Oxygen Sensor Chip Assembly Module and Oxygen Sensor Assembly Equipment

Abstract

The present invention discloses an oxygen sensor chip assembly module and an oxygen sensor assembly device. The oxygen sensor chip assembly module includes a conveying module and an oxygen sensor chip loading module. The conveying module includes a plurality of fixtures that move along the conveying direction, and the fixtures are adapted to carry the oxygen sensor base. The oxygen sensor chip loading module includes an alignment mechanism, and the alignment mechanism is adapted to one of the plurality of fixtures. The alignment mechanism includes an alignment bracket and positioning jaws that are connected to the alignment bracket and can open and close. The alignment bracket is provided with an alignment hole, and the alignment hole is adapted for the oxygen sensor chip to pass through. The positioning jaws are adapted to clamp and position the oxygen sensor base. Along the vertical direction, the alignment hole, the positioning jaws, and the fixture are arranged in sequence. By providing the alignment mechanism, the relative positions of the oxygen sensor chip and the oxygen sensor base are fixed by the cooperation of the positioning jaws and the alignment hole of the alignment mechanism, ensuring the assembly accuracy between the two.

Description

Technical Field

[0001] The present invention relates to the technical field of oxygen sensor production equipment, and particularly relates to an oxygen sensor chip assembly module and an oxygen sensor assembly device. Background Art

[0002] In the related art, during the manufacturing process of an oxygen sensor, it is necessary to assemble an oxygen sensor chip, an oxygen sensor component to be installed, and an oxygen sensor base. During the assembly process, extremely high requirements are placed on the accuracy of the movement and positioning of the oxygen sensor base and the oxygen sensor chip, resulting in difficulties in assembly. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. For this purpose, the present invention provides an oxygen sensor chip assembly module and an oxygen sensor assembly device, which can hold and position the whole of the oxygen sensor base and the oxygen sensor component to be installed through positioning jaws, and set a guiding hole relatively fixed to the positioning jaws for guiding the oxygen sensor chip, ensuring accurate positioning of the oxygen sensor chip, the oxygen sensor component to be installed, and the oxygen sensor base, and efficient assembly.

[0004] On the one hand, an embodiment of the present invention provides an oxygen sensor chip assembly module for producing an oxygen sensor, the oxygen sensor including an oxygen sensor base and an oxygen sensor chip, including:

[0005] A conveying module, including a plurality of fixtures moving along a conveying direction, the fixtures being adapted to carry the oxygen sensor base;

[0006] An oxygen sensor chip loading module, including a guiding mechanism, the guiding mechanism being adapted to one of the plurality of fixtures, the guiding mechanism including a guiding bracket and positioning jaws connected to the guiding bracket and capable of opening and closing, the guiding bracket being provided with a guiding hole, the guiding hole being adapted for the oxygen sensor chip to pass through; the positioning jaws being adapted to hold and position the oxygen sensor base; along the vertical direction, the guiding hole, the positioning jaws, and the fixture are arranged in sequence.

[0007] According to some embodiments of the present invention, the guiding bracket includes a guiding moving module and two guiding clamping arms, the two guiding clamping arms being adapted to independently move along a first direction under the drive of the guiding moving module, and the two guiding clamping arms being capable of being combined and surrounding to form the guiding hole.

[0008] According to some embodiments of the present invention, the fixture includes a loading base and a chip adjusting mechanism, the loading base being provided with a loading through hole, the chip adjusting mechanism including a chip adjusting piece, the chip adjusting piece being arranged in the loading through hole and capable of telescopic movement along the axis of the loading through hole.

[0009] According to some embodiments of the present invention, the oxygen sensor chip assembly module further includes a chip height adjustment mechanism, which is adapted to one of several of the fixtures. The chip height adjustment mechanism includes an adjustment rod and an adjustment driving component. The adjustment rod is adapted to be connected to the chip adjustment piece under the drive of the adjustment driving component and drive the chip adjustment piece to perform telescopic movement.

[0010] According to some embodiments of the present invention, one of the chip adjustment piece and the adjustment rod is provided with a limiting groove, and the other is provided with a plug-in portion that cooperates with the limiting groove.

[0011] According to some embodiments of the present invention, the chip adjustment piece is provided with a first limiting portion and a second limiting portion, and the first limiting portion and the second limiting portion are arranged in sequence along the telescopic direction of the chip adjustment piece;

[0012] The loading base is provided with an elastic limiting pin, and the elastic head of the elastic limiting pin is adapted to cooperate with the first limiting portion or the second limiting portion for limiting.

[0013] According to some embodiments of the present invention, the loading base further includes an elastically telescopic plug connector. The chip adjustment piece is provided with a plug-in groove corresponding to the plug connector, and the plug-in groove is located between the first limiting portion and the second limiting portion;

[0014] The plug-in groove is provided with a stop surface and a guiding surface arranged in sequence along the telescopic direction of the chip adjustment piece. The stop surface is perpendicular to the telescopic direction, and the guiding surface is arranged at an angle to the telescopic direction. The plug connector can move and expand and contract along the guiding surface, and the stop surface can abut against the plug connector for limiting.

[0015] According to some embodiments of the present invention, the fixture further includes a base positioning block, which is fixed on one side of the axis of the loading base. The base positioning block is provided with a base positioning groove, and the opening of the base positioning groove faces the axis of the loading base. The base positioning groove is adapted to cooperate with the oxygen sensor base for limiting.

[0016] According to some embodiments of the present invention, the conveying module further includes a plurality of positioning mechanisms, which are fixed on one side of the fixture. The positioning mechanism includes a positioning ejector rod and an ejector rod driving member. A fixture positioning groove cooperating with the positioning ejector rod is provided on the fixture, and the positioning ejector rod is adapted to cooperate and be fixed with the fixture positioning groove under the drive of the ejector rod driving member.

[0017] On the other hand, the present invention also provides an oxygen sensor assembly device, including the oxygen sensor chip assembly module as described above.

[0018] The embodiments of the present invention have at least the following beneficial effects: By providing an alignment mechanism, the relative positions of the oxygen sensor chip and the oxygen sensor base are fixed through the cooperation of the positioning jaws and the alignment holes of the alignment mechanism, ensuring the assembly accuracy between the two. There is no need to set a conveying module with high-precision movement to convey the fixture or a handling mechanism to handle the oxygen sensor chip, nor is it necessary to set a high-precision fit between the oxygen sensor base and the fixture or a high-precision clamping between the handling mechanism and the oxygen sensor chip, greatly reducing the manufacturing cost of the oxygen sensor chip assembly module and effectively improving the efficiency and yield of oxygen sensor assembly.

[0019] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0021] Figure 1 is a schematic structural diagram of an oxygen sensor chip assembly module according to an embodiment of the present invention;

[0022] Figure 2 is Figure 1 an enlarged view of a partial area A in

[0023] Figure 3 is a top view of a fixture and an oxygen sensor according to an embodiment of the present invention;

[0024] Figure 4 is Figure 3 a cross-sectional view taken along the section line B-B in

[0025] Figure 5 is an assembled schematic diagram of a fixture and a chip height adjustment mechanism according to an embodiment of the present invention;

[0026] Figure 6 is a top view of an oxygen sensor assembly device according to an embodiment of the present invention.

[0027] Reference numerals:

[0028] 400. Conveyor module; 410. Fixture; 411. Fixture positioning groove; 412. Loading base; 4121. Loading through-hole; 4122. Elastic limit pin; 4123. Plug connector; 413. Chip adjustment mechanism; 4131. Chip adjustment piece; 41311. Limit groove; 41312. First limit portion; 41313. Second limit portion; 41314. Plug-in groove; 41315. Stopping surface; 41316. Guide surface; 414. Base positioning block; 4141. Base positioning groove; 440. Positioning mechanism; 441. Positioning ejector rod; 442. Ejector rod driving member; 470. Chip height adjustment mechanism; 471. Adjusting rod; 4711. Plug-in portion; 472. Adjusting driving assembly;

[0029] 100. Oxygen sensor chip feeding module; 130. Alignment mechanism; 131. Alignment bracket; 1311. Alignment hole; 1312. Alignment moving module; 1313. Alignment clamping arm; 132. Positioning clamping jaw;

[0030] 910. Oxygen sensor chip; 920. Oxygen sensor base; 930. Oxygen sensor to-be-installed part. Detailed implementation manners

[0031] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0032] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, front, back, left, right, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0033] In the description of the present invention, the meaning of "several" is one or more, the meaning of "multiple" is two or more, greater than, less than, exceeding, etc. are understood not to include the present number, and "above", "below", "within", etc. are understood to include the present number. If there is a description of "first", "second", etc., it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0034] In the description of the present invention, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0035] Please refer to Figure 1 , Figure 2 , Figure 4 and Figure 6 As shown, on the one hand, an oxygen sensor chip assembly module according to an embodiment of the present invention is provided for producing an oxygen sensor. The oxygen sensor includes an oxygen sensor base 920, an oxygen sensor to-be-installed part 930, and an oxygen sensor chip 910. The oxygen sensor chip assembly module includes a conveying module 400 and an oxygen sensor chip loading module 100. The conveying module 400 includes a plurality of jigs 410 that move along the conveying direction (the illustrated X direction), and the jigs 410 are adapted to carry the oxygen sensor base 920. The oxygen sensor chip loading module 100 includes an alignment mechanism 130, and the alignment mechanism 130 is adapted to one of the plurality of jigs 410. The alignment mechanism 130 includes an alignment bracket 131 and a positioning jaw 132 that is connected to the alignment bracket 131 and can open and close. The alignment bracket 131 is provided with an alignment hole 1311, and the alignment hole 1311 is adapted for the oxygen sensor chip 910 to pass through. The positioning jaw 132 is adapted to clamp and position the oxygen sensor base 920. Along the vertical direction, the alignment hole 1311, the positioning jaw 132, and the jig 410 are arranged in sequence.

[0036] It should be noted that in the related art, during the manufacturing process of the oxygen sensor, it is necessary to assemble the oxygen sensor chip 910, the oxygen sensor to-be-installed part 930, and the oxygen sensor base 920. Usually, the oxygen sensor chip 910 is directly moved above the jig 410 by a handling mechanism and assembled with the oxygen sensor base 920 carried by the jig 410. In order to ensure the high efficiency of the assembly process, this technical solution has high requirements for the moving accuracy of the handling mechanism and the jig 410, as well as the clamping accuracy between the handling mechanism and the oxygen sensor chip 910 or the placement accuracy of the oxygen sensor base 920 on the jig 410, resulting in problems such as high accuracy requirements, high costs, and low assembly efficiency.

[0037] In the oxygen sensor chip assembly module according to the embodiment of the present invention, the jig 410 conveys the oxygen sensor base 920 along the conveying direction, and other components (such as the oxygen sensor to-be-installed part 930) except the oxygen sensor chip 910 are assembled during the conveying process. Then, it moves to the lower part of the oxygen sensor chip loading module 100, and the positioning jaw 132 of the alignment mechanism 130 clamps the oxygen sensor base 920, so that the oxygen sensor base 920 and the oxygen sensor to-be-installed part 930 are adjusted as a whole to correspond to the alignment hole 1311, and the oxygen sensor chip 910 is guided through the alignment hole 1311 and assembled with the oxygen sensor base 920 and the oxygen sensor to-be-installed part 930.

[0038] For the oxygen sensor chip assembly module according to an embodiment of the present invention, by providing the alignment mechanism 130, the relative positions of the oxygen sensor chip 910 and the oxygen sensor base 920 are fixed through the cooperation of the positioning jaws 132 and the alignment holes 1311 of the alignment mechanism 130, ensuring the assembly accuracy between the two. There is no need to provide a conveying module 400 with high-precision movement to convey the fixture 410 or a handling mechanism to handle the oxygen sensor chip 910, nor is it necessary to provide a high-precision fit between the oxygen sensor base 920 and the fixture 410 or a high-precision clamping between the handling mechanism and the oxygen sensor chip 910, greatly reducing the manufacturing cost of the oxygen sensor chip assembly module and effectively improving the efficiency and yield of oxygen sensor assembly.

[0039] In some embodiments, in combination with Figure 1 and Figure 2 As shown, the alignment bracket 131 includes an alignment moving module 1312 and two alignment clamping arms 1313. The two alignment clamping arms 1313 are adapted to move independently along the first direction (Y direction in the figure) under the drive of the alignment moving module 1312, and the two alignment clamping arms 1313 can be combined and surrounded to form an alignment hole 1311. The two alignment clamping arms 1313 arranged in an opposing manner can adapt to oxygen sensor chips 910 of different sizes by adjusting the distance between them; moreover, the two alignment clamping arms 1313 can move independently along the first direction, that is, the alignment hole 1311 formed by the combination of the two alignment clamping arms 1313 can also move along the first direction to adapt to the oxygen sensor chip 910 and different types of oxygen sensor bases 920 (the position of the oxygen sensor chip 910 is different relative to the oxygen sensor base 920 after assembly), improving the adaptation effect of the alignment bracket 131.

[0040] In this embodiment, the number of alignment clamping arms 1313 is two and they move along the first direction. In other embodiments, the number of alignment clamping arms 1313 can also be more, and the moving direction of the alignment clamping arms 1313 can be the radial direction of the alignment hole 1311 to surround and form the alignment hole 1311.

[0041] In this embodiment, the alignment moving module 1312 is in the form of a sliding table cooperating with a sliding groove. In other embodiments, it can also be a cylinder, a screw module, etc.

[0042] In some embodiments, in combination with Figure 3 and Figure 4 As shown, the fixture 410 includes a loading base 412 and a chip adjustment mechanism 413. The loading base 412 is provided with a loading through hole 4121. The chip adjustment mechanism 413 includes a chip adjustment piece 4131. The chip adjustment piece 4131 is arranged in the loading through hole 4121 and can perform telescopic movement along the axis of the loading through hole 4121.

[0043] In this embodiment, when the oxygen sensor chip 910 is not installed on the fixture 410, the fixture 410 of the conveying module 400 flows along the conveying direction, and gradually bears the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 during the flowing process. At this time, the chip adjusting piece 4131 of the chip adjusting mechanism 413 is in the extended state, which is used to occupy a part of the installation position required by the oxygen sensor chip 910, simplifying the feeding difficulty of the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 (the staff or the feeding mechanism can thread the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 through the chip adjusting piece 4131); moreover, after the oxygen sensor to-be-installed part 930 and the oxygen sensor base 920 are matched with the chip adjusting piece 4131, by the contraction of the chip adjusting piece 4131, the oxygen sensor chip 910 is gradually inserted into the oxygen sensor to-be-installed part 930 in the oxygen sensor base 920, greatly reducing the assembly difficulty of the oxygen sensor chip 910.

[0044] In this embodiment, the height of the chip adjusting piece 4131 can be controlled to adapt to oxygen sensor chips 910 of different specifications (different lengths).

[0045] In some embodiments, as shown in Figure 1 and Figure 5 , the oxygen sensor chip assembly module further includes a chip height adjusting mechanism 470. The chip height adjusting mechanism 470 is adapted to one of several fixtures 410. The chip height adjusting mechanism 470 includes an adjusting rod 471 and an adjusting driving component 472. The adjusting rod 471 is adapted to be connected to the chip adjusting piece 4131 under the drive of the adjusting driving component 472, and drive the chip adjusting piece 4131 to do telescopic movement.

[0046] In this embodiment, it can be understood that generally a pre-pressing mechanism is provided for the assembly of the oxygen sensor. The pre-pressing mechanism preliminarily presses the oxygen sensor to-be-installed part 930 and the oxygen sensor chip 910 into a shape (such as a talcum powder preform, a front-end bushing, a rear-end bushing, etc.). Through pre-pressing, it is ensured that the material is evenly distributed, internal stress is reduced, and cracks or deformations are avoided during subsequent processing. During the pre-pressing process, it is necessary to insert the oxygen sensor chip 910 into the oxygen sensor to-be-installed part 930 to a certain depth. When the fixture 410 moves to below the pre-pressing mechanism, the adjusting rod 471 of the chip height adjusting mechanism 470 pulls down the chip adjusting piece 4131 to ensure that the pre-pressing head of the pre-pressing mechanism does not contact the oxygen sensor chip 910.

[0047] In this embodiment, the adjusting driving component 472 is formed by combining several linear movement modules to realize the movement of the adjusting rod 471 in three dimensions. The linear movement module can adopt a cylinder, a slide table module, a lead screw module, etc.

[0048] In some embodiments, as shown in Figure 5As shown, one of the chip adjustment piece 4131 and the adjusting rod 471 is provided with a limiting groove 41311, and the other is provided with a plug-in portion 4711 that cooperates with the limiting groove 41311.

[0049] In this embodiment, taking the chip adjustment piece 4131 being provided with the limiting groove 41311 and the adjusting rod 471 being provided with the plug-in portion 4711 as an example, the groove wall of the limiting groove 41311 is adapted to abut against the plug-in portion 4711. By changing the groove wall against which the plug-in portion 4711 abuts, the adjusting rod 471 can pull down the chip adjustment piece 4131 or move up the chip adjustment piece 4131.

[0050] In other embodiments, the connection mechanism between the chip adjustment piece 4131 and the adjusting rod 471 can also be a magnetic connection, a snap connection, etc.

[0051] In some embodiments, in combination with Figure 3 and Figure 4 As shown, the chip adjustment piece 4131 is provided with a first limiting portion 41312 and a second limiting portion 41313. The first limiting portion 41312 and the second limiting portion 41313 are arranged in sequence along the telescopic direction of the chip adjustment piece 4131 (the illustrated Z direction); the loading base 412 is provided with an elastic limiting pin 4122, and the elastic head of the elastic limiting pin 4122 is adapted to cooperate with the first limiting portion 41312 or the second limiting portion 41313 for limiting.

[0052] In this embodiment, when the chip adjustment piece 4131 moves down to the first limiting portion 41312 to cooperate with the elastic limiting pin 4122, the chip adjustment piece 4131 cannot continue to move down, ensuring that the oxygen sensor chip 910 above the chip adjustment piece 4131 will not fall out of the jig 410; when the chip adjustment piece 4131 moves up to the second limiting portion 41313 to cooperate with the elastic limiting pin 4122, the chip adjustment piece 4131 cannot continue to move up, ensuring that the chip adjustment piece 4131 will not fall out of the jig 410; and the positions of the first limiting portion 41312 and the second limiting portion 41313 can be set based on the distance that the oxygen sensor chip 910 needs to penetrate into the oxygen sensor base 920 and the oxygen sensor to-be-installed part 930. Compared with setting the distance electrically controlled by the adjusting drive assembly 472, the mechanical limit is more reliable.

[0053] In some embodiments, in combination with Figure 3 and Figure 4As shown, the material loading base 412 further includes a plug connector 4123 that can elastically expand and contract. The chip adjustment piece 4131 is provided with a plug slot 41314 corresponding to the plug connector 4123. The plug slot 41314 is located between the first limiting portion 41312 and the second limiting portion 41313. The plug slot 41314 is provided with a stop surface 41315 and a guiding surface 41316 arranged in sequence along the expansion and contraction direction of the chip adjustment piece 4131. The stop surface 41315 is perpendicular to the expansion and contraction direction, and the guiding surface 41316 is arranged at an angle with the expansion and contraction direction. The plug connector 4123 can move and expand and contract along the guiding surface 41316, and the stop surface 41315 can abut against the plug connector 4123 for limiting.

[0054] In this embodiment, when the chip adjustment piece 4131 moves upward, the guiding surface 41316 of the plug slot 41314 abuts against the plug connector 4123 and pushes the plug connector 4123 upward, causing the plug connector 4123 to have a tendency of elastic compression, so that the plug connector 4123 disengages from the plug slot 41314 until the chip adjustment piece 4131 moves to the second limiting portion 41313 and cooperates with the elastic limiting pin 4122 for limiting, and the chip adjustment piece 4131 stops moving. When the chip adjustment piece 4131 moves downward, the plug connector 4123 moves along the side wall of the chip adjustment piece 4131 until the plug connector 4123 is inserted into the plug slot 41314 along the guiding surface 41316 until the plug connector 4123 abuts against the stop surface 41315 and cannot move further, realizing the position fixation of the chip adjustment piece 4131. At the same time, the first limiting portion 41312 and the elastic limiting pin 4122 cooperate for limiting.

[0055] In this embodiment, by setting the form of cooperation between the plug slot 41314 and the plug connector 4123, the plug connector 4123 plays a role in limiting and supporting the chip adjustment piece 4131. When supporting the oxygen sensor chip 910 above the chip adjustment piece 4131, the plug connector 4123 and the plug slot 41314, the first limiting portion 41312 and the elastic limiting pin 4122 jointly realize the fixation of the chip adjustment piece 4131, improving the supporting effect on the oxygen sensor chip 910 while avoiding excessive force on the first limiting portion 41312 and the elastic limiting pin 4122 and damage.

[0056] Moreover, due to the angular setting of the stop surface 41315 and the guiding surface 41316, the plug connector 4123 slides along the guiding surface 41316 to achieve the plugging fit, without the need for an additional device to drive the movement of the plug connector 4123, reducing the volume of the jig 410 and lowering the use cost.

[0057] In this embodiment, the upward movement of the chip adjustment piece 4131 can be realized manually by the staff or by arranging a jacking mechanism under the chip adjustment piece 4131; the downward movement of the chip adjustment piece 4131 can be realized by the aforementioned chip height adjustment mechanism 470.

[0058] In some embodiments, in combination with Figure 5 As shown, the fixture 410 further includes a base positioning block 414. The base positioning block 414 is fixed to one side of the axis of the loading base 412. The base positioning block 414 is provided with a base positioning groove 4141. The opening of the base positioning groove 4141 faces the axis of the loading base 412. The base positioning groove 4141 is adapted to cooperate with the oxygen sensor base 920 for limiting.

[0059] In this embodiment, when the loading base 412 receives the oxygen sensor base 920, the surface of the outer shell part of the oxygen sensor base 920 cooperates with the base positioning groove 4141 and moves along the extending direction of the base positioning groove 4141. The base positioning groove 4141 effectively restricts the rotation of the oxygen sensor base 920 during loading or movement, so as to ensure the accurate positioning of the oxygen sensor base 920 and guarantee the accurate and efficient downstream processes (such as the assembly and pre-pressing of the oxygen sensor chip 910).

[0060] In this embodiment, there is one base positioning block 414, and the base positioning groove 4141 has a triangular cross-section. Of course, the number of the base positioning blocks 414 and the shape of the base positioning groove 4141 can be adaptively adjusted based on the shape of the oxygen sensor base 920.

[0061] In some embodiments, in combination with Figure 1 As shown, the conveying module 400 further includes a plurality of positioning mechanisms 440. The positioning mechanisms 440 are fixed to one side of the fixture 410. The positioning mechanism 440 includes a positioning ejector rod 441 and an ejector rod driving member 442. A fixture positioning groove 411 cooperating with the positioning ejector rod 441 is provided on the fixture 410. The positioning ejector rod 441 is adapted to cooperate with the fixture positioning groove 411 for fixation under the drive of the ejector rod driving member 442.

[0062] In this embodiment, after the fixture 410 moves to the corresponding station, the positioning ejector rod 441 of the positioning mechanism 440 extends under the drive of the ejector rod driving member 442 and inserts into the fixture positioning groove 411 to limit the fixture 410, ensuring accurate positioning of the fixture 410 during the loading or assembly process of any module.

[0063] In this embodiment, the end of the positioning ejector rod 441 is a triangular head, and the fixture positioning groove 411 is a triangular groove. Of course, the specific shapes of the end of the positioning ejector rod 441 and the fixture positioning groove 411 can be adaptively adjusted.

[0064] In this embodiment, the ejector rod driving member 442 is a cylinder. In other embodiments, it can also be a slide module, a lead screw module, etc.

[0065] On the other hand, the present invention also provides an oxygen sensor assembly device, including the above-mentioned oxygen sensor chip assembly module.

[0066] The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the scope of knowledge possessed by those of ordinary skill in the relevant art.

Claims

1. An oxygen sensor chip assembly module for producing an oxygen sensor, the oxygen sensor comprising an oxygen sensor base (920), an oxygen sensor to be mounted (930) and an oxygen sensor chip (910), characterized in that: include: A conveying module (400), comprising a plurality of jigs (410) that move along a conveying direction, wherein the jigs (410) are suitable for carrying the oxygen sensor base (920); An oxygen sensor chip loading module (100) comprises a guiding mechanism (130), wherein the guiding mechanism (130) is adapted to be matched to one of the plurality of jigs (410), wherein the guiding mechanism (130) comprises a guiding support (131) and a positioning clamp (132) connected to the guiding support (131) and capable of opening and closing, wherein the guiding support (131) is provided with a guiding hole (1311), wherein the guiding hole (1311) is suitable for the oxygen sensor chip (910) to pass through; and the positioning clamp (132) is suitable for clamping and positioning the oxygen sensor base (920), so that the oxygen sensor base (920) and the oxygen sensor to-be-mounted component (930) are adjusted as a whole to correspond to the guiding hole (1311); Along the vertical direction, the guide hole (1311), the positioning clamp (132) and the fixture (410) are arranged in sequence.

2. The oxygen sensor chip assembly module according to claim 1, characterized in that: The guiding bracket (131) comprises a guiding movable module (1312) and two guiding clamping arms (1313), wherein the two guiding clamping arms (1313) are adapted to independently move along a first direction under the drive of the guiding movable module (1312), and the two guiding clamping arms (1313) can be combined to surround and form the guiding hole (1311).

3. The oxygen sensor chip assembly module according to claim 1, characterized in that: The fixture (410) comprises a loading base (412) and a chip adjustment mechanism (413); the loading base (412) is provided with a loading through hole (4121); the chip adjustment mechanism (413) comprises a chip adjustment piece (4131); the chip adjustment piece (4131) is arranged in the loading through hole (4121) and is capable of telescopic movement along the axis of the loading through hole (4121).

4. The oxygen sensor chip assembly module according to claim 3, characterized in that: The oxygen sensor chip assembly module further comprises a chip height adjustment mechanism (470), wherein the chip height adjustment mechanism (470) is adapted to be matched to one of the plurality of jigs (410), wherein the chip height adjustment mechanism (470) comprises an adjustment rod (471) and an adjustment drive assembly (472), wherein the adjustment rod (471) is adapted to be connected to the chip adjustment plate (4131) under the drive of the adjustment drive assembly (472), and drives the chip adjustment plate (4131) to perform telescopic movement.

5. The oxygen sensor chip assembly module according to claim 4, characterized in that: One of the chip adjustment piece (4131) and the adjustment rod (471) is provided with a limiting groove (41311), and the other is provided with a plug-in portion (4711) that cooperates with the limiting groove (41311).

6. The oxygen sensor chip assembly module according to claim 4, characterized in that: The chip adjustment piece (4131) is provided with a first limiting portion (41312) and a second limiting portion (41313), and the first limiting portion (41312) and the second limiting portion (41313) are arranged in sequence along the extension and retraction direction of the chip adjustment piece (4131); The loading base (412) is provided with an elastic limiting pin (4122), and the elastic head of the elastic limiting pin (4122) is suitable for cooperating with the first limiting portion (41312) or the second limiting portion (41313) to limit the position.

7. The oxygen sensor chip assembly module according to claim 6, characterized in that: The material loading base (412) further comprises an elastically retractable plug connector (4123), the chip adjustment sheet (4131) is provided with a plug connector slot (41314) corresponding to the plug connector (4123), and the plug connector slot (41314) is located between the first limiting portion (41312) and the second limiting portion (41313); The plug-in slot (41314) is provided with a stop surface (41315) and a guide surface (41316) which are sequentially arranged along the extension and retraction direction of the chip adjustment piece (4131); the stop surface (41315) is perpendicular to the extension and retraction direction; the guide surface (41316) is arranged at an angle to the extension and retraction direction; the plug-in connector (4123) can move and retract along the guide surface (41316); and the stop surface (41315) can abut against the plug-in connector (4123) to limit the position.

8. The oxygen sensor chip assembly module according to claim 3, characterized in that: The fixture (410) further comprises a base positioning block (414), wherein the base positioning block (414) is fixed to one side of the axis of the loading base (412), and the base positioning block (414) is provided with a base positioning groove (4141), wherein the opening of the base positioning groove (4141) faces the axis of the loading base (412), and the base positioning groove (4141) is suitable for cooperating with the oxygen sensor base (920) for limiting position.

9. The oxygen sensor chip assembly module according to any one of claims 1 to 8, characterized in that: The conveying module (400) further comprises a plurality of positioning mechanisms (440), wherein the positioning mechanisms (440) are fixed to one side of the jig (410), the positioning mechanisms (440) comprising a positioning push rod (441) and a push rod driving member (442), and a jig positioning groove (411) cooperating with the positioning push rod (441) is provided on the jig (410), and the positioning push rod (441) is suitable for being matched and fixed with the jig positioning groove (411) under the drive of the push rod driving member (442).

10. An oxygen sensor assembly device, characterized in that: It comprises the oxygen sensor chip assembly module as described in any one of claims 1 to 9.

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