Optical module and preparation method thereof

Abstract

The invention provides an optical module and a preparation method of the optical module. A preparation method of an optical module comprises the following steps: providing a plug and a socket; the plug comprises an optical fiber array; the socket comprises an optical chip base; the plug is detachably connected with the socket; the plug and the socket are detached and are in a separated state; the plug and the socket are fixedly connected and are in a butt joint state; if the plug and the socket are in a separated state, packaging an optical chip on the optical chip base in a welding manner; if the plug and the socket are in the butt joint state, the plug and the socket are detached to be in a separated state, and then an optical chip is packaged on the optical chip base in a welding mode. In the process of packaging the optical chip, the plug and the socket are in a separated state, so that the plug provided with the optical fiber array is prevented from being placed in a high-temperature environment, the position deviation of optical fibers in the optical fiber array is avoided, and the coupling failure of the optical fiber array and the optical waveguide is prevented.

Description

Technical Field

[0001] The present application relates to the field of optical modules, and specifically to an optical module and a method for preparing the optical module. Background Art

[0002] As the transmission rate requirements of optical modules become higher and higher, the traditional gold wire bonding chip packaging method limits the improvement of bandwidth. The optical chip welding packaging method can realize the transmission of high-frequency signals of the chip, such as flip-chip welding. However, during the optical chip welding process, the coupling between the optical fiber array and the optical waveguide is prone to failure. Summary of the invention

[0003] Multiple embodiments of the present application provide an optical module and a method for preparing the optical module that can effectively prevent coupling failure between an optical fiber array and an optical waveguide.

[0004] In one aspect, the present application provides a method for preparing an optical module, the method comprising:

[0005] A plug and a socket are provided; the plug includes an optical fiber array; the socket includes an optical chip base; the plug and the socket are detachably connected; the plug and the socket are detached and in a separated state; the plug and the socket are fixedly connected and in a docking state;

[0006] If the plug and the socket are in a separated state, the optical chip is packaged on the optical chip base by welding; if the plug and the socket are in a docked state, the plug and the socket are disassembled to a separated state, and then the optical chip is packaged on the optical chip base by welding.

[0007] In some embodiments, the optical chip is packaged on the optical chip base by flip-chip bonding.

[0008] In some embodiments, the plug further includes a first alignment structure; the optical fiber array is fixedly disposed on the first alignment structure; the socket further includes a second alignment structure fixedly disposed on the optical chip base;

[0009] The method further comprises:

[0010] If the plug and the socket are in a docking state, a first optical waveguide and a second optical waveguide are formed on the first alignment structure and the second alignment structure respectively; if the plug and the socket are in a separated state, the plug and the socket are fixedly connected so that the plug and the socket are in a docking state, and then the first optical waveguide and the second optical waveguide are formed on the first alignment structure and the second alignment structure respectively; wherein, when the plug and the socket are in a docking state, the first optical waveguide and the second optical waveguide are coupled and connected.

[0011] In some embodiments, the first optical waveguide and the second optical waveguide are formed by femtosecond laser processing.

[0012] In some embodiments, the operation of fixedly connecting the plug and the socket includes:

[0013] A six-axis displacement coupling method is adopted to achieve docking and positioning of the plug and the socket.

[0014] In some embodiments, the first alignment structure is provided with a socket, and the second alignment structure is provided with a plug-in matching the socket; or, the first alignment structure is provided with a plug-in, and the second alignment structure is provided with a socket matching the plug-in;

[0015] The diameter of the jack is larger than the outer diameter of the plug;

[0016] The operation of fixedly connecting the plug and the socket includes:

[0017] The plug-in unit and the socket are bonded to achieve a fixed connection between the plug and the socket.

[0018] In some embodiments, the first optical waveguide has a first end coupled to the second optical waveguide, and the second optical waveguide has a second end coupled to the first optical waveguide;

[0019] The method further comprises:

[0020] A microlens is formed at the first end of the first optical waveguide and the second end of the second optical waveguide by 3D printing.

[0021] On the other hand, the present application further provides an optical module, characterized in that the optical module comprises:

[0022] A plug, comprising an optical fiber array and a first alignment structure; the optical fiber array is fixedly arranged on the first alignment structure;

[0023] A socket, comprising an optical chip base and a second alignment structure fixed on the optical chip base;

[0024] The first alignment structure is provided with a socket, and the second alignment structure is provided with a plug-in matching the socket; or, the first alignment structure is provided with a plug-in, and the second alignment structure is provided with a socket matching the plug-in;

[0025] The plug-in can be fixedly connected to the side wall of the socket so that the plug and the socket are in a docking state; the plug-in can be separated from the side wall of the socket so that the plug and the socket are in a separated state.

[0026] In some embodiments, the length of the plug is greater than the depth of the jack, so that when the plug and the socket are in a docked state, there is a gap between the first alignment structure and the second alignment structure.

[0027] In some embodiments, a first optical waveguide is disposed on the first alignment structure; a second optical waveguide is disposed on the second alignment structure; the first optical waveguide has a first end coupled to the second optical waveguide, and the second optical waveguide has a second end coupled to the first optical waveguide; microlenses are disposed at the first end of the first optical waveguide and the second end of the second optical waveguide; and an optical anti-reflection film is disposed on the surface of the microlens.

[0028] In the multiple embodiments provided in the present application, the plug and the socket can be switched between a docking state and a separation state. Thus, during the process of packaging the optical chip, the plug and the socket can be in a separation state, so as to avoid placing the plug with the optical fiber array in a high temperature environment, avoid the position of the optical fiber in the optical fiber array from being offset, and prevent the coupling failure between the optical fiber array and the optical waveguide. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A flow chart of a method for preparing an optical module provided in one embodiment of the present application.

[0030] Figure 2 A schematic diagram of the structure of an optical module provided in one embodiment of the present application.

[0031] Figure 3 for Figure 2 The cross-sectional view of the optical module is shown along the MM direction.

[0032] Figure 4 for Figure 2 Schematic diagram of the structure of the second alignment structure.

[0033] Figure 5 for Figure 3 A cross-sectional view of a second alignment structure in FIG.

[0034] Figure 6 for Figure 5 A partial enlarged view of middle A.

[0035] Figure 7 for Figure 3 A cross-sectional view of a first alignment structure in FIG.

[0036] Figure 8 for Figure 7 A partial enlarged view of B.

[0037] Description of Reference Numerals

[0038] 110. Plug; 111. Optical fiber array; 112. First alignment structure; 113. First optical waveguide; 114. Jack; 115. First end; 120. Socket; 121. Optical chip base; 1211. Metal frame; 1212. Glass substrate; 122. Second alignment structure; 123. Second optical waveguide; 124. Plug-in; 125. Second end; 130. Optical chip; 140. Microlens. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0040] In the present application, the drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show details of the local features.

[0041] Unless otherwise stated, all technical and scientific terms used in this application have the same meaning as those generally understood by those skilled in the art of the technical field of this application. The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit the scope of this application. The term "and / or" used in this application includes any and all combinations of one or more related listed items. The singular forms of "a", "above", and "the" used in this application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings.

[0042] In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In the description of the present application, the meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0043] In the description of the present application, terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of simplified description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and should not be understood as a limitation on the present application.

[0044] In the description of this application, unless otherwise clearly defined, the terms "install", "connect", "connect", "fix", "set", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In the description of the present application, unless otherwise clearly defined, a first feature being “on”, “above”, “above”, “below”, “below”, “below” or “below” a second feature may mean that the first feature is in direct contact with the second feature, or the first feature and the second feature are in indirect contact with each other through an intermediate medium. Moreover, a first feature being “on”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the horizontal height of the first feature is higher than the horizontal height of the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0046] Researchers have found that, in general, in optical modules, the optical fiber array is fixed by bonding with optical coupling glue. In high temperature environments, the shape of the optical coupling glue is prone to change, causing the position of the optical fiber array to shift or even fall off, which in turn causes the coupling between the optical fiber array and the optical waveguide to fail. In addition, in the optical fiber array, the bare optical fiber is generally fixed by photocuring glue. Similarly, the shape of the photocuring glue is also prone to change in high temperature environments, causing the position of the bare optical fiber in the optical fiber array to shift, which in turn causes the coupling between the optical fiber array and the optical waveguide to fail.

[0047] Based on this, the researchers provide a method for preparing an optical module, including: providing a plug and a socket, the plug including an optical fiber array; the socket including an optical chip base; the plug and the socket are detachably connected; the plug and the socket are detached and in a separated state; the plug and the socket are fixedly connected and in a docked state; when welding the optical chip, the plug and the socket are separated to avoid the plug in which the optical fiber array is set to be placed in a high temperature environment and to avoid the position of the optical fiber in the optical fiber array from being offset, so as to prevent the coupling failure between the optical fiber array and the optical waveguide.

[0048] The following Figures 2 to 8 Taking the optical module shown as an example, the preparation method thereof is described.

[0049] See also Figure 1 , a method for preparing an optical module provided in an embodiment of the present application includes:

[0050] S01. Provide a plug 110 and a socket 120; the plug 110 includes an optical fiber array 111; the socket 120 includes an optical chip base 121; the plug 110 and the socket 120 are detachably connected; the plug 110 and the socket 120 are detached and in a separated state; the plug 110 and the socket 120 are fixedly connected and in a docking state;

[0051] It can be understood that the plug 110 and the socket 120 are in a separated state, which means that the plug 110 and the socket 120 are disconnected, so that the plug 110 and the socket 120 can be stored or operated separately. The plug 110 and the socket 120 are in a docked state, which means that the plug 110 and the socket 120 are fixedly connected and the relative position is fixed, so that in the prepared optical module, the optical fiber array 111 and the optical chip 130 can stably transmit signals.

[0052] S02. If the plug 110 and the socket 120 are in a separated state, the optical chip 130 is packaged on the optical chip base 121 by welding; if the plug 110 and the socket 120 are in a docked state, the plug 110 and the socket 120 are disassembled to a separated state, and then the optical chip 130 is packaged on the optical chip base 121 by welding.

[0053] It is understandable that in step S02 , when the optical chip 130 is being welded and packaged, the plug 110 and the socket 120 are in a separated state.

[0054] In the above-mentioned method for preparing the optical module, the plug 110 and the socket 120 can be switched between a docking state and a separation state. Therefore, during the process of packaging the optical chip 130, the plug 110 and the socket 120 can be in a separation state, so as to avoid placing the plug 110 provided with the optical fiber array 111 in a high temperature environment, avoid the position of the optical fiber in the optical fiber array 111 from being offset, and prevent the coupling failure between the optical fiber array 111 and the optical waveguide.

[0055] In addition, it is understandable that the socket 120 and the plug 110 are detachably connected. Therefore, after the optical chip 130 is welded, the socket 120 and the plug 110 can be fixedly connected to restore the conduction of the optical path.

[0056] Furthermore, the preparation method of the above-mentioned optical module avoids placing the plug 110 for setting the optical fiber array 111 in a high-temperature environment, thereby reducing the performance requirements of the fixing glue used to fix the bare optical fibers in the optical fiber array 111, reducing the performance requirements of the fixing glue used to fix the optical fiber array 111, and reducing the production cost of the optical fiber array 111.

[0057] Furthermore, in the above optical module preparation method, when welding the optical chip 130, it is not necessary to place the plug 110 in the welding position, and only the socket 120 is placed in the welding position, thereby reducing the space required for the welding position. When welding, only the socket 120 is placed in the welding position, which is convenient to operate and can effectively improve welding efficiency.

[0058] Optionally, the optical chip 130 is packaged on the optical chip base 121 by flip-chip welding. Of course, in some embodiments, the welding method of the optical chip 130 is not limited to flip-chip welding, but can also be eutectic welding, hot pressing welding, laser welding or ultrasonic hot pressing welding.

[0059] In this embodiment, the plug 110 further includes a first alignment structure 112 ; the optical fiber array 111 is fixed on the first alignment structure 112 ; and the socket 120 further includes a second alignment structure 122 fixed on the optical chip base 121 .

[0060] The method for preparing the optical module also includes:

[0061] S0a. If the plug 110 and the socket 120 are in a docking state, the first optical waveguide 113 and the second optical waveguide 123 are formed on the first alignment structure 112 and the second alignment structure 122 respectively; if the plug 110 and the socket 120 are in a separated state, the plug 110 and the socket 120 are fixedly connected, and then the first optical waveguide 113 and the second optical waveguide 123 are formed on the first alignment structure 112 and the second alignment structure 122 respectively; wherein, when the plug 110 and the socket 120 are in a docking state, the first optical waveguide 113 and the second optical waveguide 123 are coupled and connected.

[0062] Optionally, the step of forming the first optical waveguide 113 and the second optical waveguide 123 is performed before the step of packaging the optical chip 130. The quality of the optical waveguide can be processed and tested more accurately without interference from the optical chip 130.

[0063] Of course, in some embodiments, the steps of forming the first optical waveguide 113 and the second optical waveguide 123 may be adjusted according to specific processing techniques after the step of packaging the optical chip 130 .

[0064] It can be understood that the first optical waveguide 113 corresponds to the optical fiber in the optical fiber array 111, so the number of the first optical waveguides 113 is multiple and distributed in an array. Correspondingly, the second optical waveguide 123 corresponds to the first optical waveguide 113, so the number of the second optical waveguides 123 is also multiple and distributed in an array.

[0065] The first optical waveguide 113 and the second optical waveguide 123 are formed simultaneously, thereby improving the accuracy of the coupling connection between the first optical waveguide 113 and the second optical waveguide 123 .

[0066] In addition, it can be understood that the first alignment structure 112 and the second alignment structure 122 are used to achieve alignment between the plug 110 and the socket 120. The first optical waveguide 113 and the second optical waveguide 123 are respectively formed on the first alignment structure 112 and the second alignment structure 122, simplifying the structure of the plug 110 and the socket 120.

[0067] Specifically, in this embodiment, the material of the first alignment structure 112 and the second alignment structure 122 is glass.

[0068] Optionally, the first optical waveguide 113 and the second optical waveguide 123 are formed by femtosecond laser processing, which improves the processing accuracy of the first optical waveguide 113 and the second optical waveguide 123, and improves the accuracy of the coupling connection between the first optical waveguide 113 and the second optical waveguide 123 to a precision of hundreds of nanometers, so as to better adapt to the optical waveguide in the optical chip and improve the optical coupling efficiency.

[0069] The operations of fixing the connection between the plug 110 and the socket 120 include:

[0070] S0b. A six-axis displacement coupling method is used to achieve docking and positioning of the plug 110 and the socket 120.

[0071] The six-axis displacement coupling mode has a high positioning accuracy, thereby improving the docking positioning accuracy of the plug 110 and the socket 120 and improving the coupling connection accuracy of the first optical waveguide 113 and the second optical waveguide 123.

[0072] Specifically in this embodiment, a socket 114 is provided on the first alignment structure 112; and a plug 124 matching the socket 114 is provided on the second alignment structure 122. The diameter of the socket 114 is larger than the outer diameter of the plug 124. Through the cooperation of the plug 124 and the socket 114, the plug 110 and the socket 120 are fixedly connected. Moreover, the outer diameter of the socket 114 is larger than the outer diameter of the plug 124, so that the plug 124 can be easily inserted into or pulled out of the socket 114. Optionally, the difference between the diameter of the socket and the diameter of the plug is less than or equal to 3 microns. Further optionally, the difference between the diameter of the socket and the diameter of the plug is less than or equal to 1 micron.

[0073] The operations of fixing the connection between the plug 110 and the socket 120 include:

[0074] S0c, bonding the plug-in 124 and the socket 114 to achieve a fixed connection between the plug 110 and the socket 120.

[0075] It can be understood that in this embodiment, when fixing the connection between the plug 110 and the socket 120, the plug 110 and the socket 120 can be firstly connected by step S0b to achieve docking and positioning, and then the plug 124 and the socket 114 can be fixedly connected by bonding, thereby achieving fixed connection between the plug 110 and the socket 120.

[0076] Specifically, before the plug 110 and the socket 120 are docked and positioned, the adhesive may be coated on the outer surface of the plug 124 and / or the inner surface of the socket 114. Alternatively, after the plug 110 and the socket 120 are docked and positioned, the adhesive may be injected into the gap between the plug 124 and the socket 114. The specific selection may be made based on the size and structure of the plug 124 and the socket 114, and is not limited here.

[0077] Optionally, the fixing glue used to achieve bonding and fixing of the plug-in 124 and the socket 114 may be, but is not limited to, UV curing glue, epoxy resin glue or silicone glue.

[0078] In this embodiment, the number of the plugs 124 is two, and accordingly, the number of the sockets 114 is also two, so as to prevent the plugs 124 from rotating relative to the sockets 114, and to achieve accurate positioning of the plug 110 and the socket 120. It is understandable that in other embodiments, the number of the plugs is not limited to two, but may be one or more than two; accordingly, the number of the sockets is also adjusted accordingly.

[0079] In this embodiment, the plug 124 is cylindrical and the plug hole 114 is a round hole. It is understood that in other embodiments, the shape of the plug is not limited to a cylindrical shape, the plug hole is not limited to a round hole, and the shape of the plug and the plug hole are not limited to the same, and the plug can be inserted into the plug hole.

[0080] Optionally, when the number of plugs is one and the number of sockets is also less than one, the plug and the socket are polygonal or other irregular shapes to limit the relative rotation of the plug and the socket, thereby improving the positioning accuracy of the plug and the socket and reducing the risk of the plug rotating relative to the socket.

[0081] In some other embodiments, the plug-in may be disposed on the first alignment structure, and the socket may be disposed on the second alignment structure.

[0082] Optionally, in some embodiments, the jack 114 is formed by a femtosecond laser to facilitate a better line of sight for fixing the plug 110 to the socket 120 .

[0083] Of course, it is understandable that, in some other embodiments, the method of achieving fixed connection between the plug 110 and the socket 120 is not limited thereto, and for example, the fixed connection may also be achieved by overlapping and then bonding.

[0084] In this embodiment, the first optical waveguide 113 has a first end 115 coupled to the second optical waveguide 123 , and the second optical waveguide 123 has a second end 125 coupled to the first optical waveguide 113 .

[0085] Optionally, the method further comprises:

[0086] S0d. Form a microlens 140 at the first end 115 of the first optical waveguide 113 and the second end 125 of the second optical waveguide 123 by 3D printing.

[0087] Generally, after the plug and the socket are fixedly connected, there is often a gap between the first alignment structure and the second alignment structure, resulting in the first optical waveguide and the second optical waveguide being unable to directly contact each other, resulting in a decrease in optical coupling efficiency. In this embodiment, a microlens 140 is formed at the first end 115 and the second end 125 to improve the optical coupling efficiency.

[0088] It can be understood that the light coupling efficiency is improved by disposing the microlens 140 .

[0089] Specifically, the microlens 140 may be spherical, cylindrical or non-spherical, and may be set according to specific needs, and is not specifically limited here.

[0090] Further, optionally, an optical anti-reflection film is provided on the surface of the microlens 140 to further improve the light coupling efficiency.

[0091] Specifically, the optical antireflection film can be but is not limited to a titanium oxide film, a silicon oxide film, an aluminum oxide film, a zirconium oxide film, a magnesium fluoride film or a zinc sulfide film, or a composite film formed by stacking at least two of the titanium oxide film, silicon oxide film, aluminum oxide film, zirconium oxide film, magnesium fluoride film and zinc sulfide film.

[0092] Optionally, the optical anti-reflection film is formed by plating.

[0093] Optionally, the first alignment structure 112 and the optical fiber array 111 are bonded and fixed by optical coupling adhesive.

[0094] Optionally, the second alignment structure 122 and the plug-in 124 are bonded and fixed by optical coupling adhesive.

[0095] Optionally, the second alignment structure 122 is fixedly connected to the optical chip base 121 by bonding. It is understandable that the second alignment structure 122 is fixedly connected to the optical chip base 121 by bonding with a high temperature resistant fixing glue, such as a heat curing epoxy resin glue or a UV curing epoxy resin glue.

[0096] Specifically, in this embodiment, the optical chip base 121 includes a metal frame 1211 and a glass substrate 1212 that are fixedly connected; the second alignment structure 122 is fixedly disposed on the metal frame 1211 , and the mounting position of the optical chip 130 is disposed on the glass substrate 1212 .

[0097] See also Figures 2 to 8, an optical module provided by an embodiment of the present application includes a plug 110 and a socket 120. The plug 110 includes an optical fiber array 111 and a first alignment structure 112; the optical fiber array 111 is fixedly arranged on the first alignment structure 112; the socket 120 includes an optical chip base 121 and a second alignment structure 122 fixedly arranged on the optical chip base 121; the first alignment structure 112 is provided with a plug-in 124 matching the plug-in 124; or, the first alignment structure 112 is provided with a plug-in 124, and the second alignment structure 122 is provided with a plug-in 124 matching the plug-in 124; the plug-in 124 can be fixedly connected to the side wall of the plug-in 114, so that the plug 110 and the socket 120 are in a docking state; the plug-in 124 can be separated from the side wall of the plug-in 114, so that the plug 110 and the socket 120 are in a separated state.

[0098] In the above optical module, the plug 110 and the socket 120 can be switched between a docking state and a separation state. Therefore, during the process of packaging the optical chip 130, the plug 110 and the socket 120 can be in a separation state, so as to avoid placing the plug 110 with the optical fiber array 111 in a high temperature environment, avoid the position of the optical fiber in the optical fiber array 111 from being offset, and prevent the coupling failure between the optical fiber array 111 and the optical waveguide.

[0099] It is understandable that the optical chip base 121 is provided with a position for packaging the optical chip 130. In this embodiment, the optical chip base 121 includes a metal frame 1211 and a glass substrate 1212 that are fixedly connected; the second alignment structure 122 is fixedly provided on the metal frame 1211, and the installation position of the optical chip 130 is provided on the glass substrate 1212.

[0100] In this embodiment, the length of the plug 124 is greater than the depth of the jack 114, so that when the plug 110 and the socket 120 are in a docked state, there is a gap between the first alignment mechanism and the second alignment structure 122, thereby avoiding friction between the first alignment mechanism and the second alignment mechanism when the plug 110 and the socket 120 are in a docked state. Optionally, the gap between the first alignment mechanism and the second alignment structure 122 falls between 2 microns and 1000 microns. Further optionally, the gap between the first alignment mechanism and the second alignment structure 122 falls between 3 microns and 100 microns.

[0101] The number, shape and other settings of the plug-in 124 and the plug-in hole 114 are described in the embodiment of the manufacturing method of the optical module, and will not be repeated here.

[0102] In this embodiment, a first optical waveguide 113 is provided on the first alignment structure 112; a second optical waveguide 123 is provided on the second alignment structure 122; the first optical waveguide 113 has a first end 115 coupled to the second optical waveguide 123, and the second optical waveguide 123 has a second end 125 coupled to the first optical waveguide 113; a microlens 140 is provided on the first end 115 of the first optical waveguide 113 and the second end 125 of the second optical waveguide 123, and an optical anti-reflection film is provided on the surface of the microlens 140 to improve the optical coupling efficiency between the first optical waveguide 113 and the second optical waveguide 123.

[0103] The fixing method and material between the various components in the light film block are described above and will not be repeated here.

[0104] It can be understood that in the various embodiments of the present application, the size of the serial number of each process does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0105] It can be understood that the various implementation methods described in this application can be implemented individually or in combination, and the embodiments of this application are not limited to this.

[0106] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method implementation methods and will not be repeated here.

[0107] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A method for preparing an optical module, characterized in that: The method comprises: A plug and a socket are provided; the plug includes an optical fiber array; the socket includes an optical chip base; the plug and the socket are detachably connected; the plug and the socket are detached and in a separated state; the plug and the socket are fixedly connected and in a docking state; If the plug and the socket are in a separated state, the optical chip is packaged on the optical chip base by welding; if the plug and the socket are in a docked state, the plug and the socket are disassembled to a separated state, and then the optical chip is packaged on the optical chip base by welding.

2. The method according to claim 1, characterized in that The optical chip is packaged on the optical chip base by flip-chip bonding.

3. The method according to claim 1, characterized in that The plug further comprises a first alignment structure; the optical fiber array is fixedly arranged on the first alignment structure; the socket further comprises a second alignment structure fixedly arranged on the optical chip base; The method further comprises: If the plug and the socket are in a docking state, a first optical waveguide and a second optical waveguide are formed on the first alignment structure and the second alignment structure respectively; if the plug and the socket are in a separated state, the plug and the socket are fixedly connected so that the plug and the socket are in a docking state, and then the first optical waveguide and the second optical waveguide are formed on the first alignment structure and the second alignment structure respectively; wherein, when the plug and the socket are in a docking state, the first optical waveguide and the second optical waveguide are coupled and connected.

4. The method according to claim 3, characterized in that The first optical waveguide and the second optical waveguide are formed by femtosecond laser processing.

5. The method according to claim 3 or 4, characterized in that: The operation of fixedly connecting the plug and the socket includes: A six-axis displacement coupling method is adopted to achieve docking and positioning of the plug and the socket.

6. The method according to claim 5, characterized in that The first alignment structure is provided with a socket, and the second alignment structure is provided with a plug-in matching the socket; or, the first alignment structure is provided with a plug-in, and the second alignment structure is provided with a socket matching the plug-in; The diameter of the jack is larger than the outer diameter of the plug; The operation of fixedly connecting the plug and the socket includes: The plug-in unit and the socket are bonded to achieve a fixed connection between the plug and the socket.

7. The method according to claim 3, characterized in that The first optical waveguide has a first end coupled to the second optical waveguide, and the second optical waveguide has a second end coupled to the first optical waveguide; The method further comprises: A microlens is formed at the first end of the first optical waveguide and the second end of the second optical waveguide by 3D printing.

8. An optical module, characterized in that: The optical module comprises: A plug, comprising an optical fiber array and a first alignment structure; the optical fiber array is fixedly arranged on the first alignment structure; A socket, comprising an optical chip base and a second alignment structure fixed on the optical chip base; The first alignment structure is provided with a socket, and the second alignment structure is provided with a plug-in matching the socket; or, the first alignment structure is provided with a plug-in, and the second alignment structure is provided with a socket matching the plug-in; The plug-in can be fixedly connected to the side wall of the socket so that the plug and the socket are in a docking state; the plug-in can be separated from the side wall of the socket so that the plug and the socket are in a separated state.

9. The optical module according to claim 8, characterized in that: The length of the plug is greater than the depth of the jack, so that when the plug and the socket are in a docking state, there is a gap between the first alignment mechanism and the second alignment structure.

10. The optical module according to claim 9, characterized in that: A first optical waveguide is arranged on the first alignment structure; a second optical waveguide is arranged on the second alignment structure; the first optical waveguide has a first end coupled to the second optical waveguide, and the second optical waveguide has a second end coupled to the first optical waveguide; microlenses are arranged on the first end of the first optical waveguide and the second end of the second optical waveguide; and an optical anti-reflection film is arranged on the surface of the microlens.

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