Computing device

Abstract

The embodiment of the invention provides computing equipment which comprises a machine shell, a computing module, a heat dissipation module, a power module and a control module, the computing module comprises at least one computing power board, the heat dissipation module is used for conducting heat dissipation on the computing module, and the power module is electrically connected with the computing module; the control module is in communication connection with the calculation module; wherein the calculation module, the power supply module, the control module and the heat dissipation module are all arranged in the shell; the case comprises the partition module, the partition module defines the at least two accommodating areas, and the integration level of the computing device can be improved, so that space is saved, and wiring is simplified.

Description

[0001] This disclosure claims the priority of a Chinese patent application with the application number 2025102311215, titled "Computing Device", filed with the Chinese Patent Office on February 27, 2025, the entire content of which is incorporated herein by reference. Technical Field

[0002] This application relates to the technical field of electronic devices, and particularly to a computing device. Background Art

[0003] Generally, the components of existing computing devices are assembled separately, with a low integration level, and there are relatively large gaps between the components, which increases space waste and makes the maintenance and upgrade of the computing devices more complex. For example, when replacing a certain component, it may be necessary to disassemble multiple other components, increasing the difficulty and time cost of maintenance. Summary of the Invention

[0004] Embodiments of this application provide a computing device to solve or alleviate one or more technical problems in the prior art.

[0005] As an aspect of the embodiments of this application, embodiments of this application provide a computing device, including:

[0006] A chassis;

[0007] A computing module, including at least one computing power board;

[0008] A heat dissipation module for dissipating heat from the computing module;

[0009] A power module electrically connected to the computing module;

[0010] A control module communicatively connected to the computing module;

[0011] Among them, the computing module, the power module, the control module, and the heat dissipation module are all disposed within the chassis;

[0012] The chassis includes a partitioning module that defines at least two accommodating areas.

[0013] In one embodiment, the two accommodating areas are respectively used to accommodate the computing module and the power module, and the two accommodating areas are respectively used to dissipate heat from the computing module and the power module.

[0014] In one embodiment, the length of the accommodating area is the same as the length of the chassis.

[0015] In one embodiment, the accommodating area for accommodating the power module is the first accommodating area, and the first accommodating area is further used to accommodate the control module, and the first accommodating area is used to dissipate heat from the control module.

[0016] In one embodiment, the receiving area for accommodating the computing module is the second receiving area, and the second receiving area is also used to accommodate the heat dissipation module.

[0017] In one embodiment, a first receiving area and a second receiving area are defined in the chassis, and the volumes of the first receiving area and the second receiving area are not equal.

[0018] In one embodiment, a first receiving area and a second receiving area are defined in the chassis, and the first receiving area and the second receiving area are two independent heat dissipation channels.

[0019] In one embodiment, the first receiving area and the second receiving area have the same size in at least one direction.

[0020] In one embodiment, the first receiving area and the second receiving area have the same size in the first direction and the second direction.

[0021] In one embodiment, the first receiving area and the second receiving area have different sizes in the third direction, the size of the first receiving area in the third direction is smaller than the size of the second receiving area in the third direction, and the ratio of the sizes of the first receiving area and the second receiving area in the third direction is greater than 1 / 5 and less than 2 / 3.

[0022] In one embodiment, the chassis includes an inlet panel, and the ratio of the hollowed-out area of the inlet panel to the area of the inlet panel is greater than 50%.

[0023] In one embodiment, the chassis includes an outlet panel, and the ratio of the hollowed-out area of the outlet panel to the area of the outlet panel is greater than 50%.

[0024] In one embodiment, the chassis includes a side panel, and the side panel is parallel to the computing power board.

[0025] In one embodiment, the partitioning module is perpendicular to the computing power board

[0026] In one embodiment, the power module is fixedly installed on the partitioning module.

[0027] In one embodiment, the partitioning module has the same size as the chassis in at least one direction.

[0028] In one embodiment, in the first direction and / or the second direction, the size of the partitioning module is the same as the size of the chassis.

[0029] In one embodiment, the partitioning module is parallel to the power module in the length direction of the power module.

[0030] In one embodiment, the heat dissipation module includes at least one first fan, and the first fan is used to dissipate heat from the computing module in the second receiving area.

[0031] In one embodiment, both ends of the second accommodating area in the first direction are respectively provided with an air inlet area and an air outlet area, and a first fan is provided in the air inlet area and / or the air outlet area.

[0032] In one embodiment, there is a first spacing space between the first fan provided in the air inlet area and the inlet panel, and / or there is a second spacing space between the first fan provided in the air outlet area and the outlet panel.

[0033] In one embodiment, the size of the first spacing space is greater than or equal to 25 mm and less than or equal to 85 mm; and / or the size of the second spacing space is greater than or equal to 25 mm and less than or equal to 85 mm.

[0034] In one embodiment, the first fan includes a fan bracket and at least one first fan unit, and at least one first fan unit is provided on the fan bracket.

[0035] In one embodiment, at least one first fan unit is mounted on the fan bracket by glue nails.

[0036] In one embodiment, a limiting strip is provided on the side wall of the casing in the second direction, the limiting strip has a limiting bayonet, and the fan bracket is adaptively clamped with the limiting bayonet.

[0037] In one embodiment, the power module and the heat dissipation module are provided on non - same sides of the computing module.

[0038] In one embodiment, the computing module further includes at least one heat sink group.

[0039] In one embodiment, there is a spacing space between at least one heat sink group and the heat dissipation module in the first direction.

[0040] In one embodiment, the computing power board is mounted on the heat sink group, the casing includes a mounting structure provided in the second accommodating area, and the heat sink group is mounted on the mounting structure.

[0041] In one embodiment, the mounting structure includes two mounting brackets respectively provided at the top and bottom of the second accommodating area.

[0042] In one embodiment, a heat sink group is provided on the non - chip side of the computing power board, the heat sink group provided on the non - chip side of the computing power board is the first heat sink group, the first heat sink group includes a first heat sink substrate and a plurality of first heat sink fins, and the plurality of first heat sink fins are provided on the side of the first heat sink substrate facing away from the computing power board.

[0043] In one embodiment, the upper and lower parts of the first heat sink substrate are respectively mounted on the two mounting brackets of the mounting structure.

[0044] In one embodiment, the area size of the first heat dissipation substrate is larger than the area size of the computing board, the upper area of ​​the first heat dissipation substrate not covered by the computing board defines the upper installation area, and the area of ​​the first heat dissipation substrate exceeding the lower edge of the computing board defines the lower installation area;

[0045] The first heat dissipation substrate is mounted on the corresponding mounting bracket through the upper mounting area and the lower mounting area respectively.

[0046] In one embodiment, a heat sink group is provided on the chip side of the computing board. The heat sink group provided on the chip side of the computing board is a second heat sink group. The second heat sink group includes a second heat sink substrate and a plurality of second heat sink fins. The plurality of second heat sink fins are provided on a side of the second heat sink substrate away from the computing board.

[0047] In one embodiment, an extension dimension of the second heat dissipation fin in the first direction is greater than an extension dimension of the computing board in the first direction.

[0048] In one implementation, the first heat dissipating fins and / or the second heat dissipating fins extend along the second direction, perpendicular to the side plate of the housing in the second direction.

[0049] In one embodiment, an extension dimension of the first heat dissipating fin and / or the second heat dissipating fin in the second direction is 55 mm to 70 mm.

[0050] In one embodiment, the second receiving area is provided with a sound absorbing component.

[0051] In one embodiment, the sound absorbing assembly includes an air inlet side sound absorbing component and / or an air outlet side sound absorbing component; the top and bottom of the air inlet area of ​​the second accommodating area are respectively provided with air inlet side sound absorbing components, and / or the top and bottom of the air outlet area of ​​the second accommodating area are respectively provided with air outlet side sound absorbing components.

[0052] In one embodiment, the air inlet-side sound absorbing component and / or the air outlet-side sound absorbing component are defined with a bayonet, and the upper portion and the lower portion of the fan bracket are respectively secured in the corresponding bayonet.

[0053] In one embodiment, a mounting bracket is provided between the air inlet-side sound absorbing component and the air outlet-side sound absorbing component of the sound absorbing assembly.

[0054] In one embodiment, a sound absorbing layer is disposed on the inner side of the side panel of the casing in the second direction.

[0055] In one embodiment, the power module includes a power supply and a second fan disposed outside the power supply, and the second fan is disposed in the first accommodating area to generate a cooling airflow flowing through the first accommodating area.

[0056] In one embodiment, the control module includes a first control board and at least one second control board connected to the first control board. The first control board is connected to the computing power board, and at least one second control board is connected to at least one first fan of the heat dissipation module.

[0057] In one embodiment, there is a third spacing space between the power supply module and the inlet panel. The first control board is located within the third spacing space and is disposed on the separation module.

[0058] In one embodiment, the first fan disposed in the air inlet area of the second accommodation area is an air inlet fan, and the air inlet fan is located below the third spacing space;

[0059] The first control board is adjacent to the inlet panel and is disposed on the separation module. At least one second control board is disposed within the third spacing space and is located between the first control board and the power supply module in a first direction.

[0060] In one embodiment, the first fan disposed in the air outlet area of the second accommodation area is an air outlet fan, and the air outlet fan is located below the power supply module;

[0061] The number of second control boards is two. The second control board signal - connected to the air inlet fan is located within the third spacing space, and the second control board signal - connected to the air outlet fan is disposed on the separation module and is located below the power supply module.

[0062] In one embodiment, the separation module includes a separation plate, and the separation plate divides the interior of the housing into two accommodation areas.

[0063] In one embodiment, the separation plate extends from the inlet panel to the outlet panel in a first direction.

[0064] In one embodiment, the separation plate defines a wire harness fixing structure and / or a wire routing channel.

[0065] In one embodiment, the wire harness fixing structure and / or the wire routing channel are respectively provided with protective sleeves.

[0066] In one embodiment, the separation module further includes a power supply bracket. The power supply bracket is located within the first accommodation area, is disposed above the separation plate, and is used to support the power supply module.

[0067] In one embodiment, the separation plate has an avoidance structure, and the avoidance structure is used to avoid the electrical connection structure between the power supply module and the computing power board.

[0068] In one embodiment, an installation space is defined between the power supply brackets and the separation plate, and the second control board signal - connected to the air outlet fan is disposed in the installation space.

[0069] In one embodiment, the extension dimension of the chassis in the second direction is 130 mm to 140 mm.

[0070] In one embodiment, the rated power of the computing power board is 1500 W to 2000 W.

[0071] In one embodiment, the rated power of the first fan unit of the heat dissipation module is 5 W to 7 W, and the rotation speed is 2500 revolutions per minute to 3500 revolutions per minute.

[0072] In one embodiment, the computing power board includes:

[0073] A board body;

[0074] A chip array disposed on the board body, the chip array includes a power taking unit, and the power taking unit includes at least one chip;

[0075] A power supply module disposed on the board body for connecting to a power source. The power supply module is electrically connected to the power taking unit for supplying power to the power taking unit, and the power supply module has a voltage monitoring point;

[0076] A processing module disposed on the board body, electrically connected to the voltage monitoring point for collecting the voltage of the voltage monitoring point.

[0077] In one embodiment, the number of power taking units is multiple, and the multiple power taking units are connected in series. The total number of power taking units is greater than 40 and less than 100.

[0078] In one embodiment, the power taking unit includes multiple chips, the multiple chips are arranged at intervals along the first direction, and the multiple chips are connected in parallel.

[0079] In one embodiment, the power taking unit includes two chips, and the two chips are connected in parallel.

[0080] In one embodiment, the heat dissipation air flow flows through the computing power board along the first direction. Along the first direction, the chip array includes a first power taking group and a second power taking group, and the first power taking group and the second power taking group respectively include multiple power taking units arranged in sequence along the third direction;

[0081] The first power taking group is adjacent to the air inlet side of the board body, and the second power taking group is adjacent to the air outlet side of the board body.

[0082] In one embodiment, along the third direction, the middle regions of the first power taking group and the second power taking group respectively have vacant positions.

[0083] In one embodiment, the first power taking group and the second power taking group respectively include multiple power taking areas arranged in sequence along the third direction;

[0084] In the third direction, the distance between any two adjacent power taking areas is greater than the distance between any two adjacent power taking units within any power taking area.

[0085] In one embodiment, the number of power-taking areas of the second power-taking group is greater than that of the first power-taking group.

[0086] In one embodiment, the chip array includes at least one third power-taking group. Along the first direction, at least one third power-taking group is located between the first power-taking group and the second power-taking group. The third power-taking group includes a plurality of power-taking units arranged in sequence along the third direction.

[0087] In one embodiment, the number of the third power-taking groups is two, and the two third power-taking groups are arranged at intervals in the first direction.

[0088] In one embodiment, the extension dimension of at least one third power-taking group in the third direction is less than that of the first power-taking group in the third direction, and the extension dimension of at least one third power-taking group in the third direction is less than that of the second power-taking group in the third direction.

[0089] In one embodiment, the number of chips in the first power-taking group is greater than that in the second power-taking group, and the number of chips in the first power-taking group is less than that in the third power-taking group.

[0090] In one embodiment, along the first direction, the distances between the first power-taking group, the third power-taking group, and the second power-taking group increase in sequence.

[0091] In one embodiment, with the center line of the plate body extending along the third direction as the demarcation line, the chip array is divided into a first chip array and a second chip array. The total number of chips in the first chip array close to the air inlet side of the computing power board is greater than the total number of chips in the second chip array close to the air outlet side of the computing power board.

[0092] In one embodiment, a temperature sensor is included. The temperature sensor is arranged on the plate body and is used to detect the temperature of the air flow flowing through the plate body;

[0093] The processing module is electrically connected to the temperature sensor and is used to collect the temperature detected by the temperature sensor.

[0094] In the computing device according to the embodiment of the present application, the computing module, the power supply module, the control module, and the heat dissipation module are all arranged in the casing, which can improve the integration degree of the computing device, thereby saving space and simplifying wiring; moreover, it is convenient to disassemble and assemble a certain component independently, and the convenience of maintaining and upgrading each component is improved.

[0095] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments, and features, further aspects, embodiments, and features of the present application will be readily apparent by referring to the drawings and the following detailed description. Brief Description of the Drawings

[0096] In the drawings, unless otherwise specified, the same reference numerals throughout the several views refer to the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in accordance with the present application and should not be regarded as limiting the scope of the present application.

[0097] Figure 1 A schematic exploded view of a computing device according to an embodiment of the present application is shown.

[0098] Figure 2A A schematic perspective view of a partial structure of a computing device according to an embodiment of the present application is shown.

[0099] Figure 2B A schematic perspective view of a part of a computing device according to an embodiment of the present application is shown.

[0100] Figure 3A A schematic perspective view of the overall structure of a computing device according to an embodiment of the present application is shown.

[0101] Figure 3B A schematic exploded view of the housing structure of a computing device according to an embodiment of the present application is shown.

[0102] Figure 4 A schematic view of the structure of the first fan of a computing device according to an embodiment of the present application is shown.

[0103] Figure 5A A schematic view of the structure of the housing and some components of a computing device according to an embodiment of the present application is shown.

[0104] Figure 5B A schematic view of the structure of the housing and some components of a computing device according to an embodiment of the present application from another perspective is shown.

[0105] Figure 6 A schematic view of the structure of the computing module of a computing device according to an embodiment of the present application is shown.

[0106] Figure 7 A schematic view of the power module of a computing device according to an embodiment of the present application is shown.

[0107] Figure 8 、 Figure 9 A schematic view of the structure of a computing power board according to an embodiment of the present application is shown.

[0108] Description of Reference Numerals:

[0109] Computing device 1;

[0110] Housing 10; accommodation area 101; first accommodation area 101a; second accommodation area 101b; air inlet area 101b1; air outlet area 101b2; first spaced-apart space 101b11; second spaced-apart space 101b21; third spaced-apart space 101a1;

[0111] Partition module 11; partition board 111; power supply bracket 1111; wire harness fixing structure 1112; avoidance structure 1113;

[0112] Entrance panel 12; first hollowed-out area 121; first sub-hollowed-out area 121a; second sub-hollowed-out area 121b; user operation panel 122; display screen 1221;

[0113] Exit panel 13; second hollowed-out area 131; third sub-hollowed-out area 131a; fourth sub-hollowed-out area 131b; extension outlet 132; insertion port 133;

[0114] Side plate 14; air inlet filter plate 15; limiting strip 16; mounting structure 17; mounting bracket 171; top cover 18; bottom cover 19; fastening opening 181; first mounting bracket 102; second mounting bracket 103;

[0115] Computing module 20; computing power board 21; heat sink group 22; first heat sink group 221; first heat sink substrate 2211; first heat sink fins 2212; second heat sink group 222; second heat sink substrate 2221; second heat sink fins 2222; second conductive member 231; first conductive member 232; signal interface 25;

[0116] Heat dissipation module 30; first fan 31; first fan unit 311; fan bracket 312; rubber nails 313;

[0117] Power supply module 40; second fan 41; electrical connection structure 42; electrode 43; switch 44; power supply 45;

[0118] Control module 50; first control board 51; second control board 52;

[0119] Sound absorption component 60; air inlet side sound absorption member 61; air outlet side sound absorption member 62; sound absorption layer 63;

[0120] Plate body 201; chip 202; voltage monitoring point 203; first voltage monitoring point 2031; second voltage monitoring point 2032; third voltage monitoring point 2033; fourth voltage monitoring point 2034; fifth voltage monitoring point 2035; sixth voltage monitoring point 2036; temperature sensor 205; clock frequency generator 206; first clock frequency generator 2061; second clock frequency generator 2062;

[0121] Chip array 210; first power extraction group 211, second power extraction group 212; third power extraction group 213; power extraction unit 2110; power supply module 23; electrical connection member 233; electrical connection unit 2331; boost module 234; voltage regulation module 235; processor 24; analog-to-digital converter 241;

[0122] First direction L1; second direction L2; third direction L3. Detailed implementation manners

[0123] In the following text, only some exemplary embodiments are briefly described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the accompanying drawings and description are considered to be exemplary in nature and not restrictive.

[0124] An embodiment of the present application provides a computing device, which can be used to process complex algorithms and achieve efficient computing capabilities. The computing device includes a computing module, a power supply module, a control module, and a heat dissipation module. The computing module includes a computing power board to provide efficient computing capabilities, enabling the computing device to be used in application scenarios that require a large amount of computing resources; the heat dissipation module is used to dissipate heat from the computing module to ensure that the computing power board operates within a safe range and prevent performance degradation or damage caused by overheating; the power supply module provides a stable power supply for the computing device, realizes voltage conversion and power distribution, and ensures that each component of the computing device operates normally at the rated power; the control module is communicatively connected to the computing module to realize tasks allocation of computing, control of each component, and monitoring of operation, etc. In this way, the efficient computing and stable operation of the computing device are ensured.

[0125] Generally, the components of existing computing devices are assembled separately, with a low integration degree. The gaps reserved between components are relatively large, increasing space waste and making the maintenance and upgrade of the computing device more complex.

[0126] In the computing device of the embodiment of the present application, the computing module, the power supply module, the control module, and the heat dissipation module are all arranged within the housing, which can improve the integration degree of the computing device, thereby saving space and simplifying wiring; moreover, it is convenient to disassemble and assemble a certain component independently, improving the convenience of maintenance and upgrade of each component.

[0127] The housing includes a partition module, and the partition module defines at least two accommodation areas, that is, the cavity of the housing is divided by the partition module into at least two accommodation areas, which is convenient to arrange the above-mentioned components in different accommodation areas within the same cavity. While improving the integration degree of the computing device, it is beneficial to form independent heat dissipation channels in different accommodation areas, thereby improving the heat dissipation efficiency of the computing device.

[0128] The following will be described in detail with specific embodiments in conjunction with the drawings.

[0129] Figure 1 Shows an exploded schematic view of a computing device according to an embodiment of the present application. As Figure 1 shown,

[0130] The two accommodation areas 101 can be respectively used to accommodate the computing module 20 and the power supply module 40, and the two accommodation areas 101 are respectively used to dissipate heat from the computing module 20 and the power supply module 40. In this way, the heat dissipation of the computing module 20 and the power supply module 40 is made independent, which is beneficial to improving the heat dissipation effects of both the computing module 20 and the power supply module 40 simultaneously.

[0131] Exemplarily, the power supply module 40 and the heat dissipation module 30 can be arranged on different sides of the computing module 20. For example, the power supply module 40 is located above the computing module 20, and the heat dissipation module 30 is located on one or both sides of the computing module 20 in the horizontal direction.

[0132] Exemplarily, the accommodation area 101 for accommodating the power supply module 40 is the first accommodation area 101a, and the first accommodation area 101a is also used to accommodate the control module 50, and the first accommodation area 101a is used to dissipate heat from the control module 50. In this example, both the control module 50 and the power supply module 40 are located in the first accommodation area 101a, realizing simultaneous heat dissipation of the control module 50 and the power supply module 40, and at the same time improving the space utilization rate of the first accommodation area 101a, thereby increasing the integration degree of the computing device 1.

[0133] In some examples, the power supply module 40 and / or the control module 50 can be horizontally placed in the first accommodation area 101a to reduce the occupied space of the power supply module 40 and / or the control module 50 in the vertical direction. In other examples, the power supply module 40 and / or the control module 50 can be vertically placed in the first accommodation area 101a to reduce the occupied space of the power supply module 40 and / or the control module 50 in the horizontal direction. This is only an example here and does not constitute a limitation to the present application. Those skilled in the art can understand that the power supply module 40 and / or the control module 50 can also be placed in the first accommodation area 101a in an inclined posture.

[0134] Exemplarily, continuing to refer to Figure 1 , the accommodation area 101 for accommodating the computing module 20 is the second accommodation area 101b, and the second accommodation area 101b is also used to accommodate the heat dissipation module 30. In this example, both the computing module 20 and the heat dissipation module 30 are located in the second accommodation area 101b, which can improve the space utilization rate of the second accommodation area 101b, and moreover, the heat dissipation module 30 and the computing module 20 are in the same accommodation area 101, facilitating the heat dissipation module 30 to dissipate heat from the computing module 20, which is beneficial to improving the heat dissipation effect of the computing module 20.

[0135] In some examples, the computing module 20 and / or the heat dissipation module 30 can be horizontally placed in the second accommodation area 101b to reduce the occupied space of the computing module 20 and / or the heat dissipation module 30 in the vertical direction. In other examples, the computing module 20 and / or the heat dissipation module 30 can be vertically placed in the second accommodation area 101b to reduce the occupied space of the computing module 20 and / or the heat dissipation module 30 in the horizontal direction. This is only an example and does not constitute a limitation to this application. Those skilled in the art can understand that the computing module 20 and / or the heat dissipation module 30 can also be placed in the second accommodation area 101b in an inclined posture.

[0136] Exemplarily, the length of the accommodation area 101 can be substantially the same as the length of the chassis 10. It can be understood that the extension dimension of the accommodation area 101 in the first direction L1 is substantially the same as the extension dimension of the chassis 10 in the first direction L1, that is, the accommodation area 101 is substantially distributed in the entire area of the chassis 10 in the first direction L1. In this way, the interior of the chassis 10 can be fully utilized, the space utilization rate can be improved, and sufficient space can be provided for the heat dissipation of each component, thereby improving the heat dissipation effect.

[0137] Exemplarily, the number of accommodation areas 101 defined in the chassis 10 is two, namely the first accommodation area 101a and the second accommodation area 101b. The volumes of the first accommodation area 101a and the second accommodation area 101b can be unequal. According to the sizes of different components accommodated in the first accommodation area 101a and the second accommodation area 101b and the overall space requirements, the volumes of the first accommodation area 101a and the second accommodation area 101b can be divided in different proportions to meet the placement requirements of different components and the requirements of the heat dissipation space, thereby facilitating the improvement of the space utilization rate and the heat dissipation efficiency.

[0138] Exemplarily, the first accommodation area 101a and the second accommodation area 101b have the same dimensions in at least one direction to meet the layout space requirements of each component and improve the regularity of the internal space of the chassis 10 at the same time.

[0139] In some examples, the first accommodation area 101a and the second accommodation area 101b have the same dimensions in the first direction L1 and the second direction L2 to maintain the neatness of the two accommodation areas 101.

[0140] Exemplarily, the first accommodation area 101a and the second accommodation area 101b are defined in the chassis 10, and the first accommodation area 101a and the second accommodation area 101b are two independent heat dissipation channels. Among them, the first accommodation area 101a and the second accommodation area 101b are respectively formed with corresponding heat dissipation channels, and the two heat dissipation channels are independent of each other and not connected. The heat dissipation channel is used for the cooling medium to flow, and the flowing cooling medium can dissipate heat from the working elements arranged in the heat dissipation channel.

[0141] It should be noted that by setting the dimensions of the first accommodation area 101a and the second accommodation area 101b in the first direction L1 and the dimensions in the second direction L2 to be the same respectively, the first accommodation area 101a and the second accommodation area 101b can penetrate through the housing 10 in the first direction L1 respectively, or can penetrate through the housing 10 in the second direction L2 respectively, so that the first accommodation area 101a and the second accommodation area 101b form independent heat dissipation channels in the first direction L1 or the second direction L2 respectively, for the cooling medium to flow in their respective heat dissipation channels respectively, thereby avoiding the mutual influence of the cooling media in the two heat dissipation channels and improving the heat dissipation stability of the first accommodation area 101a and the second accommodation area 101b.

[0142] In some examples, the dimensions of the first accommodation area 101a and the second accommodation area 101b in the third direction L3 are different to meet the dimensional requirements of different components arranged in the two accommodation areas 101.

[0143] In some examples, the dimension of the first accommodation area 101a in the third direction L3 is smaller than the dimension of the second accommodation area 101b in the third direction L3, which is convenient for placing components that occupy less space in the third direction L3, such as the control module 50 and / or the power module 40, in the first accommodation area 101a, and placing components that occupy more space in the third direction L3, such as the computing module 20 and / or the heat dissipation module 30, in the second accommodation area 101b.

[0144] Exemplarily, the ratio of the dimensions of the first accommodation area 101a and the second accommodation area 101b in the third direction L3 is greater than 1 / 5 and less than 2 / 3, which improves the rationality of space division and is conducive to improving space utilization. For example, the ratio of the dimensions of the first accommodation area 101a and the second accommodation area 101b in the third direction L3 can be 2 / 5, 1 / 2, 6 / 10, etc., and is not limited thereto.

[0145] Exemplarily, continue to refer to Figure 1 , the first accommodation area 101a and the second accommodation area 101b are arranged in the third direction L3, that is, the partition module 11 divides the interior of the housing 10 into two accommodation areas 101 in the third direction L3.

[0146] In some examples, the first accommodating area 101a may be located above the second accommodating area 101b. The power supply module 40 and the control module 50 are disposed in the first accommodating area 101a, and the computing module 20 and the heat dissipation module 30 are disposed in the second accommodating area 101b. It can be understood that generally the power supply module 40 is heavier. The power supply module 40 being located in the upper first accommodating area 101a can avoid the problem of unstable center of gravity, thereby improving the overall stability of the computing device 1. In other examples, the first accommodating area 101a may also be located below the second accommodating area 101b.

[0147] In the embodiments of the present application, the first direction L1 and the second direction L2 can be understood as two mutually perpendicular directions in the horizontal direction, and the third direction L3 can be understood as the vertical direction perpendicular to the horizontal direction.

[0148] Figure 2A Showing a partial three-dimensional structural schematic diagram of the computing device 1 according to an embodiment of the present application, Figure 2B Showing a partial three-dimensional structural schematic diagram of the computing device according to an embodiment of the present application, Figure 3A Showing an overall three-dimensional structural schematic diagram of the computing device 1 according to an embodiment of the present application.

[0149] Exemplarily, such as Figure 2A and Figure 3A shown, the chassis 10 may include an inlet panel 12, an outlet panel 13, two side panels 14, a top cover 18, and a bottom cover 19 to jointly enclose the interior of the chassis 10.

[0150] In some examples, such as Figure 2A shown, the top cover 18 and the bottom cover 19 may respectively have fastening openings 181 to facilitate the user to carry the computing device 1.

[0151] In some examples, the outer shape of the chassis 10 may be designed as a regular cuboid to be suitable for home or office use. In other examples, the outer shape of the chassis 10 may also be a cube, a circle, an ellipse, etc., and is not limited thereto.

[0152] In some examples, the extension dimension of the chassis 10 in the second direction L2 may be 130 to 140 mm. Specifically, the extension dimension of the chassis 10 in the second direction L2 may be 3U to match the size of the rack for carrying the computing device 1. Wherein, U is a standard height unit, called "rack unit" or "cabinet unit". 1U is equal to 1.75 inches (about 44.45 mm).

[0153] In other examples, the extension dimension of the chassis 10 in the second direction L2 may also be 130.5 mm, 132 mm, 133 mm, or 135 mm, etc., and is not limited thereto.

[0154] In a specific example, the dimensions of the chassis 10 can be 455*440*130.5 mm, that is, the extension dimension of the chassis 10 in the first direction L1 is 455 mm, the extension dimension in the third direction L3 is 440 mm, and the extension dimension in the second direction L2 is 130.5 mm.

[0155] It should be noted that the above example is only for illustration and does not constitute a limitation to this application. The dimensions of the chassis 10 can be designed accordingly according to the dimensions of the rack and the occupied space of each component inside the computing device 1.

[0156] In some examples, two of the inlet panel 12, the outlet panel 13, and the two side panels 14 can be integrally provided or separately provided. For example, the outlet panel 13 and one of the side panels 14 are integrally provided, and the other side panel 14 is separately provided to facilitate opening the separately provided side panel 14 for disassembly, assembly, maintenance and other operations of the components inside the chassis 10. Of course, this is only an example here and does not constitute a limitation to this application. Those skilled in the art can understand that the setting manner of each component of the chassis 10 can also have other forms. For example, the inlet panel 12 is separately provided from other components of the chassis 10, and at least one side panel 14 is separately provided from other components of the chassis 10; or all components of the chassis 10 are separately provided, etc., and are not limited thereto.

[0157] Exemplarily, as Figure 3A shown, the inlet panel 12 of the chassis 10 can have a first hollowed-out area 121, and the first hollowed-out area 121 can be used as an air inlet area for external air flow to enter the accommodation area 101 of the chassis 10.

[0158] In some examples, as Figure 3A shown, the first hollowed-out area 121 includes a first sub-hollowed-out area 121a and a second sub-hollowed-out area 121b distributed in the third direction L3. The first sub-hollowed-out area 121a is opposite to and communicated with the first accommodation area 101a, and external air flow can enter the first accommodation area 101a through the first sub-hollowed-out area 121a to dissipate heat from the module in the first accommodation area 101a. The second sub-hollowed-out area 121b is opposite to and communicated with the second accommodation area 101b, and external air flow can enter the second accommodation area 101b through the second sub-hollowed-out area 121b to dissipate heat from the module in the second accommodation area 101b.

[0159] In some examples, the proportion of the hollowed-out area of the inlet panel 12 of the chassis 10 in the area of the inlet panel 12 is greater than 50%, that is, the proportion of the area of the first hollowed-out area 121 of the chassis 10 in the area of the inlet panel 12 is greater than 50%. It can be seen that there is a relatively large area of hollowed-out area distributed on the inlet panel 12 to increase the air flow entering the accommodation area 101 of the chassis 10 and improve the heat dissipation efficiency.

[0160] Exemplarily, the proportion of the hollowed-out area of the inlet panel 12 of the chassis 10 in the area of the inlet panel 12 can be 60%, 70%, 80%, 90%, etc. Among them, a larger proportion value can improve the heat dissipation efficiency of the computing device. This is only an example here and does not constitute a limitation to this application. Those skilled in the art can understand that the ratio of the above two can also be other values, which will not be elaborated here.

[0161] Figure 3B Shows an exploded schematic view of the chassis structure of a computing device according to an embodiment of the present application.

[0162] Exemplarily, as Figure 3A and Figure 3B shown, an air inlet filter plate 15 can be provided on the inner side of the inlet panel 12 to filter the airflow entering from the inlet panel 12.

[0163] Exemplarily, as Figure 2A shown, the outlet panel 13 of the chassis 10 can have a second hollowed-out area 131, and the second hollowed-out area 131 can be used as an air outlet area for the airflow in the accommodation area 101 of the chassis 10 to diffuse to the outside of the chassis 10.

[0164] In some examples, as Figure 2A shown, the second hollowed-out area 131 includes a third sub-hollowed-out area 131a and a fourth sub-hollowed-out area 131b distributed in the third direction L3. The third sub-hollowed-out area 131a is opposite to and communicates with the first accommodation area 101a, and the airflow flowing through each module in the first accommodation area 101a can diffuse to the outside through the third sub-hollowed-out area 131a, so as to form an air circulation between the first accommodation area 101a and the outside. The fourth sub-hollowed-out area 131b is opposite to and communicates with the second accommodation area 101b, and the airflow flowing through each module in the second accommodation area 101b can diffuse to the outside through the fourth sub-hollowed-out area 131b, so as to form an air circulation between the second accommodation area 101b and the outside.

[0165] In some examples, the proportion of the hollowed-out area of the outlet panel 13 of the chassis 10 in the area of the outlet panel 13 is greater than 50%, that is, the proportion of the area of the second hollowed-out area 131 of the chassis 10 in the area of the outlet panel 13 is greater than 50%. It can be seen that a relatively large area of hollowed-out area is distributed on the outlet panel 13 to increase the air flow diffusing from the accommodation area 101 of the chassis 10 to the outside, reduce the wind resistance, and improve the heat dissipation effect and efficiency.

[0166] Exemplarily, the ratio of the hollowed-out area of the outlet panel 13 of the housing 10 to the area of the outlet panel 13 can be 60%, 70%, 80%, 90%, etc. Among them, a larger ratio value can improve the heat dissipation efficiency of the computing device. This is only an example here and does not constitute a limitation to this application. Those skilled in the art can understand that the ratio of the above two can also be other values, which will not be elaborated here.

[0167] In some examples, as Figure 3A shown, in the area between the first sub-hollowed-out area 121a and the second sub-hollowed-out area 121b of the inlet panel 12, a user operation panel 122, a display screen 1221, a switch reset button, a data interface, a network interface, etc. can be provided, which is convenient for users to operate and improves the human-computer interaction experience.

[0168] In some examples, as Figure 2A shown, the outlet panel 13 can have an extension port 132 and an insertion port 133. The extension port 132 corresponds to the switch 44 of the power supply module 40 for the switch 44 to be exposed, which is convenient for users to operate. The insertion port 133 corresponds to the power supply interface of the power supply module 40 and is used for an external power cable to pass through and connect to the power supply interface.

[0169] Exemplarily, the inlet panel 12 and the outlet panel 13 of the housing 10 can be distributed in the first direction L1 and extend along the second direction L2 and the third direction L3 respectively, that is, the inlet panel 12 and the outlet panel 13 are respectively arranged in a vertical state and are oppositely distributed in the first direction L1. The two side plates 14 of the housing 10 can be distributed in the second direction L2 and extend along the first direction L1 and the third direction L3 respectively, that is, the two side plates 14 are respectively arranged in a vertical state and are oppositely distributed in the second direction L2.

[0170] Exemplarily, the side plate 14 can be arranged parallel to the computing power board 21 of the computing module 20, that is, the computing power board 21 can be arranged in a vertical state and extend along the first direction L1 and the third direction L3.

[0171] Exemplarily, the partition module 11 is arranged perpendicular to the computing power board 21. It can be understood that the partition module 11 being arranged perpendicular to the computing power board 21 means that the plane where the partition module 11 is located is perpendicular to the plane where the computing power board 21 is located. Among them, the partition module 11 can be in a plate shape or at least partially in a plate shape to define two accommodation areas 101 arranged along the direction perpendicular to the partition module 11 inside the housing 10. In some specific examples, the partition module 11 can be arranged perpendicular to the third direction L3, that is, the vertical direction. By arranging the computing power board 21 perpendicular to the partition module 11, the computing power board 21 can be arranged in a vertical state and extend along the first direction L1 and the third direction L3, so as to make full use of the internal space of the accommodation area 101 where it is located, and further improve the space utilization rate inside the housing 10.

[0172] Figure 4 A schematic structural diagram of the first fan 31 of the computing device 1 according to an embodiment of the present application is shown. Figure 5A A schematic structural diagram of the housing 10 and some components of the computing device 1 according to an embodiment of the present application is shown.

[0173] In some examples, to improve the heat dissipation effect of the computing module 20, the computing device 1 according to an embodiment of the present application may adopt air-cooled heat dissipation, such as Figure 4 As shown, the heat dissipation module 30 may include at least one first fan 31, and the first fan 31 is used to dissipate heat from the computing module 20 in the second accommodation area 101b.

[0174] In other examples, the computing device 1 may also adopt water-cooled or oil-cooled methods to dissipate heat from the computing module 20.

[0175] Exemplarily, again as Figure 2A As shown, both ends of the second accommodation area 101b in the first direction L1 may respectively have an air inlet area 101b1 and an air outlet area 101b2, and the first fan 31 is provided in the air inlet area 101b1 and / or the air outlet area 101b2. That is, the first fan 31 may be one or two. When the first fan 31 is one, the first fan 31 may be provided in the air inlet area 101b1 or the air outlet area 101b2. When the first fan 31 is two, the two first fans 31 may be respectively provided in the air inlet area 101b1 and the air outlet area 101b2 to increase the air flow rate and the air flow circulation efficiency, thereby improving the heat dissipation efficiency.

[0176] In some examples, continue to refer to Figure 2A , there is a first spacing space 101b11 between the first fan 31 provided in the air inlet area 101b1 and the inlet panel 12, and / or there is a second spacing space 101b21 between the first fan 31 provided in the air outlet area 101b2 and the outlet panel 13. That is, the space in the air inlet area 101b1 is larger than the occupied space of the first fan 31, and / or the space in the air outlet area 101b2 is larger than the occupied space of the first fan 31. In this way, spare space can be vacated in the air inlet area 101b1 and / or the air outlet area 101b2, which is convenient for subsequent replacement of a larger-sized fan or addition of sound-absorbing cotton, etc., so as to provide room for users to play freely to meet the different needs of different users.

[0177] In some specific examples, the size of the first spacer 101b11 is greater than or equal to 25 mm and less than or equal to 85 mm; and / or, the size of the second spacer 101b21 is greater than or equal to 25 mm and less than or equal to 85 mm. For example, the size of the first spacer 101b11 can be 25 mm, 55 mm, or 85 mm; the size of the second spacer 101b12 can be 25 mm, 55 mm, or 85 mm. Herein, the size of the first spacer 101b11 can be understood as the size between the first fan 31 and the inlet panel 12 in the first direction L1, and the size of the first spacer 101b11 can be understood as the size between the first fan 31 and the outlet panel 13 in the first direction L1.

[0178] In addition, in order to make the specifications of the spare spaces formed by the first spacer 101b11 and the second spacer 101b12 consistent, so that users can subsequently replace the fans or sound-absorbing cotton with the same size in the first spacer 101b11 and the second spacer 101b12, the sizes of the first spacer 101b11 and the second spacer 101b12 can be the same, for example, both are 25 mm, 55 mm, or 85 mm.

[0179] Exemplarily, as Figure 4 shown, the first fan 31 can include a fan bracket 312 and at least one first fan unit 311, and at least one first fan unit 311 is arranged on the fan bracket 312.

[0180] In some examples, the first fan 31 includes a plurality of first fan units 311 to enhance the heat dissipation effect and meet the heat dissipation requirements of the computing module 20 with greater computing power. The plurality of first fan units 311 can be arranged in sequence in the third direction L3 and fixed on the fan bracket 312. As Figure 4 shown, each first fan 31 includes two first fan units 311.

[0181] In some other examples, the first fan 31 can include one first fan unit 311 to match the computing module 20 with relatively low heat dissipation requirements.

[0182] In some examples, the first fan unit 311 can be installed on the fan bracket 312 through glue nails 313 to reduce the vibration of the fan unit and facilitate the disassembly and assembly of the fan unit.

[0183] In some other examples, the first fan unit 311 can also be installed on the fan bracket 312 through other fixing parts, such as screws, buckles, or magnetic parts, etc., and is not limited thereto.

[0184] Exemplarily, the fan bracket 312 can be installed on the partition module 11.

[0185] In some examples, such as Figure 4 , and in combination with Figure 2A as shown, the upper end of the fan bracket 312 is mounted on the partition plate 111 of the partition module 11 to improve the stability of the fan bracket 312 and reduce the degree of vibration.

[0186] In some examples, such as Figure 4 , and in combination with Figure 2A as shown, the lower end of the fan bracket 312 can be mounted on the flange of the bottom cover 19 of the housing 10 to improve the stability of the fan bracket 312 and reduce the degree of vibration.

[0187] Figure 5B FIG. shows a schematic structural view of the housing of the computing device and some components according to an embodiment of the present application from another perspective.

[0188] In some examples, such as Figure 5A and Figure 5B as shown, a limiting strip 16 is provided on the side wall of the housing 10 in the second direction L2, that is, a limiting strip 16 is provided on the inner wall of a side plate 14 of the housing 10. The limiting strip 16 has a limiting bayonet, and the fan bracket 312 is adaptively clamped with the limiting bayonet to provide positioning for the installation of the fan bracket 312, and at the same time ensure the proper installation of the fan bracket 312 and improve the stability of the fan bracket 312.

[0189] Such as Figure 5A and Figure 5B as shown, two limiting strips 16 are provided on the side plate 14 of the housing 10 and are distributed in the first direction L1. The limiting strips 16 can be parallel to the extending direction of the fan bracket 312, for example, extending along the third direction L3. The two limiting strips 16 are respectively matched with the fan bracket 312 located in the air inlet area 101b1 and the fan bracket 312 located in the air outlet area 101b2 one by one to respectively limit the two fan brackets 312.

[0190] In some examples, the limiting strip 16 can be made of an elastic material, for example, plastic material, polyurethane material or silicone, etc., and is not limited thereto. While the limiting strip 16 cooperates with the installation and limitation of the fan bracket 312, it can ensure a certain sound insulation effect.

[0191] In some examples, the first fan unit 311 can be an axial flow fan, and its axis extends in the first direction L1 to generate an air flow flowing in the first direction L1 in the second accommodation area 101b. In other examples, the first fan unit 311 can also be a centrifugal fan, a cross-flow fan or a mixed-flow fan, etc., and is not limited thereto.

[0192] Exemplarily, the rated power of the first fan unit 311 can be 5 to 7 W, and the rotation speed can be 2500 to 3500 revolutions per minute, so as to improve the heat dissipation efficiency and reduce the fan noise at the same time.

[0193] In a specific example, the rated power of the first fan unit 311 can be 6 W, and the rotation speed can be 3000 revolutions per minute. In another example, the rated power of the first fan unit 311 can be 5 W, 5.5 W, 6.5 W or 7 W, etc., which is not limited thereto. The rotation speed of the first fan unit 311 can be 2500 revolutions per minute, 2800 revolutions per minute, 3200 revolutions per minute, etc., which is not limited thereto.

[0194] It should be noted that the above examples are only for illustration and do not constitute a limitation to this application. Those skilled in the art can understand that the rated power and rotation speed of the first fan unit 311 can be selected otherwise according to the heat dissipation requirements and noise reduction requirements.

[0195] Exemplarily, in order to reduce the noise of the fan, such as Figure 5A and Figure 5B and in combination with Figure 2A as shown, a sound absorption component 60 can be provided in the second accommodation area 101b to absorb noise, and at the same time, it can protect the modules in the second accommodation area 101b and guide the air flow in the second accommodation area 101b.

[0196] In some examples, the sound absorption component 60 includes an air inlet side sound absorption member 61 and / or an air outlet side sound absorption member 62; the air inlet side sound absorption member 61 is respectively provided at the top and bottom of the air inlet area 101b1 of the second accommodation area 101b, and / or, the air outlet side sound absorption member 62 is respectively provided at the top and bottom of the air outlet area 101b2 of the second accommodation area 101b. On the one hand, the air inlet side sound absorption member 61 and the air outlet side sound absorption member 62 can close some gaps in the second accommodation area 101b, block the air flow passing through the gaps, so that the air flow passes through the computing module 20 to be cooled as much as possible, increasing the heat dissipation efficiency, and on the other hand, they can absorb noise to achieve a silent effect.

[0197] Such as Figure 5A and Figure 5B and in combination with Figure 2A 、 Figure 2BAs shown, air inlet side sound-absorbing members 61 are respectively provided at the top and bottom of the air inlet area 101b1 of the second accommodation area 101b. The air inlet side sound-absorbing members 61 can absorb the noise of the first fan 31 located in the air inlet area 101b1, and at the same time provide buffering and protection for the vibration of the first fan 31. Air outlet side sound-absorbing members 62 are respectively provided at the top and bottom of the air outlet area 101b2 of the second accommodation area 101b. The air outlet side sound-absorbing members 62 can absorb the noise of the first fan 31 located in the air outlet area 101b2, and at the same time provide buffering and protection for the vibration of the first fan 31. In this way, the noise of the computing device 1 can be greatly reduced, so as to provide the user with a computing device 1 with an approximate silent effect.

[0198] In some examples, the air inlet side sound-absorbing members 61 and the air outlet side sound-absorbing members 62 can be sound-absorbing cotton, for example, wave sponge or polyurethane sponge, etc., but are not limited thereto. In other examples, the air inlet side sound-absorbing members 61 and the air outlet side sound-absorbing members 62 can be sound-absorbing members made of acoustic foam or fabric sound-absorbing materials, etc., and are not limited thereto.

[0199] In some examples, the air inlet side sound-absorbing members 61 and / or the air outlet side sound-absorbing members 62 can be defined with bayonets (not labeled), and the upper and lower parts of the fan bracket 312 are respectively clamped in the corresponding bayonets. The air inlet side sound-absorbing members 61 and the air outlet side sound-absorbing members 62 can be respectively defined with bayonets. The upper part of the fan bracket 312 located in the air inlet area 101b1 is clamped in the bayonet of the air inlet side sound-absorbing member 61 at the top, and the lower part of the fan bracket 312 is clamped in the bayonet of the air inlet side sound-absorbing member 61 at the bottom. Correspondingly, the upper part of the fan bracket 312 located in the air outlet area 101b2 is clamped in the bayonet of the air outlet side sound-absorbing member 62 at the top, and the lower part of the fan bracket 312 is clamped in the bayonet of the air outlet side sound-absorbing member 62 at the bottom. In this way, the stability of the fan bracket 312 in the air inlet area 101b1 and the fan bracket 312 in the air outlet area 101b2 is improved, the vibration is reduced, and the noise is reduced.

[0200] In some examples, as Figure 5A shown, a sound-absorbing layer 63 can be provided on the inner side of the side plate 14 of the chassis 10 in the second direction L2 to improve the sound-absorbing effect, reduce the noise, and thus achieve a silent effect.

[0201] Exemplarily, as Figure 5A and Figure 5B shown, an installation bracket 171 can be provided between the air inlet side sound-absorbing member 61 and the air outlet side sound-absorbing member 62. The installation bracket 171 is used to install the computing module 20. As Figure 5A and Figure 5BAs shown, there is a mounting bracket 171 between the intake-side sound-absorbing member 61 and the exhaust-side sound-absorbing member 62 at the bottom, and there is a mounting bracket (not shown) between the intake-side sound-absorbing member 61 and the exhaust-side sound-absorbing member 62 at the top. The mounting bracket at the top and the mounting bracket 171 at the bottom can respectively fix the top and bottom of the computing module 20, improving the stability of the computing module 20.

[0202] Figure 6 Fig. shows a schematic structural diagram of the computing module 20 of the computing device 1 according to an embodiment of the present application.

[0203] Exemplarily, as Figure 6 shown, the computing module 20 further includes at least one heat sink group 22 to increase the heat dissipation area of the computing module 20 and improve the heat dissipation efficiency.

[0204] In some examples, at least one heat sink group 22 has a spaced-apart space from the heat dissipation module 30 in the first direction L1 to ensure the smooth flow of air; at the same time, a spare space is left to facilitate the subsequent replacement of a larger-sized fan or the addition of sound-absorbing cotton, etc., so as to provide room for users to freely play and meet various needs of users.

[0205] Exemplarily, the computing power board 21 can be installed on the heat sink group 22. The housing 10 includes a mounting structure 17 provided in the second accommodation area 101b, and the heat sink group 22 is installed on the mounting structure 17, thereby realizing the fixation of the computing power board 21 and the heat sink group 22.

[0206] In some examples, the computing power board 21 can be installed on the heat sink group 22 by fasteners such as screws or bolts. In other examples, the computing power board 21 can be installed on the heat sink group 22 by rivets, buckles, etc., and is not limited thereto.

[0207] In some examples, referring again to Figure 5A , and in combination with Figure 2A shown, the mounting structure 17 can include two mounting brackets 171 respectively located at the top and bottom of the second accommodation area 101b. The mounting bracket 171 at the top and the mounting bracket 171 at the bottom can respectively fix the top and bottom of the heat sink group 22, and at the same time can provide a bearing function for the computing power board 21 and the heat sink group 22, thereby improving the stability of the computing module 20.

[0208] Exemplarily, as Figure 6As shown, a heat sink group 22 is provided on the non-chip side of the computing power board 21. The heat sink group 22 provided on the non-chip side of the computing power board 21 is the first heat sink group 221. The first heat sink group 221 includes a first heat sink substrate 2211 and a plurality of first heat sink fins 2212. The plurality of first heat sink fins 2212 are provided on the side of the first heat sink substrate 2211 facing away from the computing power board 21 to dissipate the heat of the computing power board 21 in a direction away from the computing power board 21, increasing the heat dissipation area and improving the heat dissipation effect.

[0209] The plurality of first heat sink fins 2212 can be arranged in sequence in the third direction L3 to increase the heat dissipation area.

[0210] In some examples, the upper and lower parts of the first heat sink substrate 2211 can be respectively mounted on two mounting brackets 171, so that the computing module 20 is fixed to the mounting brackets 171 through the first heat sink substrate 2211.

[0211] In some examples, as Figure 6 shown, the area size of the first heat sink substrate 2211 is larger than the area size of the computing power board 21. The area of the first heat sink substrate 2211 that is not covered by the computing power board 21 in the upper part defines an upper mounting area, and the area of the first heat sink substrate 2211 that exceeds the lower edge of the computing power board 21 defines a lower mounting area. The first heat sink substrate 2211 is respectively mounted on the corresponding mounting brackets 171 through the upper mounting area and the lower mounting area. That is, a part of the first heat sink substrate 2211 covers the non-chip side of the computing power board 21, and the upper and lower parts of the first heat sink substrate 2211 respectively have exposed areas that are not covered by the computing power board 21 to facilitate the installation of the first heat sink substrate 2211 and the mounting brackets 171.

[0212] In some examples, the first heat sink substrate 2211 can be mounted on the mounting brackets 171 through fasteners such as screws or bolts. In other examples, the first heat sink substrate 2211 can be mounted on the mounting brackets 171 by means of rivets, buckles, etc., and is not limited thereto.

[0213] Exemplarily, as Figure 6 shown, a heat sink group 22 is provided on the chip side of the computing power board 21. The heat sink group 22 provided on the chip side of the computing power board 21 is the second heat sink group 222. The second heat sink group 222 includes a second heat sink substrate 2221 and a plurality of second heat sink fins 2222. The plurality of second heat sink fins 2222 are provided on the side of the second heat sink substrate 2221 facing away from the computing power board 21 to directly dissipate the heat of the chip side with more heat generation in a direction away from the computing power board 21, improving the heat dissipation effect.

[0214] The plurality of second heat sink fins 2222 can be arranged in sequence in the third direction L3 to increase the heat dissipation area.

[0215] In some examples, the first heat sink group 221 can be integrally arranged, and the second heat sink group 222 can be formed by splicing three parts arranged in the third direction L3. In other examples, the first heat sink group 221 and the second heat sink group 222 can also be integrally arranged or split-type arranged respectively, which is not limited thereto.

[0216] In some examples, as Figure 6 shown, along the first direction L1, the first heat dissipation fins 2212 and the second heat dissipation fins 2222 are respectively wedge-shaped, that is, along the air flow direction, the upstream sections of the first heat dissipation fins 2212 and the second heat dissipation fins 2222 have inclined cutting surfaces, so that the areas of the upstream sections of the first heat dissipation fins 2212 and the second heat dissipation fins 2222 are smaller than those of the downstream sections. When the air flow passes through the computing module 20, it first passes through the inclined cutting surface and is guided downstream by the inclined cutting surface, which can reduce the wind resistance of the air flow. At the same time, the temperature of the air flow becomes higher after passing through the upstream section of the computing power board 21, and the downstream section of the computing power board 21 can be dissipated by the downstream sections of the first heat dissipation fins 2212 and the second heat dissipation fins 2222 with larger areas, so as to ensure the heat dissipation effect of the downstream section of the computing power board 21.

[0217] In some examples, as Figure 6 shown, the extension dimension of the second heat dissipation fins 2222 in the first direction L1 is greater than the extension dimension of the computing power board 21 in the first direction L1, so as to increase the area of the second heat dissipation fins 2222 and improve the heat dissipation effect on the computing power board 21.

[0218] In some examples, the first heat dissipation fins 2212 and / or the second heat dissipation fins 2222 extend along the second direction L2 and are perpendicular to the side plate 14 of the casing 10 in the second direction L2. That is, the first heat dissipation fins 2212 and the second heat dissipation fins 2222 can extend horizontally, perpendicular to the vertically extending computing power board 21 and at the same time perpendicular to the vertically extending side plate 14, making full use of the space around the computing power board 21 while increasing the heat dissipation area, thereby improving the space utilization rate.

[0219] In some examples, the extension dimension of the first heat dissipation fins 2212 and / or the second heat dissipation fins 2222 in the second direction L2 can be about 3U / 2, so as to match the casing 10 with an extension dimension of 3U in the second direction L2, so as to make the most of the internal space of the casing 10 and increase the heat dissipation efficiency.

[0220] The ratio of the extension dimension of the first heat sink group 221 and the second heat sink group 222 in the first direction L1 to the extension dimension in the third direction L3 can be 7 / 10 to 6 / 5 respectively.

[0221] The ratio of the extension dimension of the first heat dissipation fin 2212 and the second heat dissipation fin 2222 in the first direction L1 to the extension dimension in the second direction L2 can be 5 / 2 to 9 / 2.

[0222] In some examples, the extension dimension of the first heat dissipation fin 2212 and / or the second heat dissipation fin 2222 in the second direction L2 can be 55 mm to 70 mm. This range value includes the value 3U / 2. According to the size of the rack carrying the computing device 1 and the size of the casing 10 of the computing device 1, the extension dimension of the first heat dissipation fin 2212 and the second heat dissipation fin 2222 in the second direction L2 can be adjusted arbitrarily within the foregoing range.

[0223] In some examples, the thickness of the first heat dissipation fin 2212 and / or the second heat dissipation fin 2222 can be 0.6 mm - 0.8 mm to ensure its structural strength, and at the same time, more first heat dissipation fins 2212 and second heat dissipation fins 2222 can be arranged on the fixed computing power board 21.

[0224] In some examples, the overall size of the first heat dissipation fin group 221 can be 284.8 mm * 221 mm * 60 mm, that is, the extension dimension of the first heat dissipation fin group 221 in the third direction L3 can be 284.8 mm, the dimension in the first direction L1 is 221 mm, and the dimension in the second direction L2 is 60 mm.

[0225] In some examples, the overall size of the second heat dissipation fin group 222 can be 221 mm * 77.8 mm * 60 mm, that is, the extension dimension of the first heat dissipation fin group 221 in the third direction L3 can be 221 mm, the dimension in the first direction L1 is 77.8 mm, and the dimension in the second direction L2 is 60 mm.

[0226] In some examples, the spacing between two adjacent first heat dissipation fins 2212 in the third direction L3 can be 4.3 mm, and the spacing between two adjacent second heat dissipation fins 2222 in the third direction L3 can be 4.3 mm.

[0227] It should be noted that the above examples are only for illustration and do not constitute a limitation to this application. The sizes of the first heat dissipation fin group 221, the second heat dissipation fin group 222, and the first heat dissipation fins 2212 and the second heat dissipation fins 2222 can also be other values.

[0228] In some examples, the surfaces of the first heat dissipation fins 2212 and the second heat dissipation fins 2222 can be nickel-plated to prevent oxidation and are integrally insulated to prevent the computing power board 21 from conducting electricity. In some examples, the surfaces of the first heat dissipation fins 2212 and the second heat dissipation fins 2222 can be painted dark with a consistent color to improve the aesthetics.

[0229] Exemplarily, such as Figure 6 , and in combination with Figure 2A and Figure 7 As shown, the computing power board 21 has a first conductive member 232 and a second conductive member 231, and the first conductive member 232 and the second conductive member 231 are respectively electrically connected to two electrodes 43 of the power supply module 40 through two electrical connection structures 42.

[0230] Exemplarily, such as Figure 6 As shown, the computing power board 21 further has a signal interface 25, and the computing power board 21 is communicatively connected to the first control board 51 of the control module 50 through the signal interface 25.

[0231] Exemplarily, the rated power of the computing power board 21 can be 1500W to 2000W, which can meet the requirements of high computing power and increase the application range of the computing device 1.

[0232] In a specific example, the rated power of the computing power board 21 is 1600W. In another example, the rated power of the computing power board 21 can be 1500W, 1700W, 1800W, 1900W, 2000W, etc., and is not limited thereto.

[0233] It should be noted that the above examples are only for illustration and do not constitute a limitation to this application. Those skilled in the art can understand that the rated power of the computing power board 21 can be flexibly selected according to the computing power requirements.

[0234] Exemplarily, referring again to Figure 5A As shown, the separation module 11 is the same size as the housing 10 in at least one direction. For example, in the first direction L1 and / or the second direction L2, the size of the separation module 11 is the same as the size of the housing 10, so as to divide the interior of the housing 10 into two accommodation areas 101 that are roughly the same size in the first direction L1 and / or the second direction L2, making the interior of the housing 10 more regular and facilitating the arrangement of each component.

[0235] Exemplarily, referring again to Figure 2A and Figure 2B As shown, the power supply module 40 and the control module 50 can be respectively fixedly installed on the separation module 11. In some examples, the separation module 11 divides the interior of the housing 10 into a first accommodation area 101a located above and a second accommodation area 101b located below, and the power supply module 40 and the control module 50 can be located in the first accommodation area 101a and installed on the separation module 11.

[0236] Exemplarily, the separation module 11 can be arranged in parallel with the power supply module 40 in the length direction of the power supply module 40. For example, the separation module 11 extends horizontally as a whole, and the power supply module 40 is horizontally placed on the separation module 11. For another example, if the separation module 11 extends vertically as a whole, the power supply module 40 is vertically placed on the separation module 11.

[0237] Exemplarily, as Figure 5A shown, the separation module 11 includes a separation plate 111, and the separation plate 111 divides the interior of the housing 10 into two accommodation areas 101.

[0238] In some examples, the separation plate 111 extends from the inlet panel 12 to the outlet panel 13 in the first direction L1, that is, the dimension of the separation plate 111 in the first direction L1 is substantially the same as the dimension of the housing 10 in the first direction L1, so as to divide the interior of the housing 10 into two accommodation areas 101 with substantially the same extension dimension in the first direction L1, facilitating the adaptation to the layout space requirements of each component and maintaining the neatness of the accommodation areas 101.

[0239] In some examples, the separation plate 111 can define a wire harness fixing structure 1112 and / or a wire routing channel. As Figure 5A shown, the wire harness fixing structure 1112 can include a circular notch that is recessed inward at the edge of the separation plate 111. The wire routing channel can include a wire passing hole (not shown) opened on the surface of the separation plate 111.

[0240] In some examples, the wire harness fixing structure 1112 and / or the wire routing channel can be respectively provided with protective sleeves (not shown) to protect the cables and prevent the cables from being squeezed and scratched.

[0241] Exemplarily, as Figure 5A shown, the separation module 11 can further include a power supply bracket 1111. The power supply bracket 1111 is located in the first accommodation area 101a and is arranged above the separation plate 111 for supporting the power supply module 40 to maintain the stability of the power supply module 40.

[0242] Figure 7 Schematic diagram showing the power supply module 40 of the computing device 1 according to an embodiment of the present application.

[0243] In some examples, as Figure 5A , and in combination with Figure 2A , Figure 2B and Figure 7As shown, the partition board 111 may have an avoidance structure 1113 for avoiding the electrical connection structure 42 between the power supply module 40 and the computing power board 21. The edge of the partition board 111 has an inwardly recessed avoidance notch, and the electrical connection structure 42 of the power supply module 40 passes through the avoidance notch to be connected to the computing power board 21. The electrode 43 of the power supply module 40 is exposed to be connected to the computing power board 21 through the electrical connection structure 42.

[0244] In some examples, an installation space is defined between the power supply 45 brackets 1111 and the partition board 111, and the second control board 52 signal-connected to the air outlet fan may be disposed in the installation space.

[0245] As Figure 7 shown, in some examples, the power supply module 40 may include a power supply 45 and a second fan 41 disposed outside the power supply 45. The second fan 41 is disposed in the first accommodation area 101a and is used to generate a cooling air flow flowing through the first accommodation area 101a to dissipate heat from the power supply module 40.

[0246] In some examples, the power supply 45 may be provided with at least one hanging pin (not shown), and a hanging hole (not shown) may be provided in the area of the side plate 14 of the chassis 10 corresponding to the hanging pin. The hanging hole is slidably engaged with the corresponding hanging pin to guide the installation of the power supply 45 and simultaneously limit and fix the power supply 45.

[0247] In some examples, the power supply 45 may be fixed to the chassis 10 by fasteners such as screws and bolts.

[0248] In some examples, the second fan 41 may be disposed at one end of the power supply 45 adjacent to the inlet panel 12 to cause the air flow to enter the first accommodation area 101a from the hollow area of the inlet panel 12, flow through the power supply 45, and then flow out of the first accommodation area 101a from the hollow area of the outlet panel 13, improving the heat dissipation efficiency of the power supply 45.

[0249] In some examples, referring again to Figure 1 and Figure 2A shown, there is a third spaced space 101a1 between the power supply module 40 and the inlet panel 12. The first control board 51 of the control module 50 may be located in the third spaced space 101a1 and is disposed above the partition board 111. The first control board 51 of the control module 50 is communicatively connected to the computing power board 21.

[0250] In some examples, the first control board 51 may serve as a total control board, interact with the user control area, and have control functions such as computing power board 21 control, power supply 45 control, and fan control.

[0251] In other examples, continuing to refer to Figure 1 and Figure 2AAs shown, the control module 50 may further include at least one second control board 52 connected to the first control board 51, and at least one second control board 52 is communicatively connected to at least one first fan 31 of the heat dissipation module 30. In this example, the first control board 51 may serve as a main control board to interact with the user control area, and the second control board 52 may serve as a fan control board to achieve modular control, which is convenient for maintenance and management.

[0252] In some examples, the number of the second control boards 52 may be one, and one second control board 52 may be communicatively connected to two first fans 31 respectively. In some other examples, the number of the second control boards 52 may be two, and two second control boards 52 may be communicatively connected to two first fans 31 respectively.

[0253] Exemplarily, the first control board 51 may be adjacent to the entrance panel 12 and disposed above the partition board 111, and at least one second control board 52 may be disposed in the third interval space 101a1 and located between the first control board 51 and the power module 40 in the first direction L1.

[0254] In some examples, the first control board 51 may be adjacent to the user operation panel 122 on the entrance panel 12 to facilitate the connection between the first control board 51 and the user operation panel 122.

[0255] In some examples, the first fan 31 disposed in the air inlet area 101b1 of the second accommodation area 101b is denoted as an air inlet fan, and the air inlet fan may be located below the third interval space 101a1 to facilitate the communication connection between the second control board 52 and the air inlet fan.

[0256] In some examples, the first fan 31 disposed in the air outlet area 101b2 of the second accommodation area 101b is denoted as an air outlet fan, and the air outlet fan is located below the power module 40. In the example where the number of the second control boards 52 is one, the second control board 52 may be disposed in the third interval space 101a1. In the example where the number of the second control boards 52 is two, the second control board 52 signal-connected to the air inlet fan may be located in the third interval space 101a1, and the second control board 52 signal-connected to the air outlet fan may be disposed on the partition module 11 and located below the power module 40.

[0257] Exemplarily, the second control board 52 signal-connected to the air outlet fan may be disposed in the installation space between the power supply 45 bracket 1111 of the partition module 11 and the partition board 111, which can improve the space utilization rate while facilitating the communication connection between the second control board 52 and the air outlet fan.

[0258] In some examples, the connectors between the first fans 31 and the second control boards 52 may be universal connectors to be compatible with fans of different specifications and increase the scalability.

[0259] In some examples, the first control board 51 is mounted on the partition board 111 through the first mounting bracket 102, and the second control board 52 is mounted on the partition board 111 through the second mounting bracket 103.

[0260] In some examples, the partition board 111 may have mounting grooves and limiting protrusions (not shown) respectively cooperating with the first mounting bracket 102 and the second mounting bracket 103 for mounting and limiting the first mounting bracket 102 and the second mounting bracket 103.

[0261] In some examples, the first mounting bracket 102 and the second mounting bracket 103 may be mounted on the partition board 111 by cooperation such as screws or buckles.

[0262] Figure 8 , Figure 9 FIG. shows a schematic structural diagram of the computing power board 21 according to an embodiment of the present application.

[0263] The computing power board of the embodiment of the present application can be applied to a computing device to achieve efficient computing power. The computing power board includes a board body, a chip array arranged on the board body, a power supply module and a processing module; the chip array includes a power taking unit, the power taking unit includes at least one chip, the power supply module is used to connect to a power source, the power supply module is electrically connected to the power taking unit for supplying power to the power taking unit, the power supply module has a voltage monitoring point, and the processing module is electrically connected to the voltage monitoring point for collecting the voltage of the voltage monitoring point to ensure voltage stability and facilitate quick identification of the fault point.

[0264] The processing module can be signal-connected to the control module to upload the voltage of the voltage monitoring point collected by it. The control module can record and store the historical data of the voltage monitoring point of the computing power board. When the voltage data shows abnormal fluctuations, frequent drops or instability, it indicates that there is a high possibility of a fault in the computing power board. Thus, by analyzing the voltage historical data, the abnormal voltage monitoring point can be identified, and the fault location can be quickly determined.

[0265] The processing module may include a memory, and the memory records and stores the collected voltage data for maintenance personnel to call, facilitating the maintenance personnel to quickly lock the fault location.

[0266] The processing module may include a processor and an analog-to-digital converter. The analog-to-digital converter is connected to the voltage monitoring point for collecting the voltage of the voltage monitoring point, and the processor is connected to the analog-to-digital converter for obtaining the voltage of the voltage monitoring point. The processor can also compare the collected voltage with a preset voltage to determine whether the working state of the computing power board is stable.

[0267] The processor can be an MCU (Microcontroller Unit), an FPGA (Field-Programmable Gate Array), a DSP (Digital Signal Processor), etc., and is not limited thereto.

[0268] The processor can collect the voltages of different voltage monitoring points on the power supply module through multiple AD (Analog-to-Digital Converter) channels, and communicate with the control board through I2C (Inter-Integrated Circuit) or SPI (Serial Peripheral Interface), etc., to achieve power management and fault detection.

[0269] The number of voltage monitoring points can be set based on the hardware resources of the processing module itself, such as the number of pins and the number of analog-to-digital converter channels. When the hardware resources of the processing module can be satisfied, more voltage monitoring points can be set on the computing power board, that is, the power supply module can have multiple voltage monitoring points. The processor is connected to multiple voltage monitoring points through a multi-channel analog-to-digital converter respectively to achieve voltage monitoring at multiple positions on the computing power board. If the voltage of a certain monitoring point is abnormal (such as too high or too low), the specific fault location can be quickly located, thereby shortening the fault diagnosis time and improving the maintenance efficiency. The historical data of the voltage monitoring points can be used for fault analysis and trend prediction. By analyzing the historical records of voltage changes, potential patterns and problems can be identified for preventive maintenance to prevent future faults from occurring.

[0270] Under normal circumstances, according to the total voltage of the computing power board and the number of series-connected power extraction units, the voltage drop value of each stage of the power extraction unit can be determined. When the values of one or more voltage monitoring points are significantly different from the corresponding voltage values, it can be determined that there is a faulty chip in the power extraction unit upstream here, so that the troubleshooting range of the faulty chip can be narrowed. Based on this, when the hardware resources of the processing module can be satisfied, the number of voltage monitoring points can also be determined according to the number of power extraction units in the chip array. The more the number of power extraction units, the more the number of voltage monitoring points. For example, a voltage monitoring point is set at a certain interval of power extraction units.

[0271] The following will be described in detail with specific embodiments in conjunction with the drawings.

[0272] Such as Figure 8 and Figure 9As shown in the figure, there are six voltage monitoring points 203 on the computing power board 21, and the processor 24 collects the voltages of the six voltage monitoring points 203 through a six-channel analog-to-digital converter 241 respectively. In this example, limited by the hardware resources of the processing module itself, the processing module has six pins and six analog-to-digital converter channels. The processing module collects the voltages of the six voltage monitoring points respectively through the six pins and the six analog-to-digital converter channels.

[0273] In some other examples, the processing module can have more pins and analog-to-digital converter channels. Therefore, more voltage monitoring points can be set on the computing power board. For example, eight, ten or more voltage monitoring points, and it is not limited to this.

[0274] It should be noted that the above are only examples and do not constitute a limitation to this application. Those skilled in the art can select different processing modules according to the monitoring requirements and cost control, and set the corresponding number of voltage monitoring points for the computing power board.

[0275] Exemplarily, as Figure 8 shown, the power supply module 23 can include a first conductive member 232 and a second conductive member 231. The first conductive member 232 is used to connect to the negative terminal of the power supply, and the second conductive member 231 is used to connect to the positive terminal of the power supply; the processing module is connected between the first conductive member 232 and the second conductive member 231. That is, the second conductive member 231 serves as the current input of the computing power board 21, and the first conductive member 232 serves as the current output of the computing power board 21 to realize the power supply of the computing power board 21.

[0276] Exemplarily, as Figure 8 shown, the power supply module 23 can include an electrical connection member 233. The electrical connection member 233 is connected between the first conductive member 232 and the second conductive member 231. The electrical connection member 233 is connected in series with a plurality of power extraction units 2110, and the electrical connection member 233 has a voltage monitoring point 203.

[0277] A plurality of power extraction groups can be distributed along the first direction L1 on the board body 201. Each power extraction group includes a plurality of power extraction units 2110 arranged in sequence in the third direction L3. Each power extraction unit 2110 includes a plurality of chips 202 arranged in sequence along the first direction L1. The plurality of chips 202 of each power extraction unit 2110 are connected in parallel, so as to form a chip array 210 on the board body 201.

[0278] As Figure 9As shown, the electrical connection member 233 connects each power-taking unit 2110 in series between the first conductive member 232 and the second conductive member 231, and multiple chips 202 of each power-taking unit 2110 are connected in parallel. The electrical connection member 233 may include multiple electrical connection units 2331. The electrical connection units 2331 are connected between two adjacent chips 202 in the third direction L3, and the electrical connection units 2331 are connected between two adjacent power-taking groups in the first direction L1. In this way, each power-taking unit 2110 is sequentially connected in series through the electrical connection member 233 including multiple electrical connection units 2331.

[0279] The electrical connection member 233 can be a metal conductive bus bar, such as a conductive copper bus bar, to reduce the voltage drop.

[0280] Exemplarily, multiple voltage monitoring points can be evenly distributed on the series path of multiple serially connected power-taking groups of the electrical connection member.

[0281] As Figure 9 shown, taking the chip array 210 having four power-taking groups as an example, the lowermost one is the first power-taking group 211, the uppermost one is the second power-taking group 212, and the two in the middle are the third power-taking groups 213. The electrical connection member 233 has four voltage monitoring points 203, and the four voltage monitoring points 203 are respectively the first voltage monitoring point 2031, the second voltage monitoring point 2032, the third voltage monitoring point 2033, and the fourth voltage monitoring point 2034. At the input end of the electrical connection member 233, that is, one end of the electrical connection member 233 connected to the second conductive member 231, there is the first voltage monitoring point 2031, that is, the left end of the uppermost second power-taking group 212 has the first voltage monitoring point 2031. At approximately 3 / 4 of the electrical connection member 233, there is the second voltage monitoring point 2032, that is, at a position adjacent to the right end of the upper third power-taking group 213, there is the second voltage monitoring point 2032. At approximately 1 / 2 of the electrical connection member 233, there is the third voltage monitoring point 2033, that is, at a position between the left end of the lower third power-taking group 213 and the left end of the lower first power-taking group 211, there is the third voltage monitoring point 2033. At approximately 1 / 4 of the electrical connection member 233, there is the fourth voltage monitoring point 2034, that is, at a position adjacent to the right end of the first power-taking group 211, there is the fourth voltage monitoring point 2034. In this way, four voltage monitoring points 203 are evenly distributed on the series path of each power-taking group, so as to comprehensively and real-time understand the working state of the computing power board 21, ensure the stable and efficient operation of the computing power board 21, and at the same time, power problems or voltage abnormalities can be quickly detected, making it easier to diagnose and locate faults.

[0282] In some examples, such as Figure 9As shown, the power supply module 23 includes a boost module 234, which is connected to at least one power taking unit 2110 at the most downstream of the data transmission path, and is used to provide the required voltage for data transmission of at least one power taking unit 2110 at the most downstream.

[0283] It should be noted here that the data transmission between the chip 202 and the outside is realized through the signal interface 25 of the computing board 21. The voltage required for the data transmission of the chip 202 is generally higher than the voltage required by the internal circuit of the chip 202. In order to ensure the stability of the data transmission of the chip 202, each power supply group is provided with an auxiliary power supply module. Since the voltage of the power supply group at this level cannot meet the power supply requirements of data transmission, the auxiliary power supply module needs to draw power across levels in the direction of data transmission. For the last power supply groups at each level that cannot continue to draw power across levels, the computing board 21 is equipped with a boost module 234 to meet the power demand of data transmission.

[0284] In some examples, such as Figure 9 As shown, the power supply module 23 may further include a voltage stabilizing module 235, which is connected between the voltage output end of the boost module 234 and at least one power taking unit 2110 at the most downstream, that is, the output voltage of the boost module 234 is output to the corresponding power taking group after passing through the voltage stabilizing module 235 to ensure voltage stability.

[0285] like Figure 9 As shown, the voltage output end of the boost module 234 and the voltage output end of the voltage stabilizing module 235 respectively have voltage monitoring points 203, namely, the fifth voltage monitoring point 2035 of the voltage output end of the boost module 234 and the sixth voltage monitoring point 2036 of the voltage output end of the voltage stabilizing module 235. On the one hand, the output voltage is monitored to ensure that the output voltage can meet the data transmission needs of the last power-taking groups at all levels; on the other hand, when the voltage is unstable or abnormal, the fault can be quickly identified according to the voltages of different voltage monitoring points 203. For example, when the voltage of the voltage monitoring point 203 of the voltage output end of the boost module 234 is abnormal, the boost module 234 can be judged to be faulty. When the voltage of the voltage monitoring point 203 of the voltage output end of the boost module 234 is normal and the voltage of the voltage monitoring point 203 of the voltage output end of the voltage stabilizing module 235 is abnormal, the voltage stabilizing module 235 can be judged to be faulty.

[0286] Exemplarily, the boosting module 234 may include a voltage control chip, an input voltage switching element, an output voltage switching element, an inductor, a capacitor, etc. The voltage control chip is used to control the on / off of the input voltage switching element and the on / off of the output voltage switching element according to a preset voltage range. The voltage control chip can monitor the output voltage of the boosting module 234 in real time to determine whether the actual output voltage is within the preset voltage range. If the output voltage does not fall within the preset voltage range, the voltage control chip will adjust the on / off time of the input voltage switching element and the output voltage switching element, so as to stabilize the output voltage and make it fall within the preset voltage range to meet the data power consumption requirements of the chip 202.

[0287] The input voltage switching element and the output voltage switching element may be metal-oxide-semiconductor field effect transistors respectively, that is, the input voltage switching element is a high-side MOS (Metal Oxide Semiconductor) field effect transistor, and the output voltage switching element is a low-side MOS field effect transistor, so as to reduce the on-resistance and improve the efficiency of the boosting module 234.

[0288] Exemplarily, the voltage regulation module 235 may be a low dropout regulator (LDO), which has a lower input-output voltage difference, that is, it can still work stably when the input voltage is close to the output voltage.

[0289] Exemplarily, the signal interface 25 is connected to each chip 202 in sequence through a signal transmission link, such as Figure 9 As shown, the computing power board 21 includes at least two clock frequency generators 206. One of the clock frequency generators 206 is arranged adjacent to the starting end of the signal transmission link to synchronize the data transmitted at the starting end of the signal transmission link and ensure that the signal has accurate timing characteristics when being sent; at least one clock frequency generator 206 is arranged adjacent to the middle area of the signal transmission link to solve the problem of signal distortion caused by signal attenuation, timing offset or electromagnetic interference during long-distance transmission. By regenerating or enhancing the clock signal, the stability of signal transmission is ensured.

[0290] As Figure 9 shown, there are two clock frequency generators 206 on the signal transmission link. The first clock frequency generator 2061 is arranged adjacent to the starting end of the signal transmission link, and the second clock frequency generator 2062 is arranged adjacent to the middle area of the signal transmission link. The signal is subjected to timing calibration to compensate for the phase deviation or frequency attenuation caused by the increase in transmission distance, prevent waveform distortion caused by cumulative errors, so as to ensure the stability of signal transmission and avoid signal distortion.

[0291] Exemplarily, the clock frequency generator 206 may be a crystal oscillator.

[0292] Exemplarily, such asFigure 9 As shown, the signal interface 25 is sequentially connected to the first power-taking group 211, the third power-taking group 213, and the second power-taking group 212 through a signal transmission link; the chip 202 adjacent to the signal interface 25 in the first power-taking group 211 is electrically connected to the starting end of the signal transmission link, and the chip 202 adjacent to the second conductive member 231 in the second power-taking group 212 is electrically connected to the end of the signal transmission link; the chip 202 adjacent to the first conductive member 232 in the first power-taking group 211 is electrically connected to the first conductive member 232, and the chip 202 adjacent to the second conductive member 231 in the second power-taking group 212 is electrically connected to the second conductive member 231. That is, the signal transmission starts from the chip 202 closest to the signal interface 25 in the first power-taking group 211, and the power transmission starts from the chip 202 closest to the second conductive member 231 in the second power-taking group 212, so as to ensure the stability of signal transmission and facilitate wiring at the same time.

[0293] Exemplarily, as Figure 9 shown, the first conductive member 232, the second conductive member 231, the signal interface 25, the processing module (processor 24 and analog-to-digital converter 241), the boosting module 234, and the voltage stabilizing module 235 are arranged on the same side of the board body 201 in the third direction L3. On the one hand, it can provide sufficient space for the arrangement of the chip array 210, and on the other hand, it is convenient for the connection between each component and the chip 202.

[0294] Exemplarily, as Figure 9 shown, the signal interface 25, the processing module (processor 24 and analog-to-digital converter 241), the boosting module 234, and the voltage stabilizing module 235 are arranged in the area between the first conductive member 232 and the second conductive member 231, so as to improve the utilization rate of the space of the board body 201 and facilitate the connection of each component.

[0295] Exemplarily, the end of the chip array 210 in the third direction L3 that is on the same end as the first conductive member 232, the second conductive member 231, and the signal interface 25 is the first end, and the end of the chip array 210 in the third direction L3 that is opposite to the first conductive member 232, the second conductive member 231, and the signal interface 25 is denoted as the second end; the power-taking unit 2110 at the first end of the power-taking group adjacent to the second conductive member 231 is connected to the second conductive member 231, and is sequentially connected in series along the third direction L3 to the power-taking unit 2110 at the second end of this power-taking group. The power-taking unit 2110 at the second end of this power-taking group is then connected in series with the power-taking unit 2110 at the second end of the adjacent next power-taking group, and then is sequentially connected in series along the third direction L3 to the power-taking unit 2110 at the first end of this power-taking group, and is connected in series in turn until the power-taking unit 2110 at the first end of the last power-taking group is electrically connected to the first conductive member 232.

[0296] Exemplarily, along the direction of the heat dissipation air flow, the upstream side of the power extraction group in the power resistor is taken as the first side, and the downstream side is taken as the second side. The chip 202 on the second side of the power extraction unit 2110 at the first end of the power extraction group adjacent to the first conductive member 232 is connected to the signal interface 25, and the chip 202 on the first side of the power extraction unit 2110 is connected. The chip 202 on the first side of the power extraction unit 2110 is sequentially connected to the chip 202 on the first side and the chip 202 on the second side of the adjacent power extraction unit 2110, and is sequentially connected to the chip 202 on the second side of the power extraction unit 2110 at the second end of this power extraction group. The chip 202 on the second side of the power extraction unit 2110 at the second end of this power extraction group continues to be connected to the chip 202 on the first side of the power extraction unit 2110 at the second end of the adjacent power extraction group, and is sequentially connected until the chip 202 of the power extraction unit 2110 at the first end of the last power extraction group is connected.

[0297] Exemplarily, a temperature sensor 205 is provided on the board body 201. The temperature sensor 205 is used to detect the temperature of the air flow passing through the board body 201 to monitor the heat dissipation effect of the computing power board 21, so as to facilitate timely adjustment of the rotation speed of the heat dissipation module such as a fan, thereby ensuring the heat dissipation effect of the computing power board 21.

[0298] In some examples, the number of temperature sensors can be multiple. The multiple temperature sensors can be distributed in different areas of the computing power board to monitor the temperature distribution of different areas on the computing power board in real time, which helps to timely detect local overheating problems and ensure the uniformity of temperature distribution.

[0299] In some examples, the multiple temperature sensors can be respectively arranged in the areas adjacent to the air inlet side and the air outlet side of the board body. The air inlet side and the air outlet side are respectively located at two edge positions of the computing power board, which is convenient for wiring between the temperature sensors and the processing module.

[0300] In some other examples, temperature sensors can also be arranged in the middle area of the board body.

[0301] It should be noted that the above are only examples and do not constitute a limitation to this application. The number and position of the temperature sensors can be flexibly designed according to the requirements of the temperature uniformity of the computing power board and the convenience of wiring.

[0302] In a specific example, as Figure 9 shown, there are two temperature sensors 205 on the board body 201. One temperature sensor 205 is arranged in the area between the first power extraction group 211 and the adjacent third power extraction group 213, and the other temperature sensor 205 is arranged in the area between the second power extraction group 212 and the adjacent third power extraction group 213.

[0303] The chip array includes multiple power-taking groups, which are arranged at intervals in the first direction. Each power-taking group includes multiple power-taking units arranged in sequence and in series in the second direction, and each power-taking unit includes multiple chips connected in parallel. The total number of chips in the chip array is relatively large, which can improve the computing power of the computing power board, thereby improving the overall performance of the computing power board, and the array arrangement can improve the heat dissipation and temperature uniformity of multiple chips.

[0304] In some examples, the total number of power-taking units 2110 can be greater than 40 and less than 100 to improve the computing power of the computing power board 21. As Figure 9 shown, the number of power-taking units 2110 is 80, and each power-taking unit includes 2 chips connected in parallel, for a total of 160 chips. Among them, the first power-taking group 211 includes 20 power-taking units 2110, and the two third power-taking groups 213 each include 21 power-taking units 2110, and the second power-taking group 212 includes 18 power-taking units 2110. In some examples, the number of power-taking units 2110 can also be 50, 70, or 90, etc., and is not limited thereto. It should be noted that this is only an example and does not constitute a limitation to the present application. The number of power-taking units 2110 can be flexibly designed according to the computing power requirements of the computing power board 21 and the space of the computing power board 21.

[0305] Exemplarily, as Figure 9 shown, the cooling air flow flows through the computing power board 21 along the first direction L1. The first power-taking group 211, at least one third power-taking group 213, and the second power-taking group 212 are arranged in sequence in the first direction L1, that is, the first power-taking group 211 is adjacent to the air inlet side of the board body 201, the second power-taking group 212 is adjacent to the air outlet side of the board body 201, and the third power-taking group 213 is located between the first power-taking group 211 and the second power-taking group 212.

[0306] Along the third direction L3, there are vacancies in the middle regions of the first power-taking group 211 and the second power-taking group 212 respectively. That is, there are no chips 202 arranged in the middle regions of the first power-taking group 211 and the second power-taking group 212 to form a larger cooling channel. On the one hand, it can increase the air volume and air speed flowing from the middle region of the first power-taking group 211 to the third power-taking group 213 and the second power-taking group 212 downstream, reducing the wind resistance; on the other hand, it can reduce the number of chips 202 in the second power-taking group 212 located at the most downstream, improving the heat dissipation effect of the second power-taking group 212, so that the overall temperature of the computing power board 21 is more uniform.

[0307] Exemplarily, the first power-taking group 211 and the second power-taking group 212 each include a plurality of power-taking regions arranged in sequence along the third direction L3; in the third direction L3, the distance between any two adjacent power-taking regions is greater than the distance between two adjacent power-taking units 2110 within any one power-taking region, so as to increase the vacant positions on the first power-taking group 211 and the second power-taking group 212 respectively and improve the heat dissipation effect.

[0308] Exemplarily, the number of power-taking regions of the second power-taking group 212 is greater than the number of power-taking regions of the first power-taking group 211, so as to ensure the heat dissipation effect of the second power-taking group 212 located downstream of the heat dissipation air flow, thereby making the overall temperature of the computing power board 21 more uniform.

[0309] As Figure 9 shown, the first power-taking group 211 includes four power-taking regions, the second power-taking group 212 includes six power-taking regions, the distance between any two adjacent ones of the four power-taking regions of the first power-taking group 211 is greater than the distance between two adjacent chips 202 within each power-taking region. Correspondingly, the distance between any two adjacent ones of the six power-taking regions of the second power-taking group 212 is greater than the distance between two adjacent chips 202 within each power-taking region. In this way, large-spacing vacant positions are respectively formed in the first power-taking group 211 and the second power-taking group 212, improving the heat dissipation effect of the computing power board 21 and being beneficial to maintaining temperature uniformity.

[0310] Exemplarily, along the first direction L1, the distances between the first power-taking group 211, the third power-taking group 213, and the second power-taking group 212 increase in sequence. That is, along the heat dissipation air flow direction, the distances between adjacent two power-taking groups increase in sequence, so as to increase the distance between the downstream power-taking groups and make the overall temperature of the computing power board 21 more uniform.

[0311] Exemplarily, as Figure 9 shown, the extension dimension of at least one third power-taking group 213 in the third direction L3 is smaller than the extension dimension of the first power-taking group 211 in the third direction L3, and the extension dimension of at least one third power-taking group 213 in the third direction L3 is smaller than the extension dimension of the second power-taking group 212 in the third direction L3. That is to say, relative to the first power-taking group 211 and the second power-taking group 212, the extension dimension of the third power-taking group 213 in the third direction L3 is smaller. In this way, a layout area can be vacated at the end position of the third power-taking group 213, facilitating the layout of circuits and some electrical connection units 2331 of the electrical connection member 233 within this layout area.

[0312] Exemplarily, the number of chips 202 of the first power-taking group 211 is greater than the number of chips 202 of the second power-taking group 212, and the number of chips 202 of the first power-taking group 211 is less than the number of chips 202 of the third power-taking group 213. As Figure 9As shown, the number of chips 202 in the first power-taking group 211 is 40, the number of chips 202 in the second power-taking group 212 is 36, and the number of each third power-taking group 213 is 42. This is only an example and does not constitute a limitation to this application. The number of chips 202 in each power-taking group can be adjusted accordingly according to the space of the board body 201, heat dissipation requirements, computing power requirements, etc.

[0313] Exemplarily, taking the center line along which the board body 201 extends in the third direction L3 as the dividing line, the chip array 210 is divided into a first chip array 210 and a second chip array 210. The total number of chips 202 in the first chip array 210 close to the air inlet side of the computing power board 21 is greater than the total number of chips 202 in the second chip array 210 close to the air outlet side of the computing power board 21, that is, the number of chips 202 in the second chip array 210 located downstream of the heat dissipation air flow is less than the number of chips 202 in the first chip array 210 located upstream of the heat dissipation air flow, so as to arrange more chips 202 in the relatively lower temperature upstream area and appropriately reduce the number of chips 202 in the relatively higher temperature downstream area to ensure the heat dissipation effect and temperature uniformity of the computing power board 21.

[0314] It should be noted that the computing devices in the above embodiments can be used in combination with each other, and are not limited to the foregoing combination methods. The features and technical solutions in different embodiments can be flexibly adjusted and combined according to actual needs to achieve the best performance and functions.

[0315] Other components of the computing device 1 in the above embodiments can adopt various technical solutions known to those of ordinary skill in the art now and in the future, and will not be described in detail here.

[0316] In the description of this specification, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0317] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality" means two or more, unless otherwise specifically defined.

[0318] In this application, unless otherwise clearly defined or limited, terms such as "install", "connect", "link", "fix", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0319] In this application, unless otherwise clearly defined or limited, the first feature being "on" or "under" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "over" and "on top of" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the horizontal height of the first feature is lower than that of the second feature.

[0320] It should be noted that although the steps of the method in this application are described in a specific order in the drawings, this does not require or imply that these steps must be executed in that specific order, or that all the steps shown must be executed to achieve the desired result. Additionally or alternatively, some steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution, etc. The above-mentioned drawings are only schematic illustrations of the processes included in the method according to the exemplary embodiments of this application, rather than for limiting purposes. It is easy to understand that the processes shown in the above-mentioned drawings do not indicate or limit the chronological order of these processes. Additionally, it is also easy to understand that these processes can be executed synchronously or asynchronously in, for example, multiple modules.

[0321] The above disclosure provides many different implementation manners or examples to implement different structures of this application. To simplify the disclosure of this application, the components and settings of specific examples are described above. Of course, they are only examples and are not intended to limit this application. In addition, this application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various implementation manners and / or settings discussed.

[0322] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various changes or substitutions thereof, and these should all be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims described above.

Claims

1. A computing device, characterized in that: include: chassis; A computing module, comprising at least one computing board; A heat dissipation module, used for dissipating heat from the computing module; A power module, electrically connected to the computing module; A control module, communicatively connected with the computing module; Wherein, the computing module, the power module, the control module and the heat dissipation module are all arranged in the housing; The housing includes a partition module, and the partition module defines at least two accommodating areas.

2. The computing device according to claim 1, wherein: The two accommodating areas are used to accommodate the computing module and the power module respectively, and the two accommodating areas are used to dissipate heat for the computing module and the power module respectively.

3. The computing device according to claim 1, wherein: The length of the accommodating area is the same as the length of the housing.

4. The computing device according to claim 2, wherein: The accommodation area for accommodating the power module is a first accommodation area, and the first accommodation area is also used to accommodate the control module, and the first accommodation area is used to dissipate heat for the control module.

5. The computing device according to claim 2, wherein: The accommodation area for accommodating the computing module is the second accommodation area, and the second accommodation area is also used to accommodate the heat dissipation module.

6. The computing device according to claim 1, wherein: The housing defines a first accommodating area and a second accommodating area, and the volume of the first accommodating area is unequal to the volume of the second accommodating area.

7. The computing device according to claim 1, wherein: The housing defines a first accommodating area and a second accommodating area, and the first accommodating area and the second accommodating area are two independent heat dissipation channels.

8. The computing device according to claim 6, wherein: The first accommodating area and the second accommodating area have the same size in at least one direction.

9. The computing device according to claim 6, characterized in that The first accommodating area and the second accommodating area have the same size in the first direction and the second direction.

10. The computing device according to claim 6, characterized in that The sizes of the first accommodating area and the second accommodating area in the third direction are different. The size of the first accommodating area in the third direction is smaller than the size of the second accommodating area in the third direction. The ratio of the sizes of the first accommodating area and the second accommodating area in the third direction is greater than 1 / 5 and less than 2 / 3.

11. The computing device according to claim 1, wherein: The housing comprises an inlet panel, and a hollow area of ​​the inlet panel accounts for more than 50% of an area of ​​the inlet panel.

12. The computing device according to claim 1, wherein: The housing includes an outlet panel, and a hollow area of ​​the outlet panel accounts for more than 50% of the area of ​​the outlet panel.

13. The computing device according to claim 1, wherein: The housing includes a side plate, and the side plate and the computing power board are arranged in parallel.

14. The computing device according to claim 1, wherein: The power module and the control module are fixedly installed on the separation module.

15. The computing device according to claim 1, wherein: The partition module has the same size as that of the housing in at least one direction.

16. The computing device according to claim 1, wherein: In the first direction and / or the second direction, the size of the partition module is consistent with the size of the housing.

17. The computing device according to claim 1, wherein: The partition module is arranged in parallel with the power module in the length direction of the power module.

18. The computing device according to claim 1, wherein: The separation module is arranged vertically to the computing board.

19. The computing device of claim 1, wherein: The heat dissipation module includes at least one first fan, and the first fan is used to dissipate heat for the computing module in the second accommodating area.

20. The computing device of claim 19, wherein: The second accommodating area has an air inlet area and an air outlet area at two ends in the first direction respectively, and the first fan is disposed in the air inlet area and / or the air outlet area.

21. The computing device of claim 19, wherein: There is a first spacing space between the first fan arranged in the air inlet area and the inlet panel, and / or there is a second spacing space between the first fan arranged in the air outlet area and the outlet panel.

22. The computing device of claim 21, wherein: The size of the first interval space is greater than or equal to 25 mm and less than or equal to 85 mm; and / or the size of the second interval space is greater than or equal to 25 mm and less than or equal to 85 mm.

23. The computing device of claim 19, wherein: The first fan includes a fan bracket and at least one first fan unit, and the at least one first fan unit is arranged on the fan bracket.

24. The computing device of claim 23, wherein: The at least one first fan unit is mounted on the fan bracket by means of glue nails.

25. The computing device of claim 23, wherein: A limit strip is arranged on the side wall of the casing in the second direction, the limit strip has a limit slot, and the fan bracket is adapted to be snap-fitted with the limit slot.

26. The computing device of claim 1, wherein: The power module and the heat dissipation module are arranged on different sides of the computing module.

27. The computing device of claim 1, wherein: The computing module also includes at least one heat sink assembly.

28. The computing device of claim 27, wherein: There is a space between the at least one heat sink group and the heat dissipation module in the first direction.

29. The computing device of claim 27, wherein: The computing board is mounted on the heat sink group, the housing includes a mounting structure arranged in the second accommodating area, and the heat sink group is mounted on the mounting structure.

30. The computing device of claim 29, wherein: The mounting structure includes two mounting brackets respectively arranged at the top and bottom of the second accommodating area.

31. The computing device of claim 27, wherein: The heat sink group is provided on the non-chip side of the computing board. The heat sink group provided on the non-chip side of the computing board is a first heat sink group. The first heat sink group includes a first heat dissipation substrate and a plurality of first heat dissipation fins. The plurality of first heat dissipation fins are provided on a side of the first heat dissipation substrate away from the computing board.

32. The computing device of claim 31, wherein: The upper part and the lower part of the first heat dissipation substrate are respectively mounted on two mounting brackets of the mounting structure.

33. The computing device of claim 32, wherein: The area size of the first heat dissipation substrate is larger than the area size of the computing board, the upper area of ​​the first heat dissipation substrate not covered by the computing board defines an upper installation area, and the area of ​​the first heat dissipation substrate exceeding the lower edge of the computing board defines a lower installation area; The first heat dissipation substrate is mounted on the corresponding mounting bracket through the upper mounting area and the lower mounting area respectively.

34. The computing device of claim 31, wherein: The heat sink group is provided on the chip side of the computing board. The heat sink group provided on the chip side of the computing board is a second heat sink group. The second heat sink group includes a second heat dissipation substrate and a plurality of second heat dissipation fins. The plurality of second heat dissipation fins are provided on a side of the second heat dissipation substrate away from the computing board.

35. The computing device of claim 34, wherein: An extension dimension of the second heat dissipation fin in the first direction is greater than an extension dimension of the computing board in the first direction.

36. The computing device of claim 34, wherein: The first heat dissipation fins and / or the second heat dissipation fins extend along a second direction and are perpendicular to a side plate of the housing in the second direction.

37. The computing device of claim 27, wherein: An extension dimension of the first heat dissipating fin and / or the second heat dissipating fin in the second direction is 55 mm to 70 mm.

38. The computing device of claim 5, wherein: The second accommodating area is provided with a sound absorbing component.

39. The computing device of claim 38, wherein: The sound absorbing assembly includes an air inlet side sound absorbing component and / or an air outlet side sound absorbing component; the air inlet side sound absorbing component is respectively arranged at the top and bottom of the air inlet area of ​​the second accommodating area, and / or the air outlet side sound absorbing component is respectively arranged at the top and bottom of the air outlet area of ​​the second accommodating area.

40. The computing device of claim 39, wherein: The air inlet side sound absorbing member and / or the air outlet side sound absorbing member are defined with a bayonet, and the upper part and the lower part of the fan bracket are respectively clamped in the corresponding bayonet.

41. The computing device of claim 39, wherein: A mounting bracket is arranged between the air inlet side sound absorbing component and the air outlet side sound absorbing component of the sound absorbing assembly.

42. The computing device of claim 1, wherein: A sound absorbing layer is arranged on the inner side of the side plate of the casing in the second direction.

43. The computing device of claim 4, wherein: The power module includes a power supply and a second fan arranged outside the power supply, and the second fan is arranged in the first accommodating area to generate a cooling airflow flowing through the first accommodating area.

44. The computing device of claim 43, wherein: The control module includes a first control board and at least one second control board connected to the first control board, the first control board is connected to the computing board, and the at least one second control board is connected to at least one first fan of the heat dissipation module.

45. The computing device of claim 44, wherein: A third spacing space is provided between the power module and the inlet panel, and the first control panel is located in the third spacing space and is arranged on the separation module.

46. ​​The computing device of claim 45, wherein: The first fan disposed in the air inlet area of ​​the second accommodating area is an air inlet fan, and the air inlet fan is located below the third partition space; The first control board is adjacent to the inlet panel and is disposed on the partition module. At least one of the second control boards is disposed in the third compartment and is located between the first control board and the power module in a first direction.

47. The computing device of claim 45, wherein: The first fan disposed in the air outlet area of ​​the second accommodating area is an air outlet fan, and the air outlet fan is located below the power module; There are two second control boards. The second control board connected to the air inlet fan signal is located in the third partition space, and the second control board connected to the air outlet fan signal is arranged on the partition module and is located below the power module.

48. The computing device of claim 1, wherein: The partition module includes a partition plate, and the partition plate partitions the interior of the housing into the two accommodating areas.

49. The computing device of claim 48, wherein: The divider panel extends from the inlet panel to the outlet panel in a first direction.

50. The computing device of claim 48, wherein: The partition plate defines a wiring harness fixing structure and / or a wiring channel.

51. The computing device of claim 50, wherein: The wiring harness fixing structure and / or the wiring channel are respectively provided with protective covers.

52. The computing device of claim 48, wherein: The partition module further includes a power supply bracket, which is located in the first accommodating area and is arranged above the partition plate to support the power supply module.

53. The computing device of claim 52, wherein: The partition plate has an avoidance structure, and the avoidance structure is used to avoid the electrical connection structure between the power module and the computing power board.

54. The computing device of claim 52, wherein: An installation space is defined between the power supply brackets and the partition plate, and a second control board connected to the air outlet fan signal is arranged in the installation space.

55. The computing device according to any one of claims 1 to 54, characterized in that An extension dimension of the housing in the second direction is 130 mm to 140 mm.

56. A computing device according to any one of claims 1 to 54, characterized in that The rated power of the computing board is 1500W to 2000W.

57. The computing device according to any one of claims 1 to 54, characterized in that The rated power of the first fan unit of the heat dissipation module is 5W to 7W, and the rotation speed is 2500 rpm to 3500 rpm.

58. The computing device of claim 1, wherein: The computing board includes: plate body; A chip array is arranged on the board, wherein the chip array comprises a power taking unit, and the power taking unit comprises at least one chip; A power supply module, arranged on the board body and used to be connected to a power source, the power supply module is electrically connected to the power taking unit and used to supply power to the power taking unit, and the power supply module has a voltage monitoring point; The processing module is arranged on the board body and is electrically connected to the voltage monitoring point, and is used for collecting the voltage at the voltage monitoring point.

59. The computing device of claim 58, wherein: There are multiple power taking units, and the multiple power taking units are connected in series. The total number of the power taking units is greater than 40 and less than 100.

60. The computing device of claim 58, wherein: The power extraction unit includes a plurality of chips, the plurality of chips are arranged at intervals along a first direction, and the plurality of chips are connected in parallel.

61. The computing device of claim 58, wherein: The power extraction unit includes two chips, and the two chips are connected in parallel.

62. The computing device of claim 58, wherein: The heat dissipation airflow flows through the computing board along a first direction. Along the first direction, the chip array includes a first power taking group and a second power taking group. The first power taking group and the second power taking group respectively include a plurality of power taking units arranged in sequence along a third direction. The first power extraction group is adjacent to the air inlet side of the plate body, and the second power extraction group is adjacent to the air outlet side of the plate body.

63. The computing device of claim 62, wherein: Along the third direction, a middle area of ​​the first power extraction group and a middle area of ​​the second power extraction group have vacant positions respectively.

64. The computing device of claim 62, wherein: The first power extraction group and the second power extraction group respectively include a plurality of power extraction areas sequentially arranged along a third direction; In the third direction, the distance between any two adjacent power extraction areas is greater than the distance between any two adjacent power extraction units in any power extraction area.

65. The computing device of claim 64, wherein: The number of the power extraction areas of the second power extraction group is greater than the number of the power extraction areas of the first power extraction group.

66. The computing device of claim 63, wherein: The chip array includes at least one third power extraction group. Along the first direction, the at least one third power extraction group is located between the first power extraction group and the second power extraction group. The third power extraction group includes a plurality of power extraction units arranged in sequence along the third direction.

67. The computing device of claim 66, wherein: The number of the third power extraction groups is two, and the two third power extraction groups are arranged at intervals in the first direction.

68. The computing device of claim 66, wherein: The extension dimension of the at least one third power extraction group in the third direction is smaller than the extension dimension of the first power extraction group in the third direction, and the extension dimension of the at least one third power extraction group in the third direction is smaller than the extension dimension of the second power extraction group in the third direction.

69. The computing device of claim 66, wherein: The number of chips in the first power taking group is greater than the number of chips in the second power taking group, and the number of chips in the first power taking group is less than the number of chips in the third power taking group.

70. The computing device of claim 66, wherein: Along the first direction, the intervals between the first power taking group, the third power taking group, and the second power taking group increase sequentially.

71. The computing device of claim 58, wherein: The chip array is divided into a first chip array and a second chip array with the center line of the board extending along the third direction as a dividing line, and the total number of chips in the first chip array close to the air inlet side of the computing board is greater than the total number of chips in the second chip array close to the air outlet side of the computing board.

72. The computing device of claim 58, wherein: A temperature sensor is included, and the temperature sensor is arranged on the plate body and is used to detect the temperature of the air flow passing through the plate body; The processing module is electrically connected to the temperature sensor and is used to collect the temperature detected by the temperature sensor.

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