Building anti-compression extruded composite board and preparation method thereof

Abstract

The invention relates to the field of building materials, in particular to a building anti-compression extruded composite board and a preparation method thereof. Comprising an extrusion molding layer, two connecting layers and two surface layers, the extrusion molding layer is located between the two connecting layers, the two faces of the extrusion molding layer are connected with the surface layers through the connecting layers, and the extrusion molding layer is prepared from, by weight, 70%-90% of polystyrene, 1%-5% of foaming agents, 1%-3% of nucleating agents, 5%-20% of modifying agents and the balance processing agents; the modifier is prepared by mixing alkenyl-containing polysiloxane, methacryloyloxymethyl) triethoxysilane, epoxy modified resin, a reactive diluent, an initiator and filling powder according to a weight ratio of 1: (0.1 to 0.3): (0.3 to 1.5): (1 to 3): (0.01 to 0.04): (1 to 3); and the connecting layer is prepared from a bonding material containing a modifier. By means of the technical scheme, the obtained extruded composite board has good compression resistance and a stable structure, and the possibility that the layer structure falls off in a high-humidity environment is reduced.

Description

Technical Field

[0001] The present application relates to the field of building materials, and more specifically, to a building compression-resistant extruded composite board and a preparation method thereof. Background Art

[0002] As a common building material, extruded board is widely used in decoration scenes such as walls, floors, countertops, etc. It plays an important role in the construction industry due to its light weight, heat preservation, sound insulation and other characteristics. However, as people's requirements for living environment continue to increase, existing extruded boards have gradually exposed some problems in practical applications, especially in high humidity and load-bearing environments, where these problems are more prominent.

[0003] In order to meet these challenges, various methods are used in the existing technology to improve the performance of extruded boards. For example, different types of additives are added to improve its mechanical properties and durability; special adhesives are used to enhance the bonding between layers; and multi-layer composite structures are used to improve overall stability and compressive resistance.

[0004] Although the above methods have alleviated some of the problems to a certain extent, there are still obvious shortcomings. Especially when under pressure for a long time in a high humidity environment, the existing extruded boards are still prone to problems such as interlayer shedding, bending and even damage, which seriously affects their service life and safety. Therefore, it is urgent to develop a new type of extruded composite board that can maintain good performance under high humidity and load-bearing conditions to meet market demand and the needs of technological development. Summary of the invention

[0005] The purpose of the present application is to overcome the above technical problems and provide a building compression-resistant extruded composite board and a preparation method. In the first aspect, a building compression-resistant extruded composite board comprises an extruded layer, two connecting layers and two surface layers, wherein the extruded layer is located between the two connecting layers, and both sides of the extruded layer are connected to the surface layer through the connecting layer, and the extruded layer is made of the following raw materials in weight percentage: Polystyrene 70-90% Foaming agent 1-5% Nucleating agent 1-3% Modifier 5-20% The balance is processing aids; The modifier is prepared by mixing alkenyl-containing polysiloxane, methacryloxymethyl)triethoxysilane, epoxy modified resin, reactive diluent, initiator and filler powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3); The connecting layer is made of an adhesive containing a modifier.

[0006] By adopting the above technical solution, the compressive strength and interlayer connection stability of the extruded composite board can be significantly improved. Specifically: Modifier: The modifier, which is composed of alkenyl-containing polysiloxane, methacryloyloxymethyl) triethoxysilane, epoxy modified resin, active diluent, initiator, and filler powder, not only enhances the dispersibility of the filler, but also improves the overall performance of the composite board. These ingredients work synergistically to give the extruded layer better mechanical properties and waterproofness.

[0007] Connecting layer: Since the connecting layer contains a binder with a modifier, the adhesion between the connecting layer and the extruded layer is stronger, thus effectively preventing the layer structure from falling off in a high humidity environment. This further improves the durability and practicality of the composite board.

[0008] In summary, this technical solution effectively solves the problem of layer structure shedding and bending that is prone to occur in existing extruded boards during long-term use, especially in high humidity and load-bearing environments.

[0009] Compounding of alkenyl-containing polysiloxane, methacryloyloxymethyl)triethoxysilane, epoxy modified resin and active diluent can further promote the dispersibility of the filler, so that the formed modifier has better comprehensive performance. After curing, the modifier is used in the extrusion layer to further enhance the compressive strength of the composite board and further enhance the stability of the connecting layer.

[0010] By adopting the above technical solution, the dispersibility of the filler can be further promoted, so that the formed modifier has better comprehensive performance. After being cured, the modifier is used in the extrusion layer to further enhance the compression strength of the composite board and the stability between the connecting layers.

[0011] Since the connecting layer is made of an adhesive containing a modifier, it is easier to adhere to the extruded layer, thereby further improving the connection stability of the composite board structure.

[0012] By adopting the above technical solution, since the connecting layer is made of an adhesive containing a modifier, the adhesion between the connecting layer and the extruded layer is significantly enhanced, further improving the connection stability of each layer structure of the composite board. This not only effectively prevents the problem of interlayer shedding that may occur during long-term use, but also enhances the overall compression resistance and waterproofness of the composite board, thereby improving its practicality and durability in high humidity environments and load-bearing conditions.

[0013] In addition, alkenyl-containing polysiloxane, methacryloyloxymethyl)triethoxysilane, and epoxy-modified resin all play a waterproof role, further improving its waterproof properties, and the filling powder can also enhance the compressive strength of the connecting layer, thereby obtaining an extruded composite board with better layer structure stability and compression resistance, and reducing damage and delamination in long-term pressure and humid environments, thereby improving its practicality.

[0014] By adopting the above technical solution, alkenyl-containing polysiloxane, methacryloyloxymethyl)triethoxysilane, and epoxy modified resin all play a waterproof role, further improving the waterproof performance of the composite board. At the same time, the filling powder enhances the compressive strength of the connecting layer, so that the extruded composite board has good layer structure stability and compression resistance, reducing the damage and delamination in a long-term pressurized environment and a humid environment, thereby significantly improving the practicality and durability of the product.

[0015] Preferably, the filling powder in the modifier of the extrusion layer is PI powder and / or PEEK powder.

[0016] By adopting the above technical solution, the filler powder in the modifier of the extrusion layer is selected from PI powder and / or PEEK powder. These high-performance polymer materials have excellent mechanical properties and thermal stability. As filler powder, they can play the role of supporting the skeleton, and cooperate with alkenyl-containing polysiloxane, epoxy modified resin, active diluent, and initiator to further improve the compression resistance of the composite board. Especially in load-bearing environments, such as flooring, partitions, countertops and other decoration applications, this improvement can significantly improve the durability and service life of the product and reduce damage and delamination caused by long-term pressure.

[0017] PI powder and PEEK powder are both high-performance polymer materials with excellent mechanical properties and thermal stability. As filling powders, they can play the role of supporting the skeleton and cooperate with olefin-containing polysiloxanes, epoxy-modified resins, active diluents, and initiators to further improve the compression resistance of the composite board.

[0018] By adopting the above technical solution, PI powder and PEEK powder, as high-performance polymer materials, have excellent mechanical properties and thermal stability, and play the role of supporting skeleton in the extrusion layer. These filling powders work synergistically with alkenyl-containing polysiloxane, epoxy-modified resin, active diluent, and initiator to further improve the compression resistance of the composite board.

[0019] Preferably, the connecting layer is formed by curing an adhesive, and the adhesive is composed of the following raw materials in percentage by weight: Epoxy resin 55-70% Curing agent 3-8% Modifier 3-15% The balance is epoxy resin diluent; The modifier is obtained by mixing alkenyl-containing polysiloxane, methacryloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator and filling powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3).

[0020] By adopting the above technical solution, a specific proportion of epoxy resin, curing agent, modifier and epoxy resin diluent is added to the adhesive of the connecting layer, so that the connecting layer not only has good waterproofness and adhesion, but also significantly enhances the overall structural stability of the composite board. Specifically, the synergistic effect of alkenyl-containing polysiloxane, methacryloxymethyl)triethoxysilane and epoxy modified resin improves the comprehensive performance of the adhesive, especially in high humidity environment. It can still maintain good stability and durability. At the same time, the addition of filling powder further improves the compressive strength of the connecting layer, thereby effectively preventing bending and delamination after long-term pressure, and improving the practicality and life of the composite board.

[0021] Preferably, when a modifier is added, its comprehensive performance is further enhanced. According to the compression-resistant extruded composite board for construction described in claim 3, the filling powder in the modifier of the adhesive is composed of nitrile rubber powder, PI powder, and PEEK powder in a weight ratio of 3: (0.5-1): (0.1-0.5).

[0022] By adopting the above technical solution, the connection layer of the composite board not only has high adhesion and waterproof properties, but also further enhances its compressive strength and stability. Specifically: Enhanced compressive strength: The combination of nitrile rubber powder, PI powder, and PEEK powder significantly improves the mechanical properties of the connecting layer, especially the compressive strength. These high-performance polymer materials have excellent mechanical properties and thermal stability, and can maintain good structural integrity in a long-term compressive environment.

[0023] Improve interlayer stability: The alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, epoxy-modified resin and other ingredients in the modifier can effectively promote the dispersion of fillers, making the adhesion between the connecting layer and the extruded layer stronger, thereby reducing the layer structure shedding phenomenon caused by long-term use.

[0024] Improve waterproof performance: Each component in the modifier, such as alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, and epoxy-modified resin, has good waterproof properties, which further improves the overall waterproof performance of the composite board. It is particularly suitable for applications in high-humidity environments and avoids damage caused by moisture penetration.

[0025] Preferably, the particle size of the filling powder is 1-20 μm.

[0026] By adopting the above technical solution, the particle size of the filling powder is controlled within the range of 1-20μm, which can effectively improve the uniformity and density of the internal structure of the composite board. Specifically, the smaller particle size helps the filling powder to be better dispersed in the modifier, thereby enhancing the overall mechanical properties of the composite material, especially the compressive strength and durability. At the same time, the fine particles can also increase the surface area, improve the compatibility and interfacial bonding with other components, and further enhance the interlayer connection stability and waterproof performance of the composite board. These improvements enable the composite board to exhibit better performance in long-term pressure and humid environments, reducing the risk of layer structure shedding and damage.

[0027] Preferably, the alkenyl-containing polysiloxane is vinyl-terminated dimethyl polysiloxane and / or polymethylsiloxane silsesquioxane crosslinked polymer.

[0028] By adopting the above technical solution, vinyl-terminated dimethyl polysiloxane and / or polymethylsiloxane silsesquioxane crosslinked polymer as alkenyl-containing polysiloxane can significantly improve the heat resistance and mechanical properties of the modifier, thereby further enhancing the overall stability of the composite board. These high-performance polysiloxane materials not only improve the compression resistance of the extruded layer, but also enhance the adhesion between the connecting layer and the surface layer, so that the entire composite board exhibits better moisture resistance and durability under high humidity and high pressure environments.

[0029] Preferably, the epoxy modified resin is epoxy acrylate resin and / or phenolic epoxy modified vinyl ester resin.

[0030] By adopting the above technical solution, epoxy acrylate resin and / or phenolic epoxy modified vinyl ester resin as epoxy modified resin can significantly improve the overall mechanical properties and chemical corrosion resistance of the composite board. Specifically: Improve mechanical properties: Epoxy acrylate resin and phenolic epoxy modified vinyl ester resin both have high strength and toughness, which can effectively enhance the compressive and impact resistance of the extruded layer, thereby improving the mechanical properties of the entire composite board.

[0031] Improved interfacial bonding: These resins are better compatible with other components during the curing process, forming a tighter molecular network structure, thereby enhancing the bonding between the connecting layer and the extruded layer, and further improving the interlayer stability of the composite board.

[0032] In summary, choosing epoxy acrylate resin and / or phenolic epoxy modified vinyl ester resin as epoxy modified resin can significantly improve the comprehensive performance of building compression resistant extruded composite panels, making them more suitable for various harsh use environments.

[0033] Preferably, the processing aid is one or more of an antioxidant, a lubricant, a colorant, and a foam stabilizer.

[0034] By adopting the above technical solutions, the processing of composite boards is more stable. Antioxidants can effectively prevent oxidative degradation of materials at high temperatures and extend the service life of products. Lubricants help improve melt fluidity, reduce equipment wear and improve production efficiency. Colorants can adjust product color as needed to meet different decorative requirements. Foam stabilizers ensure uniform pore distribution during the foaming process and improve the physical and mechanical properties of the product.

[0035] Preferably, the foam stabilizer is one or more of triphenyl phosphite, sorbitol and pentaerythritol.

[0036] By adopting the above technical solution, the foam stabilizer is selected from one or more of triphenyl phosphite, sorbitol, and pentaerythritol, which can effectively improve the foaming process of the extruded layer and make it more uniform and stable. This not only improves the overall density and mechanical properties of the composite board, but also enhances its durability and compression resistance, thereby reducing the risk of damage under long-term pressure and humid environment.

[0037] In a second aspect, a method for preparing a compression-resistant extruded composite board for construction as claimed in any one of claims 1 to 9 comprises the following steps: Modifier: heat and solidify the modifier, dry it, and crush it to obtain a solid modifier; According to weight percentage, polystyrene, foaming agent, nucleating agent, solid modifier and processing aid are weighed and mixed evenly, and melt-extruded and foamed to obtain an extruded layer; The adhesive is coated on both sides of the extruded layer to form a glue layer, and the surface layer is attached to the surfaces of the glue layers on both sides, and the pressure is maintained and the glue layer is cured to obtain a building compression-resistant extruded composite board.

[0038] By adopting the above technical solution, the preparation method ensures the effective introduction and uniform distribution of the modifier. Specifically: Treatment of the modifier: The modifier is heated, solidified, dried, and crushed to obtain a solid modifier. This process ensures the stability and activity of the modifier, so that it can play a better role in the subsequent mixing process.

[0039] Raw material mixing and melt extrusion: According to the weight percentage, polystyrene, foaming agent, nucleating agent, solid modifier, and processing aid are weighed and mixed evenly, and melt extruded and foamed to obtain an extruded layer. This step allows the components to be fully mixed, enhances the mechanical and physical properties of the extruded layer, and especially improves its compressive strength and durability.

[0040] Application of adhesive: Apply the adhesive to both sides of the extruded layer to form a glue layer, and attach the surface layer to the glue layer on both sides, maintain the pressure, and solidify the glue layer to finally obtain the building compression-resistant extruded composite board. The adhesive contains a modifier, which further enhances the bonding force between the connecting layer and the extruded layer, and improves the overall stability and waterproof performance of the composite board.

[0041] In summary, this preparation method effectively improves the layer structure stability, compression resistance and waterproof performance of the building compression-resistant extruded composite board, which is particularly suitable for high-humidity environments and occasions with high load-bearing requirements. It reduces problems such as damage and delamination after long-term use, and significantly improves the practicality and life of the product. In summary, the present application includes at least one of the following beneficial technical effects: 1. By adding a specific proportion of modifiers to the extruded layer, especially alkenyl-containing polysiloxane, methacryloxymethyltriethoxysilane, epoxy modified resin and other ingredients, the compressive strength and waterproof performance of the composite board are significantly enhanced, and the bending and damage caused by long-term pressure in a high humidity environment are effectively reduced; 2. The connecting layer is made of an adhesive containing a modifier, which improves the adhesion between the connecting layer and the extruded layer and the surface layer, further improving the overall stability and anti-delamination ability of the composite board, and is especially suitable for application scenarios with high load-bearing requirements; 3. The selection and ratio optimization of filling powder (such as PI powder and PEEK powder) not only increases the mechanical properties and thermal stability of the composite board, but also further enhances its compression resistance and wear resistance, thereby extending the service life of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 This is a cross-sectional view of a compression-resistant extruded composite board for construction in the present application; DETAILED DESCRIPTION

[0043] The present application is further described in detail below in conjunction with embodiments.

[0044] The epoxy resin diluent is 1,4-butanediol diglycidyl ether; The active diluent is epoxidized soybean oil; The number average molecular weight of polystyrene is 100,000-200,000; The blowing agent is blowing agent H; The nucleating agent is composed of nano-silicon dioxide and benzoate in a weight ratio of 1:1; The CAS number of vinyl-terminated dimethyl polysiloxane is 68083-19-2; Methylsiloxane silsesquioxane crosspolymer KSP101, white powder; The epoxy acrylate resin is allnex EBECRYL 605 / 20; The phenolic epoxy-modified vinyl ester resin was model 977S from Jiangsu Zhipai Chemical Co., Ltd.; Epoxy resin Zhenzhengfeng MF-3301; Curing agent epoxy resin anhydride curing agent methyltetrahydrophthalic anhydride MTHPA.

[0045] Preparation example of modifier Preparation Example 1 A modifier is prepared by the following method: According to parts by weight, polysiloxane, methacryloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator and filler powder are weighed and mixed uniformly in a weight ratio of 1:0.3:0.3:1:0.01:3 to obtain a modifier.

[0046] The filling powder is PI powder. The filling powder in the modifier of the adhesive is nitrile rubber powder, and the particle size of the filling powder is 5 μm.

[0047] Preparation Example 2 The difference between Preparation Example 2 and Preparation Example 1 is that polysiloxane, methacryloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator, and filler powder are weighed and mixed uniformly in a weight ratio of 1:0.2:1:2:0.03:2.

[0048] Preparation Example 3 The difference between Preparation Example 3 and Preparation Example 1 is that polysiloxane, methacryloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator, and filler powder are weighed and mixed uniformly in a weight ratio of 1:0.1:1.5:3:0.04:1.

[0049] Preparation Example 4 The difference between Preparation Example 4 and Preparation Example 2 is that the alkenyl polysiloxane is a polymethylsiloxane silsesquioxane cross-linked polymer.

[0050] Preparation Example 5 The difference between Preparation Example 5 and Preparation Example 4 is that the alkenyl-containing polysiloxane is composed of vinyl-terminated dimethyl polysiloxane and polymethylsiloxane silsesquioxane crosslinked polymer in a weight ratio of 1:1.

[0051] Preparation Example 6 The difference between Preparation Example 6 and Preparation Example 5 is that the epoxy-modified resin is a phenolic epoxy-modified vinyl ester resin.

[0052] Preparation Example 7 The difference between Preparation Example 7 and Preparation Example 5 is that the epoxy-modified resin is composed of epoxy acrylate resin and phenolic epoxy-modified vinyl ester resin in a weight ratio of 1:2.

[0053] Preparation Example 8 The difference between Preparation Example 8 and Preparation Example 2 is that the filling powder is PEEK powder.

[0054] Preparation Example 9 The difference between Preparation Example 9 and Preparation Example 2 is that the filling powder is nitrile rubber powder.

[0055] Preparation Example 10 The difference between Preparation Example 10 and Preparation Example 7 is that the filling powder is composed of PI powder and PEEK powder in a weight ratio of 3:1.

[0056] Preparation Example 11 The difference between Preparation Example 11 and Preparation Example 7 is that the filling powder is composed of nitrile rubber powder, PI powder and PEEK powder in a weight ratio of 3:0.6:0.4.

[0057] Adhesive material preparation example Preparation Example 12 A bonding material is prepared by the following method: According to weight percentage, 55% of epoxy resin, 3% of curing agent, 27% of epoxy resin diluent, and 15% of the modifier obtained in Preparation Example 1 were weighed and mixed evenly to obtain an adhesive.

[0058] The foam stabilizer is triphenyl phosphite.

[0059] Preparation Example 13 The difference between Preparation Example 13 and Preparation Example 11 is that the adhesive is prepared by the following method: According to weight percentage, 63% of epoxy resin, 5% of curing agent, 21% of epoxy resin diluent, and 11% of the modifier obtained in Preparation Example 2 were weighed and mixed evenly to obtain an adhesive.

[0060] Preparation Example 14 The difference between Preparation Example 14 and Preparation Example 12 is that the adhesive is prepared by the following method: According to weight percentage, 70% of epoxy resin, 8% of curing agent, 11% of epoxy resin diluent, and 11% of the modifier obtained in Preparation Example 3 were weighed and mixed evenly to obtain an adhesive.

[0061] Preparation Example 15-22 The difference between Preparation Example 15-22 and Preparation Example 13 is that the sources of the modifier are different, as shown in Table 1; Table 1 Sources of modifiers for preparing 12-22 Preparation Example Source of modifier Preparation Example 12 Preparation Example 1 Preparation Example 13 Preparation Example 2 Preparation Example 14 Preparation Example 3 Preparation Example 15 Preparation Example 4 Preparation Example 16 Preparation Example 5 Preparation Example 17 Preparation Example 6 Preparation Example 18 Preparation Example 7 Preparation Example 19 Preparation Example 8 Preparation Example 20 Preparation Example 9 Preparation Example 21 Preparation Example 10 Preparation Example 22 Preparation Example 11 Preparation Comparative Example Preparation Comparative Example 1 The difference between Preparation Comparative Example 1 and Preparation Example 12 is that the modifier is replaced with an equal amount of epoxy resin. Example

[0062] Example 1 A building compression-resistant extruded composite board comprises an extruded layer, two connecting layers and two surface layers, wherein the extruded layer is located between the two connecting layers, and both sides of the extruded layer are connected to the surface layers through the connecting layers, wherein the thickness of the extruded layer is 20-100 mm, preferably 50 mm in this embodiment, the thickness of the connecting layer is 0.1-1 mm, preferably 0.2 mm in this embodiment, and the surface layer is a PET layer, and its thickness is 1-30 mm, preferably 2 mm in this embodiment.

[0063] The building compression-resistant extruded composite board is prepared by the following method: Modifier: The modifier obtained in Preparation Example 1 was heated to 70°C, cured for 20 minutes, placed in an oven at 50°C for further drying for 2 hours, placed in a grinder for grinding, and sieved through 500 mesh to obtain a solid modifier; According to the weight percentage of the extruded layer, 64% polystyrene, 5% foaming agent, 3% nucleating agent, 20% solid modifier and 8% processing aid are weighed and mixed evenly, and melt-extruded and foamed to obtain an extruded layer; the processing aid is composed of an antioxidant, a colorant and a foam stabilizer in a weight ratio of 1:2:5; the foam stabilizer is polyacrylamide, the antioxidant is antioxidant 1010, and the colorant is phthalocyanine blue.

[0064] The adhesive material of Preparation Example 12 is coated on both sides of the extruded layer to form a glue layer, and the surface layer is attached to the surfaces of the glue layers on both sides, and the pressure is maintained and the glue layer is cured to obtain a building compression-resistant extruded composite board. Figure 1 It is the cross-sectional structure of the technical composite panel.

[0065] Example 2 The difference between Example 2 and Example 1 is that the amount of raw materials used in the extrusion layer is different, as follows: According to the weight percentage of the extruded layer, 80% polystyrene, 3% foaming agent, 2% nucleating agent, 11% solid modifier, and 4% processing aid, wherein the solid modifier is obtained by the method of Example 1 of the modifier obtained in Preparation Example 2.

[0066] Example 3 The difference between Example 3 and Example 1 is that the amount of raw materials used in the extrusion layer is different, as follows: According to the weight percentage of the extruded layer, 90% polystyrene, 1% foaming agent, 1% nucleating agent, 5% solid modifier, and 3% processing aid, wherein the solid modifier is obtained by the method of Example 1 of the modifier obtained in Preparation Example 3.

[0067] Embodiment 4-7 The difference between Examples 4-7 and Example 2 is that the sources of the modifiers used in the extruded layer are different, as shown in Table 2; Table 2 Sources of modifiers used in the extruded layers of Examples 1-7 Example Sources of modifiers used in extruded layers Example 1 Preparation Example 1 Example 2 Preparation Example 2 Example 3 Preparation Example 3 Example 4 Preparation Example 4 Example 5 Preparation Example 5 Example 6 Preparation Example 6 Example 7 Preparation Example 7 Example 8 Preparation Example 8 Example 9 Preparation Example 10 Examples 10-19 The difference between Examples 10-19 and Example 9 is that the sources of the adhesive are different, as shown in Table 3; Table 3 The sources of the adhesives in Examples 10-19 are different Example Source of adhesive Example 10 Preparation Example 13 Embodiment 11 Preparation Example 14 Example 12 Preparation Example 15 Embodiment 13 Preparation Example 16 Embodiment 14 Preparation Example 17 Embodiment 15 Preparation Example 18 Example 16 Preparation Example 19 Embodiment 17 Preparation Example 20 Embodiment 18 Preparation Example 21 Embodiment 19 Preparation Example 22 Comparative Example Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that the solid modifier in the extrusion layer is replaced by filler powder.

[0068] Comparative Example 2 The difference between Comparative Example 2 and Example 1 is that the modifier in the adhesive is replaced with epoxy resin.

[0069] Comparative Example 3 The difference between Comparative Example 3 and Example 1 is that, based on Comparative Example 2, the solid modifier in the extrusion layer is replaced with filler powder.

[0070] Comparative Example 4 The difference between Comparative Example 4 and Example 1 is that the alkenyl-containing polysiloxane in the extrusion layer is replaced by an equal amount of epoxy-modified resin.

[0071] Comparative Example 5 The difference between Comparative Example 5 and Example 1 is that the epoxy-modified resin in the glue layer is replaced by an equal amount of alkenyl-containing polysiloxane.

[0072] Performance testing The architectural compression-resistant extruded composite panels obtained in Examples 1-19 and Comparative Examples 1-5 were cut into test samples of corresponding sizes and then used in the following experimental tests, as shown in Table 4.

[0073] Test method / test method Test 1: The test samples obtained in Examples 1-19 and Comparative Examples 1-5 were tested with reference to GB / T 2792-1998 for their dimensions. The connection between the extruded layer and a connecting layer was cut open by 1 mm, and then the peeling force was tested.

[0074] Test 2: The test samples obtained from Examples 1-19 and Comparative Examples 1-5 were placed in a double 85 test box and subjected to a double 85 test for 7 days. The samples were taken out and air-dried, and then the peeling force was tested in the manner described in Test 1. The peeling force reduction rate was equal to the peeling force of Test 1 minus the peeling force of Test 2 minus the peeling force of Test 1, and then multiplied by 100%.

[0075] Test 3: The test samples obtained in Examples 1-19 and Comparative Examples 1-5 had their dimensions referenced GB / T 10801.2-2018 and were subjected to compression resistance testing.

[0076] The above experimental data are shown in Table 4. Table 4 Experimental data of Examples 1-19 and Comparative Examples 1-5 Combining Example 1 and Comparative Examples 1-5 and Table 4, it can be seen that the peeling force and compression strength of Comparative Examples 1-5 are smaller than those of Example 1, while the peeling force reduction rate is greater than that of Example 1, indicating that the modifier prepared by using polysiloxane, triethoxysilane (methacryloyloxymethyl), epoxy modified resin, active diluent, initiator, and filling powder is applied to the adhesive and the technical plastic layer, which can further improve the compression resistance of the building extruded composite board.

[0077] Combining Example 7 with Example 9 and Table 4, it can be seen that the compression strength of Example 7 is smaller than that of Example 9, while the peel force reduction rate is greater than that of Example 9, indicating that the compounding of PI powder and PEEK powder plays a synergistic role and further improves its compression performance.

[0078] It can be seen from Example 10 and Table 3 that the peeling force and compression strength of Example 7 are smaller than those of Example 10, indicating that the compounding of nitrile rubber powder, PI powder and PEEK powder further enhances the comprehensive performance.

[0079] Combining Example 7, Example 5, Example 19 and Table 4, it can be seen that the peel force and compression strength of Example 5 are lower than those of Example 7 and Example 19, and the peel force reduction rate is higher than that of Example 7 and Example 19, indicating that the compounding of epoxy acrylate resin and phenolic epoxy modified vinyl ester resin has a synergistic effect, which can enhance adhesion and compression strength and avoid the possibility of falling off in a high humidity environment.

[0080] This specific embodiment is merely an explanation of the present application and is not a limitation of the present application. After reading this specification, those skilled in the art may make modifications to the present embodiment without any creative contribution as needed, but such modifications are protected by the patent law as long as they are within the scope of the claims of the present application.

Claims

1. A building compression-resistant extruded composite board, characterized in that: It comprises an extruded layer, two connecting layers and two surface layers, wherein the extruded layer is located between the two connecting layers, and both sides of the extruded layer are connected to the surface layers through the connecting layers, and the extruded layer is made of the following raw materials in weight percentage: Polystyrene 70-90% Foaming agent 1-5% Nucleating agent 1-3% Modifier 5-20% The balance is processing aids; The modifier is obtained by mixing alkenyl-containing polysiloxane, methacryloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator and filling powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3); the connecting layer is prepared from an adhesive containing the modifier.

2. The building compression-resistant extruded composite board according to claim 1, characterized in that: The filling powder in the modifier of the extrusion layer is PI powder and / or PEEK powder.

3. The building compression-resistant extruded composite board according to claim 1, characterized in that: The connecting layer is formed by curing the adhesive, and the adhesive is composed of the following raw materials in percentage by weight: Epoxy resin 55-70% Curing agent 3-8% Modifier 3-15% The balance is epoxy resin diluent; The modifier is obtained by mixing alkenyl-containing polysiloxane, methacryloxymethyl)triethoxysilane, epoxy modified resin, active diluent, initiator and filling powder in a weight ratio of 1: (0.1-0.3): (0.3-1.5): (1-3): (0.01-0.04): (1-3).

4. The building compression-resistant extruded composite board according to claim 3, characterized in that: The filling powder in the modifier of the adhesive is composed of nitrile rubber powder, PI powder and PEEK powder in a weight ratio of 3: (0.5-1): (0.1-0.5).

5. A building compression-resistant extruded composite board according to claim 1 or 2, characterized in that: The particle size of the filling powder is 1-20 μm.

6. A building compression-resistant extruded composite board according to claim 1 or 2, characterized in that: The alkenyl-containing polysiloxane is vinyl-terminated dimethyl polysiloxane and / or polymethylsiloxane silsesquioxane crosslinked polymer.

7. A building compression-resistant extruded composite board according to claim 1 or 2, characterized in that: The epoxy modified resin is epoxy acrylate resin and / or phenolic epoxy modified vinyl ester resin.

8. The building compression-resistant extruded composite board according to claim 1, characterized in that: The processing aid is one or more of an antioxidant, a lubricant, a colorant, and a foam stabilizer.

9. The building compression-resistant extruded composite board according to claim 8, characterized in that: The foam stabilizer is one or more of triphenyl phosphite, sorbitol and pentaerythritol.

10. A method for preparing a compression-resistant extruded composite board for construction as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: Modifier: heat and solidify the modifier, dry it, and crush it to obtain a solid modifier; According to weight percentage, polystyrene, foaming agent, nucleating agent, solid modifier and processing aid are weighed and mixed evenly, and melt-extruded and foamed to obtain an extruded layer; The adhesive is coated on both sides of the extruded layer to form a glue layer, and the surface layer is attached to the surfaces of the glue layers on both sides, and the pressure is maintained and the glue layer is cured to obtain a building compression-resistant extruded composite board.

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