Full-automatic testing device for semiconductor device

Abstract

The invention relates to a full-automatic testing device for a semiconductor device, and the device comprises a testing platform, the top of the testing platform is fixed with a pedestal, the pedestal is cooperatively provided with a mounting plate, the end face of the mounting plate is provided with a sliding groove, the sliding groove is internally provided with a sliding pin in a sliding manner, and the end face of the mounting plate is also cooperatively provided with a rodless cylinder and a sliding rail. The output end of the rodless air cylinder is connected with a connecting plate, the connecting plate is fixed to a follower plate, the follower plate is fixed to the sliding block, a through hole is formed in the end face of the follower plate, a rotating shaft is rotationally installed in the through hole, one end of the rotating shaft and a sliding pin are installed in a matched mode through a connecting rod, and meanwhile a suspension arm is fixed to the other end of the rotating shaft. And a tray carrying mechanism for carrying devices is mounted on the suspension arm in a matched manner. The method can effectively reduce the stray feeling in the detection process, is good in compatibility, is high in use flexibility, and is suitable for the full detection of a device. Meanwhile, a heating function is achieved, and a variable-temperature testing environment can be provided for the device.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor device testing, in particular to a full-automatic testing device for semiconductor devices. Background Art

[0002] The dynamic parameter testing method of power semiconductor devices is crucial to evaluating their performance. Double pulse testing and short circuit testing are two commonly used testing methods. They can accurately measure the performance characteristics of power semiconductor devices under specific working conditions, and can comprehensively evaluate the key parameters of the device, such as switching speed, power consumption, efficiency, and stability, providing a basis for optimizing the design.

[0003] In traditional technology, in order to facilitate dynamic parameter testing of single-tube power devices (such as TO247, TO263 and other package types), an aging socket is usually used to connect the device to be tested to the corresponding test equipment. The aging socket is directly soldered to the PCB board of the test equipment to form a fixed test platform.

[0004] However, the above conventional technologies have the following problems:

[0005] (1) Since the pins of the aging socket are long, a large stray inductance will be generated in the power circuit, thus affecting the accuracy of the test results, and in severe cases, it may even damage the device under test;

[0006] (2) A burn-in socket is not compatible with single-tube power devices of various sizes, which limits the flexibility and application scope of the test equipment;

[0007] (3) Inserting the device under test into the aging seat will cause a certain degree of damage to the device itself, which is not suitable for full inspection and is usually only suitable for laboratory testing verification or sampling inspection;

[0008] (4) The test equipment lacks a heating function, so performance testing can only be performed at room temperature, and it is impossible to provide a variable temperature test environment for the device under test. Summary of the invention

[0009] In view of the shortcomings of the above-mentioned existing production technology, the applicant provides a fully automatic testing device for semiconductor devices with a reasonable structure, which can effectively reduce noise during the detection process, has good compatibility, high flexibility in use, and is suitable for full inspection of devices; at the same time, it has a heating function and can provide a variable temperature testing environment for the device.

[0010] The technical solution adopted by the present invention is as follows:

[0011] A fully automatic testing device for semiconductor devices, comprising a testing platform for testing the devices, a fixed base at the top of the testing platform, a vertically arranged mounting plate mounted on the base, a sliding groove is provided on the end surface of the mounting plate, a sliding pin is slidably installed in the sliding groove, a rodless cylinder and a slide rail arranged in parallel and spaced apart are also mounted on the end surface of the mounting plate, a slider is mounted on the slide rail, an output end of the rodless cylinder is connected to a connecting plate, the connecting plate is fixed to a follower plate, the follower plate is fixed to the slider, a through hole is provided on the end surface of the follower plate, a rotating shaft is rotatably mounted in the through hole, one end of the rotating shaft is mounted in cooperation with the sliding pin through a connecting rod, and at the same time, a suspension arm is fixed on the other end of the rotating shaft, and a disk-carrying mechanism for carrying the device is mounted on the suspension arm;

[0012] The rodless cylinder drives the follower plate to move linearly in the vertical direction through the connecting plate, and the follower plate drives the sliding pin to move along the path of the slide slot through the rotating shaft. During the movement of the sliding pin, the rotating shaft is driven to rotate through the connecting rod, thereby driving the carrier mechanism to flip through the boom, and then the device is transported to the test work position of the test platform through the carrier mechanism.

[0013] As a further improvement of the above technical solution:

[0014] A through hole is provided on the end surface of the follower plate, a bearing is fitted in the through hole, and the follower plate is rotatably mounted on the rotating shaft via the bearing.

[0015] A bearing seat is fixed on the end surface of the follower plate, and the follower plate is installed in cooperation with the bearing through the bearing seat.

[0016] A plurality of limiters are mounted on the end surface of the mounting plate, and the movement distance of the follower plate is limited by the limiters.

[0017] The slide groove includes a first straight segment, a second straight segment and a third straight segment arranged along the vertical direction, the first straight segment and the second straight segment are connected by a first inclined segment, the second straight segment and the third straight segment are connected by a second inclined segment, and the first inclined segment is arranged perpendicular to the second inclined segment.

[0018] The structure of the carrier mechanism is as follows: it includes a fixed plate, a heating plate group and a carrier that are stacked and installed in sequence, the heating plate group is powered on to generate heat, a plurality of through slots are provided on the working end surface of the carrier, a single through slot is used to place a device, a limiting plate is installed on the working end surface of the carrier, and the limiting plate extends along the arrangement direction of the through slot, thereby limiting and fixing the device in the through slot.

[0019] A heat insulation plate is installed between the fixing plate and the heating plate group.

[0020] The heating plate group includes a first heating plate and a second heating plate that cooperate with each other. At least one heating rod is installed between the first heating plate and the second heating plate. The single heating rod is electrically connected to an external power supply. The heating rod generates heat when powered on, thereby causing the first heating plate and the second heating plate to generate heat.

[0021] At least one temperature sensor is installed between the first heating plate and the second heating plate.

[0022] A plurality of pin holes are provided on the end surface of the first heating plate.

[0023] The beneficial effects of the present invention are as follows:

[0024] The present invention has a compact and reasonable structure and is easy to operate. By arranging a test platform, a slide groove, a rodless cylinder, a follower plate, a slide pin, a connecting rod, and a rotating shaft, the device can be automatically transported to the test work position, ensuring that the test probe on the test platform can directly contact the pins on the device, thereby shortening the power circuit distance, reducing the stray inductance during the detection process, and improving the detection accuracy; at the same time, by arranging a carrier mechanism, it can be compatible with various types of single-tube power devices, and the device can be limited and fixed by the friction force between the contact surfaces, which can avoid device damage and is suitable for full inspection conditions.

[0025] The present invention also has the following advantages:

[0026] (1) Under the action of the rodless cylinder, the plate-carrying mechanism can hover at any angle between 0-180°, which is convenient for operators to quickly replace the detection device. The operation is convenient and fast, with a high degree of automation, effectively improving the detection efficiency.

[0027] (2) By providing pin holes and positioning pins, the accuracy of continuous detection can be improved.

[0028] (3) The components are connected by threaded connections, with high interchangeability and stable connection performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of the present invention.

[0030] Figure 2 It is a partial enlarged view of the test platform in the present invention.

[0031] Figure 3 The structural schematic diagram of the test platform is omitted for the present invention.

[0032] Figure 4 for Figure 3 Exploded diagram.

[0033] Figure 5 Schematic diagram of the disk loading mechanism in the present invention in working state Figure 1 .

[0034] Figure 6 Schematic diagram of the disk loading mechanism in the present invention in working state Figure 2 .

[0035] Figure 7 Schematic diagram of the disk loading mechanism in the present invention in working state Figure 3 .

[0036] Figure 8 Schematic diagram of the disk loading mechanism in the present invention in working state Figure 4 .

[0037] Fig. 9 It is a structural schematic diagram of the disk loading mechanism in the present invention.

[0038] Fig.10 for Fig. 9 Exploded diagram.

[0039] Fig.11 It is a schematic diagram of the device of the present invention when it is placed on the carrier mechanism.

[0040] Among them: 1. Test platform; 2. Positioning pin; 3. Base; 4. Stopper; 5. Mounting plate; 6. Slide groove; 7. Slide rail; 8. Slider; 9. Carrier mechanism; 10. Rodless cylinder; 11. Connecting plate; 12. Follower plate; 13. Hanging arm; 14. Sliding pin; 15. Connecting rod; 16. Bearing; 17. Bearing seat; 18. Rotating shaft; 19. Devices;

[0041] 601, first straight segment; 602, second straight segment; 603, third straight segment; 604, first inclined segment; 605, second inclined segment;

[0042] 901, fixing plate; 902, heat insulation plate; 903, first heating plate; 904, second heating plate; 905, limiting plate; 906, carrier plate; 907, pin hole; 908, first receiving groove; 909, second receiving groove; 910, limiting protrusion; 911, sensor; 912, heating rod. DETAILED DESCRIPTION

[0043] The specific implementation of the present invention will be described below in conjunction with the accompanying drawings.

[0044] The structure and function of the present invention are as follows:

[0045] like Figure 1-Figure 11As shown, a fully automatic test device for semiconductor devices includes a test platform 1 for testing a device 19, a fixed base 3 on the top of the test platform 1, a vertically arranged mounting plate 5 is mounted on the base 3, a slide groove 6 is provided on the end surface of the mounting plate 5, a slide pin 14 is slidably installed in the slide groove 6, a rodless cylinder 10 and a slide rail 7 arranged in parallel at intervals are also mounted on the end surface of the mounting plate 5, a slider 8 is mounted on the slide rail 7, the output end of the rodless cylinder 10 is connected to a connecting plate 11, the connecting plate 11 is fixed to a follower plate 12, the follower plate 12 is fixed to the slider 8, a through hole is provided on the end surface of the follower plate 12, and a rotating pin 14 is mounted in the through hole. A rotating shaft 18 is installed dynamically, one end of the rotating shaft 18 is installed with the sliding pin 14 through the connecting rod 15, and at the same time, the other end of the rotating shaft 18 is fixed to the hanging arm 13, and the hanging arm 13 is installed with a disk loading mechanism 9 for carrying the device 19; the rodless cylinder 10 drives the follower plate 12 to make a linear motion in the vertical direction through the connecting plate 11, and the follower plate 12 drives the sliding pin 14 to move along the path of the slide groove 6 through the rotating shaft 18. During the movement of the sliding pin 14, the rotating shaft 18 is driven to rotate through the connecting rod 15, thereby driving the disk loading mechanism 9 to flip through the hanging arm 13, and then the device 19 is transported to the test work position of the test platform 1 through the disk loading mechanism 9. By setting up the test platform 1, the slide groove 6, the rodless cylinder 10, the follower plate 12, the slide pin 14, the connecting rod 15, and the rotating shaft 18, the device 19 can be automatically transported to the test workstation to ensure that the test probe on the test platform 1 can directly contact the pins on the device 19, thereby shortening the power loop distance, reducing the stray inductance during the detection process, and improving the detection accuracy; at the same time, by setting up the carrier mechanism 9, it can be compatible with various types of single-tube power devices, and the device 19 can be limited and fixed by the friction force between the contact surfaces, which can avoid damage to the device 19 and is suitable for full inspection conditions.

[0046] The test platform 1 is the main structure of the test device, on which a test circuit module is installed. The test circuit module includes a test probe. The test probe is electrically connected to the pin of the device 19 to complete the performance test of the device 19. In the present invention, a hole is opened on the test platform 1 to form a test work position, and the test probe is arranged in the test work position. The device 19 is driven to flip through the carrier mechanism 9, so that when the device 19 enters the test work position, the test probe can resist the pin of the device 19, thereby achieving electrical connection through direct contact with the pin, thereby reducing the stray inductance during the test. By setting the test work position, the device 19 can be sunk into the equipment during the test, thereby providing all-round wrapping protection for the device 19 and preventing the device 19 from being damaged and causing injuries during the test.

[0047] In order to ensure that the carrier mechanism 9 can be aligned with the test workstation, positioning pins 2 are installed on both sides of the test workstation to cooperate with the pin holes 907 on the carrier mechanism 9, thereby ensuring that the carrier mechanism 9 can accurately transport the device 19 to the test workstation.

[0048] The base 3 is used to support the disk-carrying mechanism 9 and its motion driving components. A reinforcing plate is installed on the base 3 to improve the structural strength of the base 3 .

[0049] The mounting plate 5 is arranged in the vertical direction, and a slide groove 6 is provided on the end surface thereof. By providing the slide groove 6, the movement trajectory of the slide pin 14 can be guided, and the vertical distance between the slide pin 14 and the rodless cylinder 10 can be adjusted. The change of the vertical distance is compensated by the connecting rod 15, thereby driving the connecting rod 15 to rotate;

[0050] In order to ensure that the connecting rod 15 can perform 0-180° flipping motion, Figure 4 As shown, the slide groove 6 includes a first straight segment 601, a second straight segment 602 and a third straight segment 603 arranged in the vertical direction, the first straight segment 601 and the second straight segment 602 are connected by a first inclined segment 604, the second straight segment 602 and the third straight segment 603 are connected by a second inclined segment 605, and the first inclined segment 604 is arranged perpendicular to the second inclined segment 605.

[0051] A plurality of limiters 4 are installed on the end surface of the mounting plate 5 to limit the movement distance of the follower plate 12; the end of the limiter 4 is made of polyurethane material, which is used as a buffer to prevent the follower plate 12 from colliding with other metal parts during movement and causing vibration and abnormal noise of the device.

[0052] The slide rail 7 and the slide block 8 are used to improve the movement stability of the follower plate 12 .

[0053] The rodless cylinder 10 provides power for the flipping movement of the disc carrier 8, and drives the follower plate 12 to make a linear motion along the slide rail 7, thereby driving the slide pin 14 to make a translational motion along the track of the slide groove 6, and then drives the connecting rod 15 to rotate, and the connecting rod 15 drives the rotating shaft 18 to rotate, and the rotating shaft 18 drives the disc carrier 9 to rotate through the suspension arm 13.

[0054] The suspension arm 13 is L-shaped and is used to achieve the connection between the rotating shaft 18 and the disk loading mechanism 9 .

[0055] The follower plate 12 is fixed to the connecting plate 11. The follower plate 12 moves linearly in the vertical direction under the drive of the connecting plate 11. A through hole is provided on the end surface of the follower plate 12. A bearing 16 is installed in the through hole. The follower plate 12 is rotatably installed with the rotating shaft 18 through the bearing 16. A bearing seat 17 is fixed to the end surface of the follower plate 12. The follower plate 12 is installed with the bearing 16 through the bearing seat 17. The installation stability of the bearing 16 is ensured by providing the bearing seat 17, and the rotational cooperation between the follower plate 12 and the rotating shaft 18 is achieved by providing the bearing seat 17.

[0056] The two ends of the rotating shaft 18 fix the connecting rod 15 and the suspension arm 13 respectively. The connecting rod 15 is rotationally matched with the sliding pin 11, so that when the movement trajectory of the sliding pin 11 changes, the connecting rod 15 can rotate relative to the sliding pin 11.

[0057] like Figure 9-11 As shown, the structure of the carrier mechanism 9 is as follows: it includes a fixed plate 901, a heating plate group and a carrier 906 which are stacked and installed in sequence. The heating plate group generates heat when powered on. A plurality of through slots are provided on the working end surface of the carrier 906. A single through slot is used to place the device 19. A limiting plate 905 is installed on the working end surface of the carrier 906. The limiting plate 905 extends along the arrangement direction of the through slots, thereby limiting and fixing the device 19 in the through slots. The fixed plate 901 is used to be fixed to the suspension arm 13, and the heating plate group is used to heat the carrier 906, so that the ambient temperature of the device 19 is increased based on heat conduction, thereby providing a temperature-adjustable test environment for the device 19.

[0058] The single through groove includes a first accommodating groove 908 and a second accommodating groove 909 which are sequentially connected. The depth of the first accommodating groove 908 is greater than the depth of the second accommodating groove 909, so that the injection molded shell part of the device 19 is accommodated through the first accommodating groove 908, and the pin part of the device 19 is accommodated through the second accommodating groove 909;

[0059] The limiting plate 905 is used to press the device 19 in the through groove, and the device 19 is fixed in the corresponding through groove through the friction between the end surface of the limiting plate 905 and the injection-molded shell of the device 19.

[0060] In order to improve the fixing effect of the carrier 906 on the device 19, a limiting protrusion 910 is set in the single second accommodating groove 909. By making the limiting protrusion 910 clamped between two pins of the corresponding device 19, the device 19 can be effectively prevented from falling off from the corresponding through groove.

[0061] A heat insulation plate 902 is installed between the fixed plate 901 and the heating plate group. The heat insulation plate 902 is used to prevent the heating temperature of the heating plate group from affecting the fixed plate 901, and transmitting to the follower plate 12 and the rodless cylinder 10 through the fixed plate 901, thereby affecting the working performance of the device.

[0062] The heating plate group includes a first heating plate 903 and a second heating plate 904 that cooperate with each other. At least one heating rod 912 is installed between the first heating plate 903 and the second heating plate 904. The single heating rod 912 is electrically connected to an external power source. The heating rod 912 is powered on to generate heat, thereby generating heat for the first heating plate 903 and the second heating plate 904. The first heating plate 903 allows the carrier plate 906 to be evenly heated, thereby ensuring that the device 19 is evenly heated.

[0063] At least one temperature sensor 911 is also installed between the first heating plate 903 and the second heating plate 904. The temperature sensor 911 transmits the real-time temperature signal to the temperature controller, thereby controlling the temperature of the heating rod 912 through the temperature controller to ensure that the heating plate group can achieve rapid compensation between room temperature and 200°C.

[0064] In addition, mounting grooves for mounting the heating rod 912 and the temperature sensor 911 are provided on the end surfaces where the first heating plate 903 and the second heating plate 904 are joined to each other.

[0065] A plurality of pin holes 907 are provided on the end surface of the first heating plate 903. The pin holes 907 correspond to the positioning pins 2. When the positioning pins 2 are inserted into the corresponding pin holes 907, it indicates that the carrier mechanism 9 is moved into position. At this time, the device 19 on the carrier mechanism 9 sinks into the test working position and abuts against the corresponding test probe to realize electrical connection.

[0066] The working process of the present invention is as follows:

[0067] First, the rodless cylinder 10 is in the initial position, as shown in FIG. Figure 5 As shown, at this time, the through slot on the carrier 906 of the carrier mechanism 9 faces upward, and the operator puts the device 19 into the through slot, ensuring that the limiting plate 905 is in close contact with the injection molded shell of the device 19, and at the same time, ensuring that two pins of the device 19 are in close contact with the outer wall of the limiting protrusion 910;

[0068] Then, the rodless cylinder 10 descends in the vertical direction. Figure 6-Figure 8 As shown, under the driving action of the rodless cylinder 10, the connecting plate 11 drives the follower plate 12 to perform a downward linear motion in the vertical direction, and the follower plate 12 simultaneously drives the sliding pin 14 to perform a translational motion along the third straight segment 603, the second inclined segment 605, the second straight segment 602, the first inclined segment 604, and the first straight segment 601 of the slide slot 6 in sequence;

[0069] like Figure 6 As shown in FIG. 1 , when the sliding pin 14 slides over the second inclined section 605, the connecting rod 15 starts to rotate clockwise, thereby driving the disk-carrying mechanism 9 to rotate through the rotating shaft 18; Figure 7 As shown, when the sliding pin 14 moves to the second straight line segment 602, the sliding pin 14 is at the farthest vertical distance from the rodless cylinder 10, the connecting rod 15 rotates to a horizontal state, and the plate-carrying mechanism 9 rotates to 90°; Figure 8 As shown, when the sliding pin 14 slides through the first inclined section 604, the connecting rod 15 continues to rotate clockwise, thereby continuing to drive the disk-carrying mechanism 9 to rotate through the rotating shaft 18; until the sliding pin 14 slides into the first straight section 601, the disk-carrying mechanism 9 completes a 180° rotation, so that the through slot on the disk 906 of the disk-carrying mechanism 9 faces downward;

[0070] Then, the sliding pin 14 continues to slide along the first straight section 601, driving the carrier mechanism 9 to perform a downward linear motion in the vertical direction until the pin hole 907 is docked with the positioning pin 2. At this time, the device 19 on the carrier mechanism 9 sinks into the test working position and abuts against the corresponding test probe to achieve electrical connection;

[0071] The test platform 1 is powered on and starts testing the device 19. During the test, when high temperature related performance tests are required, the heating rod 912 can be powered on to generate heat, thereby achieving testing of the device 19 at high temperature.

[0072] The above description is an explanation of the present invention, not a limitation of the present invention. The scope of the present invention is defined in the claims. Any form of modification may be made within the scope of protection of the present invention.

Claims

1. A fully automatic testing device for semiconductor devices, characterized in that: The invention comprises a test platform (1) for testing a device (19), the top of the test platform (1) is fixed with a base (3), a vertically arranged mounting plate (5) is mounted on the base (3), a slide groove (6) is provided on the end surface of the mounting plate (5), a slide pin (14) is slidably mounted in the slide groove (6), a rodless cylinder (10) and a slide rail (7) arranged in parallel at intervals are mounted on the end surface of the mounting plate (5), a slider (8) is mounted on the slide rail (7), and the rodless cylinder (10) is provided with a plurality of slide pins (14) arranged in parallel at intervals. ) is connected to a connecting plate (11) at an output end thereof, the connecting plate (11) is fixed to a follower plate (12), the follower plate (12) is fixed to a slider (8), a through hole is provided on an end surface of the follower plate (12), a rotating shaft (18) is rotatably mounted in the through hole, one end of the rotating shaft (18) is mounted in cooperation with a sliding pin (14) through a connecting rod (15), and at the same time, the other end of the rotating shaft (18) is fixed to a suspension arm (13), and a disk-carrying mechanism (9) for carrying a device (19) is mounted in cooperation on the suspension arm (13); The rodless cylinder (10) drives the follower plate (12) to move linearly in the vertical direction through the connecting plate (11); the follower plate (12) drives the sliding pin (14) to move along the path of the slide groove (6) through the rotating shaft (18); during the movement of the sliding pin (14), the rotating shaft (18) is driven to rotate through the connecting rod (15), thereby driving the loading plate mechanism (9) to flip through the hanging arm (13), and then the device (19) is transported to the test work position of the test platform (1) through the loading plate mechanism (9).

2. A fully automatic test device for semiconductor devices as claimed in claim 1, characterized in that: A through hole is provided on the end surface of the follower plate (12), a bearing (16) is fitted in the through hole, and the follower plate (12) is rotatably mounted on the rotating shaft (18) via the bearing (16).

3. A fully automatic test device for semiconductor devices as claimed in claim 2, characterized in that: A bearing seat (17) is fixed on the end surface of the follower plate (12), and the follower plate (12) is installed in cooperation with the bearing (16) through the bearing seat (17).

4. A fully automatic test device for semiconductor devices as claimed in claim 1, characterized in that: A plurality of limiters (4) are mounted on the end surface of the mounting plate (5), and the movement distance of the follower plate (12) is limited by the limiters (4).

5. A fully automatic test device for semiconductor devices as claimed in claim 1, characterized in that: The slide groove (6) comprises a first straight segment (601), a second straight segment (602) and a third straight segment (603) arranged in a vertical direction, the first straight segment (601) and the second straight segment (602) are connected via a first inclined segment (604), the second straight segment (602) and the third straight segment (603) are connected via a second inclined segment (605), and the first inclined segment (604) is arranged perpendicular to the second inclined segment (605).

6. A fully automatic test device for semiconductor devices as claimed in claim 1, characterized in that: The structure of the carrier mechanism (9) is as follows: it comprises a fixed plate (901), a heating plate group and a carrier (906) which are stacked and installed in sequence; the heating plate group generates heat when powered on; a plurality of through slots are provided on the working end surface of the carrier (906); a single through slot is used to place a device (19); a limiting plate (905) is installed on the working end surface of the carrier (906); the limiting plate (905) extends along the arrangement direction of the through slots, thereby limiting and fixing the device (19) in the through slots.

7. A fully automatic test device for semiconductor devices as claimed in claim 6, characterized in that: A heat insulation plate (902) is installed between the fixing plate (901) and the heating plate group.

8. A fully automatic test device for semiconductor devices as claimed in claim 6, characterized in that: The heating plate group comprises a first heating plate (903) and a second heating plate (904) which cooperate with each other, at least one heating rod (912) is installed between the first heating plate (903) and the second heating plate (904), and the single heating rod (912) is electrically connected to an external power supply. The heating rod (912) generates heat when it is powered on, thereby causing the first heating plate (903) and the second heating plate (904) to generate heat.

9. A fully automatic test device for semiconductor devices as claimed in claim 8, characterized in that: At least one temperature sensor (911) is also installed between the first heating plate (903) and the second heating plate (904).

10. A fully automatic test device for semiconductor devices as claimed in claim 1, characterized in that: A plurality of pin holes (907) are provided on the end surface of the first heating plate (903).

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