Control method and device of beauty equipment, beauty equipment, medium and program

Abstract

The invention relates to the technical field of beauty equipment, and discloses a control method and device of the beauty equipment, the beauty equipment, a medium and a program.The control method and device of the beauty equipment control a semiconductor chilling plate of the beauty equipment to be turned on and turned off in a work cycle cycle to prevent the temperature from continuously rising / falling; the current temperature of the metal guide head of the beauty equipment is detected, whether the current temperature is within the target temperature range or not is judged, and if the current temperature is not within the target temperature range, the time proportion of the turn-on time and the turn-off time of the semiconductor chilling plate in the work cycle is adjusted; the heating / refrigerating time of the semiconductor refrigerating sheet in each working period is reasonably controlled, and the temperature change is prevented from being too fast, so that the skin of a user is prevented from being damaged, and the body feeling of the user during use is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of beauty equipment, and in particular to a control method, device, beauty equipment, medium and program for beauty equipment. Background Art

[0002] Beauty devices on the market almost all have a heating function due to the need to dilate pores. When the contact temperature between the beauty device and the skin is higher than a certain temperature, there is a risk of low-temperature burns, which refers to chronic burns caused by long-term contact with low-temperature objects at 41℃-45℃. At the same time, continuous heating will cause the surface temperature of the beauty device in contact with the skin to be too high, which may seriously burn the skin and cause harm to the user. Therefore, temperature control of beauty devices is very important.

[0003] At present, the traditional method adjusts the output power or voltage according to the current temperature of the beauty instrument to prevent burns to the user's skin. Although controlling the beauty instrument to cool down after the temperature rises to a certain level can prevent the temperature from being too high, there are still problems of the beauty instrument heating up too quickly and large temperature fluctuations. The temperature of the beauty instrument cannot be stably maintained within a certain range, which seriously affects the user's physical sensation and usage experience. Summary of the invention

[0004] In view of this, the present invention provides a control method, device, beauty device, medium and program for beauty equipment to solve the problem that traditional methods cannot stably maintain the temperature of beauty equipment within a certain range, seriously affecting the user's physical sensation and usage experience.

[0005] In a first aspect, the present invention provides a control method for a beauty device, the beauty device comprising a semiconductor refrigeration sheet and a metal guide head, the semiconductor refrigeration sheet being used for heating or cooling, the method comprising:

[0006] Determine the working cycle of the semiconductor refrigeration piece and the target temperature range corresponding to the metal guide head; wherein the working cycle is composed of the on time and off time of the semiconductor refrigeration piece;

[0007] Control the semiconductor refrigeration chip to work in a working cycle and detect the current temperature of the metal guide head;

[0008] When it is detected that the current temperature is not within the target temperature range, based on the current temperature and the target temperature range, the proportion of the semiconductor refrigeration chip's on time and off time in the working cycle is adjusted, and the step of controlling the semiconductor refrigeration chip to work in the working cycle is returned.

[0009] Beneficial effect: The present invention controls the semiconductor refrigeration plate of the beauty equipment to turn on and off in a working cycle to prevent the temperature from continuously rising / falling. During the working process of the semiconductor refrigeration plate, the current temperature of the metal guide head of the beauty equipment is detected, and it is determined whether the current temperature is within the target temperature range. If the current temperature is not within the target temperature range, the proportion of the turn-on time and the turn-off time of the semiconductor refrigeration plate in the working cycle is adjusted to reasonably control the heating / cooling time of the semiconductor refrigeration plate in each working cycle to prevent the temperature from changing too quickly, thereby avoiding damage to the user's skin and improving the user's physical sensation when using it.

[0010] In an optional implementation, when the semiconductor refrigeration chip is used for heating, based on the current temperature and the target temperature range, the proportion of the on time and off time of the semiconductor refrigeration chip in the working cycle is adjusted, including:

[0011] Obtaining a target hot compress temperature according to a lower limit of the target temperature range, and calculating a first temperature difference reference value based on a difference between an upper limit and a lower limit of the target temperature range;

[0012] When it is detected that the current temperature is greater than the target hot compress temperature, and the temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, the proportion of the heating-on time of the semiconductor refrigeration chip in the working cycle is reduced, and the proportion of the heating-off time of the semiconductor refrigeration chip in the working cycle is increased.

[0013] Beneficial effect: In an embodiment of the present invention, when the semiconductor refrigeration plate is used for heating, if the current temperature of the metal conductor exceeds the target hot compress temperature during heating, and the exceeding part is greater than the first temperature difference reference value during heating, the on time of the semiconductor refrigeration plate during heating in the working cycle is reduced and the off time is increased, and the semiconductor refrigeration plate is controlled to be turned on and off according to the adjusted working cycle cycle, the metal conductor is cooled, and the temperature of the metal conductor is reasonably controlled to prevent excessive heating or large temperature fluctuations, avoid scalding the user's skin, and thus improve the user experience.

[0014] In an optional embodiment, the method further includes:

[0015] When it is detected that the current temperature is greater than a first temperature threshold, the semiconductor refrigeration plate is controlled to be turned off; wherein the first temperature threshold is greater than an upper limit value of a target temperature range;

[0016] When it is detected that the shutdown time of the semiconductor refrigeration sheet reaches a first preset time, determining whether the current temperature is less than the target hot compress temperature;

[0017] If the current temperature is lower than the target hot compress temperature, the semiconductor refrigeration chip is controlled to restart heating.

[0018] Beneficial effect: In an embodiment of the present invention, when it is detected that the current temperature of the metal conductor exceeds the set first temperature threshold, the semiconductor refrigeration chip is first controlled to stop heating for a period of time, so that the metal conductor can be quickly cooled down to avoid damage to the user's skin. When the heating stop time reaches the first preset time, the semiconductor refrigeration chip is restarted for heating and the heating workflow is re-entered, thereby improving the user's physical sensation.

[0019] In an optional embodiment, the method further includes:

[0020] When it is detected that the current temperature is greater than a second temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the second temperature threshold is greater than the first temperature threshold.

[0021] Beneficial effect: In an embodiment of the present invention, when the current temperature of the metal conductor exceeds the set second temperature threshold, it means that the temperature of the metal conductor is too high. At this time, an alarm is directly triggered and the semiconductor refrigeration plate is turned off to avoid scalding the user's skin.

[0022] In an optional embodiment, when the semiconductor refrigeration piece is used for cooling, the proportion of the on time and the off time of the semiconductor refrigeration piece in the working cycle is adjusted based on the current temperature and the target temperature range, including:

[0023] Obtaining a target cold compress temperature according to an upper limit of the target temperature range, and calculating a second temperature difference reference value based on a difference between the upper limit and the lower limit of the target temperature range;

[0024] When it is detected that the current temperature is lower than the target cold compress temperature, and the temperature difference between the target cold compress temperature and the current temperature is greater than a second temperature difference reference value, the proportion of the semiconductor refrigeration chip's cooling-on time in the working cycle is reduced, and the proportion of the semiconductor refrigeration chip's cooling-off time in the working cycle is increased.

[0025] Beneficial effect: In an embodiment of the present invention, when the semiconductor refrigeration plate is used for refrigeration, if the current temperature of the metal conductor is lower than the target cold compress temperature during refrigeration, and the insufficient part is greater than the second temperature difference reference value during refrigeration, the on time of the semiconductor refrigeration plate during refrigeration in the working cycle is reduced and the off time is increased, the semiconductor refrigeration plate is controlled to be turned on and off according to the adjusted working cycle cycle, the metal conductor is heated up, and the temperature of the metal conductor is reasonably controlled to prevent excessive cooling or large temperature fluctuations, avoid frostbite of the user's skin, thereby improving the user experience.

[0026] In an optional embodiment, the method further includes:

[0027] When it is detected that the current temperature is less than a third temperature threshold, the semiconductor refrigeration piece is controlled to be turned off; wherein the third temperature threshold is less than a lower limit value of the target temperature range;

[0028] When it is detected that the shutdown time of the semiconductor refrigeration sheet reaches a second preset time, determining whether the current temperature is greater than the target cold compress temperature;

[0029] If the current temperature is greater than the target cold compress temperature, the semiconductor refrigeration chip is controlled to restart cooling.

[0030] Beneficial effect: In an embodiment of the present invention, when it is detected that the current temperature of the metal conduction head is lower than the set third temperature threshold, the semiconductor refrigeration chip is first controlled to stop cooling for a period of time, so that the metal conduction head can be quickly heated up to avoid damage to the user's skin. When the cooling stop time reaches a second preset time, the semiconductor refrigeration chip is restarted for cooling and the cooling workflow is re-entered, thereby improving the user's physical sensation.

[0031] In an optional embodiment, the method further includes:

[0032] When it is detected that the current temperature is lower than a fourth temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the fourth temperature threshold is lower than the third temperature threshold.

[0033] Beneficial effect: In an embodiment of the present invention, when the current temperature of the metal conductor exceeds the set fourth temperature threshold, it means that the temperature of the metal conductor is too low. At this time, an alarm is directly triggered and the semiconductor refrigeration plate is turned off to avoid frostbite on the user's skin.

[0034] In a second aspect, the present invention provides a control device for a beauty device, the beauty device comprising a semiconductor refrigeration sheet and a metal guide head, the semiconductor refrigeration sheet is used for heating or cooling, and the device comprises:

[0035] The first processing module is used to determine the working cycle of the semiconductor refrigeration piece and the target temperature range corresponding to the metal guide head; wherein the working cycle is composed of the opening time and the closing time of the semiconductor refrigeration piece;

[0036] The second processing module is used to control the semiconductor refrigeration chip to work in a working cycle and detect the current temperature of the metal guide head;

[0037] The third processing module is used to adjust the proportion of the on time and off time of the semiconductor refrigeration plate in the working cycle based on the current temperature and the target temperature range when it is detected that the current temperature is not in the target temperature range, and return to the step of controlling the semiconductor refrigeration plate to work in the working cycle.

[0038] In a third aspect, the present invention provides a beauty device, comprising a semiconductor cooling plate, a metal guide head and a controller; the controller comprises a memory and a processor, the memory and the processor are communicatively connected to each other, computer instructions are stored in the memory, and the processor executes the control method of the beauty device of the first aspect or any corresponding embodiment thereof by executing the computer instructions.

[0039] In an optional embodiment, the beauty device is a beauty instrument.

[0040] In a fourth aspect, the present invention provides a computer-readable storage medium having computer instructions stored thereon, the computer instructions being used to enable a computer to execute the control method for a beauty device according to the first aspect or any corresponding embodiment thereof.

[0041] In a fifth aspect, the present invention provides a computer program product, comprising computer instructions for causing a computer to execute the method for controlling a beauty device according to the first aspect or any corresponding embodiment thereof. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0043] Figure 1 is a schematic structural diagram of a beauty device according to an embodiment of the present invention;

[0044] Figure 2 is a flow chart of a control method of a beauty device according to an embodiment of the present invention;

[0045] Figure 3 is a flow chart of another control method of a beauty device according to an embodiment of the present invention;

[0046] Figure 4 is a flow chart of a control method of another beauty device according to an embodiment of the present invention;

[0047] Figure 5 is a flow chart of a control method of yet another beauty device according to an embodiment of the present invention;

[0048] Figure 6 is a structural block diagram of a control device of a beauty device according to an embodiment of the present invention;

[0049] Figure 7Schematic diagram of the hardware structure of the controller according to the embodiment of the present invention. DETAILED DESCRIPTION

[0050] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0051] Beauty devices on the market almost all have a heating function due to the need to relax pores. Studies have shown that when the skin temperature is higher than 43 degrees Celsius, there is a risk of low-temperature burns. At the same time, experiments have shown that continuous heating will cause the surface temperature of the beauty device in contact with the skin to exceed 90°C, which may seriously burn the skin and cause harm to the user. Therefore, it is necessary to consider eliminating situations that cause harm to users and improve product reputation.

[0052] Therefore, in order to solve the problem of overheating and scalding / freezing the skin of beauty equipment, an embodiment of the present invention provides a control method for beauty equipment to achieve gentle control at higher / lower temperatures, prevent the beauty equipment from heating up / cooling down too quickly and causing large temperature fluctuations, so that users feel more comfortable and the effect is good and effective.

[0053] According to an embodiment of the present invention, a beauty device is provided, such as Figure 1 As shown, the beauty device includes a controller, a semiconductor cooling sheet and a metal guide head. The controller and the semiconductor cooling sheet are located inside the beauty device. Figure 1 The metal guide head is in direct contact with the skin, and the semiconductor cooling sheet heats / cools the metal guide head and transmits the heat to the skin. Exemplarily, the beauty device can be a beauty instrument.

[0054] Specifically, the semiconductor cooling chip is controlled by a controller such as an MCU for heating / cooling. Since the metal guide of the beauty device is in direct contact with the skin, its temperature control is extremely important. Excessive temperature can cause skin burns. In the national standard GB4706.10-2008, Section 11.8 adds the requirement that "the temperature rise of parts in contact with the skin or hair should not exceed the temperature rise limit specified for continuous gripping of the handle in normal use"; the national standard GB4706.1-2005 requires that the temperature rise of the metal handle should not exceed 35K. In practice, when the semiconductor cooling chip is continuously heated, the temperature of the metal guide will rise rapidly. Experimental verification shows that the temperature can reach more than 90 degrees Celsius, which can cause skin burns.

[0055] In an embodiment of the present invention, a controller is used to control the working process of the semiconductor refrigeration plate to control the temperature of the metal guide head in direct contact with the skin, so as to achieve gentle control at a higher temperature, prevent excessive temperature rise and large temperature fluctuations, and thus avoid scalding human skin.

[0056] The working principle and specific working process of the controller can be found in the detailed description of the method embodiment below, which will not be repeated here.

[0057] According to an embodiment of the present invention, an embodiment of a control method for a beauty device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although a logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from that shown here.

[0058] In this embodiment, a control method of a beauty device is provided, which can be used for example Figure 1 The beauty equipment shown, such as beauty instruments, etc. Figure 2 is a flow chart of a control method of a beauty device according to an embodiment of the present invention. Figure 2 As shown, the process includes the following steps:

[0059] Step S201, determining the working cycle of the semiconductor refrigeration plate and the target temperature range corresponding to the metal conductor.

[0060] Specifically, the working cycle [a, b] of the semiconductor refrigerator is composed of the on time a and the off time b of the semiconductor refrigerator. The semiconductor refrigerator will work cyclically according to the working cycle [a, b]. In each working cycle, the semiconductor refrigerator will first work for a period of time according to the on time a, then stop working for a period of time according to the off time b, and then enter the next working cycle. This can prevent the temperature of the metal conductor from rising / falling too fast or fluctuating greatly.

[0061] It should be noted that semiconductor refrigeration chips can be used for both heating and cooling. The working principle of semiconductor refrigeration chips is mainly based on the Peltier Effect in the thermoelectric effect. When current passes through a thermocouple composed of an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends. The heat will be transferred from one end to the other end, thereby generating a temperature difference to form a cold and hot end, thereby achieving cooling. Conversely, if the direction of the current changes, the direction of the heat transfer will also change, thereby achieving heating.

[0062] In this embodiment, the beauty device has multiple working modes such as hot compress mode and cold compress mode, the metal guide head corresponds to a target temperature range in different modes, and the semiconductor refrigeration sheet corresponds to a working cycle in different modes. For example, when the user turns on the hot compress mode, the semiconductor refrigeration sheet is mainly used for heating; when the user turns on the cold compress mode, the semiconductor refrigeration sheet is mainly used for cooling. It should be noted that the target temperature range can be set according to the actual application scenario and the adaptability of the human body.

[0063] Step S202, controlling the semiconductor refrigeration plate to work in a working cycle and detecting the current temperature of the metal conductor.

[0064] Specifically, the semiconductor refrigeration plate is controlled to be turned on and off according to the currently determined working cycle cycle. During the operation of the semiconductor refrigeration plate, the current temperature of the metal guide head can be detected in real time by a temperature sensing package, a temperature sensor, etc., and it is determined whether the current temperature is within the target temperature range. If the current temperature is not within the target temperature range, step S203 is executed.

[0065] Step S203, when it is detected that the current temperature is not within the target temperature range, based on the current temperature and the target temperature range, the proportion of the on time and off time of the semiconductor refrigeration plate in the working cycle is adjusted, and the process returns to step S202.

[0066] Specifically, according to the gap between the current temperature and the target temperature range, a corresponding method is selected to adjust the proportion of the on-time and off-time of the semiconductor refrigeration chip in the working cycle, so as to adjust the heating / cooling time proportion of the semiconductor refrigeration chip, maintain the temperature of the metal guide head within the target temperature range, prevent the temperature from changing too quickly, thereby avoiding damage to the user's skin and improving the user's physical sensation when using it.

[0067] The control method of the beauty device provided in the present embodiment controls the semiconductor refrigeration plate of the beauty device to turn on and off in a working cycle to prevent the temperature from continuously rising / falling. During the working process of the semiconductor refrigeration plate, the current temperature of the metal guide head of the beauty device is detected, and it is determined whether the current temperature is within the target temperature range of the beauty device. If the current temperature is not within the target temperature range, the proportion of the turn-on time and the turn-off time of the semiconductor refrigeration plate in the working cycle is adjusted to reasonably control the heating / cooling time of the semiconductor refrigeration plate in each working cycle to prevent the temperature from changing too quickly, thereby avoiding damage to the user's skin and improving the user's physical sensation during use.

[0068] In this embodiment, a control method of a beauty device is provided, which can be used for example Figure 1 The beauty equipment shown, such as beauty instrument, when the semiconductor cooling sheet is used for heating, Figure 3is a flow chart of a control method of a beauty device according to an embodiment of the present invention. Figure 3 As shown, the process includes the following steps:

[0069] Step S301, determine the working cycle of the semiconductor cooling plate and the target temperature range corresponding to the metal guide head. Figure 2 Step S201 of the illustrated embodiment will not be described in detail here.

[0070] Step S302, control the semiconductor cooling plate to work in a working cycle and detect the current temperature of the metal guide head. Figure 2 Step S202 of the illustrated embodiment will not be described in detail here.

[0071] Step S303, when it is detected that the current temperature is not within the target temperature range, based on the current temperature and the target temperature range, the proportion of the on time and off time of the semiconductor refrigeration plate in the working cycle is adjusted, and the process returns to step S302.

[0072] Specifically, when the semiconductor refrigeration sheet is used for heating, the above step S303 includes:

[0073] Step S3031, obtaining the target hot compress temperature according to the lower limit of the target temperature range, and calculating the first temperature difference reference value based on the difference between the upper limit and the lower limit of the target temperature range.

[0074] Specifically, when the semiconductor refrigeration sheet is used for heating, the target temperature range corresponding to the metal guide head can be [T R , T R +ΔT R ], the lower limit of this range is the target hot compress temperature T R The difference between the upper limit and the lower limit of the range is the first temperature difference reference value ΔT R Among them, according to the tolerance of human skin, the target hot compress temperature T R The value is generally taken in the range of 38℃-42℃, and can be set specifically according to the actual scenario.

[0075] Step S3032, when it is detected that the current temperature is greater than the target hot compress temperature, and the temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, reduce the proportion of the heating on time of the semiconductor refrigeration chip in the working cycle, and increase the proportion of the heating off time of the semiconductor refrigeration chip in the working cycle, and return to step S302.

[0076] Specifically, if it is detected that the current temperature T>T R And the current temperature T and the target hot compress temperature T R The temperature difference between ΔT1>ΔT R, then reduce the on time a of the semiconductor refrigeration plate during heating in the working cycle, and increase the off time b of the semiconductor refrigeration plate, update the working cycle, return to step S302, control the semiconductor refrigeration plate to turn on and off according to the adjusted working cycle cycle, cool the metal guide head, and reasonably control the current temperature to be within the target temperature range.

[0077] Specifically, if the current temperature T is detected <T R , then continue to control the semiconductor cooling film to heat according to the current working cycle, so that the metal guide head reaches the target hot compress temperature T R .

[0078] In an embodiment of the present invention, when a semiconductor refrigeration sheet is used for heating, if the current temperature of the metal conductor exceeds the target hot compress temperature during heating, and the exceeding part is greater than the first temperature difference reference value during heating, the on time of the semiconductor refrigeration sheet during heating in the working cycle is reduced and the off time is increased, and the semiconductor refrigeration sheet is controlled to be turned on and off according to the adjusted working cycle cycle, so as to cool the metal conductor and reasonably control the temperature of the metal conductor to prevent excessive heating or large temperature fluctuations, thereby avoiding scalding the user's skin and improving the user experience.

[0079] Step S304, when it is detected that the current temperature is greater than a first temperature threshold, the semiconductor refrigeration plate is controlled to be turned off; wherein the first temperature threshold is greater than an upper limit value of a target temperature range.

[0080] Specifically, when it is detected that the current temperature T> the first temperature threshold T1, the semiconductor refrigeration chip is turned off, heating is stopped, and the shutdown time t of the semiconductor refrigeration chip is recorded. It should be noted that the first temperature threshold T1>T R +ΔT R According to the tolerance of human skin, the first temperature threshold T1 is generally set within the range of 43° C.-48° C., but the embodiment of the present invention is not limited thereto.

[0081] Step S305, when it is detected that the shutdown time of the semiconductor refrigeration plate reaches the first preset time, it is determined whether the current temperature is less than the target hot compress temperature.

[0082] Specifically, when it is detected that the off time t of the semiconductor cooling plate reaches the first preset time t1, it is determined whether the current temperature of the metal guide head drops to the target hot compress temperature T R If yes, execute step S306; otherwise, execute step S307.

[0083] It should be noted that the first preset time t1 is the minimum restart heating time, which is generally set to 5s-40s to avoid frequent start and stop of the semiconductor refrigeration plate when the temperature fluctuates, resulting in poor temperature control effect and large temperature fluctuations.

[0084] Step S306, if the current temperature is lower than the target hot compress temperature, control the semiconductor refrigeration plate to restart heating.

[0085] Specifically, if the current temperature of the metal guide head drops to the target hot compress temperature T after the first preset time t1, R Below, the semiconductor refrigeration chip heating is restarted.

[0086] In an embodiment of the present invention, when it is detected that the current temperature of the metal conductor exceeds the set first temperature threshold, the semiconductor refrigeration chip is first controlled to stop heating for a period of time to allow the metal conductor to cool down quickly to avoid damage to the user's skin. When the heating stop time reaches a first preset time, the semiconductor refrigeration chip is restarted for heating and the heating workflow is re-entered, thereby improving the user's physical sensation.

[0087] Step S307, when it is detected that the current temperature is greater than the second temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the second temperature threshold is greater than the first temperature threshold.

[0088] Specifically, no matter what the situation is, as long as it is detected that the current temperature of the metal conductor is greater than the second temperature threshold T2, an alarm is triggered and the semiconductor refrigeration plate is turned off. It should be noted that the second temperature threshold T2 is greater than the first temperature threshold T1. According to the tolerance of human skin, the second temperature threshold T2 is generally within the range of 49°C-60°C, and the embodiment of the present invention is not limited thereto.

[0089] In an embodiment of the present invention, when the current temperature of the metal conductor exceeds the set second temperature threshold, it means that the temperature of the metal conductor is too high. At this time, an alarm is directly processed and the semiconductor cooling plate is turned off to avoid scalding the user's skin.

[0090] The control method of the beauty device provided in the present embodiment controls the semiconductor refrigeration chip of the beauty device to be turned on and off in a working cycle to prevent the temperature from continuing to rise. During the working process of the semiconductor refrigeration chip, the current temperature of the metal guide head of the beauty device is detected, and it is determined whether the current temperature is within the target temperature range. If the current temperature of the metal guide head exceeds the target hot compress temperature, and the excess is greater than the first temperature difference reference value, the turn-on time of the semiconductor refrigeration chip during heating in the working cycle is reduced and the turn-off time is increased. The heating time of the semiconductor refrigeration chip in each working cycle is reasonably controlled to prevent the temperature from rising too quickly, thereby avoiding burns to the user's skin and improving the user's physical sensation during use.

[0091] In this embodiment, a control method of a beauty device is provided, which can be used for example Figure 1 The beauty equipment shown, such as beauty instrument, when the semiconductor cooling sheet is used for cooling, Figure 4is a flow chart of a control method of a beauty device according to an embodiment of the present invention. Figure 4 As shown, the process includes the following steps:

[0092] Step S401, determine the working cycle of the semiconductor cooling plate and the target temperature range corresponding to the metal guide head. Figure 2 Step S201 of the illustrated embodiment will not be described in detail here.

[0093] Step S402, control the semiconductor cooling plate to work in a working cycle and detect the current temperature of the metal guide head. Figure 2 Step S202 of the illustrated embodiment will not be described in detail here.

[0094] Step S403, when it is detected that the current temperature is not within the target temperature range, based on the current temperature and the target temperature range, the proportion of the on time and off time of the semiconductor refrigeration plate in the working cycle is adjusted, and the process returns to step S402.

[0095] Specifically, when the semiconductor refrigeration sheet is used for refrigeration, the above step S403 includes:

[0096] Step S4031, obtaining a target cold compress temperature according to the upper limit of the target temperature range, and calculating a second temperature difference reference value based on the difference between the upper limit and the lower limit of the target temperature range.

[0097] Specifically, when the semiconductor refrigeration sheet is used for refrigeration, the target temperature range corresponding to the metal guide head can be [T L -ΔT L , T L ], the upper limit of this range is the target cold compress temperature T L The difference between the upper limit and the lower limit of the range is the second temperature difference reference value ΔT L Among them, the target cold compress temperature T L It can be set according to the human body's tolerance and actual scenarios.

[0098] Step S4032, when it is detected that the current temperature is lower than the target cold compress temperature, and the temperature difference between the target cold compress temperature and the current temperature is greater than the second temperature difference reference value, the proportion of the semiconductor refrigeration chip's cooling on time in the working cycle is reduced, and the proportion of the semiconductor refrigeration chip's cooling off time in the working cycle is increased, and return to step S402.

[0099] Specifically, if the current temperature T is detected <T L And the target cold compress temperature T L The temperature difference from the current temperature T is ΔT2>ΔT L, then reduce the on time a of the semiconductor refrigeration plate during cooling in the working cycle, and increase the off time b of the semiconductor refrigeration plate, update the working cycle, return to step S402, control the semiconductor refrigeration plate to turn on and off according to the adjusted working cycle cycle, heat up the metal guide head, and reasonably control the current temperature to be within the target temperature range.

[0100] Specifically, if it is detected that the current temperature T>T L , then continue to control the semiconductor refrigeration piece to cool according to the current working cycle, so that the metal guide head reaches the target cold compress temperature T L .

[0101] In an embodiment of the present invention, when a semiconductor refrigeration plate is used for refrigeration, if the current temperature of the metal conductor is lower than the target cold compress temperature during refrigeration, and the insufficient part is greater than the second temperature difference reference value during refrigeration, the on time of the semiconductor refrigeration plate during refrigeration in the working cycle is reduced and the off time is increased, and the semiconductor refrigeration plate is controlled to be turned on and off according to the adjusted working cycle cycle, the metal conductor is heated, and the temperature of the metal conductor is reasonably controlled to prevent excessive cooling or large temperature fluctuations, avoid frostbite on the user's skin, and thus improve the user experience.

[0102] Step S404, when it is detected that the current temperature is less than a third temperature threshold, the semiconductor refrigeration plate is controlled to be turned off; wherein the third temperature threshold is less than a lower limit of the target temperature range.

[0103] Specifically, when it is detected that the current temperature T<the third temperature threshold T3, the semiconductor refrigeration chip is turned off, the refrigeration is stopped, and the shutdown time t of the semiconductor refrigeration chip is recorded. It should be noted that the third temperature threshold T3 <T L -ΔT L The third temperature threshold T3 can be set according to the tolerance of human skin.

[0104] Step S405, when it is detected that the shutdown time of the semiconductor refrigeration plate reaches the second preset time, it is determined whether the current temperature is greater than the target cold compress temperature.

[0105] Specifically, when it is detected that the off time t of the semiconductor refrigeration plate reaches the second preset time t2, it is determined whether the current temperature of the metal guide head rises to the target cold compress temperature T L If so, execute step S406; otherwise, execute step S407.

[0106] Step S406: If the current temperature is greater than the target cold compress temperature, the semiconductor refrigeration chip is controlled to restart for cooling.

[0107] Specifically, if the current temperature of the metal guide head rises to the target cold compress temperature T after the second preset time t2,L If the temperature is above 200 °C, the semiconductor refrigeration chip will be restarted for cooling.

[0108] In an embodiment of the present invention, when it is detected that the current temperature of the metal conductor is lower than the set third temperature threshold, the semiconductor refrigeration chip is first controlled to stop cooling for a period of time, so that the metal conductor head can be quickly heated up to avoid damage to the user's skin. When the cooling stop time reaches a second preset time, the semiconductor refrigeration chip is restarted for cooling and the cooling workflow is re-entered, thereby improving the user's physical sensation.

[0109] Step S407, when it is detected that the current temperature is lower than a fourth temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the fourth temperature threshold is lower than the third temperature threshold.

[0110] Specifically, as long as it is detected that the current temperature of the metal conductor is less than the fourth temperature threshold T4, an alarm is triggered and the semiconductor refrigeration plate is turned off. It should be noted that the fourth temperature threshold T4 is less than the third temperature threshold T3, and the fourth temperature threshold T4 can be set according to the tolerance of human skin.

[0111] In an embodiment of the present invention, when the current temperature of the metal conductor exceeds the set fourth temperature threshold, it means that the temperature of the metal conductor is too low. At this time, an alarm is directly triggered and the semiconductor refrigeration plate is turned off to avoid frostbite on the user's skin.

[0112] The control method of the beauty device provided in the present embodiment controls the semiconductor refrigeration plate of the beauty device to turn on and off in a working cycle to prevent the temperature from continuously decreasing. During the working process of the semiconductor refrigeration plate, the current temperature of the metal guide head of the beauty device is detected, and it is determined whether the current temperature is within the target temperature range. If the current temperature of the metal guide head is lower than the target cold compress temperature, and the insufficient part is greater than the second temperature difference reference value, the on time of the semiconductor refrigeration plate during cooling in the working cycle is reduced and the off time is increased. The cooling time of the semiconductor refrigeration plate in each working cycle is reasonably controlled to prevent the temperature from decreasing too quickly, thereby avoiding frostbite on the user's skin and improving the user's physical sensation during use.

[0113] The following takes the beauty device as a beauty instrument and the semiconductor cooling sheet as an example for heating, and describes the control method of the beauty device of the present invention in detail in combination with a specific application example. Figure 5 As shown, the application example specifically includes the following steps:

[0114] Step 1: After turning on the machine, preset relevant control parameters: target hot compress temperature T R , first temperature threshold T1, second temperature threshold T2, first temperature difference reference value ΔT R , the semiconductor refrigeration plate heating on time a and the heating off time b within the working cycle, and the first preset time length t1.

[0115] Step 2, turn on the semiconductor refrigeration plate for heating.

[0116] Step 3: Detect the current temperature T of the metal guide head and determine whether T is less than or equal to the target hot compress temperature T. R , then maintain heating; if T>T R , let ΔT1=TT R , determine whether ΔT1 is greater than the first temperature difference reference value ΔT R , if ΔT1 is not greater than the first temperature difference reference value ΔT R , then the semiconductor heating on time in the working cycle is set to a, and the semiconductor heating off time in the cycle is set to b, and the semiconductor refrigeration piece is controlled to heat cyclically with this working cycle [a, b]. In each working cycle [a, b], the semiconductor refrigeration piece is first heated for a period of time according to the on time a, and then stops heating for a period of time according to the off time b; if ΔT1 is greater than the first temperature difference reference value ΔT R , then a--, b++, keep the entire cycle length unchanged, and then use the updated cycle [a, b] to control the semiconductor refrigeration chip to heat cyclically. In this way, through appropriate algorithm settings, the heating time ratio is reasonably controlled, and the current temperature is finally maintained at the preset [t R , t R +Δt R ] range.

[0117] Step 4: Check whether the current temperature t is greater than the first temperature threshold T1. If so, turn off the heating and time the off time t of the semiconductor cooling plate. When the off time t reaches the first preset time t1, determine whether the current temperature drops to the target hot compress temperature T R If yes, restart heating; if the current temperature T is less than or equal to the first temperature threshold T1, proceed to the next step.

[0118] Step 5: Regardless of the situation, if the current temperature T is detected to be greater than the second temperature threshold T2, an alarm is triggered.

[0119] The above application example proposes a temperature control method that can solve the problem of overheating and scalding the skin of a beauty instrument, achieve gentle control at a higher temperature, prevent rapid temperature rise and large temperature fluctuations, make the user feel more comfortable, and the effect is good and effective.

[0120] In this embodiment, a control device for a beauty device is also provided, which is used to implement the above-mentioned embodiments and preferred implementations, and will not be repeated here. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware, is also possible and conceivable.

[0121] This embodiment provides a control device for a beauty device, such as Figure 6 As shown, including:

[0122] The first processing module 601 is used to determine the working cycle of the semiconductor refrigeration piece and the target temperature range corresponding to the metal guide head; wherein the working cycle is composed of the on time and off time of the semiconductor refrigeration piece;

[0123] The second processing module 602 is used to control the semiconductor cooling chip to work in a working cycle and detect the current temperature of the metal guide head;

[0124] The third processing module 603 is used to adjust the proportion of the on time and off time of the semiconductor refrigeration plate in the working cycle based on the current temperature and the target temperature range when it is detected that the current temperature is not in the target temperature range, and return to the step of controlling the semiconductor refrigeration plate to work in the working cycle.

[0125] In some optional implementations, when the semiconductor refrigeration sheet is used for heating, the third processing module 603 is further used to:

[0126] Obtaining a target hot compress temperature according to a lower limit of the target temperature range, and calculating a first temperature difference reference value based on a difference between an upper limit and a lower limit of the target temperature range;

[0127] When it is detected that the current temperature is greater than the target hot compress temperature, and the temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, the proportion of the heating on time of the semiconductor refrigeration chip in the working cycle is reduced, and the proportion of the heating off time of the semiconductor refrigeration chip in the working cycle is increased.

[0128] In some optional embodiments, the device is also used for:

[0129] When it is detected that the current temperature is greater than a first temperature threshold, the semiconductor refrigeration plate is controlled to be turned off; wherein the first temperature threshold is greater than an upper limit value of a target temperature range;

[0130] When it is detected that the shutdown time of the semiconductor refrigeration sheet reaches a first preset time, determining whether the current temperature is less than the target hot compress temperature;

[0131] If the current temperature is lower than the target hot compress temperature, the semiconductor refrigeration chip is controlled to restart heating.

[0132] In some optional embodiments, the device is also used for:

[0133] When it is detected that the current temperature is greater than a second temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the second temperature threshold is greater than the first temperature threshold.

[0134] In some optional implementations, when the semiconductor refrigeration sheet is used for refrigeration, the third processing module 603 is further used to:

[0135] Obtaining a target cold compress temperature according to an upper limit of the target temperature range, and calculating a second temperature difference reference value based on a difference between the upper limit and the lower limit of the target temperature range;

[0136] When it is detected that the current temperature is lower than the target cold compress temperature, and the temperature difference between the target cold compress temperature and the current temperature is greater than a second temperature difference reference value, the proportion of the semiconductor refrigeration chip's cooling-on time in the working cycle is reduced, and the proportion of the semiconductor refrigeration chip's cooling-off time in the working cycle is increased.

[0137] In some optional embodiments, the device is also used for:

[0138] When it is detected that the current temperature is less than a third temperature threshold, the semiconductor refrigeration piece is controlled to be turned off; wherein the third temperature threshold is less than a lower limit value of the target temperature range;

[0139] When it is detected that the shutdown time of the semiconductor refrigeration sheet reaches a second preset time, determining whether the current temperature is greater than the target cold compress temperature;

[0140] If the current temperature is greater than the target cold compress temperature, the semiconductor refrigeration chip is controlled to restart cooling.

[0141] In some optional embodiments, the device is also used for:

[0142] When it is detected that the current temperature is lower than a fourth temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the fourth temperature threshold is lower than the third temperature threshold.

[0143] The further functional description of each of the above modules and units is the same as that of the above corresponding embodiments and will not be repeated here.

[0144] The control device of the beauty device in this embodiment is presented in the form of a functional unit, where the unit refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and memory that executes one or more software or fixed programs, and / or other devices that can provide the above functions.

[0145] The embodiment of the present invention also provides a controller having the above Figure 6 The control device of the beauty device shown.

[0146] See also Figure 7 , Figure 7 is a schematic diagram of the structure of a controller provided by an optional embodiment of the present invention, such as Figure 7 As shown, the controller includes: one or more processors 10, a memory 20, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses for communication, and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the controller, including instructions stored in or on the memory to display graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some optional embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Figure 6 A processor 10 is taken as an example.

[0147] The processor 10 may be a central processing unit, a network processor or a combination thereof. The processor 10 may further include a hardware chip. The hardware chip may be a dedicated integrated circuit, a programmable logic device or a combination thereof. The programmable logic device may be a complex programmable logic device, a field programmable gate array, a general purpose array logic or any combination thereof.

[0148] The memory 20 stores instructions executable by at least one processor 10, so that the at least one processor 10 executes the method shown in the above embodiment.

[0149] The memory 20 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required by at least one function; the data storage area may store data created according to the use of the controller, etc. In addition, the memory 20 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some optional embodiments, the memory 20 may optionally include a memory remotely arranged relative to the processor 10, and these remote memories may be connected to the controller via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0150] The memory 20 may include a volatile memory, such as a random access memory; the memory may also include a non-volatile memory, such as a flash memory, a hard disk or a solid state drive; the memory 20 may also include a combination of the above types of memory.

[0151] The controller also includes an input device 30 and an output device 40. The processor 10, the memory 20, the input device 30 and the output device 40 may be connected via a bus or other means. Figure 7 The example of connecting through bus is taken in the following.

[0152] The input device 30 can receive input digital or character information and generate key signal input related to the user settings and function control of the controller, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The above-mentioned display device includes but is not limited to a liquid crystal display, a light emitting diode, a display and a plasma display. In some optional embodiments, the display device can be a touch screen.

[0153] The embodiment of the present invention also provides a computer-readable storage medium. The method according to the embodiment of the present invention can be implemented in hardware, firmware, or can be implemented as a computer code that can be recorded in a storage medium, or can be implemented as a computer code that is originally stored in a remote storage medium or a non-temporary machine-readable storage medium and will be stored in a local storage medium through a network download, so that the method described herein can be stored in such software processing on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. Among them, the storage medium can be a magnetic disk, an optical disk, a read-only storage memory, a random access memory, a flash memory, a hard disk or a solid-state hard disk, etc.; further, the storage medium can also include a combination of the above types of memories. It can be understood that a computer, a processor, a microprocessor controller, or programmable hardware includes a storage component that can store or receive software or computer code. When the software or computer code is accessed and executed by a computer, a processor, or hardware, the method shown in the above embodiment is implemented.

[0154] A part of the present invention may be applied as a computer program product, such as a computer program instruction, which, when executed by a computer, can call or provide the method and / or technical solution according to the present invention through the operation of the computer. Those skilled in the art should understand that the existence of the computer program instruction in a computer-readable medium includes, but is not limited to, a source file, an executable file, an installation package file, etc., and accordingly, the way in which the computer program instruction is executed by the computer includes, but is not limited to: the computer directly executes the instruction, or the computer compiles the instruction and then executes the corresponding compiled program, or the computer reads and executes the instruction, or the computer reads and installs the instruction and then executes the corresponding installed program. Here, the computer-readable medium may be any available computer-readable storage medium or communication medium accessible to the computer.

[0155] Although the embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.

Claims

1. A method for controlling a beauty device, characterized in that: The beauty device comprises a semiconductor refrigeration sheet and a metal guide head, the semiconductor refrigeration sheet is used for heating or cooling, and the method comprises: Determine the working cycle of the semiconductor refrigeration piece and the target temperature range corresponding to the metal guide head; wherein the working cycle is composed of the on time and off time of the semiconductor refrigeration piece; Controlling the semiconductor refrigeration chip to work in the working cycle and detecting the current temperature of the metal guide head; When it is detected that the current temperature is not within the target temperature range, based on the current temperature and the target temperature range, the proportion of the on time and off time of the semiconductor refrigeration plate in the working cycle is adjusted, and the step of controlling the semiconductor refrigeration plate to work in the working cycle is returned.

2. The method according to claim 1, characterized in that When the semiconductor refrigeration piece is used for heating, adjusting the proportion of the on time and the off time of the semiconductor refrigeration piece in the working cycle based on the current temperature and the target temperature range includes: Obtaining a target hot compress temperature according to the lower limit of the target temperature range, and calculating a first temperature difference reference value based on the difference between the upper limit and the lower limit of the target temperature range; When it is detected that the current temperature is greater than the target hot compress temperature, and the temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, the proportion of the heating on time of the semiconductor refrigeration chip in the working cycle is reduced, and the proportion of the heating off time of the semiconductor refrigeration chip in the working cycle is increased.

3. The method according to claim 2, characterized in that The method further comprises: When it is detected that the current temperature is greater than a first temperature threshold, the semiconductor refrigeration plate is controlled to be turned off; wherein the first temperature threshold is greater than an upper limit value of the target temperature range; When it is detected that the shutdown time of the semiconductor refrigeration sheet reaches a first preset time, determining whether the current temperature is less than the target hot compress temperature; If the current temperature is lower than the target hot compress temperature, the semiconductor refrigeration plate is controlled to restart heating.

4. The method according to claim 3, characterized in that The method further comprises: When it is detected that the current temperature is greater than a second temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the second temperature threshold is greater than the first temperature threshold.

5. The method according to claim 1, characterized in that When the semiconductor refrigeration plate is used for refrigeration, adjusting the proportion of the opening time and the closing time of the semiconductor refrigeration plate in the working cycle based on the current temperature and the target temperature range includes: Obtaining a target cold compress temperature according to an upper limit of the target temperature range, and calculating a second temperature difference reference value based on a difference between the upper limit and the lower limit of the target temperature range; When it is detected that the current temperature is lower than the target cold compress temperature, and the temperature difference between the target cold compress temperature and the current temperature is greater than the second temperature difference reference value, the proportion of the semiconductor refrigeration chip's cooling on time in the working cycle is reduced, and the proportion of the semiconductor refrigeration chip's cooling off time in the working cycle is increased.

6. The method according to claim 5, characterized in that The method further comprises: When it is detected that the current temperature is less than a third temperature threshold, the semiconductor refrigeration plate is controlled to be turned off; wherein the third temperature threshold is less than the lower limit of the target temperature range; When it is detected that the shutdown time of the semiconductor refrigeration sheet reaches a second preset time, determining whether the current temperature is greater than the target cold compress temperature; If the current temperature is greater than the target cold compress temperature, the semiconductor refrigeration plate is controlled to restart for cooling.

7. The method according to claim 6, characterized in that When it is detected that the current temperature is lower than a fourth temperature threshold, the semiconductor refrigeration plate is controlled to be turned off and an alarm is issued; wherein the fourth temperature threshold is lower than the third temperature threshold.

8. A control device for beauty equipment, characterized in that: The beauty device comprises a semiconductor refrigeration sheet and a metal guide head, the semiconductor refrigeration sheet is used for heating or cooling, and the device comprises: A first processing module is used to determine the working cycle of the semiconductor refrigeration piece and the target temperature range corresponding to the metal guide head; wherein the working cycle is composed of the on time and off time of the semiconductor refrigeration piece; A second processing module is used to control the semiconductor refrigeration chip to work in the working cycle and detect the current temperature of the metal guide head; The third processing module is used to adjust the proportion of the on time and off time of the semiconductor refrigeration plate in the working cycle based on the current temperature and the target temperature range when it is detected that the current temperature is not in the target temperature range, and return to the step of controlling the semiconductor refrigeration plate to work in the working cycle.

9. A beauty device, characterized in that: It includes a semiconductor refrigeration piece, a metal guide head and a controller, and the semiconductor refrigeration piece is used for heating or cooling; The controller includes a memory and a processor, the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor executes the control method of the beauty device according to any one of claims 1 to 7 by executing the computer instructions.

10. The beauty device according to claim 9, characterized in that: The beauty equipment is a beauty instrument.

11. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a computer to execute the control method of the beauty device according to any one of claims 1 to 7.

12. A computer program product, characterized in that The method comprises computer instructions for causing a computer to execute the control method of the beauty device according to any one of claims 1 to 7.

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