Full liquid cooling server based on one-inlet multi-outlet manifold microchannel

Abstract

A full liquid cooling server based on a one-inlet multi-outlet manifold microchannel comprises a mainboard, a CPU, a memory bank, a GPU, a hard disk, an SSD and a power supply. A case of the server is provided with a liquid inlet and a liquid outlet; the CPU is provided with a multi-outlet manifold micro-channel radiator; the multi-outlet manifold micro-channel radiator comprises a plurality of radiator units which share one first cooling liquid inlet. A first cooling liquid outlet is formed in each radiator unit; the memory bank, the GPU, the hard disk, the SSD and the power supply are provided with heat exchange cooling devices; a second cooling liquid inlet and a second cooling liquid outlet are formed in the heat exchange cooling device; cooling liquid flows out of the first cooling liquid outlet and flows into the heat exchange cooling device through the second cooling liquid inlet. And the cooling liquid flows out from the second cooling liquid outlet and flows out from the liquid outlet. By optimizing the structural design of the liquid cooling system, the cooling efficiency is improved, the liquid flow resistance is reduced, and the uniformity of the cooling effect is ensured, so that efficient heat dissipation is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, and in particular to a full liquid cooling server based on a one-inlet and multiple-outlet manifold microchannel, which aims to evenly distribute cooling liquid to four microchannels of a cold plate through a one-inlet and four-outlet structure. Background Art

[0002] With the rapid development of information technology, the computing power of computer servers, especially data center servers, has been continuously improved. At the same time, the heat dissipation problem brought about by high-performance computing has become more and more prominent. Traditional air cooling systems have gradually been unable to meet the heat dissipation needs of modern high-density servers, especially when the power consumption of components such as processors and graphics cards increases. It is difficult to achieve efficient heat dissipation by relying solely on air cooling systems.

[0003] Liquid cooling technology is a cooling method superior to air cooling. It uses the thermal conductivity of liquid to quickly remove the heat generated by electronic components. It is widely used in supercomputing centers, big data centers, game servers, etc. However, existing liquid cooling solutions mostly use simple liquid circulation pipelines, which have problems such as low heat dissipation efficiency, poor cooling uniformity, and high liquid flow resistance. It cannot meet the growing heat dissipation needs of high-performance servers.

[0004] Therefore, how to design an efficient, uniform, and low-resistance liquid cooling system has become an important direction for solving the heat dissipation problem of high-performance servers. Summary of the invention

[0005] The purpose of the present invention is to provide a fully liquid-cooled server based on a one-inlet and multiple-outlet manifold microchannel, aiming to improve the cooling efficiency, reduce the liquid flow resistance, and ensure the uniformity of the cooling effect by optimizing the structural design of the liquid cooling system, thereby achieving efficient heat dissipation.

[0006] The technical solution adopted by the present invention is:

[0007] A full liquid cooling server based on a one-inlet and multiple-outlet manifold microchannel comprises a mainboard and a CPU, a memory stick, a GPU, a hard disk, an SSD and a power supply installed on the mainboard; a liquid inlet and a liquid outlet are arranged on a chassis of the server; a multi-outlet manifold microchannel radiator is installed on the CPU; the multi-outlet manifold microchannel radiator comprises a plurality of radiator units, and the plurality of radiator units share a first cooling liquid inlet; the cooling liquid flows in from the liquid inlet and flows into each radiator unit through the first cooling liquid inlet; a first cooling liquid outlet is arranged at each radiator unit; a heat exchange cooling device is respectively installed on the memory stick, the GPU, the hard disk, the SSD and the power supply; a second cooling liquid inlet and a second cooling liquid outlet are arranged on the heat exchange cooling device; the cooling liquid flows out from the first cooling liquid outlet and flows into the heat exchange cooling device through the corresponding second cooling liquid inlet; the cooling liquid in the heat exchange cooling device flows out from the second cooling liquid outlet and finally flows out from the liquid outlet.

[0008] Preferably, the multi-outlet manifold microchannel radiator is connected to the mainboard through pins; the multi-outlet manifold microchannel radiator also includes a cover plate, a mounting box and a VC heat spreader; the lower surface of the VC heat spreader is in direct contact with the CPU; the mounting box is a three-dimensional structure lacking a top surface, and the mounting box is arranged on the top of the VC heat spreader; a transverse and / or longitudinal partition is arranged in the cavity of the mounting box; the partition divides the cavity into a group of cavity units, and a plurality of liquid outlets are arranged at intervals on the side wall of the mounting box corresponding to each cavity unit; the An outlet sleeve is provided on the outside of the installation box and corresponds to the multiple liquid outlets of each cavity unit, and the coolant discharged from the multiple liquid outlets is concentrated in the outlet sleeve; the radiator unit is installed in the cavity unit accordingly; the radiator unit is divided into two layers, the upper layer is the manifold shunt structure layer, and the lower layer is the manifold microchannel structure layer; the cover plate covers the top of the installation box, and the first coolant inlet is set in the middle of the plate surface of the cover plate; the coolant enters the cavity from the first coolant inlet, and is evenly diverted to the manifold microchannel structure layer through the manifold shunt structure layer.

[0009] Preferably, the manifold diversion structure layer is in the shape of a plate; at least three coolant diversion ports are arranged in parallel and spaced apart on the manifold diversion structure layer, and each coolant diversion port is in the shape of a long strip; coolant sub-outlets are respectively arranged at both ends of the portion between each adjacent coolant diversion port on the manifold diversion structure layer; the liquid outlet on the mounting box is arranged corresponding to the coolant sub-outlet; the coolant is discharged from the coolant sub-outlet and the corresponding liquid outlet after heat exchange through the manifold microchannel structure layer, merges into the outlet sleeve, and is discharged from the outlet of the outlet sleeve.

[0010] Preferably, the manifold microchannel structure layer includes at least three first guide ribs arranged in parallel and spaced apart; the first guide ribs are connected to the bottom plate of the mounting box, and the two ends of the first guide ribs are respectively connected to the side walls on both sides of the mounting box; the first guide ribs are straight ribs or wavy ribs or columnar ribs, the rib thickness is 1-2mm, and the height is not less than 4mm.

[0011] Preferably, when the heat exchange cooling device is installed on a GPU or a hard disk or an SSD or a power supply, the heat exchange cooling device includes a flat microchannel radiator; the second coolant inlet and the second coolant outlet are respectively arranged on the flat microchannel radiator.

[0012] Preferably, when the heat exchange cooling device is installed on the memory stick, the heat exchange cooling device includes a flat microchannel radiator and a liquid collecting chamber; flat microchannel radiators are respectively attached to both sides of the memory stick, each flat microchannel radiator is connected to the liquid collecting chamber, and the second coolant inlet and the second coolant outlet are respectively on the liquid collecting chamber.

[0013] Preferably, the heat exchange cooling device comprises a flat microchannel radiator and a liquid collecting chamber; the flat microchannel radiator is attached to the hardware to be cooled, and the flat microchannel radiator is connected to the liquid collecting chamber;

[0014] The second coolant inlet and the second coolant outlet are respectively on the liquid collecting chamber.

[0015] Preferably, the flat-plate microchannel radiator is a rectangular three-dimensional structure surrounded by wall panels, and a second flow-guiding rib is arranged in the internal cavity of the flat-plate microchannel radiator.

[0016] Preferably, the second guide ribs are provided in multiple groups, and the multiple groups of second guide ribs are arranged in the cavity of the flat microchannel radiator, and the channels surrounded by the wall panels of the flat microchannel radiator are Z-shaped channels, S-shaped channels, or U-shaped channels.

[0017] The present invention has at least the following beneficial effects:

[0018] 1. The present invention adopts a full liquid cooling server with a one-inlet and multiple-outlet manifold microchannel. This radiator divides the heat of the CPU into multiple parts. The coolant can be evenly distributed to multiple radiator units, ensuring the flow uniformity of the coolant and improving the overall heat dissipation efficiency; and each part has a separate coolant outlet. Compared with other microchannel radiators, this solution can avoid the radiator outlet water temperature being too high to affect subsequent heat dissipation.

[0019] 2. Since each part of the full liquid cooling server with one inlet and multiple outlets of the manifold microchannel only takes away one Nth of the heat of the CPU, the outlet coolant temperature of each part is not high, and it can also dissipate heat for other parts. This full liquid cooling server with one inlet and multiple outlets of the manifold microchannel makes full liquid cooling possible, avoiding the problem of other microchannel radiators with high outlet coolant temperature and inability to dissipate heat for other parts.

[0020] 3. Each part of the full liquid cooling server with one-inlet and multiple-outlet manifold microchannel of the present invention adopts a manifold structure, which can reduce the flow distance of the coolant in the radiator, which is beneficial to reduce the resistance loss along the way, thereby reducing the pump work and improving the overall efficiency of the system; in addition, the microchannel design of the present invention ensures that the coolant can contact the heat source to the greatest extent, increases the surface area of ​​heat exchange, thereby enhancing the heat conduction effect and further improving the heat dissipation capacity.

[0021] 4. The server of the present invention adopts a full liquid cooling solution. The CPU, memory bar, GPU, hard disk, SSD, power supply and other modules all adopt liquid cooling, which has high heat dissipation efficiency and low noise than air-cooled servers (or air-liquid hybrid cooling servers); the liquid cooling design has a compact structure and can adapt to the space requirements of high-density servers. It is suitable for various forms of server chassis and has strong adaptability. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a rear view of the overall structure of the full liquid cooling server of the present invention.

[0024] Figure 2 It is a front view of the overall structure of the full liquid cooling server of the present invention.

[0025] Figure 3 It is a schematic diagram of the overall structure of the multi-outlet manifold microchannel radiator in the present invention.

[0026] Figure 4 It is an exploded view of the multi-outlet manifold microchannel radiator of the present invention.

[0027] Figure 5 It is a schematic diagram of the cover plate structure of the multi-outlet manifold microchannel radiator in the present invention.

[0028] Figure 6 It is a schematic diagram of the outlet sleeve structure of the multi-outlet manifold microchannel radiator in the present invention.

[0029] Figure 7 It is a structural schematic diagram of the radiator unit in the present invention.

[0030] Figure 8 It is a schematic diagram of the internal flow channel of the radiator unit in the present invention.

[0031] Fig. 9 It is a schematic diagram of the internal structure of the flat-plate microchannel radiator in the present invention.

[0032] Fig.10 It is a schematic diagram of the internal flow channel of the flat-plate microchannel radiator in the present invention.

[0033] Fig.11 It is a schematic diagram of the structure in which the heat exchange device structure of the present invention is arranged on the memory bar.

[0034] Fig.12 It is a schematic diagram of the heat exchange device and flow channel at the hard disk in the present invention.

[0035] Fig.13 It is a schematic diagram of the structure of the pin connection on the multi-outlet manifold microchannel radiator in the present invention.

[0036] Fig.14 It is a schematic diagram of the overall pipeline connection and flow channel of the full liquid cooling server in the present invention.

[0037] Fig.15 It is a schematic diagram of the planar structure in which the first guide rib is installed in the cavity unit in the present invention.

[0038] Figure 1: Mainboard; 2: Liquid inlet; 3: Liquid outlet; 4: CPU; 5: Memory stick; 6: GPU; 7: Hard disk; 8: SSD; 9: Power supply; 10: Multi-outlet manifold microchannel radiator; 101: Radiator unit; 11: Cover plate; 12: Manifold flow distribution structure layer; 13: Manifold microchannel structure layer; 14: VC heat sink; 15: Outlet sleeve; 16: First coolant outlet; 17: Liquid collection box; 24: Flat microchannel radiator; 25 - liquid collecting chamber; 26 - second cooling liquid inlet; 27 - second cooling liquid outlet; 28 - liquid input pipe; 29 - liquid output pipe; 30 - connecting pipe; 46 - pin; 47 - cooling liquid diversion port; 48 - first guide rib; 49 - cooling liquid sub-outlet; 50 - second guide rib; 111 - first cooling liquid inlet, 51 - mounting box, 52 - partition, 53 - cavity unit, 54 - liquid outlet. DETAILED DESCRIPTION

[0039] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0040] As a possible embodiment of the present invention, Figure 1-15 As shown, this full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel includes a motherboard 1 and a CPU 4, a memory bar 5, a GPU 6, a hard disk 7, an SSD 8 and a power supply 9 installed on the motherboard 1; a liquid inlet 2 and a liquid outlet 3 are arranged on the chassis of the server. Specifically, the motherboard 1 is installed on the chassis of the server, and the liquid inlet 2 and the liquid outlet 3 are arranged on the chassis of the server; two CPUs 4 are arranged at intervals in the middle horizontal axis of the motherboard 1, a memory bar 5 is arranged between the two CPUs 4, and a memory bar 5 is arranged on both sides of the two CPUs 4; two GPUs 6 are arranged, located on the front side of the motherboard 1, near the liquid inlet 2 and the liquid outlet 3; the SSD 8 and the power supply 9 are located on the left and right sides of the two GPUs 6 respectively; the hard disk 7 is arranged on the side of the motherboard 1 away from the liquid inlet 2 and the liquid outlet 3.

[0041] A multi-outlet manifold microchannel radiator 10 is installed on the CPU 4; in this embodiment, a multi-outlet manifold microchannel radiator 10 is installed on each CPU 4; the multi-outlet manifold microchannel radiator 10 is connected to the mainboard 1 through a pin 46; the multi-outlet manifold microchannel radiator 10 includes a cover plate 11, an installation box 51, a VC heat spreader 14 and a plurality of radiator units 101; the VC heat spreader 14 Vapor Chamber, also known as vacuum chamber heat spreader heat dissipation, temperature spreader or heat spreader; the lower surface of the VC heat spreader 14 is in direct contact with the CPU 4; the installation box 51 is a three-dimensional structure lacking a top surface, and the installation box 51 is arranged on the top of the VC heat spreader 14; a horizontal and / or vertical partition 52 is arranged in the cavity of the installation box 51; the partition 52 divides the cavity into a group of cavity units 53. In this embodiment, transverse and longitudinal partitions 52 are arranged in the cavity enclosed by the installation box 51 and the VC heat spreader 14, and the partitions 52 divide the cavity into four cavity units 53. The radiator unit 101 is correspondingly installed in the cavity unit 53; four radiator units 101 are arranged, and they are respectively correspondingly installed in the four cavity units 53. The radiator unit 101 is divided into two layers, the upper layer is the manifold diversion structure layer 12, and the lower layer is the manifold microchannel structure layer 13; a first coolant outlet 16 is arranged at each radiator unit 101; the cover plate 11 covers the top of the installation box 51, and a first coolant inlet 111 is arranged in the middle of the plate surface of the cover plate 11; the coolant enters the four cavity units 53 from the first coolant inlet 111, and is evenly diverted to the manifold microchannel structure layer 13 through the manifold diversion structure layer 12. A plurality of liquid outlet holes 54 are arranged at intervals on the side wall of the mounting box 51 corresponding to each cavity unit 53. The liquid outlet holes 54 may be two, three, four, etc., and are two in this embodiment. An outlet sleeve 15 is arranged on the outside of the mounting box 51 corresponding to the plurality of liquid outlet holes 54 of each cavity unit 53. The outlet sleeve 15 includes a liquid collecting box 17. The liquid collecting box 17 is a rectangular three-dimensional structure lacking a front side surface. The liquid collecting box 17 is fixedly connected to the front side wall or the rear side wall of the mounting box 51 and covers the two liquid outlet holes 54 therein. The coolant discharged from the plurality of liquid outlet holes 54 is concentrated in the liquid collecting box 17. The first coolant outlet 16 is connected to the middle of the outer side surface of the mounting box 51, and is used to discharge the coolant collected in the liquid collecting box 17.

[0042] The memory stick 5, GPU 6, hard disk 7, SSD 8 and power supply 9 are respectively installed with heat exchange cooling devices; when the heat exchange cooling device is installed on GPU 6 or hard disk 7 or SSD 8 or power supply 9, the heat exchange cooling device includes a flat microchannel radiator 24; the second coolant inlet 26 and the second coolant outlet 27 are respectively arranged on the flat microchannel radiator 24. When the hardware to be cooled is a hard disk 7, and there are at least two hard disks 7 stacked, a flat microchannel radiator 24 is arranged between two adjacent hard disks 7 and on the top of the uppermost hard disk 7, and the upper and lower adjacent flat microchannel radiators 24 are connected, the second coolant inlet 26 is arranged on the lowermost flat microchannel radiator 24, and the second coolant outlet 27 is arranged on the uppermost flat microchannel radiator 24, such as Fig.12 When the heat exchange cooling device is installed on the memory stick 5, the two sides of the memory stick 5 are respectively provided with flat microchannel heat sinks 24, and each flat microchannel heat sink 24 is connected to the liquid collecting cavity 25, as shown in FIG. Fig.10 As shown, the second coolant inlet 26 and the second coolant outlet 27 are respectively on the liquid collecting chamber 25; the coolant flows out from the first coolant outlet 16 and flows into the heat exchange cooling device through the corresponding second coolant inlet 26; the coolant in the heat exchange cooling device flows out from the second coolant outlet 27 and finally flows out from the liquid outlet 3.

[0043] In this embodiment, a multi-outlet manifold microchannel radiator 10 is provided on each of the two CPUs 4, and there are two first coolant inlets 111 in the entire device, namely, first coolant inlet No. 1 and first coolant inlet No. 2; four radiator units 101 are provided in each multi-outlet manifold microchannel radiator 10, and a first coolant outlet 16 is provided on each radiator unit 101; therefore, eight first coolant outlets 16 are provided on the two multi-outlet manifold microchannel radiators 10, namely, first coolant outlet No. 1, first coolant outlet No. 2, first coolant outlet No. 3, first coolant outlet No. 4, first coolant outlet No. 5, first coolant outlet No. 6, first coolant outlet No. 7, and first coolant outlet No. 8. At the same time, heat exchange cooling devices are respectively provided on the three memory sticks 5, the two GPUs 6, the hard disk 7, the SSD 8 and the power supply 9, and each heat exchange cooling device is provided with a second coolant inlet 26 and a second coolant outlet 27; a total of eight second coolant inlets 26 and eight second coolant outlets 27, namely, second coolant inlet No. 1 and second coolant outlet No. 1, second coolant inlet No. 2 and second coolant outlet No. 2, second coolant inlet No. 3 and second coolant outlet No. 3, second coolant inlet No. 4 and second coolant outlet No. 4, second coolant inlet No. 5 and second coolant outlet No. 5, second coolant inlet No. 6 and second coolant outlet No. 6, second coolant inlet No. 7 and second coolant outlet No. 7, second coolant inlet No. 8 and second coolant outlet No. 8.

[0044] In this embodiment, a liquid input pipe 28 is provided between the liquid inlet 2 and the first coolant inlet 111; a connecting pipe 30 is provided between the first coolant outlet 16 and the corresponding second coolant inlet 26; and a liquid output pipe 29 is provided between the second coolant outlet 27 and the liquid outlet 3.

[0045] Therefore, in this embodiment, there are 8 coolant circulation pipelines:

[0046] Pipeline 1: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 1-second coolant inlet No. 1-second coolant outlet No. 1-liquid outlet 3.

[0047] Pipeline 2: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 2-second coolant inlet No. 2-second coolant outlet No. 2-liquid outlet 3.

[0048] Pipeline 3: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 3-second coolant inlet No. 3-second coolant outlet No. 3-liquid outlet 3.

[0049] Pipeline 4: liquid inlet 2-first coolant inlet No. 1-first coolant outlet No. 4-second coolant inlet No. 4-second coolant outlet No. 4-liquid outlet 3.

[0050] Pipeline 5: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 5-second coolant inlet No. 5-second coolant outlet No. 5-liquid outlet 3.

[0051] Pipeline 6: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 6-second coolant inlet No. 6-second coolant outlet No. 6-liquid outlet 3.

[0052] Pipeline 7: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 7-second coolant inlet No. 7-second coolant outlet No. 7-liquid outlet 3.

[0053] Pipeline 8: liquid inlet 2-first coolant inlet No. 2-first coolant outlet No. 8-second coolant inlet No. 8-second coolant outlet No. 8-liquid outlet 3.

[0054] In this embodiment, the manifold diversion structure layer 12 is plate-shaped; at least three coolant diversion ports 47 are arranged in parallel and spaced apart on the manifold diversion structure layer 12, and each coolant diversion port 47 is in the shape of a long strip; coolant sub-outlets 49 are respectively arranged at both ends of the portion between each adjacent coolant diversion port 47 on the manifold diversion structure layer 12; the coolant sub-outlet 49 is a strip groove arranged at the bottom of the portion between adjacent coolant diversion ports 47; the liquid outlet 54 on the mounting box 51 is arranged corresponding to the coolant sub-outlet 49; the coolant is discharged from the coolant sub-outlet 49 and the corresponding liquid outlet 54 after heat exchange through the manifold microchannel structure layer 13, merges into the outlet sleeve 15, and is discharged from the outlet of the outlet sleeve 15.

[0055] In this embodiment, the manifold microchannel structure layer 13 includes at least three first guide ribs 48 arranged in parallel and spaced apart; the first guide ribs 48 are connected to the bottom plate of the mounting box 51, and the two ends of the first guide ribs 48 are respectively connected to the side walls on both sides of the mounting box 51; the first guide ribs 48 are straight ribs or wavy ribs or columnar ribs, the rib thickness is 1-2mm, and the height is not less than 4mm.

[0056] In this embodiment, the flat microchannel radiator 24 is a rectangular three-dimensional structure surrounded by wall panels, and a second guide rib 50 is arranged in the internal cavity of the flat microchannel radiator 24; the second guide rib 50 is provided with two groups, and the channel surrounded by the two groups of second guide ribs 50 and the wall panels of the flat microchannel radiator 24 is a multi-stage S-shaped channel; the two groups of second guide ribs 50 are respectively connected to the side walls on the opposite sides of the flat microchannel radiator 24, and are arranged in a staggered interval; one end of the second guide rib 50 is fixedly connected to the side wall on the corresponding side, and a gap for the circulation of coolant is left between one end of the second guide rib 50 and the side wall on the opposite side; the second guide rib 50 is a straight rib plate or a wavy rib or a columnar rib.

[0057] Of course, in other embodiments, the channel surrounded by the second guide rib 50 and the side wall of the flat microchannel heat sink 24 can also be a multi-stage Z-shaped channel or a U-shaped channel.

[0058] In addition, the above figures are only schematic illustrations of the processes included in the method according to the exemplary embodiment of the present invention, and are not intended to be limiting. It is easy to understand that the processes shown in the above figures do not indicate or limit the time sequence of these processes.

[0059] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the present invention should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A full liquid cooling server based on a one-inlet-multiple-outlet manifold microchannel, comprising a motherboard (1) and a CPU (4), a memory stick (5), a GPU (6), a hard disk (7), an SSD (8) and a power supply (9) installed on the motherboard (1); a liquid inlet (2) and a liquid outlet (3) are arranged on the chassis of the server; the characteristics are: The CPU (4) is provided with a multi-outlet manifold microchannel radiator (10); the multi-outlet manifold microchannel radiator (10) comprises a plurality of radiator units (101), and the plurality of radiator units (101) share a first cooling liquid inlet (111); the cooling liquid flows in from the liquid inlet (2) and flows into each radiator unit (101) through the first cooling liquid inlet (111); a first cooling liquid outlet (16) is provided at each radiator unit (101); a heat exchange cooling device is respectively provided on the memory bar (5), GPU (6), hard disk (7), SSD (8) and power supply (9); a second cooling liquid inlet (26) and a second cooling liquid outlet (27) are provided on the heat exchange cooling device; the cooling liquid flows out from the first cooling liquid outlet (16) and flows into the heat exchange cooling device through the corresponding second cooling liquid inlet (26); the cooling liquid in the heat exchange cooling device flows out from the second cooling liquid outlet (27) and finally flows out from the liquid outlet (3).

2. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 1 is characterized in that: The multi-outlet manifold microchannel heat sink (10) is connected to the mainboard (1) via a pin (46); the multi-outlet manifold microchannel heat sink (10) further comprises a cover plate (11), a mounting box (51) and a VC heat sink (14); the lower surface of the VC heat sink (14) is in direct contact with the CPU (4); the mounting box (51) is a three-dimensional structure lacking a top surface, and the mounting box (51) is arranged on the top of the VC heat sink (14); a transverse and / or longitudinal partition ( 52); the partition (52) divides the cavity into a group of cavity units (53); a plurality of liquid outlet holes (54) are arranged at intervals on the side wall of the installation box (51) corresponding to each cavity unit (53); an outlet sleeve (15) is arranged on the outer side of the installation box (51) corresponding to the plurality of liquid outlet holes (54) of each cavity unit (53); the coolant discharged from the plurality of liquid outlet holes (54) is concentrated in the outlet sleeve (15); the radiator unit (101) is correspondingly installed in the cavity unit (53); The radiator unit (101) is divided into two layers, the upper layer is a manifold diversion structure layer (12), and the lower layer is a manifold microchannel structure layer (13); the cover plate (11) covers the top of the installation box (51), and the first coolant inlet (111) is arranged in the middle of the plate surface of the cover plate (11); the coolant enters the cavity through the first coolant inlet (111), and is evenly diverted to the manifold microchannel structure layer (13) through the manifold diversion structure layer (12).

3. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 2 is characterized in that: The manifold shunt structure layer (12) is in the shape of a plate; at least three coolant shunt ports (47) are arranged in parallel and at intervals on the manifold shunt structure layer (12), and each coolant shunt port (47) is in the shape of a long strip; coolant sub-outlets (49) are respectively arranged at both ends of the portion between each adjacent coolant shunt port (47) on the manifold shunt structure layer (12); the liquid outlet (54) on the mounting box (51) is arranged corresponding to the coolant sub-outlet (49); the coolant is discharged from the coolant sub-outlet (49) and the corresponding liquid outlet (54) after heat exchange in the manifold microchannel structure layer (13), merged into the outlet sleeve (15), and discharged from the outlet of the outlet sleeve (15).

4. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 2 is characterized in that: The manifold microchannel structure layer (13) includes at least three first guide ribs (48) arranged in parallel and at intervals; the first guide ribs (48) are connected to the bottom plate of the installation box (51), and the two ends of the first guide ribs (48) are respectively connected to the side walls on both sides of the installation box (51); the first guide ribs (48) are straight ribs or wavy ribs or columnar ribs, the rib thickness is 1-2 mm, and the height is not less than 4 mm.

5. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 1, characterized in that: When the heat exchange cooling device is installed on a GPU (6) or a hard disk (7) or an SSD (8) or a power supply (9), the heat exchange cooling device comprises a flat microchannel radiator (24); the second cooling liquid inlet (26) and the second cooling liquid outlet (27) are respectively arranged on the flat microchannel radiator (24).

6. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 1, characterized in that: When the heat exchange cooling device is installed on the memory bar (5), the heat exchange cooling device comprises a flat microchannel radiator (24) and a liquid collecting chamber (25); the flat microchannel radiators (24) are respectively attached to the two sides of the memory bar (5), each flat microchannel radiator (24) is connected to the liquid collecting chamber (25), and the second cooling liquid inlet (26) and the second cooling liquid outlet (27) are respectively on the liquid collecting chamber (25).

7. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 1, characterized in that: The flat-plate microchannel radiator (24) is a rectangular three-dimensional structure surrounded by wall panels, and a second flow guide rib (50) is arranged in the internal cavity of the flat-plate microchannel radiator (24).

8. The full liquid cooling server based on one-inlet and multiple-outlet manifold microchannel according to claim 7 is characterized in that: The second flow guide ribs (50) are provided in multiple groups, and the multiple groups of second flow guide ribs (50) are arranged in the cavity of the flat microchannel radiator (24), and the channels surrounded by the wall panels of the flat microchannel radiator (24) are Z-shaped channels, S-shaped channels, or U-shaped channels.

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