Oscilloscope sampling module packaging structure and oscilloscope comprising same

Abstract

The invention discloses an oscilloscope sampling module packaging structure and an oscilloscope comprising the same, and relates to the technical field of chip packaging. The circuit board substrate is used for bearing the chip body, a high-frequency circuit and a low-frequency circuit which are mutually independent are arranged in the circuit board substrate, and the high-frequency circuit and the low-frequency circuit are electrically connected with corresponding pins of the chip body; according to the oscilloscope sampling module packaging structure and the oscilloscope, the shell body is adopted to package the chip body so as to improve the anti-interference performance, and the chip gasket made of the high-heat-conduction insulating material is additionally arranged between the chip body and the shell body, so that the problem that heat dissipation is difficult due to the fact that the bottom of the chip body must be connected with a suspended network is solved; and meanwhile, the high-frequency connector penetrates through the shell body and the high-frequency line which transmits in a differential mode is adopted, so that the bandwidth and the anti-interference capability are improved, the noise is reduced, and the sampling effect of the oscilloscope is improved.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging technology, and more specifically, to an oscilloscope sampling module packaging structure. In addition, the present invention also relates to an oscilloscope including the oscilloscope sampling module packaging structure. Background Art

[0002] In a sampling oscilloscope, an electrical signal sampling module device that realizes high bandwidth and low noise is a key component for the sampling oscilloscope to meet functional indicators and improve system performance.

[0003] In channel transmission, channel attenuation increases with the increase of frequency. Large attenuation leads to a decrease in the upper limit of channel bandwidth. Therefore, reducing signal attenuation is a major method to increase channel bandwidth. At the same time, reducing noise interference in signal transmission on the channel can improve the overall performance of oscilloscope eye diagram measurement. In the signal transmission link, good delay characteristics are helpful for eye diagram recovery and compensation.

[0004] There are few introductions to the known sampling oscilloscope front-end module packaging, especially for related module packaging products above 56Gbaud. There is almost no relevant introduction on the market. For high-speed packaging, the main packaging on the market is BGA packaging (Ball Grid Array Package), but this does not perfectly solve the problem of high-speed signal insertion loss. In addition, the insertion loss and frequency response bandwidth of the substrate itself are also weaker than high speed, and it cannot solve the low loss and low noise problems between the bare chip and the connector. For devices packaged with BGA, there is still a transitional loss problem from the high-speed signal PAD to the connector.

[0005] Moreover, the current design focus still relies on chip design. However, the process size of the chip is very different from the module process size level. It is difficult for traditional design to achieve a good balance between process and design between the two processes, resulting in the bandwidth of the product being highly limited compared to the chip itself, with low bandwidth and high noise.

[0006] In summary, how to solve the problems of low bandwidth, high noise and poor heat dissipation caused by chip packaging is an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0007] In view of this, the purpose of the present invention is to provide an oscilloscope sampling module packaging structure, in which a shell body is used to encapsulate the chip body to improve the anti-interference performance, and a chip gasket is added between the chip body and the shell body to solve the problem of heat dissipation difficulty caused by the bottom of the chip body being a suspended network. At the same time, a high-frequency connector is used to penetrate the shell body and the high-frequency line transmitted using a differential method to increase the bandwidth and anti-interference ability, thereby reducing noise and improving the sampling effect of the oscilloscope.

[0008] Another object of the present invention is to provide an oscilloscope including the above-mentioned oscilloscope sampling module packaging structure, which has the same technical features and can solve the same technical problems.

[0009] In order to achieve the above object, the present invention provides the following technical solutions:

[0010] An oscilloscope sampling module packaging structure, comprising:

[0011] Chip body;

[0012] A circuit board substrate, used to carry the chip body, wherein a high-frequency circuit and a low-frequency circuit are independently arranged inside the circuit, and the high-frequency circuit and the low-frequency circuit are both electrically connected to corresponding pins of the chip body; differential transmission is adopted in the high-frequency circuit, and the spacing between two adjacent groups of differential lines in the high-frequency circuit near one end of the chip body is smaller than the spacing at the other end;

[0013] A shell body, wherein an inner cavity for accommodating the circuit board substrate and the chip body is provided inside the shell body;

[0014] A chip substrate, which is arranged between the bottom surface of the chip body and the bottom surface of the inner cavity, so that the chip body can exchange heat with the shell body;

[0015] A high-frequency connector, which penetrates through the side wall of the housing body and is electrically connected to the high-frequency circuit;

[0016] A low-frequency connector penetrates through the side wall of the shell body and is electrically connected to the low-frequency circuit.

[0017] Preferably, the housing body (6) is made of metal, and / or

[0018] The chip substrate (2) is made of an insulating heat-conducting material.

[0019] Preferably, the circuit board substrate includes a low-frequency power supply board and a high-frequency radio frequency board, the low-frequency circuit is arranged in the low-frequency power supply board, the high-frequency circuit is arranged in the high-frequency radio frequency board, and the high-frequency radio frequency board is a soft substrate.

[0020] Preferably, the bottom of the low-frequency power supply board is grounded to the bottom surface of the inner cavity, and a placement groove is provided in the low-frequency power supply board for accommodating the chip substrate.

[0021] Preferably, a receiving groove is provided in the shell body for separately receiving the high-frequency radio frequency board, and the bottom surface of the high-frequency radio frequency board is grounded to the bottom surface of the receiving groove.

[0022] Preferably, a first transition zone (411) is provided at one end of the differential line close to the high-frequency connector, so that the width of the end of the differential line is consistent with the width of the core of the high-frequency connector, and the center lines of the two overlap.

[0023] Preferably, a second transition zone is provided at one end of the differential line close to the chip body, so that the spacing between the ends of two adjacent groups of the differential lines is consistent with the spacing between the differential pads of the pins at corresponding positions of the chip body, and the center lines of the two overlap.

[0024] Preferably, the second transition zone includes an electrically connected cutting zone and a capacitance compensation zone, the cutting zone includes the remaining portion of two adjacent groups of differential lines away from the side cutting angle, and the capacitance compensation zone is arranged on the side adjacent to the two adjacent groups of differential lines; so that the spacing between two adjacent groups of the second transition zones is equal to the spacing between the corresponding pins of the chip body.

[0025] Preferably, a cover plate is provided at the upper end of the shell body to cover the inner cavity;

[0026] An upper flange is arranged at the opening edge of the inner cavity for wrapping the side edge of the cover plate.

[0027] An oscilloscope comprises any one of the above-mentioned oscilloscope sampling module packaging structures.

[0028] Compared with the prior art, the oscilloscope sampling module packaging structure provided by the present invention has at least the following beneficial effects:

[0029] 1. A heat-conducting chip substrate is arranged at the bottom of the chip body to solve the problem that the chip body must be negatively charged or suspended, and the heat generated by the chip body can be transferred to the shell body, and the shell body has a large heat dissipation area for rapid heat dissipation to avoid high temperature of the chip body;

[0030] 2. The low-frequency power supply circuit and the high-frequency signal transmission circuit in the circuit board substrate are designed independently to reduce the impact of the power supply circuit on the signal transmission circuit, that is, to reduce the noise in the signal;

[0031] 3. The signal in the high-frequency line is transmitted differentially, which has strong anti-interference ability, and the differential line adopts the form of single-ended routing to differential routing. The single-ended routing close to the high-frequency connector has a wider routing width and spacing than the differential routing, which helps to reduce the transmission loss of the differential line and facilitates connection with the high-frequency connector. At the same time, the high-frequency connector adopts a design that runs through the shell body, which is conducive to achieving high bandwidth.

[0032] The oscilloscope provided by the present invention includes the above-mentioned oscilloscope sampling module packaging structure and has the same beneficial effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0034] Figure 1 A schematic diagram of the packaging structure of the oscilloscope sampling module provided by the present invention;

[0035] Figure 2 An exploded view of the parts of the oscilloscope sampling module packaging structure provided by the present invention;

[0036] Figure 3 A top view of the packaging structure of the oscilloscope sampling module provided by the present invention;

[0037] Figure 4 This is a schematic diagram of the wiring inside the packaging structure of the oscilloscope sampling module provided by the present invention;

[0038] Figure 5 This is a schematic diagram of assembling the high-frequency radio frequency board and differential line provided by the present invention;

[0039] Figure 6 for Figure 5 The enlarged view of point A in the middle;

[0040] Figure 7 for Figure 5 The enlarged view of point B in the middle;

[0041] Figure 8-Figure 10 The simulation results of the return loss curve at both ends of the differential line at different frequencies.

[0042] Figure 1-Figure 10 middle:

[0043] 1. Chip body; 2. Chip substrate; 3. Low-frequency power supply board; 4. High-frequency RF board; 41. Differential line; 411. First transition zone; 412. Capacitor compensation zone; 413. Cutting zone; 5. High-frequency connector; 6. Shell body; 61. Upper flange; 7. Low-frequency connector; 8. Cover plate; 81. Boss; 9. Pin. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] The core of the present invention is to provide an oscilloscope sampling module packaging structure, which uses a shell body to package the chip body to improve the anti-interference performance, and adds a chip gasket between the chip body and the shell body to solve the problem of heat dissipation of the chip body. At the same time, a high-frequency connector is used to penetrate the shell body and the high-frequency line using differential transmission to increase the bandwidth and anti-interference ability, thereby reducing noise and improving the sampling effect of the oscilloscope.

[0046] Another core of the present invention is to provide an oscilloscope including the above-mentioned oscilloscope sampling module packaging structure, which has the same technical features and can solve the same technical problems.

[0047] Please refer to Figure 1-Figure 7 , an oscilloscope sampling module packaging structure, comprising:

[0048] Chip body 1;

[0049] A circuit board substrate is used to carry the chip body 1, and is provided with independent high-frequency circuits and low-frequency circuits inside, and both the high-frequency circuits and the low-frequency circuits are electrically connected to the corresponding pins of the chip body 1; the high-frequency circuit is used for high-frequency signal input and output of the chip body 1, and the low-frequency circuit is used for low-frequency power supply of the chip body 1. Differential transmission is adopted in the high-frequency circuit, and the spacing between two adjacent groups of differential lines 41 in the high-frequency circuit near one end of the chip body 1 is smaller than the spacing at the other end;

[0050] The housing body 6 has an inner cavity for accommodating the circuit board substrate and the chip body 1, and the bottom surface of the circuit board substrate is grounded to the bottom surface of the inner cavity;

[0051] The chip substrate 2 is disposed between the bottom surface of the chip body 1 and the bottom surface of the inner cavity, so that the chip body 1 can exchange heat with the housing body 6;

[0052] A high-frequency connector 5, which penetrates the side wall of the housing body 6 and is electrically connected to the high-frequency circuit;

[0053] The low frequency connector 7 penetrates through the side wall of the housing body 6 and is electrically connected to the low frequency circuit.

[0054] The housing body 6 is made of metal, and / or

[0055] The chip substrate 2 is made of an insulating thermally conductive material.

[0056] like Figure 1-Figure 4As shown, a metal shell body 6 is used to encapsulate the chip body 1, which effectively reduces external interference. The shell body 6 is preferably made of copper material and gold-plated on the surface, and an inner cavity is provided to accommodate the circuit board substrate and the chip body 1. The cavity is preferably made of copper and gold-plated on the surface by 0.5-1 μm, so that the bottom surface of the circuit board substrate can be grounded by contacting with the bottom surface of the inner cavity, thereby ensuring its stability during operation;

[0057] At the same time, independent low-frequency circuits and high-frequency circuits are set in the circuit board substrate, wherein the low-frequency circuit is used for the low-frequency power supply of the chip body 1, and the high-frequency circuit is used for the high-frequency signal input and output of the chip body 1. The separation design of the high-frequency circuit and the low-frequency circuit can reduce the system power supply noise interference, thereby reducing the noise in the signal;

[0058] At the same time, differential transmission is adopted in the high-frequency circuit, and the distances between the two ends of the differential line 41 are not equal, that is, a transition mode from single-ended routing to differential routing is realized between the pins of the high-frequency connector 5 and the chip body 1, thereby facilitating the electrical connection between the differential line 41 and the high-frequency connector 5, ensuring stable welding between the two; and the high-frequency connector 5 penetrates the side wall of the shell body 6 in a through-wall manner, which helps to achieve high bandwidth;

[0059] And if Figure 3 As shown, the pins of the chip body 1 are electrically connected to the corresponding positions of the high-frequency circuit and the low-frequency circuit by gold wire bonding, and the chip substrate 2 is arranged between the chip body 1 and the bottom surface of the inner cavity, so that the chip substrate 2 supports the chip body 1, and the heat generated by the chip body 1 can be transferred to the shell body 6 through the chip substrate 2 for heat dissipation, thereby improving the heat dissipation effect of the chip body 1;

[0060] The chip substrate 2 is preferably made of aluminum nitride ceramics, and the chip body 1 and the chip substrate 2 are bonded together using a high thermal conductivity insulating adhesive, which helps to improve the heat exchange efficiency between the chip body 1 and the chip substrate 2; at the same time, combined with the good thermal conductivity of the surface material of the inner cavity, the chip substrate 2 is bonded to the shell body 6, which achieves rapid heat dissipation of the chip body 1 and solves the problem that the chip body 1 cannot be directly bonded to the shell body 6 for heat conduction;

[0061] Through simulation, after long-term operation, the surface temperature of the chip body 1 is 82°, the temperature of the inner cavity is 78°, and there is good heat conduction efficiency between the surface chip body 1 and the shell body 6.

[0062] In some embodiments, the circuit board substrate includes a low-frequency power supply board 3 and a high-frequency radio frequency board 4, the low-frequency circuit is arranged in the low-frequency power supply board 3, the high-frequency circuit is arranged in the high-frequency radio frequency board 4, and the high-frequency radio frequency board 4 is a soft substrate;

[0063] like Figure 2As shown, the circuit board substrate adopts a split board design of a low-frequency power supply board 3 and a high-frequency radio frequency board 4, which further reduces the interference between the low-frequency circuit and the high-frequency circuit, and helps to reduce the difficulty of processing the circuit board substrate;

[0064] Among them, the high-frequency RF board 4 is mainly designed with a soft substrate with low dielectric constant and low loss, preferably a 5-mil thick Rogers board with a specification of RO5880 and a surface copper thickness of 18um, which is easy to process and can reduce processing errors, thereby ensuring the integrity of signal transmission between the high-frequency connector 5 and the chip body 1.

[0065] In some embodiments, the bottom of the low-frequency power supply board 3 is grounded to the bottom surface of the inner cavity, and a placement groove is provided in the low-frequency power supply board 3 for accommodating the chip substrate 2;

[0066] like Figure 2 and Figure 3 As shown, a placement groove with a single-side opening is set at the edge of the low-frequency power supply board 3, the chip body 1 is placed above the placement groove, and the pins around the chip body 1 are electrically connected to the low-frequency circuit or the high-frequency circuit by gold wire bonding. Before assembly, a high thermal conductivity insulating glue is preferably used to bond the chip body 1 and the chip substrate 2 together. Therefore, during assembly, it is only necessary to place the chip substrate 2 in the placement groove to quickly complete the relative positioning of the chip body 1 and the low-frequency power supply board 3, and ensure that the heat generated by the chip body 1 can be transferred to the cavity of the inner cavity through the chip substrate 2, thereby quickly dissipating the heat.

[0067] In some embodiments, a receiving groove is provided in the housing body 6 for separately receiving the high-frequency radio frequency board 4, and the bottom surface of the high-frequency radio frequency board 4 is grounded to the bottom surface of the receiving groove;

[0068] like Figure 2 and Figure 3 As shown, the integrated design of the receiving groove and the inner cavity facilitates shielding of the high-frequency circuit while meeting the heat dissipation requirements, and the high-frequency radio frequency board 4 is arranged separately in the receiving groove, and is physically separated from the low-frequency power supply board 3, further reducing the interference of the low-frequency circuit to the high-frequency circuit;

[0069] At the same time, if Figure 3 As shown, the high-frequency RF board 4 adopts a Y-shaped design, and the two groups of differential lines 41 in the high-frequency circuit are also arranged in a Y shape, that is, the ends of the two groups of differential lines 41 close to the high-frequency connector 5 are respectively arranged on different forks of the high-frequency RF board 4, and the accommodating groove is provided with an isolator in the middle of the fork of the high-frequency RF board 4, so as to further reduce the noise influence between the two groups of differential lines 41.

[0070] In some embodiments, a first transition region 411 is provided at one end of the differential line 41 close to the high-frequency connector 5, so that the width of the end of the differential line 41 is consistent with the width of the core of the high-frequency connector 5, and the center lines of the two overlap;

[0071] like Figure 5 and Figure 6 As shown, since the width of the differential line 41 itself is fixed, such as 0.37 mm, and the core width of the high-frequency connector 5 is only 0.25 mm, there is a large difference between the widths of the two, which avoids the return loss at the contact position. Therefore, a first transition zone 411 is set at one end of the differential line 41 close to the high-frequency connector 5. The first transition zone 411 is an isosceles trapezoid as a whole, which is specifically achieved by cutting the copper foil on both sides of the differential line 41; Figure 8 As shown in FIG. 4 , it is found through simulation that after adding the first transition zone 411, the echo within 50 GHz is controlled within -20 dB, as shown in FIG. Fig. 9 As shown, the 65GHz return loss is controlled within -17dB, effectively reducing the impedance drop at the pad position of the high-frequency connector 5.

[0072] In some embodiments, by selecting and designing the material of the differential line 41, the width of the end of the differential line 41 is close to and not less than the width of the core of the high-frequency connector 5, which facilitates the welding of the differential line 41 and the high-frequency connector 5, and also falls within the protection scope of the present application.

[0073] In some embodiments, a second transition region is provided at one end of the differential line 41 close to the chip body 1, so that the spacing between the ends of two adjacent groups of differential lines 41 is consistent with the spacing between the differential pads of the pins at the corresponding positions of the chip body 1, and the center lines of the two overlap;

[0074] like Figure 5 and Figure 7 As shown, a second transition region is provided at the other end of the differential line 41 , and its purpose is the same as that of the first transition region 411 , which is also to reduce the impedance drop at the connection position.

[0075] In some embodiments, the second transition region includes an electrically connected cutting region 413 and a capacitance compensation region 412, the cutting region 413 includes the remaining portion of two adjacent groups of differential lines 41 away from the side cutting angle, and the capacitance compensation region 412 is arranged on the side adjacent to the two adjacent groups of differential lines 41; so that the spacing between the two adjacent groups of second transition regions is equal to the spacing between the differential pads of the corresponding pins of the chip body 1;

[0076] like Figure 7As shown, the width of the differential line 41 is greater than the width of the differential pad of the pin of the chip body 1, and the minimum spacing between the two groups of differential lines 41 is greater than the spacing between the pins of the chip body 1. Therefore, by cutting the corners of the two adjacent groups of differential lines 41 away from one side, the ends thereof are in a right-angle trapezoidal shape, that is, the portion is the cutting area 413, and a capacitor compensation area 412 is added on the side adjacent to the two adjacent groups of differential lines 41, so that the width of the end of the second transition area is consistent with the width of the differential pad of the pin of the chip body 1, and by adding the capacitor compensation area 412, the center line spacing of the two groups of second transition areas is smaller than the center line spacing of the original two groups of differential lines 41, so that the center line of the second transition area overlaps with the center line of the pin of the chip body 1, thereby ensuring the integrity of signal transmission after the differential line 41 is wire-bonded to the differential pad of the pin of the chip body 1; as shown Fig.10 As shown, after simulation, it is concluded that the return loss is controlled within -15dB within the 65G range, and the simulation results are good;

[0077] That is, by adding the first transition zone 411 and the second transition zone, the connection positions at both ends of the differential line 41 are optimized, and by gradually changing the ends of the differential line 41, the impedance discontinuity during signal transmission is effectively reduced, thereby improving signal integrity.

[0078] In some embodiments, the pins of the chip body 1 are electrically connected to the high-frequency circuit and the low-frequency circuit by gold wire bonding;

[0079] like Figure 4 As shown, the pins of the chip body 1 are connected to the high-frequency circuit and the low-frequency circuit by gold wire bonding. Before gold wire bonding, the chip body 1 needs to be modeled in combination with the chip pad size and the port characteristics of the chip body 1 itself, and then the gold wire bonding position and bonding height are further determined through simulation to reduce the impedance drop at the bonding position, which helps to ensure the integrity of signal transmission.

[0080] In some embodiments, a cover plate 8 is provided at the upper end of the housing body 6 to cover the inner cavity;

[0081] An upper flange 61 is provided at the opening edge of the inner cavity for wrapping the side edge of the cover plate 8;

[0082] like Figure 2As shown, by adding an openable cover plate 8, the arrangement of the low-frequency power supply board 3, the high-frequency radio frequency board 4, the chip body 1 and the chip substrate 2 in the inner cavity is facilitated, and by providing an upper flange 61 at the edge of the inner cavity opening, the cover plate 8 can be installed at the opening of the inner cavity in a chimeric manner, so that the cover plate 8 and the shell body 6 can form a complete shielding body, thereby improving the shielding effect, and a notch is provided at a local position of the upper flange 61, and a boss 81 is provided at a corresponding position on the side of the cover plate 8, and the boss 81 extends to the outside of the notch, so that when the cover plate 8 and the shell body 6 are separated, there is a force application point, thereby facilitating the separation of the two;

[0083] When the cover plate 8 and the shell body 6 are assembled, conductive adhesive bonding or laser welding is preferably used to ensure electromagnetic conduction between the cover plate 8 and the shell body 6;

[0084] At the same time, a wave absorbing material layer is arranged on the back of the cover plate 8 to further enhance the electromagnetic shielding effect.

[0085] Moreover, when designing the shell body 6 and the cover plate 8, a plug hole is set at the corresponding position of the two, and a plug pin 9 is installed in the plug hole. When the present application is assembled with the oscilloscope, the shell body 6 and the cover plate 8 can be grounded through the plug pin 9, and at the same time, the back of the high-frequency radio frequency board 4 and the low-frequency power supply board 3 are in contact with the bottom surface of the inner cavity, that is, the grounding is indirectly achieved;

[0086] When the chip substrate 2, the low-frequency power supply board 3, the high-frequency radio frequency board 4 and the housing body 6 are assembled, they are all fixed by bonding with conductive adhesive.

[0087] When assembling the low-frequency connector 7 and the high-frequency connector 5, the low-frequency connector 7 is preferably a glass bead connector, which is connected to the shell body 6 by sintering. The high-frequency connector 5 is preferably a G3P0 connector, which can achieve DC-100GHz high-speed signal connection, and is also connected to the shell body 6 by sintering.

[0088] In addition to the oscilloscope sampling module packaging structure disclosed in the above embodiments, the present invention also provides an oscilloscope including the above oscilloscope sampling module packaging structure. For the structures of other parts of the oscilloscope, please refer to the prior art and will not be described in detail herein.

[0089] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0090] The above is a detailed introduction to the oscilloscope sampling module packaging structure provided by the present invention and the oscilloscope containing the same. This article uses specific examples to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, the present invention can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the present invention.

Claims

1. An oscilloscope sampling module packaging structure, characterized in that: include: Chip body (1); A circuit board substrate, used for carrying the chip body (1), wherein a high-frequency circuit and a low-frequency circuit are arranged independently of each other, wherein the high-frequency circuit and the low-frequency circuit are both electrically connected to corresponding pins of the chip body (1); differential transmission is adopted in the high-frequency circuit, and the spacing between two adjacent groups of differential lines (41) in the high-frequency circuit near one end of the chip body (1) is smaller than the spacing at the other end; A housing body (6), wherein an inner cavity for accommodating the circuit board substrate and the chip body (1) is provided inside the housing; A chip substrate (2) arranged between the bottom surface of the chip body (1) and the bottom surface of the inner cavity, so that the chip body (1) can exchange heat with the housing body (6); A high-frequency connector (5), which penetrates the side wall of the housing body (6) and is electrically connected to the high-frequency circuit; A low-frequency connector (7) penetrates the side wall of the housing body (6) and is electrically connected to the low-frequency circuit.

2. The oscilloscope sampling module packaging structure according to claim 1, characterized in that: The housing body (6) is made of metal, and / or The chip substrate (2) is made of an insulating heat-conducting material.

3. The oscilloscope sampling module packaging structure according to claim 1, characterized in that: The circuit board substrate comprises a low-frequency power supply board (3) and a high-frequency radio frequency board (4); the low-frequency circuit is arranged in the low-frequency power supply board (3); the high-frequency circuit is arranged in the high-frequency radio frequency board (4); and the high-frequency radio frequency board (4) is a soft substrate.

4. The oscilloscope sampling module packaging structure according to claim 3, characterized in that: The bottom of the low-frequency power supply board (3) is grounded to the bottom surface of the inner cavity, and a placement groove is provided in the low-frequency power supply board (3) for accommodating the chip substrate (2).

5. The oscilloscope sampling module packaging structure according to claim 2, characterized in that: A receiving groove is provided in the shell body (6) for separately receiving the high-frequency radio frequency board (4), and the bottom surface of the high-frequency radio frequency board (4) is grounded to the bottom surface of the receiving groove.

6. The oscilloscope sampling module packaging structure according to claim 1, characterized in that: A first transition zone (411) is provided at one end of the differential line (41) close to the high-frequency connector (5), so that the width of the end of the differential line (41) is consistent with the width of the core of the high-frequency connector (5), and the center lines of the two overlap.

7. The oscilloscope sampling module packaging structure according to claim 1, characterized in that: A second transition zone is provided at one end of the differential line (41) close to the chip body (1), so that the spacing between the ends of two adjacent groups of the differential lines (41) is consistent with the spacing between the differential pads of the pins at corresponding positions of the chip body (1), and the center lines of the two overlap.

8. The oscilloscope sampling module packaging structure according to claim 7, characterized in that: The second transition zone comprises an electrically connected cutting zone (413) and a capacitance compensation zone (412), the cutting zone (413) comprising the remaining portion of two adjacent groups of differential lines (41) away from the side cutting angle, and the capacitance compensation zone (412) is arranged on a side adjacent to the two adjacent groups of differential lines (41); so that the spacing between the two adjacent groups of the second transition zones is equal to the spacing between the corresponding pins of the chip body (1).

9. The oscilloscope sampling module packaging structure according to any one of claims 1 to 8, characterized in that: A cover plate (8) is provided at the upper end of the shell body (6) for covering the inner cavity; An upper flange (61) is provided at the opening edge of the inner cavity, which is used to wrap around the side edge of the cover plate (8).

10. An oscilloscope, characterized in that: It comprises an oscilloscope sampling module packaging structure according to any one of claims 1-9.

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