Method of adjusting resonance frequency of terahertz focal plane detector and applications thereof
By stacking frequency adjustment compensation plates on the back side of the photosensitive chip substrate of the terahertz focal plane detector and adjusting their thickness or number, the problem of unpredictable resonant frequency is solved, and precise frequency adjustment and performance improvement are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2026-03-24
AI Technical Summary
The resonant frequency of existing terahertz focal plane detectors is difficult to predict after formation, and its performance is affected by the electromagnetic coupling of the antenna array and the flip-chip interconnection of the CMOS readout circuit.
A frequency adjustment compensation plate is stacked on the back of the original substrate of the photosensitive chip. The thickness or number of the plate is adjusted to change the resonant frequency of the terahertz focal plane detector so that it is close to the design value.
By adjusting the thickness and number of frequency adjustment compensation plates, the electromagnetic coupling effect was effectively overcome, the resonant frequency was precisely adjusted, and the detector performance was improved.
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Figure CN119714525B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to a method for adjusting the resonant frequency of a terahertz focal plane detector and its application, and belongs to the field of micro-nano manufacturing technology. BACKGROUND
[0002] Terahertz waves (0.3-10 THz) have high penetration, low photon energy, high coherence, fingerprint spectrum and other characteristics, and have broad application prospects in military and civilian fields. The core functional materials and component technologies have become the science and technology commanding heights of international competition and China's major strategic needs.
[0003] Terahertz imaging sensing technology has the advantages of strong anti-interference ability, high resolution, good timeliness, low photon energy, strong penetration, and rich spectral information, and therefore has wide application prospects in deep space exploration and remote sensing, target sensing and attack and defense, non-destructive testing and covert target imaging. Among various terahertz detection and sensing means, terahertz focal plane array imaging has the advantages of good imaging real-time performance, and is one of the best application prospects and the strongest sustainable development potential in terahertz imaging sensing technology. In a terahertz information system, the performance of the detector is the core factor determining the overall efficiency of the system. The demand for detectors by the new generation of intelligent sensing systems is constantly increasing, and the detectors need to have the characteristics of room temperature operation, high responsivity, multifunction, chip and micro-nano. The photosensitive chip integrates the detector array and the readout circuit, has the characteristics of high resolution detection and wide angle data reception, and has broad application prospects in 6G communication, high-resolution radar, industrial detection, unmanned driving and biological medicine.
[0004] The typical terahertz focal plane array architecture includes a terahertz microlens array, a focal plane detection array chip, and an intermediate frequency circuit. As shown in Figure 1 , the detection array chip is composed of GaN photosensitive chip and CMOS readout circuit flip-chip interconnection, each detection unit (pixel) corresponds to a different position on the target, and the imaging of the full field of view is realized by independent detection of each pixel.
[0005] In the research of terahertz focal plane detector array, the spectral response characteristic is a key factor affecting the detection performance. Traditionally, the response spectrum mainly depends on the geometric structure of the antenna and the material parameters. However, when the antenna forms an array, the electromagnetic coupling effect between the antennas and the influence of the multi-layer materials (such as SiC or Si substrate, CMOS circuit, etc.) after flip-chip interconnection will cause the resonant frequency to deviate from the design target, which will significantly affect the performance of the detector. Taking a 340 GHz focal plane detector as an example, the measured response spectrum (as shown in Figure 2 ) shows that the maximum response is obtained near 300 GHz, which is obviously deviated from the design frequency, and this frequency deviation will obviously reduce the performance of the detector. SUMMARY
[0006] The main objective of this invention is to provide a method for adjusting the resonant frequency of a terahertz focal plane detector and its application, thereby overcoming the shortcomings of the prior art.
[0007] To achieve the aforementioned objectives, the technical solution adopted by this invention includes:
[0008] A first aspect of the present invention provides a method for adjusting the resonant frequency of a terahertz focal plane detector, the terahertz focal plane detector comprising a flip-chip interconnected photosensitive chip and a CMOS readout circuit, the photosensitive chip comprising a substrate and an antenna array disposed on the substrate, and the method further comprising:
[0009] x frequency adjustment compensation plates are stacked on the back side of the original substrate opposite to the antenna array. The frequency adjustment compensation plates are made of the same material as the original substrate. The original substrate and the x frequency adjustment compensation plates are used as a whole as the new substrate of the photosensitive chip. The thickness or number of the frequency adjustment compensation plates are adjusted to change the resonant frequency of the terahertz focal plane detector, so that the measured value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency is close to or equal to the designed theoretical value, x≥1.
[0010] A second aspect of this invention provides a method for fabricating a terahertz focal plane detector, comprising: flip-chip interconnecting a photosensitive chip and a CMOS readout circuit to form a terahertz focal plane detector, wherein the photosensitive chip includes a substrate and an antenna array disposed on the substrate.
[0011] Furthermore, x frequency adjustment compensation plates are stacked on the back side of the original substrate opposite to the antenna array. The frequency adjustment compensation plates are made of the same material as the original substrate. The original substrate and the x frequency adjustment compensation plates are used as a whole as the new substrate of the photosensitive chip. The thickness or number of the frequency adjustment compensation plates are adjusted to change the resonant frequency of the terahertz focal plane detector, so that the measured value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency is close to or equal to the designed theoretical value. Finally, the original substrate and the x frequency adjustment compensation plates are combined into one unit, where x ≥ 1.
[0012] Compared with the prior art, the advantages of the present invention include:
[0013] This invention provides a method for adjusting the resonant frequency of a terahertz focal plane detector. By adding a frequency adjustment compensation plate and adjusting the thickness of x frequency compensation adjustment plates, the period of the response spectrum and the position of the response peak are changed, thereby enhancing the electric field coupling at a specific frequency. This overcomes the electromagnetic coupling effect between antenna arrays and the negative impact of flip-chip interconnection with the CMOS readout circuit on frequency adjustment, and realizes the adjustment of the resonant frequency of the terahertz focal plane detector, solving the problem of unpredictable changes in the resonant frequency after the formation of the terahertz focal plane detector.
[0014] The present invention provides a method for adjusting the resonant frequency of a terahertz focal plane detector. The resonant frequency can be controlled simply by adding frequency adjustment compensation plates and changing the thickness of x frequency adjustment compensation plates. This method does not require changing the structure of the terahertz focal plane detector, does not rely on complex antenna structure adjustments or dynamic tuning components, and adjusts the actual value of the resonant frequency of the terahertz focal plane detector back to the design target. The process is simple and the cost is lower. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of a terahertz focal plane detector.
[0016] Figure 2 This is the response spectrum of a 340 GHz terahertz focal plane detector;
[0017] Figure 3 It is the response spectrum of a 900 GHz terahertz focal plane detector;
[0018] Figure 4 This is a schematic diagram illustrating the principle of adjusting the resonant frequency of a terahertz focal plane detector by increasing the original substrate thickness using a frequency adjustment compensation plate, as provided in a typical embodiment of the present invention.
[0019] Figure 5 This is the response spectrum of a 900GHz terahertz focal plane detector after adding frequency adjustment compensation plates of different thicknesses;
[0020] Figure 6 It is the normalized response spectrum of a 340GHz terahertz focal plane detector with added frequency adjustment compensation plates of different thicknesses. Detailed Implementation
[0021] In view of the shortcomings of the prior art, the inventors of this invention, through long-term research and extensive practice, have proposed the technical solution of this invention. The following will further explain and illustrate this technical solution, its implementation process, and its principles.
[0022] A first aspect of this invention provides a method for adjusting the resonant frequency of a terahertz focal plane detector, the terahertz focal plane detector comprising a flip-chip interconnected photosensitive chip and a CMOS readout circuit, the photosensitive chip comprising a substrate and an antenna array disposed on the substrate.
[0023] The method includes: stacking x frequency adjustment compensation plates on the back side of the original substrate opposite to the antenna array, wherein the frequency adjustment compensation plates are made of the same material as the original substrate, and using the original substrate and the x frequency adjustment compensation plates as a whole as a new substrate for the photosensitive chip; and adjusting the thickness or number of the frequency adjustment compensation plates to change the resonant frequency of the terahertz focal plane detector, so that the measured value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency is close to or equal to the designed theoretical value, where x≥1.
[0024] Furthermore, the method for adjusting the resonant frequency of the terahertz focal plane detector includes: thinning the frequency adjustment compensation plate, replacing it with a frequency adjustment compensation plate with a larger thickness, or increasing the number of frequency adjustment compensation plates.
[0025] Furthermore, the method for adjusting the resonant frequency of the terahertz focal plane detector includes: setting x frequency adjustment compensation plates on the original substrate to obtain a new substrate; performing a responsivity test on the terahertz focal plane detector to obtain the actual response spectrum of the terahertz focal plane detector; if the measured value of the resonant frequency corresponding to the resonant peak at the required frequency is different from the design value, then adjusting the thickness or number of the frequency adjustment compensation plates until the resonant frequency corresponding to the resonant peak is the required design value.
[0026] Furthermore, the method for adjusting the resonant frequency of the terahertz focal plane detector specifically includes: determining the thickness adjustment value of the x frequency adjustment compensation plates according to the design value of the resonant frequency of the terahertz focal plane detector, where L is the sum of the thicknesses of the x frequency adjustment compensation plates and the original substrate.
[0027]
[0028] Where f is the design value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency, n is the equivalent refractive index of the original substrate when the resonant peak is at the measured value position, and c is the speed of light in vacuum.
[0029] Furthermore, the method for adjusting the resonant frequency of the terahertz focal plane detector specifically includes: adjusting the thickness of the new substrate of the photosensitive chip multiple times.
[0030] Furthermore, if the measured value of the resonant frequency corresponding to the resonant peak is lower than the design value, the frequency adjustment compensation plate of the new substrate is thinned; if the measured value of the resonant frequency corresponding to the resonant peak is higher than the design value, the frequency adjustment compensation plate with a larger thickness is replaced or the number of the frequency adjustment plates is increased.
[0031] Furthermore, the value of k used in adjusting the thickness of the x frequency adjustment compensation plates is decreased successively.
[0032] A second aspect of this invention provides a method for fabricating a terahertz focal plane detector, comprising: flip-chip interconnecting a photosensitive chip and a CMOS readout circuit to form a terahertz focal plane detector, wherein the photosensitive chip includes a primary substrate and an antenna array disposed on the primary substrate; and stacking x frequency adjustment compensation plates on the back side of the primary substrate opposite to the antenna array, wherein the frequency adjustment compensation plates are made of the same material as the primary substrate, and using the primary substrate and the x frequency adjustment compensation plates as a whole as a new substrate for the photosensitive chip; and adjusting the thickness or number of the frequency adjustment compensation plates to change the resonant frequency of the terahertz focal plane detector, such that the measured value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the desired frequency is close to or equal to the designed theoretical value; and finally combining the primary substrate and the x frequency adjustment compensation plates into a single unit, where x ≥ 1.
[0033] Furthermore, the method for manufacturing the terahertz focal plane detector includes: thinning the frequency adjustment compensation plate, or replacing it with a frequency adjustment compensation plate with a larger thickness, or increasing the number of the frequency adjustment compensation plates.
[0034] Furthermore, the method for fabricating the terahertz focal plane detector specifically includes:
[0035] A new substrate is obtained by setting x frequency adjustment compensation plates on the original substrate. The responsivity of the terahertz focal plane detector is tested to obtain the actual response spectrum of the terahertz focal plane detector. If the measured value of the resonant frequency corresponding to the resonant peak at the required frequency is different from the design value, the thickness or number of the frequency adjustment compensation plates is adjusted until the resonant frequency corresponding to the resonant peak is the required design value.
[0036] Furthermore, if the measured value of the resonant frequency corresponding to the resonant peak is lower than the design value, the frequency adjustment compensation plate of the new substrate is thinned; if the measured value of the resonant frequency corresponding to the resonant peak is higher than the design value, the frequency adjustment compensation plate with a larger thickness is replaced or the number of the frequency adjustment plates is increased.
[0037] In a more specific implementation, the fabrication method of the terahertz focal plane detector specifically includes: determining the thickness adjustment values of the x frequency adjustment compensation plates according to the design value of the resonant frequency of the terahertz focal plane detector, where L is the sum of the thicknesses of the x frequency adjustment compensation plates and the original substrate.
[0038]
[0039] Where f is the design value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency, n is the equivalent refractive index of the original substrate when the resonant peak is at the measured value position, and c is the speed of light in vacuum.
[0040] Furthermore, the thickness of the new substrate of the photosensitive chip is adjusted multiple times;
[0041] Furthermore, the value of k used in adjusting the thickness of the x frequency adjustment compensation plates is decreased successively.
[0042] The following will provide a further explanation of the technical solution, its implementation process, and its principles, in conjunction with the accompanying drawings and specific implementation examples.
[0043] In fabricating terahertz focal plane array detectors, electromagnetic coupling and edge effects between antennas cause a shift or change in the overall resonant frequency of the detector. Adjusting the geometry of each individual antenna alone cannot precisely control the resonant frequency of the entire detector. Furthermore, due to the flip-chip interconnection between the terahertz focal plane array detector chip and the CMOS readout circuit, as well as the influence of various materials such as the original substrate of the terahertz focal plane array detector chip (e.g., SiC substrate, Si substrate) and the CMOS readout circuit traces, the electromagnetic environment of the terahertz focal plane array detector becomes complex and unpredictable, leading to a discrepancy between the actual resonant frequency after fabrication and the design target value.
[0044] This invention has discovered that in existing terahertz focal plane array detectors, because the wavelength of the incident THz radiation is comparable to or even longer than the substrate thickness of the detector, a very significant THz wave interference effect occurs at the antenna position, such as... Figure 3 As shown, the response spectrum of the 900GHz focal plane detector exhibits periodic interference peaks. This substrate cavity interference effect significantly impacts signal coupling. Based on this, this invention discovers that, without altering the design of the terahertz focal plane detector, by adding a frequency adjustment compensation plate to the original substrate on the photosensitive chip and changing the thickness of the compensation plate, the interference conditions can be changed. This enhances the electric field coupling of the antenna at a specific frequency, thereby enabling the resonant frequency to be adjusted back to the design value.
[0045] Specifically, there are two main ways to change the thickness of the frequency adjustment compensation plate: one is to thin the plate, reducing its thickness; the other is to replace it with a plate of greater thickness or increase the number of plates to increase the overall thickness by x. Since the thinning process after flip-chip mounting is quite difficult, especially ensuring uniform and consistent thickness with very high precision requirements, the following example will illustrate the implementation of a scheme that primarily uses frequency adjustment compensation plates of different thicknesses to alter interference conditions, thereby enhancing electric field coupling at a specific frequency and adjusting the resonant frequency back to the design value.
[0046] In a more specific implementation, a method for adjusting the resonant frequency of a terahertz focal plane detector is performed after flip-chip interconnecting a photosensitive chip and a CMOS readout circuit to form a terahertz focal plane detector. The photosensitive chip includes a primary substrate and an antenna array disposed on the primary substrate. The specific adjustment method is as follows:
[0047] First, the thickness adjustment value of a single frequency adjustment compensation plate is determined based on the design value of the resonant frequency of the terahertz focal plane detector, where L is the sum of the thicknesses of the frequency adjustment compensation plate and the original substrate.
[0048]
[0049] Where f is the design value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency, n is the equivalent refractive index of the original substrate when the resonant peak is at the measured value position, and c is the speed of light in vacuum.
[0050] It should be noted that while adding a frequency adjustment compensation plate can effectively adjust the resonant frequency, it will lead to a relative reduction in the detector's response bandwidth. Therefore, within the limits of the process, a smaller "k" value should be selected as much as possible to mitigate the impact of adding a frequency adjustment compensation plate on the detector's response bandwidth.
[0051] After determining the required thickness adjustment value L, a frequency adjustment compensation plate with the corresponding thickness is fabricated. It should be noted that before fixing the frequency adjustment compensation plate to the original substrate of the photosensitive chip, the electromagnetic field distribution of the terahertz focal plane detector with the added frequency adjustment compensation plate of the corresponding thickness can be simulated using electromagnetic simulation software (such as HFSS, CST, etc.). The change in electric field intensity at the antenna position can be analyzed, and the thickness adjustment value L can be further optimized based on the simulation results to ensure that the adjusted resonant frequency is more consistent with the design target.
[0052] Then, as Figure 4As shown, the frequency adjustment compensation plate is fixedly assembled with the original substrate of the photosensitive chip, and the original substrate is thickened through methods such as mounting. During the assembly process, it is important to ensure that the frequency adjustment compensation plate and the original substrate are tightly bonded to ensure the consistency of electromagnetic characteristics and reduce interference effects caused by uneven thickness.
[0053] To verify whether the addition of the frequency adjustment compensation plate achieved the expected results, the assembled terahertz focal plane detector needed to undergo another responsivity test. By testing the responsivity of the terahertz focal plane detector at different frequencies, it was determined whether adding the frequency adjustment compensation plate and adjusting its thickness successfully adjusted the resonant frequency, and whether the response at the required resonant frequency met the design target. If the test results showed that the resonant frequency had been adjusted to the target range and the responsivity curve was consistent with expectations, the resonant frequency adjustment was considered complete. If the actual deviation of the resonant frequency still did not meet the requirements, the thickness of the frequency adjustment compensation plate was further adjusted based on the test results. Specifically, if the measured value of the resonant frequency corresponding to the resonant peak was lower than the design value, the frequency adjustment compensation plate was thinned to obtain a frequency adjustment compensation plate with a smaller thickness. If the measured value of the resonant frequency corresponding to the resonant peak was higher than the design value, a frequency adjustment compensation plate with a larger thickness was fabricated and replaced until the design target was achieved.
[0054] In a typical implementation case, the response spectrum of the FPA-900GHz terahertz focal plane detector with added frequency adjustment compensation plates of different thicknesses is as follows: Figure 5 As shown, it can be seen that adding the frequency adjustment compensation plate has no significant effect on the magnitude of the responsivity value of the terahertz focal plane detector. However, adding the frequency adjustment compensation plate can effectively change the period of the response spectrum and the position of the response peak.
[0055] In a typical implementation, the present invention also tested the normalized response spectrum of the terahertz focal plane detector after adding frequency tuning compensation plates of different thicknesses in a 340 GHz terahertz focal plane detector, such as... Figure 6 As shown in the figure. Experiments have confirmed that the frequency adjustment compensation plate can effectively adjust the resonant frequency of the terahertz focal plane detector, and that frequency adjustment compensation plates of different thicknesses can achieve different degrees of frequency shift compensation.
[0056] This invention provides a method for adjusting the resonant frequency of a terahertz focal plane detector. By introducing a frequency adjustment compensation plate and adjusting its thickness, the period of the response spectrum and the position of the response peak are changed, thereby enhancing the electric field coupling at a specific frequency. This overcomes the electromagnetic coupling effect between antenna arrays and the negative impact of flip-chip interconnection with the CMOS readout circuit on frequency adjustment, and achieves the adjustment of the resonant frequency of the terahertz focal plane detector, solving the problem of unpredictable changes in the resonant frequency after the formation of the terahertz focal plane detector.
[0057] The present invention provides a method for adjusting the resonant frequency of a terahertz focal plane detector. This method can control the resonant frequency simply by introducing a frequency adjustment compensation plate and adjusting the thickness of the plate. It does not require changing the structure of the terahertz focal plane detector, nor does it rely on complex antenna structure adjustments or dynamic tuning components. The actual value of the resonant frequency of the terahertz focal plane detector is adjusted back to the design target. The process is simple and the cost is lower.
[0058] It should be understood that the above embodiments are merely illustrative of the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. They should not be construed as limiting the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.
Claims
1. A method for adjusting the resonant frequency of a terahertz focal plane detector, the terahertz focal plane detector comprising a flip-chip interconnected photosensitive chip and a CMOS readout circuit, the photosensitive chip comprising a substrate and an antenna array disposed on the substrate, characterized in that, The method further includes: x frequency adjustment compensation plates are stacked on the back side of the original substrate, opposite to the antenna array. The frequency adjustment compensation plates are made of the same material as the original substrate. The original substrate and the x frequency adjustment compensation plates together serve as the new substrate for the photosensitive chip. The thickness or number of the frequency adjustment compensation plates is adjusted to change the resonant frequency of the terahertz focal plane detector, so that the measured value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency is close to or equal to the designed theoretical value. If the measured value of the resonant frequency corresponding to the resonant peak is lower than the design value, the frequency adjustment compensation plates of the new substrate are thinned. If the measured value of the resonant frequency corresponding to the resonant peak is higher than the design value, a frequency adjustment compensation plate with a larger thickness is replaced or the number of the frequency adjustment compensation plates is increased, where x ≥ 1.
2. The method for adjusting the resonant frequency of a terahertz focal plane detector according to claim 1, characterized in that, include: A new substrate is obtained by setting x frequency adjustment compensation plates on the original substrate. The responsivity of the terahertz focal plane detector is tested to obtain the actual response spectrum of the terahertz focal plane detector. If the measured value of the resonant frequency corresponding to the resonant peak at the required frequency is different from the design value, the thickness or number of the frequency adjustment compensation plates is adjusted until the resonant frequency corresponding to the resonant peak is the required design value.
3. The method for adjusting the resonant frequency of a terahertz focal plane detector according to claim 2, characterized in that, include: The thickness adjustment values of the x frequency adjustment compensation plates are determined based on the design value of the resonant frequency of the terahertz focal plane detector, where L is the sum of the thicknesses of the x frequency adjustment compensation plates and the original substrate. ， (k=0, 1, 2……) in, f is the design value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency, n is the equivalent refractive index of the original substrate when the resonant peak is at the measured value position, and c is the speed of light in vacuum.
4. The method for adjusting the resonant frequency of a terahertz focal plane detector according to claim 3, characterized in that: The thickness of the new substrate for the photosensitive chip was adjusted multiple times.
5. The method for adjusting the resonant frequency of a terahertz focal plane detector according to claim 4, characterized in that: The thickness of the x frequency adjustment compensation plates was adjusted multiple times. k The value decreases successively.
6. A method for fabricating a terahertz focal plane detector, characterized in that, include: A terahertz focal plane detector is formed by flip-chip interconnecting a photosensitive chip and a CMOS readout circuit. The photosensitive chip includes a substrate and an antenna array disposed on the substrate. Furthermore, x frequency adjustment compensation plates are stacked on the back side of the original substrate opposite to the antenna array. The frequency adjustment compensation plates are made of the same material as the original substrate. The original substrate and the x frequency adjustment compensation plates are used as a whole as the new substrate of the photosensitive chip. The thickness or number of the frequency adjustment compensation plates is adjusted to change the resonant frequency of the terahertz focal plane detector, so that the measured value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency is close to or equal to the designed theoretical value. Finally, the original substrate and the x frequency adjustment compensation plates are combined into one unit. If the measured value of the resonant frequency corresponding to the resonant peak is lower than the design value, the frequency adjustment compensation plates of the new substrate are thinned. If the measured value of the resonant frequency corresponding to the resonant peak is higher than the design value, the frequency adjustment compensation plates with a larger thickness are replaced or the number of frequency adjustment compensation plates is increased, where x≥1.
7. The method for manufacturing a terahertz focal plane detector according to claim 6, characterized in that, include: A new substrate is obtained by setting x frequency adjustment compensation plates on the original substrate. The responsivity of the terahertz focal plane detector is tested to obtain the actual response spectrum of the terahertz focal plane detector. If the measured value of the resonant frequency corresponding to the resonant peak at the required frequency is different from the design value, the thickness or number of the frequency adjustment compensation plates is adjusted until the resonant frequency corresponding to the resonant peak is the required design value.
8. The method for manufacturing a terahertz focal plane detector according to claim 7, characterized in that, include: The thickness adjustment values of the x frequency adjustment compensation plates are determined based on the design value of the resonant frequency of the terahertz focal plane detector, where L is the sum of the thicknesses of the x frequency adjustment compensation plates and the original substrate. ， (k=0, 1, 2……) in, f is the design value of the resonant frequency corresponding to the resonant peak of the terahertz focal plane detector at the required frequency, n is the equivalent refractive index of the original substrate when the resonant peak is at the measured value position, and c is the speed of light in vacuum.
9. The method for manufacturing a terahertz focal plane detector according to claim 8, characterized in that: The thickness of the new substrate for the photosensitive chip was adjusted multiple times.
10. The method for manufacturing a terahertz focal plane detector according to claim 9, characterized in that: The thickness of the x frequency adjustment compensation plates was adjusted multiple times. k The value decreases successively.
Citation Information
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