Driving backboard, preparation method of driving backboard and display device

Abstract

The embodiment of the invention provides a driving backboard, a preparation method of the driving backboard and a display device, and the driving backboard comprises a substrate which comprises a wiring layer; the light-emitting device is arranged on one side of the substrate; the reflecting layer and the light-emitting device are arranged on the same side of the substrate, the reflecting layer is provided with a through hole, the through hole penetrates through the wiring layer, and the light-emitting device is electrically connected with the wiring layer through the through hole; wherein the orthographic projection of the light-emitting device on the projection surface covers the orthographic projection of the through hole on the projection surface, and the projection surface is parallel to the reflecting layer. According to the technical scheme of the embodiment of the invention, the reflectivity of the reflecting layer can be effectively improved, the lighting effect is improved, and the overall optical effect of the driving backboard is further improved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a driving backplane, a method for preparing the driving backplane, and a display device. Background Art

[0002] In the related art, the driver backplane generally includes a substrate, a reflective layer, and an LED chip. The reflective layer is disposed on the substrate, and an array of openings is disposed on the reflective layer to expose the pads on the substrate. The LED chip is located in the opening and is electrically connected to the pads. However, the size of the opening on the reflective layer is generally larger than the size of the LED chip, which affects the reflectivity of the reflective layer, thereby affecting the overall optical effect of the driver backplane. Summary of the invention

[0003] The embodiments of the present application provide a driving backplane, a method for preparing the driving backplane, and a display device to solve or alleviate one or more technical problems in the prior art.

[0004] As one aspect of an embodiment of the present application, the embodiment of the present application provides a driving backplane, including: a substrate, including a wiring layer; a light-emitting device, arranged on one side of the substrate; a reflective layer, arranged on the same side of the substrate as the light-emitting device, the reflective layer is provided with a through hole, the through hole penetrates the wiring layer, and the light-emitting device is electrically connected to the wiring layer through the through hole; wherein the orthographic projection of the light-emitting device on the projection plane covers the orthographic projection of the through hole on the projection plane, and the projection plane is parallel to the reflective layer.

[0005] In one embodiment, the light-emitting device includes a light-emitting part and a connecting pin, wherein the connecting pin is connected to the side of the light-emitting part facing the substrate, and the connecting pin is electrically connected to the wiring layer through a through hole; wherein the orthographic projection of the connecting pin on the projection plane is located within the orthographic projection of the through hole on the projection plane.

[0006] In one embodiment, a minimum distance between an orthographic projection of the connecting pin on the projection plane and an orthographic projection of the through hole on the projection plane is greater than or equal to 10 μm.

[0007] In one embodiment, the light-emitting device includes two connecting pins arranged at intervals in a first direction, each connecting pin is electrically connected to the wiring layer through a through hole; the orthographic projection of each connecting pin on the projection plane includes a first edge and a second edge arranged opposite to each other in the first direction and two third edges arranged opposite to each other in the second direction, and the first edge is arranged close to another connecting pin; the orthographic projection of the through hole on the projection plane includes two fourth edges arranged opposite to each other in the first direction and two fifth edges arranged opposite to each other in the second direction, and the second direction is perpendicular to the first direction; wherein the distance between the first edge and the adjacent fourth edge is greater than or equal to 10 μm, the distance between the second edge and the adjacent fourth edge is greater than or equal to 20 μm, and the distance between the third edge and the adjacent fifth edge is greater than or equal to 20 μm.

[0008] In one embodiment, the driving backplane also includes: a first metal connection portion filled in the through hole, the first metal connection portion being electrically connected to the light-emitting device and the wiring layer; a second metal connection portion being connected to the first metal connection portion, and the second metal connection portion being arranged on a side surface of the wiring layer facing away from the reflective layer.

[0009] In one embodiment, a dimension of the second metal connection portion in a direction perpendicular to the projection plane is greater than or equal to 30 μm.

[0010] In one embodiment, the routing layer includes multiple metal connecting lines, the size of the first metal connecting part in the extension direction of the metal connecting line is L1, the size of the second metal connecting part in the extension direction of the metal connecting line is L2; ​​the size of the through hole in the extension direction of the metal connecting line is L3; wherein L1+L2≥2L3.

[0011] In one embodiment, the substrate also includes a first insulating protective layer, which is arranged between the wiring layer and the reflective layer, and the through hole penetrates the first insulating protective layer; wherein the orthographic projection of the first insulating protective layer on the projection plane covers the orthographic projection of the wiring layer on the projection plane.

[0012] In one embodiment, the substrate also includes a second insulating protective layer, which is arranged on the side of the wiring layer facing away from the reflective layer; wherein the orthographic projection of the second insulating protective layer on the projection plane covers the orthographic projection of the light-emitting device on the projection plane and covers the orthographic projection of the wiring layer on the projection plane.

[0013] In one embodiment, the driving backplane also includes: a protective adhesive layer, which is arranged on the side of the light-emitting device away from the substrate; wherein the protective adhesive layer is an integral structure, and the orthographic projection of the protective adhesive layer on the projection surface covers the orthographic projections of multiple light-emitting devices on the projection surface; or, the protective adhesive layer includes multiple protective adhesive parts arranged at intervals, and the orthographic projection of each protective adhesive part on the projection surface covers the orthographic projection of the corresponding light-emitting device on the projection surface.

[0014] In one embodiment, when the protective rubber layer is an integral structure, the size of the portion of the protective rubber layer corresponding to the reflective layer in a direction perpendicular to the projection plane is 0.2 mm to 0.3 mm; when the protective rubber layer includes multiple protective rubber portions, the maximum size of the protective rubber portion in a direction perpendicular to the projection plane is 0.45 mm to 0.55 mm; and / or the size of the reflective layer in a direction perpendicular to the projection plane is 0.02 mm to 0.1 mm.

[0015] As another aspect of an embodiment of the present application, an embodiment of the present application provides a method for preparing a driving backplane, which is applied to the driving backplane of any of the above-mentioned embodiments, and the preparation method includes: providing a substrate; wherein the substrate includes a wiring layer; setting a reflective layer to be opened on one side of the substrate; forming a through hole on the reflective layer to be opened to obtain a reflective layer; wherein the through hole passes through the wiring layer; setting a light-emitting device on the side of the substrate where the reflective layer is set, and electrically connecting the light-emitting device to the wiring layer through the through hole.

[0016] As another aspect of the embodiments of the present application, the embodiments of the present application provide a display device, comprising a driving backplane according to any of the above embodiments.

[0017] The embodiment of the present application adopts the above-mentioned technical solution to effectively improve the reflectivity of the reflective layer, improve the light efficiency, and thus improve the overall optical effect of the driving backplane.

[0018] The above summary is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the present application will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0020] Figure 1 A schematic structural diagram of a driving backplane is shown;

[0021] Figure 2 A schematic cross-sectional structure diagram of a first driving backplane is shown;

[0022] Figure 3 A schematic diagram showing the structure of a reflective layer of a second driving backplane;

[0023] Figure 4 A schematic cross-sectional structure diagram of a second driving backplane is shown;

[0024] Figure 5 A schematic cross-sectional structure diagram of a driving backplane according to an embodiment of the present application is shown;

[0025] Figure 6 Show Figure 5 SEM image of the part A circled in the middle;

[0026] Figure 7 A bottom view schematically shows a driving backplane according to an embodiment of the present application;

[0027] Figure 8 A schematic cross-sectional structure diagram of a driving backplane according to another embodiment of the present application is shown;

[0028] Fig. 9 A process diagram of manufacturing a driving backplane according to an embodiment of the present application is shown;

[0029] Fig.10 A schematic flow chart of a method for preparing a driving backplane according to an embodiment of the present application is shown.

[0030] Description of reference numerals:

[0031] 10: driving backplane; 100: substrate; 100a: second window area; 110: routing layer; 111: metal connecting line; 120: first insulating protection layer; 130: second insulating protection layer; 200: light-emitting device; 210: light-emitting part; 220: connecting pin; 300: reflecting layer; 310: through hole; 400: first metal connecting part; 500: second metal connecting part; 600: protective glue layer; 610: protective glue part; 700: first circuit board; 800: second circuit board. DETAILED DESCRIPTION

[0032] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present application. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0033] Figure 1 A schematic structural diagram of a driving backplane is shown; Figure 2 FIG. 4 shows a schematic cross-sectional structure diagram of the first type of driving backplane. Figure 1 and Figure 2As shown, the driving backplane 10 includes a substrate 100, a reflective layer 300, a light-emitting device 200, a protective adhesive layer 600, a first circuit board 700 and a second circuit board 800. The first circuit board 700 can be connected between the substrate 100 and the second circuit board 800, and is used to transmit the control signal output by the second circuit board 800 to the substrate 100. Among them, the first circuit board 700 can be directly made on the substrate 100; or, the first circuit board 700 can be bound and connected to the substrate 100. Exemplarily, the first circuit board 700 can be a flexible printed circuit (Flexible Printed Circuit, FPC). The second circuit board 800 can be a printed circuit board (Printed Circuit Board, PCB). The light-emitting device 200 can be a light-emitting diode (Light-EmittingDiode, LED) or a sub-millimeter light-emitting diode (Mini-LED), etc.

[0034] Among them, the substrate 100 may include a routing layer 110, a first insulating protective layer 120 and a second insulating protective layer 130. The routing layer 110 is located between the first insulating protective layer 120 and the second insulating protective layer 130, and is used to realize signal transmission. The light-emitting device 200 is electrically connected to the routing layer 110. The first insulating protective layer 120 and the second insulating protective layer 130 can protect the routing layer 110 and can enhance the bending resistance of the substrate 100. The reflective layer 300 is arranged on the side of the first insulating protective layer 120 away from the second insulating protective layer 130, and is used to reflect light and improve brightness. The protective adhesive layer 600 is arranged on the side of the reflective layer 300 away from the second insulating protective layer 130, and is used to protect the light-emitting device 200, and can adjust the light shape of the light-emitting device 200. Exemplarily, the routing layer 110 may be a single-layer structure or a multi-layer structure. In the case of a multi-layer structure, two adjacent routing layers are electrically isolated from each other by an insulating layer, and are interconnected at the connection position through a via structure penetrating the insulating layer, and the rest of the positions are uniform; the material of the routing layer may include a metal material with high conductivity such as copper. The material of the first insulating protection layer 120 and the second insulating protection layer 130 may be polyimide (PI).

[0035] Optionally, the routing layer 110 includes a pad for binding and connecting with the connecting pin 220 of the light emitting device 200. The size of the surface of the pad facing the connecting pin 220 can be slightly larger than the size of the connecting pin 220 to ensure that the connecting pin 220 has sufficient contact area with the pad, thereby improving the welding reliability of the connecting pin 220 and the pad.

[0036] There may be a plurality of light-emitting devices 200, and the plurality of light-emitting devices 200 may be arranged in an array to form a light-emitting array. In order to avoid interference between the first insulating protective layer 120, the reflective layer 300 and the light-emitting device 200, and to avoid affecting the welding between the connecting pins and the pads, the first insulating protective layer 120 may be provided with a plurality of first openings corresponding to the plurality of light-emitting devices 200, and each first opening is used to avoid the corresponding light-emitting device 200. The reflective layer 300 may be provided with a plurality of second openings corresponding to the plurality of light-emitting devices 200, and each second opening is used to avoid the corresponding light-emitting device 200.

[0037] The manufacturing accuracy of the first opening can be 0.05mm, that is, the deviation range between the actual size of the first opening and the designed size can be ±0.05mm. In the row direction of the light-emitting array, the distance accuracy between the two first openings at both ends can be 0.1mm, that is, the deviation range between the actual distance between the two first openings at both ends and the designed distance can be ±0.1mm. The attachment accuracy of the first insulating protective layer 120 can be 0.2mm. The overall comprehensive accuracy of the first insulating protective layer 120 can be 0.21mm. In order to ensure that the first insulating protective layer 120 does not cover the pad and does not interfere with the light-emitting device 200, the second projection needs to be located within the first projection, and the design width of the first window area between the first projection and the second projection needs to be 0.3mm; wherein the first projection is the orthographic projection of the first opening on the second insulating protective layer 130; the second projection is the orthographic projection of the light-emitting device 200 corresponding to the first opening on the second insulating protective layer 130. Considering the overall comprehensive accuracy of the first insulating protective layer 120, the actual width W1 of the first window area is (0.3±0.21)mm. The portion of the wiring layer 110 corresponding to the first window area is not protected by the first insulating protection layer 120 and is easily contaminated or damaged, and is easily corroded during the reliability process.

[0038] The reflective layer 300 can be prepared by different processes or materials. In some embodiments, the material of the reflective layer 300 can be photosensitive ink or thermosetting ink. Specifically, the photosensitive ink can be printed on the entire surface of the side of the first insulating protective layer 120 that is away from the second insulating protective layer 130, and then the photosensitive ink in the corresponding area of ​​the connecting electrode 220 of the light-emitting device 200 is patterned by exposure and development to form a second opening; the thermosetting ink can also be set on the side of the first insulating protective layer 120 that is away from the second insulating protective layer 130 by steel screen printing, and the reflective layer 300 with the second opening can be formed after curing; the reflective sheet structure with the first opening can also be cut into corresponding sizes and directly attached to the side of the first insulating protective layer 120 that is away from the second insulating protective layer 130. Among them, the patterning accuracy of the photosensitive ink is relatively high. For example, when the material of the reflective layer 300 is photosensitive ink, the manufacturing accuracy of the second opening can be less than 0.1 mm. Therefore, for the reflective layer 300 whose material is photosensitive ink, such as Figure 1 and Figure 2 As shown, in order to ensure that the reflective layer 300 exposes the pad and does not interfere with the light-emitting device 200, the fourth projection needs to be located within the third projection, and the design width of the second window area 100a between the third projection and the fourth projection can be 0.1mm; wherein the third projection is the orthographic projection of the second opening on the second insulating protective layer 130; the fourth projection is the orthographic projection of the light-emitting device 200 corresponding to the second opening on the second insulating protective layer 130. The manufacturing accuracy of the second opening can be 0.05mm, that is, the deviation range between the actual size and the design size of the second opening can be ±0.05mm. Considering the manufacturing accuracy of the second opening, the actual width W2 of the second window area 100a is (0.1±0.05)mm. The printing accuracy of thermosetting ink is low. For example, when the material of the reflective layer 300 is thermosetting ink, the manufacturing accuracy of the second opening can be 0.4mm. Therefore, for thermosetting ink, in order to ensure that the reflective layer 300 does not cover the pad and does not interfere with the light-emitting device 200, the fourth projection needs to be located within the third projection, and the design width of the second window area 100a between the third projection and the fourth projection needs to be greater than or equal to 0.4 mm.

[0039] Figure 3 A schematic diagram showing the structure of a reflective layer of a second driving backplane; Figure 4 FIG. 1 is a schematic cross-sectional view of a second type of driving backplane 10. Figure 1 , Figure 3 and Figure 4, the reflectivity of the reflective sheet (such as 95%) is usually higher than the average reflectivity of the ink (such as 90%). In the reflective sheet attachment process, the manufacturing accuracy of the second opening can be 0.05mm. In the row direction of the light-emitting array, the distance accuracy between the two second openings at both ends can be 0.1mm, that is, the deviation range between the actual distance and the designed distance between the two second openings at both ends can be ±0.1mm. The attachment accuracy of the reflective sheet can be 0.2mm. The overall comprehensive accuracy of the reflective sheet can be 0.21mm. In order for the reflective layer 300 not to cover the pad and not to interfere with the light-emitting device 200, the fourth projection needs to be located within the third projection, and the design width of the second window area 100a between the third projection and the fourth projection needs to be 0.3mm. Considering the overall comprehensive accuracy of the reflective sheet, the actual width W2 of the second window area 100a is (0.3±0.05)mm. In the second window area 100a, light cannot be reflected, thereby affecting the luminous intensity and reducing the light efficiency. For example, when the width of the second window area 100a increases by 0.25 mm, the light efficiency decreases by 10%, and the second window area 100a with an actual width of W2 will reduce the light efficiency by more than 10%. The above "width" can be understood as the maximum width.

[0040] In order to solve the above technical problems, the first aspect of the present application provides a driving backplane 10. Figure 5-Figure 10 The driving backplane 10 according to the first embodiment of the present application is described.

[0041] Figure 5 A schematic cross-sectional structure diagram of a driving backplane 10 according to an embodiment of the present application is shown; Figure 6 Show Figure 5 The scanning electron microscope image of the circled part A. Figure 5 and Figure 6 As shown, the driving backplane 10 includes a substrate 100, a light-emitting device 200 and a reflective layer 300. The substrate 100 includes a wiring layer 110. The light-emitting device 200 is arranged on one side of the substrate 100. The reflective layer 300 and the light-emitting device 200 are arranged on the same side of the substrate 100. The reflective layer 300 is provided with a through hole 310, and the through hole 310 at least corresponds to the connecting pin 220 of the light-emitting device 200, so that the connecting pin 220 can be electrically connected to the pad in the wiring layer 110; wherein the orthographic projection of the light-emitting device 200 on the projection plane covers the orthographic projection of the through hole 310 on the projection plane, and the projection plane is parallel to the reflective layer 300.

[0042] It should be noted that “the orthographic projection of the light-emitting device 200 on the projection plane covers the orthographic projection of the through hole 310 on the projection plane” means that the orthographic projection of the through hole 310 on the projection plane is located within the orthographic projection of the light-emitting device 200 on the projection plane; or the orthographic projection of the light-emitting device 200 on the projection plane coincides with the orthographic projection of the through hole 310 on the projection plane.

[0043] For example, the material of the substrate 100 can be a relatively thin and relatively low hardness substrate such as polyimide (PI) or high-performance glass fiber reinforced polyester resin composite material (Bismaleimide Triazine, BT) to facilitate opening. The light-emitting device 200 can be a white light LED (such as a packaged white light Mini-LED) or a blue light LED (such as a blue light Mini-LED).

[0044] Optionally, the size of the reflective layer 300 in the direction perpendicular to the projection plane may be 0.02 mm to 0.1 mm (including the end values), so as to effectively reflect light while achieving a secure connection with the substrate 100 .

[0045] The orthographic projection of the substrate 100 on the projection surface may include a first substrate area and a second substrate area. The first substrate area coincides with the orthographic projection of the light-emitting device 200 on the projection surface; the second substrate area does not overlap with the orthographic projection of the light-emitting device 200 on the projection surface. By making the orthographic projection of the light-emitting device 200 on the projection surface cover the orthographic projection of the through hole 310 on the projection surface, the reflective layer 300 can cover the second substrate area. Compared with the first and second drive backplanes mentioned above, the second window area 100a can be avoided, thereby effectively improving the reflectivity of the reflective layer 300, improving the light efficiency, and further improving the overall optical effect of the drive backplane 10. For example, compared with the second drive backplane mentioned above, the second window area 100a with a width of (0.3±0.05) mm can be avoided, thereby improving the light efficiency by more than 10%.

[0046] Figure 7 FIG. 1 is a bottom view of a driving backplane 10 according to an embodiment of the present application. Figure 5-Figure 7 As shown, the light-emitting device 200 includes a light-emitting portion 210 and a connecting pin 220, wherein the connecting pin 220 is connected to the side of the light-emitting portion 210 facing the substrate 100, and the connecting pin 220 is electrically connected to the pad in the wiring layer 110 through the through hole 310; wherein the orthographic projection of the connecting pin 220 on the projection plane is located within the orthographic projection of the through hole 310 on the projection plane.

[0047] In this embodiment, by making the orthographic projection of the connecting pin 220 on the projection plane be located within the orthographic projection of the through hole 310 on the projection plane, on the one hand, the electrical connection position of the connecting pin 220 can be made accurate, thereby ensuring the quality of the electrical connection between the connecting pin 220 and the wiring layer 110 and avoiding poor connection or short circuit problems; on the other hand, the mechanical stability and reliability of the light-emitting device 200 can be improved, thereby avoiding damage to the light-emitting device 200 due to mechanical stress or vibration.

[0048] In one embodiment, the minimum distance between the orthographic projection of the connecting pin 220 on the projection plane and the orthographic projection of the through hole 310 on the projection plane may be greater than or equal to 10 μm. Thus, the edge of the through hole 310 may exceed the edge of the corresponding connecting pin 220 by more than 10 μm, with sufficient margin to prevent the connecting pin 220 from being offset beyond the orthographic projection of the through hole 310 on the projection plane due to mechanical stress, thereby making the electrical connection between the connecting pin 220 and the routing layer 110 more reliable.

[0049] In one embodiment, in combination Figure 5 and Figure 7 , the light emitting device 200 includes a light emitting device 200 in a first direction (eg, Figure 5 and Figure 7 Two connecting pins 220 are arranged at intervals in the left and right directions (in the left and right directions in the middle), and each connecting pin 220 is electrically connected to the wiring layer 110 through a through hole 310. The orthographic projection of each connecting pin 220 on the projection plane includes a first edge and a second edge arranged opposite to each other in the first direction and a second edge in the second direction (for example, Figure 7 The through hole 310 has two third edges arranged opposite to each other in the vertical direction (in the vertical direction), and the first edge is arranged close to another connecting pin 220. The orthographic projection of the through hole 310 on the projection plane includes two fourth edges arranged opposite to each other in the first direction and two fifth edges arranged opposite to each other in the second direction, and the second direction is perpendicular to the first direction. Among them, the distance LX1 between the first edge and the fourth edge adjacent to it is greater than or equal to 10μm, the distance LX2 between the second edge and the fourth edge adjacent to it is greater than or equal to 20μm, and the distance LX3 between the third edge and the fifth edge adjacent to it is greater than or equal to 20μm.

[0050] For example, the orthographic projection of each connecting pin 220 on the projection plane may be a rectangle. Accordingly, the orthographic projection of the through hole 310 corresponding to the connecting pin 220 on the projection plane is a rectangle. Figure 7 The two connecting pins 220 from left to right in the figure are respectively referred to as the first connecting pin 220 and the second connecting pin 220; and Figure 7The two through holes 310 from left to right in the figure are respectively referred to as the first through hole 310 and the second through hole 310. The right edge of the first connecting pin 220 is the first edge, the left edge of the first connecting pin 220 is the second edge, and the upper edge and the lower edge of the first connecting pin 220 are both the third edge. The left edge and the right edge of the first through hole 310 are both the fourth edge, and the upper edge and the lower edge of the first through hole 310 are both the fifth edge. The fourth edge adjacent to the first edge of the first connecting pin 220 is the right edge of the first through hole 310; the fourth edge adjacent to the second edge of the first connecting pin 220 is the left edge of the first through hole 310; the fifth edge adjacent to the third edge of the first connecting pin 220 which is the upper edge is the upper edge of the first through hole 310; the fifth edge adjacent to the third edge of the first connecting pin 220 which is the lower edge is the lower edge of the first through hole 310. The left edge of the second connecting pin 220 is the first edge, the right edge of the second connecting pin 220 is the second edge, and the upper edge and the lower edge of the second connecting pin 220 are both the third edge. The left edge and the right edge of the second through hole 310 are both the fourth edge, and the upper edge and the lower edge of the second through hole 310 are both the fifth edge. The fourth edge adjacent to the first edge of the second connecting pin 220 is the left edge of the second through hole 310; the fourth edge adjacent to the second edge of the second connecting pin 220 is the right edge of the second through hole 310; the fifth edge adjacent to the third edge of the second connecting pin 220 which is the upper edge is the upper edge of the second through hole 310; the fifth edge adjacent to the third edge of the second connecting pin 220 which is the lower edge is the lower edge of the second through hole 310.

[0051] In this embodiment, one edge of the through hole 310 can exceed the edge of the corresponding connecting pin 220 by more than 10 μm, and the other three edges can exceed the edges of the corresponding connecting pin 220 by more than 20 μm. This can further prevent the connecting pin 220 from being offset to exceed the orthographic projection of the through hole 310 on the projection surface due to mechanical stress, thereby making the electrical connection between the connecting pin 220 and the routing layer 110 more reliable.

[0052] In one embodiment, Figure 5 and Figure 7 As shown, the driving backplane 10 also includes a first metal connection part 400 and a second metal connection part 500. The first metal connection part 400 is filled in the through hole 310, and the first metal connection part 400 is electrically connected to the light emitting device 200 and the wiring layer 110. The second metal connection part 500 is connected to the first metal connection part 400, and the second metal connection part 500 is arranged on a side surface of the wiring layer 110 away from the reflective layer 300. Exemplarily, the material of the first metal connection part 400 and the second metal connection part 500 includes at least one of tin, copper or silver, but is not limited thereto.

[0053] Therefore, by setting the above-mentioned first metal connection part 400 and second metal connection part 500, the first metal connection part 400 can contact the wiring layer 110 in a direction perpendicular to the projection plane, and the second metal connection part 500 can contact the wiring layer 110 in a direction parallel to the projection plane. The total contact area between the first metal connection part 400 and the second metal connection part 500 and the wiring layer 110 is large, which can effectively ensure the electrical connection stability and reliability of the light-emitting device 200 and the wiring layer 110.

[0054] In one embodiment, the size of the second metal connection part 500 in the direction perpendicular to the projection plane can be greater than or equal to 30 μm. In this way, the second metal connection part 500 has a larger thickness and a higher current transmission capacity, thereby making the electrical connection between the light-emitting device 200 and the wiring layer 110 more reliable. In addition, the structural stability of the second metal connection part 500 can be improved, reducing the risk of the second metal connection part 500 becoming loose under mechanical stress or vibration.

[0055] In one embodiment, in combination Figure 5 and Figure 7 , the wiring layer 110 includes a plurality of metal connection lines 111, the size of the first metal connection part 400 in the extension direction of the metal connection line 111 is L1, the size of the second metal connection part 500 in the extension direction of the metal connection line 111 is L2; ​​the size of the through hole 310 in the extension direction of the metal connection line 111 is L3; wherein L1+L2≥2L3. Exemplarily, the extension direction of the metal connection line 111 is the first direction mentioned above, for example Figure 5 and Figure 7 When the first metal connection part 400 fills the through hole 310, the size of the first metal connection part 400 in the extension direction of the metal connection line 111 is equal to the size of the through hole 310 in the extension direction of the metal connection line 111, that is, L1 = L3, and L2 ≥ L3.

[0056] In this embodiment, by making L1+L2≥2L3, the size of the through hole 310 in the extension direction of the metal connecting line 111 is larger, which can increase the contact area between the second metal connecting part 500 and the corresponding metal connecting line 111, thereby ensuring the stability of the conductive connection between the light-emitting device 200 and the wiring layer 110.

[0057] In one embodiment, Figure 5As shown, the substrate 100 also includes a first insulating protective layer 120, which is disposed between the wiring layer 110 and the reflective layer 300, and the through hole 310 penetrates the first insulating protective layer 120; wherein, the orthographic projection of the first insulating protective layer 120 on the projection surface covers the orthographic projection of the wiring layer 110 on the projection surface. Thus, compared with the first and second driving backplanes described above, the first window area can be avoided, and the wiring layer 110 can be avoided from being exposed in the first window area, so that the first insulating protective layer 120 can better protect the wiring layer 110, thereby avoiding contamination or damage to the wiring layer 110, and at the same time, corrosion of the wiring layer 110 during the trust process can be avoided. Optionally, the first insulating protective layer 120 can be a PI layer to improve the bending resistance of the substrate 100; the thickness of the first insulating protective layer 120 can be 0.02mm to 0.03mm (including the end value), such as 0.025mm, but is not limited thereto.

[0058] In one embodiment, reference Figure 5 and Figure 7 The substrate 100 also includes a second insulating protective layer 130, which is arranged on the side of the wiring layer 110 that is away from the reflective layer 300; wherein the orthographic projection of the second insulating protective layer 130 on the projection plane covers the orthographic projection of the light-emitting device 200 on the projection plane and covers the orthographic projection of the wiring layer 110 on the projection plane, and the second insulating protective layer 130 can play an effective protective role, protecting the wiring layer 110 from the influence of external impurities such as moisture and dust, thereby ensuring the reliability of the driving backplane 10.

[0059] Exemplarily, when the driving backplane 10 includes the first metal connection part 400 and the second metal connection part 500, the orthographic projection of the second insulating protection layer 130 on the projection plane can cover the orthographic projection of the first metal connection part 400 on the projection plane, and can cover the orthographic projection of the second metal connection part 500 on the projection plane. Optionally, the second insulating protection layer 130 can be a PI layer; the thickness of the second insulating protection layer 130 can be 0.02 mm to 0.03 mm (including the end value), such as 0.025 mm, but is not limited thereto.

[0060] In one embodiment, Figure 5As shown, the driving backplane 10 also includes a protective adhesive layer 600, which is disposed on the side of the light-emitting device 200 away from the substrate 100; wherein the protective adhesive layer 600 can be an integral structure, and the orthographic projection of the protective adhesive layer 600 on the projection surface covers the orthographic projections of multiple light-emitting devices 200 on the projection surface. Exemplarily, at this time, the size of the portion of the protective adhesive layer 600 corresponding to the reflective layer 300 in the direction perpendicular to the projection surface can be 0.2mm to 0.3mm (including the end value), such as 0.25mm, so as to effectively protect the light-emitting device 200. Wherein, "the portion of the protective adhesive layer 600 corresponding to the reflective layer 300" refers to the portion of the protective adhesive layer 600 corresponding to the reflective layer 300, and the orthographic projection of this portion on the projection surface is located within the orthographic projection of the reflective layer 300 on the projection surface.

[0061] Figure 8 FIG. 2 shows a schematic cross-sectional structure diagram of a driving backplane 10 according to another embodiment of the present application. Figure 8 As shown, the protective glue layer 600 may include a plurality of protective glue portions 610 arranged at intervals, and the orthographic projection of each protective glue portion 610 on the projection surface covers the orthographic projection of the corresponding light-emitting device 200 on the projection surface. Exemplarily, the plurality of protective glue portions 610 may be arranged in a one-to-one correspondence with the plurality of light-emitting devices 200. At this time, the maximum size of the protective glue portion 610 in the direction perpendicular to the projection surface may be 0.45 mm to 0.55 mm (including the end value), such as 0.5 mm, to better protect the light-emitting device 200.

[0062] Fig. 9A preparation process diagram of a driving backplane according to an embodiment of the present application is shown. Exemplarily, the preparation process of the driving backplane may include the following steps: Step (a): Provide a substrate 100. The substrate 100 includes a wiring layer 110 and a first insulating protective layer 120 disposed on one side of the wiring layer 110. Step (b): Dispose a reflective layer 300A to be opened on the side of the first insulating protective layer 120 away from the wiring layer 110. For example, the reflective layer 300A to be opened may be a reflective sheet, and the reflective sheet may be attached to the first insulating protective layer 120. Step (c): Form a through hole 310 on the reflective layer 300A to be opened to obtain a reflective layer 300; wherein the through hole 310 passes through the first insulating protective layer 120 and the wiring layer 110. For example, the through hole 310 may be formed by laser. Step (d): Fill the through hole 310 with the first metal connection part 400, and arrange the second metal connection part 500 on the surface of the wiring layer 110 on the side away from the reflective layer 300. For example, the first metal connection part 400 can be printed on the through hole 310 and the second metal connection part 500 can be printed on the wiring layer 110 by a printing process. Step (e): Arrange the second insulating protective layer 130 on the side of the wiring layer 110 away from the first insulating protective layer 120, so that the second insulating protective layer 130 covers the wiring layer 110, the first insulating protective layer 120 and the second insulating protective layer 130; and connect the light-emitting device 200 to the corresponding first metal connection part 400 to achieve electrical connection between the light-emitting device 200 and the wiring layer 110. The light-emitting device 200 includes a light-emitting part 210 and a connecting pin 220, and the connecting pin 220 is connected to the side of the light-emitting part 210 facing the substrate 100. The first metal connection portion 400 is connected to the connection pin 220. Step (f): forming a protective adhesive layer 600 on a side of the reflective layer 300 away from the wiring layer 110.

[0063] In this embodiment, by providing the protective adhesive layer 600 , the protective adhesive layer 600 can effectively protect the light emitting device 200 and improve the light shape of the light emitting device 200 .

[0064] A second aspect of the present application provides a method for preparing a driving backplane 10 , which is applied to the driving backplane 10 in any of the above-mentioned embodiments. Fig.10 FIG. 1 is a schematic diagram showing a process of manufacturing a driving backplane 10 according to an embodiment of the present application. Fig. 9 and Fig.10 As shown, the preparation method comprises:

[0065] Step S1001: providing a substrate 100, wherein the substrate 100 includes a wiring layer 110. For example, a first insulating protection layer 120 may be provided on one side of the wiring layer 110.

[0066] Step S1002 : a reflective layer 300A to be drilled is provided on one side of the substrate 100 . For example, the reflective layer 300A to be drilled may be a reflective sheet, and the reflective sheet may be attached to the first insulating protective layer 120 .

[0067] Step S1003: forming a through hole 310 on the reflective layer 300A to be opened, thereby obtaining the reflective layer 300, wherein the through hole 310 passes through the wiring layer 110. For example, the through hole 310 can be formed by laser, so that the through hole 310 passes through the first insulating protection layer 120 and the wiring layer 110.

[0068] Step S1004 : a light emitting device 200 is disposed on the side of the substrate 100 where the reflective layer 300 is disposed, and the light emitting device 200 is electrically connected to the wiring layer 110 through the through hole 310 .

[0069] According to the method for preparing the driving backplane of the embodiment of the present application, the reflective layer 300A to be opened can be first arranged on one side of the substrate 100, and then a through hole 310 can be formed on the reflective layer 300A to be opened. There is no need to consider the manufacturing accuracy of the through hole 310 and the attachment or printing accuracy of the reflective layer 300, thereby avoiding the appearance of a window area, and making the orthographic projection of the light-emitting device 200 on the projection surface cover the orthographic projection of the through hole 310 on the projection surface, which can effectively improve the reflectivity of the reflective layer 300, improve the light efficiency, and thus improve the overall optical effect of the driving backplane 10.

[0070] The third aspect of the present application provides a display device, including the driving backplane 10 of any of the above embodiments. Exemplarily, the display device can be a tablet computer, a mobile phone, an e-reader, a remote controller, a personal computer (PC), a laptop, a personal digital assistant (PDA), a vehicle-mounted device, an Internet TV, a wearable device, a TV, and other intelligent devices with network functions. The embodiments of the present application do not limit the specific form of the display device.

[0071] The driving backplane 10 and other components of the display device in the above embodiment may adopt various technical solutions known to ordinary technicians in the field now and in the future, and will not be described in detail here.

[0072] In the description of this specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0073] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0074] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0075] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0076] The disclosure above provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described above. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numerals and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0077] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A driving backplane, characterized in that: include: Substrate, including routing layers; A light emitting device is disposed on one side of the substrate; A reflective layer is arranged on the same side of the substrate as the light-emitting device, the reflective layer is provided with a through hole, the through hole passes through the wiring layer, and the light-emitting device is electrically connected to the wiring layer through the through hole; wherein the orthographic projection of the light-emitting device on the projection plane covers the orthographic projection of the through hole on the projection plane, and the projection plane is parallel to the reflective layer.

2. The driving backplane according to claim 1, characterized in that: The light-emitting device includes a light-emitting part and a connecting pin, wherein the connecting pin is connected to a side of the light-emitting part facing the substrate, and the connecting pin is electrically connected to the wiring layer through the through hole; wherein the orthographic projection of the connecting pin on the projection plane is located within the orthographic projection of the through hole on the projection plane.

3. The driving backplane according to claim 2, characterized in that: A minimum distance between an orthographic projection of the connecting pin on the projection plane and an orthographic projection of the through hole on the projection plane is greater than or equal to 10 μm.

4. The driving backplane according to claim 3, characterized in that: The light emitting device comprises two connecting pins arranged at intervals in a first direction, each connecting pin being electrically connected to the wiring layer through one of the through holes; The orthographic projection of each of the connecting pins on the projection plane includes a first edge and a second edge arranged opposite to each other in the first direction and two third edges arranged opposite to each other in the second direction, the first edge is arranged close to another connecting pin, and the second direction is perpendicular to the first direction; The orthographic projection of the through hole on the projection plane includes two fourth edges arranged opposite to each other in the first direction and two fifth edges arranged opposite to each other in the second direction; The distance between the first edge and its adjacent fourth edge is greater than or equal to 10 μm, the distance between the second edge and its adjacent fourth edge is greater than or equal to 20 μm, and the distance between the third edge and its adjacent fifth edge is greater than or equal to 20 μm.

5. The driving backplane according to claim 1, characterized in that: Also includes: A first metal connection portion filled in the through hole, wherein the first metal connection portion is electrically connected to the light-emitting device and the wiring layer; The second metal connection portion is connected to the first metal connection portion, and the second metal connection portion is arranged on a surface of the wiring layer on a side away from the reflective layer.

6. The driving backplane according to claim 5, characterized in that: A size of the second metal connection portion in a direction perpendicular to the projection plane is greater than or equal to 30 μm.

7. The driving backplane according to claim 5, characterized in that: The routing layer includes multiple metal connecting lines, the size of the first metal connecting part in the extension direction of the metal connecting line is L1, the size of the second metal connecting part in the extension direction of the metal connecting line is L2; ​​the size of the through hole in the extension direction of the metal connecting line is L3; wherein L1+L2≥2L3.

8. The driving backplane according to any one of claims 1 to 7, characterized in that: The substrate also includes a first insulating protective layer, which is arranged between the wiring layer and the reflective layer, and the through hole penetrates the first insulating protective layer; wherein the orthographic projection of the first insulating protective layer on the projection plane covers the orthographic projection of the wiring layer on the projection plane.

9. The driving backplane according to any one of claims 1 to 7, characterized in that: The substrate also includes a second insulating protective layer, which is arranged on the side of the wiring layer away from the reflective layer; wherein the orthographic projection of the second insulating protective layer on the projection plane covers the orthographic projection of the light-emitting device on the projection plane and covers the orthographic projection of the wiring layer on the projection plane.

10. The driving backplane according to any one of claims 1 to 7, characterized in that: Also includes: A protective adhesive layer is arranged on a side of the light-emitting device away from the substrate; wherein the protective adhesive layer is an integral structure, and the orthographic projection of the protective adhesive layer on the projection surface covers the orthographic projections of a plurality of the light-emitting devices on the projection surface; Alternatively, the protective adhesive layer includes a plurality of protective adhesive portions that are spaced apart from each other, and the orthographic projection of each protective adhesive portion on the projection surface covers the orthographic projection of the corresponding light emitting device on the projection surface.

11. The driving backplane according to claim 10, characterized in that: In the case where the protective adhesive layer is an integral structure, the size of the portion of the protective adhesive layer corresponding to the reflective layer in a direction perpendicular to the projection surface is 0.2 mm to 0.3 mm; in the case where the protective adhesive layer includes a plurality of protective adhesive portions, the maximum size of the protective adhesive portion in a direction perpendicular to the projection surface is 0.45 mm to 0.55 mm; And / or the size of the reflective layer in a direction perpendicular to the projection surface is 0.02 mm to 0.1 mm.

12. A method for preparing a driving backplane, characterized in that: Applicable to the driving backplane according to any one of claims 1 to 11, the preparation method comprising: Providing a substrate; wherein the substrate includes a wiring layer; Disposing a reflective layer to be opened on one side of the substrate; Forming a through hole on the reflective layer to be opened to obtain a reflective layer; wherein the through hole passes through the routing layer; A light emitting device is arranged on the side of the substrate where the reflective layer is arranged, and the light emitting device is electrically connected to the wiring layer through the through hole.

13. A display device, characterized in that: Comprising a driving backplane according to any one of claims 1-11.

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