Liquid Cooling Heat Dissipation Device and Server

Abstract

The present application discloses a liquid cooling heat dissipation device and a server, relating to the technical field of server heat dissipation, including a main heat exchange flow channel; the board heat exchange mechanism includes a fixed shaft, a quick locking assembly and a board heat exchange sub-board. The board heat exchange sub-board is sleeved on the fixed shaft so that the board heat exchange sub-board can rotate around the fixed shaft and slide axially along the fixed shaft. The board heat exchange sub-board is used to clamp the corresponding board, and the quick locking assembly is used to abut the board heat exchange sub-board against the main heat exchange flow channel. When it is necessary to replace the board, it is only necessary to open the quick locking assembly and rotate the board heat exchange sub-board around the fixed shaft, then the board can be taken out and a new board can be replaced, without removing the board heat exchange sub-board for disassembly and assembly. The present application supports the independent disassembly, installation and maintenance of the board, greatly improving the flexibility, convenience and safety of production, testing and operation and maintenance.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a liquid cooling device and a server. Background Art

[0002] With the economic development of society, especially with the development of artificial intelligence technology, higher demands are placed on the computing power of IT equipment such as servers, which has led to a rapid increase in the power consumption of boards in servers. At the same time, higher requirements are also placed on the deployment density of IT equipment such as servers, which makes liquid cooling technology the best choice to meet the high-density and high-power dissipation requirements of servers.

[0003] However, in the related art, with the iterative upgrade of servers, the distance between adjacent board slots in the server is getting smaller and smaller, and the frequency of board replacement is relatively high. The liquid cooling device for dissipating heat from the boards in the server has the problem of difficulty in installation and operation and maintenance. Summary of the invention

[0004] The present application provides a liquid cooling device and a server to at least solve the problem of difficult installation and operation and maintenance of boards and liquid cooling devices in the related art.

[0005] The present application provides a liquid cooling device, comprising:

[0006] Main heat exchange flow channel;

[0007] The plate-card heat exchange mechanism comprises a fixed shaft, a quick locking assembly and a plurality of plate-card heat exchange sub-plates. The plate-card heat exchange sub-plates are passed through the fixed shaft so that the plate-card heat exchange sub-plates can rotate around the fixed shaft and slide axially along the fixed shaft. The plate-card heat exchange sub-plates are used to clamp corresponding plates. The quick locking assembly is used to fix the plurality of plate-card heat exchange sub-plates and abut against the main heat exchange flow channel so that the plate-card heat exchange sub-plates can exchange heat with the main heat exchange flow channel.

[0008] The present application also provides a server, comprising the above-mentioned liquid cooling device.

[0009] With the liquid cooling and heat dissipation device of the present application, since the board heat exchange sub-board is penetrated through the fixed shaft, fixed by the quick locking assembly, and abuts against the main heat exchange flow channel, the board heat exchange sub-board is used to clamp the corresponding board, simplifying the installation and disassembly process of the board heat exchange sub-board, reducing the operation time, and improving the operation and maintenance efficiency. Therefore, when it is necessary to replace the board, it is only necessary to open the quick locking assembly and rotate the board heat exchange sub-board of the corresponding board around the fixed shaft, then the board can be taken out and a new board can be replaced, without removing the board heat exchange sub-board for disassembly and assembly; the board heat exchange sub-board is penetrated through the fixed shaft, so the board heat exchange sub-board can move freely along the axial direction of the fixed shaft. During actual assembly, the position of the board heat exchange sub-board can be adaptively and precisely adjusted according to the position of the board to ensure the best fit with the board. The present application supports the independent disassembly, installation and maintenance of the board, greatly improving the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0011] Figure 1 Structural schematic diagram of a server provided by an embodiment of the present application;

[0012] Figure 2 For Figure 1 Structural schematic diagram of the liquid cooling and heat dissipation device of the server shown;

[0013] Figure 3 For Figure 2 Structural schematic diagram of the liquid cooling and heat dissipation device shown;

[0014] Figure 4 For Figure 2 Partial exploded structural schematic diagram of the liquid cooling and heat dissipation device of the server shown;

[0015] Figure 5 For Figure 3 Structural schematic diagram of the main heat exchange flow channel of the liquid cooling and heat dissipation device shown;

[0016] Figure 6 For Figure 5 Structural schematic diagram of another perspective of the main heat exchange flow channel shown;

[0017] Figure 7 For Figure 5 Partial exploded structural schematic diagram of the main heat exchange flow channel shown;

[0018] Figure 8 ForFigure 7 The enlarged structural schematic diagram of the partial structure of the main heat exchange channel shown;

[0019] Figure 9 is Figure 5 The sectional view of the main heat exchange channel shown;

[0020] Figure 10 is Figure 3 The structural schematic diagram of the board heat exchange sub - board of the liquid - cooled heat dissipation device shown;

[0021] Figure 11 is Figure 10 One of the partial exploded structural schematic diagrams of the board heat exchange sub - board shown;

[0022] Figure 12 is Figure 10 Another of the partial exploded structural schematic diagrams of the board heat exchange sub - board shown;

[0023] Figure 13 is Figure 10 The structural schematic diagram of the main cold plate of the board heat exchange sub - board shown;

[0024] Figure 14 is Figure 10 The structural schematic diagram of another perspective of the board heat exchange sub - board shown;

[0025] Figure 15 is Figure 10 The sectional view of the board heat exchange sub - board shown;

[0026] Figure 16 is Figure 3 The structural schematic diagram of the board heat exchange mechanism of the liquid - cooled heat dissipation device shown;

[0027] Figure 17 is Figure 16 The structural schematic diagram when the board heat exchange mechanism is assembled;

[0028] Figure 18 is Figure 16 The structural schematic diagram after the board heat exchange mechanism is assembled;

[0029] Figure 19 is Figure 18 The structural schematic diagram of the quick - locking assembly of the board heat exchange mechanism shown;

[0030] Figure 20 is Figure 18 The structural schematic diagram of another perspective after the board heat exchange mechanism is assembled;

[0031] Figure 21 is Figure 3 The partial exploded structural schematic diagram of the liquid leakage detection mechanism of the liquid - cooled heat dissipation device shown;

[0032] Figure 22 is Figure 21 a partially enlarged structural schematic diagram of the liquid leakage detection mechanism shown;

[0033] Figure 23 is Figure 3 a structural schematic diagram when the liquid cooling and heat dissipation device shown is assembled.

[0034] Among them, the above-mentioned drawings include the following reference numerals:

[0035] 100 - liquid cooling and heat dissipation device; 10 - main heat exchange flow channel; 11 - main heat exchange sub - flow channel; 111 - first main heat exchange sub - flow channel; 112 - second main heat exchange sub - flow channel; 113 - third main heat exchange sub - flow channel; 114 - liquid distribution port; 115 - liquid collection port; 116 - sub - flow channel joint; 12 - connecting pipeline; 121 - first branch connecting pipeline; 122 - second branch connecting pipeline; 13 - cover plate; 131 - flow channel cavity; 132 - rib structure; 133 - heat conduction groove; 134 - heat exchange pad; 14 - bottom plate; 141 - shovel tooth structure; 15 - inlet; 16 - outlet; 17 - second positioning hole; 18 - second non - loosening screw; 19 - fixing seat; 30 - board - card heat exchange mechanism; 31 - fixing shaft; 32 - quick - locking assembly; 321 - pressure rod bracket; 322 - pressure rod; 323 - lock; 3231 - locking pin; 3232 - guiding inclined surface; 324 - lock piece; 3241 - stop piece; 3242 - dial piece; 325 - limit screw; 326 - pressure rod sleeve; 327 - elastic piece; 328 - convex structure; 33 - board - card heat exchange sub - plate; 331 - main cold plate; 3311 - base plate; 3312 - reinforcement frame; 3313 - limit groove; 3314 - heat pipe groove; 3315 - heat pipe; 3316 - guiding pin; 332 - auxiliary cold plate; 3321 - heat conduction pad groove; 3322 - guiding hole; 333 - heat conduction pad; 334 - locking switch assembly; 3341 - cam wrench; 3342 - cam rotating shaft; 3343 - pressing slider; 3344 - guiding shaft; 3345 - cam part; 3346 - handle part; 3347 - compression spring; 3348 - guiding groove; 3349 - guiding block; 335 - anti - scratch film; 336 - through hole; 40 - liquid leakage detection mechanism; 41 - first diversion groove; 42 - detection wire groove; 43 - liquid leakage detection wire; 44 - second diversion groove; 50 - supply - return liquid joint assembly; 51 - liquid inlet pipeline; 52 - liquid return pipeline; 80 - cold plate support; 81 - first positioning pin; 82 - first non - loosening screw; 83 - second positioning pin; 84 - support screw hole; 200 - server; 201 - main board; 202 - processor; 203 - board card; 204 - first positioning hole; 205 - main board screw hole; 206 - supply - return liquid quick joint. Detailed implementation manners

[0036] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts belong to the protection scope of the present application.

[0037] It should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be construed as a limitation on the present application. The terms "installation", "connection", and "coupling" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within the acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either of them. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood in specific situations.

[0038] In order to enable those skilled in the art of this technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0039] Such as Figure 1 、 Figure 2 and Figure 3As shown, the liquid cooling device 100 provided in the embodiment of the present application is used in a server 200. The server 200 includes a motherboard 201, a processor 202, a board 203 and the liquid cooling device 100. The processor 202 and the board 203 are arranged on the motherboard 201. The liquid cooling device 100 is used to perform liquid cooling on the board 203.

[0040] In some possible implementations, the server 200 is a dual-way general-purpose server.

[0041] In some possible implementations, the board 203 is a memory, but is not limited thereto.

[0042] The liquid cooling device 100 includes a main heat exchange channel 10 and a board heat exchange mechanism 30. The main heat exchange channel 10 is used to communicate with the coolant flow path. The board heat exchange mechanism 30 is in heat exchange contact with the main heat exchange channel 10. The board heat exchange mechanism 30 is sandwiched with the board 203 to cool the board 203.

[0043] Please also see Figure 5 In some possible implementations, the board heat exchange mechanism 30 performs heat exchange for the memory and can be used as a memory heat exchange mechanism. The board heat exchange mechanism 30 includes a fixed shaft 31, a quick locking assembly 32, and a plurality of board heat exchange sub-plates 33. The board heat exchange sub-plates 33 are inserted into the fixed shaft 31 so that the board heat exchange sub-plates 33 rotate around the fixed shaft 31 and slide axially along the fixed shaft 31. The board heat exchange sub-plates 33 are used to be clamped on the corresponding board 203, and the quick locking assembly 32 is used to fix and abut the plurality of board heat exchange sub-plates 33 on the main heat exchange flow channel 10 so that the board heat exchange sub-plates 33 and the main heat exchange flow channel 10 can perform heat exchange.

[0044] Specifically, the quick locking assembly 32 applies pressure to the plate card heat exchange sub-plate 33 so that the plate card heat exchange sub-plate 33 is pressed against the main heat exchange flow channel 10 , thereby allowing the plate card heat exchange sub-plate 33 to exchange heat with the main heat exchange flow channel 10 .

[0045] In some possible implementations, multiple boards 203 are arranged in sequence on the main board 201, the axial direction of the fixed shaft 31 is parallel to the arrangement direction of the multiple boards 203, the quick locking assembly 32 is arranged on one side of the board 203, and along the arrangement direction of the multiple boards 203, the multiple board heat exchange sub-plates 33 rotated on the fixed shaft 31 are pressed onto the corresponding boards 203.

[0046] The board heat exchange sub-board 33 is passed through the fixed shaft 31, fixed by the quick locking assembly 32, and abuts against the main heat exchange flow path 10. The board heat exchange sub-board 33 clamps the corresponding board 203. Therefore, when the board 203 needs to be replaced, simply operate to open the quick locking assembly 32, and rotate the board heat exchange sub-board 33 of the corresponding board 203 around the fixed shaft 31, then the board 203 can be taken out and a new board 203 can be replaced without removing the board heat exchange sub-board 33 for disassembly and assembly, greatly simplifying the replacement process of the board 203; the board heat exchange sub-board 33 is passed through the fixed shaft 31, so the board heat exchange sub-board 33 can move freely on the fixed shaft 31. During actual assembly, the position of the board heat exchange sub-board 33 can be adaptively and precisely adjusted according to the position of the board 203 to ensure the best contact and heat exchange efficiency between the board heat exchange sub-board 33 and the board 203, achieving the best fit, improving the structural compatibility and reliability of the board heat exchange sub-board 33, and improving the heat dissipation effect.

[0047] Since the liquid cooling heat dissipation device 100 of the present application supports the independent disassembly, installation and maintenance of the board 203, the operation and maintenance personnel can replace and maintain the components more quickly, reduce the unnecessary disassembly and assembly times of the required heat dissipation electronic components, greatly improve the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance, reduce the downtime, improve the availability and maintenance efficiency of the server 200, improve the structural compatibility and reliability of the board heat exchange mechanism 30, can meet various operation and maintenance scenarios in the data center, is beneficial to reducing the failure rate of liquid cooling components and electronic components, and reducing the development and operation and maintenance costs.

[0048] At the same time, the application of the quick locking assembly 32 realizes tool-free installation, reduces the risk of misoperation during the disassembly and assembly process, and enhances the safety and reliability of the system.

[0049] In some possible implementation manners, the main heat exchange flow path 10 includes a plurality of main heat exchange sub-flow paths 11, and the plurality of main heat exchange sub-flow paths 11 are sequentially communicated through the connecting pipelines 12.

[0050] In some possible implementation manners, the main heat exchange flow path 10 includes a first main heat exchange sub-flow path 111, a second main heat exchange sub-flow path 112 and a third main heat exchange sub-flow path 113. The connecting pipeline 12 includes a first branch connecting pipeline 121 and a second branch connecting pipeline 122. The first main heat exchange sub-flow path 111 is communicated with the second main heat exchange sub-flow path 112 through the first branch connecting pipeline 121, and the second main heat exchange sub-flow path 112 is communicated with the third main heat exchange sub-flow path 113 through the second branch connecting pipeline 122.

[0051] By dividing the main heat exchange flow path 10 into multiple sub-flow paths, segmented heat dissipation can be realized. Each sub-flow path can focus on the heat management of a specific area or component, thereby improving the overall heat dissipation efficiency.

[0052] In some possible implementations, the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 are located in the same row and are oppositely arranged with respect to the second main heat exchange sub-channel 112.

[0053] In some possible implementations, the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 are located at the rear side of the processor 202 and the board 203, and the second main heat exchange sub-channel 112 is located at the front side of the processor 202 and the board 203.

[0054] Please refer to Figure 6 as well. In some possible implementations, a liquid distribution port 114 is provided on the first main heat exchange sub-channel 111, and a liquid collection port 115 is provided on the third main heat exchange sub-channel 113. The liquid cooling heat dissipation device 100 further includes a second heat exchange mechanism. The liquid distribution port 114 and the liquid collection port 115 are respectively communicated with the second heat exchange mechanism, so that the second heat exchange mechanism is communicated with the main heat exchange channel 10 through the liquid distribution port 114 and the liquid collection port 115.

[0055] In some possible implementations, the second heat exchange mechanism is a processor heat exchange mechanism. When the processor heat exchange mechanism is in a connected state with the main heat exchange channel 10 through the liquid distribution port 114 and the liquid collection port 115, the first branch enters the processor heat exchange mechanism from the liquid distribution port 114 on the side wall of the first main heat exchange sub-channel 111, continuously takes away the heat generated during the operation of the processor 202 chip, so as to ensure that the temperature of the processor 202 chip is always within the normal range. Subsequently, the coolant flows out through the liquid collection port 115 into the main heat exchange channel 10.

[0056] The second branch passes through the flow channel in the first main heat exchange sub-channel 111 at the rear side. After changing the flow direction of the coolant through the first branch connection pipeline 121, it reaches the second main heat exchange sub-channel 112 near the front side of the chassis. After the coolant absorbs the heat transferred from the board heat exchange sub-board 33 in the second main heat exchange sub-channel 112 at the front side and flows out, it then reaches the third main heat exchange sub-channel 113 at the rear side through the second branch connection pipeline 122. Subsequently, it flows along the flow channel in the third main heat exchange sub-channel 113 at the rear side and converges with the coolant of the first branch at the liquid collection port 115.

[0057] In some possible implementations, sub-channel connectors 116 are respectively provided at the opposite ends of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 and at both ends of the second main heat exchange sub-channel 112. The sub-channel connector 116 of the first main heat exchange sub-channel 111 is connected to the sub-channel connector 116 on one side of the second main heat exchange sub-channel 112 through the first branch connection pipeline 121. The sub-channel connector 116 on the other side of the second main heat exchange sub-channel 112 is connected to the sub-channel connector 116 of the third main heat exchange sub-channel 113 through the second branch connection pipeline 122.

[0058] Please also refer to Figure 7 , Figure 8 and Figure 9 , in some possible implementation manners, the main heat exchange sub-channel 11 includes a cover plate 13 and a bottom plate 14. A flow channel cavity 131 is provided in the cover plate 13, and the bottom plate 14 covers the flow channel cavity 131. The board heat exchange sub-board 33 abuts against the cover plate 13.

[0059] The combination of the cover plate 13 and the bottom plate 14 provides a closed and stable structure, ensuring the integrity and sealing of the flow channel cavity 131, preventing coolant leakage, and improving the reliability of the system. At the same time, the design of the flow channel cavity 131 can optimize the fluid path according to specific heat dissipation requirements, ensuring that the coolant maximally contacts the heat source during the flow process and improving the heat exchange efficiency.

[0060] The design of the flow channel cavity 131 allows the coolant to flow inside the cover plate 13, directly communicate with the second heat exchange mechanism, realize efficient heat exchange, be able to quickly take away the heat generated by the processor 202, and improve the heat dissipation efficiency. Due to the direct communication design between the second heat exchange mechanism and the flow channel cavity 131, the second heat exchange mechanism can be conveniently disassembled and replaced during maintenance without affecting the installation of the board heat exchange sub-board 33, improving the maintainability of the system.

[0061] The board heat exchange sub-board 33 directly abuts against the cover plate 13, enabling the board heat exchange sub-board 33 to more flexibly exchange heat with the coolant in the flow channel cavity 131, reducing the thermal resistance in the heat transfer path, and enabling the heat generated by the board 203 to be more quickly transferred to the coolant.

[0062] , in some possible implementation manners, rib structures 132 are provided in the flow channel cavity 131. The rib structures 132 protrude in the flow channel cavity 131 and are arranged along the extending direction of the flow channel cavity 131.

[0063] The rib structures 132 increase the surface area inside the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving the heat exchange efficiency, and enabling the heat to be more quickly transferred from the heat source to the coolant. The rib structures 132 can guide the flow path of the coolant in the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding the occurrence of flow dead zones or local overheating phenomena.

[0064] At the same time, the rib structures 132 can disturb the flow of the coolant and promote the formation of turbulence. Compared with laminar flow, the fluid in the turbulent flow state has higher heat transfer ability, thereby improving the convective heat transfer between the flow channel cavity 131 and the coolant and being able to more effectively take away the heat.

[0065] The rib structure 132 not only helps to improve the heat exchange efficiency, but also can enhance the structural strength of the flow channel cavity 131, acting as a reinforcing rib, improving the liquid pressure resistance ability of the flow channel cavity 131, and preventing deformation or rupture under high-pressure conditions.

[0066] The shape and spacing of the rib structure 132 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0067] In some possible implementation manners, a shovel tooth structure 141 is provided on the bottom plate 14, and the shovel tooth structure 141 is arranged in the flow channel cavity 131 along the extending direction of the flow channel cavity 131. The shovel tooth structure 141 is distributed directly below the contact area between the flow channel cavity 131 and the board card heat exchange sub-plate 33.

[0068] The shovel tooth structure 141 increases the surface area inside the flow channel cavity 131, thereby expanding the contact area between the coolant and the flow channel wall, improving the heat exchange efficiency, and enabling heat to be transferred from the heat source to the coolant more quickly. The shovel tooth structure 141 can guide the flow path of the coolant in the flow channel cavity 131, ensuring that the fluid is evenly distributed throughout the flow channel and avoiding the occurrence of flow dead zones or local overheating phenomena.

[0069] At the same time, the shovel tooth structure 141 can disturb the flow of the coolant and promote the formation of turbulence. Compared with laminar flow, the fluid in the turbulent flow state has a higher heat transfer ability and can take away heat more effectively.

[0070] The shovel tooth structure 141 not only helps to improve the heat exchange efficiency, but also can enhance the structural strength of the flow channel cavity 131, improve its pressure resistance ability, and prevent deformation or rupture under high-pressure conditions.

[0071] The shape, length, height and spacing of the shovel tooth structure 141 can be designed and adjusted according to specific heat dissipation requirements to achieve the best thermal management effect.

[0072] In some possible implementation manners, the rib structure 132 is located in the middle of the flow channel cavity 131 to divide the flow channel cavity 131 into two parts, and multiple shovel tooth structures 141 are respectively located in the flow channel cavities 131 on both sides. The tooth tops of the shovel tooth structures 141 are welded to the cover plate 13 to be integrated, so as to further divide the flow channel cavity 131 and form multiple micro-channels.

[0073] In some possible implementation manners, the first main heat exchange sub-channel 111 is provided with an inlet 15. The third main heat exchange sub-channel 113 is provided with an outlet 16. The inlet 15 and the outlet 16 are respectively located in the middle of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113, and a baffle structure is divided in the flow channel cavities 131 of the first main heat exchange sub-channel 111 and the third main heat exchange sub-channel 113 through the rib structure 132.

[0074] After the coolant enters the first main heat exchange sub-channel 111 from the inlet 15, a part of the liquid enters the second heat exchange mechanism through the liquid distribution port 114 to form the first branch, and the other part flows along the flow channel cavity 131 of the first main heat exchange sub-channel 111 to form the second branch. After flowing in the first main heat exchange sub-channel 111 in the direction of the third main heat exchange sub-channel 113, it undergoes a single baffle and then flows in the direction away from the third main heat exchange sub-channel 113. Then it enters the first branch connection pipeline 121 through the sub-channel joint 116. After passing through the second main heat exchange sub-channel 112, it reaches the third main heat exchange sub-channel 113 at the rear through the second branch connection pipeline 122. Subsequently, it flows in the direction of the first main heat exchange sub-channel 111 along the flow channel in the rear third main heat exchange sub-channel 113, and after undergoing a single baffle, it converges with the coolant of the first branch at the liquid collection port 115 and flows out of the main heat exchange channel 10 through the outlet 16.

[0075] In some possible implementation manners, the fixed shaft 31 is arranged on the cover plate 13, and the axial direction of the fixed shaft 31 is the same as the extending direction of the flow channel cavity 131 in the cover plate 13, so as to sequentially arrange a plurality of board heat exchange sub-boards 33 along the extending direction of the flow channel cavity 131.

[0076] Please also refer to Figure 10 , in some possible implementation manners, a plurality of board heat exchange sub-boards 33 are divided into two groups along the length direction of the board 203. The two groups of board heat exchange sub-boards 33 are arranged oppositely, and along the length direction of the board 203, each group of board heat exchange sub-boards 33 respectively clamps one end of the corresponding board 203. The board heat exchange sub-boards 33 at both ends are axially symmetric structures and are combined into a set of board heat exchange sub-boards 33 to jointly dissipate heat for one board 203.

[0077] By dividing the board heat exchange sub-boards 33 into two groups and respectively clamping one end of the board 203 along the length direction of the board 203, the length of the board heat exchange sub-boards 33 is reduced. Since the ability of the board heat exchange sub-boards 33 to resist stress bending and deformation is improved after the length of the board heat exchange sub-boards 33 is reduced, the stiffness of each board heat exchange sub-board 33 can be effectively increased, the risk of deformation of the board heat exchange sub-boards 33 during the process of fitting with and plugging and unplugging the board 203 is reduced, the stability of the overall structure is improved, which helps to maintain good contact between the board heat exchange sub-boards 33 and the board 203 during the installation and disassembly processes, and ensures the heat dissipation performance. At the same time, the disconnected area between the two board heat exchange sub-boards 33 can also effectively prevent the chip protruding in the center of the board 203 from being damaged by extrusion during plugging and unplugging.

[0078] The daughter board heat exchanger sub-board 33 is connected to the main heat exchange flow channel 10 through the fixed shaft 31, so the daughter board heat exchanger sub-board 33 can move freely on the fixed shaft 31. During actual assembly, the daughter board heat exchanger sub-board 33 can adapt to and precisely adjust its own position according to the position of the daughter board 203, effectively solving the problem of poor fitting between the daughter board heat exchanger sub-board 33 and the daughter board 203 caused by the assembly tolerance of related components within the server 200, and ensuring the best fit with the daughter board 203.

[0079] Please also refer to Figure 11 、 Figure 12 、 Figure 13 and Figure 14 In some possible implementation manners, the daughter board heat exchanger sub-board 33 includes a main cold plate 331, a secondary cold plate 332, a thermal pad 333, and a locking switch assembly 334. Along the thickness direction of the daughter board 203, the main cold plate 331 is located on one side of the daughter board 203. The secondary cold plate 332 is movably disposed on the main cold plate 331 and is located on the other side of the daughter board 203. The thermal pad 333 is disposed on the sides of the main cold plate 331 and the secondary cold plate 332 facing the daughter board 203. The main cold plate 331 and the secondary cold plate 332 are passed through the fixed shaft 31. The locking switch assembly 334 is disposed on the main cold plate 331, and the locking switch assembly 334 is used to drive the secondary cold plate 332 to move towards the main cold plate 331 to press the thermal pad 333 on the main cold plate 331 and the secondary cold plate 332 onto the daughter board 203.

[0080] The thermal pad 333 is disposed on the sides of the main cold plate 331 and the secondary cold plate 332 facing the daughter board 203, ensuring good thermal contact between the daughter board heat exchanger sub-board 33 and the daughter board 203, improving the heat conduction efficiency, and being able to more effectively transfer the heat generated by the daughter board 203 to the daughter board heat exchanger sub-board 33 for heat dissipation.

[0081] The secondary cold plate 332 is movably disposed on the main cold plate 331 and is adjusted by the locking switch assembly 334, allowing adjustment according to the actual thickness of the daughter board 203 during installation to ensure close contact between the daughter board heat exchanger sub-board 33 and the daughter board 203.

[0082] The locking switch assembly 334 can drive the secondary cold plate 332 to move towards the main cold plate 331 to achieve quick locking, simplifying the installation and disassembly process of the daughter board heat exchanger sub-board 33, reducing the operation time, and improving the operation and maintenance efficiency. Through the adjustment of the locking switch assembly 334, an appropriate pressing force can be provided to avoid applying excessive mechanical stress to the daughter board 203, thereby reducing the risk of damage to the daughter board 203. The locking switch assembly 334 improves the overall reliability of the system, ensuring that the daughter board heat exchanger sub-board 33 can maintain good thermal contact with the daughter board 203 under various operating conditions.

[0083] The board heat exchange daughter board 33 can improve the structural compatibility, reliability, and operation flexibility of the board cold plate, and solve the problems of difficult insertion and extraction of the current board 203, poor contact of the heat dissipation surface, and cumbersome steps for replacing the board 203. The board heat exchange daughter board 33 is designed as a split type at both ends, that is, two groups of board heat exchange daughter boards 33 with a length approximately half of the length of the board 203 are combined to achieve the heat dissipation of each board 203. Each group of board heat exchange daughter boards 33 is designed with a locking switch assembly 334 for quick locking, which not only provides an adjustable spring force to ensure good fitting of the thermal conductive pad 333 with the board 203 and the required pressing force, but also can achieve manual quick locking and unlocking of the board heat exchange daughter board 33 with the board 203, while reducing the failure rate of the board 203 and further improving its service life.

[0084] In some possible implementation manners, the main cold plate 331 includes a base plate 3311 and a reinforcement frame 3312. The base plate 3311 is passed through the fixed shaft 31, the reinforcement frame 3312 is arranged on the base plate 3311, the auxiliary cold plate 332 is movably arranged on the reinforcement frame 3312, and the locking switch assembly 334 is arranged on the reinforcement frame 3312.

[0085] In some possible implementation manners, the reinforcement frame 3312 is designed at the top end of the base plate 3311. On the one hand, it is used to strengthen the rigidity of the base plate 3311 to prevent deformation caused by extrusion with the board 203 during use; on the other hand, the reinforcement frame 3312 can provide an installation hole position for the locking switch assembly 334 and will not interfere with the board 203 during the operation process.

[0086] The introduction of the reinforcement frame 3312 improves the overall rigidity and strength of the main cold plate 331, reduces the possible deformation of the board heat exchange daughter board 33 during installation and use, ensures the stable contact between the board heat exchange daughter board 33 and the board 203, and improves the heat dissipation efficiency. The reinforcement frame 3312 helps to evenly distribute the pressure applied on the locking switch assembly 334 during the locking process, avoid excessive local stress on the board 203, and reduce the risk of damage to the board 203.

[0087] In some possible implementation manners, a limiting groove 3313 is arranged on the base plate 3311, and the limiting groove 3313 is used to accommodate the thermal conductive pad 333.

[0088] The limiting groove 3313 provides a clear installation position for the thermal conductive pad 333, ensures the precise positioning of the thermal conductive pad 333 between the main cold plate 331 and the board 203, helps to maintain the effective contact area of the thermal conductive pad 333, and improves the heat conduction efficiency. The limiting groove 3313 can also effectively prevent the thermal conductive pad 333 from moving or sliding during installation and use, ensure that the thermal conductive pad 333 is always in the best position, and avoid the decrease in heat dissipation performance caused by position deviation.

[0089] The limiting groove 3313 provides a fixed position for the thermal pad 333, simplifying the installation process, reducing the possibility of installation errors, and improving the operation efficiency. At the same time, the limiting groove 3313 can also protect the edge of the thermal pad 333 to a certain extent, reducing damage caused by mechanical stress or friction, thereby extending the service life of the thermal pad 333.

[0090] In some possible implementation manners, a heat pipe groove 3314 is provided on one side of the substrate 3311 away from the limiting groove 3313, and the heat pipe groove 3314 is used for embedding a heat pipe 3315.

[0091] The heat pipe 3315 is an efficient heat conduction device that can transfer heat quickly. By embedding the heat pipe 3315 in the substrate 3311, heat can be transferred from the region of the board 203 to other parts more rapidly, improving the heat dissipation efficiency of the main cold plate 331.

[0092] The design of the heat pipe groove 3314 allows the heat pipe 3315 to be tightly embedded in the substrate 3311, ensuring uniform distribution of heat along the length direction of the heat pipe 3315, helping to avoid local overheating, and improving the temperature uniformity of the board 203. Embedding the heat pipe 3315 into the substrate 3311 through the heat pipe groove 3314 makes the main cold plate 331 more compact and does not significantly increase the volume of the board heat exchange daughter board 33. The heat pipe groove 3314 ensures tight contact between the heat pipe 3315 and the substrate 3311, reducing the thermal resistance in the heat transfer path and improving the heat conduction efficiency.

[0093] In some possible implementation manners, a thermal pad groove 3321 is provided on the side of the secondary cold plate 332 facing the board 203, and the thermal pad groove 3321 is used for accommodating the thermal pad 333.

[0094] The thermal pad groove 3321 provides a definite installation position for the thermal pad 333, ensuring precise positioning of the thermal pad 333 between the secondary cold plate 332 and the board 203, helping to maintain the effective contact area of the thermal pad 333, and improving the heat conduction efficiency. The thermal pad groove 3321 can also effectively prevent the thermal pad 333 from moving or sliding during installation and use, ensuring that the thermal pad 333 is always in the optimal position and avoiding a decrease in heat dissipation performance caused by position deviation.

[0095] The thermal pad groove 3321 provides a fixed position for the thermal pad 333, simplifying the installation process, reducing the possibility of installation errors, and improving the operation efficiency. At the same time, the thermal pad groove 3321 can also protect the edge of the thermal pad 333 to a certain extent, reducing damage caused by mechanical stress or friction, thereby extending the service life of the thermal pad 333.

[0096] The hardness of the thermal pads 333 on the main cold plate 331 and the auxiliary cold plate 332 is the same. Therefore, the acting forces exerted by the locking switch assembly 334 on the main cold plate 331 and the auxiliary cold plate 332 are the same. So, the clamping forces on the two sides of the board 203 are also consistent, avoiding the situation in the previous solution where the board 203 tilts to one side due to different contact methods or size deviations on both sides of the board 203, which may cause stress damage to the gold fingers of the board 203 and the board slot, and is beneficial to reducing the failure rate of the board 203 and further improving its service life.

[0097] In some possible implementation manners, one of the main cold plate 331 and the auxiliary cold plate 332 is provided with a guide pin 3316, and the other is provided with a guide hole 3322 opposite to the guide pin 3316.

[0098] The design of the guide pin 3316 and the guide hole 3322 ensures that the main cold plate 331 and the auxiliary cold plate 332 can be accurately aligned during the installation process, which helps to ensure good contact between the board heat exchange sub-board 33 and the board 203 and improve the heat conduction efficiency.

[0099] The guide pin 3316 and the guide hole 3322 provide a simple and effective alignment mechanism, making the installation process more intuitive and convenient, reducing the possibility of installation errors, and improving the operation efficiency. During use, the guide pin 3316 and the guide hole 3322 can effectively prevent the relative misalignment of the main cold plate 331 and the auxiliary cold plate 332, ensuring the stable structure of the board heat exchange sub-board 33 during operation.

[0100] In some possible implementation manners, through holes 336 are provided on the base plate 3311 and the auxiliary cold plate 332. The through holes 336 are used for passing through the fixed shaft 31. The through holes 336 and the fixed shaft 31 cooperate to form a hinge structure, enabling the base plate 3311 and the auxiliary cold plate 332 to rotate on the fixed shaft 31.

[0101] In some possible implementation manners, there is no heat pipe groove on the auxiliary cold plate 332, so its thickness can be appropriately reduced to meet the requirements of the spacing of the board 203.

[0102] Please also refer to Figure 15 , in some possible implementation manners, the locking switch assembly 334 includes a cam wrench 3341, a cam rotating shaft 3342, a pressing slider 3343, and a guide shaft 3344. The cam wrench 3341 is rotatably arranged on the reinforcement frame 3312 through the cam rotating shaft 3342. The guide shaft 3344 is arranged on the reinforcement frame 3312. The auxiliary cold plate 332 passes through the guide shaft 3344, and the pressing slider 3343 is arranged on the auxiliary cold plate 332 and faces the cam wrench 3341. The cam wrench 3341 is used to push the pressing slider 3343 to move axially along the guide shaft 3344, so that the auxiliary cold plate 332 moves towards the main cold plate 331.

[0103] When installing the board heat exchange daughter board 33 onto the board 203, the main cold plate 331 and the auxiliary cold plate 332 rotate together around the fixed shaft 31 to both sides of the board 203. Until they contact the main heat exchange sub-channel 11, at this time, the quick locking assembly 32 is lowered and locked. Finally, the cam wrench 3341 is pulled from the vertical position to the horizontal position to lock. During the process, the cam of the cam wrench 3341 rotates from the small diameter to the large diameter, pushing the pressing slider 3343 to translate along the guide shaft 3344. During the above process, the pressing slider 3343 will drive the auxiliary cold plate 332 to translate. The heat conduction pads 333 on the main cold plate 331 and the auxiliary cold plate 332 will first contact the board 203. As the main cold plate 331 and the auxiliary cold plate 332 continue to translate and clamp the board 203 under the cam thrust, the heat conduction pad 333 can be further compressed to ensure that the required pre-tightening force is met between the heat conduction pad 333 and the board 203, reducing the contact thermal resistance and achieving the best heat dissipation effect.

[0104] The close fitting and unlocking of the board heat exchange daughter board 33 and the board 203 only require pulling the cam wrench 3341. The operation is quick and reliable, effectively reducing the failure rate and operation time of electronic component replacement. The use of the cam wrench 3341 makes the locking and unlocking process simple and intuitive. The operator can quickly complete the installation and disassembly of the board heat exchange daughter board 33 and the board 203, improving the operation efficiency.

[0105] Through the rotation of the cam rotating shaft 3342, the cam wrench 3341 can precisely control the movement of the pressing slider 3343, allowing an accurate pressing force to be applied to the auxiliary cold plate 332 to ensure good thermal contact between the board heat exchange daughter board 33 and the board 203.

[0106] The guide shaft 3344 provides a stable sliding path, preventing the auxiliary cold plate 332 from shifting or tilting during movement, ensuring the stability of the board heat exchange daughter board 33. Through the cam mechanism, the pressing slider 3343 can move smoothly along the axial direction of the guide shaft 3344, ensuring that the force applied to the auxiliary cold plate 332 is uniform, reducing local stress concentration, and reducing the risk of damage to the board 203.

[0107] In some possible implementation manners, the cam wrench 3341 has a cam portion 3345 and a handle portion 3346. The cam portion 3345 is rotatably arranged on the cam rotating shaft 3342 and is in abutting cooperation with the pressing slider 3343. The handle portion 3346 is connected to the cam portion 3345.

[0108] Through the abutting cooperation with the pressing slider 3343, the cam portion 3345 can convert the rotational motion into a linear motion, thereby precisely controlling the pressing force applied to the auxiliary cold plate 332, helping to ensure good thermal contact between the board heat exchange daughter board 33 and the board 203, and improving the heat dissipation efficiency.

[0109] The handle 3346 provides an interface that is easy to grasp and operate, so that the user can easily rotate the cam wrench 3341, thereby improving the efficiency of installation and removal and reducing the operation time. By adjusting the rotation angle of the handle 3346, the user can easily adjust the size of the clamping force, allowing for flexible adjustment according to specific installation requirements to ensure the best clamping effect.

[0110] In some possible implementations, the mating surfaces of the cam portion 3345 and the clamping slider 3343 are arc surfaces, which can ensure smooth sliding during the mating process.

[0111] In some possible implementations, a self-locking surface is provided on the cam portion 3345, and the self-locking surface can cooperate with the clamping slider 3343 to achieve self-locking of the cam wrench 3341 to prevent accidental loosening or movement, ensure that the locking switch assembly 334 remains stable during operation, and maintains precise alignment and position, thereby improving the accuracy and performance of the entire system and improving the overall reliability of the system.

[0112] In some possible implementations, the locking switch assembly 334 also includes a compression spring 3347, which is sleeved on the guide shaft 3344 and located on the side of the clamping slider 3343 away from the cam wrench 3341, and one side of the compression spring 3347 is connected to the reinforcement frame 3312, and the other side is connected to the clamping slider 3343.

[0113] The compression spring 3347 provides a buffer mechanism that can absorb and alleviate mechanical shocks and vibrations that may occur during installation and use, helping to protect the board heat exchange sub-board 33 and the board 203 and extend their service life.

[0114] The difference between the large diameter and the small diameter of the cam portion 3345 is the horizontal displacement of the auxiliary cold plate 332, based on which the parameters such as the compression amount of the thermal pad 333 can be further calculated, which is convenient for design and selection. When it is necessary to operate or unlock the board heat exchange sub-plate 33, pull the cam wrench 3341 from the horizontal position to the vertical position, that is, open the locking switch device. During the process, the cam portion 3345 rotates from the large diameter to the small diameter, and the compression spring 3347 pushes the clamping slider 3343 to move in the direction of release during the rebound process. At this time, the thermal pads 333 of the main cold plate 331 and the auxiliary cold plate 332 and the board 203 change from a compressed state to a non-contact state. Therefore, after unlocking the quick locking assembly 32, opening the board slot switch can make the board 203 smoothly pulled out from the main board 201, realizing tool-free and quick replacement.

[0115] In some possible implementations, one of the clamping slider 3343 and the guide shaft 3344 is provided with a guide groove 3348 , and the other is provided with a guide block 3349 relative to the guide groove 3348 .

[0116] The cooperation of the guiding groove 3348 and the guiding block 3349 can ensure that the main cold plate 331 and the auxiliary cold plate 332 will not tilt during the translation process, thereby improving the accuracy of fitting with the board card 203.

[0117] The combination of the guiding groove 3348 and the guiding block 3349 ensures the precise linear movement of the pressing slider 3343 along the guiding shaft 3344, which helps to prevent the pressing slider 3343 from shifting or tilting during movement, ensuring that the applied pressing force is uniform and stable. The design of the guiding groove 3348 and the guiding block 3349 provides a clear movement path, reducing the friction and wear between the pressing slider 3343 and other components, thereby extending the service life of the components. The precise guiding mechanism improves the reliability of the locking and unlocking operations, ensuring that the expected pressing effect can be achieved for each operation and enhancing the overall reliability of the system.

[0118] In some possible implementation manners, the board card heat exchange sub-board 33 further includes an anti-scratch film 335, and the anti-scratch film 335 is attached to the heat-conducting pad 333, the main cold plate 331 and the auxiliary cold plate 332.

[0119] The anti-scratch film 335 can effectively protect the surfaces of the heat-conducting pad 333, the main cold plate 331 and the auxiliary cold plate 332, reduce the friction force during installation, and prevent scratches, wear or other physical damages during installation, operation and maintenance, thereby extending the service life of the components, maintaining the integrity and heat-conducting performance of the heat-conducting pad 333, and ensuring that heat can be efficiently transferred from the board card 203 to the board card heat exchange sub-board 33.

[0120] The anti-scratch film 335 can also prevent dust, grease and other pollutants from adhering to the surfaces of the heat-conducting pad 333, the main cold plate 331 and the auxiliary cold plate 332, keep the components clean, and improve the heat dissipation efficiency. The presence of the anti-scratch film 335 makes the cleaning and maintenance process simpler. Users can easily wipe off the dirt on the film without worrying about damaging the surfaces of the heat-conducting pad 333, the main cold plate 331 and the auxiliary cold plate 332.

[0121] In some possible implementation manners, the cover plate 13 is provided with a heat-conducting groove 133, a heat-exchange pad 134 is arranged in the heat-conducting groove 133, and the board card heat exchange sub-board 33 abuts against the heat-exchange pad 134.

[0122] The design of the heat-conducting groove 133 can reduce the thermal resistance of the heat of the board card 203 continuing to be transferred to the main heat-exchange sub-channel 11 through the board card heat exchange sub-board 33. On the one hand, it can reduce the wall thickness of the main heat-exchange sub-channel 11 in this heat-conducting area and reduce its heat-conducting thermal resistance; on the other hand, it can better fix the position of the heat-exchange pad 134, prevent it from moving, generating wrinkles or falling off after being compressed, thereby improving the service life.

[0123] The heat exchange pad 134 can effectively fill the gap in the heat conduction area between the daughter heat exchange board 33 of the board card and the cover plate 13, ensuring close contact between the two, reducing the contact thermal resistance, improving the heat conduction efficiency, and transferring the heat generated by the board card 203 to the cover plate 13 more quickly for heat dissipation.

[0124] The combined design of the heat conduction groove 133 and the heat exchange pad 134 reduces the thermal resistance in the heat transfer path, ensuring that heat can be efficiently transferred from the daughter heat exchange board 33 of the board card to the cover plate 13.

[0125] The heat conduction groove 133 provides a definite position for placing the heat exchange pad 134, simplifies the installation process, ensures the correct positioning of the heat exchange pad 134, and improves the operation efficiency.

[0126] The heat exchange pad 134 has a certain flexibility and can compensate for the possible unevenness on the surfaces of the daughter heat exchange board 33 of the board card and the cover plate 13, thereby increasing the contact area and heat conduction efficiency.

[0127] Please also refer to Figure 16 、 Figure 17 、 Figure 18 、 Figure 19 and Figure 20 , in some possible implementation manners, the quick locking assembly 32 includes a lever bracket 321, a lever 322, a lock 323, and a lock piece 324. The lock 323 is arranged on the main heat exchange channel 10. One end of the lever 322 is rotatably arranged on the lever bracket 321. A lock piece 324 is arranged at the other end of the lever 322. The lock 323 cooperates with the lock piece 324 to lock the lever 322 and make the lever 322 abut against the side of the daughter heat exchange board 33 of the board card away from the main heat exchange channel 10, so that the daughter heat exchange board 33 of the board card abuts against the main heat exchange channel 10.

[0128] The quick locking assembly 32 is used to apply a certain clamping force to the daughter heat exchange board 33 of the board card, further improving the heat conduction efficiency between the daughter heat exchange board 33 of the board card and the main heat exchange sub-channel 11 and reducing its contact thermal resistance.

[0129] The design of the quick locking assembly 32 allows the user to quickly lock or release the daughter heat exchange board 33 through simple operation of the lever 322, greatly simplifying the installation and disassembly processes and improving the operation efficiency.

[0130] The cooperation between the lock 323 and the lock piece 324 provides a stable mechanical connection, ensuring that the lever 322 can firmly hold the daughter heat exchange board 33 against the main heat exchange channel 10 and preventing loosening or displacement during use. The design of the lever 322 makes the force applied to the daughter heat exchange board 33 uniform, ensuring good contact between the daughter heat exchange board 33 of the board card and the main heat exchange channel 10 and improving the heat conduction efficiency.

[0131] In some possible implementations, the pressure rod bracket 321 and the lock buckle 323 are respectively arranged on the main heat exchange flow channel 10 and are located on both sides of the plurality of sequentially arranged boards 203. When the lock buckle 323 cooperates with the locking piece 324, the extension direction of the pressure rod 322 is the same as the direction in which the plurality of boards 203 are sequentially arranged, thereby simultaneously pressing the plurality of board heat exchange sub-boards 33 onto the corresponding boards 203.

[0132] In some possible implementations, the quick locking assembly 32 further includes a limiting screw 325 . The limiting screw 325 is disposed on the pressure rod bracket 321 , and a pressure rod sleeve 326 is disposed at one end of the pressure rod 322 , and the pressure rod sleeve 326 is passed through the limiting screw 325 .

[0133] The limit screw 325 provides a clear limit function to ensure that the pressure rod 322 remains in a predetermined position during operation, which helps to ensure a stable connection between the plate card heat exchange sub-plate 33 and the main heat exchange flow channel 10. By limiting the movement range of the pressure rod 322, the limit screw 325 can prevent excessive force, thereby avoiding damage to the plate card heat exchange sub-plate 33 and other components.

[0134] The pressure rod sleeve 326 is passed through the limiting screw 325 to provide additional support and guidance, thereby enhancing the stability of the pressure rod 322 and reducing possible shaking or deviation during operation.

[0135] In some possible implementations, a spring sheet 327 is provided on one side of the pressure rod 322 facing the board heat exchange sub-plate 33 , and a protruding structure 328 is provided on the spring sheet 327 opposite to the board heat exchange sub-plate 33 .

[0136] The spring piece 327 has a certain elasticity and can provide additional cushioning and support when the pressure rod 322 applies force, adapt to slight dimensional changes caused by thermal expansion or other factors, and ensure stable contact between the board heat exchange sub-plate 33 and the main heat exchange flow channel 10. The spring piece 327 and the protruding structure 328 help to improve the heat conduction efficiency and enhance the heat dissipation effect.

[0137] The protruding structure 328 can concentrate the force on a specific area, ensuring that the pressure applied to the board heat exchange sub-plate 33 is uniform, reducing local stress concentration and reducing the risk of component damage.

[0138] The height of the protruding structure 328 on the corresponding spring sheet 327 can be designed according to the required compression amount of the heat exchange pad 134. When the pressure rod 322 is lowered and locked, the protruding structure 328 on the spring sheet 327 will squeeze the board heat exchange sub-plate 33, so that the spring sheet 327 will produce elastic deformation and generate a certain elastic force acting on the board heat exchange sub-plate 33. The force is transmitted through the board heat exchange sub-plate 33 and compresses the heat exchange pad 134 in the heat conduction groove 133 to meet its buckling force requirements.

[0139] In some possible implementations, the lock buckle 323 includes a locking pin 3231 and a guide slope 3232. The locking piece 324 is provided with a blocking piece 3241 and a paddle 3242. The locking pin 3231 and the blocking piece 3241 are limited and matched, and the paddle 3242 is connected to the blocking piece 3241. When the pressure rod 322 is pressed until the locking pin 3231 and the blocking piece 3241 are limited, locking can be achieved. When the paddle 3242 is toggled to disengage the locking pin 3231 from the blocking piece 3241, unlocking can be achieved, and tool-free installation is achieved, thereby improving operation efficiency.

[0140] The limiting cooperation between the locking pin 3231 and the baffle 3241 provides a stable locking mechanism, ensuring that the pressure rod 322 will not loosen when in the locked position, thereby maintaining a stable connection between the plate heat exchange sub-plate 33 and the main heat exchange flow channel 10. The guide bevel 3232 helps to guide the locking plate 324 into the correct position, reducing the need for precise alignment during operation, making the locking and unlocking process smoother and more intuitive. The presence of the guide bevel 3232 also reduces the direct friction between the locking plate 324 and the locking pin 3231, reducing wear and extending the service life of the component. The design of the paddle 3242 allows the user to quickly release the locking mechanism with a simple action, simplifying the disassembly process and improving operational efficiency.

[0141] In this solution, by unlocking the quick locking assembly 32 and the locking switch assembly 334, the board heat exchange sub-board 33 can be rotated and lifted along the fixed axis 31, and the board slot switch is completely exposed, and there is no device blocking the upper area, which is convenient for operators to directly unlock the board slot switch. This effectively solves the difficulty of unlocking the memory slot switch through the gap between adjacent memory cold plates through the memory cold plate in the existing memory cold plate solution, greatly improving the operating efficiency and safety.

[0142] Please also see Figure 21 and Figure 22 In some possible implementations, the liquid cooling device 100 further includes a liquid leakage detection mechanism 40, and the liquid leakage detection mechanism 40 includes a processor liquid leakage detection component and a board liquid leakage detection component.

[0143] The liquid leakage detection mechanism 40 can quickly detect any leakage in the liquid cooling system, issue an alarm in a timely manner or take automatic protection measures to prevent damage caused by liquid leakage. The processor 202 and the board 203 are key components in the computer system. The liquid leakage detection mechanism 40 specifically monitors these areas, which helps protect these key components from liquid damage and extends their service life. By quickly detecting and responding to liquid leakage problems, the system can be repaired before the problem expands, reducing unexpected downtime caused by liquid leakage and improving the availability of the system. The liquid leakage detection mechanism 40 can be integrated with the system's automated management and monitoring system to achieve real-time monitoring and automated response of the liquid cooling system, improving management efficiency. To meet the flexibility requirements, the processor liquid leakage detection component and the board liquid leakage detection component are independently designed, and each has an independent signal interface connected to the main board 201.

[0144] In some possible implementation manners, the processor liquid leakage detection component includes a second heat exchange mechanism detection piece, a second heat exchange mechanism and connecting pipeline connection detection piece, and a second heat exchange mechanism connecting pipeline detection piece.

[0145] The processor liquid leakage detection component is located at the welded joint of the second heat exchange mechanism, the connection between the second heat exchange mechanism and the connecting pipeline, and below the connecting pipeline of the second heat exchange mechanism and the maintenance joint connecting pipeline, etc. The leakage detection line can be fixed to metal parts such as the cold plate and the joint by winding along the outer diameter of the metal part, using acetic acid tape, waterproof tape or a buckle, etc. The leakage detection line can be fixed to the connecting pipeline by heat-shrinking the leakage detection line and the connecting pipeline inside a heat-shrinkable sleeve and then heat-shrinking.

[0146] By setting multiple detection pieces at key positions, the system can comprehensively monitor the second heat exchange mechanism, the connecting pipeline and their connection points to ensure that any potential liquid leakage problem can be detected in a timely manner. Comprehensive liquid leakage detection improves the overall reliability of the liquid cooling system, ensures safe operation under various operating conditions, and reduces the risk of failures caused by liquid leakage.

[0147] In some possible implementations, the liquid cooling heat dissipation device 100 further includes a cold plate bracket 80. The board leakage detection component includes a first diversion groove 41, a detection wire groove 42, and a leakage detection wire 43. The main heat exchange flow path 10 is provided on the cold plate bracket 80. The side of the cold plate bracket 80 facing the main heat exchange flow path 10 is provided with a detection wire groove 42 and a plurality of first diversion grooves 41. The plurality of first diversion grooves 41 are arranged at intervals. The detection wire groove 42 communicates with the plurality of first diversion grooves 41. The leakage detection wire 43 is arranged in the detection wire groove 42. The first diversion groove 41 is used to collect and divert the leaked liquid in the main heat exchange flow path 10 to prevent the leaked liquid in the main heat exchange flow path 10 from spreading to the main board 201 and damaging the circuit. The detection wire groove 42 is used to place and protect the leakage detection wire 43 on the one hand, to prevent it from being damaged by pulling and friction, and to receive the leaked liquid diverted by the first diversion groove 41 on the other hand. Once liquid leakage is detected, the electrical signal of the leakage detection wire 43 changes accordingly and triggers an alarm. After receiving the alarm signal, the server management module immediately issues an instruction to turn off the server power supply to avoid losses to equipment and data.

[0148] If the laying scheme of the processor leakage detection component is followed for the board leakage detection component, the leakage detection wire needs to be fixed to the main heat exchange sub-flow path 11 with tape to detect the leaked liquid. However, in actual use, due to the different structures of the board heat exchange sub-board 33 and the need to frequently operate the board 203, it is difficult to fix the leakage detection wire flat and firmly on the board heat exchange sub-board 33 in the above way. It is easy for the leakage detection wire to become loose or displaced and interfere with the switch of the board slot during the opening and closing process, resulting in damage to the leakage detection wire due to wear and pulling, and inability to lock due to interference with the board slot switch, causing faults such as the board 203 not being properly installed. If the number of fixing tapes is increased, a part of the leaked liquid will be absorbed and isolated, affecting the accuracy of the leakage detection system. Therefore, in this solution, the board leakage detection component takes into account both the convenience of installation and operation and maintenance and the accuracy of the detection function.

[0149] The arrangement of multiple first liquid diversion grooves 41 can effectively guide any potential liquid leakage into specific detection liquid grooves 42, ensuring that the liquid leakage can be quickly collected and detected, and reducing the diffusion of liquid in the system. By arranging multiple spaced first liquid diversion grooves 41 and detection liquid grooves 42 on the cold plate bracket 80, the system can cover a larger area, ensuring that liquid leakage at any position can be detected, and improving the overall detection coverage rate. The connected design of the detection liquid groove 42 and multiple first liquid diversion grooves 41 enables the liquid leakage detection line 43 to quickly detect the liquid in any first liquid diversion groove 41, providing a timely liquid leakage alarm and preventing the liquid from damaging the system. It can achieve efficient and reliable liquid leakage detection in a limited space, is not prone to interference with the board 203, is firmly fixed and has good contact, is not easily damaged during installation and operation and maintenance, reduces the difficulty of production and operation and maintenance operations, effectively improves the detection accuracy rate as well as the installation and operation and maintenance efficiency, and saves the server downtime.

[0150] In some possible implementation manners, a fixed seat 19 is provided on the main heat exchange flow channel 10, and the fixed seat 19 is used to connect the second heat exchange mechanism.

[0151] A connector is provided on the fixed seat 19. One of the connection ends of the connector and the second heat exchange mechanism is a female connector, and the other is a male connector. When the two are docked with each other, the connection of the second heat exchange mechanism can be realized.

[0152] In some possible implementation manners, a second liquid diversion groove 44 penetrating the main heat exchange flow channel 10 is provided on the main heat exchange flow channel 10 below the connection port of the second heat exchange mechanism and the fixed seat 19, and the second liquid diversion groove 44 is communicated with the detection liquid groove 42.

[0153] The arrangement of the second liquid diversion groove 44 can effectively guide any liquid leakage from the connection port of the second heat exchange mechanism, enabling it to quickly flow into the detection liquid groove 42, thereby improving the efficiency of liquid leakage detection. By communicating the second liquid diversion groove 44 with the detection liquid groove 42, the system can cover a larger detection area, not only limited to the area of the board 203, but also including the area near the connection port of the second heat exchange mechanism, ensuring comprehensive monitoring. Since the second liquid diversion groove 44 directly penetrates the main heat exchange flow channel 10, any liquid leakage can be quickly guided to the liquid leakage detection line 43 in the detection liquid groove 42. Therefore, when liquid leakage occurs at the connection port of the second heat exchange mechanism, the leaked liquid will drip on the surface of the main heat exchange flow channel 10 under the action of gravity. When the liquid accumulates to a certain volume, it will flow along the second liquid diversion groove 44 to the detection liquid groove 42, and the liquid leakage detection line 43 arranged in the detection liquid groove 42 will trigger an alarm immediately after being wetted, thus achieving a quick response and reducing the potential damage of the liquid to the system. This design makes the liquid leakage detection system more integrated and simplified, reduces the need for additional sensors or complex wiring, and reduces the system complexity and cost.

[0154] In some possible implementation manners, the width of the second liquid guiding groove 44 covers the range where liquid leakage may occur at the connection of the fixing seat 19 and the second heat exchange mechanism, that is, the width of the second liquid guiding groove 44 is greater than the gap between the female joint and the male joint, so as to more comprehensively detect the liquid leakage at the connection of the second heat exchange mechanism.

[0155] In some possible implementation manners, the inlet 15 is arranged adjacent to one of the fixing seats 19, the outlet 16 is arranged adjacent to the other fixing seat 19, and the length of the second liquid guiding groove 44 covers the inlet 15 and one of the fixing seats 19, or the outlet 16 and the fixing seat 19, so as to simultaneously detect the liquid leakage at the inlet 15 and the fixing seat 19, or the outlet 16 and the fixing seat 19.

[0156] The liquid leakage detection mechanism 40 of the present application effectively solves the liquid leakage detection problem of the connection port of the second heat exchange mechanism in a limited space. For the quick connectors and other movable connecting parts that may be used in the second heat exchange mechanism, they need to be connected during operation and disconnected during maintenance. The accuracy of liquid leakage detection and the service life are crucial. If the liquid leakage detection line is directly laid along the connection direction of the quick connector and fixed to it, it is necessary to require a wiring terminal in the middle of the liquid leakage detection line to enable connection and disconnection. Therefore, in actual use, before unlocking and disconnecting the quick connector, it is necessary to first disconnect the wiring terminal of the liquid leakage detection line here, and after the quick connector is connected and locked, it is necessary to reconnect the wiring terminal of the liquid leakage detection line here. The above operation steps will inevitably increase the operation difficulty and time, and if not careful, it will also cause the liquid leakage detection line to be damaged by external force pulling. At the same time, the outer shape of the quick connector is often a continuous curved surface in the axial direction. Problems such as the liquid leakage detection line being difficult to fit well with the quick connector and fixed, and being unable to cover all areas of liquid droplet leakage will also lead to low detection accuracy. The liquid leakage detection mechanism 40 of this solution not only avoids the complex liquid leakage detection line circuit winding on the board heat exchange sub-board 33, solves the interference problem that is likely to occur in practical applications, but also effectively improves the detection accuracy and the installation, operation and maintenance efficiency, and saves the server downtime.

[0157] In some possible implementation manners, the cold plate bracket 80 is provided with a first positioning pin 81 and a first non-loosening screw 82. The first positioning pin 81 corresponds to the first positioning hole 204 on the main board 201, and the first non-loosening screw 82 corresponds to the main board screw hole 205 on the main board.

[0158] The first positioning pin 81 corresponds to the positioning hole 204 on the main board, ensuring that the cold plate bracket 80 can be accurately positioned on the main board 201, which helps to ensure the correct alignment of the cold plate bracket 80 with the processor 202 or other components, thereby optimizing the heat conduction efficiency. The design of the first positioning pin 81 and the first non-loosening screw 82 makes the installation process simpler and more intuitive, reduces the possibility of installation errors, improves the operation efficiency, facilitates the maintenance and replacement of the cold plate bracket 80 and related components. Users can easily remove and reinstall these components, reducing the maintenance cost. Users can easily fix the cold plate bracket 80 in place without complex adjustments. The design of the first non-loosening screw 82 ensures that the screw will not fall off during installation and maintenance, reducing the risk of losing the screw, and at the same time ensuring that the cold plate bracket 80 remains stable during use, preventing loosening caused by vibration or movement.

[0159] In some possible implementation manners, the main heat exchange flow channel 10 is provided with a second positioning hole 17 and a second non-loosening screw 18, and the cold plate bracket 80 is provided with a second positioning pin 83 and a bracket screw hole 84. The second positioning pin 83 corresponds to the second positioning hole 17, and the second non-loosening screw 18 corresponds to the bracket screw hole 84.

[0160] The second positioning pin 83 corresponds to the second positioning hole 17, ensuring the precise alignment of the cold plate bracket 80 with the main heat exchange flow channel 10, which helps to optimize the liquid flow path and heat conduction efficiency, and ensures the efficient operation of the system.

[0161] The design of the second positioning pin 83 and the second non-loosening screw 18 makes the installation process simpler and more intuitive. Users can easily fix the main heat exchange flow channel 10 to the cold plate bracket 80 without complex adjustments, reducing the possibility of installation errors, facilitating the maintenance and replacement of the main heat exchange flow channel 10 and related components. Users can easily remove and reinstall these components, reducing the maintenance cost. The design of the second non-loosening screw 18 ensures that the screw will not fall off during installation and maintenance, reducing the risk of losing the screw and the screwdriver slipping, and at the same time ensuring that the main heat exchange flow channel 10 remains stable during use, preventing loosening caused by vibration or movement.

[0162] In some possible implementation manners, the liquid cooling heat dissipation device 100 further includes a supply and return liquid joint assembly 50. The supply and return liquid joint assembly 50 is communicated with the main heat exchange flow channel 10, and the supply and return liquid joint assembly 50 is mainly used for the on-off of the cooling liquid flow path in the server 200.

[0163] The introduction of the supply and return liquid joint assembly 50 allows the coolant to circulate in the main heat exchange flow path 10, removing the heat generated by electronic components such as the processor 202 and the circuit board 203, thereby achieving efficient thermal management and heat dissipation. The supply and return liquid joint assembly 50 can be integrated with an external cooling system (such as a chiller or a radiator) to provide a flexible heat dissipation solution, adapting to different application requirements and environmental conditions. Through continuous liquid circulation, the liquid cooling heat dissipation device 100 can maintain a stable temperature within the system, prevent overheating, and improve the performance and reliability of electronic devices.

[0164] In some possible implementation manners, the supply and return liquid joint assembly 50 is fixed at the leftmost side of the rear window of the server 200. After being connected to the water distributor at the cabinet end through the supply and return liquid quick connector 206, the coolant circuit is conducted, achieving the separation of water and electricity from the power module on the right side of the server 200 to the greatest extent.

[0165] In some possible implementation manners, the supply and return liquid joint assembly 50 includes a liquid inlet pipeline 51 and a liquid return pipeline 52. The liquid inlet pipeline 51 is communicated with one side of the main heat exchange flow path 10, and the liquid return pipeline 52 is communicated with the other side of the main heat exchange flow path 10.

[0166] The coolant enters the liquid cooling heat dissipation device 100 of the server 200 through the supply and return liquid quick connector 206, reaches the first main heat exchange sub-flow path 111 through the liquid inlet pipeline 51, and returns the coolant flowing out of the third main heat exchange sub-flow path 113 to the supply and return liquid quick connector 206 through the liquid return pipeline 52, thus completing the entire circulation process of the coolant within the server 200.

[0167] By connecting the liquid inlet pipeline 51 and the liquid return pipeline 52 to both sides of the main heat exchange flow path 10 respectively, a complete circulation path is formed, ensuring that the coolant can effectively flow through the entire main heat exchange flow path 10, removing the heat generated by the equipment and achieving efficient heat exchange. This design allows for flexible configuration of the flow direction and flow rate of the coolant to adapt to different heat dissipation requirements and system configurations, providing greater design and application flexibility.

[0168] Please refer to Figure 23, during installation, in the first step, install the cold plate bracket 80. Align all the first positioning pins 81 on the cold plate bracket 80 and place them into the first positioning holes 204 on the main board 201. At this time, the first non-loosening screw 82 can also be aligned with the main board screw hole 205. Fasten the first non-loosening screw 82 in place. In the second step, lift the pressure lever 322, rotate all the board card heat exchange sub-plates 33 around the fixed shaft 31 to the maximum elevation angle position, then lower and lock the pressure lever 322. Then rotate all the board card heat exchange sub-plates 33 in the opposite direction around the fixed shaft 31 and lean them against the pressure lever 322. The pressure lever 322 plays a role in blocking and limiting the board card heat exchange sub-plates 33 to prevent them from falling further. In the third step, align the second positioning hole 17 on the main heat exchange channel 10 with the second positioning pin 83 on the cold plate bracket 80, and lower the main heat exchange channel 10 and the board card heat exchange sub-plates 33 together. At this time, the second non-loosening screw 18 on the main heat exchange channel 10 is also aligned with the bracket screw hole 84 on the cold plate bracket 80. Fasten the second non-loosening screw 18 in place. Then, fasten the supply and return liquid joint assembly 50 to the rear window of the chassis with screws. In the fourth step, install the board card heat exchange sub-plates 33, insert the board card 203, lift the pressure lever 322, rotate all the board card heat exchange sub-plates 33 around the fixed shaft 31 to the position covering the board card 203 particles, then lower and lock the pressure lever 322, and finally pull the locking switch assembly 334 to press the board card 203. In the fifth step, install the signal interface of the liquid leakage detection line. Connect the signal interfaces of the liquid leakage detection lines of the second heat exchange mechanism and the board card heat exchange sub-plates 33 to the main board 201 according to the bit numbers respectively, and the installation of the entire liquid cooling and heat dissipation system can be completed.

[0169] The liquid cooling and heat dissipation device 100 provided by the embodiment of the present application includes a main heat exchange channel 10 and a board card heat exchange mechanism 30. The board card heat exchange mechanism 30 includes a fixed shaft 31, a quick locking assembly 32 and a plurality of board card heat exchange sub-plates 33. The board card heat exchange sub-plates 33 are sleeved on the fixed shaft 31 and sandwich the corresponding board cards 203. The quick locking assembly 32 is used to fix and abut the board card heat exchange sub-plates 33 on the main heat exchange channel 10 so that the board card heat exchange sub-plates 33 exchange heat with the main heat exchange channel 10. The board card heat exchange sub-plates 33 include a main cold plate 331, a sub-cold plate 332, a heat conducting pad 333 and a locking switch assembly 334. Along the thickness direction of the board card 203, the main cold plate 331 is located on one side of the board card 203, the sub-cold plate 332 is movably arranged on the main cold plate 331 and is located on the other side of the board card 203. The heat conducting pad 333 is arranged on the sides of the main cold plate 331 and the sub-cold plate 332 facing the board card 203. The main cold plate 331 and the sub-cold plate 332 are sleeved on the fixed shaft 31. The locking switch assembly 334 is arranged on the main cold plate 331. The locking switch assembly 334 is used to drive the sub-cold plate 332 to move towards the main cold plate 331 to press the heat conducting pads 333 on the main cold plate 331 and the sub-cold plate 332 against the board card 203.

[0170] The board heat exchange sub-board 33 is threaded through the fixed shaft 31 and fixed by the quick locking assembly 32, and abuts against the main heat exchange flow path 10. The board heat exchange sub-board 33 clamps the corresponding board 203. Therefore, when the board 203 needs to be replaced, only a simple operation is required to open the quick locking assembly 32, and rotate the board heat exchange sub-board 33 of the corresponding board 203 around the fixed shaft 31, then the board 203 can be taken out and a new board 203 can be replaced, without removing the board heat exchange sub-board 33 for disassembly and assembly, which greatly simplifies the replacement process of the board 203; the board heat exchange sub-board 33 is threaded through the fixed shaft 31, so the board heat exchange sub-board 33 can move freely on the fixed shaft 31. During actual assembly, it can adapt to the position of the board 203 and precisely adjust its own position to ensure the best contact and heat exchange efficiency between the board heat exchange sub-board 33 and the board 203, achieving the best fit and improving the heat dissipation effect.

[0171] Since the liquid cooling heat dissipation device 100 of the present application supports the independent disassembly, installation and maintenance of the processor 202 and the board 203, the operation and maintenance personnel can replace and maintain the components more quickly, greatly improving the flexibility, maintainability, convenience and safety of production, testing and operation and maintenance, reducing the downtime, and improving the availability and maintenance efficiency of the server 200.

[0172] In addition, the embodiment of the present application also provides a server 200, including a main board 201, a processor 202, a board 203 and the above-mentioned liquid cooling heat dissipation device 100. The processor 202 and the board 203 are arranged on the main board 201, and the liquid cooling heat dissipation device 100 is used to dissipate heat from the board 203.

[0173] In view of the fact that the server 200 in this embodiment includes the liquid cooling heat dissipation device 100 described in any of the above embodiments, therefore, the server 200 includes the structure and beneficial effects of the liquid cooling heat dissipation device 100, and will not be elaborated herein again.

[0174] The above has introduced in detail a liquid cooling heat dissipation device and a server provided by the present application. Specific examples are used herein to elaborate the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A liquid cooling device, characterized in that: include: Main heat exchange flow channel; The plate and card heat exchange mechanism includes a fixed shaft, a quick locking assembly and a plurality of plate and card heat exchange sub-plates, the plate and card heat exchange sub-plates being passed through the fixed shaft so that the plate and card heat exchange sub-plates can rotate around the fixed shaft and slide axially along the fixed shaft, the plate and card heat exchange sub-plates are used to clamp the corresponding plates and cards, the quick locking assembly includes a pressure rod bracket, a pressure rod, a locking buckle, and a locking plate, the locking buckle is arranged on the main heat exchange flow channel, one end of the pressure rod is rotatably arranged on the pressure rod bracket, the other end of the pressure rod is provided with the locking plate, the locking buckle cooperates with the locking plate to lock the pressure rod, and the quick locking assembly is used to fix and abut the plurality of plate and card heat exchange sub-plates on the main heat exchange flow channel so that the plate and card heat exchange sub-plates can exchange heat with the main heat exchange flow channel.

2. The liquid cooling device according to claim 1, characterized in that: The main heat exchange flow channel includes a plurality of main heat exchange sub-flow channels, and the plurality of main heat exchange sub-flow channels are connected in sequence through connecting pipelines.

3. The liquid cooling device according to claim 2, characterized in that: The main heat exchange channel includes a first main heat exchange sub-channel, a second main heat exchange sub-channel and a third main heat exchange sub-channel, and the connecting pipeline includes a first branch connecting pipeline and a second branch connecting pipeline. The first main heat exchange sub-channel is connected to the second main heat exchange sub-channel through the first branch connecting pipeline, and the second main heat exchange sub-channel is connected to the third main heat exchange sub-channel through the second branch connecting pipeline.

4. The liquid cooling device according to claim 3, characterized in that: The first main heat exchange sub-channel is provided with a liquid separation port, and the third main heat exchange sub-channel is provided with a liquid collection port. The liquid separation port and the liquid collection port are respectively communicated with the second heat exchange mechanism.

5. The liquid cooling device according to claim 3, characterized in that: The liquid cooling device also includes a liquid supply and return joint assembly, and the liquid supply and return joint assembly is connected to the main heat exchange flow channel.

6. The liquid cooling device according to claim 5, characterized in that: The liquid supply and return joint assembly includes a liquid inlet pipeline and a liquid return pipeline. The liquid inlet pipeline is communicated with the first main heat exchange sub-channel, and the liquid return pipeline is communicated with the third main heat exchange sub-channel.

7. The liquid cooling device according to claim 1, characterized in that: The main heat exchange flow channel comprises a cover plate and a bottom plate. The cover plate is provided with a flow channel cavity, the bottom plate covers the flow channel cavity, and the plate card heat exchange sub-plate abuts against the cover plate.

8. The liquid cooling device according to claim 7, characterized in that: A rib structure is provided in the flow channel cavity, and the rib structure is arranged along the extension direction of the flow channel cavity.

9. The liquid cooling device according to claim 7, characterized in that: The bottom plate is provided with a shovel tooth structure, and the shovel tooth structure is arranged in the flow channel cavity along the extension direction of the flow channel cavity.

10. The liquid cooling device according to claim 7, characterized in that: The cover plate is provided with a heat conduction groove, a heat exchange pad is provided in the heat conduction groove, and the board card heat exchange sub-plate abuts against the heat exchange pad.

11. The liquid cooling device according to claim 1, characterized in that: The plurality of plate card heat exchange sub-plates are divided into two groups along the length direction of the plate card. The two groups of plate card heat exchange sub-plates are arranged opposite to each other, and along the length direction of the plate card, each group of plate card heat exchange sub-plates is respectively clamped at one end of the corresponding plate card.

12. The liquid cooling device according to claim 1, characterized in that: The board heat exchange sub-plate includes a main cold plate, an auxiliary cold plate, a thermal pad and a locking switch assembly. Along the thickness direction of the board, the main cold plate is located on one side of the board, the auxiliary cold plate is movably arranged on the main cold plate and is located on the other side of the board, the thermal pad is arranged on the side of the main cold plate and the auxiliary cold plate facing the board, the main cold plate and the auxiliary cold plate are passed through the fixed shaft, the locking switch assembly is arranged on the main cold plate, and the locking switch assembly is used to drive the auxiliary cold plate to move toward the main cold plate to press the auxiliary cold plate and the thermal pad on the main cold plate onto the board.

13. The liquid cooling device according to claim 12, characterized in that: The main cold plate includes a base plate and a reinforcement frame, the base plate is inserted into the fixed shaft, the reinforcement frame is arranged on the base plate, the auxiliary cold plate is movably arranged on the reinforcement frame, and the locking switch assembly is arranged on the reinforcement frame.

14. The liquid cooling device according to claim 13, characterized in that: The base plate is provided with a limiting groove, and the limiting groove is used to accommodate the thermal pad.

15. The liquid cooling device according to claim 14, characterized in that: A heat pipe groove is provided on one side of the substrate away from the limiting groove, and the heat pipe groove is used for embedding a heat pipe.

16. The liquid cooling device according to claim 13, characterized in that: One of the main cold plate and the auxiliary cold plate is provided with a guide pin, and the other is provided with a guide hole relative to the guide pin.

17. The liquid cooling device according to claim 13, characterized in that: The locking switch assembly includes a cam wrench, a cam shaft, a clamping slider, and a guide shaft. The cam wrench is rotatably arranged on the reinforcement frame by the cam shaft. The guide shaft is arranged on the reinforcement frame. The auxiliary cold plate is passed through the guide shaft. The clamping slider is arranged on the auxiliary cold plate and faces the cam wrench. The cam wrench is used to push the clamping slider to move axially along the guide shaft so that the auxiliary cold plate moves toward the main cold plate.

18. The liquid cooling device according to claim 17, characterized in that: The cam wrench comprises a cam portion and a handle portion, wherein the cam portion is rotatably arranged on the cam shaft and abuts against the clamping slider, and the handle portion is connected to the cam portion.

19. The liquid cooling device according to claim 17, characterized in that: The locking switch assembly also includes a compression spring, which is sleeved on the guide shaft and located on the side of the clamping slide away from the cam wrench. One side of the compression spring is connected to the reinforcement frame, and the other side is connected to the clamping slide.

20. The liquid cooling device according to claim 17, characterized in that: One of the pressing slide block and the guide shaft is provided with a guide groove, and the other is provided with a guide block relative to the guide groove.

21. The liquid cooling device according to claim 12, characterized in that: The board heat exchange sub-plate further includes an anti-scratch film, and the anti-scratch film is attached to the thermal pad, the main cold plate and the auxiliary cold plate.

22. The liquid cooling device according to claim 1, characterized in that: When the pressing rod is locked, the pressing rod abuts against a side of the plate-card heat exchange sub-plate away from the main heat exchange flow channel, so that the plate-card heat exchange sub-plate abuts against the main heat exchange flow channel.

23. The liquid cooling device according to claim 22, characterized in that: A spring sheet is provided on one side of the pressure rod facing the board card heat exchange sub-plate, and a protruding structure is provided on the spring sheet relative to the board card heat exchange sub-plate.

24. The liquid cooling device according to claim 22, characterized in that: The lock buckle comprises a locking pin and a guiding inclined surface. A blocking piece and a paddle are arranged on the locking piece. The locking pin is limitedly matched with the blocking piece, and the paddle is connected to the blocking piece.

25. The liquid cooling device according to claim 1, characterized in that: The liquid-cooled heat dissipation device also includes a liquid leakage detection mechanism, and the liquid-cooled heat dissipation device also includes a cold plate bracket. The liquid leakage detection mechanism includes a first guide groove, a detection line groove and a liquid leakage detection line. The main heat exchange flow channel is arranged on the cold plate bracket, and the cold plate bracket is provided with the detection line groove and multiple first guide grooves on the side facing the main heat exchange flow channel. The multiple first guide grooves are arranged at intervals, and the detection line groove connects the multiple first guide grooves. The liquid leakage detection line is arranged in the detection line groove.

26. The liquid cooling device according to claim 25, characterized in that: A fixing seat is provided on the main heat exchange flow channel, and the fixing seat is used to connect the second heat exchange mechanism.

27. The liquid cooling device according to claim 26, characterized in that: A second guide groove penetrating the main heat exchange flow channel is provided on the main heat exchange flow channel below the connection port between the second heat exchange mechanism and the fixing seat, and the second guide groove is communicated with the detection line groove.

28. A server, characterized in that: Comprising a liquid cooling heat dissipation device as described in any one of claims 1-27.

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