Fan
By using semiconductor refrigeration sheet technology in the fan, the heat in the airflow is converted between the cold and hot zones, and the cooling and hot air are generated, and discharged through special outlets, the problem that traditional fans cannot achieve real cooling is solved, and efficient cooling and heating effects are achieved.
CN119712590AInactive Publication Date: 2025-03-28SHENZHEN FABER PRECISION TECH CO LTD
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Patent Information
- Application Number
- CN202411945242.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-03-28
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Technical Problem
Traditional fans cannot achieve true cooling effects and can only bring a certain sense of coolness through the flow of air.
Method used
Using semiconductor refrigeration sheet technology, the air flow is directed to the cold and hot zones in the temperature control module through the fan module, forming cold and hot air respectively, and discharged through the air-conditioning outlet and hot air outlet arranged at intervals.
Benefits of technology
It realizes effective separation of air conditioners and hot air, improves cooling efficiency, avoids energy loss and discomfort caused by the mixing of hot and cold air, and allows users to choose to blow cold or hot air as needed.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention discloses a fan. The fan comprises a circuit board; the fan module is electrically connected with the circuit board and located at the air inlet; the temperature control module is electrically connected with the circuit board and communicates with the fan module, the temperature control module comprises at least one semiconductor chilling plate, a cold plate set and a hot plate set, the semiconductor chilling plate is provided with a cold area and a hot area which are oppositely arranged, the cold plate set is correspondingly arranged in the cold area of the semiconductor chilling plate, and the hot plate set is correspondingly arranged in the hot area of the semiconductor chilling plate; wherein the fan module is used for guiding air flow to the temperature control module, the air flow passes through a cold piece set located in a cold area and a hot piece set located in a hot area in the temperature control module to form cold air and hot air, the cold air and the hot air are exhausted through a cold air outlet and a hot air outlet which are arranged at intervals, effective separation of the cold air and the hot air can be achieved, and the refrigeration efficiency is improved.
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