Gallium nitride semiconductor chip packaging debugging parameter detection device and method

Abstract

The invention provides a gallium nitride semiconductor chip packaging debugging parameter detection device and method. The problems that in the Micro-LED display technology, a traditional display voltage value testing method is high in accuracy requirement and not visual enough are solved. According to the method, pure color test data of different chromaticity are transmitted through a special detection device, and the maximum value of the number of LED chips which can be lightened under the driving of the test data is observed and recorded, so that a corresponding display voltage value is directly calculated. The innovation not only simplifies the test process, reduces the accuracy requirement of the brightness test, but also improves the intuition and reliability of the test. According to the invention, an efficient and convenient test means is provided for production and quality control of the Micro-LED display technology.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a device and method for detecting parameters of a gallium nitride semiconductor chip packaging and debugging. Background Art

[0002] With the continuous innovation of display technology, Micro-LED has gradually become the focus of the new generation of display technology due to its excellent brightness, contrast and power consumption characteristics. In order to improve the production efficiency and yield of Micro-LED displays, technicians have innovatively proposed a technical solution to integrate the red, green and blue Micro-LED chips and unit driver chips into the same display packaging unit. This integrated packaging method greatly simplifies the subsequent assembly process of the display. Only these pre-packaged display packaging units need to be arranged one by one on the corresponding circuit board according to the design requirements to quickly complete the assembly of the display.

[0003] However, in the current production process, the performance of the entire display packaging unit is usually tested after the red, green and blue Micro-LED chips and the unit driver chips are packaged. This testing method has obvious disadvantages: once a fault is detected in the display packaging unit, it is impossible to accurately determine whether the problem is with the three-color Micro-LED chip or the unit driver chip. This not only increases the difficulty of troubleshooting, but may also lead to the scrapping of the entire display packaging unit, seriously affecting production efficiency and cost control. Summary of the invention

[0004] The purpose of the present application is to provide a device and method for detecting parameters of a gallium nitride semiconductor chip packaging and debugging, which can improve the above-mentioned problems.

[0005] The embodiment of the present application is implemented as follows: In a first aspect, the present application provides a gallium nitride semiconductor chip packaging debugging parameter detection device, which includes a transmission cable and a test substrate, a first test circuit layer, and a chip test layer stacked in sequence; The chip test layer is provided with a control chip installation slot to be tested, each of the control chip installation slots to be tested is provided with a pin contact pad electrically connected to the first test circuit layer, and when the display unit driver chip to be tested is placed in the control chip installation slot to be tested, each pin contacts the corresponding pin contact pad; The chip test layer is also provided with a data input contact, a red light drive interface, a green light drive interface and a blue light drive interface which are electrically connected to the first test circuit layer; The chip test layer is also provided with a strip groove and at least two LED chips arranged along the strip groove, at least two control contacts electrically connected to the first test circuit layer are arranged in the strip groove, and each LED chip corresponds to one control contact; The first test circuit layer includes a first test circuit, and the first test circuit is used to connect the first electrode of the LED chip with the corresponding control contact, connect the second electrode of the LED chip with the common drive pin contact pad, connect the data input contact with the data input pin contact pad, connect the red light drive interface with the red light drive pin contact pad, connect the green light drive interface with the green light drive pin contact pad, and connect the blue light drive interface with the blue light drive pin contact pad; The first end of the transmission cable is provided with a contact interface corresponding to the red light driving interface, the green light driving interface and the blue light driving interface, and the second end of the transmission cable is provided with a sliding contact head, and the sliding contact head is slidably set in the strip groove.

[0006] When in use, the display unit driver chip to be tested is placed in the test slot and electrically connected to the test circuit layer. Subsequently, the test interface is connected to the target drive interface using a transmission cable, and the test color data is transmitted. Driven by the display unit driver chip, the LED chip applies a display voltage according to the test data. By moving the sliding contact head, the maximum value of the number of LED chips lit corresponding to the test color data is recorded, and then the display voltage value is calculated. By comparing the difference between the actual color data and the test color data, it is quickly determined whether the display unit driver chip is qualified. This method is simple and easy to implement, and improves the test efficiency and accuracy.

[0007] It can be understood that the present application provides a simpler and more intuitive display voltage value test solution. Compared with conventional testing methods, the present application no longer relies on the luminous brightness of a single LED chip to determine the display voltage value, but observes and records the maximum number of LED chips that can be lit by inputting pure color test data of different color shades, such as red light data, green light data or blue light data. This method not only reduces the high requirements for the accuracy of brightness testing, but also makes the testing process more intuitive and easy to understand. By counting the number of LED chips that are lit, the corresponding display voltage value can be directly calculated, which greatly simplifies the testing process. In addition, this testing method also improves the efficiency and reliability of the test, because it can quickly and accurately judge the performance of the display unit driver chip, providing a more efficient and convenient testing method for the production and quality control of Micro-LED display technology.

[0008] In an optional embodiment of the present application, at least one row of LED chip groups is further provided on the chip testing layer, each row of the LED chip groups is correspondingly provided with a strip-shaped groove, and the conduction threshold voltages of the LED chips in each row of the LED chip groups are equal.

[0009] In an optional embodiment of the present application, at least two rows of LED chip groups are further arranged on the chip testing layer, and each row of the LED chip groups is correspondingly provided with a strip-shaped groove; the number of the LED chips contained in each row of the LED chip groups is not equal.

[0010] It can be understood that as the sliding contact head slides in the strip groove, different numbers of LED chips can be turned on. Since the turn-on threshold voltages of each LED chip are equal, each LED chip shares the display voltage value on average. For a larger number of LED chips, each LED chip shares a smaller display voltage value, which is equivalent to a higher adjustment accuracy of the sliding contact head; for a smaller number of LED chips, each LED chip shares a larger display voltage value, which is equivalent to a lower adjustment accuracy of the sliding contact head. LED chipsets containing different numbers of LED chips can provide adjustment modes with different accuracies.

[0011] In an optional embodiment of the present application, a power contact and a ground contact are also provided on the chip test layer, the power contact is electrically connected to the power pin contact pad through the first test circuit, and the ground contact is electrically connected to the ground pin contact pad through the first test circuit.

[0012] In an optional embodiment of the present application, the common drive pin contact pad is also electrically connected to the ground contact through the first test circuit.

[0013] In an optional embodiment of the present application, a first magnet is embedded in the control contact, and a second magnet with a magnetic pole opposite to that of the first magnet is embedded in the sliding contact head. It can be understood that when the sliding contact head is close to a certain control contact point, the sliding contact head will be attracted to the corresponding control contact point by magnetic force, thereby increasing the test accuracy.

[0014] In an optional embodiment of the present application, a display module mounting groove to be tested is provided on the chip test layer, and each display module mounting groove to be tested is provided with a contact pad electrically connected to the first test circuit layer, and when the display module to be tested is placed in the display module mounting groove to be tested, each contact contacts the corresponding contact pad; the display module includes a red LED chip, a green LED chip and a blue LED chip, and in the display module, the first electrode of the red LED chip is electrically connected to the first contact, the first electrode of the green LED chip is electrically connected to the second contact, and the blue LED chip The first electrode is electrically connected to the third contact, and the second electrodes of the red light LED chip, the green light LED chip and the blue light LED chip are all electrically connected to the common contact; the chip test layer is also provided with a test common contact, a red light test contact, a green light test contact and a blue light test contact; the first test circuit layer also includes a second test circuit, which is used to connect the test common contact and each common contact contact pad, connect the red light test contact and the first contact contact pad, connect the green light test contact and the second contact contact pad, and connect the blue light test contact and the third contact contact pad.

[0015] It can be understood that by setting the installation groove of the display module to be tested and the contact pad electrically connected to the first test circuit layer, the rapid installation and electrical connection of the display module to be tested is achieved. Using the second test circuit, the test voltage can be easily applied to the ground and the first electrode of the LED chips of different colors. By observing whether the LED chip is lit, the qualification of the display module to be tested can be quickly judged. This method simplifies the test process, improves the test efficiency, and can intuitively reflect the working status of various color LED chips in the display module, which helps to find and eliminate faults in time and ensure that the quality and performance of the display module meet the requirements.

[0016] On the second aspect, the present application discloses a method for detecting parameters of a gallium nitride semiconductor chip package debugging, including steps S1 to S5, wherein S1, S2, etc. are merely step identifiers, and the execution order of the method is not necessarily in ascending order of numbers, for example, step S2 may be executed first and then step S1, and the present application does not impose any limitation thereto.

[0017] The above-mentioned gallium nitride semiconductor chip packaging debugging parameter detection method is applied to the gallium nitride semiconductor chip packaging debugging parameter detection device as described in any one of the first aspects, and the above-mentioned steps S1 to S4 are specifically as follows: S1: placing the display unit driver chip to be tested in the installation slot of the control chip to be tested, so that the data input pin of the display unit driver chip contacts the data input pin contact pad, the common drive pin of the display unit driver chip contacts the common drive pin contact pad, the red light drive pin of the display unit driver chip contacts the red light drive pin contact pad, the green light drive pin of the display unit driver chip contacts the green light drive pin contact pad, and the blue light drive pin of the display unit driver chip contacts the blue light drive pin contact pad; S2: Connecting the contact interface of the transmission cable to a target drive interface, and then placing the sliding contact head in the strip-shaped groove, wherein the target drive interface is the red light drive interface, the green light drive interface or the blue light drive interface; S3: transmitting the test color data to the data input contact, driving the display unit driving chip to apply a display voltage through the red light driving pin, the green light driving pin or the blue light driving pin; S4: moving the sliding contact head and recording the maximum value of the number of the LED chips lit corresponding to the test color data; S5: Calculate the display voltage value corresponding to the maximum value, compare the difference between the actual color data corresponding to the display voltage value and the test color data, if the difference is less than the preset value, judge that the display unit driver chip is qualified, if the difference is greater than the preset value, judge that the display unit driver chip is unqualified.

[0018] In an optional embodiment of the present application, the calculation of the display voltage value corresponding to the maximum value includes taking the product of the maximum value and the turn-on threshold voltage of a single LED chip as the display voltage value.

[0019] In an optional embodiment of the present application, between step S2 and step S3, the method further includes: applying a power signal to the power contact and grounding the ground contact.

[0020] In an optional embodiment of the present application, step S6 is also included: grounding the test common contact, applying test voltage to the red light test contact, the green light test contact and the blue light test contact in sequence, and observing whether the red light LED chip, the green light LED chip and the blue light LED chip in the display module to be tested are lit.

[0021] The present application provides a simpler and more intuitive display voltage value test solution. Compared with conventional testing methods, the present application no longer relies on the luminous brightness of a single LED chip to determine the display voltage value, but observes and records the maximum number of LED chips that can be lit by inputting pure color test data of different color shades, such as red light data, green light data or blue light data. This method not only reduces the high requirements for the accuracy of brightness testing, but also makes the testing process more intuitive and easy to understand. By counting the number of LED chips that are lit, the corresponding display voltage value can be directly calculated, which greatly simplifies the testing process. In addition, this testing method also improves the efficiency and reliability of the test, because it can quickly and accurately judge the performance of the display unit driver chip, providing a more efficient and convenient testing method for the production and quality control of Micro-LED display technology.

[0022] The present application also proposes an embodiment that is convenient for testing the performance of a display module, wherein a mounting groove for a display module to be tested is provided on a chip test layer, and a contact pad electrically connected to a first test circuit layer is provided in the groove. The display module to be tested comprises red, green and blue LED chips, the first electrodes of which are electrically connected to different contacts respectively, and the second electrodes are all connected to a common contact. A common test contact and test contacts corresponding to each color LED chip are also provided on the chip test layer. Through the second test circuit, a test voltage can be conveniently applied to each color LED chip, and it can be observed whether it is lit. This embodiment simplifies the test process of the display module and improves the test efficiency and accuracy. By visually observing the lighting of the LED chip, the qualification of the display module can be quickly judged, and faults can be discovered and eliminated in time. This method is not only easy to operate, but also can effectively ensure the quality and performance of the display module, providing strong support for the production and quality control of Micro-LED display technology.

[0023] In order to make the above-mentioned objects, features and advantages of the present application more obvious and understandable, optional embodiments are specifically listed below and described in detail with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a partial top view of a gallium nitride semiconductor chip packaging and debugging parameter detection device provided by the present application; Figure 2 yes Figure 1The circuit connection diagram of the LED chip shown; Figure 3 yes Figure 1 A cross-sectional view of a gallium nitride semiconductor chip packaging and debugging parameter detection device shown; Figure 4 It is a partial top view of another gallium nitride semiconductor chip packaging debugging parameter detection device provided by the present application; Figure 5 is a cross-sectional view of the display module to be tested provided by the present application; Figure 6 yes Figure 5 A top view of the display module to be tested is shown; Figure 7 It is a partial top view of another gallium nitride semiconductor chip packaging debugging parameter detection device provided by the present application; Figure 8 This is a second test circuit schematic diagram provided by this application. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0027] First, as Figures 1 to 3 As shown, the present application provides a gallium nitride semiconductor chip packaging debugging parameter detection device, which includes a transmission cable and a test substrate 1, a test circuit layer 2 and a chip test layer 3 stacked in sequence, wherein the chip test layer 3 is an insulating material.

[0028] The chip test layer 3 is provided with a test control chip mounting slot, each of which is provided with a pin contact pad electrically connected to the test circuit layer 2. When the display unit driver chip to be tested is placed in the test control chip mounting slot, each pin contacts the corresponding pin contact pad. Figure 1 The chip testing layer 3 shown is provided with a control chip mounting groove 4 to be tested, and the control chip mounting groove 4 to be tested is provided with a power pin contact pad P1, a ground pin contact pad P4, a data input pin contact pad P8, a data output pin contact pad P5, a common drive pin contact pad P7, a red light drive pin contact pad P2, a green light drive pin contact pad P3 and a blue light drive pin contact pad P6, which are respectively in contact with the power pin, ground pin, data input pin, data output pin, common drive pin, red light drive pin, green light drive pin and blue light drive pin of the display unit drive chip to be tested.

[0029] Continue to refer Figure 1 The chip test layer 3 is also provided with a data input contact Q1 , a red light drive interface Q2 , a green light drive interface Q3 and a blue light drive interface Q6 which are electrically connected to the test circuit layer 2 .

[0030] The chip test layer 3 is also provided with a strip groove and at least two LED chips arranged along the strip groove. At least two control contacts electrically connected to the test circuit layer 2 are arranged in the strip groove, and each LED chip corresponds to a control contact. Figures 1 to 3 The chip testing layer 3 shown is provided with a first strip groove 5, in which are provided a first control contact a1, a second control contact a2, a third control contact a3, a fourth control contact a4, a fifth control contact a5, a sixth control contact a6, a seventh control contact a7, and an eighth control contact a8; the chip testing layer 3 is also provided with a first LED chip D1, a second LED chip D2, a third LED chip D3, a fourth LED chip D4, a fifth LED chip D5, a sixth LED chip D6, a seventh LED chip D7 and an eighth LED chip D8.

[0031] The test circuit layer 2 includes a first test circuit, which is used to connect the first electrode of the LED chip with the corresponding control contact, connect the second electrode of the LED chip with the common drive pin contact pad, connect the data input contact with the data input pin contact pad, connect the red light drive interface with the red light drive pin contact pad, connect the green light drive interface with the green light drive pin contact pad, and connect the blue light drive interface with the blue light drive pin contact pad.

[0032] The first end of the transmission cable (not shown in the figure) is provided with a contact interface corresponding to the red light drive interface, the green light drive interface and the blue light drive interface, and the second end of the transmission cable is provided with a sliding contact head 6, such as Figure 3 As shown, the sliding contact head 6 is slidably arranged in the strip-shaped groove 5 .

[0033] When in use, the display unit driver chip to be tested is placed in the test slot and electrically connected to the test circuit layer 2. Subsequently, the test interface is connected to the target drive interface using a transmission cable, and the test color data is transmitted. Driven by the display unit driver chip, the LED chip applies a display voltage according to the test data. By moving the sliding contact head, the maximum value of the number of LED chips lit corresponding to the test color data is recorded, and then the display voltage value is calculated. By comparing the difference between the actual color data and the test color data, it is quickly determined whether the display unit driver chip is qualified. This method is simple and easy to implement, and improves the test efficiency and accuracy.

[0034] It can be understood that the present application provides a simpler and more intuitive display voltage value test solution. Compared with conventional testing methods, the present application no longer relies on the luminous brightness of a single LED chip to determine the display voltage value, but observes and records the maximum number of LED chips that can be lit by inputting pure color test data of different color shades, such as red light data, green light data or blue light data. This method not only reduces the high requirements for the accuracy of brightness testing, but also makes the testing process more intuitive and easy to understand. By counting the number of LED chips that are lit, the corresponding display voltage value can be directly calculated, which greatly simplifies the testing process. In addition, this testing method also improves the efficiency and reliability of the test, because it can quickly and accurately judge the performance of the display unit driver chip, providing a more efficient and convenient testing method for the production and quality control of Micro-LED display technology.

[0035] In an optional embodiment of the present application, at least one row of LED chip groups is further provided on the chip test layer 3, each row of LED chip groups is correspondingly provided with a strip-shaped groove, and the conduction threshold voltages of the LED chips in each row of LED chips are equal. Figure 1 For example, assuming that the display voltage that can be output by the red light driving pin in the display unit driver chip to be tested is 0-4V, 8 LED chips are arranged in parallel, and the conduction threshold voltage of each LED chip is 0.5V. When in use, different test color data can be input into the data input contacts in turn, driving the display unit driver chip to output 1V, 2V, 3V, and 4V display voltages through the red light driving pin, and then by moving the sliding contact head, observe the maximum number of LED chips that can be lit by the current test color data, so as to verify whether the display unit driver chip outputs the corresponding display voltage. For example, when the red light driving pin outputs a display voltage of 1V, and the maximum number of LED chips that can be lit is observed to be 2, then it means that this test is qualified. If it is observed that the maximum number of LED chips that can be lit is only 1, or more than 2, then it means that this test is unqualified, and the corresponding display unit driver chip has certain faults.

[0036] In an optional embodiment of the present application, at least two rows of LED chip groups are further arranged on the chip testing layer 3, and each row of LED chip groups is correspondingly provided with a strip-shaped groove; the number of LED chips contained in each row of LED chip groups is not equal. Figure 4 The chip testing layer 3 shown is also provided with a first LED chip group including 8 LED chips and a second LED chip group including 6 LED chips.

[0037] It can be understood that as the sliding contact head slides in the strip groove, different numbers of LED chips can be turned on. Since the turn-on threshold voltages of each LED chip are equal, each LED chip shares the display voltage value on average. For a larger number of LED chips, each LED chip shares a smaller display voltage value, which is equivalent to a higher adjustment accuracy of the sliding contact head; for a smaller number of LED chips, each LED chip shares a larger display voltage value, which is equivalent to a lower adjustment accuracy of the sliding contact head. LED chipsets containing different numbers of LED chips can provide adjustment modes with different accuracies.

[0038] In an optional embodiment of the present application, a power contact and a ground contact are also provided on the chip test layer 3. The power contact is electrically connected to the power pin contact pad through the first test circuit, and the ground contact is electrically connected to the ground pin contact pad through the first test circuit.

[0039] In an optional embodiment of the present application, the common drive pin contact pad is also electrically connected to the ground contact through the first test circuit.

[0040] In an optional embodiment of the present application, a first magnet is embedded in the control contact, and a second magnet with a magnetic pole opposite to that of the first magnet is embedded in the sliding contact. It can be understood that when the sliding contact is close to a certain control contact, the sliding contact will be attracted to the corresponding control contact by magnetic force, thereby increasing the test accuracy.

[0041] In addition to testing the display unit driver chip, the display module should also be tested. Figure 5 and Figure 6 As shown, the display module includes a sapphire substrate 11 and a light-emitting chip arrangement layer stacked on the sapphire substrate 11; the light-emitting chip arrangement layer includes a red light Micro-LED chip 12, a green light Micro-LED chip 13 and a blue light Micro-LED chip 14 bonded to the sapphire substrate 11 through a transparent adhesive layer; an insulating packaging layer 15 is filled between the Micro-LED chips; the first electrodes of the red light Micro-LED chip 12 extend to the red light signal pad 17 located on the surface of the insulating packaging layer, the first electrodes of the green light Micro-LED chip 13 extend to the green light signal pad 18 located on the surface of the insulating packaging layer, and the first electrodes of the blue light Micro-LED chip 13 extend to the blue light signal pad 19 located on the surface of the insulating packaging layer, and the second electrodes of each Micro-LED chip are electrically connected to each other and extend to the common pad 16 located on the surface of the insulating packaging layer.

[0042] In an optional embodiment of the present application, a plurality of display module mounting grooves to be tested are provided on the chip test layer, and a contact pad electrically connected to the test circuit layer is provided in each display module mounting groove to be tested, and when the display module to be tested is placed in the display module mounting groove to be tested, each contact point contacts the corresponding contact pad; the display module includes a red LED chip, a green LED chip and a blue LED chip, and in the display module, a first electrode of the red LED chip is electrically connected to the first contact, a first electrode of the green LED chip is electrically connected to the second contact, and a blue LED chip is electrically connected to the first contact. The first electrode of the chip is electrically connected to the third contact, and the second electrodes of the red light LED chip, the green light LED chip and the blue light LED chip are all connected to the common contact pad; the chip test layer 3 is also provided with a test common contact, a red light test contact, a green light test contact and a blue light test contact; the test circuit layer also includes a second test circuit, and the second test circuit is used to connect the test common contact and each common contact pad, connect the red light test contact and the first contact pad, connect the green light test contact and the second contact pad, and connect the blue light test contact and the third contact pad.

[0043] like Figure 7 and Figure 8 As shown, the chip test layer 3 is provided with four display module mounting slots 20 to be tested, each display module mounting slot 20 to be tested is provided with a contact pad electrically connected to the test circuit layer 2, and when the display module to be tested is placed in the display module mounting slot to be tested, each contact point contacts the corresponding contact pad. Figure 7 As shown, the common contact pads T14, T24, T34, and T44 are respectively connected to the common pad 16 of the corresponding display module, the first contacts T11, T21, T31, and T41 are connected to the red light signal pad 17 of the corresponding display module, the second contacts T12, T22, T32, and T42 are connected to the green light signal pad 18 of the corresponding display module, and the third contacts T13, T23, T33, and T43 are connected to the blue light signal pad 19 of the corresponding display module. A test common contact X4, a red light test contact X1, a green light test contact X2 and a blue light test contact X3 are also provided on the chip test layer 3; the test circuit layer 2 also includes a second test circuit, which is used to connect the test common contact and each common contact contact pad, connect the red light test contact X1 and the first contact T11, T21, T31, T41 contact pad, connect the green light test contact X2 and the second contact T12, T22, T32, T42 contact pad, and connect the blue light test contact X3 and the third contact T13, T23, T33, T43 contact pad.

[0044] It can be understood that by setting the installation groove of the display module to be tested and the contact pad electrically connected to the test circuit layer 2, the rapid installation and electrical connection of the display module to be tested is achieved. Using the second test circuit, the test voltage can be easily applied to the ground and the first electrode of the LED chips of different colors. By observing whether the LED chip is lit, the qualification of the display module to be tested can be quickly judged. This method simplifies the test process, improves the test efficiency, and can intuitively reflect the working status of various color LED chips in the display module, which helps to find and eliminate faults in time and ensure that the quality and performance of the display module meet the requirements.

[0045] On the second aspect, the present application discloses a method for detecting parameters of a gallium nitride semiconductor chip package debugging, including steps S1 to S5, wherein S1, S2, etc. are merely step identifiers, and the execution order of the method is not necessarily in ascending order of numbers, for example, step S2 may be executed first and then step S1, and the present application does not impose any limitation thereto.

[0046] The above-mentioned gallium nitride semiconductor chip packaging debugging parameter detection method is applied to any gallium nitride semiconductor chip packaging debugging parameter detection device of the first aspect, and the above-mentioned steps S1 to S4 are specifically as follows: S1: placing the display unit driver chip to be tested in the mounting slot of the control chip to be tested, so that the data input pin of the display unit driver chip contacts the data input pin contact pad, the common drive pin of the display unit driver chip contacts the common drive pin contact pad, the red light drive pin of the display unit driver chip contacts the red light drive pin contact pad, the green light drive pin of the display unit driver chip contacts the green light drive pin contact pad, and the blue light drive pin of the display unit driver chip contacts the blue light drive pin contact pad; S2: Connecting the contact interface of the transmission cable to the target drive interface, and then setting the sliding contact head in the strip groove, the target drive interface is a red light drive interface, a green light drive interface or a blue light drive interface; S3: transmitting the test color data to the data input contact, driving the display unit driver chip to apply a display voltage through the red light driving pin, the green light driving pin or the blue light driving pin; S4: Move the sliding contact head and record the maximum value of the number of LED chips lit corresponding to the test color data; S5: Calculate the display voltage value corresponding to the maximum value, compare the difference between the actual color data and the test color data corresponding to the display voltage value, if the difference is less than the preset value, the display unit driver chip is judged to be qualified, if the difference is greater than the preset value, the display unit driver chip is judged to be unqualified.

[0047] In an optional embodiment of the present application, calculating the display voltage value corresponding to the maximum value includes taking the product of the maximum value and the conduction threshold voltage of a single LED chip as the display voltage value.

[0048] In an optional embodiment of the present application, between step S2 and step S3, the method further includes: applying a power signal to the power contact and grounding the ground contact.

[0049] In an optional embodiment of the present application, step S6 is also included: grounding the test common contact, applying test voltage to the red light test contact, the green light test contact and the blue light test contact in turn, and observing whether the red light LED chip, the green light LED chip and the blue light LED chip in the display module to be tested are lit.

[0050] The expressions "first", "second", "the first" or "the second" used in various embodiments of the present disclosure may modify various components regardless of order and / or importance, but these expressions do not limit the corresponding components. The above expressions are only configured for the purpose of distinguishing an element from other elements. For example, a first user device and a second user device represent different user devices, although both are user devices. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present disclosure.

[0051] When one element (e.g., a first element) is referred to as being "(operably or communicatively) coupled" or "(operably or communicatively) coupled to" or "connected to" another element (e.g., a second element), it is understood that the one element is directly connected to the other element or the one element is indirectly connected to the other element via yet another element (e.g., a third element). Conversely, it is understood that when an element (e.g., a first element) is referred to as being "directly connected" or "directly coupled" to another element (the second element), no element (e.g., a third element) is interposed between the two.

[0052] It should be noted that, in this article, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, components, features, and elements with the same name in different embodiments of the present application may have the same meaning or different meanings, and their specific meanings need to be determined by their explanation in the specific embodiment or further combined with the context of the specific embodiment.

[0053] As used herein, the words "if" and "if" may be interpreted as "at the time of" or "when" or "in response to determining" or "in response to detecting", depending on the context. Similarly, the phrases "if it is determined" or "if (stated condition or event) is detected" may be interpreted as "when it is determined" or "in response to determining" or "when detecting (stated condition or event)" or "in response to detecting (stated condition or event)", depending on the context.

[0054] The above description is only an optional embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the above invention concept. For example, the above features are replaced with the technical features with similar functions disclosed in this application (but not limited to) by each other.

[0055] The above description is only an optional embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A gallium nitride semiconductor chip packaging and debugging parameter detection device, characterized in that: It includes a transmission cable and a test substrate, a first test circuit layer and a chip test layer which are stacked in sequence; The chip test layer is provided with a control chip installation slot to be tested, each of the control chip installation slots to be tested is provided with a pin contact pad electrically connected to the first test circuit layer, and when the display unit driver chip to be tested is placed in the control chip installation slot to be tested, each pin contacts the corresponding pin contact pad; The chip test layer is also provided with a data input contact, a red light drive interface, a green light drive interface and a blue light drive interface which are electrically connected to the first test circuit layer; The chip test layer is also provided with a strip groove and at least two LED chips arranged along the strip groove, at least two control contacts electrically connected to the first test circuit layer are arranged in the strip groove, and each LED chip corresponds to one control contact; The first test circuit layer includes a first test circuit, and the first test circuit is used to connect the first electrode of the LED chip with the corresponding control contact, connect the second electrode of the LED chip with the common drive pin contact pad, connect the data input contact with the data input pin contact pad, connect the red light drive interface with the red light drive pin contact pad, connect the green light drive interface with the green light drive pin contact pad, and connect the blue light drive interface with the blue light drive pin contact pad; The first end of the transmission cable is provided with a contact interface corresponding to the red light driving interface, the green light driving interface and the blue light driving interface, and the second end of the transmission cable is provided with a sliding contact head, and the sliding contact head is slidably set in the strip groove.

2. The gallium nitride semiconductor chip packaging and debugging parameter detection device according to claim 1, characterized in that: At least one row of LED chip groups is also arranged on the chip testing layer, each row of the LED chip groups is correspondingly provided with a strip-shaped groove, and the conduction threshold voltages of the LED chips in each row of the LED chip groups are equal.

3. The gallium nitride semiconductor chip packaging and debugging parameter detection device according to claim 2, characterized in that: At least two rows of LED chip groups are also arranged on the chip testing layer, and each row of the LED chip groups is correspondingly provided with a strip-shaped groove; the number of the LED chips contained in each row of the LED chip groups is not equal.

4. The gallium nitride semiconductor chip packaging and debugging parameter detection device according to claim 1, characterized in that: The chip test layer is also provided with a power contact and a ground contact. The power contact is electrically connected to the power pin contact pad through the first test circuit, and the ground contact is electrically connected to the ground pin contact pad through the first test circuit.

5. The gallium nitride semiconductor chip packaging and debugging parameter detection device according to claim 4, characterized in that: The common drive pin contact pad is also electrically connected to the ground contact through the first test circuit.

6. The gallium nitride semiconductor chip packaging debugging parameter detection device according to any one of claims 1 to 5, characterized in that: A first magnet is embedded in the control contact, and a second magnet having a magnetic pole opposite to that of the first magnet is embedded in the sliding contact head.

7. The gallium nitride semiconductor chip packaging and debugging parameter detection device according to any one of claims 1 to 5, characterized in that: The chip test layer is provided with a display module installation groove to be tested, each of the display module installation grooves to be tested is provided with a contact pad electrically connected to the first test circuit layer, and when the display module to be tested is placed in the display module installation groove to be tested, each contact point contacts with the corresponding contact pad; The display module comprises a red LED chip, a green LED chip and a blue LED chip, wherein in the display module, a first electrode of the red LED chip is electrically connected to a first contact, a first electrode of the green LED chip is electrically connected to a second contact, a first electrode of the blue LED chip is electrically connected to a third contact, and second electrodes of the red LED chip, the green LED chip and the blue LED chip are all electrically connected to a common contact; The chip test layer is also provided with a test common contact, a red light test contact, a green light test contact and a blue light test contact; The first test circuit layer also includes a second test circuit, which is used to connect the test common contact and each common contact pad, connect the red light test contact and the first contact pad, connect the green light test contact and the second contact pad, and connect the blue light test contact and the third contact pad.

8. A gallium nitride semiconductor chip packaging and debugging parameter detection method, applied to the gallium nitride semiconductor chip packaging and debugging parameter detection device according to claim 7, characterized in that: The following steps are involved: S1: placing the display unit driver chip to be tested in the installation slot of the control chip to be tested, so that the data input pin of the display unit driver chip contacts the data input pin contact pad, the common drive pin of the display unit driver chip contacts the common drive pin contact pad, the red light drive pin of the display unit driver chip contacts the red light drive pin contact pad, the green light drive pin of the display unit driver chip contacts the green light drive pin contact pad, and the blue light drive pin of the display unit driver chip contacts the blue light drive pin contact pad; S2: Connecting the contact interface of the transmission cable to a target drive interface, and then placing the sliding contact head in the strip-shaped groove, wherein the target drive interface is the red light drive interface, the green light drive interface or the blue light drive interface; S3: transmitting the test color data to the data input contact, driving the display unit driving chip to apply a display voltage through the red light driving pin, the green light driving pin or the blue light driving pin; S4: moving the sliding contact head and recording the maximum value of the number of the LED chips lit corresponding to the test color data; S5: Calculate the display voltage value corresponding to the maximum value, compare the difference between the actual color data corresponding to the display voltage value and the test color data, if the difference is less than the preset value, judge that the display unit driver chip is qualified, if the difference is greater than the preset value, judge that the display unit driver chip is unqualified.

9. The gallium nitride semiconductor chip packaging debugging parameter detection method according to claim 8, characterized in that: The calculating the display voltage value corresponding to the maximum value includes taking the product of the maximum value and the conduction threshold voltage of a single LED chip as the display voltage value.

10. The gallium nitride semiconductor chip packaging debugging parameter detection method according to claim 8, characterized in that: The method also includes step S6: grounding the test common contact, applying test voltages to the red light test contact, the green light test contact and the blue light test contact in sequence, and observing whether the red light LED chip, the green light LED chip and the blue light LED chip in the display module to be tested are lit.

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