Thermal barrier coating and method of making same, thermal barrier coated workpiece, aerospace component

Abstract

The application relates to the technical field of thermal barrier coating preparation, in particular to a thermal barrier coating, a preparation method thereof, a thermal barrier coating workpiece and an aviation assembly. The preparation method of the thermal barrier coating comprises the following steps: providing a substrate, preparing a metal bonding layer on the surface of the substrate; and preparing a ceramic thermal insulation layer on the surface of the metal bonding layer away from the substrate by adopting a plasma physical vapor deposition method. The preparation process parameters of the ceramic thermal insulation layer include that the Ar gas flow rate is 10 L / min-30 L / min, the He gas flow rate is 40 L / min-50 L / min, the current is 1000 A-1400 A, the power is 30 KW-50 KW, the temperature of the substrate is 600 DEG C-800 DEG C, and the working air pressure is 2 mbar-5 mbar. The preparation method provided by the application is low in power, He gas consumption, power and current, can effectively reduce spraying cost, and is also suitable for thin-walled or small-sized workpieces.

Description

Technical Field

[0001] This application relates to the field of thermal barrier coating preparation technology, specifically to thermal barrier coatings and their preparation methods, thermal barrier coated workpieces, and aerospace components. Background Technology

[0002] Thermal barrier coatings (TBCs) are a surface protection technology that combines ceramic materials with low thermal conductivity, strong resistance to oxidation and corrosion, and strong temperature resistance with a metal substrate in the form of a coating, thereby increasing the operating temperature of hot-end metal components and extending their service life.

[0003] Currently, thermal barrier coatings are generally prepared using electron beam physical vapor deposition (EB-PVD) or air plasma spraying (APS). Each method has its advantages and disadvantages. EB-PVD can produce thermal barrier coatings with well-defined structures and excellent thermal shock resistance, but it involves high equipment costs, a long preparation cycle, and its thermal insulation performance is lower than that of coatings prepared by APS. APS technology offers faster coating deposition and produces coatings with excellent thermal insulation performance, but its preparation requires high jet temperatures, high He gas consumption, high power, and high current, significantly increasing the cost. Furthermore, current thermal barrier coatings are not suitable for thin-walled or small-sized workpieces. Summary of the Invention

[0004] Based on this, this application provides a thermal barrier coating and its preparation method, a thermal barrier coated workpiece, and an aerospace component. The thermal barrier coating preparation method provided in this application uses low power, low He gas consumption, and low power and current, which can effectively reduce the spraying cost. Moreover, this preparation method is also suitable for thin-walled or small-sized workpieces.

[0005] A first aspect of this application provides a method for preparing a thermal barrier coating, comprising the following steps:

[0006] A substrate is provided, and a metal bonding layer is prepared on the surface of the substrate;

[0007] A ceramic thermal insulation layer was prepared on the surface of the metal bonding layer away from the substrate using plasma physical vapor deposition.

[0008] The manufacturing process parameters of the ceramic heat insulation layer include: Ar gas flow rate of 10L / min~30L / min, He gas flow rate of 40L / min~50L / min, current of 1000A~1400A, power of 30KW~50KW, substrate temperature of 600℃~800℃, and working gas pressure of 2mbar~5mbar.

[0009] In one embodiment, the manufacturing process parameters of the ceramic heat insulation layer further include:

[0010] The powder feeding rate is 2g / L~10g / L, the Ar flow rate of the powder carrier gas is 5L / min~9L / min, and the spraying distance is 400mm~800mm.

[0011] In one embodiment, the thickness of the ceramic insulation layer is 50 μm to 500 μm; and / or,

[0012] The ceramic heat insulation layer has a columnar crystal structure.

[0013] In one embodiment, the powder used to prepare the ceramic heat insulation layer is yttrium oxide-doped zirconium oxide.

[0014] In one embodiment, the metal bonding layer comprises one or more of MCrAlYSi, MCrAlY, and PtAl; wherein, each time M appears, it is independently one or more of Ni and Co; and / or,

[0015] The thickness of the metal bonding layer is 30μm~200μm.

[0016] A second aspect of this application provides a thermal barrier coating, comprising:

[0017] Metal bonding layer;

[0018] A ceramic heat insulation layer is disposed on one side surface of the metal bonding layer. The ceramic heat insulation layer is prepared by plasma physical vapor deposition and has a columnar crystal structure.

[0019] In one embodiment, the thermal barrier coating has one or more of the following characteristics:

[0020] (1) The metal bonding layer comprises one or more of MCrAlY and PtAl; wherein M comprises one or more of Ni and Co;

[0021] (2) The thickness of the metal bonding layer is 30μm~200μm;

[0022] (3) The thickness of the ceramic heat insulation layer is 150μm~250μm.

[0023] A third aspect of this application provides a thermal barrier coated workpiece, comprising a substrate and the thermal barrier coating described in the second aspect of this application, wherein the metal bonding layer and the ceramic heat insulation layer in the thermal barrier coating are sequentially disposed on the surface of the substrate.

[0024] In one embodiment, the substrate has one or more of the following features:

[0025] (1) The dimensions of the substrate are 5mm to 200mm;

[0026] (2) The matrix is ​​a nickel-based single-crystal high-temperature alloy;

[0027] (3) The matrix includes a nickel-containing γ' phase material.

[0028] A fourth aspect of this application provides an aerospace component including the thermal barrier coated workpiece described in the third aspect of this application.

[0029] The method for preparing the thermal barrier coating provided in this application has at least the following advantages:

[0030] In the method for preparing the thermal barrier coating provided in this application, a metal bonding layer is disposed on the surface of the substrate, which can avoid the bonding difficulties caused by the large difference in physicochemical properties between the substrate and the ceramic insulation layer, and can effectively enhance the bonding strength between the ceramic insulation layer and the substrate. Further supplementing this method with plasma physical vapor deposition (APS) to prepare the ceramic insulation layer, this method combines the advantages of low cost and high efficiency of EB-PVD and the fast deposition rate of APS, enabling the large-scale production of low-cost, high-insulation thermal barrier coatings.

[0031] Furthermore, the process parameters for preparing the ceramic thermal insulation layer specified in this application reduce the power, He gas consumption, and current, achieving physical vapor deposition at low power and enabling the preparation of a thermal barrier coating with excellent mechanical and thermal insulation properties. Moreover, the method for preparing the thermal barrier coating provided in this application is also applicable to thin-walled or small-sized workpieces. Attached Figure Description

[0032] Figure 1 A process flow diagram of the thermal barrier coating preparation method provided in this application;

[0033] Figure 2 This is a schematic diagram of the structure of the thermal barrier coating workpiece of this application;

[0034] Figures 3-5 Microscopic morphology images of the ceramic heat insulation layer prepared in Example 1 of this application at different magnifications;

[0035] Figures 6-8 The images show the microstructure of the ceramic heat insulation layer prepared in Comparative Example 1 of this application at different magnifications.

[0036] Explanation of reference numerals in the attached figures:

[0037] In the figure, 10 is the substrate, 20 is the metal bonding layer, and 30 is the ceramic insulation layer. Detailed Implementation

[0038] The following detailed description, in conjunction with specific embodiments, provides a more complete and clear account of the thermal barrier coating and its preparation method, thermal barrier coated workpieces, and aerospace components of this application. This application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this application.

[0039] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] When a numerical range is disclosed herein, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless otherwise stated or in case of conflict, the terms or phrases used herein have the following meanings:

[0042] In this application, the terms "multiple", "various", "multiple times", "multi-dimensional", etc., unless otherwise specified, refer to a quantity greater than or equal to 2. For example, "one or more" means one or more or more.

[0043] In this application, the terms "first aspect," "second aspect," "third aspect," and "fourth aspect," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or quantity, nor should they be construed as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first," "second," "third," and "fourth," etc., serve only a non-exhaustive enumeration purpose and should be understood not to constitute a closed limitation on quantity.

[0044] In this application, the technical features described in an open-ended manner include both closed technical solutions consisting of the listed features and open technical solutions that include the listed features.

[0045] In this application, the terms "combinations thereof", "any combination thereof", and "any combination thereof" include all suitable combinations of any two or more of the listed items.

[0046] In this application, the term "suitable" as used in phrases such as "suitable combination," "suitable method," and "any suitable method" refers to the ability to implement the technical solution of this application, solve the technical problem of this application, and achieve the expected technical effect of this application.

[0047] In this application, terms such as "preferred," "better," "more suitable," and "ideal" are used only to describe implementation methods or embodiments with better effects, and should be understood not to constitute a limitation on the scope of protection of this application.

[0048] In this application, terms such as "further," "even further," and "particularly" are used for descriptive purposes to indicate differences in content, but should not be construed as limiting the scope of protection of this application.

[0049] In this application, the terms "optionally," "optionally," and "optional" refer to options that are optional, meaning they can be selected from either "with" or "without." If multiple "optional" options appear in a technical solution, unless otherwise specified and there are no contradictions or mutual constraints, each "optional" option is independent.

[0050] In this application, numerical intervals (i.e., numerical ranges) are involved. Unless otherwise specified, the selected numerical distributions within the aforementioned numerical intervals are considered continuous and include the two endpoints (i.e., the minimum and maximum values) of the numerical range, as well as every value between these two endpoints. Unless otherwise specified, when a numerical interval refers only to integers within that interval, it includes the two endpoint integers of the numerical range, as well as every integer between the two endpoints. In this document, this is equivalent to directly listing every integer. For example, if t is an integer selected from 1 to 10, it means that t is any integer selected from the group of integers consisting of 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10. Furthermore, when multiple ranges are provided to describe features or characteristics, these ranges can be merged. In other words, unless otherwise specified, the ranges disclosed herein should be understood to include any and all subranges to which they are included.

[0051] Unless otherwise specified, the temperature parameters in this application are permitted to be either constant-temperature treatment or variations within a certain temperature range. It should be understood that the constant-temperature treatment allows temperature fluctuations within the precision range of the instrument control, such as ±5℃, ±4℃, ±3℃, ±2℃, or ±1℃.

[0052] In this application, percentage content refers to mass percentage for solid-liquid mixtures and solid-phase-solid mixtures, and volume percentage for liquid-phase-liquid mixtures, unless otherwise specified.

[0053] In this application, unless otherwise specified, percentage concentrations refer to final concentrations. The final concentration refers to the percentage of the added component in the system after its addition.

[0054] Currently, the process parameters typically involved in preparing metallic thermal insulation layers using plasma physical vapor deposition (PVD) include: current of 1800A~2000A, power of 100KW~120KW, and temperature of 900℃. This method requires a high jet temperature, thus increasing the amount of He gas used and consequently raising the coating cost. Furthermore, the main component in PVD equipment that generates plasma is the spray gun. Because traditional methods use high power and current, a high voltage needs to be applied between the electrodes during spray gun operation to ionize the gas and form plasma. However, applying high voltage leads to rapid electrode ablation, requiring additional replacement costs.

[0055] Based on this, see Figure 1 The first aspect of this application provides a method for preparing a thermal barrier coating, comprising the following steps:

[0056] S10. Provide a substrate and prepare a metal bonding layer on the surface of the substrate.

[0057] S20. A ceramic heat insulation layer is prepared on the surface of the metal bonding layer away from the substrate using plasma physical vapor deposition.

[0058] In step S20, the preparation process parameters of the ceramic heat insulation layer include: Ar gas flow rate of 10L / min~30L / min, He gas flow rate of 40L / min~50L / min, current of 1000A~1400A, power of 30KW~50KW, substrate temperature of 600℃~800℃, and working gas pressure of 2mbar~5mbar.

[0059] The ceramic thermal insulation layer preparation process parameters provided in this application further reduce the usage of Ar and He gases, current, and power by adjusting the working gas pressure and substrate temperature, thereby achieving physical vapor deposition at low power. Simultaneously, these preparation process parameters also enable the preparation of ceramic thermal insulation layers with high vapor content, thus endowing the thermal barrier coating with superior thermal insulation and thermal shock resistance properties.

[0060] Specifically, in the above process parameters, Ar gas, as an inert gas, has a flow rate of 10 L / min to 30 L / min during the plasma physical vapor deposition process. This flow rate helps stabilize the plasma and adjust the concentration of active materials in the plasma, thereby controlling the deposition rate of the ceramic insulation layer to form a uniform ceramic insulation layer. For example, the Ar gas flow rate includes, but is not limited to, 10 L / min, 12 L / min, 14 L / min, 16 L / min, 18 L / min, 20 L / min, 22 L / min, 24 L / min, 26 L / min, 28 L / min, or 30 L / min, or any two of the above values ​​as endpoints within a range.

[0061] He gas has good thermal conductivity, and this application limits the He gas flow rate to 40 L / min to 50 L / min. Within this range, He gas can effectively transfer the heat generated by the plasma to the substrate surface, making the substrate temperature more uniform. At the same time, He gas can also increase the activity of the plasma, resulting in finer and more uniform deposited ceramic particles. This application limits the gas flow rates of He and Ar, which work synergistically to optimize the plasma composition and promote the densification of the ceramic insulation layer. For example, the He gas flow rate includes, but is not limited to, 40 L / min, 42 L / min, 44 L / min, 46 L / min, 48 L / min, or 50 L / min, or any two of the above values ​​as endpoints within a range.

[0062] In the process parameters of the ceramic insulation layer of this application, the current is 1000A~1400A and the power is 30KW~50KW. Due to the synergy of other process parameters, this application limits the current and power to the lower range mentioned above, which can provide sufficient energy for the ceramic source to fully evaporate and ionize, while enabling the ceramic particles to deposit at a suitable rate to form a dense and uniform microstructure. For example, the current value includes, but is not limited to, 1000A, 1050A, 1100A, 1150A, 1200A, 1250A, 1300A, 1350A or 1400A. The power value includes, but is not limited to, 30 KW, 32 KW, 34 KW, 36 KW, 38 KW, 40 KW, 42 KW, 45 KW, 48 KW or 50 KW, or any two of the above values ​​as endpoints within the range.

[0063] A substrate temperature of 600℃ to 800℃ provides a suitable thermal environment for the deposition of the ceramic insulation layer, making the adsorption, diffusion, and reaction of ceramic materials on the substrate surface easier. For example, the substrate temperature includes, but is not limited to, 600℃, 620℃, 650℃, 680℃, 700℃, 720℃, 750℃, 780℃, or 800℃, or any two of the above values ​​as endpoints within a range.

[0064] The working gas pressure has a significant impact on the plasma state. Within a pressure range of 2 mbar to 5 mbar, the plasma can maintain appropriate density and activity between the spray gun and the substrate. This pressure range prevents excessive plasma diffusion or concentration, allowing the active substances in the plasma to effectively interact with the ceramic source material and the substrate surface, thereby ensuring the deposition quality of the ceramic insulation layer. For example, the working gas pressure includes, but is not limited to, 2 mbar, 2.2 mbar, 2.5 mbar, 2.7 mbar, 3 mbar, 3.2 mbar, 3.5 mbar, 3.8 mbar, 4 mbar, 4.2 mbar, 4.5 mbar, 4.8 mbar, or 5 mbar, or any two of the above values ​​as endpoints within a range.

[0065] In one example, the manufacturing process parameters of the ceramic insulation layer also include:

[0066] The powder feeding rate is 2g / L~10g / L, the Ar flow rate of the powder carrier gas is 5L / min~9L / min, and the spraying distance is 400mm~800mm.

[0067] In this application, limiting the powder feed rate and the Ar flow rate of the powder carrier gas ensures the deposition efficiency of the ceramic insulation layer. This avoids excessively slow deposition rates caused by slightly low powder feed rates and slightly low carrier gas flow rates, and also avoids uneven powder accumulation caused by a slightly larger amount of powder reaching the surface of the metal binder layer at the same time, which would affect the quality of the ceramic insulation layer.

[0068] For example, the powder feeding rate includes, but is not limited to, 2 g / L, 3 g / L, 4 g / L, 5 g / L, 6 g / L, 7 g / L, 8 g / L, 9 g / L or 10 g / L, or any two of the above point values ​​as endpoints within the range.

[0069] For example, the Ar flow rate of the powder carrier gas includes, but is not limited to, 5 L / min, 6 L / min, 7 L / min, 8 L / min or 9 L / min, or any two of the above points as endpoints within the range.

[0070] In this application, the spraying distance refers to the distance between the spray gun and the substrate. Within the range of 400mm to 800mm, the powder can be deposited relatively uniformly on the substrate surface under the action of plasma. This avoids the disadvantage that if the spraying distance is too close, the powder will be subjected to excessive heat flow and impact force from the plasma, leading to an increase in the surface roughness of the coating. It also avoids the disadvantage that if the spraying distance is too far, the powder will lose too much energy during the spraying process, failing to fully melt and deposit, thus affecting the density and uniformity of the coating. For example, the above-mentioned spraying distance includes, but is not limited to, 400mm, 450mm, 500mm, 550mm, 600mm, 650mm, 700mm, 750mm, or 800mm, or any two of the above values ​​as endpoints within a range.

[0071] In one example, the thickness of the ceramic insulation layer is 50 μm to 500 μm.

[0072] The thickness of the ceramic insulation layer plays a crucial role in blocking heat transfer. In this application, the thickness of the ceramic insulation layer is limited to 50μm~500μm, so that when heat passes through the ceramic insulation layer, it will undergo multiple scattering and absorption in the internal structure of the ceramic material, such as the lattice, grain boundaries, and pores. At the same time, this thickness can also increase the heat propagation path, thereby reducing the heat transfer rate of high-temperature combustion gas to the substrate. For example, the thickness of the ceramic insulation layer includes, but is not limited to, 50μm, 80μm, 100μm, 120μm, 150μm, 180μm, 200μm, 220μm, 240μm, 260μm, 280μm, 300μm, 320μm, 340μm, 360μm, 370μm, 380μm, 400μm, 420μm, 450μm, 480μm, or 500μm, or any two of the above point values ​​as endpoint values ​​within the range.

[0073] In one example, the ceramic insulation layer has a columnar crystalline structure.

[0074] In this application, the ceramic thermal insulation layer has a columnar crystalline structure. This structure contains numerous grain boundaries, which continuously scatter heat flow as it crosses these boundaries, effectively reducing heat transfer efficiency. Furthermore, the columnar crystalline structure exhibits excellent crystal orientation, enabling better dispersion of thermal stress. When the ceramic thermal insulation layer experiences thermal stress due to rapid temperature changes, the interaction between the columnar crystals disperses the stress across different grains and grain boundaries, reducing stress concentration and improving the thermal shock resistance of the thermal barrier coating.

[0075] In one example, the powder used to prepare the ceramic insulation layer is yttrium-doped zirconium oxide.

[0076] Yttrium oxide doping can stabilize the crystal structure of zirconia, suppress phase transitions, and give yttrium-doped zirconia a lower thermal conductivity. Furthermore, yttrium-doped zirconia matches the thermal expansion coefficients of various metal matrices, allowing it to expand and contract synchronously with the matrix material. This reduces thermal stress caused by differences in thermal expansion coefficients, thereby lowering the risk of peeling off the ceramic insulation layer.

[0077] Furthermore, in yttrium-doped zirconium oxide, the mass fraction of yttrium oxide is 6% to 8%.

[0078] In one example, the metal bonding layer comprises one or more of MCrAlYSi, MCrAlY, and PtAl; wherein each time M appears, it is independently one or more of Ni and Co.

[0079] In MCrAlYSi and MCrAlY alloys, Al can form chemical bonds with the ceramic insulation layer, while Ni and Co can form metallurgical bonds with the substrate. This allows the adhesive layer to act as a good transition between the ceramic insulation layer and the substrate, improving the bonding strength of the thermal barrier coating. PtAl alloys possess a unique intermetallic compound structure. Pt improves interfacial wettability, making it easier for the ceramic insulation layer to adhere to the adhesive layer. Al interacts with the components in the ceramic insulation layer through chemical reactions, enhancing the bonding effect. This excellent adhesion effectively prevents the ceramic insulation layer from peeling off during high-temperature operation, thus forming a good interfacial bond between the ceramic insulation layer and the substrate.

[0080] For example, the metal bonding layer includes one or more of NiCrAlYSi, CoCrAlYSi, NiCrAlY, CoCrAlY, and PtAl.

[0081] In one example, the thickness of the metal bonding layer is 30 μm to 200 μm. A thickness within this range effectively bonds the ceramic insulation layer to the substrate, avoiding uneven substrate surface coverage caused by a thinner metal bonding layer, which negatively impacts bonding strength. For example, the thickness of the metal bonding layer includes, but is not limited to, 30 μm, 40 μm, 50 μm, 80 μm, 100 μm, 120 μm, 150 μm, 180 μm, 200 μm, 220 μm, 240 μm, 260 μm, 280 μm, 300 μm, 320 μm, 340 μm, 360 μm, 370 μm, 380 μm, 400 μm, 420 μm, 450 μm, 480 μm, or 500 μm, or any two of the above values ​​as endpoints.

[0082] A second aspect of this application provides a thermal barrier coating, comprising:

[0083] Metal bonding layer;

[0084] A ceramic heat insulation layer is disposed on one side surface of the metal bonding layer. The ceramic heat insulation layer is prepared by plasma physical vapor deposition and has a columnar crystal structure.

[0085] In thermal barrier coatings, the metal bonding layer and the ceramic insulating layer work synergistically to provide thermal insulation. The metal bonding layer can reflect some heat, reducing heat transfer to the substrate. The ceramic insulating layer, as the primary insulating component, effectively hinders heat conduction with its columnar crystalline structure and exhibits excellent thermal shock resistance. When this thermal barrier coating is applied to high-temperature components such as aero-engines, it significantly reduces heat transfer from high-temperature exhaust gases to internal engine metal parts, thereby improving engine thermal efficiency and component lifespan.

[0086] In one example, the metal bonding layer comprises one or more of MCrAlY and PtAl; wherein M comprises one or more of Ni and Co.

[0087] In one example, the thickness of the metal bonding layer is 30 μm to 200 μm.

[0088] In one example, the thickness of the ceramic insulation layer is 150μm to 250μm.

[0089] Understandably, the properties and thicknesses of the metal bonding layer and the ceramic insulation layer in the second aspect of this application are similar to those in the first aspect of this application, so they will not be described again here.

[0090] See Figure 3 In a third aspect of this application, a thermal barrier coating workpiece is provided, comprising a substrate 10 and the thermal barrier coating described in the second aspect of this application, wherein the metal bonding layer 20 and the ceramic heat insulation layer 30 in the thermal barrier coating are sequentially disposed on the surface of the substrate 10.

[0091] Understandably, in this application, the substrate is a metal substrate.

[0092] The thermal barrier coating provided in this application allows for the application of both a metal bonding layer and a metal insulating layer not only to large-sized substrate surfaces but also to small-sized substrates. In one example, the substrate has a size of 5 mm to 200 mm.

[0093] In this application, "size" refers to the longest linear dimension of the substrate that can be measured in space.

[0094] In one example, the substrate is a nickel-based single-crystal superalloy. The coefficient of thermal expansion of the nickel-based single-crystal superalloy can be well matched with the metal bonding layer and ceramic insulation layer in the thermal barrier coating. During temperature changes, this matching can reduce thermal stress and prevent the thermal barrier coating from peeling off.

[0095] Meanwhile, nickel-based single-crystal superalloys exhibit good chemical compatibility with components in thermal barrier coatings (such as MCrAlY and PtAl in the metal binder layer). At high temperatures, a certain chemical reaction can occur between the alloy matrix and the metal binder layer, forming a strong bonding interface.

[0096] In one example, the matrix comprises a nickel-containing γ' phase material.

[0097] In high-temperature environments, nickel-containing γ' phase materials can effectively hinder dislocation movement and resist creep deformation at high temperatures. For example, the matrix includes, but is not limited to, DD6 single-crystal superalloy, IC10 single-crystal superalloy, and IC21 single-crystal superalloy.

[0098] The following detailed embodiments illustrate this application in more detail. It should also be understood that the following embodiments are for further explanation only and should not be construed as limiting the scope of protection of this application. Any non-essential improvements and adjustments made by those skilled in the art based on the above description of this application fall within the scope of protection of this application. The specific process parameters, etc., in the following embodiments are merely examples within a suitable range; that is, those skilled in the art can make appropriate selections within the range based on the description herein, and are not necessarily limited to the specific values ​​in the embodiments below.

[0099] Example 1

[0100] Example 1 provides a thermal barrier coating and its preparation method, including the following steps:

[0101] (1) Provide a substrate, wherein the substrate is a Φ14*2mm DD6 single crystal high-temperature alloy;

[0102] (2) A metal bonding layer is prepared on the surface of the substrate, wherein the metal bonding layer is NiCrAlYSi and the thickness of the metal bonding layer is 40 μm;

[0103] (3) A ceramic heat insulation layer is prepared on the side of the metal bonding layer away from the substrate by plasma physical vapor deposition. The preparation process parameters of the ceramic heat insulation layer include: Ar gas flow rate of 20 L / min, He gas flow rate of 40 L / min, current of 1400 A, power of 50 KW, substrate temperature of 800 °C, working gas pressure of 3 mbar, powder feed rate of 5 g / L, Ar powder carrier gas flow rate of 5 L / min, and spraying distance of 600 mm. The powder is yttrium-doped zirconium oxide, and the thickness of the ceramic heat insulation layer is 190 μm.

[0104] Example 2

[0105] Example 2 provides a thermal barrier coating and its preparation method, including the following steps:

[0106] (1) Provide a substrate, wherein the substrate is a Φ14*2mm IC10 single crystal high temperature alloy;

[0107] (2) A metal bonding layer is prepared on the surface of the substrate, wherein the metal bonding layer is PtAl and the thickness of the metal bonding layer is 50 μm;

[0108] (3) A ceramic heat insulation layer is prepared on the side of the metal bonding layer away from the substrate by plasma physical vapor deposition. The preparation process parameters of the ceramic heat insulation layer include: Ar gas flow rate of 10 L / min, He gas flow rate of 50 L / min, current of 1000 A, power of 30 KW, substrate temperature of 600 °C, working gas pressure of 4 mbar, powder feed rate of 3 g / L, Ar powder carrier gas flow rate of 5 L / min, and spraying distance of 400 mm. The powder is yttrium-doped zirconium oxide, and the thickness of the ceramic heat insulation layer is 190 μm.

[0109] Example 3

[0110] Example 3 provides a thermal barrier coating and its preparation method, including the following steps:

[0111] (1) Provide a substrate, wherein the substrate is a Φ14*2mm IC21 single crystal high temperature alloy;

[0112] (2) A metal bonding layer is prepared on the surface of the substrate, wherein the metal bonding layer is PtAl and the thickness of the metal bonding layer is 30 μm;

[0113] (3) A ceramic heat insulation layer is prepared on the side of the metal bonding layer away from the substrate by plasma physical vapor deposition. The preparation process parameters of the ceramic heat insulation layer include: Ar gas flow rate of 30 L / min, He gas flow rate of 40 L / min, current of 1200 A, power of 40 KW, substrate temperature of 700 °C, working gas pressure of 2 mbar, powder feed rate of 2 g / L, Ar powder carrier gas flow rate of 9 L / min, and spraying distance of 800 mm. The powder is yttrium-doped zirconium oxide, and the thickness of the ceramic heat insulation layer is 190 μm.

[0114] Comparative Example 1

[0115] Comparative Example 1 provides a thermal barrier coating and its preparation method, comprising the following steps:

[0116] (1) Provide a substrate, wherein the substrate is a Φ14*2mm IC21 single crystal high temperature alloy;

[0117] (2) A metal bonding layer is prepared on the surface of the substrate, wherein the metal bonding layer is PtAl and the thickness of the metal bonding layer is 30 μm;

[0118] (3) A ceramic heat insulation layer is prepared on the side of the metal bonding layer away from the substrate by plasma physical vapor deposition. The preparation process parameters of the ceramic heat insulation layer include: Ar gas flow rate of 30 L / min, He gas flow rate of 60 L / min, current of 1800 A, power of 60 KW, substrate temperature of 900 °C, working gas pressure of 2 mbar, powder feed rate of 5 g / L, Ar powder carrier gas flow rate of 10 L / min, spraying distance of 1200 mm; and the thickness of the ceramic heat insulation layer is 180 μm.

[0119] Figures 3-5 Microscopic morphology images of the ceramic heat insulation layer prepared in Example 1 of this application at different magnifications; Figures 6-8 These are microscopic images of the ceramic heat insulation layer prepared in Comparative Example 1 of this application at different magnifications. Figures 3-5 As can be seen, the ceramic heat insulation layer prepared in Example 1 of this application has a thickness of approximately 190 μm, and the heat insulation layer has few pores and cracks, with a relatively dense structure, thus exhibiting good heat insulation performance and mechanical strength. Figures 6-8 It can be seen that the ceramic heat insulation layer prepared in Comparative Example 1 has more pores and cracks, and its structure is relatively loose, which will affect the heat insulation performance and mechanical strength of the coating.

[0120] The bonding strength of the thermal barrier coating was tested according to standard GB / T 8642-2002. The thermal insulation effect of the thermal barrier coating was tested using combustion gas thermal shock according to standard Q / 18A3046-2010. The difference between the surface temperature of the thermal barrier coating and the substrate temperature was measured and recorded as the thermal insulation effect. The corresponding test results are shown in Table 1.

[0121] Table 1

[0122]

[0123] Furthermore, as can be seen from Table 1, the thermal barrier coatings prepared in Examples 1 to 3 of this application have better bonding strength and thermal insulation effect than Comparative Example 1.

[0124] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0125] The embodiments described above are merely illustrative of several implementation methods of this application, intended to facilitate a detailed understanding of the technical solutions of this application, but should not be construed as limiting the scope of protection of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. It should be understood that technical solutions obtained by those skilled in the art based on the technical solutions provided in this application through logical analysis, reasoning, or limited experimentation are all within the scope of protection of the appended claims. Therefore, the scope of protection of this patent application should be determined by the content of the appended claims, and the specification can be used to interpret the content of the claims.

Claims

1. A method for preparing a thermal barrier coating, characterized in that, Includes the following steps: A substrate is provided, and a metal bonding layer is prepared on the surface of the substrate; A ceramic thermal insulation layer was prepared on the surface of the metal bonding layer away from the substrate using plasma physical vapor deposition. The manufacturing process parameters of the ceramic heat insulation layer include: Ar gas flow rate of 10L / min~30L / min, He gas flow rate of 40L / min~50L / min, current of 1000A~1400A, power of 30KW~50KW, substrate temperature of 600℃~800℃, working gas pressure of 2mbar~5mbar, powder feeding rate of 2g / L~10g / L, Ar powder carrier gas flow rate of 5L / min~9L / min, and spraying distance of 400mm~800mm; The thickness of the ceramic heat insulation layer is 50μm~500μm; The ceramic heat insulation layer has a columnar crystal structure, and the columnar crystals have crystal orientation. The powder used to prepare the ceramic heat insulation layer is yttrium-doped zirconium oxide; the mass fraction of yttrium oxide in the yttrium-doped zirconium oxide is 6%~8%.

2. The method for preparing the thermal barrier coating according to claim 1, characterized in that, The metal bonding layer comprises one or more of MCrAlYSi, MCrAlY, and PtAl; wherein, each time M appears, it is independently one or more of Ni and Co; and / or, The thickness of the metal bonding layer is 30μm~200μm.

3. A thermal barrier coating prepared by the preparation method according to claim 1 or 2, characterized in that, include: Metal bonding layer; A ceramic heat insulation layer is disposed on one side surface of the metal bonding layer. The ceramic heat insulation layer is prepared by plasma physical vapor deposition and has a columnar crystal structure.

4. The thermal barrier coating according to claim 3, characterized in that, The thermal barrier coating has one or more of the following characteristics: (1) The metal bonding layer comprises one or more of MCrAlY and PtAl; wherein M comprises one or more of Ni and Co; (2) The thickness of the metal bonding layer is 30μm~200μm; (3) The thickness of the ceramic heat insulation layer is 150μm~250μm.

5. A workpiece with a thermal barrier coating, characterized in that, The coating includes a substrate and a thermal barrier coating as described in claim 3 or 4, wherein the metal bonding layer and the ceramic insulating layer in the thermal barrier coating are sequentially disposed on the surface of the substrate.

6. The thermal barrier coated workpiece according to claim 5, characterized in that, The matrix has one or more of the following characteristics: (1) The dimensions of the substrate are 5mm to 200mm; (2) The matrix is ​​a nickel-based single-crystal high-temperature alloy; (3) The matrix includes a nickel-containing γ' phase material.

7. An aerospace component, characterized in that, Includes the thermal barrier coating workpiece as described in claim 5 or 6.

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