to remove bubbles, and water is sprayed to flush the PCB circuit board; S105, the copper filling of the PCB is completed, and the power unit (3) is reversed and lifts the PCB out of the electroplating tank (4).

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