Electronic device

Abstract

An electronic device comprises a substrate, at least one optical module and at least one metal connecting piece. The at least one optical module comprises an optical transmission seat and a lens. The light transmission seat is arranged on the substrate and is provided with a total reflection surface and a bottom surface. The total reflection surface is not parallel to the bottom surface, and the bottom surface is opposite to the total reflection surface and faces the substrate. The lens is arranged on the bottom surface. The at least one metal connecting piece is connected with the optical transmission seat and is welded on the substrate.

Description

Technical Field

[0001] The present invention relates to an electronic device, in particular to an electronic device utilizing optical fiber communication technology. Background Art

[0002] In modern information communication, optical fiber communication networks are becoming more and more developed. Optical fiber communication networks include the technology of receiving optical signals from optical fiber networks and converting them into electronic signals for transmission, as well as the technology of optical communication modules that convert electronic signals into optical signals and then transmit them outward through optical fiber networks. In addition, optical fiber communication networks have the characteristics of low transmission loss, high data confidentiality, excellent anti-interference and ultra-large bandwidth.

[0003] In optical fiber communication networks, chip on board lens (COB lens) is used to transmit optical signals. Generally, chip on board lens is packaged by using UV glue to perform a curing process. However, the curing process has low packaging accuracy, and it is easy for the chip on board lens to be misaligned due to external environmental factors such as thermal expansion and contraction, thus failing to accurately transmit optical signals. In addition, the curing process also has the problem of long packaging time. Therefore, how to improve the packaging accuracy of chip on board lens and reduce the packaging time is one of the problems that R&D personnel should solve. Summary of the invention

[0004] The present invention provides an electronic device, thereby improving the packaging accuracy of a chip-on-board packaging lens and reducing the packaging time.

[0005] An electronic device disclosed in one embodiment of the present invention comprises a substrate, at least one optical module and at least one metal connector. The at least one optical module comprises an optical transmission seat and a lens. The optical transmission seat is disposed on the substrate. The optical transmission seat has a total reflection surface and a bottom surface. The total reflection surface is not parallel to the bottom surface, and the bottom surface is opposite to the total reflection surface and faces the substrate. The lens is disposed on the bottom surface. At least one metal connector is connected to the optical transmission seat and welded to the substrate.

[0006] According to the electronic device of the above embodiment, since the metal connector is connected to the optical transmission seat and welded to the substrate, the optical transmission seat can be more effectively positioned, thereby improving the packaging accuracy of the optical module. In addition, compared with packaging the optical module by general gluing, the welding method can reduce the time by about 3 to 4 times, so the process of the electronic device can be more efficient.

[0007] The above description of the content of the present invention and the following description of the implementation modes are used to demonstrate and explain the principles of the present invention and to provide further explanation for the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a first embodiment of the present invention.

[0009] Figure 2 for Figure 1 Exploded diagram of the electronic device.

[0010] Figure 3 for Figure 1 A schematic cross-sectional view of an electronic device.

[0011] Figure 4 To present light Figure 1 A schematic cross-sectional view of a path in an electronic device.

[0012] Figure 5 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a second embodiment of the present invention.

[0013] Figure 6 for Figure 5 Exploded diagram of the electronic device.

[0014] Figure 7 for Figure 5 A schematic cross-sectional view of an electronic device.

[0015] Figure 8 for Figure 5 A partially exploded schematic diagram of an electronic device.

[0016] [Description of Reference Numerals]

[0017] 10,10A: Electronic devices

[0018] 11: Substrate

[0019] 12,12A: Optical module

[0020] 121,121A: Optical transmission seat

[0021] 1211,1211A: Total reflection surface

[0022] 1212,1212A: Bottom

[0023] 121A1: First Block

[0024] 121A2: Second seat

[0025] 122: Lens

[0026] 13: Light-emitting element

[0027] 14,14A: Fiber optic connector

[0028] 141,141A: Slot

[0029] 15: Metal connectors

[0030] 151: Bottom side

[0031] 1511: Hollow part

[0032] 152: Top side

[0033] 1521: Structural reinforcement

[0034] 15211: Give way to the gap

[0035] 20,20A: Fiber Optic

[0036] A~D: Direction DETAILED DESCRIPTION

[0037] See also Figures 1 to 3 . Figure 1 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a first embodiment of the present invention. Figure 2 for Figure 1 Exploded diagram of the electronic device. Figure 3 for Figure 1 A schematic cross-sectional view of an electronic device.

[0038] The electronic device 10 of the present embodiment includes a substrate 11, two optical modules 12, two light emitting elements 13, two optical fiber connectors 14, and two metal connectors 15. Since the structures of the two optical modules 12, the two light emitting elements 13, the two optical fiber connectors 14, and the two metal connectors 15 are the same, one of the optical modules 12, one of the light emitting elements 13, one of the optical fiber connectors 14, and one of the metal connectors 15 are described below.

[0039] The substrate 11 is, for example, a circuit board or a ceramic substrate. The optical module 12 is, for example, injection molded by a plastic material, and includes a light transmission seat 121 and a lens 122. The light transmission seat 121 is disposed on the substrate 11, and has a total reflection surface 1211 and a bottom surface 1212. The total reflection surface 1211 and the bottom surface 1212 are, for example, not parallel. For example, the angle between the total reflection surface 1211 and the bottom surface 1212 is 45 degrees. The bottom surface 1212 is opposite to the total reflection surface 1211 and faces the substrate 11.

[0040] The lens 122 is, for example, a chip-on-board package lens 122 (COB lens), and is, for example, integrally formed with the optical transmission seat 121. The lens 122 is disposed on the bottom surface 1212. That is, the bottom surface 1212 is located between the total reflection surface 1211 and the lens 122. The light-emitting element 13 is disposed on the substrate 11, and is, for example, located within the projection range of the optical transmission seat 121 onto the substrate 11, and the lens 122 of the optical module 12 corresponds to the light-emitting element 13. The light-emitting element 13 is used to emit light having an optical signal toward the lens 122, and the lens 122 receives the light and emits the light to the total reflection surface 1211.

[0041] The optical fiber connector 14 is, for example, an LC (Lucent connector / Local connector) type connector. The optical fiber connector 14 is connected to the optical transmission connector 121 and, for example, is integrally formed with the optical transmission connector 121. The optical fiber connector 14 has a slot 141. The slot 141 is used for plugging the optical fiber 20. The total reflection surface 1211 is used to reflect the light emitted by the lens 122 to the optical fiber 20. In this way, the optical module 12 guides the light emitted by the light-inducing element 13 to be reflected to the optical fiber 20 to transmit the optical signal to the outside.

[0042] The metal connector 15 is, for example, injection molded. The metal connector 15 is connected to the optical transmission seat 121 and, for example, welded to the substrate 11. In detail, the metal connector 15 includes a bottom side 151 and a top side 152. The bottom side 151 is connected to the substrate 11, for example, by laser welding, and has a hollow portion 1511. At least part of the bottom side 151 is separated from the substrate 11 by the hollow portion 1511, so that the metal connector 15 will not be in electrical contact with the circuit (not shown) disposed on the substrate 11, thereby preventing the circuit from being interfered by the metal connector 15 when transmitting signals.

[0043] The top side 152 is opposite to the bottom side 151 and has a structural reinforcement portion 1521. The metal connector 15 can be more firmly connected to the optical transmission seat 121 by providing the structural reinforcement portion 1521. The structural reinforcement portion 1521 has a clearance gap 15211. At least part of the optical transmission seat 121 is located in the clearance gap 15211 to facilitate the connection between the optical transmission seat 121 and the metal connector 15.

[0044] In this embodiment, the metal connector 15 is connected to the optical transmission seat 121 and laser welded to the substrate 11. The advantage is that the optical transmission seat 121 can be more effectively positioned, thereby improving the packaging accuracy of the optical module 12. In addition, compared with packaging the optical module 12 by general gluing, laser welding can reduce the time by about 3 to 4 times, so the manufacturing process of the electronic device 10 can be more efficient.

[0045] In this embodiment, the number of optical modules 12, the number of light emitting elements 13, the number of metal connectors 15, and the number of optical fiber connectors 14 are each two, but the present invention is not limited thereto. In other embodiments, the number of optical modules, the number of light emitting elements, the number of metal connectors, and the number of optical fiber connectors may each be only one or more than three.

[0046] In this embodiment, the light emitting element 13 is located within the projection range of the light transmission seat 121 projected onto the substrate 11, and the lens 122 of the optical module 12 corresponds to the light emitting element 13, but the present invention is not limited thereto. In other embodiments, the light emitting element may also be located outside the projection range of the light transmission seat projected onto the substrate, and the lens of the optical module corresponds to the light emitting element.

[0047] In this embodiment, the bottom side 151 of the metal connector 15 is connected to the substrate 11 by laser welding, but the present invention is not limited thereto. In other embodiments, the bottom side of the metal connector can also be connected to the substrate by other welding methods such as lead-tin alloy or solder.

[0048] Please also read Figure 4 . Figure 4 To present light Figure 1 1 is a cross-sectional schematic diagram of a path in an electronic device. In this embodiment, when an optical signal needs to be transmitted through the electronic device 10, first, the light emitting element 13 converts the electronic signal into an optical signal and emits light toward the lens 122 along direction A. Then, after receiving the light, the lens 122 emits the received light toward the total reflection surface 1211 along direction B. Then, the total reflection surface 1211 reflects the light emitted from the lens 122 along direction C to the optical fiber 20 plugged into the optical fiber connector 14 to transmit the optical signal to the outside.

[0049] See also Figures 5 to 7 . Figure 5 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a second embodiment of the present invention. Figure 6 for Figure 5 Exploded diagram of the electronic device. Figure 7 for Figure 5 A schematic cross-sectional view of an electronic device.

[0050] The electronic device 10A of the present embodiment is similar to the electronic device 10 of the first embodiment, so the differences between the present embodiment and the first embodiment will be described below, and the similarities will not be repeated. The electronic device 10A of the present embodiment includes a substrate 11, two optical modules 12A, two light-emitting elements 13, two optical fiber connectors 14A, and two metal connectors 15. Since the structures of the two optical modules 12A, the two light-emitting elements 13, the two optical fiber connectors 14A, and the two metal connectors 15 are the same, the following description is based on one of the optical modules 12A, one of the light-emitting elements 13, one of the optical fiber connectors 14A, and one of the metal connectors 15.

[0051] The optical module 12A includes an optical transmission seat 121A and a lens 122. The optical transmission seat 121A includes a first seat body 121A1 and a second seat body 121A2. The first seat body 121A1 is connected to the second seat body 121A2. The metal connector 15 surrounds the second seat body 121A2, and at least part of the first seat body 121A1 is connected to the top side 152 of the metal connector 15. In addition, the optical fiber connector 14A is, for example, an MT (Mechanical Transfer) type connector. The optical fiber connector 14A is connected to the second seat body 121A2, and is, for example, integrally formed with the second seat body 121A2. The optical fiber connector 14A has a slot 141A.

[0052] The first base body 121A1 has a bottom surface 1212. The second base body 121A2 has a total reflection surface 1211. The total reflection surface 1211 is not parallel to the bottom surface 1212, and the bottom surface 1212 faces away from the total reflection surface 1211 and faces the substrate 11. The lens 122 is disposed on the bottom surface 1212 of the first base body 121A1. In other words, the bottom surface 1212 is located between the total reflection surface 1211 and the lens 122. In this way, the lens 122 disposed on the first base body 121A1 in the optical module 12 guides the light having the optical signal emitted by the light-emitting element 13 to be reflected by the total reflection surface 1211 of the second base body 121A2 to the optical fiber 20A plugged into the optical fiber connector 14A, so as to transmit the optical signal to the outside.

[0053] Please also read Figure 8 . Figure 8 for Figure 5 In this embodiment, the optical transmission seat 121A includes the first seat body 121A1 and the second seat body 121A2. When the lens 122 of the optical module 12A needs to be repaired or replaced, only the first seat body 121A1 and the optical fiber connection seat 14A need to be disassembled along the direction D, and the lens 122 disposed on the second seat body 121A2 can be repaired or replaced without disassembling the entire optical transmission seat 121A. In this way, the convenience of repairing or replacing the lens 122 can be improved.

[0054] According to the electronic device of the above embodiment, since the metal connector is connected to the optical transmission seat and welded to the substrate, the optical transmission seat can be more effectively positioned, thereby improving the packaging accuracy of the optical module. In addition, compared with packaging the optical module by general gluing, the welding method can reduce the time by about 3 to 4 times, so the process of the electronic device can be more efficient.

Claims

1. An electronic device, characterized in that: Include: a substrate; At least one optical module, comprising: A light transmission seat is disposed on the substrate, the light transmission seat has a total reflection surface and a bottom surface, the total reflection surface is not parallel to the bottom surface, and the bottom surface is opposite to the total reflection surface and faces the substrate; as well as a lens disposed on the bottom surface; and At least one metal connecting piece is connected to the light transmission seat and welded to the base plate.

2. The electronic device according to claim 1, wherein: It further comprises a light emitting element, which is arranged on the substrate and the lens corresponds to the light emitting element. The light emitting element is used to emit a light toward the lens. After the lens receives the light and emits the light to the total reflection surface, the total reflection surface reflects the light.

3. The electronic device according to claim 2, wherein: The at least one metal connecting member includes a bottom side and a top side, the bottom side is welded to the substrate and has a hollow portion, at least part of the bottom side is separated from the substrate by the hollow portion, the top side is opposite to the bottom side, and at least part of the light transmission seat is connected to the top side, the top side has a structural reinforcement portion, the structural reinforcement portion has a clearance gap, and at least part of the light transmission seat is located in the clearance gap.

4. The electronic device as claimed in claim 3, characterized in that: It further comprises at least one optical fiber connection seat, which is connected to the optical transmission seat and has a slot for plugging the at least one optical fiber. The total reflection surface reflects the light to the at least one optical fiber.

5. The electronic device as claimed in claim 4, characterized in that: The optical transmission seat includes a first seat body and a second seat body, the first seat body is connected to the second seat body, the at least one metal connecting member surrounds the second seat body, and at least a portion of the first seat body is connected to the top side of the at least one metal connecting member, the at least one optical fiber connection seat is arranged on the second seat body, the first seat body has the bottom surface, and the second seat body has the total reflection surface.

6. The electronic device as claimed in claim 4, characterized in that: The optical fiber connector is an LC type connector.

7. The electronic device as claimed in claim 4, characterized in that: The optical fiber connector is an MT type connector.

8. The electronic device as claimed in claim 1, wherein: The at least one metal connecting piece is connected to the substrate through laser welding, lead-tin alloy or soldering.

9. The electronic device as claimed in claim 1, wherein: The at least one metal connecting piece is injection molded.

10. The electronic device according to claim 1, wherein: The at least one optical module is formed by injection molding of plastic material.

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