Optical module

Abstract

The invention discloses an optical module, which comprises a circuit board provided with a base mounting part, and a base covering part of the base mounting part. The base is arranged on the lower surface of the circuit board. The upper surface of the bearing platform of the base protrudes to form a protruding part. The light receiving component is located on the upper surface of the base. And the light emitting component is positioned on the lower surface of the base and is positioned at the base mounting part. And the base mounting part is used for mounting and avoiding the light emitting component. The bottom surface of the first concave part is concave relative to the lower surface of the bearing platform, so that an electric connecting line between the light emitting component and the circuit board is shortest. The hot surface of a semiconductor cooler of the light emitting component is connected with positive and negative power supply wires, conductive pins are arranged on the upper surface of the circuit board and located at the third notch, and the positive and negative power supply wires on the hot surface of the semiconductor cooler are connected with the conductive pin wires.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] Optical communication technology is used in new business models and application models such as cloud computing, mobile Internet, and video. In optical communication, optical modules are tools for converting photoelectric signals into each other and are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have made great progress.

[0003] The optical module is equipped with an optical transmitting component for converting electrical signals into optical signals and an optical receiving component for converting optical signals into electrical signals. In the current 800G optical module solution, the main device is usually a 100G EML laser as the optical transmitting device. The existing 800G QSFPDD 2xFR4 is mainly hard-connected, and the hard-connected method cannot be directly applied to OSFQ packaging. Summary of the invention

[0004] The present application provides an optical module to achieve a soft connection between an optical emitting component and an optical port adapter of the module, thereby facilitating the assembly of the optical module.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] On the one hand, an embodiment of the present application discloses an optical module, including:

[0007] A circuit board having a base mounting portion;

[0008] A base is located above the circuit board, and the base includes:

[0009] Carrying platform;

[0010] A raised portion, the upper surface of which is raised upward relative to the bearing platform;

[0011] A first recessed portion, located on the lower surface of the carrying platform, wherein the first recessed portion is recessed upward relative to the carrying platform;

[0012] A third notch is located at one side of the carrying platform, and the first recessed portion is connected to the third notch;

[0013] A light receiving component, located on the upper surface of the base;

[0014] A light emitting component is located on the lower surface of the base, and the light emitting component is located on the base mounting portion;

[0015] Wherein, the light emitting component comprises: a semiconductor cooler, located in the first recessed portion; a power supply wire is provided on the hot surface of the semiconductor cooler;

[0016] A conductive pin is provided on the upper surface of the circuit board, and the conductive pin is located at the third notch.

[0017] The power supply wire of the semiconductor cooler is connected to the conductive pin.

[0018] In a second aspect, an embodiment of the present application discloses another optical module, including: a circuit board having a base mounting portion;

[0019] A base is located above the circuit board, and the base includes:

[0020] Carrying platform;

[0021] A raised portion, the upper surface of which is raised upward relative to the bearing platform;

[0022] A first recessed portion, located on the lower surface of the carrying platform, wherein the first recessed portion is recessed upward relative to the carrying platform;

[0023] A third notch is located at one side of the carrying platform, and the first recessed portion is connected to the third notch;

[0024] A light receiving component, located on the upper surface of the base;

[0025] A light emitting component is located on the lower surface of the base, and the light emitting component is located on the base mounting portion;

[0026] Wherein, the light emitting component comprises: a semiconductor refrigerator, located in the first recessed portion; the semiconductor refrigerator is provided with a power supply wire;

[0027] A conductive pin is provided on the upper surface of the circuit board, and the conductive pin is located at the third notch so that the conductive pin is exposed;

[0028] The power supply wires of the semiconductor cooler are located above the conductive pins.

[0029] Compared with the prior art, the present invention has the following advantages:

[0030] The present application discloses an optical module, including: a base mounting portion is provided on its circuit board, and the base mounting portion covers part of the base. The base is arranged on the lower surface of the circuit board. The upper surface of the bearing platform of the base is raised to form a raised portion. The light receiving component is located on the upper surface of the base. The light emitting component is located on the lower surface of the base, and the light emitting component is located at the base mounting portion. The base mounting portion is used for the installation avoidance of the light emitting component. The bottom surface of the first recessed portion is recessed relative to the lower surface of the bearing platform, so that the electrical connection line between the light emitting component and the circuit board is the shortest. The light emitting component includes: a semiconductor refrigerator, which is located in the first recessed portion; a power supply wire is connected to the hot surface of the semiconductor refrigerator; a conductive pin is provided on the upper surface of the circuit board, and the conductive pin is located at the third notch, and the power supply wire is connected to the conductive pin wire. In the present application, the light receiving component and the light emitting component are respectively located on both sides of the base, and the optical fiber connector of the light emitting component is connected to the adapter of the optical port through the optical fiber, so as to realize the soft connection between the light emitting component and the optical port, and the overall structure is simple and easy to assemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0032] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0033] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0034] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0035] Figure 4 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0036] Figure 5 The structure of the light receiving component, the light emitting component and the circuit board provided according to some embodiments of the present disclosure is shown in FIG. Figure 1 ;

[0037] Figure 6 The structure of the light receiving component, the light emitting component and the circuit board provided according to some embodiments of the present disclosure is shown in FIG. Figure 2 ;

[0038] Figure 7 A cross-sectional schematic diagram of a light receiving component, a light emitting component and a circuit board provided according to some embodiments of the present disclosure;

[0039] Fig. 8A An exploded schematic diagram of a light receiving component, a light emitting component and a circuit board provided according to some embodiments of the present disclosure;

[0040] Figure 8B A schematic diagram of a base and a circuit board structure provided according to some embodiments of the present disclosure;

[0041] Fig. 9 It is a schematic diagram of the exploded view of the base and the light receiving component provided according to some embodiments of the present disclosure;

[0042] Fig.10 A schematic diagram of a base structure provided according to some embodiments of the present disclosure Figure 1 ;

[0043] Fig.11 A schematic diagram of a base and a light emitting component provided according to some embodiments of the present disclosure;

[0044] Fig.12 A schematic cross-sectional view of a base and a light emitting component provided according to some embodiments of the present disclosure;

[0045] Fig.13 A schematic diagram of a base structure provided according to some embodiments of the present disclosure Figure 3 ;

[0046] Fig.14 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 1 ;

[0047] Fig.15 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 2 . DETAILED DESCRIPTION

[0048] Some embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. However, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0049] Unless the context requires otherwise, throughout the specification and claims, the term "comprising" is to be interpreted as having an open, inclusive meaning, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" implies open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps; descriptions such as "parallel", "perpendicular", "same", "consistent", and "flush" are not limited to absolute mathematical theoretical relationships, but also include an acceptable error range generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0050] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0051] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0052] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure. Figure 1As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0053] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0054] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0055] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0056] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0057] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0058] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0059] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0060] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0061] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0062] Figure 2 1 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0063] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0064] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 3 and Figure 4As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0065] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0066] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 is covered on the two lower side plates of the lower shell 202 to form the above-mentioned shell.

[0067] In some embodiments, the lower shell 202 includes a bottom plate 2021 and a first lower side plate 2022 and a second lower side plate 2023 located on both sides of the bottom plate 2021 and perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and perpendicular to the cover plate 2011, and the two upper side plates are combined with the two lower side plates to achieve the upper shell 201 covering the lower shell 202.

[0068] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0069] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0070] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0071] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0072] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0073] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0074] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0075] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0076] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0077] The light emitting component 400 and / or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board. In some embodiments, the light emitting component 400 and the light receiving component 500 are respectively located on the upper and lower surfaces of the circuit board.

[0078] In order to make full use of the limited space, the existing 800G QSFPDD 2xFR4 is mainly hard-connected, that is, the optical emitting component 400 and the optical receiving component 500 are connected to the optical fiber adapter. In the OSFQ package, the optical emitting component 400 and the optical receiving component 500 are required to be connected to the optical fiber first, and the optical fiber has an optical fiber adapter at the optical port position. The present application provides an optical module, in which the optical emitting component 400 and the optical receiving component 500 are arranged on both sides of the base, the base is embedded in the circuit board, and the coupling connection with the optical fiber is realized, and then the soft connection is realized through the optical fiber and the optical port of the optical module. Through this design, the same optical and module structure design is realized, which can be applied to the QSFP-DD packaging method and the OSFP packaging method, and the requirements of the FR4 and LR4 optical modules for loss and sensitivity are met at the same time. Because the structure realizes the optical design of the transmitting and receiving ends as much as possible, and unifies different product packaging platforms (such as QSFP-DD and OSFP) and product standards (FR4 and LR4) in one optical and structural design, the assembly process is simplified, the cost of materials and components is reduced, and it is easier to achieve batch and low-cost goals. By rationally arranging optical components and optimizing the assembly process, the overall assembly of the module is greatly simplified, the production efficiency and maintenance efficiency are greatly improved, and it is more suitable for mass production.

[0079] Figure 5 The structure of the light receiving component, the light emitting component and the circuit board provided according to some embodiments of the present disclosure is shown in FIG. Figure 1 . Figure 6 The structure of the light receiving component, the light emitting component and the circuit board provided according to some embodiments of the present disclosure is shown in FIG. Figure 2 . Figure 5 and Figure 6 Schematic diagrams of the structures of the light receiving component, the light emitting component and the circuit board at different angles. Figure 7 It is a cross-sectional schematic diagram of a light receiving component, a light emitting component and a circuit board provided according to some embodiments of the present disclosure. Fig. 8A Schematic diagram of an exploded view of a light receiving component, a light emitting component and a circuit board provided according to some embodiments of the present disclosure. Figure 5 , Figure 6 , Figure 7 and Fig. 8A As shown, the optical module further includes a base 900, the light receiving component 500 is located above the base, and the light emitting component 400 is located below the base 900. The circuit board 300 is provided with a base mounting portion 303, and the base 900 is located above the base mounting portion 303. The light receiving component 500 is located above the base 900, and the light emitting component 400 is located below the base 900.

[0080] For the convenience of description, in the following description, the X-axis direction in the figure is defined as the length direction of the optical module, the Y-axis direction in the figure is defined as the width direction of the optical module, and the Z-axis direction is defined as the height direction of the optical module.

[0081] Figure 8B Schematic diagram of the base and circuit board structure provided according to some embodiments of the present disclosure, such as Figure 8B As shown, in some embodiments of the present application, the base mounting portion 303 is a hollow structure of the circuit board 300, and the base mounting portion 303 includes a first mounting portion 3031 and a second mounting portion 3032, and the width of the second mounting portion 3032 is greater than the width of the first mounting portion 3031. The first mounting portion 3031 is adjacent to the optical port position, and the second mounting portion 3032 is adjacent to the electrical port position.

[0082] A DSP chip is disposed on the upper surface of the circuit board 300 , the light receiving component 500 is located on the upper surface of the base, and the light emitting component 400 is located on the lower surface of the base 900 .

[0083] The width of the base 900 is greater than the width of the second mounting portion 3032 , and the base 900 is located on the upper surface of the circuit board 300 . The base 900 covers the second mounting portion 3032 .

[0084] The base 900 does not completely cover the first installation portion 3031 , and a gap of part of the first installation portion 3031 is left between the circuit board and the base 900 to facilitate the clamping and installation of the optical fiber connector.

[0085] Fig. 9 It is a schematic diagram of the decomposition of the base and the light receiving component provided according to some embodiments of the present disclosure. Fig.10 A schematic diagram of a base structure provided according to some embodiments of the present disclosure Figure 1 .like Fig. 9 and Fig.10 As shown, the upper surface of the carrying platform 910 of the base 900 is raised to form a raised portion 914 , and the first light receiving component 510 and the second light receiving component are respectively located on both sides of the raised portion 914 .

[0086] The upper surface of the protrusion 914 protrudes upward relative to the upper surface of the carrying platform 910, and one end of the protrusion 914 protrudes from the side wall of the carrying platform 910. The first light receiving component 510 is located on one side of the first side wall 9141 of the protrusion 914, and the second light receiving component 5200 is located on one side of the second side wall 9142 of the protrusion 914. The second side wall 9142 is located on the opposite side of the first side wall 9141.

[0087] In some embodiments, the first light receiving component 510 includes: a first light collimator 511, a first demultiplexer 512, a first lens assembly 513, a first optical chipset 514, and a first transimpedance amplifier 515. The first light collimator 511 and the first demultiplexer 512 are located on the upper surface of the carrying platform 910 and on one side of the first side wall 9141. The first lens assembly, the first optical chipset, and the first transimpedance amplifier are located on the upper surface of the circuit board 300.

[0088] For the convenience of assembly, the first side wall 9141 positions the first optical collimator 511 and the first demultiplexer 512, and the first optical collimator 511 and the first demultiplexer 512 are connected to the upper surface of the carrying platform 910. The first lens assembly includes: a first coupling substrate, a first converging lens group and a first reflecting prism. The first coupling substrate is located on the upper surface of the circuit board, and provides a suitable installation height for the first converging lens group and the first reflecting prism, so that the height of the central axis of the first converging lens group and the first reflecting prism is consistent with the height of the first optical collimator 511 and the first demultiplexer 512, so as to achieve optical path coupling.

[0089] The first optical collimator 511 is connected to the optical fiber adapter through an optical fiber, receives signal light from the outside and collimates the signal light. The first demultiplexer 512 demultiplexes the signal light from the first optical collimator 511 to form signal light with different wavelengths. The first converging lens group converges the demultiplexed signal light, and the first reflecting prism reflects the converged light to the first optical chip group 514. The first optical chip group 514 converts the optical signal into an electrical signal and transmits it to the first transimpedance amplifier 515.

[0090] In some embodiments, the second light receiving component 520 includes: a second light collimator 521, a second demultiplexer 522, a second lens assembly 523, a second optical chipset 524, and a second transimpedance amplifier 525. The second light collimator 521 and the second demultiplexer 522 are located on the upper surface of the carrying platform 910 and on one side of the second side wall 9142. The second lens assembly, the second optical chipset, and the second transimpedance amplifier are located on the upper surface of the circuit board 300.

[0091] In order to facilitate assembly, the second side wall 9142 forms a position for the second demultiplexer 522, and the second optical collimator 521 and the second demultiplexer 522 are connected to the upper surface of the carrying platform 910. In order to unify the optical center axis of the second optical collimator 521, the second demultiplexer 522, and the second lens assembly, the second lens assembly includes: a second coupling substrate, a second converging lens group, and a second reflecting prism. The second coupling substrate is located on the upper surface of the circuit board, and provides a mounting platform for the second converging lens group and the second reflecting prism, so that the height of the center axis of the second converging lens group and the second reflecting prism is consistent with the height of the second optical collimator 521 and the second demultiplexer 522, so as to achieve optical path coupling.

[0092] The second optical collimator 521 is connected to the optical fiber adapter through an optical fiber, receives the signal light from the outside and collimates the signal light. The second demultiplexer 522 demultiplexes the signal light from the second optical collimator 521 to form signal lights with different wavelengths. The second converging lens group converges the demultiplexed signal light, and the second reflecting prism reflects the converged light to the second optical chip group 524. The second optical chip group 524 converts the optical signal into an electrical signal and transmits it to the second transimpedance amplifier 525.

[0093] In some embodiments, the first converging lens group and the second converging lens group may be disposed on a base or on a circuit board.

[0094] The carrying platform 910 is provided with a first notch 911 , and the edge of the first notch 911 limits the first light collimator 511 in the length direction.

[0095] The carrying platform 910 is provided with a second notch 912 , and the edge of the second notch 912 limits the second light collimator 521 in the length direction.

[0096] In some embodiments, the carrying platform 910 is further provided with a third notch 913 , and the third notch 913 is located below the first demultiplexer 512 . The third notch 913 facilitates positioning and observation during the installation process of the base and the circuit board.

[0097] Fig.11 Schematic diagram of a base and a light emitting component provided according to some embodiments of the present disclosure. Fig.12It is a schematic cross-sectional view of a base and a light emitting component provided according to some embodiments of the present disclosure. Fig.13 A schematic diagram of a base structure provided according to some embodiments of the present disclosure Figure 3 .like Fig.11 , Fig.12 , Fig.13 As shown, the lower surface of the base 900 is recessed to form a first recessed portion 915, and the lower surface of the base 900 is in contact with the upper surface of the circuit board. The bottom surface of the first recessed portion 915 is recessed relative to the lower surface of the carrying platform 910 to minimize the electrical connection line between the light emitting component and the circuit board.

[0098] In some embodiments, the first recessed portion 915 is connected to the third notch 913 to facilitate observation and positioning from the third notch 913 during installation.

[0099] To shorten the connection between the light emitting component and the circuit board, the pins of the light emitting component are flush with the lower surface of the circuit board. To achieve avoidance installation of the light emitting component, the first recessed portion 915 is located at the second installation position 3032 .

[0100] The first optical emission component 410 includes: a first optical fiber connector 411, a first converging lens 412, a first multiplexer 413 and a first optical emission assembly 414. The first optical fiber connector 411, the first converging lens 412 and the first multiplexer 413 are located on the lower surface of the carrying platform 910. The first optical emission assembly 414 is located in the first recessed portion 915. A semiconductor refrigerator 417 is also provided above the first optical emission assembly 414. The first recessed portion 915 makes the lower surface of the first optical emission assembly 414 flush with the lower surface of the circuit board 300, thereby shortening the wiring distance between the first optical emission assembly 414 and the circuit board 300.

[0101] The first optical transmission component 414 is electrically connected to the circuit board 300, and the first optical transmission component 414 converts the multi-channel electrical signals into multi-channel optical signals and forms collimated light. The first multiplexer 413 multiplexes the multi-channel optical signals into a beam of multi-wavelength signal light. The multi-wavelength signal light is converged to the first optical fiber connector 411 by the first converging lens 412 and then enters the optical fiber, realizing the soft connection between the optical transmission component and the optical fiber adapter of the module optical port. An optical isolator is arranged inside the first optical fiber connector 411 to simplify the assembly process and also reduce costs.

[0102] In some embodiments, the laser in the first light emitting assembly 414 in the first light emitting component emits scattered light of four different wavelengths, which are collimated by a collimating lens to form four parallel light beams. After being merged into a collimated light beam by a first wavelength division multiplexer, the collimated light beams enter the first converging lens 412 to form a converging light beam that enters the first optical fiber connector 411. The distance between the first converging lens and the first optical fiber connector conforms to the focal length of the converging lens.

[0103] In the optical receiving component, the light emitted by the first collimator is a collimated light beam, which is decomposed into 4 beams by the first demultiplexer, and formed into 4 converging beams by the first lens assembly, and the circuit direction is converted to face the surface of the circuit board. Therefore, the optical path length from the laser to the first optical fiber connector of the first optical emitting component is greater than the optical path length from the optical receiving chip in the first optical receiving component to the first optical collimator.

[0104] In some embodiments of the present application, the area between the first notch 911 and the second notch 912 of the carrier plate 916 protrudes toward the optical port relative to the side wall of the carrier platform 910 , and the carrier plate 916 is used to carry the optical fiber connector.

[0105] The second optical emission component 420 includes: a second optical fiber connector 421, a second converging lens 422, a second multiplexer 423 and a second optical emission assembly 424. The second optical fiber connector 421, the second converging lens 422 and the second multiplexer 423 are located on the lower surface of the carrying platform 910. The second optical emission assembly 424 is located in the first recessed portion 915. A semiconductor refrigerator 417 is also provided above the second optical emission assembly 424. The first recessed portion 915 makes the lower surface of the second optical emission assembly 424 flush with the lower surface of the circuit board 300, shortening the wiring distance between the second optical emission assembly 424 and the circuit board 300. The second optical fiber connector is connected to the carrying plate 916.

[0106] In some embodiments of the present application, the protrusion 914 is thermally connected to the upper housing. The first light emitting assembly and the second light emitting assembly are the main heat sources of the optical module, and the heat emitted by them is transferred to the upper housing through the protrusion 914 to improve the heat dissipation effect of the optical module.

[0107] In some embodiments, the first fiber adapter is connected to the first fiber connector, the second fiber adapter is connected to the second fiber connector, the third fiber adapter is connected to the first optical collimator, and the fourth fiber adapter is connected to the second optical collimator.

[0108] The first optical emitting component includes four lasers, and the second optical emitting component includes four lasers. The first wavelength division multiplexer combines the light emitted by the four lasers in the first optical emitting component into one beam, and sends it out through the first optical fiber adapter. The second wavelength division multiplexer combines the light emitted by the four lasers in the second optical emitting component into one beam, and sends it out through the second optical fiber adapter.

[0109] The light beam carried in the third optical fiber adapter is divided into four beams by the first demultiplexer and received by four optical receiving chips. The light beam carried in the fourth optical fiber adapter is divided into four beams by the second demultiplexer and received by four optical receiving chips.

[0110] In some embodiments, the first fiber optic adapter, the third fiber optic adapter, the second fiber optic adapter and the fourth fiber optic adapter may be arranged sequentially at the same height, or may be presented in two rows, such as the first fiber optic adapter and the third fiber optic adapter are respectively located above the second fiber optic adapter and the fourth fiber optic adapter.

[0111] The base mounting portion 303 provides a space for mounting the light emitting component.

[0112] Fig.14 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 1 ; Fig.15 A schematic diagram of a partial cross-sectional structure of an optical module provided according to some embodiments of the present application Figure 2 .like Fig.14 and Fig.15 As shown, in some embodiments of the present application, the hot surface of the semiconductor cooler 417 is connected to positive and negative power wires, and is led out from the third notch 913; the upper surface of the circuit board is provided with conductive pins, and the positive and negative power wires are connected to the conductive pin wires. In some embodiments, the conductive pins are located at the third notch 913, and the conductive pins are located above the power wires.

[0113] In the present application, the hot surface of the semiconductor cooler is the side adjacent to the light emitting chip.

[0114] A substrate 418 is provided between the semiconductor cooler 417 and the first recessed portion 915. The substrate is provided with a circuit and is electrically connected to other parts of the semiconductor cooler 417. One end of the substrate 418 extends into the third notch and is located below the circuit board 300. The hot surface of the semiconductor cooler is connected with a positive power supply wire and a negative power supply wire. A positive pin and a negative pin are provided on the upper surface of the circuit board. The third notch 913 allows the positive power supply wire 4181 and the negative power supply wire 4182 to be led out from the bottom of the circuit board. The positive pin is electrically connected to the positive power supply wire, and the negative pin is conductively connected to the negative power supply wire.

[0115] The present application provides an optical module, whose circuit board is provided with a base mounting portion, and the base covers part of the base mounting portion. The base is arranged on the lower surface of the circuit board. The upper surface of the bearing platform 910 of the base 900 is raised to form a raised portion 914, and the first light receiving component 510 and the second light receiving component are respectively located on both sides of the raised portion 914. The lower surface of the base 900 is recessed to form a first recessed portion 915, and the lower surface of the base 900 is in contact and connected with the upper surface of the circuit board. The bottom surface of the first recessed portion 915 is recessed relative to the lower surface of the bearing platform 910, so that the electrical connection line between the light emitting component and the circuit board is as short as possible. The bearing platform 910 is also provided with a third notch 913, and the first recessed portion 915 is connected to the third notch 913, so as to facilitate the observation and positioning from the third notch 913 during the installation process.

[0116] In the present application, the first optical chipset 514, the first transimpedance amplifier 515, the second optical chipset 524, and the second transimpedance amplifier 525 are fixed at the position of the circuit board. During the installation process, the base, the first optical emission component, and the second optical emission component can be connected first, and then the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer are connected to the base to form a transceiver component. The base provides an installation platform for the first optical emission component, the second optical emission component, the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer. Then the transceiver component is positioned and connected to the circuit board, and the first lens assembly and the second lens assembly are installed according to the positional relationship between the base and the circuit board.

[0117] The base, the first optical transmission component, and the second optical transmission component are connected, and then the first optical collimator, the first demultiplexer, the second optical collimator, and the second demultiplexer are connected to the base to form a transceiver component. As an integral component, the transceiver component is easy to install and can be applied to a variety of optical modules.

[0118] The light emitting component is designed for reverse assembly, so that the bonding surface height of the light emitting component is the same as the lower surface of the circuit board during assembly, so that the connection wire between the two is as short as possible to ensure excellent high-frequency transmission performance. The light emitting component is designed for reverse assembly, and the base is used as a heat sink for the laser and semiconductor cooler, directly contacting the upper cover of the optical module, forming a more direct and efficient heat transfer channel.

[0119] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0120] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: A circuit board having a base mounting portion; A base is located above the circuit board, and the base includes: Carrying platform; A raised portion, the upper surface of which is raised upward relative to the bearing platform; A first recessed portion, located on the lower surface of the carrying platform, wherein the first recessed portion is recessed upward relative to the carrying platform; A third notch is located at one side of the carrying platform, and the first recessed portion is connected to the third notch; A light receiving component, located on the upper surface of the base; A light emitting component is located on the lower surface of the base, and the light emitting component is located at the base mounting portion; Wherein, the light emitting component comprises: A semiconductor refrigerator is located in the first recessed portion; a power supply wire is provided on the hot surface of the semiconductor refrigerator; a conductive pin is provided on the upper surface of the circuit board, and the power supply wire is connected to the conductive pin wire.

2. The optical module according to claim 1, characterized in that: The light receiving components include: A first light collimator; A first demultiplexer, the first optical collimator and the first demultiplexer are located on the carrying platform, and the first optical collimator and the first demultiplexer are located on one side of the protruding portion; a second light collimator; The second demultiplexer, the second optical collimator and the second demultiplexer are located on the carrying platform, and the second optical collimator and the second demultiplexer are located on the other side of the protruding portion.

3. The optical module according to claim 1 or 2, characterized in that: Also includes: a first lens assembly; One end of the protruding portion protrudes from the side wall of the carrying platform; and the first lens assembly is located at one side of the protruding portion.

4. The optical module according to claim 1, characterized in that: The light emitting component comprises: A first light emitting component is located below the semiconductor refrigerator; A first multiplexer, located on the lower surface of the carrying platform, multiplexes the light emitted by the first optical emitting assembly; A first converging lens, located on the lower surface of the carrying platform and in the light emitting direction of the first multiplexer; A first optical fiber connector, having an optical isolator built therein, wherein the first optical fiber connector is connected to the optical fiber; The base is provided with a bearing plate, and the first optical fiber connector is connected to the bearing plate.

5. The optical module according to claim 4, characterized in that: The two sides of the bearing plate are respectively provided with a first notch and a second notch: The light receiving component comprises: a first light collimator and a second light collimator, the side edge of the first notch limits the first light collimator, and the side edge of the second notch limits the second light collimator.

6. An optical module, characterized in that: include: A circuit board having a base mounting portion; A base is located above the circuit board, and the base includes: Carrying platform; A raised portion, the upper surface of which is raised upward relative to the bearing platform; A first recessed portion, located on the lower surface of the carrying platform, wherein the first recessed portion is recessed upward relative to the carrying platform; A third notch is located at one side of the carrying platform, and the first recessed portion is connected to the third notch; A light receiving component, located on the upper surface of the base; A light emitting component is located on the lower surface of the base, and the light emitting component is located on the base mounting portion; Wherein, the light emitting component comprises: a semiconductor cooler, located in the first recessed portion; a power supply wire is provided on the hot surface of the semiconductor cooler; The upper surface of the circuit board is provided with a conductive pin, which is located at the third notch so that the conductive pin is exposed; the hot surface of the semiconductor cooler is located above the conductive pin, and the power supply wire is connected to the conductive pin.

7. The optical module according to claim 6, characterized in that: The light receiving components include: A first light collimator; A first demultiplexer, the first optical collimator and the first demultiplexer are located on the carrying platform, and the first optical collimator and the first demultiplexer are located on one side of the protruding portion; a second light collimator; The second demultiplexer, the second optical collimator and the second demultiplexer are located on the carrying platform, and the second optical collimator and the second demultiplexer are located on the other side of the protruding portion.

8. The optical module according to claim 6 or 7, characterized in that: Also includes: a first lens assembly; One end of the protruding portion protrudes from the side wall of the carrying platform; and the first lens assembly is located at one side of the protruding portion.

9. The optical module according to claim 6, characterized in that: The light emitting component comprises: A first light emitting component is located below the semiconductor refrigerator; A first multiplexer, located on the lower surface of the carrying platform, multiplexes the light emitted by the first optical emitting assembly; A first converging lens, located on the lower surface of the carrying platform and in the light emitting direction of the first multiplexer; The first optical fiber connector has an optical isolator built in it, and the first optical fiber connector is connected to the optical fiber.

10. The optical module according to claim 6, characterized in that: Also includes: Upper shell; A lower shell, which is covered with the upper shell to form a shell; A circuit board is located between the upper housing and the lower housing; The upper surface of the protrusion is thermally connected to the upper shell.

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