Coupling circuit, circuit board and electronic equipment

Abstract

The invention relates to a coupling circuit, a circuit board and electronic equipment, the coupling circuit comprises a signal line group, the signal line group comprises a plurality of signal lines, the plurality of signal lines are used for connecting an interface of a first electric device and an interface of a second electric device in the electronic equipment, and the plurality of signal lines are used for transmitting differential signals from the first electric device to the second electric device; and the at least one radio frequency coupling circuit is coupled with the signal line, and the radio frequency coupling circuit is used for receiving the first radio frequency signal so as to generate an interference signal in the coupled signal line. Since the radio frequency coupling circuit superposes the interference signal to the differential signal in a coupling manner, the impedance of the signal line is less affected by the interference signal, thereby improving the accuracy of the immunity test. Meanwhile, the radio frequency of the first radio frequency signal can be set as required, so that the immunity of the interface under different radio frequencies can be tested, and the accuracy of the immunity test is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of anti-interference testing, and in particular to a coupling circuit, a circuit board and an electronic device. Background Art

[0002] At present, in the process of producing electronic equipment, it is necessary to test the anti-interference performance of the interface that receives high-speed digital signals inside the electronic equipment to avoid failures caused by interference from radio frequency signals during use. However, in the process of testing the anti-interference performance of the interface, there is a problem of inaccurate testing. Summary of the invention

[0003] In order to overcome the problems existing in the related art, the present disclosure provides a coupling circuit, a circuit board and an electronic device.

[0004] According to a first aspect of the present disclosure, a coupling circuit is provided, the coupling circuit comprising:

[0005] A signal line group, the signal line group comprising a plurality of signal lines, the plurality of signal lines being used to connect an interface of a first electrical device and an interface of a second electrical device in an electronic device, the plurality of signal lines being used to transmit a differential signal from the first electrical device to the second electrical device;

[0006] At least one radio frequency coupling circuit is coupled to the signal line, and the radio frequency coupling circuit is used to receive a first radio frequency signal to generate an interference signal in the coupled signal line.

[0007] In some embodiments of the present disclosure, the radio frequency coupling circuit includes a coupling trace for coupling with the signal line, and the coupling trace has a consistent effect on the multiple coupled signal lines.

[0008] In some embodiments of the present disclosure, each of the signal lines is located in a first plane, and a coupling line of the radio frequency coupling circuit is parallel to the first plane.

[0009] In some embodiments of the present disclosure, in the same signal line group, the projection of the coupled routing line on the first plane and the coupled signal line have overlapping areas, and the areas of the overlapping areas of the signal lines are the same.

[0010] In some embodiments of the present disclosure, the signal line group corresponds to a plurality of the RF coupling circuits, the plurality of the RF coupling circuits are respectively coupled to different signal lines in the signal line group, and the coupling line of each of the RF coupling circuits is parallel to the corresponding signal line.

[0011] In some embodiments of the present disclosure, the length and width of each of the signal lines in the overlapping area are equal.

[0012] In some embodiments of the present disclosure, a projection of a central axis of the coupling trace on the first plane coincides with a central axis of the corresponding signal line.

[0013] In some embodiments of the present disclosure, the width of the coupling trace is less than or equal to the width of the corresponding signal line, and the length of the coupling trace is less than the length of the corresponding signal line, and the projection of the coupling trace on the first plane is located on the signal line.

[0014] In some embodiments of the present disclosure, the coupling traces have the same length and / or the same width.

[0015] In some embodiments of the present disclosure, the signal line group corresponds to one RF coupling circuit, and a projection of a coupling line of the RF coupling circuit on the first plane is perpendicular to the multiple signal lines coupled in the signal line group.

[0016] According to a second aspect of the present disclosure, a circuit board is provided, in which the coupling circuit as described above is arranged.

[0017] In some embodiments of the present disclosure, each of the signal lines and the radio frequency coupling circuit is arranged on different layers of the same circuit board.

[0018] In some embodiments of the present disclosure, the circuit board includes a first conductive layer, a second conductive layer, and a third conductive layer that are stacked, wherein:

[0019] The first conductive layer includes each of the signal lines;

[0020] The second conductive layer comprises coupling traces corresponding to the respective signal lines, and a projection of the coupling traces on the first conductive layer at least partially overlaps with the corresponding signal line;

[0021] The third conductive layer includes a first pad corresponding to each of the coupling traces and a second pad corresponding to each of the coupling traces, and the first pad and the second pad are used to connect the radio frequency coupling circuit.

[0022] In some embodiments of the present disclosure, the second conductive layer further includes a connection line group corresponding to each of the coupling traces, each of the connection line groups includes a first connection line and a second connection line, one end of the first connection line is connected to one end of the corresponding coupling trace, the other end of the first connection line is connected to the first pad through a first conductive column, one end of the second connection line is connected to the other end of the corresponding coupling trace, and the other end of the second connection line is connected to the second pad through a second conductive column;

[0023] Wherein, each of the first connection lines located on the same side of each of the coupling lines extends from the corresponding coupling line in different directions, and each of the second connection lines located on the same side of each of the coupling lines extends from the corresponding coupling line in different directions.

[0024] In some embodiments of the present disclosure, the first conductive layer further includes a first ground layer isolated from each of the signal lines; the second conductive layer further includes a second ground layer isolated from each of the coupling traces; the third conductive layer further includes a third ground layer isolated from each of the first pads and the second pads;

[0025] The circuit board also includes:

[0026] a fourth conductive layer, the fourth conductive layer being located on a side of the first conductive layer away from the second conductive layer, an area on the fourth conductive layer corresponding to the positions of the plurality of signal lines being a hollow area, and an area of ​​the fourth conductive layer other than the hollow area constituting a fourth ground layer;

[0027] The fourth ground layer is connected to the first ground layer through a third conductive column, the first ground layer is connected to the second ground layer through a fourth conductive column, and the second ground layer is connected to the third ground layer through a fifth conductive column.

[0028] In some embodiments of the present disclosure, the hollow area is provided with a grid structure, and the grid structure is connected to the fourth ground layer.

[0029] In some embodiments of the present disclosure, the circuit board includes a fifth conductive layer and a sixth conductive layer stacked together, wherein:

[0030] The fifth conductive layer includes each of the signal lines;

[0031] The sixth conductive layer includes coupling traces, and projections of the coupling traces on the fifth conductive layer are perpendicular to the signal lines.

[0032] In some embodiments of the present disclosure, the sixth conductive layer also includes a third pad connected to one end of the coupling trace and a fourth pad connected to the other end of the coupling trace, and the third pad and the fourth pad are used to connect to the RF coupling circuit.

[0033] In some embodiments of the present disclosure, the fifth conductive layer further includes a fifth ground layer isolated from each of the signal lines;

[0034] The sixth conductive layer further includes a sixth ground layer which is isolated from the coupling trace, the third pad and the fourth pad;

[0035] The circuit board further includes a seventh conductive layer, and the seventh conductive layer is located on a side of the fifth conductive layer away from the sixth conductive layer;

[0036] The fifth grounding layer is connected to the sixth grounding layer through a sixth conductive column, and the seventh conductive layer is connected to the fifth grounding layer through a seventh conductive column.

[0037] In some embodiments of the present disclosure, the circuit board further includes a first interface and a second interface, one end of each of the signal lines is connected to the first interface, and the other end of each of the signal lines is connected to the second interface.

[0038] According to a third aspect of the present disclosure, an electronic device is provided, comprising the circuit board as described above.

[0039] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0040] In the process of testing the anti-interference of the interface, a coupling circuit is used for testing, and the coupling circuit includes multiple signal lines and at least one radio frequency coupling circuit. Multiple signal lines are connected between the interface of the first electrical device and the interface of the second electrical device, and are used to transmit differential signals from the first electrical device to the second electrical device. The radio frequency coupling circuit can be coupled with each signal line, and is used to generate an interference signal in the coupled signal line after receiving the first radio frequency signal, and to test the anti-interference of the interface of the second electrical device with the injected first radio frequency signal. Since the radio frequency coupling circuit superimposes the interference signal on the differential signal in a coupled manner, the impedance of the signal line is less affected by the interference signal, thereby improving the accuracy of the anti-interference test. At the same time, since the radio frequency frequency of the first radio frequency signal received by the radio frequency coupling circuit can be set as needed, the anti-interference of the interface at different radio frequency frequencies can be tested, thereby further improving the accuracy of the anti-interference test.

[0041] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0043] Figure 1 is a structural schematic diagram of a coupling circuit provided by an exemplary embodiment of the present disclosure;

[0044] Figure 2 is a structural schematic diagram of a radio frequency coupling circuit provided by an exemplary embodiment of the present disclosure;

[0045] Figure 3-1is a schematic structural diagram of a circuit board provided by an exemplary embodiment of the present disclosure;

[0046] Figure 3-2 is a schematic structural diagram of a circuit board provided by another exemplary embodiment of the present disclosure;

[0047] Figure 3-3 is a schematic structural diagram of a circuit board provided by another exemplary embodiment of the present disclosure;

[0048] Figure 3-4 is a schematic structural diagram of a circuit board provided by another exemplary embodiment of the present disclosure;

[0049] Figure 4-1 is a schematic diagram of an application scenario of a coupling circuit provided by an exemplary embodiment of the present disclosure;

[0050] Figure 4-2 is a schematic diagram of an application scenario of a coupling circuit provided by another exemplary embodiment of the present disclosure;

[0051] Figure 5-1 is a graph showing impedance variation over test time provided by an exemplary embodiment of the present disclosure;

[0052] Figure 5-2 is a graph showing the coupling degree changing with the radio frequency provided by an exemplary embodiment of the present disclosure;

[0053] Figure 5-3 is a graph showing a coupling phase varying with radio frequency provided by an exemplary embodiment of the present disclosure;

[0054] Figure 6-1 is a schematic structural diagram of a circuit board provided by another exemplary embodiment of the present disclosure;

[0055] Figure 6-2 is a schematic structural diagram of a circuit board provided by another exemplary embodiment of the present disclosure;

[0056] Figure 6-3 is a schematic structural diagram of a circuit board provided by another exemplary embodiment of the present disclosure;

[0057] Figure 6-4 is a schematic structural diagram of a circuit board provided by another exemplary embodiment of the present disclosure;

[0058] Figure 7-1 is a graph showing a change in coupling degree with radio frequency provided by another exemplary embodiment of the present disclosure;

[0059] Figure 7-2 is a graph showing a coupling phase varying with radio frequency provided by another exemplary embodiment of the present disclosure;

[0060] Figure 8is a flow chart of a testing method provided by an exemplary embodiment of the present disclosure;

[0061] Fig. 9 is a system block diagram of an electronic device provided by an exemplary embodiment of the present disclosure.

[0062] In the figure:

[0063] 10-signal line group; 11-signal line; 20-RF coupling circuit; 21-RF test module; 22-coupling trace; 30-first electrical device; 40-second electrical device; 50-first soldering pad; 51-second soldering pad; 52-first connecting line; 53-second connecting line; 54-first ground layer; 55-second ground layer; 56-third ground layer; 57-fourth ground layer; 58-third soldering pad; 59-fourth soldering pad; 60-fifth ground layer; 61-sixth ground layer; 62-seventh ground layer; 70-RF signal source; 80-two-way power divider; 90-three-way power divider; R-load resistor; GND-ground terminal; 400-electronic device; 402-processing component; 404-memory; 406-power supply component; 408-multimedia component; 410-audio component; 412-input and output interface; 414-sensor component; 416-communication component; 420-processor. DETAILED DESCRIPTION

[0064] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Instead, they are merely examples of devices and methods consistent with some aspects of the present invention as detailed in the appended claims. It should also be understood that the term "and / or" as used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0065] At present, with the development of electronic equipment technology, the radio frequency of the radio frequency signal emitted by the communication component in the electronic equipment is gradually increasing, and the rate of signal transmission between different electrical components in the electronic equipment is gradually increasing. The electrical components in the electronic equipment are provided with a mobile industry processor interface (MIPI), and the mobile industry processor interfaces are connected through a flexible printed circuit (FPC), and multiple signal line groups of the flexible circuit board are used to transmit high-speed digital signals. The transmission rate of high-speed digital signals can be 1GHz to 6GHz. During the use of the electronic equipment, the communication component will emit radio frequency signals, which will interfere with the high-speed digital signals transmitted by the signal line group. The interface as the receiving end in the electrical device cannot receive the correct high-speed digital signal, causing the electronic device to malfunction. For example, the camera module of the electronic device is stuck, the screen is distorted, etc. At the same time, in order to improve the reliability of high-speed digital signal transmission, each signal line group includes multiple signal lines, and multiple signal lines are used to transmit high-speed differential signals. When the communication component transmits the radio frequency signal, interference signals will be generated in multiple signal lines, which will interfere with the high-speed differential signal. Therefore, in the process of producing electronic equipment, it is necessary to test the anti-interference of the interface that receives high-speed digital signals inside it to avoid malfunction of the electronic equipment due to interference generated by radio frequency signals during use.

[0066] In the related art, a Bulk Current Injection (BCI) method is disclosed to test the interference immunity of the interface, which requires adding an injection clamp to the original circuit in the electronic device. Although this method can test the interference immunity of the interface, it is only applicable to the test under the interference of RF signals with a RF frequency of 150kHz to 1GHz, and cannot be applied to the test under the interference of RF signals with a RF frequency greater than 1GHz. The RF frequency of the RF signal emitted by the communication component in the electronic device is often greater than 1GHz. When the large current injection method is used to test the interference immunity of the interface in the electronic device, there is a problem of inaccurate testing.

[0067] Based on this, the present disclosure provides a coupling circuit, which receives a first RF signal for testing through an RF coupling circuit in the coupling circuit, and generates an interference signal in each coupled signal line. Since the interference signal is superimposed on each signal line in a coupled manner, the impedance of the signal line is less affected by the interference signal, thereby improving the accuracy of the anti-interference test. At the same time, since the RF frequency of the first RF signal can be set according to the test needs, the RF frequency of the first RF signal that causes the interference signal can be greater than 1GHz, thereby further improving the accuracy of the anti-interference test. In addition, since there is no connection relationship between the RF coupling circuit and the signal line, the original circuit structure in the electronic device will not be destroyed when the coupling circuit is connected, thereby reducing the complexity of the anti-interference test.

[0068] An exemplary embodiment of the present disclosure provides a coupling circuit, such as Figure 1 As shown, the coupling circuit includes a signal line group 10 and at least one radio frequency coupling circuit 20. The signal line group 10 includes a plurality of signal lines 11, and the plurality of signal lines 11 are used to connect the interface of the first electrical device 30 and the interface of the second electrical device 40 in the electronic device, and the plurality of signal lines 11 are used to transmit the differential signal from the first electrical device 30 to the second electrical device 40. The radio frequency coupling circuit 20 is coupled with the signal line 11, and is used to receive the first radio frequency signal to generate an interference signal in the coupled signal line 11.

[0069] In this embodiment, in the process of testing the anti-interference of the interface, a coupling circuit is used for testing, and the coupling circuit includes multiple signal lines and at least one radio frequency coupling circuit. Multiple signal lines are connected between the interface of the first electrical device and the interface of the second electrical device, and are used to transmit differential signals from the first electrical device to the second electrical device. The radio frequency coupling circuit can be coupled with each signal line, and is used to generate an interference signal in the coupled signal line after receiving the first radio frequency signal, and to test the anti-interference of the interface of the second electrical device with the injected first radio frequency signal. Since the radio frequency coupling circuit superimposes the interference signal on the differential signal in a coupled manner, the impedance of the signal line is less affected by the interference signal, thereby improving the accuracy of the anti-interference test. At the same time, since the radio frequency frequency of the first radio frequency signal received by the radio frequency coupling circuit can be set as needed, the anti-interference of the interface at different radio frequency frequencies can be tested, thereby further improving the accuracy of the anti-interference test.

[0070] Exemplarily, the signal line group 10 may be a signal line group that receives interference signals. The signal line group 10 may be, for example, a clock signal line group, a data signal line group, and the like. Each signal line group 10 generally includes two to three signal lines 11, and high-speed differential signals are transmitted through multiple test signal lines 11 to improve the reliability of signal transmission. When there are two signal lines 11 in the signal line group 10, the differential signal is a two-wire differential signal. When there are three signal lines 11 in the signal line group 10, the differential signal is a three-wire differential signal. The signal line group 10 may be the same as the signal line group of the electronic device during actual use. Among them, the signal line group 10 may be one or more. When there is one signal line group 10, the complexity of the anti-interference test can be reduced. When there are multiple signal line groups 10, the reliability of the anti-interference test can be improved.

[0071] Exemplarily, in addition to the signal line group 10 and the RF coupling circuit 20, the coupling circuit may also include a reference signal line group. The reference signal line group is used to connect the interface of the first electrical device 30 and the interface of the second electrical device 40 in the electronic device, and is used to transmit the differential signal from the first electrical device 30 to the second electrical device 40. The reference signal line group may be, for example, a clock signal line group, a data signal line group, etc., and the reference signal line group is different from the signal line group 10. The RF coupling circuit 20 cannot be coupled with the reference signal line group. The reference signal line group may be the same as the signal line group of the electronic device during actual use. Since the coupling circuit includes the signal line group 10 and the reference signal line group, the first electrical device 30 can normally transmit a high-speed differential signal to the second electrical device 40 and only the differential signal transmitted by the signal line group 10 is superimposed with an interference signal to test the anti-interference performance of the interface.

[0072] Exemplarily, one RF coupling circuit 20 may correspond to all signal lines 11 , or may correspond to the signal lines 11 one by one.

[0073] Exemplarily, the first electrical device 30 is an electrical device that needs to send high-speed differential signals, and the second electrical device 40 is an electrical device that needs to receive high-speed differential signals. For example, when the first electrical device 30 is a camera module, the second electrical device 40 can be a mainboard. When the first electrical device 30 is a mainboard, the second electrical device 40 can be a screen. The first electrical device 30 and the second electrical device 40 are not limited here.

[0074] For example, the interference signal includes a voltage signal, a current signal, etc. The interference signal may include a differential mode interference signal, a common mode interference signal, etc.

[0075] In one embodiment, if Figure 2As shown, the RF coupling circuit 20 includes an RF test module 21 and a load resistor R. The RF test module 21 is used to receive a first RF signal. The first end of the load resistor R is connected to the signal terminal SIG of the RF test module 21 through a coupling trace 22, and the second end is connected to the ground terminal GND. The coupling trace 22 is used to couple the RF interference signal converted from the first RF signal to the corresponding signal line 11.

[0076] In this embodiment, since the RF test module can convert the first RF signal into corresponding electrical energy and output it from the signal end, a stable RF interference signal can be formed on the coupling line by connecting the load resistor, so as to couple the RF interference signal to the corresponding signal line to generate an interference signal. Since the load resistor can stabilize the RF interference signal of the coupling line, the degree of change of the interference signal is small, thereby improving the reliability of the anti-interference test.

[0077] Exemplarily, the first ground terminal GND1, the second ground terminal GND2 and the third ground terminal GND3 of the RF test module 21 are connected to the ground terminal GND. The RF test module 21 may be a module such as a RF test socket for receiving RF signals and converting them into electrical energy.

[0078] Exemplarily, the value range of the load resistance R may be 40Ω to 60Ω. The value of the load resistance R may be 49Ω, 50Ω, 51Ω, etc.

[0079] Exemplarily, after the radio frequency interference signal is coupled to the corresponding signal line 11 , an interference signal is generated on the corresponding signal line 11 .

[0080] Exemplarily, the radio frequency interference signal includes a voltage signal, a current signal, etc.

[0081] In one embodiment, the RF coupling circuit 20 includes a coupling trace 22 for coupling with the signal line 11 , and the coupling trace 22 has a consistent effect on the coupled multiple signal lines 11 .

[0082] In this embodiment, since the coupling trace has the same influence on the coupled multiple signal lines, a common-mode interference signal can be generated in the multiple signal lines to test the immunity of the interface to the common-mode interference signal, thereby improving the reliability of the interface test.

[0083] In one embodiment, each signal line 11 is located on a first plane, and the coupling trace 22 of the RF coupling circuit 20 is parallel to the first plane.

[0084] In this embodiment, since the coupling trace of the RF coupling circuit is located in a different plane from the signal line and is parallel to the plane where the signal line is located, the coupling trace can couple the RF interference signal to the signal line to generate an interference signal in the signal line, thereby improving the accuracy of the anti-interference test. In addition, since the coupling trace and the signal line are located in different planes, it avoids occupying the space of the first plane and interfering with the reference signal line group, thereby improving the reliability of the anti-interference test.

[0085] Exemplarily, the coupling trace 22 may be located on the second plane.

[0086] In one embodiment, in the same signal line group 10 , the projection of the coupling trace 22 on the first plane and the coupled signal line 11 both have overlapping areas, and the overlapping areas of the signal lines 11 are the same.

[0087] In this embodiment, since the overlapping areas of each signal line are the same, the interference signal coupled to the signal line by the RF coupling circuit can be a common-mode interference signal, so as to test the immunity of the interface to the common-mode interference signal and thus improve the reliability of the interface immunity test.

[0088] In one embodiment, the signal line group 10 corresponds to a plurality of RF coupling circuits 20 , which are respectively coupled to different signal lines 11 in the signal line group 10 , and a coupling trace 22 of each RF coupling circuit 20 is parallel to the corresponding signal line 11 .

[0089] In this embodiment, since the coupling line is parallel to the coupled signal line, the interference signal is prevented from being introduced into other signal lines to affect the interface's immunity test to common-mode interference signals, thereby improving the reliability of the interface immunity test.

[0090] In one embodiment, the length and width of each signal line 11 in the overlapped area are equal.

[0091] In this embodiment, since the length and width of each signal line in the overlap region are equal, the area of ​​each signal line in the overlap region is the same so that the interference signals introduced by each signal line are consistent, thereby improving the reliability of the interface immunity test.

[0092] In one embodiment, the projection of the central axis of the coupling trace 22 on the first plane coincides with the central axis of the corresponding signal line 11 .

[0093] In this embodiment, since the projection of the central axis of the coupling trace on the first plane coincides with the central axis of the corresponding signal line, the interference signal can be introduced into each signal line in a symmetrical manner to form a common-mode interference signal, thereby improving the accuracy of the interface immunity test.

[0094] Exemplarily, the central axis of the signal line 11 refers to the axis passing through the center of mass of the signal line 11 , and the central axis of the coupling trace 22 refers to the axis passing through the center of mass of the coupling trace 22 .

[0095] In one embodiment, the width of the coupling trace 22 is less than or equal to the width of the corresponding signal line 11 , and the length of the coupling trace 22 is less than the length of the corresponding signal line 11 , and the projection of the coupling trace 22 on the first plane is located on the signal line 11 .

[0096] In this embodiment, since the width of the coupling trace is less than or equal to the width of the corresponding signal line and the length is less than the length of the corresponding signal line, the signal line is prevented from being lengthened due to the RF coupling circuit and affecting the line impedance, thereby improving the reliability of the interface immunity test.

[0097] In one embodiment, the coupling traces 22 have the same length and / or the same width.

[0098] In this embodiment, since the coupling traces have the same length and / or width, it is convenient to design the RF coupling circuit and the coupling traces have the same effect on the coupled signal lines, thereby improving the reliability of the interface immunity test.

[0099] In one embodiment, the signal line group 10 corresponds to one RF coupling circuit 20 , and the projection of the coupling trace 22 of the RF coupling circuit 20 on the first plane is perpendicular to the multiple signal lines 11 coupled in the signal line group 10 .

[0100] In this embodiment, since all coupled signal lines correspond to one RF coupling circuit and the signal line is perpendicular to the coupling line, the RF interference signal of one coupling line can be coupled to each signal line to form an interference signal on each signal line, thereby improving the reliability of the anti-interference test and reducing the complexity of the coupling circuit.

[0101] An exemplary embodiment of the present disclosure provides a circuit board, in which the coupling circuit as described above is disposed.

[0102] In this embodiment, by arranging the coupling circuit on the circuit board, it is convenient to connect the coupling circuit with the first electrical device and the second electrical device, thereby reducing the complexity of the anti-interference test.

[0103] In one embodiment, each signal line 11 and the RF coupling circuit 20 are disposed on different layers of the same circuit board.

[0104] In this embodiment, since the signal line and the radio frequency coupling circuit are arranged on different layers of the same circuit board, the circuit board only needs to be connected once during the test to connect the signal line with the first electrical device and the second electrical device and to make the radio frequency coupling circuit generate interference signals on the signal line, thereby reducing the complexity of the anti-interference test. At the same time, since the signal line and the radio frequency coupling circuit are located on the same circuit board, it is avoided that the circuit board where the radio frequency coupling circuit is located is connected to the first electrical device and the second electrical device separately to introduce additional interference signals on the signal line, thereby improving the accuracy of the anti-interference test.

[0105] It is understandable that the signal line 11 and the RF coupling circuit 20 can also be located on different circuit boards. The two circuit boards can be connected to form a circuit board. The RF interference signal of the coupling trace 22 can be coupled to the signal line 11 to generate an interference signal in the signal line 11, which is not limited here.

[0106] In one embodiment, if Figure 3-1 to Figure 3-3 As shown, the circuit board includes a first conductive layer, a second conductive layer and a third conductive layer which are stacked. The first conductive layer includes each signal line 11. The second conductive layer includes a coupling trace 22 corresponding to each signal line 11, and the projection of the coupling trace 22 on the first conductive layer at least partially overlaps with the corresponding signal line 11. The third conductive layer includes a first pad 50 corresponding to each coupling trace 22 and a second pad 51 corresponding to each coupling trace 22, and the first pad 50 and the second pad 51 are used to connect the radio frequency coupling circuit 20.

[0107] In this embodiment, since the signal line corresponds to the coupling trace one by one and is located in different layers, the interference signal can be introduced into the signal line through board-level conduction, reducing the influence of the interference signal on the impedance of the signal line to improve the accuracy of the anti-interference test. The RF coupling circuit can be set on the third conductive layer through the first pad and the second pad, and connected through the coupling trace to form a RF interference signal on the coupling trace, thereby reducing the complexity of the circuit board structure.

[0108] Exemplarily, the first pad 50 is used to be connected to the signal terminal SIG of the RF test module 21 , and the second pad 51 is used to be connected to the first end of the load resistor R.

[0109] In one embodiment, the second conductive layer further includes a connection line group corresponding to each coupling trace 22, and each connection line group includes a first connection line 52 and a second connection line 53. One end of the first connection line 52 is connected to one end of the corresponding coupling trace 22, and the other end is connected to the first pad 50 through a first conductive column. One end of the second connection line 53 is connected to the other end of the corresponding coupling trace 22, and the other end is connected to the second pad 51 through a second conductive column. Among them, each first connection line 52 located on the same side of each coupling trace 22 extends from the corresponding coupling trace 22 to different directions, and each second connection line 53 located on the same side of each coupling trace 22 extends from the corresponding coupling trace 22 to different directions.

[0110] In this embodiment, the coupling traces of different layers can be connected to the RF test module and the load resistor through the first connecting line and the second connecting line. Since the first connecting line and the second connecting line extend in different directions, a certain gap can be set between multiple RF test modules and multiple load resistors to avoid crowding between devices, thereby reducing the complexity of circuit board design.

[0111] In one embodiment, the first conductive layer further includes a first grounding layer 54 isolated from each signal line 11. The second conductive layer further includes a second grounding layer 55 isolated from each coupling trace 22. The third conductive layer further includes a third grounding layer 56 isolated from each first pad 50 and second pad 51. Figure 3-4 As shown, the circuit board also includes a fourth conductive layer. The fourth conductive layer is located on the side of the first conductive layer away from the second conductive layer. The area on the fourth conductive layer corresponding to the position of the plurality of signal lines 11 is a hollow area, and the area of ​​the fourth conductive layer other than the hollow area constitutes a fourth grounding layer 57. The fourth grounding layer 57 is connected to the first grounding layer 54 through the third conductive column, the first grounding layer 54 is connected to the second grounding layer 55 through the fourth conductive column, and the second grounding layer 55 is connected to the third grounding layer 56 through the fifth conductive column.

[0112] In this embodiment, since the area on the fourth conductive layer corresponding to the positions of the plurality of signal lines is a hollow area, the width of the signal line can be set to be thicker to facilitate controlling the impedance of the signal line, thereby improving the reliability of the immunity test. By connecting the first ground layer, the second ground layer, the third ground layer and the fourth ground layer, the signals in the signal line and the coupling trace can be refluxed, thereby further improving the reliability of the immunity test.

[0113] Exemplarily, the third ground layer 56 forms a ground terminal GND to which the RF test module 21 and the load resistor R of the RF coupling circuit 20 are connected.

[0114] In one embodiment, a grid structure is provided in the hollow area, and the grid structure is connected to the fourth ground layer 57 .

[0115] In this embodiment, since the hollow area is provided with a grid structure, it is convenient to control the impedance of the signal line, thereby improving the reliability of the anti-interference test.

[0116] Exemplarily, an isolation layer is provided between the fourth conductive layer and the first conductive layer, an isolation layer is provided between the first conductive layer and the second conductive layer, and an isolation layer is provided between the second conductive layer and the third conductive layer.

[0117] For example, Figure 4-1 and Figure 4-2 As shown, in the process of testing the immunity of the interface to common-mode interference signals, the RF signal source 70 is required to transmit a second RF signal, and after the second RF signal passes through a multi-way power divider, the second RF signal is divided into multiple first RF signals and transmitted to each RF coupling circuit 20. For example, when the number of RF coupling circuits 20 is two, the multi-way power divider is a two-way power divider 80. When the number of RF coupling circuits 20 is three, the multi-way power divider is a three-way power divider 90. After the RF signal source 70 transmits the second RF signal, it is necessary to determine the impedance change of the signal line 11 in the entire routing, the coupling degree between the RF test module 21 and the corresponding signal line 11, and the coupling phase of the interference signal coupled from the RF test module 21 to the signal line 11. In the process of testing the immunity of the interface to differential-mode interference signals, the multi-way power divider may not be used, and the second RF signal may be directly transmitted to one RF coupling circuit 20.

[0118] For example, Figure 5-1 As shown, the impedance change of the signal line 11 in the entire routing is observed by the time domain reflectometry method (Time Domain Reflectometry, TDR). Among them, curve S1 is the impedance curve of a signal line 11, and the signal line group 10 including the signal line 11 is the clock signal line group. The other curves are the impedance curves of the reference signal line in the reference signal line group, and the reference signal line group is the data signal line group. 0s~500ps is the effective test time. Within the effective test time, the impedance of the signal line 11 can be maintained at 90±5Ω, meeting the impedance control requirements. Among them, t is the test time, and Z is the impedance. As shown Figure 5-2As shown, curve S2 and curve S3 are the coupling curves between the RF test module 21 and the corresponding signal line 11. Because within the effective RF frequency of the RF signal emitted by the communication component of the electronic device, the coupling degree between the RF test module 21 and the corresponding signal line 11 is generally 10dB to 23dB, and the coupling degree will change at different RF frequencies. By adjusting the length of the coupling trace 22 and the distance between the coupling trace 22 and the corresponding signal line 11, the coupling degree can be changed so that the coupling degree is within the expected range. It can be seen that within the RF frequency range of 0.2GHz to 8GHz, the coupling degree is between 10dB and 23dB. Moreover, the coupling degree between the two RF test modules 21 and the corresponding two signal lines 11 is very small. Wherein, f is the RF frequency, L is the RF frequency, and L is the RF frequency. cou- is the opposite of the coupling degree. Figure 5-3 As shown, curve S4 and curve S5 are coupling phase curves of interference signals of the RF test module 21 coupled to the corresponding signal line 11. It can be seen that the coupling phase difference of the two interference signals is less than 5°. Wherein, f is the RF frequency, and pha is the coupling phase. Therefore, when the projection of the coupling trace 22 partially overlaps with the signal line 11, the RF coupling circuit 20 can introduce interference signals of approximately the same amplitude and phase into the corresponding signal line 11, and generate interference signals on each signal line 11 to improve the accuracy of the anti-interference test.

[0119] In one embodiment, if Figure 6-1 to Figure 6-4 As shown, the circuit board includes a fifth conductive layer and a sixth conductive layer stacked together, wherein the fifth conductive layer includes signal lines 11 , and the sixth conductive layer includes coupling traces 22 , and the projections of the coupling traces 22 on the fifth conductive layer are perpendicular to the signal lines 11 .

[0120] In this embodiment, since the projection of the coupling line is perpendicular to each signal line, only one coupling line is needed to couple each signal line to form an interference signal, thereby reducing the complexity of the circuit board structure.

[0121] In one embodiment, the sixth conductive layer further includes a third pad 58 connected to one end of the coupling trace 22 and a fourth pad 59 connected to the other end of the coupling trace 22 . The third pad 58 and the fourth pad 59 are used to connect to the RF coupling circuit 20 .

[0122] In this embodiment, since the third pad, the fourth pad and the coupling trace are all located in the sixth conductive layer, the number of layers of the circuit board is reduced to reduce the thickness of the circuit board, thereby reducing the complexity of the circuit board structure.

[0123] Exemplarily, the third pad 58 is used to be connected to the signal terminal SIG of the RF test module 21 , and the fourth pad 59 is used to be connected to the first end of the load resistor R.

[0124] In one embodiment, the fifth conductive layer further includes a fifth grounding layer 60 isolated from each signal line 11. The sixth conductive layer further includes a sixth grounding layer 61 isolated from the coupling trace 22, the third pad 58 and the fourth pad 59. The circuit board further includes a seventh conductive layer, which is located on the side of the fifth conductive layer away from the sixth conductive layer. The fifth grounding layer 60 is connected to the sixth grounding layer 61 through a sixth conductive column, and the seventh conductive layer is connected to the fifth grounding layer 60 through a seventh conductive column. The seventh conductive layer serves as a seventh grounding layer 62.

[0125] In this embodiment, by connecting the fifth ground layer, the sixth ground layer and the seventh conductive layer, the signals in the signal lines and the coupling traces can be refluxed, thereby improving the reliability of the anti-interference test.

[0126] Exemplarily, an isolation layer is disposed between the fifth conductive layer and the sixth conductive layer, and an isolation layer is disposed between the sixth conductive layer and the seventh conductive layer.

[0127] Exemplarily, in the process of testing the anti-interference performance of the interface, the RF signal source 70 is required to transmit a second RF signal. Since the number of RF coupling circuits 20 is one, there is no need to add a multi-way power divider, and the RF signal source 70 transmits the second RF signal to the RF coupling circuit 20. At this time, without considering the loss value between the RF signal source 70 and the RF coupling circuit 20, the first RF signal received by the RF coupling circuit 20 is the second RF signal. After the RF signal source 70 transmits the second RF signal, it is necessary to determine the impedance change of the signal line 11 in the entire routing, the coupling degree between the RF test module 21 and the corresponding signal line 11, and the coupling phase of the interference signal coupled from the RF test module 21 to the signal line 11.

[0128] For example, when the projection of the coupling line 22 partially overlaps or is perpendicular to the signal line 11, the impedance change of the signal line 11 in the entire line is not much different, which will not be described in detail here. Figure 7-1 As shown, curve S6, curve S7 and curve S8 are the coupling curves between the RF test module 21 and the corresponding signal lines 11. It can be seen that the coupling difference between the RF test module 21 and the corresponding three signal lines 11 is less than 1 dB. Where f is the RF frequency, L cou- is the opposite of the coupling degree. Figure 7-2As shown, curve S9, curve S10 and curve S11 are coupling phase curves of interference signals of the RF test module 21 coupled to the corresponding signal line 11. It can be seen that the coupling phase difference of the three interference signals is less than 5°. Wherein, f is the RF frequency, and pha is the coupling phase. Therefore, when the projection of the coupling trace 22 is perpendicular to the signal line 11, the RF coupling circuit 20 can introduce interference signals of approximately the same amplitude and phase into the corresponding signal line 11, and generate common-mode interference signals on each signal line 11 to improve the accuracy of the anti-interference test.

[0129] In one embodiment, the circuit board further includes a first interface and a second interface, one end of each signal line 11 is connected to the first interface, and the other end of each signal line 11 is connected to the second interface.

[0130] In this embodiment, by providing the first interface and the second interface on the circuit board, the first interface and the second interface can be connected to the interface of the first electrical component and the interface of the second electrical component, thereby reducing the complexity of the anti-interference test.

[0131] Exemplarily, the first interface, the second interface, the interface of the first electrical device 30 and the interface of the second electrical device 40 may be board-to-board connectors (Board To Board, BTB).

[0132] An exemplary embodiment of the present disclosure provides a testing method, using the coupling circuit as described above, such as Figure 8 As shown, the test methods include:

[0133] S100: Determine the radio frequency power of a second radio frequency signal emitted by a radio frequency signal source to a radio frequency coupling circuit.

[0134] S200: Determine a loss value between a radio frequency signal source and a radio frequency coupling circuit.

[0135] S300: Determine the coupling degree between the radio frequency coupling circuit and the corresponding signal line.

[0136] S400: Determine the interference immunity of the interface of the second electrical component according to the radio frequency power, the loss value and the coupling degree.

[0137] In this embodiment, the RF power of the second RF signal is determined to determine the strength of the second RF signal. The loss value between the RF signal source and the RF coupling circuit is determined to determine the loss difference between the first RF signal and the second RF signal to avoid the loss value affecting the determination of the anti-interference performance. The coupling degree between the RF coupling circuit and the corresponding signal line is determined to determine the strength of the interference signal coupled to the signal line by the RF coupling circuit. Through the RF power, loss value and coupling degree, the anti-interference performance of the interface of the second electrical device can be determined to quantify the anti-interference performance of the interface, thereby improving the accuracy of the anti-interference test. At the same time, after the anti-interference performance is determined, the isolation between the antenna of the communication component in the electronic device and the interface of the second electrical device can be designed according to the anti-interference performance, thereby improving the reliability of the electronic device design.

[0138] Exemplarily, the anti-interference performance of the interface of the second electrical device is determined according to the radio frequency power, the loss value and the coupling degree in step S400 in the following manner:

[0139] P i =P sig -L div -L cou ;

[0140] Among them, P i is the noise immunity, P sig is the RF power, L div is the loss value, L cou The frequency of the coupling degree is the same as the radio frequency frequency of the second radio frequency signal.

[0141] Exemplarily, after determining the anti-interference performance of the interface of the second electrical component, the transmission power of the antenna may be subtracted from the anti-interference performance to ensure that the difference between the transmission power of the antenna and the anti-interference performance is smaller than the isolation performance of the interface between the antenna and the second electrical component.

[0142] In an exemplary embodiment, an electronic device is provided, and the electronic device is, for example, a mobile phone, a notebook computer, a tablet computer, a wearable device, etc. The electronic device includes the circuit board described above.

[0143] refer to Fig. 9 As shown, electronic device 400 may include one or more of the following components: a processing component 402 , a memory 404 , a power component 406 , a multimedia component 408 , an audio component 410 , an input / output (I / O) interface 412 , a sensor component 414 , and a communication component 416 .

[0144] The processing component 402 generally controls the overall operation of the electronic device 400, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 402 may include one or more processors 420 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 402 may include one or more modules to facilitate the interaction between the processing component 402 and other components. For example, the processing component 402 may include a multimedia module to facilitate the interaction between the multimedia component 408 and the processing component 402.

[0145] The memory 404 is configured to store various types of data to support operations on the electronic device 400. Examples of such data include instructions for any application or method operating on the electronic device 400, contact data, phone book data, messages, pictures, videos, etc. The memory 404 can be implemented by any type of volatile or non-volatile storage terminal or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0146] The power supply component 406 provides power to the various components of the electronic device 400. The power supply component 406 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 400.

[0147] The multimedia component 408 includes a screen that provides an output interface between the electronic device 400 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 408 includes a front camera module and / or a rear camera module. When the electronic device 400 is in an operating mode, such as a shooting mode or a video mode, the front camera module and / or the rear camera module may receive external multimedia data. Each front camera module and the rear camera module may be a fixed optical lens system or have a focal length and optical zoom capability.

[0148] The audio component 410 is configured to output and / or input audio signals. For example, the audio component 410 includes a microphone (MIC), and when the electronic device 400 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 404 or sent via the communication component 416. In some embodiments, the audio component 410 also includes a speaker for outputting audio signals.

[0149] I / O interface 412 provides an interface between processing component 402 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: a home button, a volume button, a start button, and a lock button.

[0150] The sensor assembly 414 includes one or more sensors for providing various aspects of status assessment for the electronic device 400. For example, the sensor assembly 414 can detect the open / closed state of the electronic device 400, the relative positioning of components, such as the display and keypad of the electronic device 400, and the sensor assembly 414 can also detect the position change of the electronic device 400 or a component of the electronic device 400, the presence or absence of user contact with the electronic device 400, the orientation or acceleration / deceleration of the electronic device 400, and the temperature change of the electronic device 400. The sensor assembly 414 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 414 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 414 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0151] The communication component 416 is configured to facilitate wired or wireless communication between the electronic device 400 and other terminals. The electronic device 400 can access a wireless network based on a communication standard, such as WiFi, 2G, 3G, 4G, 5G, or a combination thereof. In an exemplary embodiment, the communication component 416 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 416 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0152] In an exemplary embodiment, the electronic device 400 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing terminals (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to perform the above-described methods.

[0153] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 404 including instructions, and the above instructions can be executed by the processor 420 of the electronic device 400 to complete the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a tape, a floppy disk, and an optical data storage terminal. When the instructions in the storage medium are executed by the processor of the terminal, the terminal is enabled to perform the method shown in the above embodiment.

[0154] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the claims.

[0155] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. The present disclosure is intended to cover any variations, uses or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0156] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A coupling circuit, characterized in that: The coupling circuit comprises: A signal line group, the signal line group comprising a plurality of signal lines, the plurality of signal lines being used to connect an interface of a first electrical device and an interface of a second electrical device in an electronic device, the plurality of signal lines being used to transmit a differential signal from the first electrical device to the second electrical device; At least one radio frequency coupling circuit is coupled to the signal line, and the radio frequency coupling circuit is used to receive a first radio frequency signal to generate an interference signal in the coupled signal line.

2. The coupling circuit according to claim 1, characterized in that: The radio frequency coupling circuit includes a coupling trace for coupling with the signal line, and the coupling trace has a consistent effect on the coupled multiple signal lines.

3. The coupling circuit according to claim 2, characterized in that: Each of the signal lines is located on a first plane, and a coupling line of the radio frequency coupling circuit is parallel to the first plane.

4. The coupling circuit according to claim 3, characterized in that: In the same signal line group, the projection of the coupled wiring on the first plane and the coupled signal line have overlapping areas, and the areas of the overlapping areas of the signal lines are the same.

5. The coupling circuit according to claim 4, characterized in that: The signal line group corresponds to a plurality of the RF coupling circuits, and the plurality of the RF coupling circuits are respectively coupled to different signal lines in the signal line group, and a coupling line of each of the RF coupling circuits is parallel to the corresponding signal line.

6. The coupling circuit according to claim 5, characterized in that: The length and width of each of the signal lines in the overlapped area are equal.

7. The coupling circuit according to claim 5, characterized in that: The projection of the central axis of the coupling trace on the first plane coincides with the central axis of the corresponding signal line.

8. The coupling circuit according to claim 5, characterized in that: The width of the coupling trace is less than or equal to the width of the corresponding signal line, and the length of the coupling trace is less than the length of the corresponding signal line, and the projection of the coupling trace on the first plane is located on the signal line.

9. The coupling circuit according to claim 8, characterized in that: The coupling traces have the same length and / or the same width.

10. The coupling circuit according to claim 4, characterized in that: The signal line group corresponds to one radio frequency coupling circuit, and a projection of a coupling line of the radio frequency coupling circuit on the first plane is perpendicular to a plurality of signal lines coupled in the signal line group.

11. A circuit board, characterized in that: The circuit board is provided with a coupling circuit as claimed in any one of claims 1 to 10.

12. The circuit board according to claim 11, characterized in that: Each of the signal lines and the radio frequency coupling circuit is arranged on different layers of the same circuit board.

13. The circuit board according to claim 12, characterized in that: The circuit board includes a first conductive layer, a second conductive layer and a third conductive layer which are stacked. The first conductive layer includes each of the signal lines; The second conductive layer comprises coupling traces corresponding to the respective signal lines, and a projection of the coupling traces on the first conductive layer at least partially overlaps with the corresponding signal line; The third conductive layer includes a first pad corresponding to each of the coupling traces and a second pad corresponding to each of the coupling traces, and the first pad and the second pad are used to connect the radio frequency coupling circuit.

14. The circuit board according to claim 13, characterized in that: The second conductive layer further includes a connection line group corresponding to each of the coupling traces, each of the connection line groups includes a first connection line and a second connection line, one end of the first connection line is connected to one end of the corresponding coupling trace, the other end of the first connection line is connected to the first pad via a first conductive column, one end of the second connection line is connected to the other end of the corresponding coupling trace, the other end of the second connection line is connected to the second pad via a second conductive column; Wherein, each of the first connection lines located on the same side of each of the coupling lines extends from the corresponding coupling line in different directions, and each of the second connection lines located on the same side of each of the coupling lines extends from the corresponding coupling line in different directions.

15. The circuit board according to claim 13, characterized in that: The first conductive layer further includes a first ground layer isolated from each of the signal lines; the second conductive layer further includes a second ground layer isolated from each of the coupling traces; the third conductive layer further includes a third ground layer isolated from each of the first pads and the second pads; The circuit board also includes: a fourth conductive layer, the fourth conductive layer being located on a side of the first conductive layer away from the second conductive layer, an area on the fourth conductive layer corresponding to the positions of the plurality of signal lines being a hollow area, and an area of ​​the fourth conductive layer other than the hollow area constituting a fourth ground layer; The fourth ground layer is connected to the first ground layer through a third conductive column, the first ground layer is connected to the second ground layer through a fourth conductive column, and the second ground layer is connected to the third ground layer through a fifth conductive column.

16. The circuit board according to claim 15, characterized in that: The hollow area is provided with a grid structure, and the grid structure is connected to the fourth ground layer.

17. The circuit board according to claim 12, characterized in that: The circuit board includes a fifth conductive layer and a sixth conductive layer which are stacked, wherein: The fifth conductive layer includes each of the signal lines; The sixth conductive layer includes coupling traces, and projections of the coupling traces on the fifth conductive layer are perpendicular to the signal lines.

18. The circuit board according to claim 17, characterized in that: The sixth conductive layer further includes a third pad connected to one end of the coupling trace and a fourth pad connected to the other end of the coupling trace, and the third pad and the fourth pad are used to be connected to the radio frequency coupling circuit.

19. The circuit board according to claim 18, characterized in that: The fifth conductive layer also includes a fifth ground layer isolated from each of the signal lines; The sixth conductive layer further includes a sixth ground layer which is isolated from the coupling trace, the third pad and the fourth pad; The circuit board further includes a seventh conductive layer, and the seventh conductive layer is located on a side of the fifth conductive layer away from the sixth conductive layer; The fifth grounding layer is connected to the sixth grounding layer through a sixth conductive column, and the seventh conductive layer is connected to the fifth grounding layer through a seventh conductive column.

20. The circuit board according to any one of claims 11 to 19, characterized in that: The circuit board also includes a first interface and a second interface, one end of each of the signal lines is connected to the first interface, and the other end of each of the signal lines is connected to the second interface.

21. An electronic device, characterized in that: The electronic device comprises the circuit board according to any one of claims 11 to 20.

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